Bearing device

Abstract

The bearing device comprises a bearing assembly and a driving assembly, and the bearing assembly comprises a bearing disc, a film jacking piece, a conveying piece and a driving mechanism; wherein the bearing disc comprises an adsorption part, a transition part and a bearing part, the film jacking piece is arranged in the transition part, and the conveying piece is arranged in the bearing part; the driving mechanism drives the film jacking piece to ascend to jack up the adhesive film part of the tested piece, so that the tested piece is separated from the bearing disc; the driving assembly drives the transmission member to lift so as to receive or release the tested member through the transmission member. The adsorption part is used for adsorbing the tested piece, so that the tested piece can be stably fixed on the bearing disc in a posture that the front surface faces upwards; on the basis of cooperation of the film jacking piece and the conveying piece, the film jacking piece is used for supporting the adhesive film part of the tested piece, the tested piece can be prevented from making contact with the bearing disc, the tightening degree of the adhesive film is adjusted, and the tested piece is borne and fixed in the posture that the back face faces upwards; therefore, the bearing device is endowed with double functions of front and back bearing, and support is provided for realizing front detection and back detection based on the same detection equipment.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor process flow equipment, and in particular to a carrier device. Background Art

[0002] In the semiconductor manufacturing process, carriers are often used to support and secure semiconductor workpieces such as wafers, enabling processing, transportation, and testing. For example, wafers typically have circuit patterns on their front surfaces, preventing them from coming into direct contact with the carriers.

[0003] Common carriers usually only have a front-side carrying function, that is, the wafer is fixed to the carrier with the front side facing up. This also means that the inspection equipment can generally only inspect the front side of the wafer. As the inspection requirements become more and more stringent, it is necessary to inspect not only the front side of the wafer, but also the back side of the wafer. Therefore, how to make the carrier have the dual functions of front and back carrying, and thus meet the requirements of front and back inspection of semiconductor workpieces, has become a technical problem that needs to be solved urgently in this field. Summary of the invention

[0004] The main technical problem solved by the present application is to provide a bearing device that has the dual functions of front bearing and back bearing.

[0005] To achieve the above-mentioned purpose, an embodiment provides a carrying device, comprising a carrying assembly and a driving assembly, wherein the carrying assembly comprises a carrying plate, a top film member, a transmission member, and a driving mechanism; wherein: The carrier plate includes an adsorption portion, a transition portion surrounding the adsorption portion, and a bearing portion surrounding the transition portion, wherein the upper surface of the bearing portion is lower than the upper surfaces of the adsorption portion and the transition portion; the top film member is disposed in the transition portion, and the conveying member is disposed in the bearing portion; The driving mechanism is configured to drive the top film member to rise and fall relative to the carrier plate, so as to lift the film portion of the test piece by the top film member, so that the test piece is spaced apart from the adsorption portion; The driving assembly is configured to drive the conveying member to rise and fall relative to the carrying plate, so as to receive or release the tested object through the conveying member.

[0006] In one embodiment, the transition portion is provided with a groove, the top film member is disposed in the groove, and the upper surface of the top film member is lower than the upper surface of the transition portion.

[0007] In one embodiment, the top membrane member includes a top membrane portion close to the adsorption portion and a connecting portion surrounding the top membrane portion, the upper surface of the top membrane portion is higher than the upper surface of the connecting portion, the connecting portion is connected to the driving mechanism, and the driving mechanism drives the connecting portion to drive the top membrane portion to rise and fall.

[0008] In one embodiment, the driving mechanism includes a first driving member, a first lifting plate, a first lifting column, and a first elastic member; wherein: The first end of the first lifting column extends into the groove and is connected to the top film member. The first driving member is connected to the carrier plate, and the first driving member is configured to drive the first lifting plate to move up and down. The first lifting plate acts on the second end of the first lifting column to drive the first lifting column to drive the top film member to rise; One end of the first elastic member is connected to the carrier plate, and the other end is connected to the second end of the first lifting column. The first elastic member is configured to provide an elastic force that urges the first lifting column to drive the top film member to descend.

[0009] In one embodiment, the carrier assembly further includes a guiding structure and / or a limiting structure, wherein: The guiding structure is configured to guide the linear lifting of the first lifting plate. The guiding structure includes a first guiding member and a second guiding member that are slidably connected. The first guiding member is connected to the first lifting plate, and the second guiding member is connected to the carrier plate; The limiting structure is configured to limit the lifting stroke of the first lifting plate. The limiting structure includes a first limiting member and a second limiting member that cooperate with each other. The first limiting member is fixedly arranged relative to the first driving member, and the second limiting member is fixedly arranged relative to the first lifting plate.

[0010] In one embodiment, the conveying member includes a second lifting column and a second elastic member. The second lifting column penetrates through the carrying portion. The first end of the second lifting column is configured to contact the device under test. One end of the second elastic member is connected to the carrier plate, and the other end is connected to the second end of the second lifting column; The second elastic member is configured to provide an elastic force that urges the second lifting column to descend. The driving assembly acts on the second end of the second lifting column to drive the second lifting column to rise.

[0011] In one embodiment, the carrier assembly further includes a hemming mechanism; the hemming mechanism is arranged on the carrying portion and is configured to fix the device under test.

[0012] And / or the carrier assembly further includes one or more first pipeline connectors; the first pipeline connectors are configured to be detachably connected to second pipeline connectors of an external control source to achieve air path connection or electrical connection between the carrier assembly and the external control source.

[0013] In one embodiment, the carrying device further includes a first positioning seat for being arranged on the moving platform, and the carrying assembly further includes a second positioning seat for carrying the carrying plate; the first positioning seat and the second positioning seat are detachably connected to detachably connect the carrying assembly to the moving platform.

[0014] In one embodiment, the first positioning seat is provided with at least three first positioning members, and the second positioning seat is provided with at least three second positioning members arranged around the center of the carrying plate; the first positioning members and the second positioning members correspond to each other one by one and are inserted and connected to prevent the carrying assembly from rotating and translating relative to the first positioning seat.

[0015] In one embodiment, the first positioning seat is further provided with a first magnetic attracting member, and the second positioning seat is provided with a second magnetic attracting member; the first magnetic attracting member and the second magnetic attracting member are attracted to each other in alignment to prevent the first positioning seat and the second positioning seat from moving in the thickness direction of the carrying plate.

[0016] In one embodiment, the number of the carrying assemblies is set to be plural, and different carrying assemblies are used to carry workpieces to be measured with different external dimensions; each carrying assembly includes the second positioning seat matching with the first positioning seat, so that the plural carrying assemblies can be detachably connected to the moving platform.

[0017] In one embodiment, the driving assembly includes a second driving member and a second lifting plate, the second driving member is arranged on the moving platform and is used for driving the second lifting plate to lift; the second lifting plate has a supporting structure corresponding to the conveying members in different carrying assemblies, and the second lifting plate drives the corresponding conveying members to lift through the supporting structure.

[0018] In one embodiment, the moving platform includes a supporting portion and a rotating portion that can be controllably rotated relative to the supporting portion; the first positioning seat is connected to the rotating portion and rotates synchronously therewith, and the carrying assembly follows the first positioning seat to rotate synchronously; Wherein, the supporting portion is provided with a third limiting member, and the carrying assembly further includes a fourth limiting member connecting the carrying plate; the third limiting member and the fourth limiting member cooperate to limit the rotation stroke of the carrying assembly.

[0019] The carrier device according to the above embodiments includes a carrier assembly and a driving assembly. The carrier assembly includes a carrier disk, a top film member, a transfer member, and a driving mechanism. Among them, the carrier disk includes an adsorption portion, a transition portion, and a carrying portion. The top film member is disposed in the transition portion, and the transfer member is disposed in the carrying portion. The driving mechanism drives the top film member to rise and lift the film portion of the device under test, so that the device under test is spaced apart from the carrier disk. The driving assembly drives the transfer member to move up and down to receive or release the device under test through the transfer member. By using the adsorption portion to adsorb the device under test, the device under test can be stably fixed on the carrier disk with the front side facing up. Based on the cooperation between the top film member and the transfer member, by using the top film member to support the film portion of the device under test, the device under test can be prevented from contacting the carrier disk and the tension of the film can be adjusted, so that the device under test is carried and fixed with the back side facing up. In this way, the carrier device is given the dual functions of front and back carrying, providing support for realizing front inspection and back inspection operations based on the same detection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 FIG. is a schematic plan view of a conventional iron ring wafer.

[0021] Figure 2 FIG. is a schematic structural view of a carrier device according to an embodiment.

[0022] Figure 3 FIG. is a schematic structural view of a carrier device according to an embodiment with the moving platform omitted.

[0023] Figure 4 FIG. is a schematic cross-sectional view of a carrier device according to an embodiment.

[0024] Figure 5 FIG. is a schematic cross-sectional view of a carrier assembly in a carrier device according to an embodiment.

[0025] Figure 6 FIG. is a schematic structural view of a carrier assembly in a carrier device according to an embodiment.

[0026] Figure 7 FIG. is a schematic diagram of the front carrying principle of a carrier device according to an embodiment.

[0027] Figure 8 FIG. is a schematic diagram of the back carrying principle of a carrier device according to an embodiment.

[0028] Figure 9 FIG. is a schematic view of the state when a carrier device according to an embodiment carries an iron ring wafer on the back.

[0029] Figure 10 FIG. is a schematic structural view (I) of a limiting structure in a carrier device according to an embodiment.

[0030] Figure 11 FIG. is a schematic structural view (II) of a limiting structure in a carrier device according to an embodiment.

[0031] Figure 12 Schematic structural diagram of the first positioning seat in a loading device of an embodiment.

[0032] Figure 13 Schematic combined structural diagram of the first positioning seat and the second positioning seat in a loading device of an embodiment.

[0033] In the figure: 100, loading assembly; 110, loading tray; 111, adsorption part; 112, transition part; 1121, groove; 113, loading part; 120, top film member; 121, top film part; 122, connecting part; 130, conveying member; 131, second lifting column; 132, second elastic member; 140, driving mechanism; 141, first driving member; 142, first lifting plate; 143, first lifting column; 144, first elastic member; 151, first limiting member; 152, second limiting member; 153, first guiding member; 154, second guiding member; 160, edge locking mechanism; 161, third driving member; 162, pressing block; 170, second positioning seat; 171, second positioning member; 172, second magnetic attracting member; 180, fourth limiting member; 200, driving assembly; 210, second driving member; 220, second lifting plate; 230, supporting structure; 300, moving platform; 310, first positioning seat; 311, first positioning member; 312, first magnetic attracting member; 320, supporting part; 330, rotating part; 340, third limiting member; A, iron ring wafer; A1, film part; A2, frame part; A3, wafer part. Detailed implementation manners

[0034] The present application will be further described in detail below in conjunction with the accompanying drawings through specific implementation manners. Similar elements in different implementation manners are labeled with related similar element numbers. In the following implementation manners, many detailed descriptions are provided to enable a better understanding of the present application. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification to avoid overwhelming the core part of the present application with excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the descriptions in the specification and the general technical knowledge in the art.

[0035] In addition, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can also be reordered or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and drawings are only for clearly describing a certain embodiment and do not mean that they are the necessary sequences, unless it is otherwise stated that a certain sequence must be followed.

[0036] The serial numbers assigned to the components in this article, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. And the "connection" and "coupling" mentioned in this application, unless otherwise specified, both include direct and indirect connection (coupling).

[0037] In the back-end processes of semiconductor manufacturing, wafers are often attached to a blue film with an iron ring on the edge for processing, transportation, and inspection. This type of wafer is generally called an iron-ring wafer (also known as a bonded-ring wafer, Frame wafer, etc.); specifically, please refer to Figure 1 , a conventional iron-ring wafer A includes a wafer, a blue film, and an iron-ring around the wafer; among them, usually, after being processed through multiple front-end processes, the front side of the wafer has been engraved with circuit patterns, while the back side of the wafer is generally an unprocessed surface; therefore, by respectively pasting and fixing the back side of the wafer and the back side of the iron-ring to the front side of the blue film, the wafer and the iron-ring can be connected together through the blue film to form the iron-ring wafer A.

[0038] Currently, a vacuum chuck designed based on the principle of vacuum adsorption is one of the most commonly configured loading devices in inspection equipment. In the case of the iron-ring wafer A, when the iron-ring wafer A is placed on the loading device with the front side of the wafer facing up, the wafer can be indirectly tightly fixed by adsorbing and fixing the blue film. Since there is a layer of blue film between the wafer and the loading device, the back side of the wafer will not be contaminated by the loading device. Therefore, by obtaining an image of the front side of the wafer, the inspection of the front side of the wafer (commonly known as front inspection) can be achieved. However, if the back side of the wafer is inspected (commonly known as back inspection) based on the same inspection equipment, the iron-ring wafer A needs to be fixed on the loading device with the front side of the wafer facing down. At this time, the front side of the wafer will directly contact the loading device, resulting in the contamination of the front side of the wafer by the loading device (for example, damaging the circuit patterns already processed on the front side of the wafer). Obviously, this situation is not allowed in the manufacturing process; therefore, the existing loading device does not have the function of back-loading the iron-ring wafer A and cannot meet the requirements of performing front inspection and back inspection on the same iron-ring wafer A based on the same inspection equipment, leading to a series of problems such as low equipment utilization rate and low inspection efficiency.

[0039] The carrier device provided by this application has the dual functions of front-side loading and back-side loading. By loading and fixing semiconductor workpieces such as the iron-ring wafer A, it can realize the front inspection and back inspection operations of semiconductor workpieces based on the same detection equipment, and can provide support for effectively improving equipment utilization rate and detection efficiency, etc.

[0040] Below, taking the iron-ring wafer A as the workpiece to be measured as an example, the structural configuration, working principle, etc. of this carrier device will be described; however, it should be noted that the workpiece to be measured can also be other semiconductor workpieces, such as workpieces similar to the iron-ring wafer A in terms of structural form or detection method, etc. At the same time, to describe the carrier device provided by the embodiments of this application more clearly and in detail, please refer to Figure 1 and Figures 7 to 9 , the workpiece to be measured includes a film portion A1, a frame portion A2, and a wafer portion A3; specifically refer to Figure 1 , in the case of the iron-ring wafer A, the wafer portion A3 refers to the part occupied by the wafer in the iron-ring wafer A, the frame portion A2 refers to the part occupied by the iron ring in the iron-ring wafer A, and the film portion A1 refers to the blue film between the iron ring (i.e., the frame portion A2) and the wafer (i.e., the wafer portion A3) in the iron-ring wafer A.

[0041] Please refer to Figures 2 to 13 , some embodiments of this application provide a carrier device, including a carrier assembly 100 and a driving assembly 200; among them, the carrier assembly 100 includes a carrier plate 110, a top film member 120, a transfer member 130, a driving mechanism 140, and other functional components that exist as needed, which will be specifically described below.

[0042] Please refer to Figure 2 , Figure 7 and Figure 8 , the carrier plate 110 is arranged on the moving platform 300. The carrier plate 110 includes a central adsorption portion 111, a transition portion 112 surrounding the adsorption portion 111, and a carrier portion 113 surrounding the transition portion 112; among them, the adsorption portion 111 can include a porous ceramic part, a microporous ceramic part, a metal groove part, or other forms of adsorption structures, and the adsorption portion 111 is connected to an external control source (specifically, a negative pressure gas source) through a gas path; when the iron-ring wafer A is placed with the front side of the wafer facing up, the adsorption portion 111 adsorbs the blue film of the wafer portion A3 through negative pressure, and indirectly fastens the wafer on the carrier plate 110, realizing the front-side loading of the iron-ring wafer A.

[0043] The upper surface of the bearing part 113 is set lower than the upper surfaces of the adsorption part 111 and the transition part 112; for example, the upper surfaces of the adsorption part 111 and the transition part 112 are flush, and the height difference between the upper surface of the adsorption part 111 (or the transition part 112) and the upper surface of the bearing part 113 is not less than the thickness of the frame part A2 (exemplarily, the upper surface of the bearing part 113 can be 1-2 mm lower than the upper surface of the adsorption part 111 (or the transition part 112)). Among them, when the iron-ring wafer A is placed with the front side of the wafer facing up, the transition part 112 can be used to carry the adhesive film part A1 (i.e., the blue film located between the adsorption part 111 and the bearing part 113); and when the iron-ring wafer A is placed with the front side facing up or down, the bearing part 113 can be used to carry the frame part A2.

[0044] Exemplarily, please refer to Figure 7 and Figure 8 , the inner diameter of the bearing part 113 can be set smaller than the inner diameter of the frame part A2 (specifically the iron ring), and the outer diameter of the bearing part 113 can be set larger than the outer diameter of the frame part A2 (specifically the iron ring). In this way, when carrying the iron-ring wafer A, an ample carrying space can be provided for the frame part A2 to avoid structural interference between the frame part A2 and the transition part 112.

[0045] It should be noted that Figure 7 and Figure 8 the bold dashed lines in represent the approximate boundaries between the adsorption part 111 and the transition part 112, and between the transition part 112 and the bearing part 113.

[0046] Please refer to Figure 5 , Figure 7 and Figure 8 , the top film member 120 is disposed in the transition part 112. For example, the top film member 120 can be an annular structure housed inside the transition part 112; the driving mechanism 140 is configured to drive the top film member 120 to move up and down relative to the carrier plate 110. The driving mechanism 140 can adopt an electric, hydraulic or pneumatic push rod assembly or cylinder block assembly, or other power assemblies capable of outputting linear motion and being controllable, for the purpose of automatically driving the top film member 120 to move up and down; among them, the body of the driving mechanism 140 is connected to the carrier plate 110, and the power end of the driving mechanism 140 is coupled to the top film member 120.

[0047] Please refer to Figure 8 , when the iron-ring wafer A is placed with the front side of the wafer facing down, the driving mechanism 140 drives the top film member 120 to rise to a position where the upper surface of the top film member 120 is higher than the upper surface of the adsorption part 111. By lifting the adhesive film part A1 with the top film member 120, the iron-ring wafer A can be kept spaced from the adsorption part 111 of the carrier plate 110, preventing the front side of the wafer from contacting the adsorption part 111 of the carrier plate 110. Please refer toFigure 7 When the iron ring wafer A is placed with the front side of the wafer facing up, the driving mechanism 140 drives the top film member 120 to descend to a position where the upper surface of the top film member 120 is lower than the upper surface of the transition portion 112, so that the transition portion 112 can support the film portion A1, thereby preventing the top film member 120 from lifting up the film portion A1 and affecting the adsorption and fixing effect of the adsorption portion 111 on the wafer portion A3, and avoiding friction or interference between the top film member 120 and the film portion A1.

[0048] See also Figures 2 to 4 and Figure 6 The conveying member 130 is arranged in the carrying part 113. For example, the conveying member 130 can be a columnar structure that penetrates the carrying part 113 along the thickness direction of the carrier plate 110. The driving component 200 is configured to drive the conveying member 130 to rise and fall relative to the carrier plate 110. The driving component 200 can adopt an electric, hydraulic or pneumatic push rod component or cylinder component, or other power components that can output linear motion and can be controlled, so as to realize the purpose of automatically driving the conveying member 130 to rise and fall. The main body of the driving component 200 can be connected to the carrier plate 110, or it can be arranged on the motion platform 300, and the power end of the driving component 200 is coupled to the conveying member 130. In this way, by driving the conveying member 130 to rise and fall with the help of the driving component 200, the iron ring wafer A can be received or released through the conveying member 130.

[0049] For example, please combine Figure 7 Before the inspection, an external gripping device (such as a robot) transfers the iron ring wafer A to the top of the carrier plate 110 and makes the front of the wafer face up, and uses the driving mechanism 140 to drive the top film member 120 to descend to a position where the upper surface of the top film member 120 is lower than the upper surface of the transition portion 112; at this time, the driving component 200 drives the conveying member 130 to rise to a position where the upper surface of the conveying member 130 is higher than the upper surface of the adsorption portion 111, and the iron ring wafer A is conveyed by the external gripping device, so that the conveying member 130 contacts the upper surface of the adsorption portion 111. The iron ring wafer A is held or supported (i.e., the frame portion A2) to achieve the reception of the iron ring wafer A; then the external gripping device is removed, and the driving component 200 drives the conveying member 130 to drive the iron ring wafer A to descend until the wafer portion A3 falls on the adsorption portion 111, thereby releasing the iron ring wafer A; finally, the blue film of the wafer portion A3 is adsorbed by the adsorption portion 111 to indirectly fasten the wafer to the carrier plate 110, thereby achieving the front support of the iron ring wafer A so as to enable the front of the wafer to be inspected.

[0050] For example, please combine Figure 8Before back inspection, an external grasping device (such as a robot) flips the iron ring wafer A so that the front side of the wafer faces down, and then moves the iron ring wafer to the top of the carrier 110; at this time, the driving component 200 drives the conveying member 130 to rise to a position where the upper surface of the conveying member 130 is higher than the upper surface of the adsorption portion 111, and the iron ring wafer A is conveyed by the external grasping device, so that the conveying member 130 receives and supports the frame portion A2 to achieve the reception of the iron ring wafer A; at the same time, the driving mechanism 140 drives the top film member 120 to rise to a position where the upper surface of the top film member 120 is higher than the upper surface of the adsorption portion 111 but lower than the upper surface of the conveying member 130; then the external grasping device is removed, and the driving component 200 drives the conveying member 130 to descend until the film portion A1 falls on the top film member 120 and the frame portion A2 falls on the carrying portion 113, thereby releasing the iron ring wafer A.

[0051] When the height of the top film member 120 is determined to be appropriate based on demand and experience, the top film member 120 pushes the film portion A1 upward to form a height difference between the top film member 120 and the supporting portion 113, the adsorption portion 111 and the transition portion 112, as well as a height difference between the transition portion 112 and the supporting portion 113, so that when the frame portion A2 falls to the supporting portion 113, the film portion A1 will be stretched downward under the action of the gravity of the frame portion A2 (that is, relying on the deadweight of the frame portion A2 to form a 360-degree omnidirectional stretching of the film portion A1). In this way, since the film portion A1 is in a taut state, the wafer portion A3 (specifically the wafer) will be horizontally suspended above the adsorption portion 111, preventing the wafer from contacting the supporting plate 110 and being contaminated or damaged, thereby achieving the support of the back side of the iron ring wafer A, so as to facilitate the inspection of the back side of the wafer.

[0052] Furthermore, in order to prevent the under-test object from being deflected due to insufficient gravity and affecting the test result, the frame portion A2 can be locked on the carrying portion 113 by the edge locking mechanism 160 to further secure the under-test object.

[0053] Furthermore, due to differences in the quality, blue film material, blue film thickness, and tightness of the blue film of different iron ring wafer A, when it is uncertain whether the height at which the top film member 120 rises is appropriate, the top film member 120 pushes up the adhesive film portion A1 upward, creating a height difference between the top film member 120 and the bearing portion 113, the adsorption portion 111, and the transition portion 112, as well as a height difference between the transition portion 112 and the bearing portion 113. When the frame portion A2 falls onto the bearing portion 113, the adhesive film portion A1 will be stretched downward under the gravitational force of the frame portion A2; then, the frame portion A2 is locked tightly onto the bearing portion 113 by the edge-locking mechanism 160, and the driving mechanism 140 is used to drive the top film member 120 to lift and lower, adjusting the height of the top film member 120 until the adhesive film portion A1 is tightened and the wafer portion A3 (specifically, the wafer) is horizontally suspended above the adsorption portion 111 without moving. This not only avoids the wafer contacting the carrier plate 110 and being contaminated or damaged but also realizes the backside loading and detection of the iron ring wafer A.

[0054] In summary, by designing the partition structure of the carrier plate 110 to form the corresponding adsorption portion 111, transition portion 112, and bearing portion 113, using the height difference formed between the bearing portion 113 and the adsorption portion 111 and the transition portion 112, and through the cooperation of the driving mechanism 140 combined with the top film member 120 and the conveying member 130 combined with the driving assembly 200, the carrier device is endowed with the dual functions of both front-side loading and backside loading. Thus, the front inspection and back inspection operations of the same iron ring wafer A can be realized based on the same inspection equipment, effectively improving the utilization rate and inspection efficiency of the equipment. At the same time, when performing backside loading on the iron ring wafer A, by adjusting the lifting position of the top film member 120, the tension degree of the adhesive film portion A1 can also be adjusted to adapt to differences in the quality, blue film material, blue film thickness, and tightness of the blue film of different iron ring wafers A; moreover, by the combined action of the self-weight of the frame portion A2 (specifically, the iron ring), the edge-locking mechanism 160, and the top film member 120, the tightness of the adhesive film portion A1 is achieved, which not only avoids the wafer contacting the carrier plate 110 and being contaminated or damaged but also realizes the backside loading fixation and detection of the iron ring wafer A.

[0055] It should be noted that the "front-side loading" and "backside loading" described in this application are relative concepts. Among them, "front-side loading" means that the iron ring wafer A is placed on the carrier device with the front side of the wafer facing upward and is carried and fixed, and "backside loading" means that the iron ring wafer A is placed on the carrier device with the front side of the wafer facing downward and is carried and fixed.

[0056] In some embodiments, please refer to Figures 2 to 5, the transition part 112 is provided with a groove 1121, the top film member 120 is disposed in the groove 1121, and the upper surface of the top film member 120 is lower than the upper surface of the transition part 112. Exemplarily, the groove 1121 may be an annular groove surrounding the adsorption part 111, the top film member 120 may be a first circular ring structure surrounding the center of the carrier plate 110 and disposed in the groove 1121, and the top film member 120 may also be a second annular structure composed of a plurality of arc-shaped structures arranged at intervals in the groove 1121.

[0057] Thus, by accommodating the top film member 120 in the groove 1121, the structural integration between the top film member 120 and the carrier plate 110 can be achieved without increasing the overall thickness of the carrier plate 110; when the iron-ring wafer A is positively carried, since the top film member 120 is accommodated in the groove 1121 and the upper surface of the top film member 120 is lower than the upper surface of the transition part 112, the top film member 120 can be prevented from lifting the adhesive film part A1 and affecting the adsorption and fixation effect of the adsorption part 111 on the wafer part A3; conversely, when the iron-ring wafer A is negatively carried, by virtue of the annular structure form of the top film member 120, the adhesive film part A1 can be supported and lifted omnidirectionally by 360 degrees, and combined with the self-gravity of the frame part A2, the wafer part A3 or the wafer can be horizontally suspended above the carrier plate 110 to meet the requirements of back inspection.

[0058] In other embodiments, the top film member 120 may also adopt other suitable structural forms. For example, the top film member 120 is a columnar structure penetrating the transition part 112, and there are a plurality of top film members 120 arranged at intervals around the center of the carrier plate 110; thus, by driving the plurality of top film members 120 to lift and lower synchronously through the driving mechanism 140, when the top film members 120 extend from the transition part 112 to a position higher than the upper surface of the adsorption part 111, the adhesive film part A1 can be supported and lifted, and the wafer or the wafer part A3 can be horizontally suspended above the adsorption part 111. All these are not elaborated here.

[0059] In some embodiments, please refer to Figure 5 , the top film member 120 includes a top film part 121 close to the adsorption part 111 and a connecting part 122 surrounding and connecting the top film part 121; wherein, the upper surface of the top film part 121 is higher than the upper surface of the connecting part 122. Thus, based on the structural form that the connecting part 122 surrounds the top film part 121 and the height difference between the upper surfaces of the two, the top film member 120 can be integrally constructed into a stepped structural form.

[0060] On the one hand, taking advantage of the structural feature that the width ratio of the top film portion 121 in the top film member 120 is relatively small (for example, the width of the top film portion 121 can be set to 2 - 3 mm), while the top film portion 121 supports and lifts the adhesive film portion A1, the contact area and frictional force between the top film member 120 and the adhesive film portion A1 can be effectively reduced. This is conducive to tightly stretching and flattening the blue film under the action of the self - gravity of the frame portion A2, so that the wafer is horizontally suspended above the adsorption portion 111.

[0061] On the other hand, taking advantage of the feature that the width ratio of the connecting portion 122 in the top film member 120 is relatively large, based on the stable structural connection relationship between the connecting portion 122 in the top film member 120 and the driving mechanism 140, the driving mechanism 140 can stably drive the connecting portion 122 to drive the top film portion 121 to move up and down, so that the top film portion 121 rises out of the groove 1121 to lift the adhesive film portion A1. It should be noted that the so - called "width" here can be understood as the dimension of the connecting portion 122 or the top film portion 121 in the radial direction of the carrier 110.

[0062] In some embodiments, referring to Figure 2 、 Figure 5 and Figure 6 ,the driving mechanism 140 includes a first driving member 141, a first lifting plate 142, a first lifting column 143 and a first elastic member 144. Among them, the body of the first driving member 141 is connected to the carrier 110, and the power end of the first driving member 141 is connected to the first lifting plate 142 to drive the first lifting plate 142 to move up and down relative to the carrier 110. The first end of the first lifting column 143 extends into the groove 1121 and is connected to the top film member 120 (specifically, such as the connecting portion 122). One end of the first elastic member 144 is connected to the carrier 110, and the other end is connected to the second end of the first lifting column 143. For example, the first elastic member 144 can be a spring sleeved on the first lifting column 143. And the first lifting plate 142 corresponds to the second end of the first lifting column 143.

[0063] When the first driving member 141 drives the first lifting plate 142 to rise, the first lifting plate 142 can abut against and act on the second end of the first lifting column 143, thereby driving the first lifting column 143 to drive the top film member 120 to rise (at this time, the first elastic member 144 is compressed by the first lifting column 143 to store elastic potential energy), so that the top film member 120 can lift the adhesive film portion A1. Conversely, when the first driving member 141 drives the first lifting plate 142 to descend, the first elastic member 144 will release the elastic potential energy to provide an elastic force to promote the first lifting column 143 to drive the top film member 120 to descend synchronously, so that the top film member 120 descends to a position where its upper surface is lower than the upper surface of the bearing portion 113 (for example, the top film portion 121 enters the groove 1121).

[0064] In this way, by setting the driving mechanism 140 as a split matching structure, the top membrane member 120 can be raised and lowered more smoothly under the cooperation of the first driving member 141 (together with the first lifting plate 142) and the first elastic member 144; at the same time, it is also beneficial to reduce the difficulty of disassembly and assembly of the supporting assembly 100.

[0065] For some examples, see Figures 3 to 6 The number of the first lifting columns 143 can be set to multiple, such as two, three, four or more, and the multiple first lifting columns 143 are arranged at intervals around the center of the transition portion 112, and the first ends of the multiple first lifting columns 143 are respectively connected to the top membrane member 120; correspondingly, the first elastic member 144 corresponds to the first lifting columns 143 one by one, and the multiple first lifting columns 143 correspond to the same first lifting plate 142, that is, the first lifting plate 142 can simultaneously drive the multiple first lifting columns 143 to rise or fall.

[0066] In this way, by setting up multiple first lifting columns 143, multiple connection positions or action positions can be formed between the top membrane part 120 and the driving mechanism 140. In this way, with the cooperation of the first lifting plate 142 and the first elastic part 144, the force applied to the top membrane part 120 during the lifting process can be more balanced, which can effectively improve the stability of the lifting of the top membrane part 120 and help simplify the structure of the supporting component 100.

[0067] In other embodiments, the driving mechanism 140 may also adopt other suitable structural forms. For example, the first elastic member 144 may be omitted, and the second end of the first lifting column 143 may be directly connected to the first lifting plate 142. The first driving member 141 may drive the first lifting plate 142 to move upward and downward, thereby driving the top film member 120 to move upward and downward via the first lifting column 143. For another example, the power end of the first driving member 141 may be directly connected to the top film member 120 to directly drive the top film member 120 to move upward and downward. All of these details will not be elaborated here.

[0068] In some embodiments, the first drive member 141 can be an electric cylinder. Leveraging its highly controllable speed and acceleration, and its ability to stop at any position within its travel range, the electric cylinder effectively controls the elevation and speed of the top film member 120, adapting to varying iron ring wafers A and enabling precise adjustment of the tension of the blue film. Alternatively, the first drive member 141 can be a pneumatic cylinder, which offers low and controllable pneumatic pressure and a short travel range, thus preventing the top film member 120 from overlifting the adhesive film portion A1 and potentially damaging the blue film.

[0069] For some examples, see Figure 5 、 Figure 6 、 Figure 10 and Figure 11, the carrying component 100 further includes a limiting structure, which is mainly used to limit the lifting stroke of the top film member 120 by restricting the lifting stroke of the first lifting plate 142, so that the top film member 120 can stay at the required height position. Specifically, the limiting structure includes a first limiting member 151 and a second limiting member 152; wherein, the first limiting member 151 is fixedly arranged relative to the first driving member 141. For example, the first limiting member 151 can be connected to the body of the first driving member 141 or to the carrying tray 110; the second limiting member 152 is fixedly arranged relative to the first lifting plate 142. For example, the second limiting member 152 can be connected to the first lifting plate 142 or to the power end of the first driving member 141.

[0070] Exemplarily, please refer to Figure 10 , the first limiting member 151 and the second limiting member 152 cooperate to form a mechanical limiting structure. Specifically, the number of the first limiting members 151 can be set to two, and the two first limiting members 151 are arranged at intervals up and down. At least part of the second limiting member 152 is located between the two first limiting members 151. When the first driving member 141 drives the first lifting plate 142 to rise to the first preset height position, the second limiting member 152 will abut against the upper first limiting member 151, thereby preventing the first lifting plate 142 from rising further; conversely, when the first driving member 141 drives the first lifting plate 142 to descend to the second preset height position, the second limiting member 152 will abut against the lower first limiting member 151, thereby preventing the first lifting plate 142 from descending further. By utilizing the mechanical abutting relationship between the first limiting member 151 and the second limiting member 152, the lifting stroke of the first lifting plate 142 or the top film member 120 is restricted.

[0071] Exemplarily, please refer to Figure 11 , the first limiting member 151 and the second limiting member 152 cooperate to form an optoelectronic limiting structure. Specifically, the number of the first limiting members 151 is set to two, and the two first limiting members 151 are arranged at intervals up and down, and the first limiting member 151 can be a travel sensor, a pressure sensor, an infrared sensor, etc.; at least part of the second limiting member 152 is located between the two first limiting members 151. When the first driving member 141 drives the first lifting plate 142 to rise to the first preset height position, the second limiting member 152 will trigger the upper first limiting member 151, and the first driving member 141 stops driving the first lifting plate 142 to rise according to the trigger information at this time; conversely, when the first driving member 141 drives the first lifting plate 142 to descend to the second preset height position, the second limiting member 152 will trigger the lower first limiting member 151, and the first driving member 141 stops driving the first lifting plate 142 to descend according to the trigger information at this time. In this way, the lifting stroke of the first lifting plate 142 or the top film member 120 can also be restricted.

[0072] In some embodiments, please refer to Figure 10 and Figure 11 , the limiting structure can be set to two groups. One group is a mechanical limiting structure, and the other group is an optoelectronic limiting structure. In this way, the lifting stroke of the first lifting plate 142 or the top film member 120 can be reliably limited within a preset stroke range; when carrying on the back side, it is ensured that the top film member 120 can effectively lift the adhesive film portion A1, so that the iron ring wafer A is spaced from the adsorption portion 111; when carrying on the front side, it is ensured that the upper surface of the top film member 120 is lower than the upper surface of the transition portion 112, ensuring the adsorption and fixing effect of the adsorption portion 111 on the wafer portion A3.

[0073] In some embodiments, please refer to Figure 3 and Figure 6 , the carrying assembly 100 further includes a guiding structure. The guiding structure includes a first guiding member 153 and a second guiding member 154 that are slidably connected. For example, one of the first guiding member 153 and the second guiding member 154 can be a guide rail seat, and the other can be a sliding table; wherein, the first guiding member 153 is connected to the first lifting plate 142, and the second guiding member 154 is connected to the carrying plate 110. During the process of the first driving member 141 driving the first lifting plate 142 to lift and lower, by virtue of the sliding connection relationship between the first guiding member 153 and the second guiding member 154, the first lifting plate 142 can be guided to perform linear lifting and lowering, thereby indirectly realizing the stable lifting and lowering of the top film member 120; at the same time, using the guiding structure to establish a structural connection relationship between the first lifting plate 142 and the carrying plate 110 is also beneficial to enhancing the structural stability between the driving mechanism 140 and the carrying plate 110.

[0074] In some embodiments where the first driving member 141 drives a plurality of first lifting columns 143 to drive the top film member 120 to rise, the first driving member 141 and the guiding structure can be symmetrically arranged about the center of the carrying plate 110, so as to ensure the smoothness of the lifting movement of the first lifting plate 142.

[0075] In some embodiments, please refer to Figure 2 , Figure 3 , Figure 6 and Figure 9, the carrier component 100 further includes one or more edge locking mechanisms 160 disposed on the carrying portion 113; wherein, a plurality of edge locking mechanisms 160 can be arranged at intervals around the center of the carrying portion 113; during back inspection, since the iron ring wafer A is separated from the adsorption portion 111 and is not affected by vacuum adsorption, at this time, the top film member 120 is used to lift the adhesive film portion A1, and the frame portion A2 is fixed by the edge locking mechanism 160, which can effectively prevent the iron ring wafer A from slipping relative to the carrier plate 110 and the like, realizing the stable carrying of the iron ring wafer A, so as to facilitate the back inspection of the wafer. At the same time, as described above, when it is not possible to determine whether the lifting height of the top film member 120 is appropriate, when the top film member 120 jacks up the adhesive film portion A1 and the frame portion A2 falls to the carrying portion 113 and stretches the adhesive film portion A1, the frame portion A2 can be first locked and fixed on the carrying portion 113 by the edge locking mechanism 160, and then the driving mechanism 140 is used to drive the top film member 120 to lift and lower, and the top film member 120 is adjusted to an appropriate height, so as to finally tighten the adhesive film portion A1 and ensure that the wafer portion A3 is horizontally suspended above the adsorption portion 111 without moving.

[0076] Exemplarily, please refer to Figure 9 , the edge locking mechanism 160 includes a third driving member 161 and a pressing block 162; wherein, the body of the third driving member 161 is connected to the carrier plate 110, and the power end of the third driving member 161 is coupled to the pressing block 162. By driving the pressing block 162 to rotate relative to the carrier plate 110 through the third driving member 161, the fixing and releasing of the frame portion A2 can be realized. Specifically, when the top film member 120 jacks up the adhesive film portion A1 and the frame portion A2 is released on the carrying portion 113, the pressing block 162 is driven by the third driving member 161 to rotate to the upper side of the frame portion A2, and the frame portion A2 can be pressed and fixed on the carrying portion 113.

[0077] In other embodiments, the edge locking mechanism 160 can also be an adsorption structure disposed on the carrying portion 113, such as a vacuum chuck, an electromagnet, a magnet, etc.; when the frame portion A2 is released on the carrying portion 113, the frame portion A2 can be fixed by adsorption, and the slipping and other phenomena of the iron ring wafer A relative to the carrier plate 110 can also be avoided.

[0078] In some embodiments, please refer to Figure 3 、 Figure 4 and Figure 6The conveying member 130 includes a second lifting column 131 and a second elastic member 132; wherein the second lifting column 131 is arranged through the carrying part 113, and the first end of the second lifting column 131 is used to contact the frame part A2 of the iron ring wafer A, one end of the second elastic member 132 is connected to the carrying plate 110, and the other end is connected to the second end of the second lifting column 131. For example, the second elastic member 132 can be a spring sleeved on the second lifting column 131; correspondingly, the driving assembly 200 includes a second driving member 210 and a second lifting plate 220; wherein the second lifting plate 220 corresponds to the second end of the second lifting column 131, and the second driving member 210 can include a power device such as a cylinder or an electric cylinder that can output linear motion and is arranged on the motion platform 300, and the power end of the second driving member 210 is coupled to the second lifting plate 220.

[0079] In this way, the second driving member 210 drives the second lifting plate 220 to rise and fall relative to the supporting plate 110, and when the second lifting plate 220 rises, it can abut against the second end of the second lifting column 131 to drive the second lifting column 131 to rise synchronously (at this time, the second elastic member 132 will be compressed by the second lifting column 131 to store elastic potential energy), thereby supporting the frame part A2 through the second lifting column 131 to achieve the support of the iron ring wafer A; conversely, when the second lifting plate 220 descends, the second elastic member 132 will release the elastic potential energy to provide an elastic force that prompts the second lifting column 131 to drive the frame part A2 to descend synchronously, until the film part A1 falls on the top film part 120 or the frame part A2 falls on the supporting part 113, thereby achieving the release of the iron ring wafer A.

[0080] For some examples, see Figure 3 and Figure 4 The number of conveying members 130 is set to be multiple, and the multiple conveying members 130 are arranged at intervals around the center of the carrying part 113, and the multiple conveying members 130 correspond to the same second lifting plate 220; in this way, with the help of the second lifting plate 220, the multiple conveying members 130 can be driven to rise synchronously, so as to support the frame part A2 from different positions through the multiple conveying members 130, so as to achieve smooth acceptance and release of the iron ring wafer A; moreover, the multiple conveying members 130 share a driving component 200, which is conducive to reducing the overall structural complexity of the carrying device; in addition, the driving component 200 and the conveying member 130 adopt a relatively independent structural system and cooperate with each other, which is also conducive to reducing the difficulty of disassembly and assembly of the carrying device.

[0081] Considering that the device under test usually has different external dimensions. For example, common wafers have two specifications of 8 inches and 12 inches. Correspondingly, the dimensions of the wafer part A3 and the frame part A2 of the iron ring wafer A are also different. Due to the large size difference between the 8-inch and 12-inch iron ring wafers A, it is not easy to set the top film part 120 and related functional structures adapted to the 8-inch and 12-inch iron ring wafers A on the same carrier plate 110. However, if a set of loading devices is set for each specification of the iron ring wafer A respectively, it will inevitably increase the configuration cost, detection cost, etc. of the loading device or the detection equipment.

[0082] Therefore, in some embodiments, the number of the loading components 100 is set to be multiple, and different loading components 100 are configured to load devices under test with different external dimensions. For example, one of the multiple loading components 100 is set to be able to load and fix the 8-inch iron ring wafer A, and another one of the multiple loading components 100 is configured to be able to load and fix the 12-inch iron ring wafer A. At the same time, please refer to Figure 3 、 Figure 4 、 Figure 6 、 Figure 12 and Figure 13 ,the loading device further includes a moving platform 300. A first positioning seat 310 is arranged on the moving platform 300. Each loading component 100 includes a second positioning seat 170 that plays a role in loading the respective carrier plate 110 (for example, the second positioning seat 170 is centrally arranged at the bottom of the carrier plate 110). The first positioning seat 310 and the second positioning seat 170 are mutually matched and detachably connected.

[0083] In this way, by using the detachable connection relationship between the first positioning seat 310 and the second positioning seat 170, a quick-change structure can be formed between the loading component 100 and the moving platform 300, so that the multiple loading components 100 can be detachably connected to the moving platform 300 in a mutually replaceable manner. Thus, according to the different size specifications of the iron ring wafer A, the corresponding loading component 100 can be selectively combined with the moving platform 300 to form a loading device, which can not only meet the requirements of the front inspection and back inspection of devices under test with different specifications and sizes, but also effectively save the transformation time of the loading device structure system and improve the detection efficiency. At the same time, the multiple loading components 100 share the same moving platform 300, which can also effectively improve the utilization rate of the moving platform 300 and related functional components and reduce the configuration and use costs of the loading device.

[0084] In some embodiments, please refer to Figure 6 、 Figure 12 and Figure 13, the first positioning seat 310 is provided with at least three first positioning members 311, and the second positioning seat 170 is provided with at least three second positioning members 171 arranged at intervals along the center of the carrier plate 110. The first positioning members 311 and the second positioning members 171 correspond to each other one by one and are inserted and connected. For example, one of the corresponding first positioning member 311 and second positioning member 171 has a groove structure extending in the radial direction of the carrier plate 110, and the other has a convex structure that can be inserted into the corresponding groove structure.

[0085] When the carrier assembly 100 is connected to the moving platform 300 through the cooperation of the second positioning seat 170 and the first positioning seat 310, by using the insertion and connection relationship between the first positioning member 311 and the second positioning member 171, as well as the quantity and arrangement relationship between the two, the carrier assembly 100 can be prevented from rotating and translating relative to the first positioning seat 310, so as to stably limit the carrier assembly 100 on the moving platform 300; conversely, if the carrier assembly 100 needs to be replaced, only an upward force along the thickness direction of the carrier plate 110 needs to be applied to the carrier assembly 100, and the carrier assembly 100 can be removed from the moving platform 300, thereby realizing the quick disassembly, installation and switching of different carrier assemblies 100 based on the same moving platform 300.

[0086] In some embodiments, please refer to Figure 6 , Figure 12 and Figure 13 , the first positioning seat 310 is further provided with a first magnetic attraction member 312, and the second positioning seat 170 is further provided with a second magnetic attraction member 172 for aligning and attracting with the first magnetic attraction member 312 one by one; wherein, one of the first magnetic attraction member 312 and the second magnetic attraction member 172 can be a magnet, and the other can be made of a ferromagnetic material; the quantity of the first magnetic attraction member 312 and the second magnetic attraction member 172 can be set to be multiple, for example, the second magnetic attraction member 172 and the second positioning member 171 are arranged alternately around the center of the carrier plate 110.

[0087] In this way, relying on the alignment and attraction relationship between the first magnetic attraction member 312 and the second magnetic attraction member 172, the first positioning seat 310 and the second positioning seat 170 can be prevented from moving along the thickness direction of the carrier plate 110. Furthermore, under the action of the gravity of the carrier assembly 100 and the cooperation of the first positioning member 311 and the second positioning member 171, the carrier assembly 100 can be effectively prevented from rotating, translating and moving up and down relative to the first positioning seat 310, so as to more firmly limit and connect the carrier assembly 100 to the moving platform 300.

[0088] Please refer to Figure 3 , Figure 4 and Figure 12, in some embodiments as described above, the driving assembly 200 may be disposed on the moving platform 300. At this time, a plurality of sets of supporting structures 230 may be disposed on the second lifting plate 220, and different sets of supporting structures 230 correspond to the positions of the conveying members 130 in different loading assemblies 100. In this way, when the second driving member 210 drives the second lifting plate 220 to lift or lower, the corresponding conveying member 130 can be driven to lift or lower by utilizing the position corresponding relationship between the supporting structure 230 and the conveying member 130. At the same time, by sharing the driving assembly 200, it is also beneficial to simplify the structural complexity of the loading assembly 100 and improve the utilization rate of the moving platform 300, the driving assembly 200 and related functional components.

[0089] In some embodiments, in order to save the structural space occupied by components such as the loading tray 110 and provide support for arranging components such as the top film member 120 on the loading tray 110, the pipelines (such as air duct pipelines, etc.) and circuits (such as connecting cables, etc.) in the loading assembly 100 may adopt an external wiring method. At this time, the corresponding pipelines may adopt a quick-insert structure to be connected to an external control source (such as a negative pressure air source, a control device, etc.), so that when switching the loading assembly 100, the loading assembly 100 can be disassembled and assembled as a whole.

[0090] Specifically, the loading assembly 100 further includes one or more first pipeline connectors (not shown in the figure). The first pipeline connector may include connectors connected to the loading tray 110 (specifically, the adsorption part 111), the driving mechanism 140 (such as the first driving member 141 using a cylinder) through corresponding air duct pipelines, and may also include connectors connected to the driving mechanism 140 (such as the first driving member 141 using an electric cylinder), the photoelectric limit structure, etc. through corresponding power supply or signal cables.

[0091] By detachably connecting the first pipeline connector to the second pipeline connector of the external control source (such as plugging and unplugging connection), both the air path connection or electrical connection between the loading assembly 100 and the external control source can be realized, and it is also convenient to disassemble, assemble and combine the loading assembly 100 as a whole with the moving platform 300, the external control source, the driving assembly 200, etc., so as to realize the quick switching between different loading assemblies 100. In order to meet the requirement of quickly switching different loading assemblies 100, the transformation time of the structural system of the loading device is further saved.

[0092] In some embodiments, the moving platform 300 is configured to drive the loading assembly 100 to rotate, so as to drive the iron ring wafer A to rotate synchronously through the loading assembly 100, and adjust the detected position of the iron ring wafer A to meet the requirements of front inspection or back inspection. Specifically, please refer to Figure 2 and Figure 4, the motion platform 300 includes a support portion 320 and a rotating portion 330 that rotates controllably relative to the support portion 320; wherein, the first positioning seat 310 is connected to the rotating portion 330 and rotates synchronously therewith, so that the bearing assembly 100 can rotate synchronously with the first positioning seat 310; while the driving assembly 200 and the like can be arranged on the support portion 320.

[0093] Meanwhile, the support portion 320 is provided with a third limiting member 340, and the bearing assembly 100 further includes a fourth limiting member 180 connected to the bearing disk 110. Through the cooperation of the third limiting member 340 and the fourth limiting member 180, the rotation stroke of the bearing assembly 100 can be restricted, so that the rotating portion 330 drives the bearing assembly 100 to rotate within a preset angle range, thereby avoiding breaking the pipelines (such as air duct pipelines, signal / supply cables, etc.) in the bearing assembly 100 due to excessive rotation angle of the bearing assembly 100.

[0094] Exemplarily, please refer to Figure 2 , the third limiting member 340 and the fourth limiting member 180 cooperate to form a mechanical limiting structure. Specifically, the number of the third limiting members 340 can be set to two, and the two third limiting members 340 are arranged on the support portion 320 at intervals along the rotation trajectory of the bearing assembly 100, and at least part of the fourth limiting member 180 can be located between the two third limiting members 340. When the rotating portion 330 drives the bearing assembly 100 to rotate to the first preset angle position or the second preset angle position, the fourth limiting member 180 will abut against the corresponding third limiting member 340 to prevent the bearing assembly 100 from continuing to rotate, thereby forming a restriction on the rotation stroke of the bearing assembly 100.

[0095] Exemplarily, please refer to Figure 2 , the third limiting member 340 and the fourth limiting member 180 cooperate to form an optoelectronic limiting structure. Specifically, the number of the third limiting members 340 is set to two, and the two third limiting members 340 are arranged on the support portion 320 at intervals along the rotation trajectory of the bearing assembly 100, and the third limiting member 340 can be a travel sensor, a pressure sensor, an infrared sensor, etc.; at least part of the fourth limiting member 180 is located between the two third limiting members 340. When the rotating portion 330 drives the bearing assembly 100 to rotate to the first preset angle position or the second preset angle position, the fourth limiting member 180 will trigger the corresponding third limiting member 340, and the motion platform 300 or the relevant control device can stop the rotating portion 330 from driving the bearing assembly 100 to rotate according to the trigger information of the third limiting member 340, thereby realizing the restriction on the rotation stroke of the bearing assembly 100.

[0096] In some embodiments, the third limiting member 340 and the fourth limiting member 180 can be set in two groups, one group being a mechanical limiting structure and the other group being an optoelectronic limiting structure, so that the rotation stroke of the carrying assembly 100 can be reliably limited within a preset stroke range.

[0097] The above uses specific examples to elaborate on the present application, which is only used to help understand the present application and is not intended to limit the present application. For those skilled in the technical field to which the present application pertains, based on the idea of the present application, several simple deductions, deformations or substitutions can also be made.

Claims

1. A carrying device, characterized in that, It includes a bearing assembly and a driving assembly, wherein the bearing assembly includes a bearing plate, a top film member, a transmission member and a driving mechanism; wherein: The carrier plate includes an adsorption portion, a transition portion surrounding the adsorption portion, and a bearing portion surrounding the transition portion, wherein the upper surface of the bearing portion is lower than the upper surfaces of the adsorption portion and the transition portion; the top film member is disposed in the transition portion, and the conveying member is disposed in the bearing portion; The driving mechanism is configured to drive the top film member to rise and fall relative to the carrier plate, so as to lift the film portion of the test piece by the top film member, so that the test piece is spaced apart from the adsorption portion; The driving assembly is configured to drive the conveying member to rise and fall relative to the carrying plate, so as to receive or release the tested object through the conveying member.

2. The carrying device according to claim 1, characterized in that, The transition portion is provided with a groove, the top film member is arranged in the groove, and the upper surface of the top film member is lower than the upper surface of the transition portion.

3. The bearing device according to claim 2, characterized in that, The top membrane part includes a top membrane part close to the adsorption part and a connecting part surrounding the top membrane part. The upper surface of the top membrane part is higher than the upper surface of the connecting part. The connecting part is connected to the driving mechanism, and the driving mechanism drives the connecting part to drive the top membrane part to rise and fall.

4. The carrying device according to claim 2, characterized in that, The driving mechanism includes a first driving member, a first lifting plate, a first lifting column and a first elastic member; wherein: The first end of the first lifting column extends into the groove and is connected to the top film member. The first driving member is connected to the carrying plate. The first driving member is used to drive the first lifting plate to move up and down. The first lifting plate acts on the second end of the first lifting column to drive the first lifting column to drive the top film member to move up. One end of the first elastic member is connected to the carrying plate, and the other end is connected to the second end of the first lifting column. The first elastic member is used to provide an elastic force that prompts the first lifting column to drive the top membrane member to descend.

5. The carrier device according to claim 4, wherein The bearing assembly further includes a guide structure and / or a limiting structure, wherein: The guide structure is used to guide the first lifting plate to move up and down linearly, and the guide structure includes a first guide member and a second guide member that are slidably connected, the first guide member is connected to the first lifting plate, and the second guide member is connected to the carrying plate; The limiting structure is used to limit the lifting stroke of the first lifting plate. The limiting structure includes a first limiting member and a second limiting member that cooperate with each other. The first limiting member is fixed relative to the first driving member, and the second limiting member is fixed relative to the first lifting plate.

6. The bearing device according to claim 1, wherein The conveying member includes a second lifting column and a second elastic member, the second lifting column is arranged through the carrying portion, a first end of the second lifting column is used to contact the test piece, and one end of the second elastic member is connected to the carrying plate and the other end is connected to the second end of the second lifting column; The second elastic member is used to provide an elastic force to cause the second lifting column to descend; the driving assembly acts on the second end of the second lifting column to drive the second lifting column to ascend.

7. The carrying device according to claim 1, wherein, The carrying assembly further includes a locking mechanism; the locking mechanism is provided on the carrying portion and is used to fix the tested object; And / or the carrier assembly further includes one or more first pipeline connectors; the first pipeline connectors are configured to be detachably connected to the second pipeline connectors of an external control source to achieve a gas path connection or an electrical connection between the carrier assembly and the external control source.

8. The carrying device according to any one of claims 1-7, characterized in that, The carrier device further includes a first positioning seat for being arranged on the moving platform, and the carrier assembly further includes a second positioning seat for carrying the carrier plate; the first positioning seat and the second positioning seat are detachably connected to detachably connect the carrier assembly to the moving platform.

9. The bearing device according to claim 8, wherein The first positioning seat is provided with at least three first positioning members, and the second positioning seat is provided with at least three second positioning members arranged around the center of the carrier plate; the first positioning members and the second positioning members correspond to each other one by one and are inserted and connected to prevent the carrier assembly from rotating and translating relative to the first positioning seat.

10. The carrying device according to claim 9, wherein The first positioning seat is further provided with a first magnetic attracting member, and the second positioning seat is provided with a second magnetic attracting member; the first magnetic attracting member and the second magnetic attracting member are attracted in alignment to prevent the first positioning seat and the second positioning seat from moving in the thickness direction of the carrier plate.

11. The bearing device according to claim 8, characterized in that, The number of the carrier assemblies is set to be multiple, and different carrier assemblies are used to carry workpieces to be measured with different external dimensions; each carrier assembly includes the second positioning seat matching the first positioning seat, so that the multiple carrier assemblies can be detachably connected to the moving platform in a mutually replaceable manner.

12. The bearing device according to claim 8, wherein The driving assembly includes a second driving member and a second lifting plate, the second driving member is arranged on the moving platform and is used to drive the second lifting plate to lift; the second lifting plate has a supporting structure corresponding to the conveying members in different carrier assemblies, and the second lifting plate drives the corresponding conveying members to lift through the supporting structure.

13. The carrier device according to claim 8, characterized in that, The moving platform includes a supporting portion and a rotating portion that can be controllably rotated relative to the supporting portion; the first positioning seat is connected to the rotating portion and rotates synchronously, and the carrier assembly rotates synchronously with the first positioning seat; Wherein, the supporting portion is provided with a third limiting member, and the carrier assembly further includes a fourth limiting member connecting the carrier plate; the third limiting member and the fourth limiting member cooperate to limit the rotation stroke of the carrier assembly.

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