Multifunctional automatic LED lamp bead surface mounting device

Abstract

The invention discloses a multifunctional automatic LED lamp bead pasting device which comprises a concentric-square-shaped rack, a double-row belt conveyor used for horizontally conveying a PCB is installed in the concentric-square-shaped rack, and a servo driving unit used for driving the double-row belt conveyor to work is installed at the bottom of the concentric-square-shaped rack. A horizontal plate is fixed to the top end of the concentric-square-shaped rack through two profiles, and a solder paste frame is installed in the center of the interior of the horizontal plate. Soldering paste in the solder paste frame is smeared on a PCB through the double-shaft tin coating assembly, the gear reduction type tin coating following assembly enables the soldering paste in the solder paste frame to approach the middle of the frame body, and therefore the double-shaft tin coating assembly can obtain sufficient soldering paste materials every time the double-shaft tin coating assembly acts.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp chip mounting, and specifically to a multifunctional automatic LED lamp bead chip mounting device. Background Art

[0002] The chip mounting process of LED lamp beads is a crucial part in the manufacturing of LED lamps, covering multiple steps. First, in the preparation stage, equipment and materials such as PCB boards, LED lamp beads, solder paste, chip mounters, and reflow soldering furnaces need to be prepared to ensure their quality meets the standards. Next, the treatment of the PCB board is crucial, including cleaning the surface to remove dirt and oxides, and evenly applying solder paste to improve the adhesion of the lamp beads. Subsequently, the chip mounting operation of the LED lamp beads is carried out. The lamp beads are placed in the chip mounter, ensuring the accurate position and direction of the lamp beads to avoid deviation or reverse chip mounting. At the same time, the chip mounting speed and pressure are controlled to ensure firm adhesion. After chip mounting, the PCB board enters the reflow soldering stage. The solder paste is heated to the melting point in the soldering furnace to form firm solder joints. The entire process requires strict control of temperature and time to prevent thermal damage to the LED lamp beads. After soldering, cooling and a series of inspections are carried out, including visual inspection and electrical testing, to ensure that each LED lamp bead works properly; As disclosed in a chip mounting device for LED lamp beads with the authorization announcement number CN116997096B, it includes a bottom plate. The bottom of the bottom plate is fixedly connected with legs. A partition is arranged above the bottom plate. A groove is opened at the top of the bottom plate. A motor is fixedly connected to the bottom of the inner wall of the groove. It also includes: an adsorption component. The adsorption component includes a fixed rod. The fixed rod is fixedly connected to the top of the bottom plate. The top of the fixed rod is fixedly connected with a bracket. An adsorption component is arranged on the top of the bottom plate. The chip is adsorbed and fixed through the adsorption component. After the chip is fixed, the adsorption frame is pushed downward by an electric push rod. After placing the LED lamp bead into the positioning component, the LED lamp bead is limited by the groove rod in the positioning component. However, in the stage of applying solder paste in the above technical solution, the screen printing method is mainly used. A screen and a solder paste storage frame that match the PCB board are selected. After fixing the PCB board, the solder paste is evenly applied by a squeegee. When the squeegee reciprocates to apply the solder paste, the squeegee will push the solder paste to both sides of the storage frame, resulting in a gradual reduction of the solder paste in the central part of the screen and the storage frame during the subsequent application process. This causes incomplete solder joints or poor soldering during the subsequent welding and chip mounting of the LED lamp beads. Moreover, as the solder paste decreases during the application process, the operator also needs to pay more attention to the distribution of the solder paste, increasing the difficulty of quality control. Summary of the Invention

[0003] The object of the present invention is to provide a multifunctional automatic LED lamp bead pasting device. A double-row belt conveyor sends the PCB board to be pasted with LED lamp beads under the solder paste frame, and the position of the PCB board is detected by a photoelectric sensor. Then, the Z-axis lifting assembly makes the PCB board adhere to the lower surface of the solder paste frame, and the double-axis tin coating assembly smears the solder paste in the solder paste frame on the PCB board. At the same time, the gear reduction type tin coating following assembly makes the solder paste in the solder paste frame approach the middle of the frame body, so that the double-axis tin coating assembly can obtain a sufficient amount of solder paste material each time it operates, so as to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solutions: A multifunctional automatic LED lamp bead pasting device, including: A rectangular frame, inside which is installed a double-row belt conveyor for horizontally conveying the PCB board, at the bottom of the rectangular frame is installed a servo drive unit for driving the double-row belt conveyor to work, at the top of the rectangular frame is fixed a horizontal plate by two profiles, and at the center position inside the horizontal plate is installed a solder paste frame. Inside the rectangular frame is installed a Z-axis lifting assembly for lifting the PCB board to the lower surface of the solder paste frame, and photoelectric sensors are installed on the front and rear outer walls of the rectangular frame; A double-axis tin coating assembly, which is arranged at the top of the horizontal plate and is used to smear the solder paste in the solder paste frame on the PCB board when the PCB board adheres to the lower surface of the solder paste frame. At the top of the horizontal plate on one side of the solder paste frame is provided a gear reduction type tin coating following assembly, which is used for power connection with the double-axis tin coating assembly and pushing the solder paste towards the middle area of the solder paste frame.

[0005] Preferably, the Z-axis lifting assembly includes a bottom frame arranged at the bottom of the rectangular frame, a Z-axis cylinder installed at the center position inside the bottom frame, and a support plate installed at the top end of the piston rod of the Z-axis cylinder. The support plate is located between the two parallel conveyor belts of the double-row belt conveyor.

[0006] Preferably, hollow guide sleeves are fixed to the top ends of the bottom frame on both sides of the Z-axis cylinder, and sliding columns are slidably installed inside the hollow guide sleeves. The top ends of the sliding columns are fixedly connected to the bottom end of the support plate.

[0007] Preferably, an outer right-angle arm is fixed to the bottom end of the support plate between the two sliding columns on the same side. A double-rod cylinder is installed on the outer wall of the outer right-angle arm away from the support plate, and the top end of the piston rod of the double-rod cylinder is installed with a secondary support arm.

[0008] Preferably, the double-axis tin coating assembly includes a gantry fixed to both sides of the top end of the horizontal plate, an X-axis synchronous belt linear module installed between the two gantries, and a second cylinder installed at the movable end of the X-axis synchronous belt linear module. A sandwich pushing member is installed at the bottom end of the piston rod of the second cylinder. A stepping motor for driving the X-axis synchronous belt linear module and the gear reduction type tin coating following assembly to work is installed on one side of one of the double-axis tin coating assemblies.

[0009] Preferably, the sandwich pushing member is a longitudinal beam installed at the bottom end of the piston rod of the second cylinder and rubber scraping plates bolted and fixed on both sides of the bottom end of the longitudinal beam.

[0010] Preferably, the end of the rubber scraping plate is in sliding contact with the inner wall of one side of the solder paste frame, and a gap portion is provided between the two rubber scraping plates.

[0011] Preferably, the gear reduction type tin coating following assembly includes a support plate fixed to one side of the top end of the horizontal plate, a main shaft rotatably installed at the center position of the surface of the support plate, and a gear-rack bidirectional traction structure provided at one end of the main shaft close to the solder paste frame. Sliding tables are installed at both movable ends of the gear-rack bidirectional traction structure, and a pushing plate extending into the solder paste frame is installed at the bottom end of the sliding table. A gear reduction structure is provided at the other end of the main shaft, and a belt drive structure for driving the gear reduction structure and the main shaft to rotate is installed on one rotating shaft of the main shaft away from the sliding table.

[0012] Preferably, the bottom edge of the pushing plate is in contact with the bottom of the solder paste frame, and both sliding tables are slidably matched with the support plate. The gear-rack bidirectional traction structure includes a rack installed on the back of the sliding table and a central gear fixed to one end of the surface of the main shaft, and the central gear meshes with the two racks.

[0013] Preferably, the gear reduction structure includes a first-stage input gear shaft, a second-stage reduction gear shaft rotatably installed on the back of the support plate, and a third-stage reduction gear disc fixed to the other end of the main shaft. The first-stage input gear shaft, the second-stage reduction gear shaft, and the third-stage reduction gear disc are sequentially meshed, and power connection is carried out between one of the rotating shafts of the first-stage input gear shaft and the main shaft through a belt drive structure.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: The multi-functional automatic LED lamp bead pasting device uses a double-row belt conveyor to send the PCB board to be pasted with LED lamp beads under the solder paste frame, and the position of the PCB board is detected by an optoelectronic sensor. Then, the Z-axis lifting assembly makes the PCB board adhere to the lower surface of the solder paste frame, and the double-axis tin coating assembly smears the solder paste in the solder paste frame onto the PCB board. At the same time, the gear reduction type tin coating following assembly makes the solder paste in the solder paste frame approach the middle of the frame body, so that the double-axis tin coating assembly can obtain a sufficient amount of solder paste material each time it operates; among them, the optoelectronic sensor monitors the in-place situation of the PCB board in real time to ensure that the Z-axis lifting assembly can respond in time and correctly attach the PCB board to the lower surface of the solder paste frame, and the double-axis tin coating assembly can quickly and evenly smear the solder paste onto the PCB board to ensure that each solder joint can obtain sufficient solder paste, thereby improving the welding quality of subsequent LED lamp bead pasting; secondly, the design of the gear reduction type tin coating following assembly makes the solder paste always approach the middle of the frame body during the smearing process, ensuring that the double-axis tin coating assembly can obtain sufficient solder paste each time it smears, effectively avoiding the problem of the gradual reduction of the solder paste during the smearing process, thus ensuring the stability and consistency of each smearing; finally, since the solder paste can maintain a sufficient amount each time it is smeared, it avoids secondary smearing caused by insufficient solder paste, optimizes the use of the solder paste, improves the material utilization rate, and further reduces the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is the front view structural schematic diagram of the present invention; Figure 2 is the three-dimensional structural schematic Figure 1 ; Figure 3 is the three-dimensional structural schematic Figure 2 ; Figure 4 is the three-dimensional sectional structural schematic diagram of the present invention; Figure 5 is the three-dimensional structural schematic diagram of the Z-axis lifting assembly of the second embodiment of the present invention; Figure 6 is the three-dimensional structural schematic diagram of the double-axis tin coating assembly of the third embodiment of the present invention; Figure 7 is the three-dimensional structural schematic diagram of the gear reduction type tin coating following assembly of the third embodiment of the present invention.

[0016] Figure 8 is the three-dimensional structural schematic diagram of the gear reduction structure of the third embodiment of the present invention.

[0017] In the figure: 1. Square frame; 2. Double-row belt conveyor; 3. Photoelectric sensor; 4. Horizontal plate; 5. Solder paste frame; 6. Z-axis lifting assembly; 601. Underframe; 602. Z-axis cylinder; 603. Support plate; 604. Outer right-angle arm; 605. Double-rod cylinder; 606. Secondary support arm; 7. Double-axis solder coating assembly; 701. Gantry; 702. X-axis synchronous belt linear module; 703. Second cylinder; 704. Longitudinal beam; 705. Rubber squeegee; 706. Stepper motor; 8. Gear reduction type solder coating following assembly; 801. Support plate; 802. Spindle; 803. Gear-rack bidirectional traction structure; 804. Gear reduction structure; 805. Belt drive structure; 806. Slide; 807. Pusher plate; 9. Servo drive unit. Specific embodiments

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0019] Embodiment 1, given by Figures 1 to 4 The present invention includes a square frame 1. Inside the square frame 1, a double-row belt conveyor 2 for horizontally conveying PCB boards is installed. At the bottom of the square frame 1, a servo drive unit 9 for driving the double-row belt conveyor 2 to work is installed. The servo drive unit 9 includes a servo motor, a multi-wedge pulley, and a multi-wedge belt. At the top of the square frame 1, a horizontal plate 4 is fixed by two profiles, and a solder paste frame 5 is installed at the center position inside the horizontal plate 4. Inside the square frame 1, a Z-axis lifting assembly 6 for lifting the PCB board to the lower surface of the solder paste frame 5 is installed. Photoelectric sensors 3 are installed on the front and rear outer walls of the square frame 1; The use of the double-row belt conveyor 2 can ensure the stability of the PCB board during transportation, avoid damage to the PCB board caused by vibration or inclination. At the same time, the gap between its two belts is set to allow the Z-axis lifting assembly 6 to act, so that it can be adjusted according to production requirements to adapt to PCB boards of different sizes and shapes, enhancing the flexibility of the production line; A double-axis solder coating assembly 7 is provided at the top of the horizontal plate 4 and is used to apply the solder paste in the solder paste frame 5 to the PCB board when the PCB board is attached to the lower surface of the solder paste frame 5. At the top of the horizontal plate 4 on one side of the solder paste frame 5, a gear reduction type solder coating following assembly 8 is provided. The gear reduction type solder coating following assembly 8 is used to connect with the double-axis solder coating assembly 7 for power connection and push the solder paste towards the middle area of the solder paste frame 5. The solder paste frame 5 is used to store and distribute the solder paste and cooperate with the double-axis solder coating assembly 7 and the gear reduction type solder coating following assembly 8 to ensure uniform distribution of the solder paste, avoid phenomena such as missed coating or excessive coating, and thus improve the subsequent welding quality; The staff can install a PLC control panel on the outer wall of the loop-shaped frame 1, electrically connect it to each electrical component in the device through the PLC control panel, and adjust the device parameters according to different types of PCB boards and production requirements, including the servo drive unit 9, the feeding speed of the double-row belt conveyor 2, the tin coating speed, pressure of the double-axis tin coating assembly 7, and the action timing of the Z-axis lifting assembly 6.

[0020] Example 2, based on Example 1, is given by Figure 4 and Figure 5 The Z-axis lifting assembly 6 includes a chassis 601 provided at the bottom of the loop-shaped frame 1, a Z-axis cylinder 602 installed at the central position inside the chassis 601, and a support plate 603 installed at the top end of the piston rod of the Z-axis cylinder 602. The support plate 603 is located between the two parallel conveyor belts of the double-row belt conveyor 2. Hollow guide sleeves are fixed to the top ends of the chassis 601 on both sides of the Z-axis cylinder 602, and sliding columns are installed inside the hollow guide sleeves. The top ends of the sliding columns are fixedly connected to the bottom end of the support plate 603; An external right-angle arm 604 is fixedly connected to the bottom end of the support plate 603 between two sliding columns on the same side. A double-rod cylinder 605 is installed on the outer wall of the side of the external right-angle arm 604 away from the support plate 603. The top end of the piston rod of the double-rod cylinder 605 is installed with a secondary support arm 606. The secondary lifting cooperation of the double-rod cylinder 605 and the secondary support arm 606 is mainly used for PCB boards with larger length specifications to reduce the gravity deformation at the end of the PCB board; The photoelectric sensor 3 monitors the position of the PCB board in real time to ensure that it is in the correct position during the tin coating process and avoid uneven tin coating caused by position deviation. After the photoelectric sensor 3 detects the position of the PCB board, the Z-axis cylinder 602 and the double-rod cylinder 605 in the Z-axis lifting assembly 6 act. The Z-axis cylinder 602 pushes the support plate 603, the PCB board, the external right-angle arm 604, and the double-rod cylinder 605 upward until the PCB board adheres to the lower surface of the solder paste frame 5, and the double-rod cylinder 605 makes a secondary push, so that the secondary support arm 606 continues to adhere to the lower surface of the PCB board. By precisely controlling the height of the PCB board and the contact pressure with the solder paste frame 5, it ensures uniform coating of the solder paste and improves the precision and quality of the tin coating.

[0021] Example 3, based on Example 1, is given by Figure 6 、 Figure 7 and Figure 8Given that, the double-axis tin coating assembly 7 includes a gantry 701 fixed to both sides of the top end of the horizontal plate 4, an X-axis synchronous belt linear module 702 installed between the two gantries 701, and a second cylinder 703 installed at the movable end of the X-axis synchronous belt linear module 702. A sandwich pushing member is installed at the bottom end of the piston rod of the second cylinder 703. A stepping motor 706 for driving the X-axis synchronous belt linear module 702 and the gear reduction type tin coating following assembly 8 to work is installed on one side of one of the double-axis tin coating assemblies 7. The sandwich pushing member is a longitudinal beam 704 installed at the bottom end of the piston rod of the second cylinder 703 and rubber scraping plates 705 bolted and fixed to both sides of the bottom end of the longitudinal beam 704; After the Z-axis lifting assembly 6 tops the PCB board against the lower surface of the solder paste frame 5, the second cylinder 703 pushes the longitudinal beam 704 and the rubber scraping plates 705 downward until the bottom edge of the rubber scraping plates 705 contacts the bottom of the solder paste frame 5. At this time, solder paste remains between the two rubber scraping plates 705. The stepping motor 706 drives the X-axis synchronous belt linear module 702 to work, then the X-axis synchronous belt linear module 702 drives the second cylinder 703, the longitudinal beam 704, and the rubber scraping plates 705 to perform linear movement along the X-axis. During the movement of the rubber scraping plates 705, the solder paste adheres to the PCB board through the holes at the bottom of the solder paste frame 5, thereby completing the tin coating of the PCB board in a short time and achieving a uniform coating effect; The end of the rubber scraping plate 705 is in sliding contact with the inner wall of one side of the solder paste frame 5. A gap portion is provided between the two rubber scraping plates 705. After a coating operation is completed, the stepping motor 706 and the X-axis synchronous belt linear module 702 reset the rubber scraping plates 705 and return them to the starting position; The gear reduction type tin coating following assembly 8 includes a support plate 801 fixed to one side of the top end of the horizontal plate 4, a main shaft 802 rotatably installed at the center position of the surface of the support plate 801, and a gear and rack bidirectional traction structure 803 provided at one end of the main shaft 802 close to the solder paste frame 5. Sliding tables 806 are installed at both movable ends of the gear and rack bidirectional traction structure 803. A pushing plate 807 extending into the solder paste frame 5 is installed at the bottom end of the sliding table 806. A gear reduction structure 804 is provided at the other end of the main shaft 802. A belt drive structure 805 for driving the gear reduction structure 804 and the main shaft 802 to rotate is installed on a rotating shaft of the main shaft 802 away from the sliding table 806; When the stepping motor 706 transfers power to the X-axis synchronous belt linear module 702, a synchronous pulley of the X-axis synchronous belt linear module 702 away from the stepping motor 706 will transfer rotational power to the main shaft 802 through the belt pulley transmission structure 805 and the gear reduction structure 804. The gear reduction structure 804 serves to reduce the rotational speed of the main shaft 802. Then, the main shaft 802 drives the gear-rack bidirectional traction structure 803 to work, and the gear-rack bidirectional traction structure 803 drives two sliders 806 and two pusher plates 807 in the X-axis direction to approach each other. Subsequently, the pusher plates 807 push the solder paste towards the middle of the solder paste frame 5, ensuring an adequate amount of solder paste for each application of the double-axis tin coating assembly 7; The bottom edge of the pusher plate 807 is in contact with the bottom of the solder paste frame 5. Both sliders 806 are slidably engaged with the support plate 801. The gear-rack bidirectional traction structure 803 includes a rack mounted on the back of the slider 806 and a central gear fixed to one end of the surface of the main shaft 802. The central gear meshes with the two racks. The gear reduction structure 804 includes a primary input gear shaft, a secondary reduction gear shaft rotatably mounted on the back of the support plate 801, and a tertiary reduction gear disc fixed to the other end of the main shaft 802. The primary input gear shaft, the secondary reduction gear shaft, and the tertiary reduction gear disc are engaged in sequence. Power connection is made between one of the rotating shafts of the primary input gear shaft and the main shaft 802 through the belt pulley transmission structure 805; When the stepping motor 706 and the X-axis synchronous belt linear module 702 drive the rubber squeegee 705 to reset, the two pusher plates 807 will also reset and wait for the next application of solder paste. During this process, due to the use of the gear reduction structure 804, the sliding distance of the pusher plates 807 can be significantly reduced.

[0022] When the embodiment of this application is in use, first, the device needs to be arranged at the feeding port of the mounter, and the double-row belt conveyor 2 is connected to the feeding area of the mounter. Subsequently, a comprehensive inspection of the device is carried out, including the servo drive unit 9, the double-row belt conveyor 2, the solder paste frame 5, the photoelectric sensor 3, the Z-axis lifting assembly 6, and the double-axis tin coating assembly 7, to ensure that all components are operating normally without faults or abnormalities; inject a sufficient amount of solder paste into the interior of the solder paste frame 5, and pre-open tin coating points at the bottom of the solder paste frame 5 that match the PCB to ensure its suitability for the LED bead soldering process of the PCB; the staff stably places the PCB to be processed with LED bead soldering and tin coating on the double-row belt conveyor 2, and starts the servo drive unit 9 and the double-row belt conveyor 2 to work. The double-row belt conveyor 2 sends the PCB to the west of the solder paste frame 5. At this time, the photoelectric sensor 3 monitors the position of the PCB in real time. When the PCB approaches below the solder paste frame, the photoelectric sensor 3 emits a signal and makes the Z-axis lifting assembly 6 prepare for the lifting operation. Under the guidance of the photoelectric sensor 3, the Z-axis lifting assembly 6 lifts the PCB to the lower surface of the solder paste frame 5, and the servo drive unit 9 and the double-row belt conveyor 2 stop working. At this time, it is necessary to confirm that the PCB is completely attached to the solder paste frame 5 to ensure the accuracy of the tin coating process; once the PCB is accurately positioned, the double-axis tin coating assembly 7 starts to work. The double-axis tin coating assembly 7 evenly applies solder paste on the PCB. The operator needs to observe the tin coating process to ensure that the tin coating is uniform and there is no missed coating or excessive coating. At the same time, the gear reduction type tin coating following assembly 8 receives the rotary power from the double-axis tin coating assembly 7, so as to move the solder paste in the solder paste frame 5 closer to the middle of the frame to ensure that the double-axis tin coating assembly 7 can obtain a sufficient amount of solder paste during each coating. The operator also needs to regularly check the state of the solder paste to ensure that it always remains sufficient during the coating process; if it is found that the tin coating is uneven or other problems, the operator needs to adjust the device parameters in time and re-perform the tin coating to ensure that each PCB meets the quality standards; after the tin coating is completed, the Z-axis lifting assembly 6 places the PCB back on the double-row belt conveyor 2, and the double-row belt conveyor 2 transports the PCB coated with solder paste to the mounter and the mounter performs the operation process of LED bead soldering. During this process, attention needs to be paid to the stability of the PCB to avoid damage caused by vibration or deviation during the transportation process; after completing a batch of tin coating work, the operator needs to clean the device, especially the solder paste frame 5 and the double-axis tin coating assembly 7, to avoid the remaining solder paste affecting subsequent production.

[0023] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0024] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. Multifunctional automatic LED lamp bead soldering device, characterized in that Including: A rectangular frame (1), inside which a double-row belt conveyor (2) for horizontally conveying PCB boards is installed. At the bottom of the rectangular frame (1), a servo drive unit (9) for driving the double-row belt conveyor (2) to work is installed. At the top of the rectangular frame (1), a horizontal plate (4) is fixed by two profiles, and at the central position inside the horizontal plate (4), a solder paste frame (5) is installed. Inside the rectangular frame (1), a Z-axis lifting assembly (6) for lifting the PCB board to the lower surface of the solder paste frame (5) is installed. Photoelectric sensors (3) are installed on the front and rear outer walls of the rectangular frame (1). A double-axis tin coating assembly (7), which is arranged at the top of the horizontal plate (4) and is used to apply the solder paste in the solder paste frame (5) onto the PCB board when the PCB board is attached to the lower surface of the solder paste frame (5). At the top of the horizontal plate (4) on one side of the solder paste frame (5), a gear reduction type tin coating following assembly (8) is provided, and the gear reduction type tin coating following assembly (8) is used for power connection with the double-axis tin coating assembly (7) and pushing the solder paste towards the central area of the solder paste frame (5).

2. The multifunctional automatic LED lamp bead pasting device according to claim 1, characterized in that: The Z-axis lifting assembly (6) includes a chassis (601) arranged at the bottom of the rectangular frame (1), a Z-axis cylinder (602) installed at the central position inside the chassis (601), and a support plate (603) installed at the top of the piston rod of the Z-axis cylinder (602). The support plate (603) is located between two parallel conveyor belts of the double-row belt conveyor (2).

3. The multifunctional automatic LED lamp bead pasting device according to claim 2, characterized in that: At the top of the chassis (601) on both sides of the Z-axis cylinder (602), hollow guide sleeves are fixed, and sliding columns are installed inside the hollow guide sleeves. The top ends of the sliding columns are fixedly connected to the bottom end of the support plate (603).

4. The multifunctional automatic LED lamp bead pasting device according to claim 3, wherein: An outer right-angle arm (604) is fixedly connected to the bottom end of the support plate (603) between two sliding columns on the same side. On the outer wall of the outer right-angle arm (604) away from the support plate (603), a double-rod cylinder (605) is installed, and the top of the piston rod of the double-rod cylinder (605) is installed with a secondary support arm (606).

5. The multifunctional automatic LED lamp bead patch device according to claim 1, wherein: The double-axis tin coating assembly (7) includes gantry frames (701) fixed on both sides at the top of the horizontal plate (4), an X-axis synchronous belt linear module (702) installed between the two gantry frames (701), and a second cylinder (703) installed at the movable end of the X-axis synchronous belt linear module (702). At the bottom end of the piston rod of the second cylinder (703), a sandwich pushing member is installed. On one side of one of the double-axis tin coating assemblies (7), a stepping motor (706) for driving the X-axis synchronous belt linear module (702) and the gear reduction type tin coating following assembly (8) to work is installed.

6. The multifunctional automatic LED lamp bead patch device according to claim 5, wherein: The sandwich pushing member is a longitudinal beam (704) installed at the bottom end of the piston rod of the second cylinder (703) and rubber scraping plates (705) bolted and fixed on both sides at the bottom end of the longitudinal beam (704).

7. The multifunctional automatic LED lamp bead pasting device according to claim 6, wherein: The end of the rubber scraping plate (705) is in sliding contact with the inner wall of one side of the solder paste frame (5), and a gap part is provided between the two rubber scraping plates (705).

8. The multifunctional automatic LED lamp bead chip mounting device according to claim 5, characterized in that: The gear reduction type tin coating following assembly (8) includes a support plate (801) fixed to one side of the top end of the horizontal plate (4), a main shaft (802) rotatably installed at the center position of the surface of the support plate (801), and a gear-rack bidirectional traction structure (803) arranged at one end of the main shaft (802) close to the solder paste frame (5). Both movable ends of the gear-rack bidirectional traction structure (803) are equipped with sliding tables (806), and a pushing plate (807) extending into the interior of the solder paste frame (5) is installed at the bottom end of the sliding table (806). A gear reduction structure (804) is arranged at the other end of the main shaft (802), and a belt pulley transmission structure (805) for driving the gear reduction structure (804) and the main shaft (802) to rotate is installed on a rotating shaft of the main shaft (802) away from the sliding table (806).

9. The multifunctional automatic LED lamp bead patch device according to claim 8, wherein: The bottom edge of the pushing plate (807) is in contact with the bottom of the solder paste frame (5). Both of the sliding tables (806) are in sliding fit with the support plate (801). The gear-rack bidirectional traction structure (803) includes a rack installed on the back of the sliding table (806) and a central gear fixed to one end of the surface of the main shaft (802). The central gear meshes with the two racks.

10. The multi-functional automatic LED lamp bead pasting device according to claim 9, wherein: The gear reduction structure (804) includes a first-stage input gear shaft, a second-stage reduction gear shaft rotatably installed on the back of the support plate (801), and a third-stage reduction gear disc fixed to the other end of the main shaft (802). The first-stage input gear shaft, the second-stage reduction gear shaft, and the third-stage reduction gear disc are engaged in sequence. Power connection is carried out between one of the rotating shafts of the first-stage input gear shaft and the main shaft (802) through the belt pulley transmission structure (805).

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