Inversion device, imaging device, inversion method, and imaging method

Abstract

The present invention inverts polycrystalline silicon having different shapes and / or sizes so as to image the polycrystalline silicon. The reversing device (3) is provided with: a first clamping section (31) having a first elastically deformable section (311) that is elastically deformable; a second clamping part (32) which is provided with a second elastic deformation part (321) capable of elastically deforming; and inversion mechanisms (33A, 33B) that, in a sandwiched state in which the polycrystalline silicon (S) is sandwiched between the first elastic deformation section (311) and the second elastic deformation section (321), invert the polycrystalline silicon (S) so as to image the polycrystalline silicon (S).

Description

Technical Field

[0001] The present invention relates to an inversion device, a photographing device, an inversion method, and a photographing method. Background Art

[0002] Patent Document 1 discloses a method for classifying polysilicon, in which a silicon rod or a silicon block is photographed to generate an image, and the silicon rod or the silicon block is classified based on the generated image.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2022-537014

[0006] In the method for classifying polysilicon disclosed in Patent Document 1, there is a problem that when photographing a silicon rod or a silicon block disposed on a predetermined placement surface, a part of the side surface of the placement surface in the silicon rod or the silicon block cannot be photographed. An object of one aspect of the present invention is to invert polysilicon having at least one of different shapes and sizes in order to photograph the polysilicon. Summary of the Invention

[0007] To solve the above problems, an inversion device according to one aspect of the present invention includes: a first clamping portion having a first elastically deformable portion; a second clamping portion having a second elastically deformable portion; and an inversion mechanism that inverts the polysilicon in a clamped state where the polysilicon is clamped between the first elastically deformable portion and the second elastically deformable portion in order to photograph the polysilicon.

[0008] A photographing device according to one aspect of the present invention includes: a first clamping portion having a first elastically deformable portion; a second clamping portion having a second elastically deformable portion; an inversion mechanism that inverts the polysilicon in a clamped state where the polysilicon is clamped between the first elastically deformable portion and the second elastically deformable portion; and a photographing portion that can photograph the polysilicon inverted by the inversion mechanism.

[0009] An inversion method according to one aspect of the present invention includes: a clamping step of clamping polysilicon between a first elastically deformable portion of a first clamping portion and a second elastically deformable portion of a second clamping portion; and an inversion step of inverting the polysilicon in a clamped state where the polysilicon is clamped by the clamping step in order to photograph the polysilicon.

[0010] The photographing method according to one aspect of the present invention includes: a clamping step of clamping polysilicon between a first elastically deformable portion provided in a first clamping portion and a second elastically deformable portion provided in a second clamping portion; a reversing step of reversing the polysilicon in a clamped state where the polysilicon is clamped by the above-described clamping step; and a photographing step of photographing the polysilicon reversed by the above-described reversing step.

[0011] Advantages of the Invention

[0012] According to one aspect of the present invention, it is possible to reverse polysilicon with at least one of the shape and size being different in order to photograph the polysilicon. Description of the Drawings

[0013] Figure 1 It is a schematic diagram showing the configuration of the photographing device according to Embodiment 1 of the present invention.

[0014] Figure 2 It is for Figure 1 explaining the operation of the reversing device provided in the photographing device shown.

[0015] Figure 3 It is for Figure 1 explaining the operation of the reversing device provided in the photographing device shown.

[0016] Figure 4 It is showing Figure 1 the configuration of the dome portion, the photographing portion, and the irradiation portion provided in the photographing device shown.

[0017] Figure 5 It is a diagram showing the configuration of the dome portion, the photographing portion, and the irradiation portion provided in the photographing device according to Embodiment 2 of the present invention.

[0018] Figure 6 It is a schematic diagram showing the configuration of the photographing device according to Embodiment 3 of the present invention. Detailed Description of the Invention

[0019] 〔Embodiment 1〕

[0020] Figure 1 It is a schematic diagram showing the configuration of the photographing device 1 according to Embodiment 1 of the present invention. In Figure 1 it, the extending direction of the transfer mechanism 2 is set as the X-axis direction, the direction from the transfer mechanism 2 toward the dome portion 4 is set as the Z-axis direction, and the direction orthogonal to both the X-axis direction and the Z-axis direction is set as the Y-axis direction. The X-axis direction and the Z-axis direction are orthogonal to each other. The definitions of the X-axis direction, the Y-axis direction, and the Z-axis direction described here are also applicable to other figures.

[0021] <Configuration of the Photographing Device 1>

[0022] As shown Figure 1 in FIG. 1, the photographing device 1 includes a transfer mechanism 2, a reversing device 3, a dome parts 4 and 7, photographing parts 5 and 8, irradiation parts 6 and 9, and a control part 10. The photographing device 1 is a device for discriminating the surface state, shape, and size of the polysilicon S by photographing the polysilicon S. The polysilicon S is disposed on the first clamping part 31 or the second clamping part 32 of the reversing device 3. A plurality of polysilicon S may be disposed on the first clamping part 31 or the second clamping part 32. The number of the polysilicon S disposed on the first clamping part 31 or the second clamping part 32 is, for example, one or two.

[0023] The polysilicon S supplied to the photographing device according to one aspect of the present invention is a pulverized product of polysilicon obtained by pulverizing a silicon rod or a silicon block manufactured by a known method. As the shape of the polysilicon S, various forms such as a flat shape or a fist shape may be included. In addition, as the size of the polysilicon S, an appropriate size is selected according to the use, but generally, it is selected within a range of 10 mm or more and 150 mm or less in the major axis.

[0024] Moreover, by performing surface purification using an etching process, a pulverized product of high-purity polysilicon can be obtained as the pulverized product of polysilicon. As the polysilicon S supplied to the photographing device according to one aspect of the present invention, both the pulverized product of polysilicon after surface purification and the pulverized product of polysilicon before surface purification can be used.

[0025] The transfer mechanism 2 transfers the polysilicon S in the +X-axis direction by transferring the first clamping part 31 or the second clamping part 32 in the +X-axis direction. The reversing device 3 and the dome parts 4 and 7 are disposed on the +Z-axis direction side in the transfer mechanism 2. In addition, toward the +X-axis direction, the dome part 4, the reversing mechanisms 33A and 33B of the reversing device 3, and the dome part 7 are disposed in this order.

[0026] <Configuration of the reversing device 3>

[0027] Figure 2 And Figure 3 is a diagram for explaining the operation of the reversing device 3 included in the photographing device 1 shown Figure 1 in FIG. 2. Figure 2 The reference numeral 101 in the drawing indicates a case where the second clamping part 32 on which the polysilicon S is disposed is transferred by the transfer mechanism 2 from the position of the dome part 4 to the position where the reversing mechanisms 33A and 33B are disposed on the transfer mechanism 2. Figure 1 The reference numeral 102 in the drawing indicates a case where the state shown by the reference numeral 101 in the drawing migrates to a clamped state in which the polysilicon S is clamped by the first clamping part 31 and the second clamping part 32. Figure 2 The reference numeral 102 in the drawing indicates a case where the state shown by the reference numeral 101 in the drawing migrates to a clamped state in which the polysilicon S is clamped by the first clamping part 31 and the second clamping part 32. Figure 2 The reference numeral 102 in the drawing indicates a case where the state shown by the reference numeral 101 in the drawing migrates to a clamped state in which the polysilicon S is clamped by the first clamping part 31 and the second clamping part 32.

[0028] Figure 2 Reference numeral 103 indicates a state where the state transitioned from that shown by reference numeral 102 Figure 2 is a diagram showing a case where the state of the polysilicon S after being inverted by the inversion mechanisms 33A and 33B is shown. Figure 3 Reference numeral 104 indicates a case where the inversion mechanisms 33A and 33B move in the negative Z-axis direction from Figure 2 the state shown by reference numeral 103. Figure 3 Reference numeral 105 indicates a case where the state transitions from Figure 3 the state shown by reference numeral 104 to a state where the clamping state of the polysilicon S is released.

[0029] As Figure 2 shown by reference numeral 101, the inversion device 3 includes a first clamping portion 31, a second clamping portion 32, and inversion mechanisms 33A and 33B. The first clamping portion 31 has a first elastic deformation portion 311 and a support member 312, and the second clamping portion 32 has a second elastic deformation portion 321 and a support member 322.

[0030] The first elastic deformation portion 311 is elastically deformable and has a first elastic sheet 313 and a first cushioning material 314. The support member 312 is a member that supports the first elastic deformation portion 311, for example, polyvinyl chloride resin (PVC). A recess 315 is formed in the support member 312. The first cushioning material 314 is provided in the recess 315, and the recess 315 is closed by the first cushioning material 314.

[0031] The first elastic sheet 313 is, for example, adhesively fixed to the support member 312 so as to cover the first cushioning material 314. In addition, the first elastic sheet 313 is not adhesively fixed to the first cushioning material 314. This is because the replacement frequency of the first elastic sheet 313 is different from that of the first cushioning material 314, and the resilience modulus of the first elastic sheet 313 is greater than that of the first cushioning material 314. In addition, the method of fixing the first elastic sheet 313 to the support member 312 is not limited to adhesive fixing, and for example, a fixing method using a pressing plate or the like may also be used. Further, the first cushioning material 314 is, for example, adhesively fixed to the bottom surface of the recess 315.

[0032] The second elastic deformation portion 321 is elastically deformable and has a second elastic sheet 323 and a second cushioning material 324. The support member 322 is a member that supports the second elastic deformation portion 321, for example, polyvinyl chloride resin. A recess 325 is formed in the support member 322. The second cushioning material 324 is provided in the recess 325, and the recess 325 is closed by the second cushioning material 324.

[0033] The second elastic sheet 323 is, for example, adhesively fixed to the support member 322 to cover the second cushioning material 324. In addition, the second elastic sheet 323 is not adhesively fixed to the second cushioning material 324. This is because the replacement frequency of the second elastic sheet 323 is different from that of the second cushioning material 324, and the resilience modulus of the second elastic sheet 323 is greater than that of the second cushioning material 324. In addition, the method of fixing the second elastic sheet 323 to the support member 322 is not limited to adhesive fixing. For example, it may also be a fixing method using a pressing plate or the like. In addition, the second cushioning material 324 is, for example, adhesively fixed to the bottom surface of the recess 325.

[0034] The reversing mechanisms 33A and 33B reverse the polysilicon S in a clamped state where the polysilicon S is clamped between the first elastic deformation portion 311 and the second elastic deformation portion 321 so that the polysilicon S can be photographed by the photographing unit 8.

[0035] The reversing mechanism 33A includes a first holding portion 331, a second holding portion 332, a rotating portion 333, and moving members 337 and 338. The first holding portion 331 is provided on the side wall of the support member 312 and is a member that holds the moving member 337 when the front end portion of the moving member 337 connected to the rotating portion 333 is inserted. The second holding portion 332 is provided on the side wall of the support member 322 and is a member that holds the moving member 338 when the front end portion of the moving member 338 connected to the rotating portion 333 is inserted.

[0036] The rotating portion 333 is connected to the moving members 337 and 338 and reverses the positions of the moving member 337 and the moving member 338 by rotating 180° about the Y axis. The rotating portion 333 has a spring mechanism and a driving member (not shown). The spring mechanism and the driving member are respectively connected to the moving members 337 and 338. Thus, the moving members 337 and 338 can move in the positive Y-axis direction or the negative Y-axis direction, respectively. The movements of the moving members 337 and 338 are independently controlled. For example, a cylinder is used as the driving member.

[0037] The moving member 337 can move along the Y axis and, by being held by the first holding portion 331, causes the support member 312 to be held (fixed) to the reversing mechanism 33A. The moving member 338 can move along the Y axis and, by being held by the second holding portion 332, causes the support member 322 to be held (fixed) to the reversing mechanism 33A.

[0038] Claw portions are provided at the front end portions of the moving members 337 and 338. The moving members 337 and 338 are respectively held by the first holding portion 331 or the second holding portion 332 by the claw portions being respectively hooked on the recess formed in the first holding portion 331 or the recess formed in the second holding portion 332.

[0039] The reversing mechanism 33B includes a first holding portion 334, a second holding portion 335, a rotating portion 336, and moving members 339, 340. The first holding portion 334 is provided on the side wall of the supporting member 312 and is a member that holds the moving member 339 when the front end portion of the moving member 339 connected to the rotating portion 336 is inserted. The second holding portion 335 is provided on the side wall of the supporting member 322 and is a member that holds the moving member 340 when the front end portion of the moving member 340 connected to the rotating portion 336 is inserted.

[0040] The rotating portion 336 is connected to the moving members 339, 340 and reverses the positions of the moving member 339 and the moving member 340 by rotating 180° about the Y-axis. The rotating portion 336 has a spring mechanism (not shown) and a driving member. The spring mechanism and the driving member are respectively connected to the moving members 339, 340. Thus, the moving members 339, 340 can move in the positive Y-axis direction or the negative Y-axis direction respectively. The movements of the moving members 339, 340 are independently controlled respectively. For example, a cylinder is used as the driving member.

[0041] The moving member 339 can move along the Y-axis and the supporting member 312 is held (fixed) to the reversing mechanism 33B by being held by the first holding portion 334. The moving member 340 can move along the Y-axis and the supporting member 322 is held (fixed) to the reversing mechanism 33B by being held by the second holding portion 335.

[0042] Claw portions are provided at the front end portions of the moving members 339, 340. The moving members 339, 340 are respectively held by the first holding portion 334 or the second holding portion 335 by the claw portions being respectively hooked on the concave portions formed in the first holding portion 334 or the concave portions formed in the second holding portion 335.

[0043] As Figure 2 shown by the reference numeral 101 in the figure, when the second clamping portion 32 is transported to the position where the reversing mechanisms 33A, 33B are arranged, the first clamping portion 31 and the second clamping portion 32 face each other. In other words, the first elastic piece 313 and the second elastic piece 323 face each other. In addition, by the first holding portions 331, 334 holding the moving members 337, 339 respectively, the supporting member 312 is held by the reversing mechanisms 33A, 33B. The polysilicon S is arranged on the second elastic piece 323.

[0044] As Figure 2As shown by the reference numeral 102 in the drawings, while the support member 312 is held by the reversing mechanisms 33A and 33B, the rotating portions 333 and 336 move in the negative Z-axis direction. As a result, the polysilicon S is held in a clamped state between the first elastic deformation portion 311 and the second elastic deformation portion 321. In other words, the reversing device 3 clamps the polysilicon S between the first elastic deformation portion 311 and the second elastic deformation portion 321 (clamping step).

[0045] At this time, the first elastic piece 313 and the second elastic piece 323 come into contact with the polysilicon S and elastically deform in the above-described clamped state. In addition, the first buffer material 314 comes into contact with the first elastic piece 313 from the side opposite to the polysilicon S and elastically deforms in the above-described clamped state. The second buffer material 324 comes into contact with the second elastic piece 323 from the side opposite to the polysilicon S and elastically deforms in the above-described clamped state.

[0046] In addition, a spring mechanism is connected to the moving members 338. Therefore, as the rotating portions 333 and 336 move in the negative Z-axis direction, the moving members 338 and 340 move in the Y-axis direction along the surfaces of the second holding portions 332 and 335, respectively, and are inserted into the second holding portions 332 and 335. At this time, by the elastic force of the spring mechanism, the moving member 338 is pressed in the positive Y-axis direction in the concave portion of the second holding portion 332. In addition, by the elastic force of the spring mechanism, the moving member 340 is pressed in the negative Y-axis direction in the concave portion of the second holding portion 335. As a result, the support member 322 is held by the reversing mechanisms 33A and 33B.

[0047] As Figure 2 shown by the reference numeral 103 in the drawings, the reversing mechanisms 33A and 33B hold the support member 312 by the moving members 337 and 339, respectively, and the reversing mechanisms 33A and 33B hold the support member 322 by the moving members 338 and 340, respectively. In this state, the rotating portions 333 and 336 move to a predetermined position in the positive Z-axis direction. Then, the reversing mechanisms 33A and 33B rotate the rotating portions 333 and 336 by 180° about the Y-axis, respectively.

[0048] As a result, the reversing mechanisms 33A and 33B reverse the positions of the moving member 337 and the moving member 338, and reverse the positions of the moving member 339 and the moving member 340. In other words, the reversing mechanisms 33A and 33B reverse the positions of the first holding portion 331 and the second holding portion 332, and reverse the positions of the first holding portion 334 and the second holding portion 335. As a result, the reversing mechanisms 33A and 33B reverse the positions of the first clamping portion 31 and the second clamping portion 32, and reverse the polysilicon S (reversing step).

[0049] After the reversing mechanisms 33A and 33B reverse the polysilicon S, asFigure 3 As shown by the reference numeral 104 in the drawing, the rotating parts 333 and 336 move in the negative Z-axis direction. Thereby, the first clamping part 31 comes to be in a state of being disposed on the transfer mechanism 2. After the first clamping part 31 comes to be in a state of being disposed on the transfer mechanism 2, the driving member moves the moving part 337 in the negative Y-axis direction, and pulls out the front end part of the moving part 337 from the concave part of the first holding part 331. Further, the driving member moves the moving part 339 in the positive Y-axis direction, and pulls out the front end part of the moving part 339 from the concave part of the first holding part 334. Thereby, the reversing mechanisms 33A and 33B release the holding of the support member 312.

[0050] After the reversing mechanisms 33A and 33B release the holding of the support member 312, as Figure 3 shown by the reference numeral 105 in the drawing, in a state where the support member 322 is held by the reversing mechanisms 33A and 33B, the rotating parts 333 and 336 move in the positive Z-axis direction. Thereby, since the transfer mechanism 2 can transfer the first clamping part 31 in the positive X-axis direction, the first clamping part 31 is transferred in the positive X-axis direction.

[0051] According to the above configuration, in a clamping state where the polysilicon S is clamped between the first elastic deformation part 311 and the second elastic deformation part 321, the reversing mechanisms 33A and 33B reverse the polysilicon S. Thereby, in the clamping state, the first elastic deformation part 311 and the second elastic deformation part 321 deform in accordance with the shape of the polysilicon S, so that the reversing device 3 can reverse the polysilicon S having at least one of different shapes and sizes.

[0052] <Regarding the first elastic piece 313 and the second elastic piece 323>

[0053] The materials of the first elastic piece 313 and the second elastic piece 323 are, for example, polyurethane rubber, but are not limited thereto. Preferably, the hardness of the first elastic piece 313 and the second elastic piece 323 is 30 or more and 90 or less on the Shore A scale. The hardness of the first elastic piece 313 and the second elastic piece 323 is the result measured by an A-type hardness meter based on JIS K6253.

[0054] As described above, as the shape of the polysilicon S, various forms such as a flat shape or a fist shape can be included, so a part of the crushed material has a sharp shape. Since the Mohs hardness of the polysilicon is 6 or more and 8 or less, when the first elastic piece 313 and the second elastic piece 323 come into contact with the polysilicon S, it is possible that the surfaces of the first elastic piece 313 and the second elastic piece 323 are worn or broken.

[0055] Since the hardness of the first elastic piece 313 and the second elastic piece 323 is above Shore A30, the impact when the first elastic piece 313 and the second elastic piece 323 contact the polysilicon S can be reduced. In addition, the elasticity of the first elastic piece 313 and the second elastic piece 323 can be maintained. Therefore, wear or breakage of the first elastic piece 313 and the second elastic piece 323 can be prevented.

[0056] In addition, since the hardness of the first elastic piece 313 and the second elastic piece 323 is below Shore A90, the first elastic piece 313 and the second elastic piece 323 can conform to the shape of the polysilicon S and deform to stably hold the shape of the polysilicon S even during inversion. Therefore, the polysilicon S can be reliably held when the inversion mechanisms 33A and 33B invert the polysilicon S.

[0057] Preferably, the thickness of the first elastic piece 313 and the second elastic piece 323 along the Z-axis direction is 0.5 mm or more and 5 mm or less. Since the thickness of the first elastic piece 313 and the second elastic piece 323 is 0.5 mm or more, the wear margin for continuous long-term use of the first elastic piece 313 and the second elastic piece 323 can be ensured. Such an effect also contributes to, for example, achieving Goal 12 of the Sustainable Development Goals (SDGs) advocated by the United Nations, "Ensure sustainable production and consumption patterns", etc.

[0058] In addition, since the thickness of the first elastic piece 313 and the second elastic piece 323 is 5 mm or less, the first elastic piece 313 and the second elastic piece 323 can conform to the shape of the polysilicon S and deform to stably hold the shape of the polysilicon S even during inversion. Therefore, the polysilicon S can be reliably held when the inversion mechanisms 33A and 33B invert the polysilicon S.

[0059] <Regarding the first buffer material 314 and the second buffer material 324>

[0060] The materials of the first buffer material 314 and the second buffer material 324 are, for example, polyurethane foam, but are not limited thereto. There are flat-shaped polysilicon S, and depending on the compression hardness of the buffer material, the flat-shaped polysilicon S may slip on the upper sides of the first elastic piece 313 and the second elastic piece 323 when rotating in the clamped state. Therefore, according to the necessity of maintaining the clamped state during the rotation of the inversion mechanisms 33A and 33B, it is preferable that the 40% compression hardness of the first buffer material 314 and the second buffer material 324 is 20 N or more and 80 N or less. The 40% compression hardness of the first buffer material 314 and the second buffer material 324 is the result measured according to the JIS K6400-2A method.

[0061] The 40% compression hardness of the first buffer material 314 and the second buffer material 324 is 20 N or more, so that when the flat polycrystalline silicon S is clamped by the first clamping portion 31 and the second clamping portion 32, it can be fully ensured that the polycrystalline silicon S does not slip sideways between the first elastic piece 313 and the second elastic piece 323 that are clamped.

[0062] In addition, the 40% compression hardness of the first buffer material 314 and the second buffer material 324 is 80 N or less, so that the deformation of the first elastic piece 313 and the second elastic piece 323 that conform to the shape of the polycrystalline silicon S can be appropriately absorbed by the first buffer material 314 and the second buffer material 324. Therefore, the polycrystalline silicon S can be reliably held when the reversing mechanisms 33A and 33B reverse the polycrystalline silicon S.

[0063] As described above, as the size of the polycrystalline silicon S, it is generally selected in the range where the major axis is 10 mm or more and 150 mm or less. When the large-sized polycrystalline silicon S contacts the first elastic piece 313 and the second elastic piece 323, if the resilience modulus of the first buffer material 314 and the second buffer material 324 is large, the polycrystalline silicon S is likely to bounce on the first elastic piece 313 and the second elastic piece 323. In addition, if the above resilience modulus is too small, the deformation of the first elastic piece 313 and the second elastic piece 323 is likely to be large.

[0064] The specific gravity of the polycrystalline silicon S of the above size is generally 2.2 g / cm 3 or more and 2.5 g / cm 3 or less. Thus, it is preferable that the resilience modulus of the first buffer material 314 and the second buffer material 324 suitable for the polycrystalline silicon S with a major axis of about 10 mm or more and about 150 mm or less is 1% or more and 6% or less. The resilience modulus of the first buffer material 314 and the second buffer material 324 is the result measured according to JISK6400-3.

[0065] In addition, since the contact between the polycrystalline silicon S and the first buffer material 314 and the second buffer material 324 is via the first elastic piece 313 or the second elastic piece 323, the wear of the first buffer material 314 and the second buffer material 324 during contact is less. Therefore, the first buffer material 314 is softer than the first elastic piece 313, and the second buffer material 324 is softer than the second elastic piece 323.

[0066] When the polycrystalline silicon S is clamped by the first elastic deforming portion 311 and the second elastic deforming portion 321, the first and second elastic cushioning materials 314 and 324 can appropriately absorb deformation of the first and second elastic sheets 313 and 323 that conform to the shape of the polycrystalline silicon S. Since the first and second elastic cushioning materials 314 and 324 have a rebound modulus of 1% or greater, when the polycrystalline silicon S is released from being clamped by the first and second elastic deforming portions 311 and 321, the first and second cushioning materials 314 and 324 can return to their pre-clamped shapes.

[0067] Furthermore, since the first and second buffer materials 314 and 324 have a rebound modulus of 6% or less, the large polysilicon S can be prevented from bouncing on the first and second elastic sheets 313 and 323 when they come into contact with the first and second elastic sheets 313 and 323 .

[0068] From the perspective of positional stability and durability of the polysilicon S during imaging, components in direct contact with the polysilicon S require a certain degree of hardness. On the other hand, if the components in direct contact with the polysilicon S are made too hard, their shape-following properties may be impaired, potentially preventing them from stably holding the polysilicon S during inversion. Therefore, as described above, both the first elastically deformable portion 311 and the second elastically deformable portion 321 are configured with elastic sheets and cushioning material. This achieves a balance between positional stability, durability, and shape-following properties.

[0069] <Configuration of Dome 7 and Imaging Section 8>

[0070] Figure 4 Yes Figure 1 FIG. 1 is a diagram showing the configuration of the dome portion 7, the imaging portion 8, and the irradiation portion 9 included in the imaging device 1. Figure 4 As shown, the dome portion 7 has a hemispherical ceiling portion 71 on which the imaging unit 8 is installed. The ceiling portion 71 is formed to be convex toward the positive direction of the Z axis. Multiple imaging units 8 are installed on the ceiling portion 71 so that the polycrystalline silicon S can be imaged from multiple directions. As a result, the results of imaging the polycrystalline silicon S can be used by the control unit 10 to accurately determine the surface condition and surface shape of the polycrystalline silicon S.

[0071] The plurality of imaging units 8 are provided in the opening formed in the ceiling portion 71 and can image the polysilicon S after being inverted by the inverting mechanisms 33A and 33B. Figure 1As shown, for example, when visually confirming the top 7 of the circle in the negative Z-axis direction, a photographing unit 8 may also be provided at the top of the top 7 of the circle, and eight photographing units 8 may be arranged in a ring around the one photographing unit 8. Preferably, the eight photographing units 8 are arranged such that the photographing directions of the eight photographing units 8 are inclined 30° with respect to the Z-axis.

[0072] The transfer mechanism 2 transfers the first clamping portion 31 configured with the polysilicon S from the position after being reversed by the reversing mechanisms 33A and 33B to the second photographing position. The position after being reversed by the reversing mechanisms 33A and 33B is the position where the reversing mechanisms 33A and 33B are arranged on the transfer mechanism 2.

[0073] The above-mentioned second photographing position is a position below the top 7 of the circle, and is a position where the plurality of photographing units 8 can photograph the polysilicon S. The plurality of photographing units 8 photograph the polysilicon S transferred from the position after being reversed by the reversing mechanisms 33A and 33B to the above-mentioned second photographing position (photographing process).

[0074] As a photographing means for the polysilicon S, a photographing means capable of recognizing the shape and surface state of the entire polysilicon S can be adopted. Specifically, photographing means such as photographing based on still images or moving images of a CCD (Charge Coupled Device) camera can be adopted.

[0075] The images obtained by photographing the polysilicon S by the photographing units 5 and 8 are adjusted to a picture quality capable of recognizing holes of 1 mm or less existing on the surface of the polysilicon S. Specifically, the viewing angle and the distance to the object to be photographed are adjusted such that the width of the image is 1.2 times or more and 5.0 times or less the maximum size of the polysilicon S. In addition, the polysilicon S is photographed with a pixel count of 2 million pixels or more.

[0076] After the polysilicon S is photographed by the plurality of photographing units 8, the transfer mechanism 2 transfers the first clamping portion 31 configured with the polysilicon S to the place where the polysilicon S is sorted. At this time, the transfer mechanism 2 transfers the first clamping portion 31 in the positive X-axis direction. At the place where the polysilicon S is sorted, the polysilicon S is sorted based on the result of classifying the polysilicon S by the server 11 described later.

[0077] According to the above configuration, the reversing mechanisms 33A and 33B reverse the polysilicon S in the clamped state, and the photographing unit 8 can photograph the polysilicon S reversed by the reversing mechanisms 33A and 33B. Thus, the photographing device 1 can photograph polysilicon S with at least one of different shapes and sizes, and can also photograph the reversed polysilicon S.

[0078] <Configuration of the irradiation unit 9>

[0079] A plurality of irradiation units 9 are arranged at a position below the inner surface 72 of the ceiling portion 71 of the circular top portion 7, and are light sources arranged within the space enclosed by the inner surface 72. The plurality of irradiation units 9 irradiate the inner surface 72 with light L, causing the light L to be reflected by the inner surface 72 and irradiate the light L downward toward the circular top portion 7. The inner surface 72 is made of a material capable of reflecting the light L. As Figure 1 shown, for example, when visually confirming the circular top portion 7 in the negative Z-axis direction, six irradiation units 9 may be provided near the outer periphery of the circular top portion 7.

[0080] According to the above configuration, the inverted polysilicon S can be arranged at the second shooting position, and the light L reflected by the inner surface 72 of the ceiling portion 71 of the circular top portion 7 is irradiated onto the polysilicon S located at the second shooting position through the irradiation unit 9. Therefore, the imaging device 1 can clearly image the inverted polysilicon S.

[0081] <Configuration of the circular top portion 4, the imaging unit 5, and the irradiation unit 6>

[0082] Figure 1 The configurations of the circular top portion 4, the imaging unit 5, and the irradiation unit 6 shown are the same as the configurations of the circular top portion 7, the imaging unit 8, and the irradiation unit 9 respectively. The plurality of imaging units 5 can image the polysilicon S transported by the transport mechanism 2. The transport mechanism 2 transports the second clamping portion 32 on which the polysilicon S is arranged to the first shooting position. The first shooting position is a position below the circular top portion 4 and is a position where the plurality of imaging units 5 can image the polysilicon S.

[0083] The plurality of imaging units 5 image the polysilicon S in the state before being inverted by the inversion mechanisms 33A and 33B and transported to the above-mentioned first shooting position. After the polysilicon S is imaged by the plurality of imaging units 5, the transport mechanism 2 transports the second clamping portion 32 on which the polysilicon S is arranged to the position where the inversion mechanisms 33A and 33B are arranged on the transport mechanism 2.

[0084] <Configuration of the control unit 10>

[0085] The control unit 10 may be a control device capable of controlling the transport mechanism 2, the inversion device 3, the imaging units 5 and 8, and the irradiation units 6 and 9, such as a CPU (Central Processing Unit). In addition, the control unit 10 may be a device having such a control device, and also having a storage device such as a memory and a communication device capable of communicating with the server 11.

[0086] The control unit 10 acquires the captured images captured by the plurality of imaging units 5 and the plurality of imaging units 8. The control unit 10 transmits the acquired captured images to the server 11. The server 11 determines at least one feature selected from the group consisting of the porosity, cracks, holes, stains, rod diameter, and surface shape of the polysilicon S by referring to the captured images received from the control unit 10. The server 11 classifies the polysilicon S based on the at least one feature. The rod diameter is the diameter of the rod when the polysilicon S is formed in a rod shape.

[0087] In addition, the classification of the polysilicon S may be performed not by the server 11 but by the control unit 10. In this case, the control unit 10 determines the at least one feature by referring to the acquired captured images. Further, the control unit 10 classifies the polysilicon S based on the at least one feature.

[0088] <Modification Example>

[0089] In the clamped state where the polysilicon S is clamped by the first clamping unit 31 and the second clamping unit 32, the first clamping unit 31 and the second clamping unit 32 are transported to the positions where the reversing mechanisms 33A and 33B are arranged, and the reversing mechanisms 33A and 33B may reverse the polysilicon S in the above clamped state. Hereinafter, a specific description will be given.

[0090] Consider the case where after the polysilicon S is imaged by the plurality of imaging units 5, the second clamping unit 32 on which the polysilicon S is arranged is transported in the positive X-axis direction by the transport mechanism 2. In this case, at the position between the dome portion 4 and the reversing mechanisms 33A and 33B, the first clamping unit 31 may be arranged on the second clamping unit 32 and the polysilicon S by a mechanism (not shown). At this time, the first elastic piece 313 and the second elastic piece 323 face each other, and the polysilicon S is in the clamped state clamped by the first clamping unit 31 and the second clamping unit 32.

[0091] After the polysilicon S is in the above clamped state, the transport mechanism 2 transports the first clamping unit 31 and the second clamping unit 32 in the above clamped state to the positions where the reversing mechanisms 33A and 33B are arranged on the transport mechanism 2. Then, by Figure 2 the shown rotating portions 333 and 336 moving in the negative Z-axis direction, the moving members 337 and 339 are respectively inserted into the first holding portions 331 and 334. As a result, the reversing mechanisms 33A and 33B hold the support member 312 of the first clamping unit 31. In addition, the moving members 338 and 340 are respectively inserted into the second holding portions 332 and 335. As a result, the reversing mechanisms 33A and 33B hold the support member 322 of the second clamping unit 32.

[0092] Moreover, by moving the rotating parts 333 and 336 in the positive Z-axis direction, the reversing mechanisms 33A and 33B respectively rotate the rotating parts 333 and 336 by 180° around the Y-axis to reverse the polysilicon S. After the reversing mechanisms 33A and 33B reverse the polysilicon S, the rotating parts 333 and 336 move in the negative Z-axis direction. Thereby, the first clamping part 31 becomes a state of being arranged on the transfer mechanism 2.

[0093] After the first clamping part 31 is in a state of being arranged on the transfer mechanism 2, the moving parts 337 and 339 respectively move so that the front ends are separated from the first holding parts 331 and 334. Thereby, the reversing mechanisms 33A and 33B release the holding of the support member 312. In addition, the moving parts 338 and 340 respectively move so that the front ends are separated from the second holding parts 332 and 335. Thereby, the reversing mechanisms 33A and 33B release the holding of the support member 322.

[0094] After releasing the holding of the support members 312 and 322, the transfer mechanism 2 transfers the first clamping part 31 and the second clamping part 32 in the above clamping state in the positive X-axis direction. Then, at a position between the reversing mechanisms 33A and 33B and the dome part 7, the second clamping part 32 can be removed from the first clamping part 31 by a mechanism (not shown). After removing the second clamping part 32, the transfer mechanism 2 transfers the first clamping part 31 having the polysilicon S to the above second photographing position.

[0095] 〔Embodiment 2〕

[0096] Hereinafter, Embodiment 2 of the present invention will be described. In addition, for convenience of explanation, components having the same functions as those described in Embodiment 1 are denoted by the same reference numerals, and their descriptions are not repeated. Figure 5 It is a diagram showing the configuration of the dome part 7, the photographing part 8, and the irradiation part 9 included in the photographing device according to Embodiment 2 of the present invention.

[0097] As Figure 5 shown, compared with the photographing device 1 of Embodiment 1, the position where the irradiation part 9 is provided is different in the photographing device of Embodiment 2. A plurality of irradiation parts 9 are provided in the opening formed in the ceiling part 71, and irradiate light L downward toward the dome part 7. In other words, the plurality of irradiation parts 9 directly irradiate the polysilicon S reversed by the reversing mechanisms 33A and 33B with light L. For example, it can also be arranged such that when visually confirming the dome part 7 in the negative Z-axis direction, six irradiation parts 9 are arranged in a ring around the plurality of photographing parts 8.

[0098] According to the above configuration, by disposing the inverted polysilicon S at the second shooting position below the top 7 of the circle, light L can be directly irradiated onto the polysilicon S located at the second shooting position. Therefore, the shooting device of Embodiment 2 can clearly shoot the inverted polysilicon S.

[0099] In addition, the top 7 of the circle may also include, for example, Figure 4 an irradiation unit 9 configured as shown for indirectly irradiating light L onto the polysilicon S and, for example, Figure 5 both an irradiation unit 9 configured as shown for directly irradiating light L onto the polysilicon S.

[0100] 〔Embodiment 3〕

[0101] Hereinafter, Embodiment 3 of the present invention will be described. In addition, for convenience of explanation, components having the same functions as those described in Embodiment 1 are denoted by the same reference numerals, and their descriptions will not be repeated. Figure 6 FIG. is a schematic diagram showing the configuration of a shooting device 1A according to Embodiment 3 of the present invention.

[0102] As Figure 6 shown, the shooting device 1A is different from the shooting device 1 of Embodiment 1 in that it does not include the top 7 of the circle, the shooting unit 8, and the irradiation unit 9. A plurality of shooting units 5 can shoot the polysilicon S after being transported by the transport mechanism 2. The transport mechanism 2 transports the second clamping portion 32 on which the polysilicon S is disposed to the first shooting position. This first shooting position is a position below the top 4 of the circle and is a position where the plurality of shooting units 5 can shoot the polysilicon S.

[0103] The plurality of shooting units 5 shoot the polysilicon S in the state before being inverted by the inversion mechanisms 33A and 33B and transported to the above-mentioned first shooting position. After the polysilicon S is shot by the plurality of shooting units 5, the transport mechanism 2 transports the second clamping portion 32 on which the polysilicon S is disposed to the position where the inversion mechanisms 33A and 33B are disposed on the transport mechanism 2. At this time, the transport mechanism 2 transports the second clamping portion 32 in the positive X-axis direction.

[0104] After the second clamping portion 32 on which the polysilicon S is disposed is transported to the position where the inversion mechanisms 33A and 33B are disposed on the transport mechanism 2, the inversion mechanisms 33A and 33B invert the positions of the first clamping portion 31 and the second clamping portion 32, thereby inverting the polysilicon S. After the polysilicon S is inverted by the inversion mechanisms 33A and 33B, the transport mechanism 2 transports the first clamping portion 31 on which the polysilicon S is disposed to the above-mentioned first shooting position. At this time, the transport mechanism 2 transports the first clamping portion 31 in the negative X-axis direction.

[0105] Multiple photographing units 5 photograph the polysilicon S in the state after being reversed by the reversing mechanisms 33A and 33B and transported to the above-mentioned first photographing position. After the polysilicon S is photographed by the multiple photographing units 5, the transfer mechanism 2 transfers the first clamping portion 31 provided with the polysilicon S to the place where the polysilicon S is sorted. At this time, the transfer mechanism 2 transfers the first clamping portion 31 in the positive X-axis direction.

[0106] 〔Summary〕

[0107] The reversing device according to aspect 1 of the present invention is configured to include: a first clamping portion having a first elastically deformable portion; a second clamping portion having a second elastically deformable portion; and a reversing mechanism that reverses the polysilicon in a clamped state between the first elastically deformable portion and the second elastically deformable portion so as to photograph the polysilicon.

[0108] The reversing device according to aspect 2 of the present invention may also be configured, in the above-mentioned aspect 1, such that the first elastically deformable portion includes: a first elastic sheet that contacts and elastically deforms the polysilicon in the clamped state; and a first buffer material that is softer than the first elastic sheet and contacts and elastically deforms the first elastic sheet from the side opposite to the polysilicon in the clamped state; the second elastically deformable portion includes: a second elastic sheet that contacts and elastically deforms the polysilicon in the clamped state; and a second buffer material that is softer than the second elastic sheet and contacts and elastically deforms the second elastic sheet from the side opposite to the polysilicon in the clamped state.

[0109] The reversing device according to aspect 3 of the present invention may also be configured, in the above-mentioned aspect 2, such that the hardness of the first elastic sheet and the second elastic sheet is 30 or more and 90 or less on the Shore A scale.

[0110] The reversing device according to aspect 4 of the present invention may also be configured, in the above-mentioned aspect 2 or 3, such that the thickness of the first elastic sheet and the second elastic sheet is 0.5 mm or more and 5 mm or less.

[0111] The reversing device according to aspect 5 of the present invention may also be configured, in any one of the above-mentioned aspects 2 to 4, such that the 40% compression hardness of the first buffer material and the second buffer material is 20 N or more and 80 N or less.

[0112] The reversing device according to aspect 6 of the present invention may also be configured, in any one of the above-mentioned aspects 2 to 5, such that the resilience modulus of the first buffer material and the second buffer material is 1% or more and 6% or less.

[0113] The photographing device according to aspect 7 of the present invention is configured to include: a first clamping portion having a first elastically deformable portion; a second clamping portion having a second elastically deformable portion; a reversing mechanism that reverses the polysilicon in a clamped state where the polysilicon is clamped between the first elastically deformable portion and the second elastically deformable portion; and a photographing portion that can photograph the polysilicon reversed by the reversing mechanism.

[0114] The photographing device according to aspect 8 of the present invention may also be configured, in the above aspect 7, to include: a dome portion having a hemispherical ceiling portion provided with the photographing portion; and an irradiation portion that is at least one of (i) an irradiation portion that irradiates light to the inner surface of the ceiling portion of the dome portion and reflects the light on the inner surface to irradiate light downward of the dome portion, and (ii) an irradiation portion that irradiates light downward of the dome portion, and the photographing portion photographs the polysilicon transported from the position reversed by the reversing mechanism to the photographing position.

[0115] The photographing device according to aspect 9 of the present invention may also be configured, in the above aspect 7 or 8, to be provided with a plurality of the photographing portions so as to be able to photograph the polysilicon from a plurality of directions.

[0116] The reversing method according to aspect 10 of the present invention includes: a clamping step of clamping polysilicon between a first elastically deformable portion of a first clamping portion and a second elastically deformable portion of a second clamping portion; and a reversing step of reversing the polysilicon in a clamped state where the polysilicon is clamped by the clamping step so as to photograph the polysilicon.

[0117] The photographing method according to aspect 11 of the present invention includes: a clamping step of clamping polysilicon between a first elastically deformable portion of a first clamping portion and a second elastically deformable portion of a second clamping portion; a reversing step of reversing the polysilicon in a clamped state where the polysilicon is clamped by the clamping step; and a photographing step of photographing the polysilicon reversed by the reversing step.

[0118] The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims, and embodiments obtained by appropriately combining technical means respectively disclosed in different embodiments are also included in the technical scope of the present invention.

[0119] Description of Reference Numerals

[0120] 1, 1A Photographing device 3 Reversing device

[0121] 4, 7 Dome portion 5, 8 Photographing portion

[0122] 6, 9 Irradiation unit 31 First clamping part

[0123] 32 Second clamping part 33A, 33B Reversing mechanism

[0124] 71 Ceiling part 72 Inner surface

[0125] 311 First elastic deformation part 313 First elastic piece

[0126] 314 First buffer material 321 Second elastic deformation part

[0127] 323 Second elastic piece 324 Second buffer material

[0128] S Polysilicon.

Claims

1. An inversion device, characterized in that, Comprising: A first clamping portion having a first elastically deformable portion; A second clamping portion having a second elastically deformable portion; and A reversing mechanism that reverses the polysilicon for photographing the polysilicon in a clamped state where the polysilicon is clamped between the first elastically deformable portion and the second elastically deformable portion.

2. The reversing device according to claim 1, characterized in that, The first elastically deformable portion has: A first elastic sheet that contacts and elastically deforms with the polysilicon in the clamped state; And A first cushioning material that is softer than the first elastic sheet and contacts and elastically deforms with the first elastic sheet from the side opposite to the polysilicon in the clamped state; The second elastically deformable portion has: A second elastic sheet that contacts and elastically deforms with the polysilicon in the clamped state; And A second cushioning material that is softer than the second elastic sheet and contacts and elastically deforms with the second elastic sheet from the side opposite to the polysilicon in the clamped state.

3. The reversing device according to claim 2, characterized in that, The hardness of the first elastic sheet and the second elastic sheet is 30 or more and 90 or less on the Shore A scale.

4. The reversing device according to claim 2 or 3, characterized in that, The thickness of the first elastic sheet and the second elastic sheet is 0.5 mm or more and 5 mm or less.

5. The reversing device according to claim 2 or 3, characterized in that, The 40% compression hardness of the first cushioning material and the second cushioning material is 20 N or more and 80 N or less.

6. The reversing device according to claim 2 or 3, characterized in that The resilience modulus of the first cushioning material and the second cushioning material is 1% or more and 6% or less.

7. A photographing device, characterized in that, Comprising: A first clamping portion having a first elastically deformable portion; A second clamping portion having a second elastically deformable portion; A reversing mechanism that reverses the polysilicon in a clamped state where the polysilicon is clamped between the first elastically deformable portion and the second elastically deformable portion; and A photographing portion that can photograph the polysilicon reversed by the reversing mechanism.

8. The photographing device according to claim 7, characterized in that, Comprising: A dome top having a hemispherical ceiling portion provided with the photographing portion; and An irradiation portion that is at least one of (i) an irradiation portion that irradiates light onto the inner surface of the ceiling portion of the dome top so that the light is reflected on the inner surface and irradiates light downward toward the dome top and (ii) an irradiation portion that irradiates light downward toward the dome top, The photographing portion photographs the polysilicon transported from the position reversed by the reversing mechanism to the photographing position.

9. The photographing apparatus according to claim 7 or 8, characterized in that, A plurality of the photographing portions are provided so as to be able to photograph the polysilicon from multiple directions.

10. A reversal method, characterized in that, Including: A clamping step of clamping polysilicon between a first elastically deformable portion of a first clamping portion and a second elastically deformable portion of a second clamping portion; And A reversing step of reversing the polysilicon for photographing the polysilicon in a clamped state where the polysilicon is clamped by the clamping step.

11. A shooting method, characterized in that, Including: A clamping step of clamping polysilicon between a first elastically deformable portion of a first clamping portion and a second elastically deformable portion of a second clamping portion; Inverting process, which inverts the polysilicon while it is in a clamped state after being clamped by the clamping process; and Imaging process, which images the polysilicon inverted by the inverting process.

Images