Manifold

Abstract

The invention relates to a manifold. The manifold is provided with: a flow path housing in which a first flow path through which a cooling fluid at a first temperature flows and a second flow path through which a cooling fluid at a second temperature that is lower than the first temperature flows are formed; and a plate member to which the flow path housing is joined, the flow path housing including a first housing in which the first flow path is formed, and a second housing in which the second flow path is formed, the first housing and the second housing being separated and joined to the plate portion.

Description

Technical Field

[0001] The present invention relates to a manifold. Background Art

[0002] There are known systems related to the thermal management of an air conditioning system or the like of a vehicle (for example, refer to Patent Document 1). Patent Document 1 discloses a thermal management system including a compressor that compresses low-temperature refrigerant vapor in a subsystem into high-temperature refrigerant vapor.

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2011-255879

[0004] In the thermal management system disclosed in Patent Document 1, for example, if a high-temperature flow path through which high-temperature refrigerant vapor compressed by the compressor flows and a low-temperature flow path through which low-temperature refrigerant vapor flows are arranged close to each other, heat exchange may occur between the high-temperature refrigerant and the low-temperature refrigerant. Summary of the Invention

[0005] The present invention has been made in view of the above problems, and an object thereof is to provide a manifold that suppresses heat exchange between cooling fluids at different temperatures.

[0006] The manifold of the present invention is characterized in the following aspects, that is, it includes: a flow path housing including a first housing in which a first flow path through which a cooling fluid at a first temperature flows is formed, and a second housing in which a second flow path through which the cooling fluid at a second temperature lower than the first temperature flows is formed; and a plate member that joins the flow path housing, and the first housing and the second housing are separated and joined to the plate member.

[0007] According to this structure, the first housing and the second housing of the flow path housing are separated and joined to the plate member. A first flow path through which a cooling fluid at a first temperature flows is formed in the first housing, and a second flow path through which a cooling fluid at a second temperature lower than the first temperature flows is formed in the second housing. That is, the first housing and the second housing are not integrated, and the first housing and the second housing are separated, so there is air with a low heat conductivity between the first housing and the second housing. Therefore, heat exchange between cooling fluids at different temperatures can be suppressed. Brief Description of the Drawings

[0008] Figure 1 It is a diagram showing a refrigerant circuit of an embodiment.

[0009] Figure 2 It is a schematic diagram showing a flow path housing and a plate member of an embodiment.

[0010] Figure 3 It is a diagram showing the structure of a flow path housing of an embodiment.

[0011] Figure 4It represents Figure 3 An enlarged view of the first housing shown.

[0012] Figure 5 It represents Figure 3 An enlarged view of the second housing shown. Detailed implementation mode

[0013] Hereinafter, the manifold of the implementation mode of the present invention will be described with reference to the drawings. However, it is not limited to the following implementation modes, and various modifications can be made without departing from the gist thereof.

[0014] 〔Refrigerant circuit〕

[0015] First, with reference to Figure 1 The refrigerant circuit C mounted on a vehicle such as an electric vehicle, a hybrid vehicle, or a fuel cell vehicle will be described. The refrigerant circuit C is composed of a refrigerant flow path L through which the refrigerant F1 for refrigeration and heating that adjusts the temperature inside the vehicle flows. The refrigerant F1 is, for example, a hydrofluorocarbon (HFC), a hydrofluoroolefin (HFO), or the like. In addition, the refrigerant flow path L is composed of a manifold 100 mounted on the vehicle (refer to Figure 2 and Figure 3 ).

[0016] As Figure 1 shown, the refrigerant circuit C includes a compressor 1 (an example of a compressor), a cockpit condenser 2 (a condenser for heating), a water-cooled condenser 3 (an example of a condenser), an evaporator 4 (an example of an evaporator), a battery cooler 5 (an example of an evaporator), a accumulator 6, and a valve V. The compressor 1, the cockpit condenser 2, the water-cooled condenser 3, the evaporator 4, the battery cooler 5, the accumulator 6, and the valve V are connected via the refrigerant flow path L.

[0017] The valve V includes an on-off valve V1 provided between the water-cooled condenser 3 and the accumulator 6. In addition, the valve V also includes a first expansion valve VE1 provided between the cockpit condenser 2 and the water-cooled condenser 3 and a second expansion valve VE2 provided between the water-cooled condenser 3 and the evaporator 4.

[0018] The on-off valve V1 controls (flows or cuts off) the flow of the refrigerant F1 between the water-cooled condenser 3 and the accumulator 6. If the on-off valve V1 is set to the open state, the refrigerant F1 flows in the order of the compressor 1, the cockpit condenser 2, the first expansion valve VE1, the water-cooled condenser 3, the on-off valve V1, the accumulator 6, and the compressor 1. Hereinafter, the refrigerant circuit C composed of the compressor 1, the cockpit condenser 2, the water-cooled condenser 3, the on-off valve V1, and the accumulator 6 will be referred to as the "main circuit Cm".

[0019] The first expansion valve VE1 and the second expansion valve VE2 expand the refrigerant F1 to adjust the pressure of the refrigerant F1. If the second expansion valve VE2 is set to the open state, the refrigerant F1 flows in the order of the second expansion valve VE2 and the evaporator 4, and then flows into the main circuit Cm between the on-off valve V1 and the accumulator 6. Hereinafter, the refrigerant circuit C that branches from the main circuit Cm and is provided with the second expansion valve VE2 and the evaporator 4 is referred to as the "first branch circuit Cb1". For example, when raising the temperature in the vehicle cabin (during heating operation of the vehicle cabin), the on-off valve V1 is set to the open state and the second expansion valve VE2 is set to the closed state. On the other hand, when lowering the temperature in the vehicle cabin (during cooling operation of the vehicle cabin), the on-off valve V1 is set to the closed state and the second expansion valve VE2 is set to the open state.

[0020] The battery cooler 5 includes an expansion valve. The expansion valve of the battery cooler 5 is set to the open state when adjusting the temperature of the battery. If the expansion valve of the battery cooler 5 is set to the open state, the refrigerant F1 flows through the battery cooler 5 and then flows into the main circuit Cm between the on-off valve V1 and the accumulator 6. Hereinafter, the refrigerant circuit C that branches from the main circuit Cm and is provided with the battery cooler 5 is referred to as the "second branch circuit Cb2".

[0021] The compressor 1 compresses the refrigerant F1 to make the refrigerant F1 a high-pressure gas. Hereinafter, the temperature of the refrigerant F1 compressed by the compressor 1 is referred to as the first refrigerant temperature (an example of the first temperature). In addition, the first refrigerant temperature is, for example, 80 degrees to 90 degrees.

[0022] The refrigerant F1 compressed by the compressor 1 is delivered to the cockpit condenser 2, exchanges heat with the air in the vehicle cabin during heating operation (takes away heat and cools down), and is then delivered to the water-cooled condenser 3 via the first expansion valve VE1. The first refrigerant F2 circulating in a circuit different from the refrigerant circuit C (for example, a cooling circuit for cooling electronic circuits mounted on the vehicle, etc.) flows through the water-cooled condenser 3. The first refrigerant F2 is a coolant such as long-life coolant (LLC), an insulating oil such as paraffin, a refrigerant such as hydrofluorocarbon (HFC), or hydrofluoroolefin (HFO). The refrigerant F1 delivered to the water-cooled condenser 3 exchanges heat with the first refrigerant F2 flowing through the water-cooled condenser 3 (takes away heat and cools down). Hereinafter, the temperature of the refrigerant F1 cooled by the water-cooled condenser 3 is referred to as the second refrigerant temperature (an example of the second temperature). In addition, the second refrigerant temperature is, for example, 60 degrees to 85 degrees, and the refrigerant F1 cooled by the water-cooled condenser 3 is a high-pressure liquid.

[0023] The refrigerant F1 delivered to the second expansion valve VE2 is expanded into a state of a mixture of liquid and gas (misty state) and is delivered to the evaporator 4. Hereinafter, the temperature of the refrigerant F1 expanded by the second expansion valve VE2 is referred to as the third refrigerant temperature (an example of the second temperature). The third refrigerant temperature is, for example, 15 degrees to 25 degrees. In the evaporator 4, the refrigerant F1 exchanges heat with the air introduced from the outside (takes heat and warms up) and vaporizes.

[0024] In addition, the refrigerant F1 delivered to the battery cooler 5 is expanded by the expansion valve of the battery cooler 5. The second refrigerant F3 circulating in a circuit different from the refrigerant circuit C (for example, a cooling circuit for cooling a battery mounted on a vehicle) flows into the battery cooler 5. The second refrigerant F3 is a coolant such as long-life coolant (LLC), an insulating oil such as paraffin, a refrigerant such as hydrofluorocarbon (HFC), or hydrofluoroolefin (HFO). The refrigerant F1 delivered to the battery cooler 5 exchanges heat with the second refrigerant F3 flowing in the battery cooler 5 (takes heat and warms up) and vaporizes. Hereinafter, the temperature of the refrigerant F1 after heat exchange by the evaporator 4 or the battery cooler 5 is referred to as the fourth refrigerant temperature (an example of the third temperature). In addition, the fourth refrigerant temperature is, for example, 15 degrees to 25 degrees.

[0025] The refrigerant F1 after heat exchange in the evaporator 4 is delivered to the accumulator 6, and the liquid contained in the refrigerant F1 is separated. The refrigerant F1 after the liquid is separated returns to the compressor 1. In addition, the refrigerant F1 after heat exchange in the battery cooler 5 is not delivered to the accumulator 6, and the liquid contained in the refrigerant F1 is separated. The refrigerant F1 after the liquid is separated returns to the compressor 1.

[0026] As described above, in the refrigerant circuit C, the temperature of the refrigerant F1 flowing in the refrigerant flow path L changes. Specifically, for the temperature of the refrigerant F1, the temperature of the refrigerant F1 from the compressor 1 toward the water-cooled condenser 3 (the first refrigerant temperature) is the highest, the temperature of the refrigerant F1 from the water-cooled condenser 3 toward the second expansion valve VE2 and / or the battery cooler 5 (the second refrigerant temperature) is the second highest, and the temperature of the refrigerant F1 from the second expansion valve VE2 toward the evaporator 4 (the third refrigerant temperature) and the temperature of the refrigerant F1 from the evaporator 4 and / or the battery cooler 5 toward the accumulator 6 (the fourth refrigerant temperature) are the lowest. Therefore, hereinafter, the first refrigerant temperature is referred to as "high temperature", the second refrigerant temperature is referred to as "medium temperature", and the third refrigerant temperature and the fourth refrigerant temperature are referred to as "low temperature".

[0027] 〔Structure of the manifold〕

[0028] Next, with reference to Figure 2 and Figure 3 With reference toFigure 1 The structure of the manifold 100 that forms the refrigerant flow path L described above will be described. Figure 2 And Figure 3 is a diagram showing the structure of the manifold 100. In addition, Figure 3 is a diagram showing the flow path housing 10 as viewed from the side opposite to the plate member 20, showing a cross-section of the wall removed from the side of the flow path housing 10 opposite to the plate member 20.

[0029] As Figure 2 And Figure 3 shown, the manifold 100 includes a flow path housing 10 and a plate member 20. In the present embodiment, the plate member 20 is rectangular in plan view (refer to Figure 3 ), and each of the flow path housing 10 and the plate member 20 is made of a metal (including alloys) containing aluminum as a material.

[0030] 〔Structure of the flow path housing〕

[0031] The flow path housing 10 is separated into two. Hereinafter, one of the two flow path housings 10 will be referred to as the "first housing 11", and the other will be referred to as the "second housing 12". The first housing 11 and the second housing 12 are separated and joined to the plate member 20. Each of the first housing 11 and the second housing 12 is joined to the plate member 20 by, for example, bolts.

[0032] By joining the flow path housing 10 to the plate member 20, the refrigerant flow path L described above with reference to Figure 1 is formed between the flow path housing 10 and the plate member 20 (refer to Figure 3 ). In addition, near the water-cooled condenser 3, a part of the heat medium flow path R is also formed in the flow path housing 10. The first heat medium F2 (refer to Figure 1 ) that exchanges heat with the refrigerant F1 in the water-cooled condenser 3 flows in the heat medium flow path R.

[0033] 〔Structure of the refrigerant flow path〕

[0034] As Figure 3As shown, the refrigerant flow path L includes a high-temperature flow path LH (an example of a first flow path) through which refrigerant F1 at a first refrigerant temperature (high temperature) flows from the compressor 1 toward the water-cooled condenser 3; a medium-temperature flow path LM (an example of a second flow path) through which refrigerant F1 at a second refrigerant temperature (medium temperature) flows from the water-cooled condenser 3 toward the second expansion valve VE2 and / or the battery cooler 5; and a low-temperature flow path LL through which refrigerant F1 at a third refrigerant temperature (low temperature) flows from the second expansion valve VE2 toward the evaporator 4 and refrigerant F1 at a fourth refrigerant temperature (low temperature) flows from the evaporator 4 and / or the battery cooler 5 toward the accumulator 6. Further, the low-temperature flow path LL includes a first low-temperature flow path LL1 (an example of a second flow path) through which refrigerant F1 flows from the second expansion valve VE2 toward the evaporator 4; and a second low-temperature flow path LL2 (an example of a third flow path) through which refrigerant F1 flows from the evaporator 4 and / or the battery cooler 5 toward the accumulator 6.

[0035] The compressor 1, the cockpit condenser 2, the water-cooled condenser 3, the evaporator 4, the battery cooler 5, the accumulator 6, and the valves V (the on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2) are provided outside the flow path housing 10. Accordingly, inlet / outlet ports are formed in the flow path housing 10 through which refrigerant F1 flows between each of the compressor 1, the cockpit condenser 2, the water-cooled condenser 3, the evaporator 4, the battery cooler 5, the accumulator 6, and the valves V. Hereinafter, the inlet ports through which refrigerant F1 from each of the compressor 1, the cockpit condenser 2, the water-cooled condenser 3, the evaporator 4, and the battery cooler 5 flows into the flow path housing 10 are respectively referred to as a "first inlet port Pa1", a "second inlet port Pa2", a "third inlet port Pa3", a "fourth inlet port Pa4", and a "fifth inlet port Pa5", and the outlet ports through which refrigerant F1 flows out of the flow path housing 10 toward each of the cockpit condenser 2, the water-cooled condenser 3, the evaporator 4, the battery cooler 5, and the accumulator 6 are respectively referred to as a "first outlet port Pb1", a "second outlet port Pb2", a "third outlet port Pb3", a "fourth outlet port Pb4", and a "fifth outlet port Pb5".

[0036] In addition, the inlet ports through which refrigerant F1 from each of the on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2 flows into the flow path housing 10 are respectively referred to as a "sixth inlet port Pa6", a "seventh inlet port Pa7", and an "eighth inlet port Pa8", and the outlet ports through which refrigerant F1 flows out of the flow path housing 10 toward each of the on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2 are respectively referred to as a "sixth outlet port Pb6", a "seventh outlet port Pb7", and an "eighth outlet port Pb8".

[0037] In addition, a refrigerant flow path L through which the refrigerant F1 flows from the accumulator 6 toward the compressor 1 is provided outside the flow path housing 10. Therefore, an inlet through which the refrigerant F1 flows from the accumulator 6 into the flow path housing 10 and an outlet through which the refrigerant F1 flows out from the flow path housing 10 to the compressor 1 are not formed in the flow path housing 10.

[0038] Hereinafter, for the sake of convenience of explanation, when viewed from the center O of the plate member 20, the direction toward the first inlet Pa1 is defined as the "X1 direction", the opposite direction thereof is defined as the "X2 direction", and the directions along the X1 direction and the X2 direction are defined as the "X direction". In addition, when viewed from the center O of the plate member 20, the direction toward the fourth outlet Pb4 is defined as the "Y1 direction", the opposite direction thereof is defined as the "Y2 direction", and the directions along the Y1 direction and the Y2 direction are defined as the "Y direction". Further, the X direction and the Y direction are orthogonal. In addition, the center O of the plate member 20 is the intersection of the diagonals of the plate member 20.

[0039] 〔Structure of the first housing〕

[0040] Next, with reference to Figure 4 the structure of the first housing 11 will be described. Figure 4 is Figure 3 an enlarged view of the first housing 11 shown.

[0041] 〔Flow path of the first housing〕

[0042] As Figure 4 shown, a high-temperature flow path LH and a second low-temperature flow path LL2 are provided (formed) in the first housing 11. The high-temperature flow path LH includes a first high-temperature flow path LH1 through which the refrigerant F1 flows from the compressor 1 toward the cockpit condenser 2, and a second high-temperature flow path LH2 through which the refrigerant F1 flows from the cockpit condenser 2 via the first expansion valve VE1 toward the water-cooled condenser 3.

[0043] The first high-temperature flow path LH1 has the first inlet Pa1 provided at the end in the X1 direction of the first housing 11 as the base end, and extends in an L shape to the first outlet Pb1 provided at the end in the Y1 direction of the first housing 11.

[0044] The second high-temperature flow path LH2 has the second flow inlet Pa2 at the end in the Y1 direction of the first housing 11 as the base end, and extends to the second flow outlet Pb2 at the end in the X2 direction. Specifically, the second high-temperature flow path LH2 includes: a first high-temperature extension LHa having the second flow inlet Pa2 as the base end and extending along the Y direction to the seventh flow outlet Pb7; a second high-temperature extension LHb having the seventh flow inlet Pa7 as the base end and bending in a manner that bulges in the Y1 direction and the X2 direction; and a third high-temperature extension LHc having the terminal of the second high-temperature extension LHb as the base end and extending along the X direction to the second flow outlet Pb2. In addition, the first high-temperature extension LHa extends to a position in the Y2 direction when observed from the second low-temperature flow path LL2. That is, the second high-temperature extension LHb and the third high-temperature extension LHc are located in the Y2 direction when observed from the second low-temperature flow path LL2.

[0045] The second low-temperature flow path LL2 has the fourth flow inlet Pa4 at the ends in the X2 direction and the Y1 direction of the first housing 11 as the base end, and extends in a T shape to the fifth flow outlet Pb5 and the sixth flow inlet Pa6. In addition, the fifth flow inlet Pa5 and the fifth flow outlet Pb5 are provided at the end in the Y1 direction of the first housing 11. The fourth flow inlet Pa4, the fifth flow inlet Pa5, and the fifth flow outlet Pb5 are arranged in this order along the X1 direction. The second low-temperature flow path LL2 includes a first low-temperature extension LL2a extending along the X direction, and a second low-temperature extension LL2b extending along the Y direction in a manner orthogonal to the first low-temperature extension LL2a. The second low-temperature extension LL2b has the sixth flow inlet Pa6 as one end and the fifth flow inlet Pa5 as the other end.

[0046] 〔Narrow slit of the first housing〕

[0047] The first housing 11 includes a first narrow slit S1 formed between the high-temperature flow path LH and the second low-temperature flow path LL2. The first narrow slit S1 extends from between the high-temperature flow path LH (the first high-temperature extension LHa) and the second low-temperature flow path LL2 (the second low-temperature extension LL2b) at one end in the Y1 direction of the first housing 11 along the second high-temperature flow path LH2 (the first high-temperature extension LHa and the second high-temperature extension LHb) to a position beyond the sixth flow inlet Pa6. By forming the first narrow slit S1 in the first housing 11, air with a lower thermal conductivity than the material of the flow path housing 10 exists between the high-temperature flow path LH and the second low-temperature flow path LL2, and heat exchange between the refrigerant F1 flowing in the high-temperature flow path LH and the refrigerant F1 flowing in the second low-temperature flow path LL2 is suppressed.

[0048] In addition, the first outer casing 11 further includes a second narrow slit S2 formed between the second low-temperature flow path LL2 and the refrigerant flow path R through which the first refrigerant F2 flows. The second narrow slit S2 extends from between the refrigerant flow path R and the first low-temperature extension LL2a at one end of the first outer casing 11 in the X2 direction toward the X1 direction along the first low-temperature extension LL2a to the vicinity of the sixth flow inlet Pa6. By forming the second narrow slit S2, air exists between the second low-temperature flow path LL2 and the refrigerant flow path R, and heat exchange between the refrigerant F1 flowing in the second low-temperature flow path LL2 and the first refrigerant F2 flowing in the refrigerant flow path R is suppressed. In addition, when viewed from the third high-temperature extension LHc, the refrigerant flow path R is located in the Y1 direction.

[0049] 〔Structure of the second outer casing〕

[0050] Next, Figure 5 the structure of the second outer casing 12 will be described with reference to Figure 5 is Figure 3 an enlarged view of the second outer casing 12 shown in

[0051] 〔Flow paths of the second outer casing〕

[0052] As Figure 5 shown, a medium-temperature flow path LM and a first low-temperature flow path LL1 are provided in the second outer casing 12. The medium-temperature flow path LM has the third flow inlet Pa3 provided at the ends of the second outer casing 12 in the X1 direction and the Y2 direction as its base end, and extends via the sixth flow outlet Pb6 to the fourth flow outlet Pb4 provided at the eighth flow outlet Pb8 and the end of the second outer casing 12 in the Y1 direction. The medium-temperature flow path LM includes a first medium-temperature extension LMa having the third flow inlet Pa3 as its base end and extending along the Y direction to the fourth flow outlet Pb4; and a second medium-temperature extension LMb branching from the first medium-temperature extension LMa at the sixth flow outlet Pb6 and extending along the X direction to the eighth flow outlet Pb8.

[0053] The first low-temperature flow path LL1 has the eighth flow inlet Pa8 as its base end and extends along the Y direction to the third flow outlet Pb3 provided at the end of the second outer casing 12 in the Y1 direction. In addition, when viewed from the fourth flow outlet Pb4, the third flow outlet Pb3 is located in the X2 direction.

[0054] 〔Narrow slits of the second outer casing〕

[0055] The second housing 12 includes a third narrow slit S3 formed between the medium-temperature flow path LM and the first low-temperature flow path LL1. The third narrow slit S3 extends along the first low-temperature flow path LL1 from between the medium-temperature flow path LM (the first medium-temperature extension LMa) and the first low-temperature flow path LL1 at one end of the second housing 12 in the Y1 direction to near the eighth flow outlet Pb8. By providing the third narrow slit S3, air exists between the first low-temperature flow path LL1 and the medium-temperature flow path LM, and heat exchange between the refrigerant F1 flowing in the first low-temperature flow path LL1 and the refrigerant F1 flowing in the medium-temperature flow path LM is suppressed.

[0056] In addition, the second housing 12 further includes a fourth narrow slit S4 formed between the first low-temperature flow path LL1, the medium-temperature flow path LM, and the heat carrier flow path R. The fourth narrow slit S4 extends from between the first low-temperature flow path LL1 (the second expansion valve VE2) and the heat carrier flow path R at one end of the second housing 12 in the X2 direction toward the X1 direction, and extends in a manner bent toward the Y2 direction at a position beyond the ninth flow outlet Pb9. By providing the fourth narrow slit S4, air exists between the first low-temperature flow path LL1, the medium-temperature flow path LM, and the heat carrier flow path R, and heat exchange between the refrigerant F1 flowing in the first low-temperature flow path LL1 and the medium-temperature flow path LM and the first heat carrier F2 flowing in the heat carrier flow path R is suppressed. In addition, the heat carrier flow path R is located in the Y2 direction when viewed from the first low-temperature flow path LL1, and is located in the X2 direction when viewed from the medium-temperature flow path LM.

[0057] 〔Structure of the plate〕

[0058] Next, return Figure 2 , and the structure of the plate member 20 will be described. As Figure 2 shown, the plate member 20 has a flat opposing surface 21 (main surface) opposing the flow path housing 10, a groove portion 22 recessed in a direction farther from the flow path housing 10 than the opposing surface 21, and a heat insulating material 23 disposed in the groove portion 22. The groove portion 22 is formed, for example, by cutting the plate member 20. In the present embodiment, the groove portion 22 does not penetrate the plate member 20, and each of the above-described first narrow slit S1 to fourth narrow slit S4 penetrates the plate member 20. However, the groove portion 22 may also penetrate the plate member 20.

[0059] The opposing surface 21 of the plate member 20 includes a portion where the first housing 11 and the second housing 12 are separated in the X direction, that is, a non-opposing region 21R that does not oppose either the first housing 11 or the second housing 12. The groove portion 22 is provided in the non-opposing region 21R. As described above, the heat insulating material 23 is disposed in the groove portion 22. Thereby, heat conduction through the plate member 20 is suppressed. In addition, the heat insulating material 23 is made of a resin or the like having a lower thermal conductivity than the plate member 20.

[0060] 〔Function and effect of the embodiment〕

[0061] As described above, according to this embodiment, the first housing 11 that forms the high-temperature flow path LH through which the high-temperature refrigerant F1 flows and the second housing 12 that forms the medium-temperature flow path LM through which the medium-temperature refrigerant F1 lower than the high-temperature refrigerant F1 flows are separated (detached) and joined to the plate member 20. That is, the first housing 11 and the second housing 12 are not integrated, and the first housing 11 and the second housing 12 are separated, so there is air with a low thermal conductivity between the first housing 11 and the second housing 12. Therefore, heat exchange between refrigerants F1 at different temperatures can be suppressed.

[0062] In addition, according to this embodiment, the refrigerant F1 flowing from the compressor 1 toward the water-cooled condenser 3 flows in the high-temperature flow path LH, and the refrigerant F1 flowing from the water-cooled condenser 3 toward the evaporator 4 and / or the battery cooler 5 and having a lower temperature than the high-temperature flow path LH flows in the medium-temperature flow path LM. Therefore, heat exchange between the refrigerant F1 flowing from the compressor 1 toward the water-cooled condenser 3 and the refrigerant F1 flowing from the water-cooled condenser 3 toward the evaporator 4 and / or the battery cooler 5 can be suppressed.

[0063] In addition, according to this embodiment, in the first housing 11, a first narrow slit S1 is formed between the high-temperature flow path LH and the second low-temperature flow path LL2 through which the refrigerant F1 at a temperature (fourth refrigerant temperature) lower than the temperature (first refrigerant temperature) of the refrigerant F1 flowing in the high-temperature flow path LH flows, so that heat exchange between different refrigerants F1 can be suppressed. In addition, for example, even when it is impossible to separate the first housing 11 in order to ensure strength for holding the water-cooled condenser 3, by providing the first narrow slit S1, heat exchange between refrigerants F1 at different temperatures can also be suppressed. In addition, it is not necessary to further divide the first housing 11, and an increase in the number of components can be avoided.

[0064] In addition, according to this embodiment, in the plate member 20, a groove portion 22 is formed between the first housing 11 and the second housing 12, and a heat insulating material 23 is disposed in the groove portion 22. Therefore, heat conduction along between the first housing 11 and the second housing 12 can be suppressed by the plate member 20.

[0065] 〔Other Embodiments〕

[0066] In addition to the above-described embodiment, the present invention can also be configured as follows (the same numbers and reference numerals as those in the embodiment are assigned to components having the same functions as those in the embodiment).

[0067] (1) The shape and position of the refrigerant flow path L (high-temperature flow path LH, medium-temperature flow path LM, and low-temperature flow path LL) described in the above embodiment are examples, and the refrigerant flow path L is not limited to the shape and position described in the above embodiment.

[0068] (2) Additionally, the narrow slits (the first narrow slit S1 and the second narrow slit S2) provided in the first housing 11 are not limited to the number, position, and shape described in the embodiment, and can be appropriately changed according to the position and shape of the refrigerant flow path L in such a way as to suppress heat exchange between refrigerants F1 at different temperatures flowing in the refrigerant flow path L. The same applies to the narrow slits (the third narrow slit S3 and the fourth narrow slit S4) provided in the second housing 12.

[0069] (3) Additionally, in the present embodiment, although the case where the plate member 20 has the groove portion 22 and the heat insulating material 23 disposed in the groove portion 22 has been described, the groove portion 22 and the heat insulating material 23 can also be omitted from the plate member 20. In this case, it is preferable to select a material with a low thermal conductivity as the material of the plate member 20.

[0070] (4) In the present embodiment, although the structure in which the refrigerant circuit C (the second branch circuit Cb2) includes the battery cooler 5 has been described as an example, the refrigerant circuit C may include a cooler instead of the battery cooler 5. Further, when the refrigerant circuit C includes a cooler instead of the battery cooler 5, the refrigerant circuit C further includes an expansion valve as the valve V between the water-cooled condenser 3 and the cooler.

[0071] (5) In the present embodiment, although the refrigerant F1 has been described as an example of the cooling fluid, the present invention may also be a fluid other than the refrigerant F1, such as cooling water such as long-life coolant (LLC), insulating oil such as paraffin series, etc.

[0072] (6) In the present embodiment, although the case where the plate member 20 is rectangular has been described, the shape of the plate member 20 is not limited to rectangular and can be appropriately changed. Additionally, the materials of the flow path housing 10 and the plate member 20 are not limited to metals containing aluminum, and can also be metals other than aluminum, resins, etc.

[0073] In the above embodiment, the following structure can be conceived.

[0074] (1) The manifold 100 of the present invention is characterized in the following aspects, that is, it includes: a flow path housing 10, which includes a first housing 11 in which a high-temperature flow path LH (first flow path) through which a refrigerant F1 (cooling fluid) at a first temperature flows is formed, and a second housing 12 in which a medium-temperature flow path LM (second flow path) through which a refrigerant F1 (cooling fluid) at a second temperature lower than the first temperature flows is formed; and a plate member 20, which is joined to the flow path housing 10, and the first housing 11 and the second housing 12 are separated and joined to the plate member 20.

[0075] According to this structure, the first housing 11 and the second housing 12 of the flow path housing 10 are separated and joined to the plate member 20. A high-temperature flow path LH (first flow path) through which the refrigerant F1 (cooling fluid) at the first temperature flows is formed in the first housing 11, and a medium-temperature flow path LM (second flow path) through which the refrigerant F1 (cooling fluid) at a second temperature lower than the first temperature flows is formed in the second housing 12. That is, the first housing 11 and the second housing 12 are not integral, and the first housing 11 and the second housing 12 are separated, so there is air with a low thermal conductivity between the first housing 11 and the second housing 12. Therefore, heat exchange between the refrigerants F1 (cooling fluids) at different temperatures can be suppressed.

[0076] (2) In the manifold 100 of (1), the refrigerant F1 (cooling fluid) from the compressor 1 (compressor) toward the water-cooled condenser 3 (condenser) may also flow in the high-temperature flow path LH (first flow path), and the refrigerant F1 (cooling fluid) from the water-cooled condenser 3 (condenser) toward the evaporator 4 and / or the battery cooler 5 (evaporator) may also flow in the medium-temperature flow path LM (second flow path).

[0077] According to this structure, heat exchange between the relatively high-temperature refrigerant F1 (cooling fluid) from the compressor 1 (compressor) toward the water-cooled condenser 3 (condenser) and the relatively low-temperature refrigerant F1 (cooling fluid) from the water-cooled condenser 3 (condenser) toward the evaporator 4 and / or the battery cooler 5 (evaporator) can be suppressed.

[0078] (3) In the manifold 100 of (1) or (2), a second low-temperature flow path LL2 (third flow path) through which the refrigerant F1 (cooling fluid) at a third temperature lower than the first temperature flows may also be formed in the first housing 11, and a narrow slit is formed between the high-temperature flow path LH (first flow path) and the second low-temperature flow path LL2 (third flow path).

[0079] According to this structure, in the first housing 11, a narrow slit is formed between the high-temperature flow path LH (first flow path) through which the refrigerant F1 (cooling fluid) at the first temperature flows and the second low-temperature flow path LL2 (third flow path) through which the refrigerant F1 (cooling fluid) at a third temperature lower than the first temperature flows, so heat exchange between the refrigerants F1 (cooling fluids) at different temperatures can be suppressed. In addition, it is not necessary to further divide the first housing 11, and an increase in the number of components can be avoided.

[0080] (4) In any one of the manifolds 100 in (1) to (3), the plate member 20 may also have a groove portion 22 formed between the first housing 11 and the second housing 12.

[0081] According to this structure, the plate member 20 forms a groove portion 22 between the first housing 11 and the second housing 12. Therefore, heat conduction between the first housing 11 and the second housing 12 can be suppressed by the plate member 20.

[0082] (5) In the manifold 100 of (4), the plate member 20 may also have a heat insulating material 23 disposed in the groove portion 22.

[0083] According to this structure, the plate member 20 also has a heat insulating material 23 disposed in the groove portion 22 formed between the first housing 11 and the second housing 12. Therefore, heat conduction between the first housing 11 and the second housing 12 can be suppressed by the plate member 20.

[0084] Industrial applicability

[0085] The present invention can be used for a manifold.

[0086] Explanation of reference numerals

[0087] 1: Compressor, 3: Water-cooled condenser, 4: Evaporator, 5: Battery cooler (Evaporator), 10: Flow path housing, 11: First housing, 12: Second housing, 20: Plate member, 22: Groove portion, 23: Heat insulating material, 100: Manifold, F1: Refrigerant (Cooling fluid), L: Refrigerant flow path, LH: High-temperature flow path (First flow path), LL2: Second low-temperature flow path (Third flow path), LM: Medium-temperature flow path (Second flow path), S1: First narrow slit.

Claims

1. A manifold, comprising: A flow path housing including a first housing having a first flow path for a cooling fluid at a first temperature flowing therethrough, and a second housing having a second flow path for the cooling fluid at a second temperature lower than the first temperature flowing therethrough; and A plate member joined to the flow path housing, The first housing and the second housing are separated and joined to the plate member.

2. The manifold according to claim 1, wherein The cooling fluid flows from a compressor toward a condenser in the first flow path, The cooling fluid flows from the condenser toward an evaporator in the second flow path.

3. The manifold according to claim 1 or 2, wherein A third flow path for the cooling fluid at a third temperature lower than the first temperature is formed in the first housing, and a narrow slit is formed between the first flow path and the third flow path.

4. The manifold according to claim 1 or 2, wherein The plate member has a groove formed between the first housing and the second housing.

5. The manifold according to claim 4, wherein The plate member further has a heat insulating material disposed in the groove.

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