Display substrate, display panel and preparation method thereof

Abstract

The invention discloses a display substrate, a display panel and a preparation method thereof. The display substrate is provided with a display area and a binding area, the binding area is located on the periphery of at least one side of the display area, and the display substrate comprises a substrate located on the display area and the binding area; the first binding electrode and the second binding electrode are located in the binding area and located on the same side of the substrate, the first binding electrode is located on the side, close to the display area, of the second binding electrode, and the first binding electrode is configured to be connected with a display driving circuit in a binding mode; the second binding electrode is configured to be in binding connection with a peripheral circuit board; the first binding electrode is electrically connected with the second binding electrode; the peripheral circuit board is configured to provide a display signal and a power supply signal to the display driving circuit; the display driving circuit is configured to provide a display driving signal to the display area; the distance between the surface of the side, away from the substrate, of the first binding electrode and the substrate is larger than the distance between the surface of the side, away from the substrate, of the second binding electrode and the substrate.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the field of display technology, and specifically relate to a display substrate, a display panel, and a method for manufacturing the same. Background Art

[0002] OLED (Organic Light-Emitting Diode) display screens have attracted widespread attention due to their advantages such as self-luminescence, low power consumption, lightness, flexibility, bright colors, high contrast, and fast response rate. Summary of the invention

[0003] In a first aspect, an embodiment of the present disclosure provides a display substrate having a display area and a binding area, wherein the binding area is located at a periphery of at least one side of the display area.

[0004] Wherein, the display substrate comprises a base located in the display area and the binding area;

[0005] The first binding electrode and the second binding electrode are located in the binding area and on the same side of the substrate, and the first binding electrode is located on a side of the second binding electrode close to the display area.

[0006] The first binding electrode is configured to be bound and connected to a display driving circuit; the second binding electrode is configured to be bound and connected to a peripheral circuit board; the first binding electrode is electrically connected to the second binding electrode;

[0007] The peripheral circuit board is configured to provide a display signal and a power signal to the display driving circuit; the display driving circuit is configured to provide a display driving signal to the display area;

[0008] A distance between a surface of the first binding electrode facing away from the substrate and the substrate is greater than a distance between a surface of the second binding electrode facing away from the substrate and the substrate.

[0009] In some embodiments, a difference between a distance between a surface of the first binding electrode facing away from the substrate and the substrate and a distance between a surface of the second binding electrode facing away from the substrate and the substrate is ≥5 μm.

[0010] In some embodiments, a distance between an orthographic projection of the first binding electrode on the substrate and an orthographic projection of the second binding electrode on the substrate is ≥0 and <500 μm.

[0011] In some embodiments, the first binding electrode includes four sub-film layers, the four sub-film layers are stacked in sequence, and along the direction away from the substrate, the materials of the four sub-film layers are titanium, aluminum, titanium, and indium tin oxide in sequence;

[0012] The material of the second bonding electrode includes aluminum.

[0013] In some embodiments, the first bonding electrode and the second bonding electrode are located in different layers, and a first insulating layer is further disposed between the first bonding electrode and the second bonding electrode.

[0014] The display substrate further includes a first connection line and a second connection line.

[0015] The first connection line is of the same layer and the same material as the second bonding electrode. The positive projection of the first connection line on the substrate overlaps at least partially with the first bonding electrode. The first connection line is electrically connected to the first bonding electrode through a plurality of first vias opened in the first insulating layer.

[0016] The second connection line is located on a side of the second bonding electrode close to the substrate, and a second insulating layer is further disposed between the second connection line and the second bonding electrode and the first connection line.

[0017] The positive projection of the second connection line on the substrate overlaps at least partially with the second bonding electrode and the first connection line.

[0018] The second connection line is electrically connected to the second bonding electrode and the first connection line respectively through a plurality of second vias opened in the second insulating layer.

[0019] In some embodiments, the first bonding electrode and the second bonding electrode are located in different layers, and a first insulating layer is further disposed between the first bonding electrode and the second bonding electrode.

[0020] The second bonding electrode further extends to a positive projection area of the first bonding electrode on the substrate, and the positive projection of the second bonding electrode on the substrate overlaps at least partially with the first bonding electrode.

[0021] The second bonding electrode is electrically connected to the first bonding electrode through a plurality of first vias opened in the first insulating layer.

[0022] In some embodiments, a first opening is formed in the first insulating layer, and the first opening overlaps at least partially with the positive projection of the second bonding electrode on the substrate.

[0023] The second bonding electrode is exposed at the first opening.

[0024] In some embodiments, the number of the first bonding electrodes is multiple, and the number of the second bonding electrodes is multiple; the multiple first bonding electrodes and the multiple second bonding electrodes are electrically connected in one-to-one correspondence.

[0025] A plurality of the first bonding electrodes are arranged along a first direction;

[0026] A plurality of the second bonding electrodes are arranged along the first direction;

[0027] Along the first direction, the odd-numbered and even-numbered first bonding electrodes are staggered from each other;

[0028] Along the first direction, the odd-numbered and even-numbered second bonding electrodes are staggered from each other;

[0029] The odd-numbered first bonding electrodes and the odd-numbered second bonding electrodes are arranged along the first direction to form a first straight line;

[0030] The even-numbered first bonding electrodes and the even-numbered second bonding electrodes are arranged along the first direction to form a second straight line;

[0031] The first straight line and the second straight line are parallel to each other.

[0032] In some embodiments, the first vias are filled with tungsten.

[0033] In some embodiments, a third bonding electrode is further included, which is located in the bonding area and on the same side of the substrate as the first bonding electrode and the second bonding electrode, and the third bonding electrode is located on the side of the first bonding electrode close to the display area;

[0034] The positive projection of the third bonding electrode on the substrate does not overlap with the positive projections of the first bonding electrode and the second bonding electrode;

[0035] The third bonding electrode is configured to be bonded and connected to the display driving circuit;

[0036] The third bonding electrode is of the same layer and the same material as the first bonding electrode, and the surface of the third bonding electrode facing away from the substrate is flush with the surface of the first bonding electrode facing away from the substrate.

[0037] In some embodiments, an anode and a pixel circuit are further included, the anode is located in the display area; the pixel circuit is located in the display area and the bonding area;

[0038] The anode is of the same layer and the same material as the first bonding electrode and the third bonding electrode;

[0039] The pixel circuit is located between the anode and the substrate; the pixel circuit is electrically connected to the anode;

[0040] The display substrate further includes a third connection line, which is located between the third bonding electrode and the substrate, and the third connection line extends from the bonding area to the display area;

[0041] The third bonding electrode is electrically connected to the third connection line, and the third connection line is electrically connected to the pixel circuit.

[0042] In some embodiments, the number of the third bonding electrodes is plural, and the plural third bonding electrodes are arranged in an array.

[0043] Along the arrangement direction of the display area and the bonding area, the positions of any adjacent two rows of the third bonding electrodes in the array of the third bonding electrodes are staggered from each other.

[0044] In some embodiments, an electrostatic ring is further included, which surrounds the periphery of the display area.

[0045] Part of the electrostatic ring is located in the bonding area, and the part of the electrostatic ring located in the bonding area is located on the side of the second bonding electrode away from the display area.

[0046] The electrostatic ring includes a first electrode line and a second electrode line. The first electrode line is of the same layer and the same material as the second bonding electrode.

[0047] The second electrode line is located on the side of the first electrode line close to the substrate. The second electrode line is electrically connected to the first electrode line, and the second electrode line is grounded.

[0048] In some embodiments, along the arrangement direction of the display area and the bonding area, the distance between the third bonding electrode and the display area is ≥2 mm.

[0049] The distance between the side boundary of the third bonding electrode close to the display area and the side boundary of the first bonding electrode away from the display area is ≥2 mm.

[0050] The distance between the side boundary of the second bonding electrode close to the display area and its side boundary away from the display area is ≥100 μm.

[0051] The distance between the side boundary of the second bonding electrode away from the display area and the side boundary of the electrostatic ring away from the display area is ≥40 μm.

[0052] In a second aspect, an embodiment of the present disclosure further provides a display panel, which includes the above display substrate.

[0053] In some embodiments, a third insulating layer, a pixel defining layer and a packaging layer are further included.

[0054] The third insulating layer, the pixel defining layer, and the encapsulation layer respectively extend from the display area to the bonding area, and the third insulating layer, the pixel defining layer, and the encapsulation layer are sequentially stacked on the side of the first bonding electrode on the display substrate away from the substrate;

[0055] The third insulating layer, the pixel defining layer, and the encapsulation layer are provided with second openings in the areas corresponding to the first bonding electrode and the third bonding electrode, and the first bonding electrode and the third bonding electrode are exposed at the second openings;

[0056] The third insulating layer, the pixel defining layer, and the encapsulation layer are provided with third openings in the area corresponding to the second bonding electrode, and the third openings overlap with the positive projection of the first opening in the display substrate on the substrate, and the second bonding electrode is exposed in the overlapping area of the positive projections of the third opening and the first opening.

[0057] In some embodiments, along the arrangement direction of the display area and the bonding area, the opening width of the second opening is the distance between the side boundary of the third bonding electrode close to the display area and the side boundary of the first bonding electrode far from the display area.

[0058] In some embodiments, a display driving circuit is further included.

[0059] The display driving circuit is located on the side of the encapsulation layer away from the display substrate, and the display driving circuit is located at the second opening.

[0060] The input electrode of the display driving circuit is bound and electrically connected to the first bonding electrode through an anisotropic conductive adhesive; the output electrode of the display driving circuit is bound and electrically connected to the third bonding electrode through the anisotropic conductive adhesive.

[0061] In some embodiments, a peripheral circuit board is further included, which is located outside the display substrate.

[0062] One end of the bonding connection wire is welded to the second bonding electrode at the overlapping position of the positive projections of the third opening and the first opening, and the other end of the bonding connection wire is welded to the bonding electrode of the peripheral circuit board.

[0063] In some embodiments, the number of the bonding connection wires is multiple.

[0064] Each bonding connection wire correspondingly electrically connects a second bonding electrode and a bonding electrode of the peripheral circuit board;

[0065] The multiple bonding connection wires are wrapped with a protective adhesive, and the protective adhesive can insulate the adjacent bonding connection wires from each other.

[0066] In some embodiments, the material of the bonding connection wire includes aluminum.

[0067] In a third aspect, an embodiment of the present disclosure provides a method for manufacturing the above display panel, which includes: preparing a display substrate;

[0068] A third insulating layer, a pixel defining layer, and a packaging layer are sequentially prepared on one side of the display substrate, and a second opening is formed in the third insulating layer, the pixel defining layer, and the packaging layer through a single etching process, and the first bonding electrode and the third bonding electrode in the display substrate are exposed at the second opening;

[0069] Then, a third opening in the third insulating layer, the pixel defining layer, and the packaging layer and a first opening in the first insulating layer of the display substrate are formed through a single etching process, and the second bonding electrode in the display substrate is exposed at the overlapping area of the positive projections of the third opening and the first opening;

[0070] The input electrode of the display driving circuit is bonded and electrically connected to the first bonding electrode by thermocompression of anisotropic conductive adhesive. At the same time, the output electrode of the display driving circuit is bonded and electrically connected to the third bonding electrode by thermocompression of the anisotropic conductive adhesive;

[0071] The other end of the bonding connection wire, one end of which is welded to the bonding electrode of the peripheral circuit board, is thermocompression welded to the second bonding electrode.

[0072] In the display substrate provided by the embodiments of the present disclosure, by making the distance between the surface of the first bonding electrode facing away from the substrate and the substrate greater than the distance between the surface of the second bonding electrode facing away from the substrate and the substrate, there is a step height difference between the surface of the first bonding electrode facing away from the substrate and the surface of the second bonding electrode facing away from the substrate. When the first bonding electrode and the display driving circuit are bonded and connected by hot pressing an anisotropic conductive adhesive, even if the anisotropic conductive adhesive overflows to the hot pressing welding surface of the second bonding electrode and the bonding connection wire when being extruded, it will not cause a short circuit between adjacent second bonding electrodes or bonding connection wires. Because when the second bonding electrode and the bonding connection wire are hot pressed and welded, the gold ball particles in the anisotropic conductive adhesive will not be flattened, so the anisotropic conductive adhesive overflowing to the hot pressing welding surface of the second bonding electrode and the bonding connection wire will not conduct electricity. Therefore, the anisotropic conductive adhesive overflowing to the hot pressing welding surface of the second bonding electrode and the bonding connection wire will not cause a short circuit between adjacent second bonding electrodes or adjacent bonding connection wires. Furthermore, the reserved spacing for tolerating glue overflow between the first bonding electrode and the second bonding electrode can be shortened or eliminated, thereby reducing the width of the bonding area in the direction away from the display area and improving the cutting efficiency of the wafer. In addition, due to the step height difference between the surface of the first bonding electrode facing away from the substrate and the surface of the second bonding electrode facing away from the substrate, when hot pressing and bonding the connection wire to bond it with the second bonding electrode, it will not cause secondary damage to the already bonded display driving circuit.

[0073] The display panel provided by the embodiments of the present disclosure, by adopting the display substrate in the above embodiments, on the one hand, can shorten or eliminate the reserved spacing for tolerating glue overflow between the first bonding electrode and the second bonding electrode, thereby reducing the width of the bonding area in the direction away from the display area and improving the cutting efficiency of the wafer; on the other hand, when hot pressing and bonding the connection wire to bond it with the second bonding electrode, it will not cause secondary damage to the already bonded display driving circuit; on the third hand, the second bonding electrode and the bonding connection wire can be easily bonded by hot pressing, and the bonding impedance between the second bonding electrode and the bonding connection wire can be reduced to ensure stable reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] The drawings are used to provide a further understanding of the embodiments of the present disclosure, and constitute a part of the specification. They are used to explain the present disclosure together with the embodiments of the present disclosure, and do not constitute a limitation to the present disclosure. By describing the detailed exemplary embodiments with reference to the drawings, the above and other features and advantages will become more obvious to those skilled in the art. In the drawings:

[0075] Figure 1a It is a cross-sectional schematic view of the bonding area of the display panel in the related art.

[0076] Figure 1bIt is a top-down schematic view of the arrangement of output connection terminals, input connection terminals, and wire connection terminals in a related art display panel.

[0077] Figure 2a It is a top-down schematic view of the structure of the display substrate in an embodiment of the present disclosure.

[0078] Figure 2b In an embodiment of the present disclosure, the display substrate is along Figure 2a a structural cross-sectional view of a structure along the AA' cutting line in

[0079] Figure 2c In an embodiment of the present disclosure, the display substrate is along Figure 2a another structural cross-sectional view of a structure along the AA' cutting line in

[0080] Figure 3a It is a top-down schematic view of the arrangement of the first bonding electrode and the second bonding electrode in an embodiment of the present disclosure.

[0081] Figure 3b It is a top-down schematic view of the arrangement of the third bonding electrode in an embodiment of the present disclosure.

[0082] Figure 4a It is a partial structural cross-sectional view of a display panel in an embodiment of the present disclosure.

[0083] Figure 4b It is another partial structural cross-sectional view of a display panel in an embodiment of the present disclosure.

[0084] Figure 4c It is a partial structural cross-sectional view of the display area of the display panel in an embodiment of the present disclosure.

[0085] Figure 5a It is a structural cross-sectional view of the display panel after the completion of step S101 in an embodiment of the present disclosure.

[0086] Figure 5b It is a structural cross-sectional view of the display panel after the completion of step S102 in an embodiment of the present disclosure.

[0087] Figure 5c It is a structural cross-sectional view of the display panel after the completion of step S103 in an embodiment of the present disclosure.

[0088] Figure 5d It is a structural cross-sectional view of the display panel after the completion of step S104 in an embodiment of the present disclosure.

[0089] Figure 5e It is a structural cross-sectional view of the display panel after the completion of step S105 in an embodiment of the present disclosure. Detailed implementation manners

[0090] To enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the following further describes in detail a display substrate, a display panel, and a manufacturing method thereof provided by the embodiments of the present disclosure in conjunction with the accompanying drawings and specific embodiments.

[0091] In the following, the embodiments of the present disclosure will be described more fully with reference to the accompanying drawings. However, the disclosed embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0092] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications to the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings have schematic properties, and the shapes of the regions shown in the drawings illustrate the specific shapes of the regions, but are not intended to be restrictive.

[0093] In the related art, with the continuous iteration of silicon-based OLED products, different from the silicon-based MDL (module) form of One Chip (single chip, that is, directly integrating the display driver integrated circuit (DDIC) on the display panel, and the display panel can be regarded as a single chip), the silicon-based MDL (module) form of Two chip (dual chip, that is, the display driver integrated circuit (DDIC) and the display panel are separately provided, and the display driver integrated circuit needs to be bonded and connected to the display panel) has a higher product yield. In the silicon-based MDL (module) of Two chip, the bonding forms of the display driver integrated circuit (DDIC) include COC (that is, chip on chip, that is, bonding the display driver integrated circuit on the display panel through anisotropic conductive adhesive) and COF (that is, bonding and connecting the display panel and the display driver integrated circuit through a flexible printed circuit board (FPC), such as one end of the flexible printed circuit board is bonded to the display panel and the other end is bonded to the display driver integrated circuit), etc. The bonding forms of the above-mentioned display panel after completing the bonding of the display driver integrated circuit with the peripheral circuit board (such as a PCB circuit board) include FPC (that is, a flexible printed circuit board, that is, bonding and connecting the display panel with the peripheral circuit board through a flexible printed circuit board) and Wire (that is, bonding and connecting the display panel with the peripheral circuit board through a wire, and then coating the wire with insulating glue for protection). The bonding form of the display driver integrated circuit and the display panel adopting the COC form + the bonding form of the display panel and the peripheral circuit board adopting the Wire form has better bonding impedance stability in theory than the bonding form of the display driver integrated circuit and the display panel adopting the COC form + the bonding form of the display panel and the peripheral circuit board adopting the FPC form.

[0094] Figure 1aIt is a schematic cross-sectional view of the bonding area of the display panel in the related art. The bonding form between the display driving chip 24 and the display panel adopts the COC form, and the bonding form between the display panel and the peripheral circuit board adopts the Wire form. As Figure 1a shown, the display panel includes a display area 100 and a bonding area 101. The output connection terminals (Output Pad) 25, input connection terminals (Input Pad) 26 required for bonding the display driving chip 24 on the display panel, and the wire connection terminals (Wire Pad) 27 required for bonding the peripheral circuit board on the display panel are located in the bonding area 101 and on the same layer and the same horizontal plane. The output connection terminals 25, input connection terminals 26, and wire connection terminals 27 are arranged in sequence along the direction away from the display area 100. These three types of connection terminals (Pad) all adopt a film layer structure of TATI (titanium, aluminum, titanium, indium tin oxide) stacked in sequence, and the indium tin oxide film layer is located on the surface layer of the connection terminal.

[0095] Figure 1b It is a schematic top view of the arrangement of the output connection terminal, input connection terminal, and wire connection terminal in the display panel of the related art. Among them, the output connection terminal 25 and the input connection terminal 26 are respectively bonded to the corresponding bonding connection terminals (Pad Bump) on the display driving chip 24, and in order to increase the bonding integration, both the output connection terminal 25 and the input connection terminal 26 adopt an interleaved and densely arranged manner. The wire connection terminal 27 adopts a linear arrangement manner.

[0096] Figure 1a and Figure 1bRegarding the structural settings of the display panel, on the one hand, the display driving chip 24 is bonded to the output connection terminal 25 and the input connection terminal 26 on the display panel using an anisotropic conductive adhesive (i.e., ACF conductive adhesive) 22. During bonding, the anisotropic conductive adhesive 22 is squeezed, flattening the gold ball particles inside to achieve electrical connection. During the squeezing process, glue overflow occurs, and the anisotropic conductive adhesive 22 easily overflows onto the thermocompression welding surface between the wire 28 and the wire connection terminal 27. The gold ball particles on the thermocompression welding surface will be flattened and conduct electricity, causing a short circuit between adjacent wires 28 or wire connection terminals 27. Therefore, currently, a spacing L of 500 μm needs to be reserved between the input connection terminal (Input Pad) 26 and the wire connection terminal (Wire Pad) in the display panel to tolerate the glue overflow problem. During the mass production process of the silicon-based OLED display panel, multiple silicon-based OLED display panels are fabricated on the same wafer. Each silicon-based OLED display panel is cut from the same wafer. Reserving a 500-μm spacing L between the input connection terminal (Input Pad) and the wire connection terminal (Wire Pad) in each of the above display panels seriously affects the cutting efficiency of the wafer (i.e., the number of display panels that can be cut from one wafer is small). On the other hand, since the output connection terminal, the input connection terminal, and the wire connection terminal are on the same horizontal plane, and the binding of the display driving chip has been completed before wire bonding. Therefore, when thermocompression bonding the aluminum wire to bond it with the wire connection terminal later, it will cause secondary damage to the already bonded display driving chip. On the further hand, since the wire for connecting the display panel to the peripheral circuit board is made of aluminum, and the wire connection terminal and the wire are connected by thermocompression welding, it is difficult to bond the indium tin oxide (ITO) on the surface of the wire connection terminal with the aluminum wire during thermocompression. Therefore, the binding impedance between the wire connection terminal and the wire is large, and the reliability is unstable.

[0097] To solve the above three problems existing in the related art, on the first hand, the embodiments of the present disclosure provide a display substrate. Referring to Figure 2a , it is a top view schematic diagram of the structure of the display substrate in the embodiments of the present disclosure; Figure 2b In the embodiments of the present disclosure, the display substrate is along Figure 2aA schematic cross-sectional view of a structure of the AA' cutting line; wherein, it is shown that the display substrate has a display area 100 and a bonding area 101, the bonding area 101 is located at least on one side periphery of the display area 100, the display substrate includes a substrate 1, which is located in the display area 100 and the bonding area 101; a first bonding electrode 2 and a second bonding electrode 3, which are located in the bonding area 101 and on the same side of the substrate 1, the first bonding electrode 2 is located on the side closer to the display area 100 of the second bonding electrode 3, the first bonding electrode 2 is configured to be bonded and connected to the display driving circuit; the second bonding electrode 3 is configured to be bonded and connected to the peripheral circuit board; the first bonding electrode 2 is electrically connected to the second bonding electrode 3; the peripheral circuit board is configured to provide a display signal and a power signal to the display driving circuit; the display driving circuit is configured to provide a display driving signal to the display area 100; the distance h1 between the surface of the first bonding electrode 2 facing away from the substrate 1 and the substrate 1 is greater than the distance h2 between the surface of the second bonding electrode 3 facing away from the substrate 1 and the substrate 1.

[0098] Wherein, the display driving circuit is the display driving chip (DDIC). The first bonding electrode 2 is bonded and connected to the display driving circuit through thermocompression anisotropic conductive adhesive (i.e., ACF conductive adhesive), and the second bonding electrode 3 is bonded and connected to the peripheral circuit board through thermocompression welding of a bonding wire.

[0099] In some embodiments, the substrate 1 is made of single crystal silicon, that is, the display substrate is a silicon-based display substrate, and the display substrate is cut from a wafer, and a wafer can be cut into multiple display substrates. The display substrate can be an AR (Augmented Reality) or VR (Virtual Reality) display substrate. The display substrate can be applied to a portable display device (such as a helmet).

[0100] In this embodiment, by making the distance h1 between the surface of the first bonding electrode 2 facing away from the substrate 1 and the substrate 1 greater than the distance h2 between the surface of the second bonding electrode 3 facing away from the substrate 1 and the substrate 1, there is a step height difference between the surface of the first bonding electrode 2 facing away from the substrate 1 and the surface of the second bonding electrode 3 facing away from the substrate 1. When the first bonding electrode 2 and the display driving circuit are bonded and connected by hot pressing an anisotropic conductive adhesive, even if the anisotropic conductive adhesive overflows to the hot pressing welding surface of the second bonding electrode 3 and the bonding connection wire when being extruded, it will not cause a short circuit between adjacent second bonding electrodes 3 or bonding connection wires. Because when the second bonding electrode 3 and the bonding connection wire are hot pressed and welded, the gold ball particles in the anisotropic conductive adhesive will not be flattened, so the anisotropic conductive adhesive overflowing to the hot pressing welding surface of the second bonding electrode 3 and the bonding connection wire will not conduct electricity. Therefore, the anisotropic conductive adhesive overflowing to the hot pressing welding surface of the second bonding electrode 3 and the bonding connection wire will not cause a short circuit between adjacent second bonding electrodes 3 or adjacent bonding connection wires. Furthermore, the reserved spacing for tolerating glue overflow between the first bonding electrode 2 and the second bonding electrode 3 can be shortened or eliminated, thereby reducing the width of the bonding area 101 in the direction away from the display area 100 and improving the cutting efficiency of the wafer. In addition, due to the step height difference between the surface of the first bonding electrode 2 facing away from the substrate 1 and the surface of the second bonding electrode 3 facing away from the substrate 1, when hot pressing and bonding the connection wire to bond it with the second bonding electrode 3, it will not cause secondary damage to the already bonded display driving circuit.

[0101] In some embodiments, the difference between the distance h1 between the surface of the first bonding electrode 2 facing away from the substrate 1 and the substrate 1 and the distance h2 between the surface of the second bonding electrode 3 facing away from the substrate 1 and the substrate 1 is ≥ 5 μm. This distance difference can ensure that the anisotropic conductive adhesive overflowing to the hot pressing welding surface of the second bonding electrode 3 and the bonding connection wire will not cause a short circuit between adjacent second bonding electrodes 3 or adjacent bonding connection wires. Thus, the reserved spacing for tolerating glue overflow between the first bonding electrode 2 and the second bonding electrode 3 can be shortened or eliminated, and further the cutting efficiency of the wafer can be improved.

[0102] In some embodiments, the distance L3 between the orthographic projection of the first bonding electrode 2 on the substrate 1 and the orthographic projection of the second bonding electrode 3 on the substrate 1 is ≥ 0 and < 500 μm. Thus, the reserved spacing for tolerating glue overflow between the first bonding electrode 2 and the second bonding electrode 3 can be shortened or eliminated, and further the cutting efficiency of the wafer can be improved.

[0103] In some embodiments, the first bonding electrode 2 includes four sub-film layers which are stacked in sequence. Along the direction away from the substrate 1, the materials of the four sub-film layers are titanium, aluminum, titanium, and indium tin oxide in sequence; the material of the second bonding electrode 3 includes aluminum. The bonding connection wire is made of an aluminum wire. Since the second bonding electrode 3 made of aluminum is soft and has good electrical conductivity, it is easy to bond the second bonding electrode 3 and the bonding connection wire by thermocompression, and the bonding impedance between the second bonding electrode 3 and the bonding connection wire can be reduced to ensure stable reliability; at the same time, the second bonding electrode 3 made of aluminum can also absorb the stress generated during the thermocompression of the aluminum wire, reducing the secondary damage to the display driving circuit during the thermocompression process.

[0104] In some embodiments, referring to Figure 2b , the first bonding electrode 2 and the second bonding electrode 3 are located on different layers, and a first insulating layer 4 is further provided between the first bonding electrode 2 and the second bonding electrode 3. The display substrate further includes a first connection line 5 and a second connection line 6. The first connection line 5 is on the same layer and made of the same material as the second bonding electrode 3. The first connection line 5 and the first bonding electrode 2 at least partially overlap in the orthographic projection on the substrate 1. The first connection line 5 is electrically connected to the first bonding electrode 2 through a plurality of first vias 40 formed in the first insulating layer 4; the second connection line 6 is located on the side of the second bonding electrode 3 close to the substrate 1, and a second insulating layer 7 is further provided between the second connection line 6 and the second bonding electrode 3 and the first connection line 5; the second connection line 6 and the second bonding electrode 3 and the first connection line 5 at least partially overlap in the orthographic projection on the substrate 1; the second connection line 6 is electrically connected to the second bonding electrode 3 and the first connection line 5 respectively through a plurality of second vias 70 formed in the second insulating layer 7.

[0105] Among them, the setting of the plurality of first vias 40 can reduce the connection impedance between the first connection line 5 and the first bonding electrode 2. The setting of the plurality of second vias 70 can reduce the connection impedance between the second connection line 6 and the second bonding electrode 3 and the connection impedance between the second connection line 6 and the first connection line 5. The setting of the second connection line 6 can realize the electrical connection between the second bonding electrode 3 and the first bonding electrode 2, so that the display signal and the power supply signal provided by the peripheral circuit board are transmitted to the display driving circuit through the second bonding electrode 3 and the first bonding electrode 2; at the same time, the setting of the second connection line 6 can also reduce the connection impedance between the second bonding electrode 3 and the first bonding electrode 2.

[0106] In some embodiments, referring to Figure 2c , for the display substrate in the embodiments of the present disclosure along Figure 2aAnother structural cross-sectional schematic diagram of the AA' cutting line; the first bonding electrode 2 and the second bonding electrode 3 are located on different layers, and a first insulating layer 4 is further provided between the first bonding electrode 2 and the second bonding electrode 3. The second bonding electrode 3 also extends to the orthographic projection area of the first bonding electrode 2 on the substrate 1, and the second bonding electrode 3 at least partially overlaps with the orthographic projection of the first bonding electrode 2 on the substrate 1. The second bonding electrode 3 is electrically connected to the first bonding electrode 2 through a plurality of first vias 40 opened in the first insulating layer 4.

[0107] Among them, the setting of the plurality of first vias 40 can reduce the connection impedance between the second bonding electrode 3 and the first bonding electrode 2. The extended setting of the second bonding electrode 3 can achieve the electrical connection between it and the first bonding electrode 2, so that the display signal and power signal provided by the peripheral circuit board are transmitted to the display driving circuit through the second bonding electrode 3 and the first bonding electrode 2; at the same time, the extended setting of the second bonding electrode 3 can also reduce the connection impedance between the second bonding electrode 3 and the first bonding electrode 2. Further, the extended setting of the second bonding electrode 3 can further shorten or eliminate the reserved spacing for tolerating glue overflow between the first bonding electrode 2 and the second bonding electrode 3, thereby improving the cutting efficiency of the wafer.

[0108] In some embodiments, referring to Figure 2c , the display substrate further includes a fourth connection line 8. The fourth connection line 8 is located on the side of the second bonding electrode 3 close to the substrate 1, and a second insulating layer 7 is further provided between the fourth connection line 8 and the second bonding electrode 3. The fourth connection line 8 at least partially overlaps with the orthographic projection of the second bonding electrode 3 on the substrate 1; the fourth connection line 8 is electrically connected to the second bonding electrode 3 through a plurality of third vias 71 opened in the second insulating layer 7.

[0109] Among them, the setting of the plurality of third vias 71 can reduce the connection impedance between the fourth connection line 8 and the second bonding electrode 3. The setting of the fourth connection line 8 can reduce the impedance of the second bonding electrode 3, thereby further reducing the connection impedance between the fourth connection line 8 and the second bonding electrode 3.

[0110] In some embodiments, both the first insulating layer 4 and the second insulating layer 7 are made of inorganic insulating materials, such as silicon nitride, silicon oxide or silicon oxynitride, etc.

[0111] In some embodiments, referring to Figure 2b and Figure 2c , a first opening 41 is opened in the first insulating layer 4. The first opening 41 at least partially overlaps with the orthographic projection of the second bonding electrode 3 on the substrate 1, and the second bonding electrode 3 is exposed at the first opening 41. This facilitates the bonding connection between the second bonding electrode 3 and the bonding connection wire.

[0112] In some embodiments, referring toFigure 3a is a top-down layout schematic diagram of the first bonding electrode and the second bonding electrode in the embodiments of the present disclosure. The number of the first bonding electrodes 2 is multiple, and the number of the second bonding electrodes 3 is multiple; the multiple first bonding electrodes 2 and the multiple second bonding electrodes 3 are electrically connected in one-to-one correspondence; the multiple first bonding electrodes 2 are arranged along the first direction X; the multiple second bonding electrodes 3 are arranged along the first direction X; along the first direction X, the odd-numbered and even-numbered first bonding electrodes 2 are staggered from each other; along the first direction X, the odd-numbered and even-numbered second bonding electrodes 3 are staggered from each other; the odd-numbered first bonding electrodes 2 and the odd-numbered second bonding electrodes 3 are arranged along the first direction X to form a first straight line P1; the even-numbered first bonding electrodes 2 and the even-numbered second bonding electrodes 3 are arranged along the first direction X to form a second straight line P2; the first straight line P1 and the second straight line P2 are parallel to each other.

[0113] Among them, along the first direction X, the odd-numbered and even-numbered first bonding electrodes 2 are staggered from each other. On the one hand, it can increase the bonding integration degree of the first bonding electrodes 2; on the other hand, it can avoid short circuits between adjacent first bonding electrodes 2. Along the first direction X, the odd-numbered and even-numbered second bonding electrodes 3 are staggered from each other. On the one hand, it can increase the bonding integration degree of the second bonding electrodes 3; on the other hand, it can avoid short circuits between adjacent second bonding electrodes 2.

[0114] In some embodiments, tungsten is filled in the first via 40. The tungsten via can reduce the connection impedance of the first via 40 on the one hand, and on the other hand, the tungsten via also facilitates subsequent observation and detection of the bonding connection situation between the first bonding electrode 2 and the second bonding electrode 3.

[0115] In some embodiments, referring to Figure 2b and Figure 2c shows that the display substrate further includes a third bonding electrode 9, which is located in the bonding area 101 and on the same side of the substrate 1 as the first bonding electrode 2 and the second bonding electrode 3. The third bonding electrode 9 is located on the side of the first bonding electrode 2 close to the display area 100; the orthographic projection of the third bonding electrode 9 on the substrate 1 does not overlap with the first bonding electrode 2 and the second bonding electrode 3; the third bonding electrode 9 is configured to be bonded and connected to the display driving circuit; the third bonding electrode 9 is of the same layer and the same material as the first bonding electrode 2, and the surface of the third bonding electrode 9 facing away from the substrate 1 is flush with the surface of the first bonding electrode 2 facing away from the substrate 1.

[0116] Among them, the first bonding electrode 2 is bonded and connected to the input electrode of the display driving circuit, and the third bonding electrode 9 is bonded and connected to the output electrode of the display driving circuit through thermocompression anisotropic conductive adhesive.

[0117] In some embodiments, referring to Figure 2b and Figure 2c, the display substrate further includes an anode 10 and a pixel circuit 11, which are located in the display area 100. The anode 10 is made of the same material and on the same layer as the first bonding electrode 2 and the third bonding electrode 9. The anode 10 is located in the display area 100. The pixel circuit 11 is located in the display area 100 and the bonding area 101. The pixel circuit 11 is located between the anode 10 and the substrate 1. The pixel circuit 11 is electrically connected to the anode 10. The display substrate further includes a third connection line 12, which is located between the third bonding electrode 9 and the substrate 1. The third connection line 12 extends from the bonding area 101 to the display area 100. The third bonding electrode 9 is electrically connected to the third connection line 12, and the third connection line 12 is electrically connected to the pixel circuit 11.

[0118] Among them, the pixel circuit 11 adopts a traditional OLED pixel circuit, and the specific circuit of the pixel circuit 11 will not be elaborated here. Figure 2b and Figure 2c only shows a schematic representation of the pixel circuit 11, and the specific circuit is not drawn. The third connection line 12 is electrically connected to the third bonding electrode 9 through a plurality of tungsten vias. By electrically connecting the third connection line 12 to the pixel circuit 11, the display driving signal provided by the display driving circuit and the power signal provided by the peripheral circuit board can be transmitted to the pixel circuit 11, so as to realize the driving of the OLED light-emitting element by the pixel circuit 11. The pixel circuit 11 further includes a cathode ring 110 surrounding the display area 100. The cathode ring 110 is made of the same material and on the same layer as the anode 10. Figure 2b and Figure 2c shows that the third connection line 12 is electrically connected to the cathode ring 110.

[0119] In some embodiments, referring to Figure 3b , which is a top view schematic diagram of the arrangement of the third bonding electrodes in the embodiments of the present disclosure; the number of the third bonding electrodes 9 is multiple, and the multiple third bonding electrodes 9 are arranged in an array. Along the arrangement direction Y of the display area 100 and the bonding area 101, the positions of any two adjacent rows of the third bonding electrodes 9 in the array of the third bonding electrodes 9 are staggered from each other. By setting like this, the bonding integration degree of the third bonding electrodes 9 can be increased, and at the same time, the short circuit between adjacent third bonding electrodes 9 can be improved or avoided.

[0120] In some embodiments, referring to Figure 2b and Figure 2c, the display substrate further includes an electrostatic ring 13, which surrounds the periphery of the display area 100. A part of the electrostatic ring 13 is located in the bonding area 101. The part of the electrostatic ring 13 located in the bonding area 101 is on the side of the second bonding electrode 3 away from the display area 100. The electrostatic ring 13 includes a first electrode line 131 and a second electrode line 132. The first electrode line 131 is on the same layer and made of the same material as the second bonding electrode 3. The second electrode line 132 is on the side of the first electrode line 131 close to the substrate 1. The second electrode line 132 is electrically connected to the first electrode line 131 and the second electrode line 132 is grounded. The first electrode line 131 and the second electrode line 132 together form the electrostatic ring 13, which can reduce the grounding impedance of the electrostatic ring 13, so that the electrostatic ring can conduct static electricity well and protect the display substrate from static damage. In addition, the electrostatic ring can also prevent cracks from entering the interior of the display substrate when the wafer is cut to form the display substrate, protecting the display substrate. When the wafer is cut to form the display substrate, the cutting is performed from the side of the electrostatic ring 13 away from the display area 100.

[0121] In some embodiments, referring to Figure 2b , along the arrangement direction Y of the display area 100 and the bonding area 101, the distance L1 between the third bonding electrode 9 and the display area 100 is L1≥2mm; this distance can ensure safety during the thermocompression of the anisotropic conductive adhesive and will not affect or damage the display area 100; the distance L2 between the boundary of the third bonding electrode 9 close to the display area 100 and the boundary of the first bonding electrode 2 away from the display area 100 is L2≥2mm; the distance L4 between the boundary of the second bonding electrode 3 close to the display area 100 and its boundary away from the display area 100 is L4≥100μm; the distance L5 between the boundary of the second bonding electrode 3 away from the display area 100 and the boundary of the electrostatic ring 13 away from the display area 100 is L5≥40μm.

[0122] The display substrate provided by the embodiments of the present disclosure makes the distance between the surface of the first bonding electrode facing away from the substrate and the substrate greater than the distance between the surface of the second bonding electrode facing away from the substrate and the substrate, so that there is a step height difference between the surface of the first bonding electrode facing away from the substrate and the surface of the second bonding electrode facing away from the substrate. When the first bonding electrode and the display driving circuit are bonded and connected by hot pressing an anisotropic conductive adhesive, even if the anisotropic conductive adhesive overflows to the hot pressing welding surface of the second bonding electrode and the bonding connection wire when being extruded, it will not cause a short circuit between adjacent second bonding electrodes or bonding connection wires, because when the second bonding electrode and the bonding connection wire are hot pressed and welded, the gold ball particles in the anisotropic conductive adhesive will not be flattened, so that the anisotropic conductive adhesive overflowing to the hot pressing welding surface of the second bonding electrode and the bonding connection wire will not conduct electricity. Therefore, the anisotropic conductive adhesive overflowing to the hot pressing welding surface of the second bonding electrode and the bonding connection wire will not cause a short circuit between adjacent second bonding electrodes or adjacent bonding connection wires, and thus the reserved spacing for tolerating glue overflow between the first bonding electrode and the second bonding electrode can be shortened or eliminated, thereby reducing the width of the bonding area along the direction away from the display area and improving the cutting efficiency of the wafer. In addition, due to the step height difference between the surface of the first bonding electrode facing away from the substrate and the surface of the second bonding electrode facing away from the substrate, when hot pressing and bonding the connection wire to bond it with the second bonding electrode, it will not cause secondary damage to the already bonded display driving circuit.

[0123] In a second aspect, an embodiment of the present disclosure further provides a display panel, including the display substrate in the above embodiment.

[0124] In some embodiments, referring to Figure 4a , it is a partial structural cross-sectional schematic diagram of a display panel in an embodiment of the present disclosure; Figure 4b It is a partial structural cross-sectional schematic diagram of another display panel in an embodiment of the present disclosure; wherein, the display panel further includes a third insulating layer 14, a pixel defining layer 15 and a packaging layer 16. The third insulating layer 14, the pixel defining layer 15 and the packaging layer 16 respectively extend from the display area 100 to the bonding area 101, and the third insulating layer 14, the pixel defining layer 15 and the packaging layer 16 are sequentially stacked on the side of the first bonding electrode 2 in the display substrate facing away from the substrate 1; the third insulating layer 14, the pixel defining layer 15 and the packaging layer 16 are provided with a second opening 17 in the areas corresponding to the first bonding electrode 2 and the third bonding electrode 9, and the first bonding electrode 2 and the third bonding electrode 9 are exposed at the second opening 17; the third insulating layer 14, the pixel defining layer 15 and the packaging layer 16 are provided with a third opening 18 in the area corresponding to the second bonding electrode 3, and the third opening 18 overlaps with the orthographic projection of the first opening 41 in the display substrate on the substrate 1, and the second bonding electrode 3 is exposed in the overlapping area of the orthographic projections of the third opening 18 and the first opening 41.

[0125] In some embodiments, referring to Figure 4a 、 Figure 4b and Figure 4c , Figure 4c is a partial structural cross-sectional schematic diagram of a display area of a display panel according to an embodiment of the present disclosure; a fourth opening is provided in a portion of the third insulating layer 14 and the pixel defining layer 15 located in the display area 100, and the anode 10 in the display substrate is exposed at the fourth opening; the display panel further includes a light-emitting functional layer 19 and a cathode layer 20, the light-emitting functional layer 19 and the cathode layer 20 are sequentially stacked on a side of the anode 10 in the display substrate facing away from the substrate 1, and the light-emitting functional layer 19 and the cathode layer 20 are located between the anode 10 and the encapsulation layer 16; the light-emitting functional layer 19 is located in the fourth opening, the cathode layer 20 covers the entire display area 100, and extends from the display area 100 to the bonding area 101 and contacts and is electrically connected to the cathode ring 110 located in the bonding area 101. The anode 10, the light-emitting functional layer 19, and the cathode layer 20 at the fourth opening are sequentially stacked to form an OLED light-emitting element, and the OLED light-emitting element emits light under the drive of the pixel circuit 11, and the encapsulation layer 16 encapsulates the OLED light-emitting element.

[0126] In some embodiments, referring to Figure 4a and Figure 4b , along the arrangement direction Y of the display area 100 and the bonding area 101, the opening width of the second opening 17 is the distance L2 between the side boundary of the third bonding electrode 9 close to the display area 100 and the side boundary of the first bonding electrode 2 far from the display area 100. That is, the orthographic projections of the first bonding electrode 2 and the third bonding electrode 9 on the display substrate are both located within the orthographic projection area of the second opening 17 on the display substrate, and the second opening 17 is used for bonding the display driving circuit.

[0127] In some embodiments, referring to Figure 4a and Figure 4b , the display panel further includes a display driving circuit 21, the display driving circuit 21 is located on a side of the encapsulation layer 16 away from the display substrate, and the display driving circuit 21 is located at the second opening 17. The input electrode of the display driving circuit 21 is bonded and electrically connected to the first bonding electrode 2 through an anisotropic conductive adhesive 22; the output electrode of the display driving circuit 21 is bonded and electrically connected to the third bonding electrode 9 through an anisotropic conductive adhesive 22.

[0128] In some embodiments, referring to Figure 4a and Figure 4b, the display panel further includes a peripheral circuit board (not shown in the figure), which is located outside the display substrate. The second bonding electrode 3 is welded and connected to one end of the bonding connection wire 23 at the overlapping position of the orthographic projections of the third opening 18 and the first opening 41, and the other end of the bonding connection wire 23 is welded and connected to the bonding electrode of the peripheral circuit board. That is, the second bonding electrode 3 and the peripheral circuit board are bonded and connected through the bonding connection wire 23.

[0129] In some embodiments, the number of the bonding connection wires 23 is multiple, and each bonding connection wire 23 is correspondingly electrically connected to a second bonding electrode 3 and a bonding electrode of the peripheral circuit board; a protective glue (not shown in the figure) is wrapped around the multiple bonding connection wires 23, and the protective glue can insulate adjacent bonding connection wires 23 from each other.

[0130] In some embodiments, the material of the bonding connection wire 23 includes aluminum. Since the second bonding electrode 3 made of aluminum is soft and has good conductivity, the second bonding electrode 3 and the bonding connection wire 23 can be easily bonded by thermocompression, and the bonding impedance between the second bonding electrode 3 and the bonding connection wire 23 can be reduced to ensure stable reliability.

[0131] The display panel provided by the embodiment of the present disclosure, by adopting the display substrate in the above embodiment, on the one hand, can shorten or eliminate the reserved spacing for tolerating overflow glue between the first bonding electrode and the second bonding electrode, thereby reducing the width of the bonding area in the direction away from the display area and improving the cutting efficiency of the wafer; on the other hand, when thermocompression bonding the bonding connection wire to bond it with the second bonding electrode, it will not cause secondary damage to the already bonded display driving circuit; on the third hand, the second bonding electrode and the bonding connection wire can be easily bonded by thermocompression, and the bonding impedance between the second bonding electrode and the bonding connection wire can be reduced to ensure stable reliability.

[0132] The display panel provided by the embodiment of the present disclosure can be any product or component with a display function, such as an OLED panel, a Micro OLED panel, an OLED TV, an OLED billboard, a display, a mobile phone, a navigator, etc.

[0133] In a third aspect, the embodiment of the present disclosure further provides a preparation method for the above display panel, referring to Figure 5a , Figure 5b , Figure 5c , Figure 5d and Figure 5e , Figure 5a is a schematic cross-sectional view of the structure of the display panel after the completion of step S101 in the preparation of the display panel in the embodiment of the present disclosure; Figure 5b is a schematic cross-sectional view of the structure of the display panel after the completion of step S102 in the preparation of the display panel in the embodiment of the present disclosure; Figure 5cIt is a schematic cross-sectional view of the structure after the completion of step S103 in the display panel preparation of this disclosure example; Figure 5d It is a schematic cross-sectional view of the structure after the completion of step S104 in the display panel preparation of this disclosure example; Figure 5e It is a schematic cross-sectional view of the structure after the completion of step S105 in the display panel preparation of this disclosure example; wherein, the preparation method of the display panel includes: Step S101: Prepare a display substrate.

[0134] In this step, the preparation of each film layer in the display substrate adopts traditional processes, which will not be elaborated here. It should be noted that after the display substrate is prepared, a first opening 41 may be formed in the first insulating layer 4, or, after the display substrate is prepared, the first insulating layer 4 may not be provided with the first opening 41, and the first opening 41 will be formed in the first insulating layer 4 in step S103 subsequently.

[0135] Step S102: Sequentially prepare a third insulating layer 14, a pixel defining layer 15 and a packaging layer 16 on one side of the display substrate, and form a second opening 17 in the third insulating layer 14, the pixel defining layer 15 and the packaging layer 16 through a single etching process, and the first bonding electrode 2 and the third bonding electrode 3 in the display substrate are exposed at the second opening 17.

[0136] In this step, the second opening 17 in the third insulating layer 14, the pixel defining layer 15 and the packaging layer 16 is formed through a single dry etching process.

[0137] Step S103: Then form a third opening 18 in the third insulating layer 14, the pixel defining layer 15 and the packaging layer 16 and a first opening 41 in the first insulating layer of the display substrate through a single etching process, and the second bonding electrode 3 in the display substrate is exposed in the overlapping area of the positive projections of the third opening 18 and the first opening 41.

[0138] In this step, the third opening 18 in the third insulating layer 14, the pixel defining layer 15 and the packaging layer 16 and the first opening 41 in the first insulating layer of the display substrate are formed through a single dry etching process.

[0139] Step S104: Bind and electrically connect the input electrode of the display driving circuit 21 to the first bonding electrode 2 through hot pressing an anisotropic conductive adhesive 22, and at the same time, bind and electrically connect the output electrode of the display driving circuit 21 to the third bonding electrode 9 through hot pressing the anisotropic conductive adhesive 22.

[0140] In this step, the gold ball particles in the anisotropic conductive adhesive 22 located on the bonding electrode pressing surface are flattened to conduct electricity, and the gold ball particles in the anisotropic conductive adhesive 22 located in the area outside the bonding electrode pressing surface are not flattened, so they will not conduct electricity either.

[0141] Step S105: The other end of the bonding connection wire 23, one end of which is welded to the bonding electrode of the peripheral circuit board, is connected to the second bonding electrode 3 by thermocompression welding.

[0142] In this step, the anisotropic conductive adhesive 22 may overflow onto the thermocompression welding surface between the second bonding electrode 3 and the bonding connection wire 23. However, during thermocompression welding, the gold ball particles in the anisotropic conductive adhesive 22 will not be flattened, so that the anisotropic conductive adhesive 22 will not conduct electricity, thus avoiding short circuits between adjacent bonding connection wires 23 and adjacent second bonding electrodes 3 caused by overflowing glue.

[0143] In this embodiment, other structures and film layer preparation of the display panel all adopt traditional processes, which will not be elaborated here.

[0144] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principles of the present disclosure. However, the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also regarded as the protection scope of the present disclosure.

Claims

1. A display substrate having a display area and a bonding area, the bonding area being located at least on one peripheral side of the display area, Among them, The display substrate includes a substrate located in the display area and the bonding area; A first bonding electrode and a second bonding electrode, located in the bonding area and on the same side of the substrate, the first bonding electrode being located on the side closer to the display area of the second bonding electrode, The first bonding electrode is configured to be bonded and connected to a display driving circuit; the second bonding electrode is configured to be bonded and connected to an external circuit board; the first bonding electrode is electrically connected to the second bonding electrode; The external circuit board is configured to provide a display signal and a power signal to the display driving circuit; the display driving circuit is configured to provide a display driving signal to the display area; The distance between the surface of the first bonding electrode facing away from the substrate and the substrate is greater than the distance between the surface of the second bonding electrode facing away from the substrate and the substrate.

2. The display substrate according to claim 1, wherein, The difference between the distance between the surface of the first bonding electrode facing away from the substrate and the substrate and the distance between the surface of the second bonding electrode facing away from the substrate and the substrate is ≥5 μm.

3. The display substrate according to claim 1, wherein, The distance between the orthographic projection of the first bonding electrode on the substrate and the orthographic projection of the second bonding electrode on the substrate is ≥0 and <500 μm.

4. The display substrate according to any one of claims 1-3, wherein The first bonding electrode includes four sub-film layers stacked in sequence. Along the direction away from the substrate, the materials of the four sub-film layers are titanium, aluminum, titanium, and indium tin oxide in sequence; The material of the second bonding electrode includes aluminum.

5. The display substrate according to claim 4, wherein, The first bonding electrode and the second bonding electrode are located in different layers, and a first insulating layer is further provided between the first bonding electrode and the second bonding electrode, The display substrate further includes a first connection line and a second connection line, The first connection line is of the same layer and the same material as the second bonding electrode. The first connection line at least partially overlaps with the orthographic projection of the first bonding electrode on the substrate. The first connection line is electrically connected to the first bonding electrode through a plurality of first vias opened in the first insulating layer; The second connection line is located on the side of the second bonding electrode closer to the substrate, and a second insulating layer is further provided between the second connection line and the second bonding electrode and the first connection line; The second connection line at least partially overlaps with the orthographic projections of the second bonding electrode and the first connection line on the substrate; The second connection line is electrically connected to the second bonding electrode and the first connection line respectively through a plurality of second vias opened in the second insulating layer.

6. The display substrate according to claim 4, wherein The first bonding electrode and the second bonding electrode are located in different layers, and a first insulating layer is further provided between the first bonding electrode and the second bonding electrode, The second bonding electrode further extends to the orthographic projection area of the first bonding electrode on the substrate, and the second bonding electrode at least partially overlaps with the orthographic projection of the first bonding electrode on the substrate, The second bonding electrode is electrically connected to the first bonding electrode through a plurality of first vias opened in the first insulating layer.

7. The display substrate according to claim 5 or 6, wherein A first opening is formed in the first insulating layer, and the first opening at least partially overlaps with the positive projection of the second bonding electrode on the substrate. The second bonding electrode is exposed at the first opening.

8. The display substrate according to claim 5 or 6, wherein The number of the first bonding electrodes is multiple, and the number of the second bonding electrodes is multiple; the multiple first bonding electrodes and the multiple second bonding electrodes are electrically connected in one-to-one correspondence. The multiple first bonding electrodes are arranged along a first direction. The multiple second bonding electrodes are arranged along the first direction. Along the first direction, the odd-numbered and even-numbered first bonding electrodes are staggered from each other. Along the first direction, the odd-numbered and even-numbered second bonding electrodes are staggered from each other. The odd-numbered first bonding electrodes and the odd-numbered second bonding electrodes are arranged along the first direction to form a first straight line. The even-numbered first bonding electrodes and the even-numbered second bonding electrodes are arranged along the first direction to form a second straight line. The first straight line and the second straight line are parallel to each other.

9. The display substrate according to claim 5 or 6, wherein Tungsten is filled in the first via hole.

10. The display substrate according to claim 1, wherein, It further includes a third bonding electrode, which is located in the bonding area and on the same side of the substrate as the first bonding electrode and the second bonding electrode. The third bonding electrode is located on the side of the first bonding electrode close to the display area. The positive projection of the third bonding electrode on the substrate does not overlap with the positive projections of the first bonding electrode and the second bonding electrode. The third bonding electrode is configured to be bonded and connected to the display driving circuit. The third bonding electrode is of the same layer and the same material as the first bonding electrode, and the surface of the third bonding electrode facing away from the substrate is flush with the surface of the first bonding electrode facing away from the substrate.

11. The display substrate according to claim 10, wherein, It further includes an anode and a pixel circuit. The anode is located in the display area; the pixel circuit is located in the display area and the bonding area. The anode is of the same layer and the same material as the first bonding electrode and the third bonding electrode. The pixel circuit is located between the anode and the substrate; the pixel circuit is electrically connected to the anode. The display substrate further includes a third connecting line, which is located between the third bonding electrode and the substrate, and the third connecting line extends from the bonding area to the display area. The third bonding electrode is electrically connected to the third connecting line, and the third connecting line is electrically connected to the pixel circuit.

12. The display substrate according to claim 11, wherein, The number of the third bonding electrodes is multiple, and the multiple third bonding electrodes are arranged in an array. Along the arrangement direction of the display area and the bonding area, the positions of any adjacent two rows of the third bonding electrodes in the array of the third bonding electrodes are staggered from each other.

13. The display substrate according to claim 12, wherein, It further includes an electrostatic ring, which surrounds the periphery of the display area. Part of the electrostatic ring is located in the bonding area, and the part of the electrostatic ring located in the bonding area is located on the side of the second bonding electrode away from the display area. The electrostatic ring includes a first electrode line and a second electrode line. The first electrode line is of the same layer and the same material as the second bonding electrode. The second electrode line is located on the side of the first electrode line close to the substrate. The second electrode line is electrically connected to the first electrode line, and the second electrode line is grounded.

14. The display substrate according to claim 13, wherein, Along the arrangement direction of the display area and the bonding area, the distance between the third bonding electrode and the display area is ≥ 2 mm; The distance between the side boundary of the third bonding electrode close to the display area and the side boundary of the first bonding electrode far from the display area is ≥ 2 mm; The distance between the side boundary of the second bonding electrode close to the display area and the side boundary of the second bonding electrode far from the display area is ≥ 100 μm; The distance between the side boundary of the second bonding electrode far from the display area and the side boundary of the static electricity ring far from the display area is ≥ 40 μm.

15. A display panel, wherein, Comprising the display substrate according to any one of claims 1-14.

16. The display panel according to claim 15, wherein, Further comprising a third insulating layer, a pixel defining layer and a packaging layer, The third insulating layer, the pixel defining layer and the packaging layer respectively extend from the display area to the bonding area, and the third insulating layer, the pixel defining layer and the packaging layer are sequentially stacked on the side of the first bonding electrode in the display substrate facing away from the substrate; The third insulating layer, the pixel defining layer and the packaging layer are provided with second openings in the areas corresponding to the first bonding electrode and the third bonding electrode, and the first bonding electrode and the third bonding electrode are exposed at the second openings; The third insulating layer, the pixel defining layer and the packaging layer are provided with third openings in the area corresponding to the second bonding electrode, and the third openings overlap with the positive projection of the first opening in the display substrate on the substrate, and the second bonding electrode is exposed in the overlapping area of the positive projections of the third opening and the first opening.

17. The display panel according to claim 16, wherein, Along the arrangement direction of the display area and the bonding area, the opening width of the second opening is the distance between the side boundary of the third bonding electrode close to the display area and the side boundary of the first bonding electrode far from the display area.

18. The display panel according to claim 17, wherein, Further comprising a display driving circuit, The display driving circuit is located on the side of the packaging layer far from the display substrate, and the display driving circuit is located at the second opening, The input electrode of the display driving circuit is bound and electrically connected to the first bonding electrode through an anisotropic conductive adhesive; the output electrode of the display driving circuit is bound and electrically connected to the third bonding electrode through the anisotropic conductive adhesive.

19. The display panel according to claim 18, wherein, Further comprising a peripheral circuit board, located outside the display substrate, One end of the bonding connection wire is welded to the second bonding electrode at the overlapping position of the positive projections of the third opening and the first opening, and the other end of the bonding connection wire is welded to the bonding electrode of the peripheral circuit board.

20. The display panel according to claim 19, wherein, The number of the bonding connection wires is multiple, Each of the bonding connection wires is correspondingly electrically connected to one of the second bonding electrodes and one of the bonding electrodes of the peripheral circuit board; The periphery of the multiple bonding connection wires is wrapped with a protective adhesive, and the protective adhesive can insulate the adjacent bonding connection wires from each other.

21. The display panel according to claim 20, wherein, The material of the bonding connection wire includes aluminum.

22. A method for manufacturing a display panel according to any one of claims 15-21, wherein, Comprising: Preparing a display substrate; A third insulating layer, a pixel defining layer, and a packaging layer are sequentially formed on one side of the display substrate, and a second opening is formed in the third insulating layer, the pixel defining layer, and the packaging layer through a single etching process, and a first bonding electrode and a third bonding electrode in the display substrate are exposed at the second opening; Then, a third opening in the third insulating layer, the pixel defining layer, and the packaging layer and a first opening in a first insulating layer of the display substrate are formed through a single etching process, and a second bonding electrode in the display substrate is exposed at an overlapping region of the positive projections of the third opening and the first opening; An input electrode of the display driving circuit is bonded and electrically connected to the first bonding electrode by hot pressing an anisotropic conductive adhesive. At the same time, an output electrode of the display driving circuit is bonded and electrically connected to the third bonding electrode by hot pressing the anisotropic conductive adhesive; The other end of a bonding connection wire, one end of which is welded and connected to a bonding electrode of an external circuit board, is connected to the second bonding electrode by hot pressing and welding.

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