Wafer processing method and device, chip sorting machine, storage medium and program product

Abstract

The invention discloses a wafer processing method and device, a chip sorting machine, a storage medium and a program product. The method comprises the following steps: acquiring a scanning map of a target wafer; dividing the scanning map into a plurality of areas according to the chip size in the scanning map; according to a preset rule, based on the neighborhood of the grain-free area, determining a target empty area needing crystal supplement in the grain-free area; and determining a crystal supplementing position in the target empty region and the region with the crystal grains, and supplementing the crystal according to the crystal supplementing position. According to the technical scheme provided by the invention, a certain number of chips are supplemented in the wafer which is originally distributed in a scattered manner, so that the wafer is continuously arranged. And furthermore, through screening of the empty areas, the number of supplemented crystals can be reduced as much as possible on the premise that the requirements of subsequent packaging equipment are met. Therefore, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] Embodiments of the present invention relate to the technical field of chip manufacturing, and in particular, to a wafer processing method, apparatus, chip sorter, storage medium, and program product. Background Art

[0002] In the LED chip sorting process, for a type of wafer, there are only a small number of NG chips. The reverse picking process is used in the sorting stage, that is, according to the map file of the wafer, the chips of the unwanted grade (bin type) are picked and removed, and then the wafer is shipped as a whole to the subsequent packaging factory. However, after picking, the wafer has a scattered grain distribution, and the subsequent packaging process equipment cannot be compatible with such a scattered wafer. It requires the chip factory to rearrange the picked chips, or not use the reverse picking process, but directly pick and arrange all the original OK chips. However, no matter which method is adopted, it will increase the manufacturing cost and reduce the production efficiency. Summary of the Invention

[0003] Embodiments of the present invention provide a wafer processing method, apparatus, chip sorter, storage medium, and program product to meet the requirements of the subsequent equipment for the continuity of the wafer, and solve the problems of low production efficiency and high cost caused by the original need for rearrangement.

[0004] In a first aspect, embodiments of the present invention provide a wafer processing method, which includes:

[0005] Obtain a scanned map of a target wafer;

[0006] Divide the scanned map into multiple regions according to the chip sizes in the scanned map;

[0007] Based on the neighborhood of the grain-free region, determine a target empty region that needs to be filled with crystals in the grain-free region according to a preset rule;

[0008] Determine the crystal filling positions in the target empty region and the grain-containing regions, so as to fill the crystals according to the crystal filling positions.

[0009] Optionally, the determining the crystal filling positions in the target empty region and the grain-containing regions includes:

[0010] Determine the chip spacing of the continuously arranged chips in the grain-containing region;

[0011] Generate a grid in the grain-containing region according to the chip spacing in the grain-containing region, and determine the crystal filling positions in the grain-containing region according to the grid nodes;

[0012] A grid is generated in the target empty area according to the chip spacing in the neighborhood of the target empty area, and a chip filling position in the target empty area is determined according to the grid nodes.

[0013] Optionally, determining a target empty area requiring grain filling in the grain-free area based on a neighborhood of the grain-free area according to a preset rule includes:

[0014] Performing a primary screening of the grain-free region based on the neighborhood of the grain-free region according to the preset rule to obtain a target grain-free region;

[0015] dividing the target grain-free region into a plurality of sub-regions;

[0016] The sub-region is screened twice based on the neighborhood of the sub-region according to the preset rule to obtain the target empty region.

[0017] Optionally, after determining the crystal filling position in the target empty area and the area with crystal grains, the method further includes:

[0018] First, the crystal filling positions in each area are sorted internally, and then all the crystal filling positions are sorted overall based on the positions of each area.

[0019] Optionally, before determining the target empty area requiring grain filling in the grain-free area based on the neighborhood of the grain-free area according to a preset rule, the method further includes:

[0020] Each grain is uniquely divided into regions according to its location.

[0021] Optionally, the preset rules include:

[0022] If the four neighborhoods of the empty area to be determined are all empty areas, the empty area to be determined is eliminated; and / or,

[0023] If there are no segmented areas at at least two positions in the four neighborhoods of the empty area to be determined, the empty area to be determined is eliminated.

[0024] In a second aspect, an embodiment of the present invention further provides a wafer processing device, the device comprising:

[0025] A map acquisition module is used to obtain a scanning map of the target wafer;

[0026] A region segmentation module, configured to segment the scan map into a plurality of regions according to the chip size in the scan map;

[0027] A region screening module, configured to determine a target empty region requiring grain filling in the grain-free region based on the neighborhood of the grain-free region according to a preset rule;

[0028] A crystal replenishment position determination module, configured to determine crystal replenishment positions in the target empty regions and the regions with crystal grains, so as to perform crystal replenishment according to the crystal replenishment positions.

[0029] In a third aspect, an embodiment of the present invention further provides a chip sorter, which includes:

[0030] One or more processors;

[0031] A memory, configured to store one or more programs;

[0032] When the one or more programs are executed by the one or more processors, the one or more processors implement the wafer processing method provided by any embodiment of the present invention.

[0033] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, it implements the wafer processing method provided by any embodiment of the present invention.

[0034] In a fifth aspect, an embodiment of the present invention further provides a computer program product, which includes a computer program, and when the program is executed by a processor, it implements the wafer processing method provided by any embodiment of the present invention.

[0035] An embodiment of the present invention provides a wafer processing method, which first obtains a scan map of a target wafer, then divides the scan map into multiple regions according to the chip sizes in the scan map, then determines target empty regions that need crystal replenishment in each non-crystal-grain region based on the neighborhood of the non-crystal-grain regions according to a preset rule, and finally determines crystal replenishment positions in each target empty region and each region with crystal grains, so as to perform crystal replenishment according to the crystal replenishment positions. The wafer processing method provided by the embodiment of the present invention makes the wafer arrangement continuous by replenishing a certain number of chips in the originally scattered wafers. Further, by screening the empty regions, the number of crystal replenishments can be reduced as much as possible on the premise of meeting the requirements of the subsequent packaging equipment. Thereby, the production efficiency is improved and the production cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a flowchart of the wafer processing method provided by Embodiment 1 of the present invention;

[0037] Figure 2 It is a schematic diagram of empty region elimination provided by Embodiment 1 of the present invention;

[0038] Figure 3 It is a schematic diagram of an exemplary crystal replenishment effect provided by Embodiment 1 of the present invention;

[0039] Figure 4 It is a schematic structural diagram of the wafer processing device provided by Embodiment 2 of the present invention;

[0040] Figure 5 This is a schematic structural diagram of the chip sorter provided in Embodiment 3 of the present invention. Specific embodiments

[0041] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the sake of description, only parts related to the present invention rather than all structures are shown in the drawings.

[0042] Before discussing the exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts depict the steps as sequential processes, many of the steps can be implemented in parallel, concurrently, or simultaneously. In addition, the order of the steps can be rearranged. The process can be terminated when its operations are completed, but it can also have additional steps not included in the drawings. The process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0043] Embodiment 1

[0044] Figure 1 This is a flowchart of the wafer processing method provided in Embodiment 1 of the present invention. This embodiment is applicable to the situation of adjusting the grain arrangement in the wafer after the reverse pick process to meet the requirements of the subsequent packaging equipment. This method can be executed by the wafer processing device provided in the embodiments of the present invention, and the device can be implemented in a hardware and / or software manner and is generally integrated in the chip sorter. As Figure 1 shown, the specific steps are as follows:

[0045] S11. Obtain the scan map of the target wafer.

[0046] S12. Divide the scan map into multiple regions according to the chip size in the scan map.

[0047] S13. Determine the target empty region that needs to be filled with crystals in the crystal-free region based on the neighborhood of the crystal-free region according to a preset rule.

[0048] S14. Determine the crystal-filling positions in the target empty region and the crystal-containing regions, and fill the crystals according to the crystal-filling positions.

[0049] Specifically, it can be achieved by combining with the existing functions of a chip sorter (such as an LED sorter). The sorter device can use a CCD camera in cooperation with its motion execution mechanism to visually scan and obtain the entire map pattern of the target wafer of the specified crystal to be supplemented, that is, the scanned map. From the scanned map, the chip size can be calculated. Then, a region division and governance strategy is adopted to dynamically divide the scanned map into several regions according to the chip size to ensure the final crystal supplementation effect. Exemplarily, the scanned map can be divided into M×N grid regions, which is more convenient for processing. Subsequently, a quadtree tree structure can also be used to associate adjacent regions for subsequent processing.

[0050] After the division is completed, it can be determined whether there are die in each region, and then each region can be marked as a region with die and a region without die. For the region with die, it can be directly determined as the region that needs crystal supplementation. For the region without die, the target empty regions that need crystal supplementation can be further screened. Specifically for a region without die, it can be judged according to a preset rule by referring to the die situation in the adjacent regions of it. For example, directly based on the current division result, when there is no region with die in its neighborhood (such as the surrounding 8 regions or the adjacent 4 regions), it can be excluded, that is, it is not used as a target empty region, and when there is a region with die in its neighborhood, it can be selected as a target empty region, etc. Or it can be judged according to whether the number of regions with die included in the neighborhood of the region without die meets the conditions in the preset rule and whether the region without die is an edge region, etc.

[0051] Among them, preferably, the preset rule includes: if the four neighboring regions of the empty region to be judged are all empty regions, then the empty region to be judged is excluded; and / or, if there are at least two positions in the four neighboring regions of the empty region to be judged where there are no divided regions, then the empty region to be judged is excluded. Specifically, as Figure 2 shown, Condition 1 ( Figure 2 the left figure in Figure 2 ) takes a region without die as the empty region 200 to be judged. If its four neighboring regions (that is, the divided regions adjacent in the four directions of up, down, left, and right) are all empty regions (that is, there are no die in the region, such as the region without die obtained after the above division), then the empty region 200 to be judged is excluded, that is, it is not used as a target empty region. Condition 2 ( Figure 2 the middle figure and the right figure in Figure 2 ) takes a region without die as the empty region 200 to be judged. If there are at least two positions in its four neighboring regions where there are no divided regions (at this time, the empty region 200 to be judged is an edge region), such as Figure 2 the case where there is only a single-sided divided region, then the empty region 200 to be judged is excluded, that is, it is not used as a target empty region. The above two conditions can be selected one by one, or can be used simultaneously to establish a dual-condition decision rule, so as to better reduce the number of crystal supplements.

[0052] Optionally, before determining the target empty regions that need to be filled with crystals in the crystal-free regions based on the preset rules according to the neighborhoods of the crystal-free regions, it further includes: uniquely dividing each crystal into each region according to the crystal positions. Specifically, after the segmentation is completed, there may be a situation where the same crystal chip spans multiple regions. For the subsequent accurate determination, the crystal chips can be divided into each region according to their positions (such as the center), so that each crystal belongs to a unique region. Among them, the crystal positions can be obtained through the above scanning process.

[0053] After determining the target empty regions, the crystal filling positions can be determined in each target empty region and each crystal-containing region, so as to perform crystal filling according to the crystal filling positions. For example, according to the specific design of the target wafer, the positions where the crystals are missing in each target empty region and each crystal-containing region can be used as the crystal filling positions. Subsequently, the crystal filling operation can be performed according to the crystal filling positions, thereby improving the continuity of the wafer.

[0054] Among them, preferably, determining the crystal filling positions in the target empty regions and the crystal-containing regions includes: determining the chip pitch of the chips arranged continuously in the crystal-containing region; generating a grid in the crystal-containing region according to the chip pitch in the crystal-containing region, and determining the crystal filling positions in the crystal-containing region according to the grid nodes; generating a grid in the target empty region according to the chip pitch in the neighborhood of the target empty region, and determining the crystal filling positions in the target empty region according to the grid nodes.

[0055] Specifically, according to the scanning map, within a single segmented region, the pitch of the continuously arranged chips can be calculated to use this pitch as the reference pitch for crystal filling. Then, in the marked crystal-containing regions, the corresponding chip pitches can be calculated. For the target empty regions, the chip pitches calculated from the crystal-containing regions in their neighborhoods (such as the above four-neighborhoods) can be recursively used. Exemplarily, if there are no crystal-containing regions in its four-neighborhoods, one of the neighborhood regions can be selected and the chip pitches in the four-neighborhoods of this neighborhood region can be searched, and the recursion is continued until a determined chip pitch is found. After determining the chip pitches of each region, a grid can be dynamically generated in the corresponding region according to the chip pitch. Each grid point can be regarded as the position of the corresponding chip. Then, using the minimum radius principle, the positions where there are already chips can be removed, so as to obtain the crystal filling positions in the corresponding regions. Among them, after determining the chip pitch, the chip pitch can also be corrected based on the preset minimum pitch and preset angle, etc., so as to reduce the situation of chip overlap.

[0056] On the basis of the above technical solution, optionally, the determining of the target empty area that needs to be filled with crystals in the crystal-free area based on the preset rule includes: initially screening the crystal-free area based on the neighborhood of the crystal-free area according to the preset rule to obtain a target crystal-free area; dividing the target crystal-free area into multiple sub-areas; and secondarily screening the sub-areas based on the neighborhood of the sub-areas according to the preset rule to obtain the target empty area.

[0057] Specifically, the crystal-free area can be screened multiple times, especially for the edge area, to further reduce the number of crystal filling. That is, after the above initial segmentation, the crystal-free area obtained by segmentation can be initially screened once in a similar process as above to obtain a target crystal-free area. Then, the target crystal-free area can be further segmented, such as dividing a single target crystal-free area into 2×2 crystal-free sub-areas, etc. For each sub-area obtained after the secondary segmentation, a secondary screening can be performed in a similar process as above to obtain the final target empty area. Of course, similarly, a third screening, a fourth screening, etc. can be further performed.

[0058] On the basis of the above technical solution, optionally, after determining the crystal filling positions in the target empty area and the crystal-containing area, it further includes: first internally sorting the crystal filling positions in each area respectively, and then globally sorting all the crystal filling positions based on the positions of the areas.

[0059] Specifically, after determining the crystal filling positions, the crystal filling order of all the crystal filling positions can be further designed to perform crystal filling more efficiently and accurately. Specifically, according to the area priority principle, the crystal filling positions within a single area can be continuously sorted, and then globally sorted according to the areas. Within a single area, the sorting can be performed in the order from top to bottom and from left to right, and the areas can also be sorted in the order from top to bottom and from left to right.

[0060] Based on the above solution, for a certain type of red LED chip, after testing, according to a 10% removal, picking, and crystal filling ratio, compared with picking 90% of the chip grains in the forward direction, 60% of the comprehensive time can be saved. Calculated based on 5 hours required for picking one wafer, 3 hours of time can be saved, and the monthly sorting quantity in a general factory is more than 10,000 pieces, and the effect of reducing the comprehensive manufacturing cost of the sorting process is obvious. An exemplary crystal filling effect is as Figure 3 shown, which can well meet the requirements of the subsequent packaging equipment.

[0061] For the technical solution provided by the embodiment of the present invention, first, a scanned map of the target wafer is obtained, then the scanned map is divided into multiple regions according to the chip size in the scanned map, and then, according to a preset rule, a target empty region that needs to be filled with chips is determined in each die-less region based on the neighborhood of the die-less region. Finally, the chip-filling positions are determined in each target empty region and each die-containing region, so as to perform chip filling according to the chip-filling positions. By filling a certain number of chips in the originally scattered wafers, the wafers are arranged continuously. Further, through the screening of the empty regions, on the premise of meeting the requirements of the subsequent packaging equipment, the number of chips to be filled can be reduced as much as possible. Thereby, the production efficiency is improved and the production cost is reduced.

[0062] Embodiment 2

[0063] Figure 4 FIG. is a schematic structural diagram of a wafer processing apparatus provided by Embodiment 2 of the present invention. The apparatus can be implemented in a hardware and / or software manner and is generally integrated into a chip sorter for executing the wafer processing method provided by any embodiment of the present invention. As Figure 4 shown, the apparatus includes:

[0064] A map acquisition module 41, configured to acquire a scanned map of the target wafer;

[0065] A region segmentation module 42, configured to divide the scanned map into multiple regions according to the chip size in the scanned map;

[0066] A region screening module 43, configured to determine a target empty region that needs to be filled with chips in the die-less region based on the neighborhood of the die-less region according to a preset rule;

[0067] A chip-filling position determination module 44, configured to determine chip-filling positions in the target empty region and the die-containing regions, so as to perform chip filling according to the chip-filling positions.

[0068] For the technical solution provided by the embodiment of the present invention, first, a scanned map of the target wafer is obtained, then the scanned map is divided into multiple regions according to the chip size in the scanned map, and then, according to a preset rule, a target empty region that needs to be filled with chips is determined in each die-less region based on the neighborhood of the die-less region. Finally, the chip-filling positions are determined in each target empty region and each die-containing region, so as to perform chip filling according to the chip-filling positions. By filling a certain number of chips in the originally scattered wafers, the wafers are arranged continuously. Further, through the screening of the empty regions, on the premise of meeting the requirements of the subsequent packaging equipment, the number of chips to be filled can be reduced as much as possible. Thereby, the production efficiency is improved and the production cost is reduced.

[0069] On the basis of the above technical solution, optionally, the chip-filling position determination module 44 is specifically configured to:

[0070] Determine the chip pitch of the continuously arranged chips in the grain-containing area;

[0071] Generate a grid in the grain-containing area according to the chip pitch in the grain-containing area, and determine the crystal filling positions in the grain-containing area according to the grid nodes;

[0072] Generate a grid in the target empty area according to the chip pitch in the neighborhood of the target empty area, and determine the crystal filling positions in the target empty area according to the grid nodes.

[0073] Based on the above technical solution, optionally, the area screening module 43 is specifically configured to:

[0074] Perform a primary screening on the grainless area based on the neighborhood of the grainless area according to the preset rule to obtain a target grainless area;

[0075] Divide the target grainless area into multiple sub-areas;

[0076] Perform a secondary screening on the sub-areas based on the neighborhood of the sub-areas according to the preset rule to obtain the target empty area.

[0077] Based on the above technical solution, optionally, the device further includes:

[0078] A crystal filling position sorting module, configured to, after determining the crystal filling positions in the target empty area and the grain-containing area, first perform an internal sorting on the crystal filling positions in each area respectively, and then perform an overall sorting on all the crystal filling positions based on the positions of each area.

[0079] Based on the above technical solution, optionally, the device further includes:

[0080] A grain division module, configured to, before determining the target empty area that needs crystal filling in the grainless area based on the neighborhood of the grainless area according to the preset rule, uniquely divide each grain into each area according to the grain positions.

[0081] Based on the above technical solution, optionally, the preset rule includes:

[0082] If the four neighborhoods of the empty area to be determined are all empty areas, then the empty area to be determined is excluded; and / or,

[0083] If at least two positions in the four neighborhoods of the empty area to be determined do not have division areas, then the empty area to be determined is excluded.

[0084] The wafer processing apparatus provided by an embodiment of the present invention can execute the wafer processing method provided by any embodiment of the present invention, and has functional modules and beneficial effects corresponding to the execution of the method.

[0085] It should be noted that, in the above embodiment of the wafer processing apparatus, the various units and modules included are only divided according to functional logic, but are not limited to the above division, as long as the corresponding functions can be achieved; in addition, the specific names of the functional units are only for the convenience of mutual distinction and do not limit the protection scope of the present invention.

[0086] Embodiment III

[0087] Figure 5 FIG. is a schematic structural diagram of a chip sorter provided by Embodiment III of the present invention, showing a block diagram of an exemplary chip sorter suitable for implementing the embodiments of the present invention. Figure 5 The displayed chip sorter is only an example and should not bring any limitation to the functions and usage scope of the embodiments of the present invention. As Figure 5 shown, the chip sorter includes a processor 51, a memory 52, an input device 53, and an output device 54; the number of processors 51 in the chip sorter can be one or more. Figure 5 Taking one processor 51 as an example, the processor 51, the memory 52, the input device 53, and the output device 54 in the chip sorter can be connected through a bus or other means. Figure 5 Taking the connection through a bus as an example.

[0088] The memory 52, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as program instructions / modules corresponding to the wafer processing method in the embodiments of the present invention (for example, the map acquisition module 41, the area segmentation module 42, the area screening module 43, and the crystal replenishment position determination module 44 in the wafer processing apparatus). The processor 51 executes various functional applications and data processing of the chip sorter by running the software programs, instructions, and modules stored in the memory 52, that is, implements the above-mentioned wafer processing method.

[0089] The memory 52 may mainly include a program storage area and a data storage area. Among them, the program storage area may store an operating system and application programs required for at least one function; the data storage area may store data created according to the use of the chip sorter, etc. In addition, the memory 52 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state storage devices. In some instances, the memory 52 may further include a memory remotely provided with respect to the processor 51, and these remote memories may be connected to the chip sorter through a network. Examples of the above network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0090] The input device 53 may be used to obtain a scanned map of the target wafer, and generate key signal inputs related to the user settings and function control of the chip sorter, etc. The output device 54 may be used to control the peripheral device to perform crystal replenishment according to the crystal replenishment position, etc.

[0091] Embodiment 4

[0092] Embodiment 4 of the present invention further provides a storage medium containing computer-executable instructions, and the computer-executable instructions are used to execute a wafer processing method when executed by a computer processor. The method includes:

[0093] Obtain a scanned map of the target wafer;

[0094] Divide the scanned map into multiple regions according to the chip size in the scanned map;

[0095] Determine a target empty region that needs crystal replenishment in the non-grained region based on the neighborhood of the non-grained region according to a preset rule;

[0096] Determine the crystal replenishment position in the target empty region and the grained region, so as to perform crystal replenishment according to the crystal replenishment position.

[0097] A storage medium can be any of various types of memory devices or storage devices. The term "storage medium" is intended to include: installation media such as CD-ROMs, floppy disks or tape drives; computer system memory or random access memory such as DRAM, DDR RAM, SRAM, EDO RAM, Rambus RAM, etc.; non-volatile memory such as flash memory, magnetic media (e.g., hard disks or optical storage); registers or other similar types of memory elements, etc. The storage medium can also include other types of memory or combinations thereof. Additionally, the storage medium can be located in the computer system in which the program is executed, or can be located in a different second computer system that is connected to the computer system via a network (such as the Internet). The second computer system can provide program instructions to the computer for execution. The term "storage medium" can include two or more storage media that can reside in different locations (e.g., in different computer systems connected via a network). The storage medium can store program instructions executable by one or more processors (e.g., embodied as a computer program).

[0098] Of course, for a storage medium containing computer-executable instructions provided by an embodiment of the present invention, the computer-executable instructions are not limited to the method operations described above, and can also execute related operations in the wafer processing method provided by any embodiment of the present invention.

[0099] A computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, which carries computer-readable program code. Such a propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device.

[0100] The program code contained on a computer-readable medium can be transmitted using any appropriate medium, including but not limited to wireless, wire, optical fiber, RF, etc., or any suitable combination of the above.

[0101] Through the above description of the embodiments, those skilled in the art can clearly understand that the present invention can be implemented by means of software and necessary general hardware. Of course, it can also be implemented by hardware, but in many cases the former is a better implementation. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as a floppy disk, read-only memory (ROM), random access memory (RAM), flash memory (FLASH), hard disk, or optical disc of a computer, etc., and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) to execute the methods described in various embodiments of the present invention.

[0102] Embodiment Five

[0103] Embodiment Five of the present invention further provides a computer program product. This computer program product includes a computer program (which can also be called code, instruction), and this computer program can be stored in a computer-readable storage medium. When this computer program is executed by a processor, it is used to execute the wafer processing method provided in any of the above embodiments and has the corresponding beneficial effects of the execution method.

[0104] Note that the above is only the preferred embodiment of the present invention and the applied technical principle. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here. Various obvious changes, re-adjustments, and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, it can also include more other equivalent embodiments, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A wafer processing method, characterized in that, including: Obtain a scanned map of the target wafer; Divide the scanned map into multiple regions according to the chip sizes in the scanned map; Determine a target empty region that needs to be filled with chips in the chipless region based on the neighborhood of the chipless region according to a preset rule; Determine chip-filling positions in the target empty region and the chip-containing regions, so as to perform chip filling according to the chip-filling positions.

2. The wafer processing method according to claim 1, wherein The determining chip-filling positions in the target empty region and the chip-containing regions includes: Determine the chip pitch of the chips arranged continuously in the chip-containing region; Generate a grid in the chip-containing region according to the chip pitch in the chip-containing region, and determine the chip-filling positions in the chip-containing region according to the grid nodes; Generate a grid in the target empty region according to the chip pitch in the neighborhood of the target empty region, and determine the chip-filling positions in the target empty region according to the grid nodes.

3. The wafer processing method according to claim 1, characterized in that, The determining a target empty region that needs to be filled with chips in the chipless region based on the neighborhood of the chipless region according to a preset rule includes: Perform a primary screening on the chipless region based on the neighborhood of the chipless region according to the preset rule to obtain a target chipless region; Divide the target chipless region into multiple sub-regions; Perform a secondary screening on the sub-regions based on the neighborhood of the sub-regions according to the preset rule to obtain the target empty region.

4. The wafer processing method according to claim 1, characterized in that, After determining the chip-filling positions in the target empty region and the chip-containing regions, further includes: First, perform internal sorting on the chip-filling positions in each region respectively, and then perform overall sorting on all chip-filling positions based on the positions of the regions.

5. The wafer processing method according to claim 1, wherein Before determining a target empty region that needs to be filled with chips in the chipless region based on the neighborhood of the chipless region according to a preset rule, further includes: Uniquely divide each chip into each region according to the chip positions.

6. The wafer processing method according to any one of claims 1-5, characterized in that, The preset rule includes: If the four neighborhoods of the empty region to be determined are all empty regions, then eliminate the empty region to be determined; and / or, If at least two positions in the four neighborhoods of the empty region to be determined do not have divided regions, then eliminate the empty region to be determined.

7. A wafer processing apparatus, characterized in that, including: A map acquisition module, configured to obtain a scanned map of the target wafer; A region division module, configured to divide the scanned map into multiple regions according to the chip sizes in the scanned map; A region screening module, configured to determine a target empty region that needs to be filled with chips in the chipless region based on the neighborhood of the chipless region according to a preset rule; A chip-filling position determination module, configured to determine chip-filling positions in the target empty region and the chip-containing regions, so as to perform chip filling according to the chip-filling positions.

8. A chip sorter, characterized in that, including: One or more processors; A memory, configured to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the wafer processing method according to any one of claims 1-6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the wafer processing method according to any one of claims 1-6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the wafer processing method according to any one of claims 1-6.

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