Three-dimensional capacitor and power module integrated heat dissipation structure
Through the integrated heat dissipation structure of the three-dimensional capacitor and power module, the thermal management is carried out by liquid cooling, which solves the problems of low space utilization and thermal resistance superposition in traditional charging modules, achieves efficient heat dissipation and low loss, and improves the power density and economy of the charging module.
Patent Information
- Application Number
- CN202510523808.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-24
- Publication Date
- 2025-07-25
AI Technical Summary
The power devices and film capacitors in traditional charging modules adopt a split heat dissipation structure, resulting in low space utilization, superimposed thermal resistance, and large parasitic inductance, which affects the overall heat dissipation efficiency and energy loss.
The integrated heat dissipation structure of three-dimensional capacitors and power modules is adopted to space couple the silicon carbide power module and the film capacitor through liquid cooling, and an integrated cooling channel is designed to achieve a compact layout and shorten the busbar connection path.
It significantly improves heat dissipation efficiency and space utilization, reduces parasitic inductance and energy loss, and improves the power density and overall economics of the charging module.
Smart Images
Figure CN120379212A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of new energy vehicle charging piles, and particularly to a three-dimensional integrated heat dissipation structure for capacitors and power modules. Background Art
[0002] With the expansion of the scale of the new energy vehicle industry, as the "heart" of ultra-fast charging technology, the performance of the charging module directly affects the overall performance of the charging equipment. Among them, the power unit is the core part of the charging module, mainly responsible for converting the input alternating current into direct current and outputting it to the battery of the electric vehicle. It is the main heat-generating device in the charging module. The power unit usually consists of parts such as a silicon carbide power module, a capacitor, and a busbar.
[0003] In traditional charging modules, power devices (such as silicon carbide power modules) and thin-film capacitors mostly adopt a split heat dissipation structure. This design has obvious limitations: First, the space utilization rate is low, and the heat dissipation structures of each component are independent of each other, resulting in volume redundancy; second, the thermal resistance superposition effect is significant, affecting the overall heat dissipation efficiency; in addition, the busbar will generate a large parasitic inductance due to long-distance wiring, thus causing additional energy loss.
[0004] Based on this, a new solution for three-dimensional heat dissipation of capacitors and power modules is needed. Summary of the Invention
[0005] In view of this, an embodiment of this specification provides a three-dimensional integrated heat dissipation structure for capacitors and power modules, which adopts a water-cooling method. Through an innovative housing architecture and cooling channel design, it solves the problems of scattered device layout and low integration degree, resulting in an increase in volume, and can effectively improve the power density of the charging module.
[0006] The embodiments of this specification provide the following technical solutions:
[0007] An embodiment of this specification provides a three-dimensional integrated heat dissipation structure for capacitors and power modules, including:
[0008] A water-cooled capacitor, which includes a liquid-cooled heat dissipation housing, a heat dissipation cover plate, and a thin-film capacitor;
[0009] The thin-film capacitor is potted in the internal space of the liquid-cooled heat dissipation housing and forms a heat conduction path with the liquid-cooled heat dissipation housing through a heat dissipation material;
[0010] The space between the outer walls on four sides of the liquid-cooled heat dissipation housing and the heat dissipation cover plate forms a cooling channel, which is used to accommodate the coolant and guide it to flow around the liquid-cooled heat dissipation housing;
[0011] The heat dissipation cover plate includes a long heat dissipation cover plate and a short heat dissipation cover plate. The long heat dissipation cover plate is fixed on the front and rear sides of the liquid-cooled heat dissipation housing, and the short heat dissipation cover plate is fixed on the left and right sides of the liquid-cooled heat dissipation housing;
[0012] The silicon carbide power module is mounted on the outer surface of the heat dissipation cover plate and is directly connected by welding at a preset distance from the capacitor busbar;
[0013] The clip is used to fix the silicon carbide power module to the liquid-cooled heat dissipation housing;
[0014] The water inlet and the water outlet are respectively located at the diagonal corners of the liquid-cooled heat dissipation housing and are used to introduce and discharge the coolant. Two cooling channels are respectively formed on the outer wall of the liquid-cooled heat dissipation housing along the long heat dissipation cover plate and the short heat dissipation cover plate, and the heat generated by the silicon carbide power module and the thin film capacitor is carried away along with the coolant flow channel.
[0015] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of this specification at least include:
[0016] 1. Spatially couple the thermal management of the silicon carbide power module and the thin film capacitor, significantly improve the heat dissipation efficiency and space utilization rate, and ultimately improve the power density of the charging module;
[0017] 2. Through the integrated liquid-cooling channel design, synchronously cool the power module and the capacitor, eliminate the local heat accumulation problem caused by traditional separate heat dissipation, and enhance the thermal balance of the system;
[0018] 3. Adopt a compact three-dimensional layout, shorten the connection path of the busbar, reduce the parasitic inductance and energy loss, and improve the power conversion efficiency;
[0019] 4. Utilize a simple structure to reduce the number of heat dissipation components and the consumption of die-casting materials while realizing the functions, and improve the overall economy. Description of the Drawings
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0021] Figure 1 It is a schematic diagram of the integrated heat dissipation structure of the three-dimensional capacitor and power module in the present application;
[0022] Figure 2 It is an exploded view of the integrated structure of the three-dimensional capacitor and power module in the present application;
[0023] Figure 3It is a schematic diagram of the power component formed after the structure in this application is welded to the control board;
[0024] Figure 4 is the explosion of the water-cooled capacitor in this application Figure 1 ;
[0025] Figure 5 is the explosion of the water-cooled capacitor in this application Figure 2 .
[0026] Among them, 010 - water-cooled capacitor; 011 - liquid-cooled heat dissipation housing; 012 - thin-film capacitor; 013 - long heat dissipation cover plate; 014 - short heat dissipation cover plate; 020 - silicon carbide power module; 021 - silicon carbide single-tube module; 022 - silicon carbide half-bridge module; 030 - clip; 031 - five-piece clip; 032 - four-piece clip; 040 - meson machine screw; 050 - control board PCBA. Specific embodiments
[0027] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0028] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.
[0029] It should be noted that the following describes various aspects of the embodiments within the scope of the appended claims. It should be obvious that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is illustrative only. Based on the present application, those skilled in the art should understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects described herein can be used to implement the device and / or practice the method. In addition, this device and / or this method can be implemented using other structures and / or functions in addition to one or more of the aspects described herein.
[0030] It should also be noted that the illustrations provided in the following embodiments only schematically illustrate the basic concept of the present application. The diagrams only show the components related to the present application, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.
[0031] In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the examples can be practiced without these specific details.
[0032] With the continuous expansion of the scale of the new energy vehicle industry, the industry pain points of "low charging efficiency and insufficient infrastructure" have become increasingly prominent. Traditional air-cooled charging systems are restricted by technical bottlenecks such as low heat dissipation efficiency and high noise, resulting in the charging power lingering below the theoretical threshold for a long time. Against this background, liquid-cooled ultra-fast charging technology can not only inject a large amount of electric energy into electric vehicles in an extremely short time, but also cleverly solve the heat dissipation problem, ensuring that the charging process is both efficient and safe.
[0033] As the "heart" of ultra-fast charging technology, the performance of the charging module directly affects the overall performance of the charging device. The power unit is the core part of the charging module, mainly responsible for converting the input alternating current into direct current and outputting it to the battery of the electric vehicle. It is the main heat-generating device in the charging module. The power unit is usually composed of parts such as a silicon carbide power module, capacitors, and busbars.
[0034] In traditional charging modules, power devices (such as silicon carbide power modules) and thin-film capacitors etc. mostly adopt a split-type heat dissipation structure. This design has obvious limitations: First, the space utilization rate is relatively low. The independent heat dissipation structures of each component lead to volume redundancy; Second, the thermal resistance superposition effect is significant, affecting the overall heat dissipation efficiency; In addition, the busbar will generate a large parasitic inductance due to long-distance wiring, thus causing additional energy losses.
[0035] In response to these problems, it is imperative to develop a new type of integrated heat dissipation solution, which needs to meet two key requirements simultaneously: one is to achieve a high degree of compactness of the structure, and the other is to effectively solve the collaborative heat dissipation problem of the power module and the thin-film capacitor.
[0036] Based on this, the embodiments of this specification propose a new solution for an integrated heat dissipation structure of a three-dimensional capacitor and a power module. By spatially coupling the thermal management of the silicon carbide power module and the thin film capacitor around the liquid-cooled heat dissipation housing, the heat dissipation efficiency and space utilization rate are improved; through the integrated liquid-cooled flow channel design, the power module and the capacitor are cooled synchronously, enhancing the thermal balance of the system; a compact three-dimensional layout is adopted to shorten the connection path of the busbar, reduce the parasitic inductance and energy loss, achieve a simple structure, realize the functions while reducing the number of heat dissipation components and the consumption of die-casting materials, and improve the overall economy.
[0037] The following will describe the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.
[0038] In traditional charging modules, power devices and thin film capacitors mostly adopt a split heat dissipation structure, resulting in low space utilization rate, thermal resistance superposition, and parasitic inductance introduced by the long-distance routing of the busbar, causing additional losses. To solve the existing problems, the present application proposes a new integrated heat dissipation solution, which can effectively solve the collaborative heat dissipation problem of the power module and the thin film capacitor.
[0039] As Figures 1 - 5 shown, the embodiments of this specification provide an integrated heat dissipation structure of a three-dimensional capacitor and a power module, including:
[0040] A water-cooled capacitor 010, which includes a liquid-cooled heat dissipation housing 011, a heat dissipation cover plate, and a thin film capacitor 012;
[0041] The thin film capacitor 012 is potted in the internal space of the liquid-cooled heat dissipation housing 011 and forms a heat conduction path with the liquid-cooled heat dissipation housing 011 through a high thermal conductivity material;
[0042] The space between the four outer walls of the liquid-cooled heat dissipation housing 011 and the heat dissipation cover plate forms a cooling flow channel, which is used to accommodate the coolant and guide it to flow around the liquid-cooled heat dissipation housing 011;
[0043] The heat dissipation cover plate includes a long heat dissipation cover plate 013 and a short heat dissipation cover plate 014. The long heat dissipation cover plate 013 is symmetrically arranged and fixed on the front and rear sides of the liquid-cooled heat dissipation housing, and the short heat dissipation cover plate is symmetrically arranged and fixed on the left and right sides of the liquid-cooled heat dissipation housing;
[0044] A silicon carbide power module 020, which is mounted on the outer surface of the heat dissipation cover plate and is directly connected by short-distance welding to the capacitor busbar;
[0045] A clip 030, which is used to fix the silicon carbide power module 020 to the liquid-cooled heat dissipation housing 011;
[0046] The inlet and outlet are respectively located at the diagonals of the liquid-cooled heat dissipation housing, and are used to introduce and discharge the coolant. Two cooling channels are respectively formed along the long heat dissipation cover plate 013 and the short heat dissipation cover plate 014 on the outer wall of the liquid-cooled heat dissipation housing 011, and the heat generated by the silicon carbide power module 020 and the thin film capacitor 012 is carried away along with the coolant flow path.
[0047] The coolant flows into the liquid-cooled heat dissipation housing from the inlet, flows through the four sides of the liquid-cooled heat dissipation housing, takes away the heat of the silicon carbide power module and the thin film capacitor, and finally discharges from the outlet of the liquid-cooled heat dissipation housing. That is, the coolant flows through the four sides of the liquid-cooled heat dissipation housing, passes through the capacitor area and the heat dissipation surface of the power module, and uses the temperature difference to drive enhanced heat transfer.
[0048] This application is applied to the technical field of new energy vehicle charging piles. Aiming at the problems of low efficiency and large volume caused by the split heat dissipation of the silicon carbide power module and the thin film capacitor in the traditional charging module, an integrated liquid-cooled heat dissipation solution is proposed. Through three-dimensional thermal coupling layout and integrated flow channel design, the heat dissipation efficiency and power density are significantly improved, while the parasitic loss and production cost are reduced, which is suitable for the large-scale application of high-reliability liquid-cooled ultra-fast charging modules.
[0049] In some embodiments, the heat dissipation cover plate is fixed to the outer walls of the four sides of the liquid-cooled heat dissipation housing 011 by friction stir welding technology.
[0050] In some embodiments, the thin film capacitor 012 is placed inside the liquid-cooled heat dissipation housing 011, and the space between the two is filled with epoxy resin to form a heat conduction path from the thin film capacitor 012 to the coolant on the outer wall of the liquid-cooled heat dissipation housing.
[0051] In some embodiments, heat dissipation fins are further provided on the surface of the heat dissipation cover plate, and the heat dissipation fins increase the heat dissipation area in the cooling channel, that is, the heat dissipation area can be effectively increased in a limited space.
[0052] In some embodiments, the clip 030 fixes the silicon carbide power module 020 to the liquid-cooled heat dissipation housing 011 by means of threaded connection, so as to eliminate the gap between the two to ensure good heat dissipation effect.
[0053] In some embodiments, the silicon carbide power module 020 is mounted on the outer surface of the heat dissipation cover plate, and a good thermal interface contact is ensured between the two through thermal conductive silicone grease.
[0054] In some embodiments, a control board is placed on the top of the water-cooled capacitor. The busbar terminals of the water-cooled capacitor 010 and the pins of the silicon carbide power module 020 are welded to the control board through the selective wave soldering process to form a power component. Wherein the control board is such as PCBA.
[0055] In some embodiments, the thin-film capacitor 012 includes a capacitor core, a busbar, and an insulating member.
[0056] In some embodiments, the silicon carbide power module 020 includes at least one of the following: a single-tube module, a half-bridge module, or a Boost module (i.e., a module based on the Boost topology (boost converter)).
[0057] In some embodiments, the coolant includes an ethylene glycol aqueous solution, where the volume of ethylene glycol accounts for 50% of the total solution volume.
[0058] Specifically, as Figure 1 and Figure 2 shown, a three-dimensional integrated heat dissipation structure for a capacitor and a power module includes: a water-cooled capacitor 010, a silicon carbide power module 020, clip pieces 030, and meson machine screws 040.
[0059] In the embodiments of this specification, two types of modules are used in the silicon carbide power module 020, namely, a silicon carbide single-tube module 021 and a silicon carbide half-bridge module 022. During the assembly process, high-performance thermal conductive silicone grease is pre-coated on the contact surfaces of these two types of modules with the water-cooled capacitor 010 to ensure good thermal interface contact. These two types of modules are fixed by a clamping method, including 2 groups of five-piece clip pieces 031 and four-piece clip pieces 032, and are uniformly locked by meson machine screws 040 to stably press and connect the power module to the peripheral side walls of the water-cooled capacitor 010. This design ensures close contact between the module and the radiator and achieves efficient heat conduction.
[0060] As Figure 3 shown, in the embodiments of this specification, the busbar terminals of the water-cooled capacitor 010 and the pins of the silicon carbide power module 020 are reliably welded to the control board PCBA050 by using a selective wave soldering process to form a power component.
[0061] As Figure 4 shown, the water-cooled capacitor 010 includes: a liquid-cooled heat dissipation housing 011, a thin-film capacitor 012, a long heat dissipation cover plate 013, and a short heat dissipation cover plate 014 (the heat dissipation cover plate includes these two types). Among them, the liquid-cooled heat dissipation housing 011 is integrally formed by high-thermal-conductivity die-cast aluminum alloy and serves as the structural base of the heat dissipation system, with cooling channels provided around it. The thin-film capacitor 012 is composed of a capacitor core, a busbar, and insulating materials, etc., and is fixed in the middle of the housing through a vacuum epoxy potting process to achieve efficient heat conduction from the heat to the surrounding of the housing. The long heat dissipation cover plate 013 and the short heat dissipation cover plate 014 are provided with a dense heat dissipation fin array on their surfaces and are metallurgically bonded to the housing through a friction stir welding process, significantly increasing the heat dissipation area and the heat conduction efficiency.
[0062] As Figure 5As shown in the figure, in this embodiment, an aqueous solution of 50% ethylene glycol is used as the cooling medium. This coolant flows around the liquid-cooled heat dissipation housing 011. During the heat dissipation process, the heat generated by the silicon carbide power module 020 is transferred to the coolant in the housing through the cover fin structure. At the same time, the heat generated during the operation of the thin film capacitor 012 is transferred to the housing through the heat conduction of the epoxy potting material and is finally carried away by the coolant. This dual-path collaborative heat dissipation mechanism realizes the efficient thermal management of power components in a limited space.
[0063] Through the three-dimensional thermal coupling layout and integrated flow channel design, this application significantly improves the heat dissipation efficiency and power density, while reducing the parasitic loss and production cost, and is suitable for the large-scale application of high-reliability liquid-cooled ultra-fast charging modules.
[0064] Combined with the above embodiments, this application also provides a charging module, which is provided with the three-dimensional capacitor and power module integrated heat dissipation structure described in any one of the above technical solutions to complete the heat dissipation task during the charging process.
[0065] In this specification, the same or similar parts between each embodiment can be referred to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the embodiments described later, the description is relatively simple, and the relevant parts can be referred to the partial description of the foregoing embodiments.
[0066] The above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed in this application should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.
Claims
1. A three-dimensional capacitor and power module integrated heat dissipation structure, characterized in that, Comprising: A water-cooled capacitor, which includes a liquid-cooled heat dissipation housing, a heat dissipation cover plate, and a thin film capacitor; The thin film capacitor is encapsulated in the internal space of the liquid-cooled heat dissipation housing and forms a heat conduction path with the liquid-cooled heat dissipation housing through a heat dissipation material; The space between the outer walls on the four sides of the liquid-cooled heat dissipation housing and the heat dissipation cover plate forms a cooling channel, which is used to accommodate the coolant and guide it to flow around the liquid-cooled heat dissipation housing; The heat dissipation cover plate includes a long heat dissipation cover plate and a short heat dissipation cover plate. The long heat dissipation cover plate is fixed on the front and rear sides of the liquid-cooled heat dissipation housing, and the short heat dissipation cover plate is fixed on the left and right sides of the liquid-cooled heat dissipation housing; A silicon carbide power module is mounted on the outer surface of the heat dissipation cover plate and is welded and directly connected to the bus bar of the thin film capacitor at a preset distance; Clamping pieces are used to fix the silicon carbide power module to the liquid-cooled heat dissipation housing; An inlet and an outlet are respectively located at the diagonal corners of the liquid-cooled heat dissipation housing and are used to introduce and discharge the coolant. Two cooling channels are respectively formed on the outer wall of the liquid-cooled heat dissipation housing along the long heat dissipation cover plate and the short heat dissipation cover plate, and the heat generated by the silicon carbide power module and the thin film capacitor is taken away along with the coolant flow channel.
2. The integrated heat dissipation structure of the three-dimensional capacitor and the power module according to claim 1, wherein The heat dissipation cover plate is fixed to the outer walls on the four sides of the liquid-cooled heat dissipation housing by friction stir welding technology.
3. The three-dimensional capacitor and power module integrated heat dissipation structure according to claim 1, wherein The thin film capacitor is placed inside the liquid-cooled heat dissipation housing, and the space between the two is filled with epoxy resin to form a heat conduction path from the thin film capacitor to the coolant on the outer wall of the liquid-cooled heat dissipation housing.
4. The three-dimensional capacitor and power module integrated heat dissipation structure according to claim 1, characterized in that Heat dissipation fins are also provided on the surface of the heat dissipation cover plate, and the heat dissipation fins increase the heat dissipation area in the cooling channel.
5. The integrated heat dissipation structure of the three-dimensional capacitor and the power module according to claim 1, wherein The clamping pieces fix the silicon carbide power module to the liquid-cooled heat dissipation housing by means of threaded connection, which is used to eliminate the gap between the two to ensure the heat dissipation effect.
6. The integrated heat dissipation structure of the three-dimensional capacitor and the power module according to claim 1, characterized in that, The silicon carbide power module is mounted on the outer surface of the heat dissipation cover plate, and the thermal interface contact between the two is ensured by thermal conductive silicone grease.
7. The integrated heat dissipation structure of the three-dimensional capacitor and the power module according to claim 1, wherein A control board is placed on the top of the water-cooled capacitor. The bus bar terminals of the water-cooled capacitor and the pins of the silicon carbide power module are welded to the control board through a selective wave soldering process to form a power component.
8. The integrated heat dissipation structure of the three-dimensional capacitor and the power module according to any one of claims 1-7, characterized in that, The thin film capacitor includes a capacitor core, a bus bar, and an insulating part; Or, the silicon carbide power module includes at least one of the following: a single-tube module, a half-bridge module, or a Boost module.
9. The three-dimensional capacitor and power module integrated heat dissipation structure according to claim 8, wherein The coolant includes an ethylene glycol aqueous solution, in which the volume of ethylene glycol accounts for 50% of the total solution volume.
10. A charging module, characterized in that, The three-dimensional capacitor and power module integrated heat dissipation structure as described in any one of claims 1-9 is provided to complete the heat dissipation task during the charging process.