Semiconductor device packaging device and packaging method

Abstract

The invention belongs to the technical field of semiconductor packaging, and particularly relates to a semiconductor device packaging device and packaging method.The semiconductor device packaging device comprises a rack and an intermittent feeder installed on the surface of the rack and further comprises an auxiliary clamping assembly installed on the surface of the rack, and the auxiliary clamping assembly comprises a rotary disc arranged on the surface of the rack; the device can realize the effects of automatic clamping and adsorption of semiconductor components and cover bodies, automatic gluing of the semiconductor components, automatic press-fit packaging of the glued semiconductor components and cover bodies, and automatic discharging, improves the packaging quality, is high in automation degree, achieves automatic packaging action, does not need manual auxiliary alignment, and improves the production efficiency. The manual labor intensity is small, the phenomenon of cover closing dislocation is not prone to occurring in the packaging process, the packaging quality can be improved, and the labor cost is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and particularly relates to a semiconductor device packaging apparatus and a packaging method. Background Art

[0002] A semiconductor device is an electronic device whose conductivity is between that of a good conductor and an insulator, and uses the special electrical characteristics of semiconductor materials to perform specific functions. It can be used to generate, control, receive, transform, amplify signals, and perform energy conversion. A semiconductor device packaging apparatus is an auxiliary device used for packaging semiconductor devices.

[0003] When packaging LED semiconductor components, it is necessary to manually apply adhesive to the surface of the components, then cover the lid on the surface of the components, and complete the packaging operation of the components after extrusion for a period of time. Sometimes, the packaging housing is made of stainless steel material, which has a certain weight. When packaging multiple LED semiconductor components, the labor intensity of manual work is high. At the same time, high vision requirements are placed on the operator during lid covering, and it is easy to occur the phenomenon of misalignment of the lid covering, which affects the packaging quality, and the degree of automation is low, and it is time-consuming and laborious.

[0004] To solve the above problems, a semiconductor device packaging apparatus and a packaging method are proposed in the present application. Summary of the Invention

[0005] To solve the problems mentioned in the above background art. The present invention provides a semiconductor device packaging apparatus and a packaging method, which can realize the automatic clamping and adsorption of semiconductor components and the lid body, and at the same time can automatically apply glue to the semiconductor components, automatically press and package the semiconductor components and the lid body after gluing, and the effect of automatic blanking, improve the packaging quality, have a high degree of automation, automatic packaging actions, do not require manual auxiliary alignment, have a small labor intensity of manual work, and are not prone to the phenomenon of misalignment of the lid covering during the packaging process, which is beneficial to improving the packaging quality and reducing labor costs.

[0006] To achieve the above object, the present invention provides the following technical solution: A semiconductor device packaging apparatus, including a frame and an intermittent feeder installed on the surface of the frame;

[0007] It further includes an auxiliary clamping assembly installed on the surface of the frame. The auxiliary clamping assembly includes a turntable arranged on the surface of the frame, multiple groups of clamping plates hinged in a plurality of grooves opened on the surface of the turntable, and an adjusting disk, a clamping adjusting groove, a fixed guide plate, an L-shaped push rod, a return spring, and a hinged plate for controlling the clamping of the components by the clamping plates;

[0008] It further includes an auxiliary pressing component installed on the bottom surface of the top of the rack. The auxiliary pressing component includes a fixed ring frame fixedly installed on the bottom surface of the top of the rack, a plurality of rack plates evenly arranged in a ring on the surface of the turntable, a second spring for pressing components, a sliding convex, a suction cup, and a sliding square rod;

[0009] It further includes an auxiliary glue - applying component installed in the rack. The auxiliary glue - applying component includes a mounting plate installed on the rack pillar, a mounting sleeve installed on the surface of the mounting plate, an inclined ejector rod, a gear, a first toothed plate, a second toothed plate, an abutting rod, and a glue brush for applying glue to components;

[0010] It further includes an auxiliary blanking component arranged on the surface of the rack. The auxiliary blanking component includes support rods annularly distributed and installed on the bottom surface of the turntable, a wedge - shaped top block installed on the surface of the rack, a sliding sleeve, an abutting rod, a hinged rod, a push plate, and a guide rod for pushing components off;

[0011] As a preferred embodiment of a semiconductor device packaging device of the present invention, a fixed guide plate is installed in a groove opened on the surface of the turntable. An L - shaped push - pull rod is slidably connected to the surface of the fixed guide plate. One end of the L - shaped push - pull rod is hinged to a hinged plate, and the hinged plate is hinged to the clamping plate. A reset tension spring is fixed on the outer side of the L - shaped push - pull rod and on one side of the fixed guide plate. One end of the reset tension spring is connected to one end of the L - shaped push - pull rod. The L - shaped push - pull rod is slidably connected in a clamping adjustment groove opened on the surface of the adjustment disk, and the adjustment disk is arranged above the turntable.

[0012] As a preferred embodiment of a semiconductor device packaging device of the present invention, a rotating rod is rotatably connected to the surface of the rack. One end of the rotating rod is connected to the turntable, and an equally - spaced indexing disk is installed on the surface of the other end of the rotating rod. A fixed sliding sleeve is installed on the bottom surface of the rack. A cylinder is installed on one side of the fixed sliding sleeve. The piston end of the cylinder is connected to a slider slidably connected in the fixed sliding sleeve. One side of the slider is hinged to a push block through a rotating shaft. A coil spring is installed on the surface of the rotating shaft. One end of the coil spring is connected to the slider, and the push block abuts against one side of the equally - spaced indexing disk.

[0013] As a preferred embodiment of a semiconductor device packaging device of the present invention, a check sleeve is installed on the bottom surface of the rack. A first spring is arranged in the check sleeve. One end of the first spring abuts against a limit stop block slidably connected in the check sleeve. The limit stop block is clamped in a groove opened on the surface of the equally - spaced indexing disk. An inclined cone is installed on the clamping surface of the clamping plate.

[0014] Preferably, as a semiconductor device packaging device of the present invention, a sliding square rod is slidably connected to the surface of the support plate. One end of the sliding square rod is provided with a sliding convex, and the sliding convex is slidably connected to the bottom surface of the fixed ring frame. A suction cup is installed at the other end of the sliding square rod. A second spring is sleeved on the surface of the sliding square rod. One end of the second spring abuts against the surface of the support plate, and the other end of the second spring abuts against the sliding convex. The fixed ring frame is connected to the adjusting disc through a support rod.

[0015] Preferably, as a semiconductor device packaging device of the present invention, a gear is rotatably connected in the installation sleeve. A first toothed plate and a second toothed plate are slidably connected in the installation sleeve. Both the first toothed plate and the second toothed plate are engaged with the gear. A rubber brush is installed on the bottom surface of one end of the first toothed plate. An abutting rod is fixed on the surface of one end of the second toothed plate. An inclined ejecting rod is fixed on the surface of the support plate.

[0016] Preferably, as a semiconductor device packaging device of the present invention, a fixed block is installed on the surface of the second toothed plate. A T-shaped guide rod is slidably connected to the surface of the fixed block. One end of the T-shaped guide rod is connected to the installation sleeve. A third spring is arranged between the installation sleeve and the fixed block and on the outside of the T-shaped guide rod.

[0017] Preferably, as a semiconductor device packaging device of the present invention, a sliding sleeve is slidably connected to the outside of the support rod. An abutting rod is fixed on one side of the sliding sleeve. A hinged rod is hinged to the other side of the sliding sleeve. A pushing plate is hinged to one end of the hinged rod. A guide rod is fixed on one side of the pushing plate. The guide rod is slidably connected to the surface of the fixed guide plate.

[0018] Preferably, as a semiconductor device packaging device of the present invention, a ball is installed at the bottom end of the support rod. The support rod is slidably connected to the surface of the frame through this ball. A fourth spring is sleeved on the surface of the support rod. One end of the fourth spring abuts against the sliding sleeve, and one end of the fourth spring abuts against the convex limit on the surface of the support rod.

[0019] The present invention also provides a packaging method for a semiconductor device packaging device, including the following steps:

[0020] S1. Sequentially place the semiconductor component and the matching box cover on the surface of the intermittent feeder to perform material transfer, so that one end of the L-shaped push-pull rod slides in the clamping adjustment groove, prompting the two clamping plates to open at an angle, guiding the semiconductor component on the surface of the intermittent feeder between the two clamping plates, clamping the semiconductor component between this set of clamping plates, and enabling the cover on the intermittent feeder to be adsorbed by the suction cup;

[0021] S2. Control the rotation of the adjustment disc so that the inclined ejecting rod can contact the abutting rod, prompting the first toothed plate to drive the rubber brush to extend out to automatically apply glue to the surface of the semiconductor component;

[0022] S3. Cause the sliding convex to pass through the protruding part at the bottom of the fixed ring frame, so that the cover body adsorbed by the bottom of the suction cup at the bottom end of the sliding square rod presses on the surface of the semiconductor component for automatic packaging;

[0023] S4. Make the suction cup move upward and separate from the surface of the cover body. At the same time, make the two clamping plates open at an angle, and make the abutting rod contact the wedge-shaped top block, so that the articulated rod pushes the push plate to push the packaged semiconductor component between the clamping plates away, realizing the automatic blanking of the packaged semiconductor component.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: The structure of the present invention is scientific and reasonable, and it is safe and convenient to use:

[0025] 1. By setting the auxiliary clamping component, when the equally spaced indexing plate, push block, check ring, turntable, adjustment plate, clamping adjustment groove and other structures are used in cooperation, when the clamping plate overlaps with one end of the intermittent feeder, the semiconductor component on the surface of the intermittent feeder can be introduced between the two clamping plates, and under the action of the clamping adjustment groove, the semiconductor component can be clamped between the group of clamping plates, realizing the automatic feeding and clamping of the semiconductor component. As the adjustment plate rotates, the semiconductor component can be automatically clamped between the corresponding group of clamping plates, without manually clamping the semiconductor components between the clamping plates respectively, realizing the batch feeding of the semiconductor components, improving the feeding speed, and the operation is simple;

[0026] By setting the torsion spring on the rotating shaft, the push block can always be abutted against one side of the equally spaced indexing plate, ensuring that when the slider reciprocates in the fixed sliding sleeve, the push block can be abutted against one side of the equally spaced indexing plate to realize intermittent adjustment;

[0027] The elastically arranged limit stop block can be inserted into the groove opened on the surface of the equally spaced indexing plate, preventing the equally spaced indexing plate from rotating back and causing the adjustment plate to rotate accordingly, so as to ensure that when the clamping plate overlaps with one end of the intermittent feeder, the semiconductor component on the surface of the intermittent feeder can be smoothly pushed between the two clamping plates for clamping;

[0028] By setting the inclined cone, when the clamping plate clamps the semiconductor component, the surface of the semiconductor component can be higher than the clamping plate after being clamped, which is convenient for subsequent gluing operations. At the same time, the inclined cone can also play a supporting role for the semiconductor component.

[0029] 2. By setting up an auxiliary pressing and closing component, through the combined use of structures such as a fixed ring frame, a frame plate, a sliding convex, a suction cup, and a sliding square rod, when the sliding convex passes through the protruding part at the bottom of the fixed ring frame, the cover body adsorbed by the suction cup at the bottom of the sliding square rod can be moved towards the side of the semiconductor component, and the cover body is pressed on the surface of the semiconductor component for an automatic packaging operation. There is no need for manual assistance in alignment, the labor intensity of workers is small, and the phenomenon of misalignment during the closing process is not likely to occur, which is conducive to improving the packaging quality.

[0030] 3. By setting up an auxiliary glue - applying component, through the cooperation of structures such as an inclined ejector rod, a gear, a first toothed plate, a second toothed plate, a contact rod, and a glue brush, when the adjustment disk rotates to one side, the inclined ejector rod can contact the contact rod, thereby promoting the glue brush to extend and automatically apply glue to the surface of the semiconductor component. During this process, no manual intervention is required, which can further reduce labor costs.

[0031] 4. By setting up an auxiliary blanking component, through the cooperation of structures such as a support rod, a sliding sleeve, a contact rod, a hinged rod, and a wedge - shaped top block, the contact rod can contact the wedge - shaped top block, and the hinged rod hinged on one side of the sliding sleeve can push the push plate to slide to one side between two clamping plates, pushing the packaged semiconductor component between the clamping plates away, realizing the automatic blanking of the packaged semiconductor component. Overall, it can achieve the automatic clamping and adsorption of semiconductor components and cover bodies, simultaneously automatically apply glue to semiconductor components, automatically press - fit and package the semiconductor components and cover bodies after glue - applying, and the effect of automatic blanking, improving the packaging quality and having a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0033] Figure 1 is a schematic structural diagram of the present invention;

[0034] Figure 2 is a schematic diagram of the internal partial structure of the frame in the present invention;

[0035] Figure 3 In the present invention Figure 1 is a schematic structural diagram of the bottom view;

[0036] Figure 4 is a schematic structural diagram of the turntable, clamping block, and adjustment disk in the present invention;

[0037] Figure 5 is a schematic structural diagram of the rotating rod, slider, and equally - spaced indexing disk in the present invention;

[0038] Figure 6 This is a schematic structural diagram of the stop return sleeve, spring one, and limit stop block of the present invention;

[0039] Figure 7 This is a schematic structural diagram of the rotating shaft, push block, and coil spring of the present invention;

[0040] Figure 8 This is a schematic structural diagram of the inclined cone, hinge plate, and L-shaped push-pull rod of the present invention;

[0041] Figure 9 This is a schematic structural diagram of the adjusting disc and the clamping adjustment groove of the present invention;

[0042] Figure 10 This is a schematic structural diagram of the fixed ring frame, suction cup, and clamping plate of the present invention;

[0043] Figure 11 This is a schematic structural diagram of the sliding convex, spring two, frame plate, and suction cup of the present invention;

[0044] Figure 12 This is a schematic structural diagram of the fixed ring frame of the present invention;

[0045] Figure 13 This is a schematic structural diagram of the turntable, L-shaped push-pull rod, and hinge rod of the present invention;

[0046] Figure 14 This is a schematic structural diagram of the abutting rod, support rod, sliding sleeve, and push plate of the present invention;

[0047] Figure 15 This is a schematic structural diagram of the wedge-shaped top plate, hinge rod, and push plate of the present invention;

[0048] Figure 16 This is a schematic structural diagram of the mounting plate, fixed ring frame, and inclined ejector rod of the present invention;

[0049] Figure 17 This is a schematic structural diagram of the mounting sleeve, abutting rod, and T-shaped guide rod of the present invention;

[0050] In the figure:

[0051] 1. Frame; 11. Intermittent feeder;

[0052] 2. Auxiliary clamping assembly; 21. Cylinder; 22. Fixed sliding sleeve; 23. Slide block; 24. Rotating rod; 25. Equally spaced indexing plate; 26. Rotating shaft; 27. Coil spring; 28. Pushing block; 29. Check ring; 210. Spring I; 211. Limit stop block; 212. Turntable; 213. Clamping plate; 214. Adjusting plate; 215. Clamping adjustment groove; 216. Fixed guide plate; 217. L-shaped push-pull rod; 218. Reset tension spring; 219. Hinge plate; 220. Oblique cone; 3. Auxiliary pressing assembly; 31. Fixed ring frame; 32. Frame plate; 33. Spring II; 34. Sliding projection; 35. Suction cup; 36. Sliding square rod; 4. Auxiliary glue application assembly; 41. Oblique ejector rod; 42. Mounting plate; 43. Mounting sleeve; 44. Gear; 45. Rack I; 46. Rack II; 47. Contact rod; 48. Spring III; 49. Fixed block; 410. T-shaped guide rod; 411. Glue brush; 5. Auxiliary blanking assembly; 51. Support rod; 52. Sliding sleeve; 53. Spring IV; 54. Contact rod; 55. Hinge rod; 56. Pushing plate; 57. Guide rod; 58. Wedge-shaped top block. Detailed implementation manner

[0053] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0054] Embodiment: As Figures 1-17 shown, the present invention provides a technical solution, a semiconductor device packaging apparatus, including a frame 1 and an intermittent feeder 11 installed on the surface of the frame 1;

[0055] It further includes an auxiliary clamping assembly 2 installed on the surface of the frame 1. The auxiliary clamping assembly 2 includes a cylinder 21, a fixed sliding sleeve 22, a slide block 23, a rotating rod 24, an equally spaced indexing plate 25, a rotating shaft 26, a coil spring 27, a pushing block 28, a check ring 29, a spring I 210, a limit stop block 211, a turntable 212, a clamping plate 213, an adjusting plate 214, a clamping adjustment groove 215, a fixed guide plate 216, an L-shaped push-pull rod 217, a reset tension spring 218, a hinge plate 219, and an oblique cone 220;

[0056] The surface of the frame 1 is provided with a turntable 212. In each of the multiple grooves formed on the surface of the turntable 212, a clamping plate 213 is hinged. A fixed guide plate 216 is installed in the groove formed on the surface of the turntable 212. A sliding connection is provided between the surface of the fixed guide plate 216 and an L-shaped push-pull rod 217. One end of the L-shaped push-pull rod 217 is hinged to a hinge plate 219, and the hinge plate 219 is hinged to the clamping plate 213. A return spring 218 is fixed on the outer side of the L-shaped push-pull rod 217 and on one side of the fixed guide plate 216. One end of the return spring 218 is connected to one end of the L-shaped push-pull rod 217. The L-shaped push-pull rod 217 is slidably connected to a clamping adjustment groove 215 formed on the surface of an adjustment disc 214, and the adjustment disc 214 is arranged above the turntable 212.

[0057] A rotating rod 24 is rotatably connected to the surface of the frame 1. One end of the rotating rod 24 is connected to the turntable 212. An equally spaced indexing disc 25 is installed on the surface of the other end of the rotating rod 24. A fixed sliding sleeve 22 is installed on the bottom surface of the frame 1. A cylinder 21 is installed on one side of the fixed sliding sleeve 22. The piston end of the cylinder 21 is connected to a slider 23 that is slidably connected within the fixed sliding sleeve 22. One side of the slider 23 is hinged to a push block 28 through a rotating shaft 26. A coil spring 27 is installed on the surface of the rotating shaft 26. One end of the coil spring 27 is connected to the slider 23. The push block 28 abuts against one side of the equally spaced indexing disc 25, ensuring that when the slider 23 reciprocally slides within the fixed sliding sleeve 22, the push block 28 can abut against one side of the equally spaced indexing disc 25 to achieve intermittent adjustment.

[0058] A check ring 29 is installed on the bottom surface of the frame 1. A first spring 210 is arranged within the check ring 29. One end of the first spring 210 abuts against a limit stop block 211 that is slidably connected within the check ring 29. The limit stop block 211 is snap-fitted into a groove formed on the surface of the equally spaced indexing disc 25. An inclined cone 220 is installed on the clamping surface of the clamping plate 213, enabling the elastically arranged limit stop block 211 to be inserted into the groove formed on the surface of the equally spaced indexing disc 25 after the equally spaced indexing disc 25 rotates and adjusts.

[0059] It further includes an auxiliary pressing component 3 installed on the bottom surface of the top of the frame 1. The auxiliary pressing component 3 includes a fixed ring frame 31, a frame plate 32, a second spring 33, a sliding convex 34, a suction cup 35, and a sliding square rod 36;

[0060] The fixed ring frame 31 is fixedly installed on the bottom surface of the top of the frame 1. A plurality of frame plates 32 are evenly installed in a ring shape on the surface of the turntable 212. A sliding connection is provided between the surface of the frame plate 32 and the sliding square rod 36. One end of the sliding square rod 36 is installed with the sliding convex 34, and the sliding convex 34 is slidably connected to the bottom surface of the fixed ring frame 31. The other end of the sliding square rod 36 is installed with the suction cup 35. A second spring 33 is sleeved on the surface of the sliding square rod 36. One end of the second spring 33 abuts against the surface of the frame plate 32, and the other end of the second spring 33 abuts against the sliding convex 34. The fixed ring frame 31 is connected to the adjustment disc 214 through a support rod.

[0061] It further includes an auxiliary glue - applying component 4 installed in the rack 1. The auxiliary glue - applying component 4 includes an inclined ejector rod 41, a mounting plate 42, a mounting sleeve 43, a gear 44, a first toothed plate 45, a second toothed plate 46, a contact rod 47, a third spring 48, a fixing block 49, a T - shaped guide rod 410, and a glue brush 411;

[0062] The mounting plate 42 is fixed on the pillar of the rack 1. The surface of the mounting plate 42 is fixed with the mounting sleeve 43. The gear 44 is rotatably connected in the mounting sleeve 43. The first toothed plate 45 and the second toothed plate 46 are slidably connected in the mounting sleeve 43. Both the first toothed plate 45 and the second toothed plate 46 are meshed with the gear 44. The bottom surface of one end of the first toothed plate 45 is installed with the glue brush 411. The surface of one end of the second toothed plate 46 is fixed with the contact rod 47. The inclined ejector rod 41 is fixed on the surface of the frame plate 32.

[0063] The surface of the second toothed plate 46 is installed with the fixing block 49. The T - shaped guide rod 410 is slidably connected to the surface of the fixing block 49. One end of the T - shaped guide rod 410 is connected to the mounting sleeve 43. A third spring 48 is arranged between the mounting sleeve 43 and the fixing block 49 and on the outside of the T - shaped guide rod 410.

[0064] It further includes an auxiliary blanking component 5 arranged on the surface of the rack 1. The auxiliary blanking component 5 includes a support rod 51, a sliding sleeve 52, a fourth spring 53, a contact rod 54, a hinged rod 55, a push plate 56, a guide rod 57, and a wedge - shaped top block 58;

[0065] A plurality of support rods 51 are annularly distributed and installed on the bottom surface of the turntable 212. The wedge - shaped top block 58 is installed on the surface of the rack 1. The outside of the support rod 51 is slidably connected with the sliding sleeve 52. One side of the sliding sleeve 52 is fixed with the contact rod 54. The other side of the sliding sleeve 52 is hinged with the hinged rod 55. One end of the hinged rod 55 is hinged with the push plate 56. One side of the push plate 56 is fixed with the guide rod 57. The guide rod 57 is slidably connected to the surface of the fixed guide plate 216.

[0066] The bottom end of the support rod 51 is installed with a ball. The support rod 51 is slidably connected to the surface of the rack 1 through this ball. A fourth spring 53 is sleeved on the surface of the support rod 51. One end of the fourth spring 53 abuts against the sliding sleeve 52, and one end of the fourth spring 53 abuts against the convex limit on the surface of the support rod 51.

[0067] Working principle and usage process of the present invention: When in use, semiconductor components and the supporting lid are successively placed on the surface of the intermittent feeder 11 for material transfer. The intermittent extension of the piston end of the cylinder 21 is controlled, so that the slider 23 can reciprocate in the fixed sliding sleeve 22, and the push block 28 hinged to one side of the slider 23 can push the equally spaced indexing plate 25, enabling the rotating rod 24 to rotate intermittently, and the turntable 212 installed at one end of the rotating rod 24 to rotate intermittently. As the turntable 212 rotates, one end of the L-shaped push-pull rod 217 can slide in the clamping adjustment groove 215 opened on the surface of the adjustment disc 214. When passing through the clamping adjustment groove 215 at the first arc-shaped structure end, one end of the L-shaped push-pull rod 217 can slide to one side, and the two clamping plates 213 can be opened at an angle through the hinge plate 219. At this time, this group of clamping plates 213 overlaps with one end of the intermittent feeder 11, and the semiconductor components on the surface of the intermittent feeder 11 can be introduced between the two clamping plates 213. When one end of the L-shaped push-pull rod 217 slides into the smooth section of the support clamping adjustment groove 215, the L-shaped push-pull rod 217 is pulled to slide in the reverse direction, and this group of clamping plates 213 can deflect towards the side close to the semiconductor components simultaneously under the action of the hinge plate 219, clamping the semiconductor components between this group of clamping plates 213, which can realize the automatic loading and clamping of semiconductor components. Thus, as the adjustment disc 214 rotates, the semiconductor components can be automatically clamped between the corresponding group of clamping plates 213 without manually clamping the semiconductor components between the clamping plates 213 respectively, realizing the batch loading of semiconductor components, improving the loading speed, and having simple operation;

[0068] By setting the torsion spring 27 on the rotating shaft 26, the push block 28 can always be in contact with one side of the equally spaced indexing plate 25, ensuring that when the slider 23 reciprocates in the fixed sliding sleeve 22, the push block 28 can be in contact with one side of the equally spaced indexing plate 25 to achieve intermittent adjustment;

[0069] When the equally spaced indexing plate 25 is adjusted intermittently, through the cooperation of the check ring 29, the first spring 210 and the limit stop 211, after the equally spaced indexing plate 25 rotates and adjusts, the elastically arranged limit stop 211 can be inserted into the groove opened on the surface of the equally spaced indexing plate 25, preventing the equally spaced indexing plate 25 from rotating back and causing the adjustment disc 214 to rotate accordingly, so as to ensure that when the clamping plates 213 overlap with one end of the intermittent feeder 11, the semiconductor components on the surface of the intermittent feeder 11 can be smoothly pushed between the two clamping plates 213 for clamping;

[0070] When the clamping plate 213 clamps the semiconductor component, the set inclined cone 220 enables the semiconductor component to slide on the surface of the inclined cone 220, and the surface of the semiconductor component can be higher than the clamping plate 213 after being clamped. At the same time, the inclined cone 220 can also play a supporting role for the semiconductor component;

[0071] When the clamping plate 213 overlaps with one end of the intermittent feeder 11 so that the semiconductor component can be introduced between the two clamping plates 213, the cover body provided on the intermittent feeder 11 can be adsorbed by the suction cup 35 at the same time. When the adjusting disk 214 rotates, one end of the sliding square rod 36 slidably connected to the surface of the frame plate 32 can slide on the surface of the fixed ring frame 31. When the sliding convex 34 passes through the protruding part at the bottom of the fixed ring frame 31, the second spring 33 can be compressed, and the cover body adsorbed by the suction cup 35 at the bottom of the sliding square rod 36 can move toward the side of the semiconductor component, and the cover body can be pressed on the surface of the semiconductor component for automatic packaging operation, without manual assistance for alignment, with low labor intensity of workers, and it is not easy to occur the phenomenon of misalignment of the cover during the packaging process, which is beneficial to improving the packaging quality;

[0072] After the semiconductor component is clamped between the two clamping plates 213 and the cover body is adsorbed by the suction cup 35, during the process of the adjusting disk 214 rotating to one side, the inclined ejector rod 41 installed on one side of the frame plate 32 can contact the abutting rod 47, and the abutting rod 47 can be driven to slide to one side, and the set first toothed plate 45 can slide in the opposite direction to the direction of the second toothed plate 46 under the action of the gear 44, so as to promote the glue brush 411 to extend out and perform automatic glue coating operation on the surface of the semiconductor component. Cooperating with the set auxiliary pressing assembly 3, automatic packaging of the semiconductor component can be realized, and no manual intervention is required during this process, which can further reduce the labor cost;

[0073] When applying glue, the third spring 48 on the T-shaped guide rod 410 is compressed. After the glue is applied (the inclined ejector rod 41 is separated from the abutting rod 47), under the action of the elasticity of the set third spring 48 itself, the glue brush 411 can be reset;

[0074] While clamping the semiconductor component between two clamping plates 213, with the cover body adsorbed by the suction cup 35, after applying glue to the surface of the semiconductor component, and pressing the cover body onto the surface of the semiconductor component for automatic encapsulation, when the sliding convex 34 slides from the protruding part at the bottom of the fixed ring frame 31 to the smooth section of the fixed ring frame 31, under the elasticity of the second spring 33, the suction cup 35 can move upward and detach from the surface of the cover body. At the same time, when one end of the L-shaped push-pull rod 217 passes through the clamping adjustment groove 215 at the second arc-shaped structure end, the two clamping plates 213 can be made to open at an angle. At the same time, the corresponding support rod 51 can rotate to the position where the suction cup 35 moves upward and detaches from the surface of the cover body, and the provided abutting rod 54 can contact the wedge-shaped top block 58, thereby being able to push the sliding sleeve 52 to slide upward from the surface of the support rod 51, so as to promote the hinge rod 55 hinged to one side of the sliding sleeve 52 to push the push plate 56 to slide to one side between the two clamping plates 213, and push the semiconductor component after encapsulation between the clamping plates 213 away, realizing the automatic blanking of the encapsulated semiconductor component. After the abutting rod 54 detaches from the wedge-shaped top block 58, under the elasticity of the fourth spring 53 provided, the push plate 56 can be reset. The whole can realize the automatic clamping and adsorption of the semiconductor component and the cover body, and at the same time can automatically apply glue to the semiconductor component, automatically press and seal the semiconductor component and the cover body after glue application, and the effect of automatic blanking, improving the quality of encapsulation, with high automation, saving time and effort.

[0075] It should be noted that: there are two sets of intermittent feeders 11, which are respectively used for the intermittent transportation and conveyance of semiconductor components and cover bodies.

[0076] It should be noted that: the suction cup 35 automatically opens when facing the intermittent feeder 11, and can realize the adsorption of the cover body, and automatically closes when the suction cup 35 moves upward after the pressing is completed.

[0077] It should be noted that: the support rod 51 can also play a role in supporting the turntable 212.

[0078] The present invention also provides a packaging method for a semiconductor device packaging device, including the following steps:

[0079] S1. Place the semiconductor component and the supporting box cover on the surface of the intermittent feeder 11 in sequence for material transfer, so that one end of the L-shaped push-pull rod 217 slides in the adjustment clamping groove 215, prompting the two clamping plates 213 to open at an angle, guiding the semiconductor component on the surface of the intermittent feeder 11 between the two clamping plates 213, clamping the semiconductor component between this group of clamping plates 213, and adsorbing the cover body on the intermittent feeder 11 by the suction cup 35;

[0080] S2. Control the rotation of the adjustment disk 21 so that the inclined push rod 41 can contact the abutting rod 47, prompting the tooth plate 45 to drive the glue brush 411 to extend, and automatically apply glue to the surface of the semiconductor component;

[0081] S3, making the sliding protrusion 34 pass through the raised portion at the bottom of the fixed ring frame 31, prompting the cover body adsorbed by the bottom of the suction cup 35 at the bottom end of the sliding square rod 36 to be pressed onto the surface of the semiconductor component for automatic packaging;

[0082] S4. The suction cup 35 moves upward and detaches from the surface of the cover body. At the same time, the two clamps 213 are opened at an angle, and the support rod 544 is brought into contact with the wedge-shaped top block 58, prompting the hinged rod 55 to push the push plate 56 to push the packaged semiconductor components between the clamps 213 away, thereby realizing automatic unloading of the packaged semiconductor components.

[0083] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A semiconductor device packaging apparatus, comprising a frame (1) and an intermittent feeder (11) mounted on the surface of the frame (1); It is characterized in that: It further includes an auxiliary clamping assembly (2) mounted on the surface of the frame (1). The auxiliary clamping assembly (2) includes a turntable (212) provided on the surface of the frame (1), multiple groups of clamping plates (213) hinged in a plurality of grooves formed on the surface of the turntable (212), and an adjustment disk (214), a clamping adjustment groove (215), a fixed guide plate (216), an L-shaped push-pull rod (217), a return spring (218), and a hinge plate (219) for controlling the clamping of the components by the clamping plates (213); It further includes an auxiliary pressing assembly (3) mounted on the bottom surface of the top of the frame (1). The auxiliary pressing assembly (3) includes a fixed ring frame (31) fixedly mounted on the bottom surface of the top of the frame (1), a plurality of frame plates (32) evenly arranged in a ring on the surface of the turntable (212), and a spring two (33), a sliding convex (34), a suction cup (35), and a sliding square rod (36) for pressing the components; It further includes an auxiliary glue coating assembly (4) mounted in the frame (1). The auxiliary glue coating assembly (4) includes a mounting plate (42) mounted on the support column of the frame (1), a mounting sleeve (43) mounted on the surface of the mounting plate (42), and an inclined ejector rod (41), a gear (44), a first toothed plate (45), a second toothed plate (46), an abutting rod (47), and a glue brush (411) for coating glue on the components; It further includes an auxiliary blanking assembly (5) provided on the surface of the frame (1). The auxiliary blanking assembly (5) includes support rods (51) distributed in a ring and mounted on the bottom surface of the turntable (212), a wedge-shaped top block (58) mounted on the surface of the frame (1), and a sliding sleeve (52), a resisting rod (54), a hinge rod (55), a push plate (56), and a guide rod (57) for pushing down the components; 2. The semiconductor device packaging apparatus according to claim 1, wherein: A fixed guide plate (216) is mounted in the groove formed on the surface of the turntable (212). An L-shaped push-pull rod (217) is slidably connected to the surface of the fixed guide plate (216). One end of the L-shaped push-pull rod (217) is hinged to a hinge plate (219). The hinge plate (219) is hinged to the clamping plate (213). A return spring (218) is fixed on the outer side of the L-shaped push-pull rod (217) and on one side of the fixed guide plate (216). One end of the return spring (218) is connected to one end of the L-shaped push-pull rod (217). The L-shaped push-pull rod (217) is slidably connected to the clamping adjustment groove (215) formed on the surface of the adjustment disk (214). The adjustment disk (214) is provided above the turntable (212).

3. The semiconductor device packaging apparatus according to claim 1, characterized in that: A rotating rod (24) is rotatably connected to the surface of the frame (1). One end of the rotating rod (24) is connected to a turntable (212). An equally spaced indexing disc (25) is mounted on the surface of the other end of the rotating rod (24). A fixed sliding sleeve (22) is mounted on the bottom surface of the frame (1). A cylinder (21) is mounted on one side of the fixed sliding sleeve (22). The piston end of the cylinder (21) is connected to a slider (23) slidably connected within the fixed sliding sleeve (22). One side of the slider (23) is hinged to a push block (28) through a rotating shaft (26). A coil spring (27) is mounted on the surface of the rotating shaft (26). One end of the coil spring (27) is connected to the slider (23). The push block (28) abuts against one side of the equally spaced indexing disc (25).

4. The semiconductor device packaging apparatus according to claim 1, wherein: A check sleeve (29) is mounted on the bottom surface of the frame (1). A first spring (210) is arranged within the check sleeve (29). One end of the first spring (210) abuts against a limit stop block (211) slidably connected within the check sleeve (29). The limit stop block (211) is clamped within a groove formed on the surface of the equally spaced indexing disc (25). An inclined cone (220) is mounted on the clamping surface of the clamping plate (213).

5. The semiconductor device packaging apparatus according to claim 1, wherein: A sliding square rod (36) is slidably connected to the surface of the frame plate (32). A sliding convex (34) is mounted on one end of the sliding square rod (36). The sliding convex (34) is slidably connected to the bottom surface of the fixed ring frame (31). A suction cup (35) is mounted on the other end of the sliding square rod (36). A second spring (33) is sleeved on the surface of the sliding square rod (36). One end of the second spring (33) abuts against the surface of the frame plate (32). The other end of the second spring (33) abuts against the sliding convex (34). The fixed ring frame (31) is connected to an adjusting disc (214) through a support rod.

6. The semiconductor device packaging apparatus according to claim 1, wherein: A gear (44) is rotatably connected within the mounting sleeve (43). A first toothed plate (45) and a second toothed plate (46) are slidably connected within the mounting sleeve (43). Both the first toothed plate (45) and the second toothed plate (46) are meshed with the gear (44). A rubber brush (411) is mounted on the bottom surface of one end of the first toothed plate (45). An abutting rod (47) is fixed to the surface of one end of the second toothed plate (46). An inclined ejector rod (41) is fixed to the surface of the frame plate (32).

7. The semiconductor device packaging apparatus according to claim 1, wherein: A fixed block (49) is mounted on the surface of the second toothed plate (46). A T-shaped guide rod (410) is slidably connected to the surface of the fixed block (49). One end of the T-shaped guide rod (410) is connected to the mounting sleeve (43). A third spring (48) is arranged between the mounting sleeve (43) and the fixed block (49) and is located outside the T-shaped guide rod (410).

8. The semiconductor device packaging apparatus according to claim 1, wherein: The outer side of the support rod (51) is slidably connected to a sliding sleeve (52), a push rod (54) is fixed to one side of the sliding sleeve (52), a hinged rod (55) is hinged to the other side of the sliding sleeve (52), one end of the hinged rod (55) is hinged to a push plate (56), a guide rod (57) is fixed to one side of the push plate (56), and the guide rod (57) is slidably connected to the surface of the fixed guide plate (216).

9. The semiconductor device packaging apparatus according to claim 1, wherein: A ball bearing is installed at the bottom end of the support rod (51), and the support rod (51) is slidably connected to the surface of the frame (1) through the ball bearing. A spring four (53) is sleeved on the surface of the support rod (51), and one end of the spring four (53) abuts against the sliding sleeve (52), and one end of the spring four (53) abuts against the raised limiter on the surface of the support rod (51).

10. The packaging method of the semiconductor device packaging apparatus according to any one of claims 11-9, characterized in that: The following steps are involved: S1. Semiconductor components and their corresponding box covers are sequentially placed on the surface of the intermittent feeder (11) to transfer materials, so that one end of the L-shaped push-pull rod (217) slides in the clamping adjustment groove (215), causing the two clamping plates (213) to open at an angle, and the semiconductor components on the surface of the intermittent feeder (11) are introduced between the two clamping plates (213), and the semiconductor components are clamped between the group of clamping plates (213), and the cover on the intermittent feeder (11) is adsorbed by the suction cup (35); S2, controlling the rotation of the regulating disk (21) so that the inclined push rod (41) can contact the abutting rod (47), prompting the tooth plate (45) to drive the glue brush (411) to extend, and automatically apply glue to the surface of the semiconductor component; S3, making the sliding protrusion (34) pass through the raised portion at the bottom of the fixed ring frame (31), prompting the cover body adsorbed at the bottom of the suction cup (35) at the bottom end of the sliding square rod (36) to be pressed onto the surface of the semiconductor component for automatic packaging; S4, the suction cup (35) is moved upward and separated from the surface of the cover body, and at the same time, the two clamping plates (213) are opened at an angle, and the support rod (544) is brought into contact with the wedge-shaped top block (58), prompting the hinged rod (55) to push the push plate (56) to push away the packaged semiconductor components between the clamping plates (213), thereby realizing automatic unloading of the packaged semiconductor components.

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