Observation device, observation method, and method for manufacturing semiconductor device

Abstract

An observation device (100) according to an embodiment of the present disclosure comprises: a mechanism designed to suspend or support a substrate (16) such that a space is formed directly below the substrate; a transport mechanism designed to transport a substrate suspended or supported above the mechanism in a transport direction; a viewing unit (50) comprising a light detector (52) designed to detect light from the substrate (16) and an optical system (51) designed to guide light from the substrate (16) to the light detector (52); and a movement mechanism (55) designed to move the observation unit (50) in a direction inclined to the conveyance direction in plan view.

Description

Technical Field

[0001] The present invention relates to an observation device, an observation method, and a method of manufacturing a semiconductor device. Background Art

[0002] Patent Document 1 discloses a laser annealing apparatus using an excimer laser. In Patent Document 1, while a substrate is suspended by a suspension unit, a transport unit transports the substrate. Then, during the transport of the substrate, the substrate is irradiated with laser light such that an irradiated area thereof has a linear shape. Further, the laser irradiation device includes a line sensor provided on the substrate. During the transport of the substrate, the line sensor captures an image of the substrate.

[0003] Citation List

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication JP 2018-64048. Summary of the Invention

[0006] Technical Problem

[0007] In such a device, it is desirable to be able to observe the substrate well enough.

[0008] Based on the description and the drawings in the present specification, other problems and novel features will be apparent.

[0009] Solution to the Problem

[0010] According to an embodiment, an observation device includes: a mechanism configured to suspend or support a substrate such that a space is formed directly below the substrate; a transport mechanism configured to transport the substrate suspended or supported above the mechanism in a transport direction; an observation unit including a light detector configured to detect light from the substrate and an optical system configured to guide the light from the substrate to the light detector; and a moving mechanism configured to move the observation unit in a direction inclined with respect to the transport direction in a plan view to change an observation position on the substrate.

[0011] According to an embodiment, an observation method is an observation method performed on an observation device including: a mechanism configured to suspend or support a substrate such that a space is formed directly below the substrate; and an observation unit including a light detector configured to detect light from the substrate and an optical system configured to guide the light from the substrate to the light detector, the observation method including the steps of: (A1) transporting the substrate in the transport direction by the transport mechanism; (A2) observing the substrate transported by the transport mechanism by using the observation unit; and (A3) observing the substrate while changing the observation position on the substrate by moving the observation unit in a direction inclined with respect to the transport direction in a plan view.

[0012] According to an embodiment, a method for manufacturing a semiconductor device includes the following steps: (S1) suspending or supporting a substrate by using a mechanism such that a space is formed directly below the substrate; (S2) transporting the substrate suspended or supported above the mechanism in a transport direction by using a transport mechanism; (S3) observing the substrate by using an observation unit including a photodetector designed to detect light from the substrate and an optical system designed to guide the light from the substrate to the photodetector; and (S4) moving the observation unit in a direction inclined with respect to the transport direction during a top view observation by using a moving mechanism to change an observation position on the substrate.

[0013] Advantages of the present invention

[0014] According to the above embodiment, an observation device, an observation method, and a method for manufacturing a semiconductor device capable of observing a substrate sufficiently well can be provided, in which the substrate can be observed sufficiently well. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is an XY plan view schematically showing an observation device according to a first embodiment;

[0016] Figure 2 is an XZ plan view schematically showing an observation device according to a first embodiment;

[0017] Figure 3 is a YZ plan view schematically showing an observation device according to a first embodiment;

[0018] Figure 4 is an enlarged view showing the structure of an observation unit.

[0019] Figure 5 is an XY plan view schematically showing an observation device according to a second embodiment;

[0020] Figure 6 is an XZ plan view schematically showing an observation device according to a second embodiment;

[0021] Figure 7 is an XY plan view schematically showing an observation device according to a third embodiment;

[0022] Figure 8 is an XZ plan view schematically showing an observation device according to a third embodiment;

[0023] Figure 9 is an XY plan view schematically showing an observation device according to a fourth embodiment;

[0024] Figure 10 is an XZ plan view schematically showing an observation device according to a fourth embodiment;

[0025] Figure 11 is an enlarged XY plan view showing the structure of the observation unit and the adsorption unit;

[0026] Figure 12 is an enlarged XZ plan view showing the structure of the observation unit when the adsorption unit adsorbs the substrate;

[0027] Figure 13 is an enlarged XZ plan view showing the structure of the observation unit when the adsorption unit releases the adsorption fixation of the substrate;

[0028] Figure 14 is an XZ plan view schematically showing the observation device according to the fifth embodiment;

[0029] Figure 15 is an XY plan view schematically showing the structure of the precision suspension unit;

[0030] Figure 16 is an XZ plan view schematically showing the structure of the precision suspension unit;

[0031] Figure 17 is an XY plan view schematically showing the observation device according to the sixth embodiment;

[0032] Figure 18 is an XZ plan view schematically showing the observation device according to the sixth embodiment;

[0033] Figure 19 is an XY plan view schematically showing the observation device according to the seventh embodiment;

[0034] Figure 20 is an XZ plan view schematically showing the observation device according to the seventh embodiment;

[0035] Figure 21 is an XY plan view schematically showing the observation device according to the eighth embodiment;

[0036] Figure 22 is an XZ plan view schematically showing the observation device according to the eighth embodiment;

[0037] Figure 23 is a YZ plan view schematically showing the observation device according to the eighth embodiment;

[0038] Figure 24 is an XY plan view schematically showing the structure of the observation device according to the eighth embodiment when its moving direction is changed;

[0039] Figure 25is an XY plan view schematically showing an observation device according to a ninth embodiment;

[0040] Figure 26 is an XZ plan view schematically showing an observation device according to a ninth embodiment;

[0041] Figure 27 is a YZ plan view schematically showing an observation device according to a ninth embodiment;

[0042] Figure 28 is an XY plan view schematically showing an observation device according to a tenth embodiment;

[0043] Figure 29 is an XZ plan view schematically showing an observation device according to a tenth embodiment;

[0044] Figure 30 is a schematic view showing a configuration of a laser irradiation device including an observation device;

[0045] Figure 31 is a simplified cross-sectional view showing a configuration of an organic EL display;

[0046] Figure 32 is a cross-sectional view showing a process in a method for manufacturing a semiconductor device according to an embodiment of the present disclosure; and

[0047] Figure 33 is a cross-sectional view showing a process in a method for manufacturing a semiconductor device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0048] An observation device according to an embodiment of the present disclosure is an observation device that observes a substrate from the back surface side of the substrate. The substrate is, for example, a glass substrate for an organic EL (electroluminescence) display. Various patterns such as a metal wiring layer, a transparent electrode layer, a semiconductor layer, a light-emitting layer, and a color filter layer are formed on the glass substrate. That is, many layers having corresponding patterns are formed on the glass substrate.

[0049] Note that in the drawings described below, for simplicity of explanation, an XYZ three-dimensional orthogonal coordinate system is appropriately shown. The Z direction is the vertical up / down direction and is perpendicular to the main surface of the substrate. The XY plane is a plane parallel to the main surface of the substrate. The XY direction is parallel to the edge of the rectangular substrate. In addition, the X direction is the conveyance direction of the substrate. The Y direction is perpendicular to the X and Z directions.

[0050] First Embodiment

[0051] will be described with reference to Figures 1 to 3 the configuration of the observation device according to the first embodiment will be described. Figure 1is a plan view (XY plane view) schematically showing the structure of the observation device 100. Figure 2 is a side view (XZ plane view) schematically showing the structure of the laser irradiation device 1. Figure 3 is a side view (YZ plane view) schematically showing the structure of the laser irradiation device 1.

[0052] The observation device 100 includes a suspension unit 10, a transfer mechanism 11, and an observation unit 50. As Figure 2 shown, the suspension unit 10 is designed to eject gas from its surface. The suspension unit 10 suspends the substrate 16 above the upper surface of the suspension unit. The gas ejected from the surface of the suspension unit 10 is blown onto the lower surface of the substrate 16, causing the substrate 16 to be suspended. For example, when transferring the substrate 16, the suspension unit 10 adjusts the suspension height of the substrate 16 so that the substrate 16 does not collide with any other mechanism (not shown) provided above the substrate 16.

[0053] The suspension unit 10 ejects gas onto the substrate 16 so that the substrate 16 does not contact the suspension unit 10. Therefore, a space G is formed directly below the substrate 16. The space G is a minute air gap formed by the gas ejected from the suspension unit 10. That is, the space G is the gap between the upper surface of the suspension unit 10 and the lower surface of the substrate 16. Note that the gas ejected from the suspension unit 10 can be air, nitrogen, or dry gas.

[0054] The suspension unit 10 serves as a mechanism for suspending the substrate 16, thereby forming a space G directly below the substrate 16. The suspension unit 10 includes a plurality of suspension unit sub-regions 10a and 10b. The suspension unit sub-region 10b is provided on the +X side of the suspension unit sub-region 10a. A gap 17 is provided between the suspension unit sub-regions 10a and 10b. Each of the suspension unit sub-regions 10a and 10b ejects gas. The observation unit 50 is provided between the suspension unit sub-regions 10a and 10b. The observation unit 50 will be described later.

[0055] Each of the suspension unit sub-regions 10a and 10b can be formed of a porous body, such as ceramics. As the porous body, porous carbon, porous alumina ceramics, porous silicon carbide ceramics, etc. can be used. Each of the suspension unit sub-regions 10a and 10b can be formed of a metal material formed with a plurality of gas ejection holes.

[0056] The transfer mechanism 11 is provided on the +Y side of the suspension unit 10. The transfer mechanism 11 transfers the suspended substrate 16 in the transfer direction. As Figure 3 shown, the transfer mechanism 11 includes a holding mechanism 12 for vacuum-adsorbing the end of the substrate 16. The holding mechanism 12 adsorbs and holds the end of the substrate 16 on the +Y side.

[0057] For example, the holding mechanism 12 can be formed by using a vacuum adsorption mechanism. The vacuum adsorption mechanism is formed of a metallic material, such as aluminum alloy. Alternatively, the holding mechanism 12 can be formed of a resin-based material, such as PEEK (PolyEtherEtherKetone) material. One or more adsorption grooves, one or more suction holes, etc. are formed on the upper surface of the holding mechanism 12. The holding mechanism 12 can be formed of a porous material.

[0058] The holding mechanism 12 is connected to the drive mechanism 13. The drive mechanism 13 moves the holding mechanism 12 in the X direction. The drive mechanism 13 includes an actuator, such as a cylinder or a motor. For example, the drive mechanism 13 includes a guiding mechanism extending in the X direction. In addition, the drive mechanism 13 slides the holding mechanism 12 in the X direction. In this way, the conveying mechanism 11 can convey the substrate 16 in the X direction. In addition, the drive mechanism 13 can include a lifting mechanism for lifting and lowering the holding mechanism 12 in the Z direction (up / down direction).

[0059] In the X direction, the observation unit 50 is disposed in the gap 17 between the suspension unit sub-regions 10a and 10b. The observation unit 50 includes a light detector 52 and an optical system 51. For the light detector 52, a CCD (Charge-Coupled Device) camera, a CMOS (Complementary metal-oxide-semiconductor) image sensor, or a photodiode array can be used. The light detector 52 is a camera with pixels arranged in the X direction and the Y direction.

[0060] The optical system 51 guides the light from the substrate 16 to the light detector 52. In this way, the light detector 52 can capture an image of the substrate 16. For example, the optical system 51 includes an objective lens, etc. that forms a magnified image of the substrate 16. For example, the observation unit 50 can capture a magnified image of the substrate 16 magnified 50 to 100 times. The optical system 51 can include other optical elements, such as lenses, beam splitters, and filters.

[0061] A cable 53 for supplying power and for receiving and outputting signals is connected to the light detector 52. The image data acquired by the light detector 52 is stored in a memory or the like. Alternatively, the image can be displayed on an external monitor.

[0062] In addition, the observation unit 50 is connected to a moving mechanism 55. The moving mechanism 55 moves the observation unit 50 in the Y direction. Note that the light detector 52 moves together with the optical system 51. In the XY plane view, the position of the observation unit 50 relative to the substrate 16 changes. The observation device 100 can change the observation position on the substrate 16 (i.e., the area on the substrate 16 that the observation device 100 observes).

[0063] The moving mechanism 55 changes the position of the observation unit 50 in the Y direction. In addition, the conveying mechanism 11 conveys the substrate 16 in the X direction. In this way, the observation unit 50 can capture images of any position (i.e., any area) on the substrate 16. The observation device 100 can capture images of a plurality of observation positions on the substrate 16. Since the relative position of the observation unit 50 with respect to the substrate 16 changes in the X and Y directions, the observation device 100 can use a desired position on the substrate 16 as the observation position on the substrate. Note that when viewed from above, the moving direction of the moving mechanism 55 and the conveying direction of the conveying mechanism 11 are not limited to the directions shown in the figure. When viewed from above, the moving direction of the moving mechanism 55 and the conveying direction of the conveying mechanism 11 are not limited to directions perpendicular to each other. That is, it is sufficient that these directions are inclined with respect to each other.

[0064] Note that in Figure 2 and Figure 3 the illumination light source 59 is provided above the substrate 16. The illumination light source 59 generates illumination light for illuminating the substrate 16. The observation unit 50 receives light from the area illuminated by the illumination light source 59. Note that a lens or the like may be provided to focus the illumination light from the illumination light source 59 on the substrate 16.

[0065] Note that the position of the illumination light source 59 is not limited to a position above the substrate 16. For example, the illumination light source 59 can be arranged such that its optical axis coincides with the optical axis of the optical system 51. In addition, the illumination light source 59 can be an annular illumination unit arranged outside the lens. Alternatively, an indoor light or the like can be used as the illumination light source 59. The illumination light source 59 can generate illumination light such that its irradiation area has a linear shape in the Y direction. Alternatively, as described later, the illumination light source 59 can move in the Y direction together with the observation unit 50.

[0066] Figure 4 is an enlarged view showing the structure of the observation unit 50. In Figure 4 the lens barrel of the objective lens 51a is shown as the optical system 51. The optical system 51 is fixed to the light detector 52. An image is formed on the imaging device 52a of the light detector 52 by the light refracted by the optical system 51. The imaging device 52a is a two-dimensional array light detector having a plurality of pixels arranged in the X and Y directions. Note that although only one lens is shown in the lens barrel of the objective lens 51a in Figure 4 a plurality of lenses can be provided in the lens barrel.

[0067] For example, the optical axis of the objective lens 51a is parallel to the Z direction. Accordingly, the position on the substrate 16 directly above the light detector 52 (i.e., the region on the lower surface of the substrate 16) becomes the observation position on the substrate 16. It should be noted that when the amount of change in the height of the substrate 16 is equal to or greater than the depth of focus D of the objective lens 51a, the image of the substrate 16 becomes blurred. In this embodiment, since the suspension unit 10 is used, the height of the substrate 16 can be controlled with high precision. By using the observation device 100 according to this embodiment, the substrate 16 can be observed well enough.

[0068] In particular, the suspension unit 10 (i.e., the suspension unit sub-regions 10a and 10b) is disposed on both sides of the substrate 16 in the X direction. That is, the suspension unit 10a is disposed on the -X side of the substrate 16, while the suspension unit 10b is disposed on the +X side of the substrate 16. In this way, fluctuations in the height of the substrate 16 can be suppressed, and thus image blurring can be prevented. By using the observation device 100 according to this embodiment, an image of the substrate 16 can be captured well enough.

[0069] In addition, as Figure 2 and 3 shown, a part of the optical system 51 is disposed above the suspension surface of the suspension unit 10. Specifically, the upper end of the objective lens 51a is disposed above the suspension surface of the suspension unit 10. In this way, the objective lens 51a having a short working distance can be used in the optical system 51. Since an objective lens having a large numerical aperture can be used, the observation unit 50 can capture a high-resolution image.

[0070] The observation unit 50 is disposed below the substrate 16. The substrate 16 can be observed from its rear surface side. That is, an image of the pattern formed on the substrate 16 can be captured through the transparent substrate. Even when an opaque metal layer or the like is formed on the upper surface side of the substrate 16, an image of the pattern of the layer formed on the substrate 16 below its opaque layer can be captured. In this way, the substrate can be inspected with high precision.

[0071] Second Embodiment

[0072] Reference will be made to Figure 5 and Figure 6 to describe the observation device 100 according to the second embodiment. Figure 5 is an XY plan view showing the configuration of the observation device 100. Figure 6 is an XZ plan view showing the configuration of the observation device 100. The configuration of the suspension unit 10 in the second embodiment is different from that in the first embodiment. The remaining configuration other than the suspension unit 10 is the same as that in the first embodiment, and thus its description is omitted.

[0073] In this example, the floating unit 10 is not divided into two floating unit sub-regions 10a and 10b. That is, the floating unit 10 is integrally formed as one component. In addition, an opening 10c for setting the observation unit 50 is formed on the floating unit 10. The opening 10c is formed in the Y direction. That is, the opening 10c is a rectangle with its long side parallel to the Y direction and its short side parallel to the X direction. The observation unit 50 moves in the Y direction within the opening 10c.

[0074] Even in the above configuration, the substrate 16 can be observed well enough. In the X direction, the floating unit 10 (i.e., the component of the floating unit 10) is provided on both sides of the substrate 16. In this way, the height fluctuation of the substrate 16 can be suppressed. By using the observation device 100 according to the present embodiment, an image of the substrate 16 can be taken well enough.

[0075] Note that the space for setting the observation unit 50 is not limited to the opening 10c and can also be a recess or the like. That is, a groove extending in the Y direction can be formed on the upper surface of the floating unit 10. In addition, the moving mechanism 55 can move the observation unit 50 along the groove.

[0076] Third Embodiment

[0077] Reference will be made to Figure 7 and Figure 8 to describe the observation device 100 according to the third embodiment. Figure 7 is an XY plan view showing the configuration of the observation device 100. Figure 8 is an XZ plan view showing the configuration of the observation device 100. In the third embodiment, a support unit 30 is provided instead of the floating unit 10 in the first and second embodiments. Note that the other configurations except the support unit 30 are the same as those in the first embodiment, so their descriptions are omitted.

[0078] The support unit 30 includes a base 31 and a plurality of conveying rollers 33. The base 31 is provided directly below the substrate 16. The plurality of conveying rollers 33 are provided on the base 31. In the XY plan view, the plurality of conveying rollers 33 are arranged in an array. The plurality of conveying rollers 33 are rotatably connected to the base 31. The rotation axis 34 of the conveying roller 33 is parallel to the Y axis.

[0079] The conveying rollers 33 are provided above the base 31. Therefore, the conveying rollers 33 are in contact with the lower surface of the substrate 16. The heights of the plurality of conveying rollers 33 are equal to each other. When the conveying rollers 33 rotate, the substrate 16 is conveyed in the X direction.

[0080] By the above-described configuration, a space G is formed directly below the substrate 16. The support unit 30 is a mechanism for supporting the substrate 16, thereby forming a space G directly below the substrate 16. The objective lens of the optical system 51 is disposed in the space G formed directly below the substrate 16. Thus, as in the first and second embodiments, the observation unit 50 can image the substrate 16 well enough. As a result, the substrate 16 can be observed well enough.

[0081] Fourth Embodiment

[0082] Reference will be made to Figure 9 and Figure 10 describe the observation device according to the fourth embodiment. Figure 9 is an XY plan view showing the configuration of the observation device 100. Figure 10 is an XZ plan view showing the configuration of the observation device 100. In this embodiment, the adsorption unit 60 is disposed around the observation unit 50. The remaining configuration other than the adsorption unit 60 is the same as that of the first embodiment, and thus its description is omitted.

[0083] The adsorption unit 60 vacuum-adsorbs and fixes the substrate 16. The observation unit 50 is housed inside the adsorption unit 60. The moving mechanism 55 moves the observation unit 50 together with the adsorption unit 60 in the Y direction.

[0084] Reference will be made to Figure 11 and Figure 12 describe the configuration of the adsorption unit 60. Figure 11 is a top view showing the configuration of the adsorption unit 60. Figure 12 is an XZ cross-sectional view showing the configuration of the adsorption unit 60.

[0085] The adsorption unit 60 includes an adsorption portion 61, a housing portion 62, and a window portion 63. The housing portion 62 is a housing (outer shell) for housing the observation unit 50. The photodetector 52 and the optical system 51 are fixed to the housing portion 62. The cable 53 is pulled out to the outside of the housing portion 62. The moving mechanism 55 moves the housing portion 62 in the Y direction. Thus, since the observation unit 50 moves, the observation position on the substrate 16 can be changed in the Y direction.

[0086] In addition, the adsorption portion 61 is disposed above the housing portion 62. The adsorption portion 61 can adsorb and hold the substrate 16 by sucking gas from its upper surface. The upper surface of the adsorption portion 61 serves as an adsorption surface. The upper end of the objective lens 51a is located below the adsorption surface of the adsorption portion 61.

[0087] The adsorption part 61 includes a circular window part 63. Light from the substrate 16 passes through the window part 63 and enters the optical system 51. The window part 63 can be a space or can be provided with a transparent member such as glass. In this way, the adsorption unit 60 can adsorb and hold the entire periphery of the observation area on the substrate 16. The adsorption unit 60 can adsorb and hold the area around the observation area on the substrate 16.

[0088] The adsorption unit 60 fixes the substrate 16 by vacuum adsorption. In this way, the height fluctuation of the substrate 16 can be more effectively suppressed. That is, the distance from the objective lens 51a to the lower surface of the substrate 16 can be made constant, so as to better observe the substrate 16. Therefore, the substrate 16 can be stably observed.

[0089] When observing the substrate 16, the adsorption unit 60 adsorbs and holds the substrate 16. In addition, when transporting the substrate 16, the adsorption unit 60 releases the adsorption and holding of the substrate 16. For example, as Figure 13 shown, gas can be ejected from the adsorption part 61. In this way, a space G is formed between the substrate 16 and the adsorption part 61. That is to say, since the substrate 16 is suspended by air, the transport mechanism 11 can transport the substrate 16.

[0090] Fifth Embodiment

[0091] will be referred to Figure 14 to describe the observation device according to the fifth embodiment. Figure 14 is an XZ plan view showing the structure of the observation device 100. In this embodiment, a precision suspension unit 80 is provided around the observation unit 50. In other words, the adsorption unit in the fourth embodiment is replaced by the precision suspension unit 80. The remaining structure except for the precision suspension unit 80 is the same as the structure of the first embodiment, so its description is omitted.

[0092] will be referred to Figure 15 and Figure 16 to describe the structure of the precision suspension unit 80. Figure 15 is a top view showing the structure of the precision suspension unit 80. Figure 16 is an XZ cross-sectional view showing the structure of the precision suspension unit 80.

[0093] The precision suspension unit 80 includes a housing part 82 and a suction / ejection part 81. The housing part 82 is a housing (outer shell) for housing the observation unit 50. The light detector 52 and the objective lens 51a are fixed to the housing part 82. The cable 53 is pulled out to the outside of the housing part 82. The moving mechanism 55 moves the housing part 82 in the Y direction. In this way, since the observation unit 50 moves, the observation position on the substrate 16 can be changed in the Y direction.

[0094] The suction / ejection unit 81 is disposed above the housing unit 82. The suction / ejection unit 81 sucks gas from its upper surface and ejects gas onto the substrate 16. When the gas ejected from the suction / ejection unit 81 blows onto the lower surface of the substrate 16, the substrate 16 floats. The suction / ejection unit 81 sucks the gas present between the substrate 16 and the suction / ejection unit 81.

[0095] The suction / ejection unit 81 functions as a precision floating unit sub-region formed of a porous body, such as ceramics. As the porous body, porous carbon, porous alumina ceramics, porous silicon carbide ceramics, etc. can be used.

[0096] The suction / ejection unit 81 ejects gas upward. In addition, suction holes for sucking gas are formed in the suction / ejection unit 81. In the porous body, the suction holes extending to its upper surface are formed at a predetermined interval, for example, by machining. The suction holes are micro-holes and form a negative pressure between the substrate 16 and the suction / ejection unit 81. In addition, gas is ejected from almost the entire surface of the porous body except for the suction holes. An ejection surface for forming a positive pressure is formed on almost the entire surface except for the suction holes. Alternatively, the suction / ejection unit 81 can be formed of a metal block formed with a plurality of suction holes and a plurality of ejection holes.

[0097] Since the suction / ejection unit 81 ejects gas onto the lower surface of the substrate 16, a minute space G is formed between the suction / ejection unit 81 and the substrate 16. The space G is an air gap formed by the gas ejected from the suction / ejection unit 81. In addition, the suction / ejection unit 81 sucks the gas present in the space G. In this way, a suction force for sucking the substrate 16 downward is generated, and thus high floating accuracy can be achieved.

[0098] A circular window portion 83 is formed in the suction / ejection unit 81. The light from the substrate 16 passes through the window portion 83 and enters the optical system 51. The window portion 83 can be a space, or can be provided with a transparent member, such as glass. In this way, the suction / ejection unit 81 can suck gas around the entire periphery of the observation region on the substrate 16. The suction / ejection unit 81 can float the region around the observation region on the substrate 16 with high floating accuracy. The floating accuracy of the region around the observation unit 50 can be improved. Therefore, the observation unit 50 can capture an image of the substrate 16 well enough.

[0099] In addition, this embodiment is designed such that the substrate 16 is neither adsorbed nor fixed. Therefore, even during the conveyance of the substrate 16, the observation unit 50 can capture an image of the substrate 16. That is, when the substrate 16 moves, the observation unit 50 can capture an image of the substrate 16. In this way, the observation unit 50 can effectively capture an image of the substrate 16. The substrate 16 can be observed and inspected with high productivity.

[0100] Sixth Embodiment

[0101] will refer to Figure 17 and Figure 18 explain the observation device according to the sixth embodiment. Figure 17 is an XY plan view showing the structure of the observation device 100. Figure 18 is an XZ plan view showing the structure of the observation device 100.

[0102] In this embodiment, the structure of the suspension unit 10 is different from that in the first embodiment. Specifically, the suspension unit 10 includes suspension unit sub-regions 10a and 10b and precision suspension unit sub-regions 10d and 10e. The remaining structure except for the precision suspension single sub-regions 10d and 10e is the same as that in the first embodiment, so its description is omitted.

[0103] Similar to the suction / ejection unit 81 of the fifth embodiment, each of the precision suspension unit sub-regions 10d and 10e sucks and ejects gas. Since the precision suspension unit sub-regions 10d and 10e eject gas onto the lower surface of the substrate 16, a minute space G is formed between the precision suspension unit sub-regions 10d and 10e and the substrate 16. The space G is an air gap formed by the gas ejected from the precision suspension unit sub-regions 10d and 10e. In addition, the precision suspension unit sub-regions 10d and 10e suck the gas present in the space G. In this way, a suction force for sucking the substrate 16 downward is generated, thereby enabling high suspension accuracy.

[0104] In the X direction, the precision suspension unit sub-regions 10d and 10e are provided on both sides of the observation unit 50. That is, the precision suspension unit sub-region 10d is provided on the -X side of the observation unit 50, and the precision suspension unit sub-region 10e is provided on the +X side of the observation unit 50. The suspension accuracy of the peripheral region of the observation unit 50 can be improved on both sides along the transport direction of the observation unit 50. Therefore, the observation unit 50 can capture an image of the substrate 16 sufficiently well.

[0105] Seventh Embodiment

[0106] will refer to Figure 19 and Figure 20 explain the observation device according to the seventh embodiment. Figure 19 is an XY plan view showing the structure of the observation device 100. Figure 20 is an XZ plan view showing the structure of the observation device 100.

[0107] In this embodiment, an adsorption unit 18 is added to the structure of the first embodiment. Specifically, the precision suspension unit sub-regions 10d and 10e in the sixth embodiment are replaced by the adsorption unit 18.

[0108] The upper surface of the adsorption unit 18 is higher than the upper surface of the suspension unit 10. The adsorption unit 18 is disposed on both sides of the observation unit 50 along the conveying direction. Similar to the adsorption portion 61, the adsorption unit 18 vacuum-adsorbs the substrate 16. That is, the adsorption unit 18 sucks the gas present in the space G formed directly below the substrate 16. In this way, the substrate 16 is adsorbed and fixed to the upper surface of the adsorption unit 18. The height fluctuation of the substrate 16 can be suppressed. That is, the observation unit 50 can capture an image of the substrate 16 located at a fixed height. Therefore, the substrate 16 can be stably observed.

[0109] Eighth Embodiment

[0110] will be referred to Figure 21 、 Figure 22 and Figure 23 to describe the observation device according to the eighth embodiment. Figure 21 is an XY plan view showing the configuration of the observation device 100. Figure 22 is an XZ plan view showing the configuration of the observation device 100. Figure 23 is a YZ plan view showing the configuration of the observation device 100. Note that the description of the same subject as in the above embodiments will be omitted as appropriate. For example, the configurations of the observation unit 50 and the moving mechanism 55 are the same as those in the first embodiment.

[0111] In this embodiment, a conveyance robot 70 is provided in place of the suspension unit 10. The conveyance robot 70 includes an arm mechanism 71 and a robot hand 72.

[0112] The robot hand 72 is a mechanism for supporting the substrate 16, thereby forming a space G directly below the substrate 16. Specifically, the robot hand 72 includes a fork 72a. The fork 72a extends in the X direction. The substrate 16 is placed on the fork 72a. A space G is formed directly below the substrate 16 between adjacent teeth of the fork 72a. Note that the robot hand 72 can adsorb and hold the substrate 16 by vacuum adsorption or the like.

[0113] The arm mechanism 71 includes actuators such as servo motors and drives the robot hand 72. Thus, as Figure 22 shown, the substrate 16 is conveyed in the X direction. In addition, the moving mechanism 55 moves the observation unit 50 in the Y direction. Thus, any position on the substrate 16 can be observed.

[0114] As Figure 24 shown, the moving directions of the arm mechanism 71 and the moving mechanism 55 can be interchanged. In Figure 24 this case, the arm mechanism 71 can move the substrate 16 in the Y direction, while the moving mechanism 55 can move the substrate 16 in the X direction. As described above, the conveying direction of the substrate 16 and the moving direction of the observation unit 50 are not limited to any specific direction.

[0115] Ninth Embodiment

[0116] Note that although in the first to eighth embodiments, the moving mechanism 55 moves the observation unit 50 to change the observation position on the substrate, the moving mechanism may also move the substrate 16 instead of or in addition to moving the observation unit 50. It is sufficient that the moving mechanism can move the relative position of the observation unit with respect to the substrate in a direction inclined with respect to the conveyance direction of the substrate during top-down observation. In this embodiment, the moving mechanism moves the substrate 16 disposed above the suspension unit 10 in the Y direction.

[0117] Reference will be made to Figures 25 to 27 explain the configuration of the observation device 100 according to this embodiment. Figure 25 is an XY plan view showing the configuration of the observation device 100. Figure 26 is an XZ plan view showing the configuration of the observation device 100. Figure 27 is a YZ plan view showing the configuration of the observation device 100.

[0118] In this embodiment, the moving mechanism 91 is provided instead of the moving mechanism 55. The moving mechanism 91 moves the substrate 16 in the Y direction. Accordingly, the observation position on the substrate 16 observed by the observation unit 50 is changed in the Y direction. The position of the observation unit 50 is fixed. For example, the observation unit 50 is fixed within an opening 10h formed in the suspension unit sub-region 10b. Thus, the observation unit 50 does not move.

[0119] More specifically, as Figure 25 shown, the suspension unit 10 includes suspension unit sub-regions 10a, 10b, 10f, and 10g. For example, the suspension unit sub-regions 10f and 10g are added to Figure 1 the configuration of the suspension unit 10 shown. Similar to the suspension unit sub-regions 10a and 10b, the suspension unit sub-regions 10f and 10g jet gas upward. The suspension unit sub-region 10f is disposed on the +Y side of the suspension unit sub-region 10a. The suspension unit sub-region 10g is disposed on the +Y side of the suspension unit sub-region 10b.

[0120] The conveyance mechanism 11 moves in the X direction within the space formed between the suspension unit sub-regions 10a and 10f. The conveyance mechanism 11 moves in the X direction within the space formed between the suspension unit sub-regions 10b and 10g. The moving mechanism 91 moves in the Y direction within the space formed between the suspension unit sub-regions 10a and 10b. The moving mechanism 91 moves in the Y direction within the space formed between the suspension unit sub-regions 10f and 10g.

[0121] The moving mechanism 91 has the same configuration as the conveyance mechanism 11, but its conveyance direction is different from that of the conveyance mechanism 11. Specifically, as Figure 26 andFigure 27 As shown, the moving mechanism 91 includes a holding mechanism 92 and a driving mechanism 93. Similar to the holding mechanism 12, the holding mechanism 92 adsorbs and holds the substrate 16. The driving mechanism 93 moves the holding mechanism 92 in the Y direction. Therefore, the moving mechanism 91 can move the substrate 16 in the Y direction. The observation unit 50 is provided directly below the substrate 16. In this way, the observation position on the substrate 16 can be changed.

[0122] For example, assume that the conveying mechanism 11 and the moving mechanism 91 are provided directly below the substrate 16. In this state, the conveying mechanism 11 and the moving mechanism 91 can transfer the substrate 16 to each other. While the holding mechanism 92 holds the substrate 16, the holding mechanism 12 releases the holding of the substrate 16. As a result, the substrate 16 is transferred from the conveying mechanism 11 to the moving mechanism 91, enabling the substrate 16 to move in the Y direction. After the substrate 16 is transferred from the conveying mechanism to the moving mechanism, the conveying mechanism 11 can lower the holding mechanism 12 to prevent the holding mechanism 12 from colliding with the substrate 16.

[0123] Then, when the driving mechanism 93 drives the holding mechanism 92, the substrate 16 moves in the Y direction. As a result, the observation position on the substrate 16 observed by the observation unit 50 moves in the Y direction. That is, the moving mechanism 91 moves the relative position of the observation unit 50 with respect to the substrate 16 in the Y direction.

[0124] While the holding mechanism 12 holds the substrate 16, the holding mechanism 92 releases the holding of the substrate 16. As a result, the substrate 16 is transferred from the moving mechanism 91 to the conveying mechanism 11, enabling the substrate 16 to move in the X direction. After the substrate 16 is transferred from the conveying mechanism to the moving mechanism, the moving mechanism 91 can lower the holding mechanism 92 to prevent the holding mechanism 92 from colliding with the substrate 16.

[0125] Then, when the driving mechanism 13 drives the holding mechanism 12, the substrate 16 moves in the X direction. As a result, the observation position on the substrate 16 observed by the observation unit 50 moves in the X direction. That is, the conveying mechanism 11 moves the relative position of the observation unit 50 with respect to the substrate 16 in the X direction.

[0126] In this embodiment, the substrate 16 moves in the Y direction instead of the observation unit 50. By combining the conveyance of the substrate 16 in the X direction by the conveying mechanism 11 and the conveyance of the substrate 16 in the Y direction by the moving mechanism 91, the observation position observed by the observation unit 50 can be changed in the X and Y directions. Therefore, due to the conveyance of the substrate 16 in the X and Y directions, the observation device 100 can observe any position on the substrate 16.

[0127] In addition, as Figure 25 and Figure 26As shown, the moving mechanism 95 is provided on the +X side of the suspension unit sub-region 10b. The moving mechanism 95 has a structure similar to that of the moving mechanism 91. Specifically, the moving mechanism 95 includes a holding mechanism 96 and a driving mechanism 97. The holding mechanism 96 corresponds to the holding mechanism 92, and the driving mechanism 97 corresponds to the driving mechanism 93. The moving mechanism 95 moves the substrate 16 in the Y direction. For example, after the moving mechanism 91 moves the substrate 16 in the -Y direction, the moving mechanism 95 moves the substrate 16 in the +Y direction. As a result, the substrate 16 returns to its original position in the Y direction.

[0128] In addition, in this embodiment, a plurality of sub-regions of the precision suspension unit 80 may also be arranged around the observation unit 50. Alternatively, one or more adsorption units 60 may be provided around the observation unit 50.

[0129] Tenth Embodiment

[0130] Reference will be made to Figure 28 and Figure 29 to describe the structure of the observation device 100 according to the tenth embodiment. In this embodiment, a rotating mechanism 99 is added to the structure of the ninth embodiment. The remaining structure except for the rotating mechanism 99 is the same as that of the above embodiment, so its description is omitted.

[0131] The rotating mechanism 99 rotates the substrate 16 suspended above the suspension unit 10 about the Z axis. The rotating mechanism 99 is provided in the opening formed in the suspension unit sub-region 10a. The rotating mechanism 99 includes a holding mechanism 99a and a driving mechanism 99b. The holding mechanism 99a adsorbs and holds the substrate 16 in the same manner as the holding mechanisms 12 and 92, etc. The driving mechanism 99b includes a motor and a rotating shaft for rotating the holding mechanism 99a. The rotating shaft is parallel to the Z direction.

[0132] In a state where gas is ejected onto the substrate 16 in the suspension unit sub-regions 10a and 10f, etc., the holding mechanism 99a holds the substrate 16. At this time, when the driving mechanism 99b rotates the holding mechanism 99a, the substrate 16 rotates about the Z axis. For example, the rotating mechanism 99 rotates the substrate 16 about the Z axis by 90° or 180°. By using the rotating mechanism 99, the observation position on the substrate 16 can be changed. As described above, in this embodiment, the observation device 100 can move the substrate 16 with three degrees of freedom, that is, along the X axis, along the Y axis, and around the rotating axis. Therefore, the observation device 100 can observe the entire surface of the substrate 16.

[0133] As described above, the observation device 100 has: a mechanism for suspending or supporting a substrate such that a space is formed directly below the substrate; and an observation unit including a light detector designed to detect light from the substrate and an optical system designed to guide the light from the substrate to the light detector. Further, the observation method performed on the observation device includes the following steps (A1) to (A3).

[0134] (A1) A step of conveying the substrate in the conveying direction by a conveying mechanism.

[0135] (A2) A step of observing the substrate conveyed by the conveying mechanism by using the observation unit.

[0136] (A3) A step of observing the substrate while changing the observation position on the substrate by moving the relative position of the observation unit relative to the substrate in a direction inclined with respect to the conveying direction during a top view observation.

[0137] The configurations of the first to tenth embodiments can be used while appropriately combining them with each other. In addition, each of the observation devices 100 shown in the first to tenth embodiments can be applied to manufacturing equipment for semiconductor devices. The substrate can be observed sufficiently well during the manufacturing process of the semiconductor device. Therefore, semiconductor devices can be manufactured with high productivity.

[0138] For example, the observation device 100 can be provided on a part of a laser irradiation device. Figure 25 It is an XZ cross-sectional view showing the configuration of a laser irradiation device 1 including the observation device 100 according to the first embodiment. The laser irradiation device 1 is, for example, an excimer laser anneal (ELA) device for forming a low temperature poly-silicon (LTPS) film. In this case, the substrate 16 is a glass substrate on which an amorphous silicon film is formed.

[0139] The laser irradiation device 1 includes the observation device 100 and a laser irradiation unit 14. In this example, the laser irradiation device 1 has a configuration obtained by adding the laser irradiation unit 14 to the observation device 100 shown in Figure 1 During conveyance of the substrate 16 in the X direction, the laser irradiation unit 14 is provided above the substrate 16. In Figure 25 the laser irradiation unit 14 is provided above the suspension unit sub-region 10b.

[0140] The laser irradiation unit 14 includes a laser source for generating laser light 15 and an irradiation optical system for guiding the laser light 15 to the substrate 16. The laser irradiation unit 14 applies a line beam having a longitudinal direction parallel to the Y direction (i.e., a beam having an irradiation area having a linear shape) to the substrate 16. Since the substrate 16 is transported in the X direction, almost the entire surface of the substrate 16 can be irradiated with laser light.

[0141] For example, the laser irradiation unit 14 includes an excimer laser source for generating laser light. In addition, the laser irradiation unit 14 includes an optical system for guiding the laser light to the substrate 16. The laser irradiation unit 14 includes a lens for focusing the laser light 15 on the substrate 16. For example, the laser irradiation unit 14 includes a cylindrical lens for forming a linear irradiation area. The substrate 16 is irradiated with a linear laser light 15 (a linear beam, i.e., a beam whose irradiation area has a linear shape), in particular, a laser light 15 whose focus extends in the y direction. The focus of the laser light 15 is formed on the substrate 16.

[0142] The levitation unit 10 suspends the substrate 16 with high precision. Therefore, the laser irradiation unit 14 can appropriately apply the laser to the substrate 16. Since the in-plane variation of the laser can be suppressed, uniform processing can be performed. The levitation height can be kept uniform. Therefore, a more stable process can be performed, so that a uniform polysilicon film can be formed. Therefore, productivity can be improved.

[0143] exist Figure 30 , the substrate 16 that has been irradiated with laser light can be observed. Needless to say, the substrate 16 that has not been irradiated with laser light can also be observed. In this case, the laser irradiation unit 14 can apply laser light to the substrate at the -X side of the observation unit 50. For example, the laser irradiation unit 14 can be disposed above the suspension unit sub-area 10a.

[0144] Note that although the above reference Figure 30 Although the example in which the observation device 100 is applied to the laser irradiation device 1 is described, the observation device 100 may be applied to devices other than the laser irradiation device. That is, the observation device 100 may be applied to a manufacturing device used in a manufacturing process of a semiconductor device.

[0145] (Organic EL display device)

[0146] The semiconductor device having the polysilicon film is suitable for a TFT (Thin Film transistor) array substrate of an organic EL (Electro Luminescence) display. That is, the polysilicon film is used as a semiconductor layer including a source region, a channel region and a drain region of the TFT.

[0147] Next, a configuration in which the semiconductor device according to the present embodiment is applied to an organic EL display will be described.Figure 31 It is a simplified cross-sectional view of a pixel circuit of an organic EL display device. Figure 31 The organic EL display 300 shown is an active matrix display device, where one or more TFTs are provided in each pixel PX.

[0148] The organic EL display device 300 includes a substrate 310, a TFT layer 311, an organic layer 312, a color filter layer 313, and a sealing substrate 314. Figure 31 A top-emission type organic EL display device is shown, where one side of the sealing substrate 314 is on the viewing side. Note that the following description is given to show an example of the structure of the organic EL display device, and the embodiment is not limited to the structure described below. For example, the semiconductor device according to this embodiment can be used for a bottom-emission type organic EL display device.

[0149] The substrate 310 is a glass substrate or a metal substrate. The TFT layer 311 is provided on the substrate 310. The TFT layer 311 includes the TFTs 311a provided in the respective pixels PX. In addition, the TFT layer 311 includes wirings (not shown) connected to the TFTs 311a, etc. The TFTs 311a, wirings, etc. constitute a pixel circuit.

[0150] The organic layer 312 is provided on the TFT layer 311. The organic layer 312 includes the organic EL light-emitting elements 312a provided in each pixel PX. In addition, in the organic layer 312, partition walls 312b for separating the organic EL light-emitting elements 312a are provided between the pixels PX.

[0151] The color filter layer 313 is provided on the organic layer 312. The color filter layer 313 includes color filters 313a for performing color display. That is, in each pixel PX, a resin layer colored with R (red), G (green), or B (blue) is provided as the color filter 313a.

[0152] The sealing substrate 314 is provided on the color filter layer 313. The sealing substrate 314 is a transparent substrate such as a glass substrate, and is provided to prevent deterioration of the organic EL light-emitting elements of the organic layer 312.

[0153] The current flowing through the organic EL light-emitting elements 312a of the organic layer 312 changes according to the display signal supplied to the pixel circuit. Therefore, the light emission amount in each pixel PX can be controlled by supplying a display signal corresponding to the display image to each pixel PX. As a result, a desired image can be displayed.

[0154] In an active matrix display device such as an organic EL display, at least one TFT (e.g., a switching TFT or a driving TFT) is provided in one pixel PX. Further, a semiconductor layer including a source region, a channel region, and a drain region is provided in the TFT in each pixel PX. The polycrystalline silicon film according to the present embodiment is applicable to the semiconductor layer of the TFT. That is, by using the polycrystalline silicon film manufactured by the above manufacturing method for the semiconductor layer of the TFT array substrate, in-plane variations in TFT characteristics can be prevented or reduced. Therefore, a display device having excellent display characteristics can be manufactured with high productivity.

[0155] (Method of manufacturing a semiconductor device)

[0156] A method of manufacturing a semiconductor device by using a laser irradiation device according to the present embodiment is suitable for manufacturing a TFT array substrate. Reference will be made to Figure 26 and Figure 32 to describe a method of manufacturing a semiconductor device having a TFT. Figure 32 and Figure 33 Each of them shows a cross-sectional view of a process in the method of manufacturing a semiconductor device. In the following description, a method of manufacturing a semiconductor device having an inverted staggered type TFT will be described. Figure 32 and Figure 33 Each of them shows one of the processes of forming a polycrystalline silicon film in the method of manufacturing a semiconductor. Note that other manufacturing processes can be performed by using known techniques, and thus their descriptions are appropriately omitted.

[0157] As Figure 32 shown, a gate electrode 402 is formed on a glass substrate 401. A gate insulating film 403 is formed on the gate electrode 402. An amorphous silicon film 404 is formed on the gate insulating film 403. The amorphous silicon film 404 is disposed on the gate electrode 402 with the gate insulating film 403 interposed therebetween. For example, the gate insulating film 403 and the amorphous silicon film 404 are sequentially formed by a CVD (Chemical Vapor Deposition) method.

[0158] Then, the glass substrate 401 having the amorphous silicon film 404 formed thereon is transferred to the above-described transfer device 600. By irradiating the amorphous silicon film 404 with a laser L1, a polycrystalline silicon film 405 is formed, as Figure 33 shown. That is, the amorphous silicon film 404 is crystallized by the laser irradiation device 1 as shown in Figure 25 etc. As a result, a polycrystalline silicon film 405 formed as silicon crystallizes is formed on the gate insulating film 403. The polycrystalline silicon film 405 corresponds to the above-described polycrystalline silicon film. While the transfer device 600 transfers the glass substrate 401, the glass substrate 401 is irradiated with the laser L1. As a result, the amorphous silicon film 404 is annealed and transformed into the polycrystalline silicon film 405.

[0159] In addition, the above description is based on the laser annealing apparatus according to the present embodiment being an apparatus that forms a polycrystalline silicon film by applying a laser to an amorphous silicon film. However, the present invention can be applied to other cases where a microcrystalline silicon film is formed by applying a laser to an amorphous silicon film. In addition, the laser used for annealing is not limited to Nd:YAG laser. In addition, the method according to the present embodiment can also be applied to a laser annealing apparatus for crystallizing a thin film other than a silicon film. That is, the method according to the present embodiment can be applied to any laser annealing apparatus in which a crystalline film is formed by applying a laser to an amorphous film. With the laser annealing apparatus according to the present embodiment, a substrate having a crystalline film can be appropriately modified (or altered).

[0160] The manufacturing method of the semiconductor device according to the present embodiment may include the following steps (S1) to (S4). (S1) A substrate is suspended or supported by using a mechanism so that a space is formed directly below the substrate. (S2) The substrate suspended or supported above the mechanism is conveyed in a conveying direction by using a conveying mechanism. (S3) The substrate is observed by using an observation unit, which includes a photodetector designed to detect light from the substrate and an optical system designed to guide the light from the substrate to the photodetector. (S4) When observing from above, the observation unit is moved relative to the substrate in a direction inclined with respect to the conveying direction by using a moving mechanism to change the observation position on the substrate.

[0161] In addition, the conveying mechanism may convey the substrate so that the laser irradiation unit applies a laser to the substrate before or after the observation unit observes the substrate.

[0162] Note that the present invention is not limited to the above-described embodiments, and they can be appropriately modified without departing from the scope and spirit of the present invention.

[0163] List of Reference Numerals

[0164] 10 Suspension unit

[0165] 11 Conveying mechanism

[0166] 12 Holding mechanism

[0167] 13 Driving mechanism

[0168] 16 Substrate

[0169] 30 Support unit

[0170] 31 Base

[0171] 33 Conveying roller

[0172] 50 Observation unit

[0173] 51 Optical system

[0174] 51a Objective lens

[0175] 52 Light detector

[0176] 53 Cable

[0177] 55 Moving mechanism

[0178] 59 Light source for illumination

[0179] 60 Adsorption unit

[0180] 61 Adsorption part

[0181] 62 Receiving part

[0182] 63 Window part

[0183] 70 Conveyor robot

[0184] 71 Arm mechanism

[0185] 72 Robot hand

[0186] 72a Fork

[0187] 80 Precision suspension unit

[0188] 81 Suction / ejection part

[0189] 82 Receiving part

[0190] 83 Window part

[0191] 100 Observation device

Claims

1. Observation device, comprising: a mechanism designed to levitate or support a substrate such that a space is formed directly below the substrate; a conveying mechanism designed to convey the substrate levitated or supported above the mechanism in a conveying direction; an observation unit including a photodetector designed to detect light from the substrate and an optical system designed to guide the light from the substrate to the photodetector; and a moving mechanism designed to move the relative position of the observation unit with respect to the substrate in a direction inclined with respect to the conveying direction during a top view observation to change the observation position on the substrate.

2. The observation device according to claim 1, wherein The mechanism includes a levitation unit designed to eject gas onto the substrate, and the levitation unit is disposed on both sides of the observation unit in the conveying direction.

3. The observation device according to claim 2, wherein The moving mechanism moves the observation unit.

4. The observation device according to claim 2, wherein, The moving mechanism moves the substrate.

5. The observation device according to claim 2 or 3, wherein, Further comprising an adsorption unit designed to vacuum-adsorb the substrate around the observation unit, wherein the observation unit observes the substrate in a state where the adsorption unit adsorbs and fixes the substrate.

6. The observation device according to claim 2 or 3, wherein, Around the observation unit, the observation unit observes the substrate in a state where gas is ejected onto the lower surface of the substrate and the gas present below the substrate is suctioned.

7. The observation device according to claim 1, wherein, The mechanism includes a plurality of conveying rollers designed to support the substrate, and the plurality of conveying rollers rotate to convey the substrate in the conveying direction.

8. The observation device according to claim 1, wherein, The mechanism includes a robot hand designed to support the substrate, and the conveying mechanism includes an arm mechanism designed to drive the robot hand.

9. Observation method performed on the observation device, The observation device includes: a mechanism designed to levitate or support a substrate such that a space is formed directly below the substrate; and an observation unit including a photodetector designed to detect light from the substrate and an optical system designed to guide the light from the substrate to the photodetector, The observation method includes the following steps: (A1) Conveying the substrate in the conveying direction by using the conveying mechanism; (A2) Observing the substrate conveyed by the conveying mechanism by using the observation unit; and (A3) While changing the observation position on the substrate, observing the substrate by moving the relative position of the observation unit with respect to the substrate in a direction inclined with respect to the conveying direction during a top view observation.

10. The observation method according to claim 9, wherein, The mechanism includes a levitation unit designed to eject gas onto the substrate, and the levitation unit is disposed on both sides of the observation unit in the conveying direction.

11. The observation method according to claim 10, wherein, In the step (A3), the observation unit is moved.

12. The observation method according to claim 10, wherein, In the step (A3), the substrate is moved.

13. The observation method according to claim 10 or 11, wherein The observation device further includes an adsorption unit designed to vacuum-adsorb the substrate around the observation unit, and the observation unit observes the substrate in a state where the adsorption unit adsorbs and fixes the substrate.

14. The observation method according to claim 10 or 11, wherein Around the observation unit, in a state where gas is ejected onto the lower surface of the substrate and the gas present below the substrate is sucked, the observation unit observes the substrate.

15. The observation method according to claim 9, wherein The mechanism includes a plurality of transport rollers designed to support the substrate, and the plurality of transport rollers rotate to transport the substrate in the transport direction.

16. The observation method according to claim 9, wherein, The mechanism includes a robot hand designed to support the substrate, and the transport mechanism includes an arm mechanism designed to drive the robot hand.

17. A method of manufacturing a semiconductor device, comprising the steps of: (S1) Suspending or supporting a substrate by using a mechanism so that a space is formed directly below the substrate; (S2) Transporting the substrate suspended or supported above the mechanism in a transport direction by using a transport mechanism; (S3) Observing the substrate by using an observation unit, the observation unit including a photodetector designed to detect light from the substrate and an optical system designed to guide light from the substrate to the photodetector; and (S4) Changing the observation position on the substrate by using a moving mechanism to move the relative position of the observation unit with respect to the substrate in a direction inclined with respect to the transport direction during a top view observation.

18. The manufacturing method of the semiconductor device according to claim 17, wherein, The mechanism includes a suspension unit designed to eject gas onto the substrate, and the suspension unit is disposed on both sides of the observation unit in the transport direction.

19. The manufacturing method of the semiconductor device according to claim 18, wherein, In the step (S4), the moving mechanism moves the observation unit.

20. The manufacturing method of the semiconductor device according to claim 18, wherein, In the step (S4), the moving mechanism moves the substrate.

21. The manufacturing method of the semiconductor device according to claim 18 or 19, wherein, The observation device further includes an adsorption unit designed to vacuum-adsorb the substrate around the observation unit, and in a state where the adsorption unit adsorbs and fixes the substrate, the observation unit observes the substrate.

22. The manufacturing method of the semiconductor device according to claim 18 or 19, wherein, Around the observation unit, in a state where gas is ejected onto the lower surface of the substrate and the gas present below the substrate is sucked, the observation unit observes the substrate.

23. The manufacturing method of the semiconductor device according to claim 17, wherein, The mechanism includes a plurality of transport rollers designed to support the substrate, and the plurality of transport rollers rotate to transport the substrate in the transport direction.

24. The method of manufacturing a semiconductor device according to claim 17, wherein, The mechanism includes a robot hand designed to support the substrate, and the transport mechanism includes an arm mechanism designed to drive the robot hand.

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