Optical sensor device, optical sensor circuit and electronic device
By using a combined structure of a printed circuit, a first heat insulating part and a heat conduction device in the optical sensor device, the influence of heat change in the heater device on temperature detection is solved, and a more accurate temperature sensing is achieved.
Patent Information
- Application Number
- CN202411372429.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-29
- Filing Date
- 2024-09-29
- Publication Date
- 2025-07-29
AI Technical Summary
The performance of traditional optical sensor circuits is affected by temperature differences adjacent to the heater device, resulting in inaccurate temperature detection operations.
The combined structure of a printed circuit, a first heat insulating portion and a heat conduction device is employed to isolate and uniformly dissipate the heat of the heater device to reduce the temperature influence on the optical sensor device.
The temperature detection accuracy of the optical sensor device is improved, and the temperature sensing error caused by heat changes in the heat of the heater device is reduced.
Smart Images
Figure CN120385431A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to an optical sensor mechanism, and particularly to an optical sensor device, an optical sensor circuit, and an electronic device. Background Art
[0002] Generally, the performance of a conventional optical sensor circuit is affected by an adjacent heater device. For example, a conventional optical sensor circuit can be used as a temperature detection sensor, which can be used to sense the temperature of an object appearing in the field of view of the conventional optical sensor circuit. If the temperature difference provided by an adjacent heater device is large, the accuracy of the temperature detection operation will be affected, that is, the result of the temperature detection operation will be inaccurate. Summary of the Invention
[0003] Therefore, one of the objectives of the present application is to disclose an optical sensor device to solve the above problems.
[0004] According to an embodiment of the present application, an optical sensor device disposed on a heater device and heated by the heater device is disclosed. The optical sensor device includes a printed circuit, an optical sensor circuit, a first heat insulation portion, and a heat conduction device. The optical sensor circuit is disposed on the top surface of the printed circuit. The first heat insulation portion has a top surface contacting the bottom surface of the printed circuit. The heat conduction device has a first portion and a second portion. The first portion of the heat conduction device is disposed between the first heat insulation portion and the top surface of the heater device, and the second portion of the heat conduction device surrounds the optical sensor circuit.
[0005] According to an embodiment of the present application, an optical sensor circuit of an optical sensor device is further disclosed. The optical sensor device is disposed on a heater device and heated by the heater device. The optical sensor device further includes a printed circuit, a first heat insulation portion, and a heat conduction device. The optical sensor circuit is disposed on the top surface of the printed circuit. The top surface of the first heat insulation portion contacts the bottom surface of the printed circuit. The heat conduction device has a first portion and a second portion. The first portion of the heat conduction device is disposed between the first heat insulation portion and the top surface of the heater device, and the second portion of the heat conduction device surrounds the optical sensor circuit.
[0006] According to an embodiment of the present application, an electronic device is further disclosed. The electronic device includes a housing, an infrared sensor circuit, and a heat insulating material. The infrared sensor circuit is disposed inside the housing and is configured to sense the temperature of an object outside the housing. The infrared sensor circuit is indirectly in contact with the housing. The heat insulating material is disposed between the infrared sensor circuit and the housing. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 FIG. is a schematic diagram of an electronic device of an optical sensor device according to a first embodiment of the present application.
[0008] Figure 2 FIG. is a schematic diagram of an electronic device of an optical sensor device according to a second embodiment of the present application.
[0009] Figure 3 FIG. is a schematic diagram of an electronic device of an optical sensor device according to a third embodiment of the present application.
[0010] Figure 4 FIG. is a schematic diagram of an electronic device of an optical sensor device according to a fourth embodiment of the present application.
[0011] Figure 5 FIG. is a schematic diagram of an electronic device of an optical sensor device according to a fifth embodiment of the present application.
[0012] Figure 6 FIG. is a schematic diagram of a sub-device such as an optical sensor device according to a sixth embodiment of the present application.
[0013] Figure 7 FIG. is a schematic diagram of an electronic device of an optical sensor device according to a seventh embodiment of the present application.
[0014] Figure 8 FIG. is an exemplary schematic diagram of an electronic device of an optical sensor device according to another different embodiment of the present application.
[0015] Wherein, the reference numerals are explained as follows:
[0016] Optical sensor devices 100, 200, 300, 400, 500, 600, 700, 800
[0017] Heater device 101
[0018] Printed circuit 105
[0019] Optical sensor circuit 110
[0020] First heat insulation part 115A
[0021] Second heat insulation part 115B
[0022] Thermal conduction device 120
[0023] Parts 120A and 120B of the thermal conduction device Detailed implementation manner
[0024] This application aims to disclose an optical sensor device that can effectively shield the heat of a heater device from the optical sensor device and evenly dissipate the heat generated by the heater device, so as to alleviate the problem that the temperature sensed by the optical sensor device changes due to the heat of the heater device.
[0025] Figure 1 It is a schematic diagram of the overall appearance and cross-section of an electronic device, such as an optical sensor device 100, according to an embodiment of the present application. As Figure 1 shown, the optical sensor device 100 is, for example, disposed on a heater device 101 as shown in Figure 1 and is heated by the heater device 101. The heater device 101 can use a significantly varying temperature range to heat the optical sensor device 100 through the bottom surface of the optical sensor device 100. For example (but not limited to), the heating temperature provided by the heater device 101 can vary from a lower temperature value (e.g., 20 °C) to a higher temperature value (e.g., 85 °C), and then rapidly change from the higher temperature value (e.g., 85 °C) to the lower temperature value (e.g., 20 °C).
[0026] To avoid the significantly varying heating temperature from affecting the performance of the optical sensor device 100, the optical sensor device 100 is arranged to shield the heat of the heater device 101 from the optical sensor device 100 and evenly dissipate the heat generated from the heater device 101. In practical applications, as Figure 1 shown, the optical sensor device 100 includes a printed circuit 105 (such as a flexible printed circuit (FPC) or a printed circuit board (PCB)), an optical sensor circuit 110 mounted and disposed on the top surface of the printed circuit 105, a first heat insulation part 115A, a second heat insulation part 115B, and a thermal conduction device 120.
[0027] The first heat insulation part 115A is, for example, a bottom heat insulation part (compared with the position of the optical sensor circuit 110), which has a top surface that contacts and is fixed to the bottom surface of the printed circuit 105, and a bottom surface of the first heat insulation part 115A contacts and is fixed to a part 120A of the thermal conduction device 120. For example, the top surface of the first heat insulation part 115A can be equal to or larger than the bottom surface of the printed circuit 105 to shield the heat of the heater device 101 transmitted and passed through the part 120A of the thermal conduction device 120.
[0028] The second heat insulation part 115B is, for example, a top heat insulation part (compared with the position of the optical sensor circuit 110), which has a top surface contacting and fixing another part 120B of the heat conduction device 120, and it has a bottom surface, and a part of the bottom surface is used to contact and fix a part of the top surface of the optical sensor circuit 110. The second heat insulation part 115B is used to shield and separate the heat of the heater device 101 transmitted and passed through the part 120B of the heat conduction device 120.
[0029] The heat conduction device 120 has a first part 120A and a second part 120B, and the first part 120A of the heat conduction device 120 is arranged between the first heat insulation part 115A and the top surface of the heater device 101. The second part 120B of the heat conduction device 120 surrounds the optical sensor circuit 110.
[0030] In this embodiment, as Figure 1 shown, for example (but not limited to), the optical sensor circuit 110 has a cylindrical shape, the cylindrical shape has a curved side surface, the optical sensor circuit 110 has a filter, and the filter is arranged on the top of the optical sensor circuit 110. The optical sensor circuit 110 is, for example, a far-infrared (FIR) sensor and can be used to detect the temperature of an object that the optical sensor circuit 110 sees and is within the field of view of the optical sensor circuit 110.
[0031] The first heat insulation part 115A can be implemented by using a sponge material, and the top surface or the bottom surface of the first heat insulation part 115A can be a circular shape or a rectangular shape (but not limited to). The top surface of the first heat insulation part 115A is used to contact the bottom surface of the printed circuit 105, and the bottom surface of the first heat insulation part 115A is used to contact and be arranged on a region of an inner surface of the first part 120A of the heat conduction device 120.
[0032] The first part 120A of the heat conduction device 120 can equivalently be used as a base to contact and fix or hold the bottom surface of the first heat insulation part 115A (i.e., the bottom heat insulation part) and support the printed circuit 105 and the optical sensor circuit 110. And the first heat insulation part 15A is used to evenly or equally dissipate the heat generated by the heater device 101 located below the optical sensor device 100. At the same time, the first heat insulation part 115A is also used to separate the printed circuit 105 from the first part 120A of the heat conduction device 120 to effectively shield the heat from the heater device 101 below the optical sensor device 100. In one embodiment, the first part 120A of the heat conduction device 120 may include a box-shaped housing, such as a lunch box-shaped base made of a specific metal material, such as an aluminum material or other metal materials that can effectively conduct heat.
[0033] In one embodiment, the second part 120B of the heat conduction device 120 may also include a box-shaped housing, such as a lunch box-shaped lid with a central circular hole. The central circular hole has a circular edge portion that is used to contact and fix the top surface of the second heat insulation part 115B (i.e., the top heat insulation part). The second heat insulation part 115B is, for example, another sponge material that is used to separate the second part 120B of the heat conduction device 120 from the optical sensor circuit 110. In one embodiment, the first part 120A of the heat conduction device 120 is used to dissipate heat evenly, and the second part 120B of the heat conduction device 120 can also be replaced by a cover case, which can be made of a non-heat-conducting material. In one embodiment, the first part 120A of the heat conduction device 120 is used to operate together with the second part 120B of the heat conduction device 120 to more evenly and effectively dissipate the heat from the optical sensor device 100 into the ambient air.
[0034] In addition, in one embodiment, the first part 120A (i.e., the bottom part) of the heat conduction device 120 may include a circular or oval substrate, and there is a raised circular portion at the top edge of the circular or oval substrate. The raised circular portion may be equivalent to a circular side wall at the top of the circular or oval substrate, as Figure 1 shown. In other embodiments, the first part 120A (i.e., the bottom part) of the heat conduction device 120 may also be only a circular or oval substrate without the raised circular portion at the top of the circular or oval substrate.
[0035] Equivalently, the second part 120B (i.e., the top part) of the heat conduction device 120 can be regarded as a rectangular lid with a central circular opening, which can be used to close the circular top and the curved side of the optical sensor circuit 110, and can also be used to close and / or fix the first part 120A (i.e., the bottom part) of the heat conduction device 120. For example, the second part 120B of the heat conduction device 120 can be attached and fixed to the first part 120A of the heat conduction device 120 by using a heat conduction paste or glue (or a non-heat conduction paste). The heat conduction paste or glue can be applied on the top of the circular side wall of the circular or oval substrate on the top of the first part 120A of the heat conduction device 120, and then the second part 120B of the heat conduction device 120 is pressed, so that the second part 120B of the heat conduction device 120 can be seamlessly contacted and fixed to the first part 120A of the heat conduction device 120 through the heat conduction paste or glue.
[0036] In addition, in an embodiment, the first part 120A of the heat conduction device 120 and the second part 120B of the heat conduction device 120 can be integrally formed without a heat conduction paste or glue, or are integrally formed as the same component. For example, in other embodiments, the first part 120A of the heat conduction device 120 and the second part 120B of the heat conduction device 120 can be integrally formed by the same component unit when the optical sensor circuit 110 can be installed inside the same component unit. In an embodiment, the heat conduction paste used can be a heat conduction composite material. In addition, for example (but not limited to), the optical sensor device 100 can be a small circuit packaging device, which, for example, has a length of 19 mm, a width of 14 mm, and a height of 5.2 mm, as Figure 1 shown.
[0037] In Figure 1 the embodiment, the second part 120B of the heat conduction device 120 further contacts the side of the printed circuit 105 by using a part of the second part 120B of the heat conduction device 120 to hold or fix the optical sensor circuit 110, so that the printed circuit 105 is correctly and accurately stuck in the second part 120B of the heat conduction device 120. As Figure 1 shown, there is an air gap between the inner side of the first part 120A of the heat conduction device 120 and the side of the first heat insulation part 115A, and there is another air gap between the inner side of the second part 120B of the heat conduction device 120 and the side of the optical sensor circuit 110.
[0038] Figure 2is a schematic diagram of the overall appearance and cross-section of an electronic device such as an optical sensor device 200 according to another embodiment of the present application. As Figure 2 shown, the thickness of the side surface of the second part 120B of the heat conduction device 120 is, for example, the same as the thickness of the side surface of the first part 120A of the heat conduction device 120 (i.e., the inner side of the heat conduction device 120). As Figure 2 shown, there is an air gap between the heat conduction device 120 and the optical sensor circuit 110.
[0039] Figure 3 is a schematic diagram of the overall appearance and cross-section of an electronic device such as an optical sensor device 300 according to another embodiment of the present application. As Figure 3 shown, the thickness of the side surface of the second part 120B of the heat conduction device 120 is, for example, the same as the thickness of the side surface of the first part 120A of the heat conduction device 120 (i.e., the inner side of the heat conduction device 120). The second part 120B of the heat conduction device 120 is used to hold or fix the optical sensor circuit 110 by using a part of the second part 120B of the heat conduction device 120 to contact the side surface of the printed circuit 105, so that the printed circuit 105 can be correctly and accurately clamped in the second part 120B of the heat conduction device 120, and the first part 120A of the heat conduction device 120 can also be used to hold or fix the first heat insulation part 115A so that the first heat insulation part 115A can be correctly and accurately clamped in the bottom 120A of the heat conduction device 120, that is, there is no air gap between the side surface of the first heat insulation part 115A and the inner side of the first part 120A of the heat conduction device 120.
[0040] Figure 4 is a schematic diagram of the overall appearance and cross-section of an electronic device such as an optical sensor device 400 according to another embodiment of the present application. As Figure 4 shown, the second heat insulation part 115B (i.e., the top heat insulation part) can be optional and not included in the optical sensor device 400. A part of the second part 120B of the heat conduction device 120 can contact the edge of the top of the optical sensor circuit 110. Additionally, in other embodiments, Figure 5 is a schematic diagram of the overall appearance and cross-section of an electronic device such as an optical sensor device 500 according to another embodiment of the present application. As Figure 5 shown, the second heat insulation part 115B can also be optional and not included in the optical sensor device 500 except. The second part 120B of the heat conduction device 120 does not contact the optical sensor circuit 110.
[0041] In addition, in other embodiments, a plurality of surface protrusions may be disposed on an outer surface of at least one of the first portion 120A and the second portion 120B of the heat conduction device 120, so as to increase the total surface area of heat conduction of the heat conduction device 120 and dissipate heat more quickly and efficiently. Figure 6 FIG. Figure 6 is an exemplary schematic diagram of a heat conduction device 120 having surface protrusions on its outer surface according to an embodiment of the present application. Furthermore, in one embodiment, a plurality of surface pits may also be disposed on an outer surface of at least one of the first portion 120A and the second portion 120B of the heat conduction device 120 to increase the total surface area of heat conduction of the heat conduction device 120 and dissipate heat more quickly and efficiently. Figure 7 FIG. Figure 7 is an exemplary schematic diagram of a heat conduction device 120 having surface pits on its outer surface according to an embodiment of the present application.
[0042] Figure 8 FIG. Figure 8 is an exemplary schematic diagram of an electronic device such as an optical sensor device 800 according to another different embodiment of the present application. The electronic device 800 includes a housing such as a heat conduction device 120, an infrared sensor circuit (formed by the optical sensor circuit 110 and the printed circuit board 105), and a thermal insulating material such as a heat insulating portion 115A. For example, as Figure 8 shown, the infrared sensor circuit 110 is disposed inside the housing 120 and is used to sense the temperature of an object outside the housing 120. The infrared sensor circuit 110 (i.e., the optical sensor circuit 110 within the printed circuit board 105) is indirectly in contact with the housing 120. The heat insulating or thermal insulating material 115A is equivalently disposed between the infrared sensor circuit (formed by the optical sensor circuit 110 and the printed circuit board 105) and the housing 120. In addition, there is an air gap between the housing 120 and the infrared sensor circuit. Additionally, the infrared sensor circuit (i.e., the printed circuit board 105 and the optical sensor circuit 110) is located on a top surface of the heat insulating material 115A, and a bottom surface of the heat insulating material 115A is in contact with a top surface of a board of the housing 120.
[0043] Based on the above device structure, when the temperature provided by the heater device 101 changes significantly, the temperature state of the object seen and detected by the optical sensor circuit 110 will not be greatly affected and changed. For example, when the temperature provided by the heater device 101 changes significantly between a lower temperature such as 20 °C and a higher temperature such as 85 °C, the temperature of the object seen and detected by a conventional optical sensor may have a significant temperature variation, such as a temperature difference of nearly 30 °C. In contrast to a conventional optical sensor, when the temperature provided by the heater device 101 changes significantly between 20 °C and 85 °C, the temperature detected by the optical sensor circuit 110 will only have a slight temperature change, for example, at most a temperature difference of 5 °C. In this way, the optical sensor device disclosed in the embodiments of the present application is equivalently capable of more accurately detecting the temperature of an object.
[0044] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. An optical sensor device, the optical sensor device being disposed on a heater device and heated by the heater device, characterized in that, The optical sensor device includes: a printed circuit; an optical sensor circuit disposed on the top surface of the printed circuit; a first heat insulation portion having a top surface contacting the bottom surface of the printed circuit; and a heat conduction device having a first portion and a second portion, wherein the first portion of the heat conduction device is disposed between the first heat insulation portion and the top surface of the heater device, and the second portion of the heat conduction device surrounds the optical sensor circuit.
2. The optical sensor device according to claim 1, characterized in that, The optical sensor device further includes: a second heat insulation portion disposed between the top surface of the optical sensor circuit and the second portion of the heat conduction device.
3. The optical sensor device according to claim 2, characterized in that, The optical sensor circuit and the printed circuit are disposed between the first heat insulation portion and the second heat insulation portion, and the first heat insulation portion and the second heat insulation portion are surrounded by the heat conduction device.
4. The optical sensor device according to claim 1, characterized in that, The first portion of the heat conduction device is fixed to the second portion of the heat conduction device by a thermal composite material.
5. The optical sensor device according to claim 1, characterized in that, The first portion of the heat conduction device and the second portion of the heat conduction device are integrally formed.
6. The optical sensor device according to claim 5, wherein The first portion of the heat conduction device and the second portion of the heat conduction device are integrally formed as one component.
7. The optical sensor device according to claim 1, wherein, A plurality of surface protrusions are provided on the outer surface of at least one of the first portion and the second portion of the heat conduction device.
8. The optical sensor device according to claim 1, characterized in that, A plurality of surface pits are provided on the outer surface of at least one of the first portion and the second portion of the heat conduction device.
9. An optical sensor circuit of an optical sensor device, characterized in that: The optical sensor device is disposed on a heater device and heated by the heater device. The optical sensor device further includes a printed circuit, a first heat insulation portion, and a heat conduction device. The optical sensor circuit is disposed on the top surface of the printed circuit. The top surface of the first heat insulation portion contacts the bottom surface of the printed circuit. The heat conduction device has a first portion and a second portion, and the first portion of the heat conduction device is disposed between the first heat insulation portion and the top surface of the heater device, and the second portion of the heat conduction device surrounds the optical sensor circuit.
10. The optical sensor circuit according to claim 9, characterized in that, The optical sensor device further includes a second heat insulation portion, and the second heat insulation portion is disposed between the top surface of the optical sensor circuit and the second portion of the heat conduction device.
11. The optical sensor circuit according to claim 10, characterized in that, The optical sensor circuit and the printed circuit are disposed between the first heat insulation portion and the second heat insulation portion, and the first heat insulation portion and the second heat insulation portion are surrounded by the heat conduction device.
12. The optical sensor circuit according to claim 9, wherein, The first portion of the heat conduction device is fixed to the second portion of the heat conduction device by a thermal composite material.
13. The optical sensor circuit according to claim 9, wherein, The first portion of the heat conduction device and the second portion of the heat conduction device are integrally formed.
14. The optical sensor circuit according to claim 13, characterized in that, The first portion of the heat conduction device and the second portion of the heat conduction device are integrally formed as one component.
15. The optical sensor circuit according to claim 9, wherein, A plurality of surface protrusions are provided on the outer surface of at least one of the first part and the second part of the heat conduction device.
16. The optical sensor circuit according to claim 9, characterized in that, A plurality of surface pits are provided on the outer surface of at least one of the first part and the second part of the heat conduction device.
17. An electronic device, characterized in that, The electronic device includes: a housing; an infrared sensor circuit, disposed inside the housing and configured to sense the temperature of an object outside the housing, the infrared sensor circuit being indirectly in contact with the housing; and a heat insulating material, disposed between the infrared sensor circuit and the housing.
18. The electronic device according to claim 17, wherein There is an air gap between the housing and the infrared sensor circuit.
19. The electronic device according to claim 17, wherein The infrared sensor circuit is located on the top surface of the heat insulating material, and the bottom surface of the heat insulating material contacts the top surface of the plate of the housing.