Non-contact dry-method degumming machine equipment capable of simultaneously degumming double surfaces of single sheet

Abstract

The invention relates to the technical field of photoresist removal, in particular to single-sheet double-face simultaneous non-contact dry-method photoresist remover equipment which comprises a processing cylinder, and fixing plates are arranged at the upper end and the lower end of the processing cylinder; the clamping piece is connected with the interior of the processing barrel; the two quartz barrels are mounted at the outward ends of the two fixing plates respectively; the two Faraday barrier covers are respectively mounted at the annular ends of the two quartz barrels; the two fixing supports are installed at the annular ends of the two Faraday barrier covers respectively. The two gas shower nozzles are respectively mounted at the outward ends of the two fixed brackets; the electromagnetic induction piece and the two electromagnetic induction pieces are installed at the annular ends of the two fixing supports respectively, by means of the design, photoresist removing operation can be efficiently and accurately conducted on the upper end face and the lower end face of the wafer at the same time, the probability that residues, damage and the like occur to the wafer due to photoresist removing is effectively reduced, and the waste liquid treatment problem caused by photoresist removing is effectively reduced; and the photoresist removing efficiency, quality and effect are effectively ensured.

Description

Technical Field

[0001] The present invention is a dry stripping machine device for simultaneous non-contact stripping of both sides of a single wafer, belonging to the technical field of stripping. Background Art

[0002] As the core substrate for semiconductor manufacturing, a wafer is processed from a silicon ingot through precision processes such as grinding, polishing, and slicing. In processes such as lithography, it is necessary to apply photoresist on both sides of the wafer to form a photoresist layer. After the wafer completes all processing procedures, in order to ensure its performance indicators and product yield, stripping treatment must be carried out. The current mainstream wet stripping process is mainly divided into two modes:

[0003] Batch processing mode: Inject an appropriate amount of chemical reagent into a special container, and through an immersion process, immerse the wafer completely in the reagent, and cooperate with ultrasonic vibration to achieve simultaneous stripping of both sides. This method is suitable for large-scale production scenarios;

[0004] Single-wafer processing mode: Use a precision clamping device to fix the wafer, and use a nozzle to spray chemical reagent on the wafer surface. After completing the stripping of one side, the other side is processed through a mechanical flipping mechanism. This mode is particularly suitable for small-batch trial production and high-end product processing because the reagent dosage is accurately controllable.

[0005] However, in the single-wafer processing technology, the local dissolution of chemical reagents and the high-pressure spraying process are likely to cause chemical residues and physical damage on the wafer surface, and at the same time, the waste liquid generated needs to be professionally recycled. These problems not only reduce the overall efficiency of the stripping process, but may also have a negative impact on the final quality of the wafer, and affect the stripping effect of the wafer. Summary of the Invention

[0006] In view of the problems in the prior art, the present invention provides a dry stripping machine device for simultaneous non-contact stripping of both sides of a single wafer.

[0007] The technical solution adopted by the present invention to solve its technical problems is as follows:

[0008] A dry stripping machine device for simultaneous non-contact stripping of both sides of a single wafer, comprising:

[0009] A processing cylinder, with fixing plates provided at both the upper and lower ends of the processing cylinder;

[0010] Two radio frequency shielding covers, which are respectively installed on the outer ends of the two fixing plates;

[0011] Two radio frequency matchers, which are respectively installed on the outer ends of the two radio frequency shielding covers;

[0012] A clamping member, connected to the inside of the processing cylinder;

[0013] Quartz barrels, two of which are provided. The two quartz barrels are respectively installed on the outer ends of two fixing plates, and the quartz barrels extend to the inner ends of the fixing plates;

[0014] Faraday barrier covers, two of which are provided. The two Faraday barrier covers are respectively installed on the annular ends of two quartz barrels;

[0015] Fixing brackets, two of which are provided. The two fixing brackets are respectively installed on the annular ends of two Faraday barrier covers, and the two fixing brackets are respectively arranged on the outer ends of two fixing plates;

[0016] Gas shower nozzles, two of which are provided. The two gas shower nozzles are respectively installed on the outer ends of two fixing brackets, and the gas shower nozzles extend into the quartz barrels. The two gas shower nozzles are respectively located within two radio frequency shielding covers;

[0017] Electromagnetic induction components, two of which are provided. The two electromagnetic inductions are respectively installed on the annular ends of two fixing brackets, and the two electromagnetic induction components are respectively located within two radio frequency shielding covers. The two electromagnetic induction components are respectively electrically connected to two radio frequency matchers.

[0018] Further, the electromagnetic induction component includes a coil. The coil is arranged on the annular end of the fixing bracket. A fixed capacitor is installed at the outer end of the fixing bracket, and the fixed capacitor is electrically connected to the coil. An adjustable capacitor is arranged at the outer end of the fixed capacitor, and the adjustable capacitor is respectively electrically connected to the fixed capacitor and the radio frequency matcher.

[0019] Further, connection joints are connected and installed at the outer ends of the two gas shower nozzles, and the two joints are respectively communicated with two special gas distribution cabinets through air pipes.

[0020] Further, the two radio frequency matchers are respectively connected to two radio frequency power supplies through radio frequency cables.

[0021] Further, the clamping component includes two support plates. The two support plates are respectively installed on the front and rear inner walls inside the processing cylinder. The inner end faces of the support plates are both recessed outward to form arc-shaped notch grooves, and the arc-shaped notch grooves respectively extend to the upper and lower ends of the support plates. The upper end faces of the support plates are recessed downward to form arc-shaped support grooves, and the arc-shaped support grooves extend to the inner ends of the support plates.

[0022] Further, the inner wall surface of the arc-shaped support groove is recessed outward to form a plurality of grooves. Cylinders are slidably connected within the plurality of grooves. A ball head is arranged at the inner end of the cylinder, and the ball head extends outside the groove. The cylinder and the ball head are of an integrated structure. An elastic member is installed at the outer end of the cylinder, and the other end of the elastic member is connected to the inner wall of the groove.

[0023] Further, a leftward recess is formed on the right end face of the processing cylinder, and the feeding port extends to the inner wall of the processing cylinder, and the feeding port is arranged facing the direction of the manipulator.

[0024] Advantages of the present invention:

[0025] First, a plurality of wafers to be de-glued are placed in the processing cylinder in a limited and lifted manner, and then high-frequency alternating currents with appropriate parameters are respectively supplied to the two coils, so as to form alternating magnetic fields in both quartz barrels, and special gases are sprayed into the two quartz barrels by two gas shower nozzles respectively. Under the action of the magnetic field, high-density plasma is generated in both quartz barrels, and is sprayed onto the upper and lower ends of the wafers to be de-glued limitedly installed in the processing cylinder. At the same time, a large number of active particles are generated by the high-density plasma, and then oxidation / decomposition reactions are carried out with the hydrocarbons in the photoresist attached to the upper and lower ends of the wafers to be de-glued, and volatile gases such as CO are generated, so as to perform non-contact dry de-gluing treatment on the upper and lower end faces of the wafers. The chemical reaction between the active particles and the photoresist is used to realize efficient and precise de-gluing operation on the upper and lower end faces of the wafers at the same time, effectively reducing the probability of residues and damages on the wafers caused by de-gluing, effectively reducing the waste liquid treatment problem caused by de-gluing, and effectively ensuring the de-gluing efficiency, quality and effect. Description of the Drawings

[0026] By reading the detailed description of the non-restrictive embodiments with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious:

[0027] Figure 1 It is a schematic structural diagram of a non-contact dry de-gluing machine device for single-wafer double-sided simultaneous de-gluing of the present invention;

[0028] Figure 2 It is a sectional view of a non-contact dry de-gluing machine device for single-wafer double-sided simultaneous de-gluing of the present invention;

[0029] Figure 3 It is Figure 2 The enlarged view of part A in

[0030] Figure 4 It is an assembly diagram of the processing cylinder and two fixing plates in a non-contact dry de-gluing machine device for single-wafer double-sided simultaneous de-gluing of the present invention;

[0031] Figure 5 It is an assembly diagram of the Faraday barrier cover, the coil and the fixing bracket in a non-contact dry de-gluing machine device for single-wafer double-sided simultaneous de-gluing of the present invention;

[0032] Figure 6 It is a perspective view of the processing cylinder in a non-contact dry de-gluing machine device for single-wafer double-sided simultaneous de-gluing of the present invention;

[0033] Figure 7 This is a perspective view of the gas shower head in a single - wafer double - sided simultaneous contactless dry stripping machine device of the present invention;

[0034] Figure 8 This is a perspective view of the quartz barrel in a single - wafer double - sided simultaneous contactless dry stripping machine device of the present invention;

[0035] Figure 9 This is a perspective view of the tray in a single - wafer double - sided simultaneous contactless dry stripping machine device of the present invention.

[0036] In the figure: 1. Processing cylinder, 11. Fixed plate, 12. Feed inlet, 2. RF shielding cover, 3. RF matcher, 4. Gas shower head, 41. Connector, 5. Quartz barrel, 6. Faraday barrier cover, 7. Coil;

[0037] 8. Fixed bracket, 81. Fixed capacitor, 82. Adjustable capacitor, 9. Tray, 91. Arc - shaped notch groove, 92. Arc - shaped support groove, 93. Ball head, 94. Cylinder, 95. Elastic member, 96. Groove, 10. Wafer. Detailed implementation mode

[0038] To make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation modes.

[0039] As Figures 1-9 shown, a single - wafer double - sided simultaneous contactless dry stripping machine device is provided, including: a processing cylinder 1, a feed inlet 12 formed by a left - hand depression on the right - hand end face of the processing cylinder 1 and extending to the inner wall of the processing cylinder 1 and arranged facing the direction of the manipulator. Through the feed inlet 12, the wafer 10 enters and exits the processing cylinder 1. Two fixed plates 11 are respectively arranged at the upper and lower ends of the processing cylinder 1. Through the fixed plates 11, an installation carrier is provided for components such as the RF shielding cover 2, and two RF shielding covers 2 are respectively installed on the outer ends of the two fixed plates 11. Through the RF shielding cover 2, an installation space is provided for components such as the coil 7, and then two RF matchers 3 are respectively installed on the outer ends of the two RF shielding covers 2. Through the RF matcher 3, it is used to adjust circuit parameters;

[0040] Two quartz barrels 5 extending to the inner ends of the fixed plates 11 are respectively installed on the outer ends of the two fixed plates 11. Through the quartz barrels 5, a plasma generation space is provided, and two Faraday barrier covers 6 are respectively installed on the annular ends of the two quartz barrels 5. Through the Faraday barrier cover 6, it is used to shield DC electric field or low - frequency electric field interference. Then two fixed brackets 8 respectively arranged on the outer ends of the two fixed plates 11 are respectively installed on the annular ends of the two Faraday barrier covers 6. Through the fixed bracket 8, an installation carrier is provided for components such as the Faraday barrier cover 6;

[0041] Two gas shower nozzles 4 extending into the quartz barrel 5 and located in two radio frequency shielding covers 2 respectively are installed on the outer ends of two fixing brackets 8. Through the gas shower nozzles 4, gas is evenly sprayed outwards. Two coils 7 located in two radio frequency shielding covers 2 respectively are installed on the annular ends of two fixing brackets 8. Through the coils 7, an alternating magnetic field is generated. Then, two fixed capacitors 81 located in two radio frequency shielding covers 2 respectively and electrically connected to two coils 7 are installed on the outer ends of two fixing brackets 8. Two adjustable capacitors 82 located in two radio frequency shielding covers 2 respectively and electrically connected to two fixed capacitors 81 are arranged on the outer ends facing away from two fixed capacitors 81. And two adjustable capacitors 82 are respectively electrically connected to two radio frequency matchers 3. The fixed capacitor 81 and the adjustable capacitor 82 are used in cooperation. By taking advantage of the complementary characteristics of their "fixed capacitance reference" and "dynamic capacitance adjustment", various precise control or dynamic adjustment functions are realized in the circuit;

[0042] Two connectors 41 located in two radio frequency shielding covers 2 respectively are connected and installed on the outer ends of two gas shower nozzles 4. Through the connectors 41, gas is conveyed into the gas shower nozzles 4. Two special gas distribution cabinets are respectively connected and arranged with two connectors 41 through air pipes. Through the special gas distribution cabinets, special gases are precisely controlled and distributed. Then, two radio frequency power supplies are respectively connected to two radio frequency matchers 3 through radio frequency cables. Through the radio frequency power supplies, electric energy is provided;

[0043] Two supporting plates 9 are respectively installed on the front and rear inner walls inside the processing cylinder 1. The two supporting plates 9 are used in cooperation to provide a processing carrier for the arc-shaped notch grooves 91. Arc-shaped notch grooves 91 extending to the upper and lower ends of the supporting plates 9 respectively are recessed outwards on the inner end faces of the supporting plates 9. Through the arc-shaped notch grooves 91, the supporting plates 9 are prevented from blocking the glued local areas on the lower end faces of the wafers 10. Arc-shaped supporting grooves 92 extending to the inner ends of the supporting plates 9 are recessed downwards on the upper end faces of the supporting plates 9. The two arc-shaped supporting grooves 92 are used in cooperation to lift the wafers 10;

[0044] A plurality of grooves 96 are recessed outwards on the inner wall surfaces of the arc-shaped supporting grooves 92. Through the grooves 96, installation spaces are provided for components such as cylinders 94. A plurality of cylinders 94 are respectively slidably connected in a plurality of grooves 96. Through the cylinders 94, installation carriers are provided for ball heads 93. And a plurality of ball heads 93 extending outside the grooves 96 and integrally structured with the cylinders 94 are respectively arranged on the inner ends of a plurality of cylinders 94. The plurality of ball heads 93 are used in cooperation to restrict the lifted wafers 10. Then, elastic members 95 with the other ends connected to the inner wall surfaces of the grooves 96 are installed on the outer ends of the cylinders 94. Through the elastic members 95, the cylinders 94 and the ball heads 93 are returned to their original positions. The elastic members 95 can be springs.

[0045] In use, first place multiple wafers 10 to be degummed into the wafer cassette in sequence and in an orderly manner. Then start the manipulator. The manipulator works to pick up the uppermost wafer 10 to be degummed in the wafer cassette, and inserts the picked-up wafer 10 to be degummed into the processing cylinder 1 through the feed port 12. Then place the wafer 10 to be degummed into the lifting groove formed by two arc-shaped brackets 92, so as to perform limit lifting placement on the wafer 10 to be degummed;

[0046] When the wafer 10 to be degummed is placed towards the inner bottom end of the lifting groove, the wafer 10 to be degummed first contacts multiple ball heads 93. Then, under the action of the weight of the wafer 10 to be degummed itself, the multiple ball heads 93 move outwards, and further the multiple cylinders 94 move outwards along the multiple grooves 96 respectively, thereby compressing the multiple elastic members 95 and making the elastic members 95 generate elastic force;

[0047] When the wafer 10 to be degummed moves to the lower end of the ball head 93 and contacts the inner bottom end of the lifting groove, under the elastic force of the elastic member 95, the cylinder 94 moves inwards, and further the ball head 93 moves inwards, thereby applying a downward pressure to the upper edge position of the wafer 10 to be degummed by the multiple ball heads 93, realizing restricted installation of the wafer 10 to be degummed, effectively reducing the probability of the wafer 10 jumping due to the contact factors between the upper and lower surfaces of the wafer 10 and the plasma, effectively reducing the probability of the wafer 10 falling during degumming, and effectively ensuring the degumming efficiency, quality and effect;

[0048] After the wafer 10 to be degummed is restrictedly installed in the processing cylinder 1, connect the circuits between the two RF power supplies and the two RF matchers 3. Then, with the assistance of the fixed capacitor 81 and the adjustable capacitor 82, high-frequency alternating current adjusted to appropriate parameters is respectively supplied to the two coils 7, and the high-frequency alternating current is dynamically adjusted at any time. Then the two coils 7 respectively form alternating magnetic fields in the two quartz barrels 5;

[0049] At the same time, use two sets of special gas distribution cabinets to precisely control and distribute special gases, and transport them into the two gas shower nozzles 4 through the gas pipes and connectors 41. Then the two gas shower nozzles 4 respectively spray the special gases into the two quartz barrels 5. Under the action of the magnetic field, the gases in the two quartz barrels 5 are both ionized, and then high-density plasma is generated in the two quartz barrels 5, so as to spray towards the upper and lower ends of the wafer 10 to be degummed restrictedly installed in the processing cylinder 1;

[0050] Moreover, the plasma density is much higher than that in reactive ion etching, so that high-density plasma can efficiently generate a large number of active particles (free radicals, ions, electrons), which then carry out oxidation / decomposition reactions with the hydrocarbons in the photoresist attached to the upper and lower ends of the wafer 10 to be de-glued, and generate volatile gases such as CO. Also, the fluorine-containing gas in the special gas comes into contact with the upper and lower ends of the wafer 10 to be de-glued, reacts with the inorganic residues formed due to de-gluing at the upper and lower ends of the wafer 10, and generates volatile products such as SiF4. At this time, equipment such as a pump is used to extract the volatile gases generated in the reaction chamber;

[0051] Thus, a non-contact dry de-gluing treatment is carried out on the upper and lower end faces of the wafer 10. By using the chemical reaction between the active particles and the photoresist, the de-gluing operation is efficiently and precisely carried out on the upper and lower end faces of the wafer 10 at the same time, effectively reducing the probabilities of residues and damages occurring to the wafer 10 due to de-gluing, effectively reducing the problem of waste liquid treatment generated due to de-gluing, and effectively ensuring the de-gluing efficiency, quality and effect.

[0052] After the de-gluing is completed, the manipulator is inserted into the processing cylinder 1 again, and the wafer 10 is lifted upward, then the ball head is pressed into the corresponding groove, and then the wafer 10 is separated from the lifting groove, and the wafer 10 is taken out of the processing cylinder 1 and then placed into another wafer cassette, thus completing the de-gluing operation of the wafer 10.

[0053] Although this specification is described according to the embodiments, not each embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A single-chip double-sided simultaneous contactless dry degumming machine device, characterized in that Comprising: A processing cylinder (1), with fixing plates (11) provided at both the upper and lower ends of the processing cylinder (1); RF shielding covers (2), there are two RF shielding covers (2), and the two RF shielding covers (2) are respectively installed on the outer ends of the two fixing plates (11); RF matchers (3), there are two RF matchers (3), and the two RF matchers (3) are respectively installed on the outer ends of the two RF shielding covers (2); A clamping member, connected to the inside of the processing cylinder (1); Quartz cylinders (5), there are two quartz cylinders (5), and the two quartz cylinders (5) are respectively installed on the outer ends of the two fixing plates (11), and the quartz cylinders (5) extend to the inner ends of the fixing plates (11); Faraday barrier covers (6), there are two Faraday barrier covers (6), and the two Faraday barrier covers (6) are respectively installed on the annular ends of the two quartz cylinders (5); Fixing brackets (8), there are two fixing brackets (8), and the two fixing brackets (8) are respectively installed on the annular ends of the two Faraday barrier covers (6), and the two fixing brackets (8) are respectively arranged on the outer ends of the two fixing plates (11); Gas shower nozzles (4), there are two gas shower nozzles (4), and the two gas shower nozzles (4) are respectively installed on the outer ends of the two fixing brackets (8), and the gas shower nozzles (4) extend into the quartz cylinders (5), and the two gas shower nozzles (4) are respectively located within the two RF shielding covers (2); Electromagnetic induction members, there are two electromagnetic induction members, and the two electromagnetic inductions are respectively installed on the annular ends of the two fixing brackets (8), and the two electromagnetic induction members are respectively located within the two RF shielding covers (2), and the two electromagnetic induction members are respectively electrically connected to the two RF matchers (3).

2. The dry stripping machine device for single-sided and double-sided simultaneous stripping without contact according to claim 1, characterized in that: The electromagnetic induction member includes a coil (7), the coil (7) is arranged on the annular end of the fixing bracket (8), a fixed capacitor (81) is installed on the outer end of the fixing bracket (8), and the fixed capacitor (81) is electrically connected to the coil (7), an adjustable capacitor (82) is arranged on the outer end of the fixed capacitor (81), and the adjustable capacitor (82) is respectively electrically connected to the fixed capacitor (81) and the RF matcher (3).

3. The dry-process adhesive stripping machine for simultaneous double-sided adhesive stripping of a single wafer without contact according to claim 1 is characterized in that: Installation joints (41) are connected and installed at the outer ends of the two gas shower nozzles (4), and the two joints (41) are respectively connected to two special gas distribution cabinets through air pipes.

4. The dry stripping machine device for single-chip double-sided simultaneous stripping without contact according to claim 1, characterized in that: The two RF matchers (3) are respectively connected to two RF power supplies through RF cables.

5. The dry stripping machine device for single-sided and double-sided simultaneous stripping without contact according to claim 1, wherein: The clamping member includes two support plates (9), the two support plates (9) are respectively installed on the front and rear inner walls inside the processing cylinder (1), arc-shaped notch grooves (91) are formed by inward depressions on the inner end faces of the support plates (9), and the arc-shaped notch grooves (91) respectively extend to the upper and lower ends of the support plates (9), arc-shaped support grooves (92) are formed by downward depressions on the upper end faces of the support plates (9), and the arc-shaped support grooves (92) extend to the inner ends of the support plates (9).

6. The dry stripping machine device for single-chip double-sided simultaneous stripping without contact according to claim 5, characterized in that: The inner wall surface of the arc-shaped bracket (92) is recessed outward to form a plurality of grooves (96). A cylinder (94) is slidably connected in each of the plurality of grooves (96). A ball head (93) is arranged at the inner end of the cylinder (94), and the ball head (93) extends out of the outer side of the groove (96). The cylinder (94) and the ball head (93) are of an integrated structure. An elastic member (95) is installed at the outer end of the cylinder (94), and the other end of the elastic member (95) is connected to the inner wall of the groove (96).

7. The dry stripping machine device for single-sided and double-sided simultaneous stripping without contact according to claim 1, wherein: The right end surface of the processing cylinder (1) is recessed leftward to form a feed inlet (12), and the feed inlet (12) extends to the inner wall of the processing cylinder (1). The feed inlet (12) is arranged facing the direction of the manipulator.

Images