Three-dimensional processing method and device
Through the three-dimensional three-dimensional processing method of slicing software and visual devices combined with ultra-high-speed scanning galvanometers, the problem that traditional galvanometers cannot handle three-dimensional processing is solved, and efficient and precise processing of complex structures is achieved.
Patent Information
- Application Number
- CN202411888050.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-07-29
AI Technical Summary
Traditional ultra-high-speed scanning galvanometers can only process two-dimensional plan views, limiting their application in three-dimensional three-dimensional processing.
The subtractive material model is generated through the slice software, combined with the visual device positioning and the high-precision positioning and feeding mechanism of the ultra-high-speed scanning galvanometer, the three-dimensional processing characteristics are transformed into planar slices, and layer-by-layer scanning processing is performed based on laser parameters and slice spacing.
It realizes efficient and precise processing of complex three-dimensional structures, and is suitable for processing of a variety of materials and complex features.
Smart Images
Figure CN120382257A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of laser processing, and particularly relates to a three-dimensional processing method and device. Background Art
[0002] Ultra-high-speed scanning galvanometers are widely used in fast processing scenarios due to their extremely high scanning speed.
[0003] However, traditional ultra-high-speed scanning galvanometers can only process imported two-dimensional plane drawings, which limits their application in three-dimensional processing. Summary of the Invention
[0004] To solve the above problems, a first aspect of the present application provides a three-dimensional processing method, including the following steps:
[0005] S11: The slicing software generates a subtraction model based on the blank part model and the target part model;
[0006] S12: Obtain processing parameters based on the laser parameters and the processing material of the blank part; the processing parameters include the removal rate and the slicing spacing;
[0007] S13: Process the subtraction model based on the slicing spacing to generate horizontal slice layers; generate corresponding multiple pictures based on the horizontal slice layers;
[0008] S14: Locate the blank part model based on the vision device, and the slicing software obtains the positioning information and compares it with the subtraction model to obtain the processing position;
[0009] S15: The ultra-high-speed scanning galvanometer processes the blank part based on the pictures, the processing parameters, and the processing position to obtain the target part.
[0010] Wherein, the slicing software obtains the pictures and analyzes the pictures, and the slicing software judges whether the pictures are processable based on the analysis results.
[0011] Wherein, the slicing software overlaps the blank part model and the target part model through Boolean operation to generate the subtraction model, and the slicing software retains the relative position of the subtraction model and the blank part model.
[0012] Wherein, the processing parameters are saved in the processing parameter database, the ultra-high-speed scanning galvanometer obtains the processing parameters each time it scans a picture, and the ultra-high-speed scanning galvanometer controls the moving distance based on the slicing spacing.
[0013] Among them, generating the horizontal slice layer by processing the subtractive model based on the slice spacing further includes cropping the non-machining area and generating positioning data for each picture, where the positioning data includes planar position, height position, and sequence information.
[0014] Among them, the blank part is placed on the processing platform, the processing platform can move along the X-axis, and the ultra-high-speed scanning galvanometer can move along the Z-axis.
[0015] The second aspect of this application further provides a three-dimensional machining device, which can apply the three-dimensional machining method described in any one of the above, including: a box body, a vision device, an ultra-high-speed scanning galvanometer, a blank part, and a processing platform; the box body can move along the Z-axis, and the processing platform can move along the X-axis and the Y-axis; the vision device and the ultra-high-speed scanning galvanometer are installed on one side of the box body close to the processing platform; the blank part is placed on one side of the processing platform close to the box body, and the movement of the blank part is controlled based on the movement of the processing platform, and the movement of the vision device and the ultra-high-speed scanning galvanometer is controlled based on the movement of the box body.
[0016] The third aspect of this application further provides an electronic device, which includes: a memory and a processor coupled to each other, and the processor is used to execute program instructions stored in the memory to implement the three-dimensional machining method described in any one of the above.
[0017] The fourth aspect of this application further provides a computer-readable storage medium, which stores program data, and the program data can be executed by a processor to implement the three-dimensional machining method described in any one of the above.
[0018] The beneficial effects of the present invention: Different from the prior art, the three-dimensional machining method of the present invention includes: S11: The slicing software generates a subtractive model based on the blank part model and the target part model; S12: Obtain machining parameters based on the laser parameters and the machining material of the blank part; the machining parameters include the removal rate and the slice spacing; S13: Process the subtractive model based on the slice spacing to generate a horizontal slice layer; generate corresponding multiple pictures based on the horizontal slice layer; S14: Obtain the positioning of the blank part model based on the vision device, and the slicing software obtains the positioning information and compares it with the subtractive model to obtain the machining position; S15: The ultra-high-speed scanning galvanometer processes the blank part based on the pictures, machining parameters, and machining position to obtain the target part. By converting the three-dimensional machining features into planar slices and combining the high-precision positioning and feeding mechanism of the ultra-high-speed scanning galvanometer, the efficient and precise machining of complex three-dimensional structures is realized. Description of the Drawings
[0019] Figure 1 It is a schematic flowchart of an embodiment of the three-dimensional machining method provided by this application;
[0020] Figure 2 Schematic comparison diagram of a set of non - machinable feature embodiments and a set of machinable feature embodiments provided for this application;
[0021] Figure 3 For Figure 2 Schematic diagram of a slice of sample 2 in
[0022] Figure 4 Schematic flow diagram of another embodiment of the three - dimensional machining method provided for this application;
[0023] Figure 5 Schematic structural diagram of an embodiment of the three - dimensional machining device provided for this application;
[0024] Figure 6 Schematic structural diagram of an embodiment of the computer device of this application;
[0025] Figure 7 Schematic structural diagram of an embodiment of the computer - readable storage medium of this application. Detailed implementation manners
[0026] The following are specific embodiments of the present invention and in combination with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.
[0027] This application proposes a new three - dimensional machining method to solve the problem of inability to achieve precise machining of complex three - dimensional structures in the prior art; the three - dimensional machining method of this application can act on basic machining features such as planes, grooves, holes, through - grooves, through - holes, countersunk holes, etc., and can also achieve machining of complex machining features such as deep - depth curved surfaces, spherical surfaces, inclined surfaces, serrated shapes, etc.; the three - dimensional machining method of this application can be used for CFRP and CMC material machining, and is also applicable to the machining of other non - homogeneous ceramic - matrix composites, resin - matrix composites, metal - matrix composites and homogeneous inorganic materials and organic materials.
[0028] As Figure 1 shown, Figure 1 Schematic flow diagram of an embodiment of the three - dimensional machining method provided for this application, including the following steps:
[0029] S11: The slicing software generates a subtractive model based on the blank part model and the target part model; the slicing software first reads the 3D model files of the target part and the blank part, and converts these model data into a data structure that can be processed inside the software; the slicing software generates a subtractive model by analyzing and processing the data structure; the part model can be in formats such as STP, STL or OBJ, and no limitation is made thereto.
[0030] S12: Obtain processing parameters based on laser parameters and the processing material of the blank part; the laser parameters include: laser power, laser frequency, laser pulse width, and laser spot size; analyze parameters such as the thermal conductivity, type, and melting point of the processing material; the processing parameters include the removal rate and the slice spacing; the removal rate can be obtained through experimental data or formulas; the removal rate is related to the laser power, laser frequency, laser pulse width, laser spot size, and material properties; the slice spacing should be equal to the thickness of the material removed in each scan to ensure that the material surface remains flat after each scan; in one embodiment, the removal rate database is established by experimentally testing the removal rates under different laser parameters and material properties; the corresponding removal rate is obtained based on the acquired laser parameters and material properties.
[0031] S13: Generate horizontal slice layers by processing the subtractive model based on the slice spacing; according to the set slice spacing, perform horizontal cutting on the subtractive model to generate a series of parallel slice layers. Each slice layer is a cross-section of the subtractive model; the slice spacing between any two adjacent slices is the same, and the thickness of each slice layer is the same, ensuring that after each laser scan, the material surface always remains on a new, flat slice layer, thus ensuring the continuity and accuracy of processing. Generate corresponding multiple pictures based on the horizontal slice layers, for example, convert each layer of slice into an 8-bit black and white BMP format picture. The specific form of the picture is not limited here, and any picture format that can be recognized by the ultra-high-speed scanning galvanometer is within the protection scope of this application.
[0032] S14: Locate the blank part model based on the vision device, for example, the vision device includes a lidar and a camera; the vision device obtains the three-dimensional coordinate information of the blank part, and the vision device transmits the obtained three-dimensional coordinate information of the blank part to the slicing software; the slicing software obtains the positioning information and compares it with the subtractive model to obtain the processing position; the vision device extracts the key feature points of the blank part through image processing algorithms, such as edges, corner points, etc.
[0033] Determine the deviation between the actual position of the blank part and the ideal position of the subtractive model through the comparison of the positioning information and the subtractive model, and the slicing software then calculates the actual processing position of each slice layer on the blank part.
[0034] S15: The ultra-high-speed scanning galvanometer processes the blank part based on the pictures, processing parameters, and processing position to obtain the target part; the ultra-high-speed scanning galvanometer performs laser scanning layer by layer from top to bottom based on the pictures, processing parameters, and processing position, and descends a slice spacing after each scan until all layers are processed.
[0035] In summary, the three-dimensional machining method of this embodiment includes: S11: The slicing software generates a subtractive model based on the blank part model and the target part model; S12: Obtain machining parameters based on the laser parameters and the machining material of the blank part; the machining parameters include the removal rate and the slicing pitch; S13: Process the subtractive model based on the slicing pitch to generate horizontal slice layers; generate corresponding multiple pictures based on the horizontal slice layers; S14: Locate the blank part model based on the vision device, and the slicing software obtains the positioning information and compares it with the subtractive model to obtain the machining position; S15: The ultra-high-speed scanning galvanometer processes the blank part based on the pictures, machining parameters and machining position to obtain the target part. By converting the three-dimensional machining features into planar slices and combining the high-precision positioning and feeding mechanism of the ultra-high-speed scanning galvanometer, the efficient and precise machining of complex three-dimensional structures is realized.
[0036] In one embodiment, the slicing software acquires pictures and analyzes the pictures. The slicing software determines whether the pictures are processable based on the analysis results; converts each slice layer into an 8-bit black-and-white BMP format that can be recognized by the ultra-high-speed scanning galvanometer. As Figure 2 shown, Figure 2 is a comparison schematic diagram of a group of unprocessable feature embodiments and a group of processable feature embodiments provided by this application;
[0037] The following analyzes Sample 1 in the unprocessable features:
[0038] The white area is the overlapping part of the target part model and the blank part model. If Sample 1 is laser scanned; the planar shape of Sample 1 is a trapezoid, and the shorter side is the closest to the ultra-high-speed scanning galvanometer, that is, if Sample 1 is laser scanned, it is necessary to first scan the shorter side until the longer side is scanned; however, in the actual process, this method will increase the material removal rate and cumulative error, and the laser will scan repeatedly.
[0039] Based on the analysis results, the slicing software determines whether each picture is processable; if there are unprocessable areas or quality problems in the pictures, the slicing software will mark these pictures and prompt the user to make adjustments or regenerate the slices.
[0040] For the processable pictures, the slicing software generates corresponding positioning data; as Figure 3 shown, Figure 3 is Figure 2 the slice schematic diagram of Sample 2 in
[0041] Sample 2 is divided into six slices. It should be clear that the thickness of each slice layer is the same, and the slicing pitch between adjacent two slice layers is also the same, but the size relationship between the slicing pitch and the slice layer thickness is not limited.
[0042] In one embodiment, the slicing software overlaps the blank part model and the target part model through Boolean operations to generate a subtractive model, and the slicing software retains the relative position between the subtractive model and the blank part model; by retaining the relative position between the subtractive model and the blank part model, it is possible to ensure that the position and orientation of each sliced layer during the machining process are exactly the same as the design requirements, avoiding position deviation; the relative position between the subtractive model and the blank part model remains consistent, ensuring that the finally machined part precisely matches the target part model. The working principle of Boolean operations is common knowledge to those skilled in the art and will not be elaborated here.
[0043] In one embodiment, the machining parameters are saved to the machining parameter database. Each time the ultra-high-speed scanning galvanometer scans a picture, it obtains the machining parameters, and the ultra-high-speed scanning galvanometer controls the moving distance based on the slice spacing; the moving distance of the ultra-high-speed scanning galvanometer is the same as the slice spacing. For example, if the slice spacing is 1 mm, after the ultra-high-speed scanning galvanometer finishes scanning one slice, it descends 1 mm and proceeds to scan the next slice.
[0044] The latest machining parameters are obtained from the database before each scan to ensure that the parameters for each scan are consistent, avoiding machining errors caused by inconsistent parameters.
[0045] The machining parameters are saved in the database, which can be quickly called, reducing the time for parameter setting and improving the machining efficiency. The machining parameter database can conveniently store and manage a large number of machining parameters, facilitating subsequent calling and traceability.
[0046] In one embodiment, generating horizontal sliced layers by processing the subtractive model based on the slice spacing further includes cropping the non-machining area and generating positioning data for each picture. The positioning data includes planar position, height position, and sequence information. The planar position represents the coordinate position of the picture on the XY plane; the height position represents the height position of the picture on the Z axis, i.e., the height of the current sliced layer; the sequence information represents the order of the picture during the overall machining process to ensure the correct machining order.
[0047] By cropping the non-machining area, the ineffective area of laser scanning can be reduced, improving the machining efficiency. The cropped pictures can generate a more concise laser path, reducing path intersections and overlaps, and further increasing the machining speed; the generated positioning data ensures that the planar position, height position, and sequence information of each picture are accurate, avoiding machining errors caused by position deviation.
[0048] In one embodiment, the blank part is placed on the processing platform. The processing platform can move along the X-axis, the ultra-high-speed scanning galvanometer can move along the Z-axis, and the processing platform can also move along the Y-axis. By moving the processing platform, the ultra-high-speed scanning galvanometer and the blank part are in the same plane position. By moving the ultra-high-speed scanning galvanometer along the Z-axis, the relative height with the blank part is adjusted to achieve the scanning of different sliced layers. In other embodiments, the processing platform can move along the X-axis, Y-axis, and Z-axis, and the ultra-high-speed scanning galvanometer is fixed. The relative height between the blank part and the ultra-high-speed scanning galvanometer is adjusted by moving the processing platform, and no specific limitation is made thereto.
[0049] Second Embodiment:
[0050] As Figure 4 shown, Figure 4 FIG. is a schematic flowchart of another embodiment of the three-dimensional machining method provided by the present application. The working process of the three-dimensional machining method of this embodiment is described in detail below:
[0051] The blank part model and the target part model are input into the slicing software. The slicing software reads the blank part model and the target part model and generates a subtractive model through Boolean operation;
[0052] Based on the laser parameters and the processing material, the single-scan removal depth is determined, and then the slice spacing is determined. The laser parameters generate a processing parameter database. The subtractive model generates horizontal sliced layers based on the slice spacing. The horizontal sliced layers are converted into the BMP format, and the BMP images are trimmed. The slicing software determines the relative positioning of the machining dimensions through the BMP images and the subtractive model.
[0053] The vision device scans and locates the workpiece, that is, the vision device scans the blank part to obtain three-axis positioning information. Based on the three-axis positioning information, the horizontal sliced layers, and the BMP images, the positioning data of each slice of the BMP is determined, and further a process file is formed;
[0054] The process file calls the parameters in the processing parameter database, and the slicing software transmits the process file to the ultra-high-speed scanning galvanometer and the machine tool control system. According to the information in the process file, the ultra-high-speed scanning galvanometer performs laser scanning layer by layer from top to bottom. After each scan, the galvanometer descends a distance of one slice spacing along the Z-axis until the scanning of all slices is completed.
[0055] The present application also provides a three-dimensional machining device. As Figure 5 shown, Figure 5 FIG. is a schematic structural diagram of an embodiment of the three-dimensional machining device provided by the present application, including: a box body 1, a vision device 2, an ultra-high-speed scanning galvanometer 3, a blank part 5, and a processing platform 6;
[0056] The box body 1 can move along the Z-axis, and the processing platform 6 can move along the X-axis and the Y-axis; a vision device 2 and an ultra-high-speed scanning galvanometer 3 are installed on one side of the box body 1 close to the processing platform 6; the blank part 5 is placed on one side of the processing platform 6 close to the box body 1, the movement of the blank part 5 is controlled based on the movement of the processing platform 6, and the movement of the vision device 2 and the ultra-high-speed scanning galvanometer 3 is controlled based on the movement of the box body 1; the blank part 5 is scanned based on the light beam 4 generated by the ultra-high-speed scanning galvanometer 3.
[0057] Through the precise control of the X, Y, and Z axes, three-dimensional precise positioning of the processing position can be achieved, thereby improving the processing accuracy; compared with single-axis movement, multi-axis coordinated movement can distribute movement errors more evenly and reduce the influence of cumulative errors.
[0058] For the above embodiments, the present application provides a computer device. Please refer to Figure 6 , Figure 6 which is a schematic structural diagram of an embodiment of the computer device of the present application. The computer device includes a memory and a processor. Among them, the memory and the processor are coupled to each other. Program data is stored in the memory, and the processor is used to execute the program data to implement the steps of any one of the above three-dimensional stereoscopic processing methods.
[0059] In this embodiment, the processor can also be called a CPU (Central Processing Unit, central processing unit). The processor may be an integrated circuit chip with signal processing capabilities. The processor may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.
[0060] For the method of the above embodiments, it can be implemented in the form of a computer program. Therefore, the present application proposes a computer-readable storage medium. Please refer to Figure 7 , Figure 7 which is a schematic structural diagram of an embodiment of the computer-readable storage medium of the present application. Program data that can be run by the processor is stored in the computer-readable storage medium, and the program data can be executed by the processor to implement the steps of any one of the above three-dimensional stereoscopic processing methods.
[0061] The computer-readable storage medium of this embodiment can be a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disc, etc., which can store program data. Or it can also be a server storing the program data. The server can send the stored program data to other devices for running, or it can also run the stored program data by itself.
[0062] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.
Claims
1. A three-dimensional solid processing method, characterized in that, It includes the following steps: S11: The slicing software generates a subtractive model based on the blank part model and the target part model; S12: Obtain processing parameters based on the laser parameters and the processing material of the blank part; the processing parameters include the removal rate and the slicing pitch; S13: Process the subtractive model based on the slicing pitch to generate horizontal slice layers; generate corresponding multiple pictures based on the horizontal slice layers; S14: Locate the blank part model based on the vision device, and the slicing software obtains the positioning information and compares it with the subtractive model to obtain the processing position; S15: The ultra-high-speed scanning galvanometer processes the blank part based on the pictures, the processing parameters and the processing position to obtain the target part.
2. The three-dimensional machining method according to claim 1, characterized in that The slicing software obtains the pictures and analyzes the pictures, and the slicing software judges whether the pictures are processable based on the analysis results.
3. The three-dimensional machining method according to claim 2, characterized in that, The slicing software overlaps the blank part model and the target part model through Boolean operation to generate the subtractive model, and the slicing software retains the relative position of the subtractive model and the blank part model.
4. The three-dimensional machining method according to claim 3, wherein The processing parameters are saved to the processing parameter database, the ultra-high-speed scanning galvanometer obtains the processing parameters each time it scans a picture, and the ultra-high-speed scanning galvanometer controls the moving distance based on the slicing pitch.
5. The three-dimensional machining method according to claim 4, characterized in that, Processing the subtractive model based on the slicing pitch to generate horizontal slice layers further includes cropping the non-processing area and generating the positioning data of each picture, and the positioning data includes the plane position, the height position and the sequence information.
6. The three-dimensional machining method according to claim 5, characterized in that, The blank part is placed on the processing platform, the processing platform can move along the X axis, and the ultra-high-speed scanning galvanometer can move along the Z axis.
7. A three-dimensional machining device applicable to the three-dimensional machining method according to any one of claims 1-6, characterized in that, It includes: A box body, a vision device, an ultra-high-speed scanning galvanometer, a blank part and a processing platform; the box body can move along the Z axis, the processing platform can move along the X axis and the Y axis; the vision device and the ultra-high-speed scanning galvanometer are installed on one side of the box body close to the processing platform; the blank part is placed on one side of the processing platform close to the box body, and the movement of the blank part is controlled based on the movement of the processing platform, and the movement of the vision device and the ultra-high-speed scanning galvanometer is controlled based on the movement of the box body.
8. An electronic device, characterized in that, The electronic device includes: a memory and a processor coupled to each other, and the processor is used to execute the program instructions stored in the memory to implement the three-dimensional machining method according to any one of claims 1-6.
9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores program data, and the program data can be executed by the processor to implement the three-dimensional machining method according to any one of claims 1-6.