Pedestal and showerhead with resistive and radiant heating

Abstract

A substrate processing system includes a susceptor for supporting a substrate, a resistive heater disposed in the susceptor to heat the substrate, and a radiant heater disposed in the susceptor to heat the substrate. A substrate processing system includes a showerhead having a panel and a radiant heater disposed in the showerhead. The panel comprises a plurality of through holes. The radiant heater includes a plurality of optical elements arranged with a gap from the plurality of through holes of the panel. A substrate processing system includes a susceptor for supporting a substrate, a resistive heater disposed in the susceptor to heat the substrate, a first radiant heater disposed in the susceptor to heat the substrate, a showerhead separate from the susceptor, and a second radiant heater disposed in the showerhead to heat the substrate.

Description

Cross - Reference to Related Applications

[0001] This application claims the benefit of priority of U.S. Provisional Application No. 63 / 432,485, filed on Dec. 14, 2022. The entire disclosure of the above - mentioned application is incorporated herein by reference. Technical Field

[0002] The present disclosure generally relates to substrate processing systems, and more particularly to susceptors and showerheads having resistive and radiative heating. Background Art

[0003] The background description provided here is for the purpose of generally presenting the background of the disclosure. Work of the current named inventors within the scope of the background art described herein and aspects of the specification that were not determined to be prior art at the time of filing the application are neither expressly nor impliedly admitted to be prior art against the disclosure.

[0004] Substrate processing systems typically include multiple processing chambers (also referred to as processing modules) for depositing, etching, and other processing of substrates such as semiconductor wafers. Examples of processes that can be performed on substrates include chemical vapor deposition (CVD), plasma - enhanced CVD (PECVD), chemically - enhanced plasma vapor deposition (CEPVD), atomic layer deposition (ALD), and plasma - enhanced ALD (PEALD). Examples of other processes that can be performed on substrates include etching (e.g., chemical etching, plasma etching, reactive ion etching, etc.).

[0005] During processing, the substrate is placed on a substrate support or susceptor such as a pedestal or an electrostatic chuck (ESC) in a processing chamber of the substrate processing system. In some processes, during deposition, a gas mixture containing one or more precursors is introduced into the processing chamber, and a plasma can be excited to activate a chemical reaction. In other processes, during etching, a gas mixture containing an etching gas is introduced into the processing chamber, and a plasma can be excited to activate a chemical reaction. A computer - controlled robot transports the substrates from one processing chamber to another in the order in which the substrates are to be processed.

[0006] Atomic layer deposition (ALD) is a thin film deposition method that performs gaseous chemical processes sequentially to deposit a thin film on the surface of a material (e.g., the surface of a substrate such as a semiconductor wafer). Most ALD reactions use at least two chemical substances called precursors (referred to as reactants), which react with the material surface in a sequential, self-limiting manner, one precursor at a time. By repeatedly exposing to different precursors, the thin film is gradually deposited on the surface of the material. Thermal ALD (T-ALD) is typically carried out in a heated processing chamber. The processing chamber is maintained under sub-atmospheric pressure using a vacuum pump and a controlled flow of inert gas. The substrate to be coated is placed in the processing chamber and brought to thermal equilibrium with the temperature of the processing chamber before starting the ALD process. Summary of the Invention

[0007] A substrate processing system includes a pedestal for supporting a substrate, a resistive heater disposed in the pedestal for heating the substrate, and a radiant heater disposed in the pedestal for heating the substrate.

[0008] In an additional feature, the substrate processing system includes a showerhead and a radiant heater disposed in the showerhead, the showerhead including a panel. The panel includes a plurality of through-holes. The radiant heater includes a plurality of optical elements disposed in a spaced-apart relationship with the plurality of through-holes of the panel.

[0009] In an additional feature, the substrate processing system includes a pedestal for supporting a substrate, a resistive heater disposed in the pedestal for heating the substrate, a first radiant heater disposed in the pedestal for heating the substrate, a showerhead spaced apart from the pedestal, and a second radiant heater disposed in the showerhead for heating the substrate.

[0010] Based on the detailed description, claims, and drawings, the further scope of the applicability of the present disclosure will become apparent. The detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Brief Description of the Drawings

[0011] The present disclosure will be more fully understood in light of the detailed description and the drawings, wherein:

[0012] Figure 1A A first example of a substrate processing system according to the present disclosure is shown, in which resistive heating and radiant heating are incorporated in the pedestal of the processing chamber;

[0013] Figure 1B A second example of a substrate processing system according to the present disclosure is shown, in which resistive heating is provided in the pedestal of the processing chamber and radiant heating is provided below the pedestal;

[0014] Figure 1C A third example of a substrate processing system according to the present disclosure is shown, in which resistive heating is provided in the pedestal of the processing chamber and radiant heating is provided in the showerhead;

[0015] Figure 1D Shows a fourth example of a substrate processing system according to the present disclosure, where resistive heating is provided in the pedestal of the processing chamber and radiative heating is provided in both the pedestal and the showerhead;

[0016] Figure 1E Shows a third example of a substrate processing system according to the present disclosure, where resistive heating is provided in the pedestal of the processing chamber and radiative heating is provided below the pedestal and in the showerhead;

[0017] Figure 2 Schematically shows Figure 1A an example of a pedestal that includes a resistive heater and a radiative heater disposed in the pedestal according to the present disclosure to heat a substrate;

[0018] Figure 3 Shows in more detail the resistive heater and the radiative heater juxtaposed in Figure 2 the pedestal;

[0019] Figure 4A Schematically shows an example of an annular pattern where a resistive heater and a radiative heater are juxtaposed in Figure 2 the pedestal;

[0020] Figure 4B Shows in more detail the annular pattern of the resistive heater and the radiative heater juxtaposed in Figure 2 the pedestal;

[0021] Figure 4C Shows an example of regions that can be formed in the radiative heater when a resistive heater and a radiative heater are juxtaposed in Figure 2 the pedestal and in the Figure 4A and 4B annular patterns shown;

[0022] Figure 5 Schematically shows an example of an annular pattern of a resistive heater and a spoke-like pattern of a radiative heater, where the resistive heater and the radiative heater are juxtaposed in Figure 2 the pedestal;

[0023] Figure 6 Schematically shows an example of a spoke-like pattern of a resistive heater and a radiative heater juxtaposed in Figure 2 the pedestal;

[0024] Figures 7A - 7C Shows examples of segments and regions that can be formed in the radiative heater of the example shown in Figures 2 - 6 ;

[0025] Figure 8Schematically shows Figure 1B an example of a susceptor in which, according to the present disclosure, a resistive heater is embedded in the susceptor and a radiant heater is located below the susceptor to heat a substrate;

[0026] Figure 9 Schematically shows Figure 8 a lens disposed on an optical element in the radiant heater of the example shown;

[0027] Figure 10 Schematically shows an example of an optical element provided in a radiant heater according to the present disclosure;

[0028] Figure 11 Schematically shows Figure 1C a showerhead including a radiant heater and Figure 1C an example of a susceptor to heat a substrate according to the present disclosure;

[0029] Figure 12 Schematically shows Figure 1D a susceptor and Figure 1D an example of a showerhead, wherein, according to the present disclosure, the susceptor includes a resistive heater and a first radiant heater, and the showerhead includes a second radiant heater for heating a substrate;

[0030] Figure 13 Schematically shows Figure 1E a susceptor and Figure 1E an example of a showerhead, wherein, according to the present disclosure, the susceptor includes a resistive heater and a first radiant heater disposed below the susceptor, and the showerhead includes a second radiant heater for heating a substrate;

[0031] Figure 14 and Figure 15 shows an example of a cross-sectional view of a susceptor according to the present disclosure; Figure 1A

[0032] Figure 16 shows an example of a block diagram of a system for controlling a resistive heater and a radiant heater according to the present disclosure; and Figures 1A - 13

[0033] Figures 17 to 34 Figures 1A - 1E Figures 2 - 15 shows an example of a method of heating a substrate in a substrate processing system according to the present disclosure, which uses Figure 16 a resistive heater and a radiant heater shown and a controller shown.

[0034] In the drawings, reference numerals may be reused to identify similar and / or identical elements. DETAILED DESCRIPTION​​

[0035] In some processing chambers, a resistive heater is embedded in a bottom plate of a susceptor and is used to heat a substrate disposed on the bottom plate of the susceptor. The bottom plate includes a thermally conductive material, such as a metallic material. The resistive heater heats the bottom plate. Heat is distributed across the entire bottom plate. The heat distributed across the entire bottom plate heats the substrate disposed on the bottom plate. Resistive heating has limited ability to tune or adjust local heating of the substrate in a recipe-controllable manner. For example, heat from the resistive heater may unevenly heat the substrate, which may result in cold spots in the center and / or surrounding regions of the substrate. Such temperature non-uniformity at the center and / or outer periphery of the substrate reduces throughput.

[0036] The present disclosure provides systems and methods for improving temperature uniformity across a substrate by using a combination of resistive heating and LED-based radiant heating for local temperature compensation. In a first example of resistive and radiant heating according to the present disclosure, the resistive and LED-based heaters are juxtaposed in a bottom plate of a susceptor that includes a ceramic material. The LED-based heater (hereinafter referred to as the LED heater) includes one or more strings of LEDs. One or more strings of LEDs may be disposed in the bottom plate of the susceptor in an annular concentric circle pattern that is staggered with the resistive heater, which is also concentrically arranged in the bottom plate of the susceptor in an annular pattern. Alternatively, one or more strings of LEDs may be disposed in the bottom plate of the susceptor in a spoke-like pattern, while the resistive heater is arranged in the bottom plate of the susceptor in an annular pattern. In another implementation, both the resistive heater and the LED strings may be disposed in the bottom plate of the susceptor in a staggered (e.g., alternating) spoke-like pattern.

[0037] In a second example of resistive heating and radiant heating according to the present disclosure, the resistive heater and the LED-based heater are not juxtaposed. Instead, the resistive heater is embedded in the bottom plate of the susceptor, while the LED heater is disposed under the susceptor. In the second example, the LED heater may include a lens disposed over the LEDs. In addition to the resistive heater, the LED heater heats the susceptor, and heat from the susceptor then heats the substrate. Since the resistive heater and the LED heater are not juxtaposed, the susceptor may include a ceramic material or a metallic material. The resistive heater in the bottom plate of the susceptor and the LEDs in the LED heater may be arranged in an annular pattern, a staggered (e.g., alternating) spoke-like pattern, or any combination thereof.

[0038] In a third example of resistive and radiative heating in accordance with the present disclosure, the resistive heater and the LED heater are not juxtaposed. Instead, the resistive heater is embedded in the base plate of the base, while the LED heater is disposed in the printhead. In the third example, multiple strings of LEDs can be arranged in an annular concentric circle pattern in the printhead. Alternatively, multiple strings of LEDs can be arranged in a spoke-like pattern in the printhead. The resistive heater in the base plate can be arranged in an annular pattern or a spoke-like pattern, which can be staggered (e.g., alternated) with the spoke-like pattern of the LEDs in the LED heater of the printhead. Since the resistive heater and the LED heater are not juxtaposed, the base can comprise a ceramic material or a metallic material. The printhead can also comprise a ceramic material or a metallic material.

[0039] In a fourth example of resistive and radiative heating in accordance with the present disclosure, the resistive heater and the LED-based heater are configured in the base plate comprising a ceramic material as in the first example, and additional LED-based heaters are arranged in the printhead as in the third example. Thus, the fourth example is a combination of the first example and the third example. In a fifth example of resistive and radiative heating in accordance with the present disclosure, the resistive heater and the LED heater are not juxtaposed. Instead, the resistive heater is embedded in the base plate of the base, while the LED heater is disposed below the base as in the second example, and additional LED-based heaters are arranged in the printhead as in the third example. Thus, the fifth example is a combination of the second example and the third example.

[0040] In the above examples, the LED strings can be continuous or segmented (zoned). For example, in each circle of the annular pattern, the LEDs can form a single string that can be controlled as a single string. Alternatively, in each circle of the annular pattern, the LEDs may not form a single string. Instead, in each circle of the annular pattern, the LEDs in the string can be divided into segments (regions) that can be controlled individually. Alternatively, the LEDs in the circles of the annular pattern can be grouped into quadrant-like or pie-shaped regions, and each region or a portion thereof can be controlled individually. In the spoke-like pattern, each spoke can comprise one or more strings of LEDs that can be controlled individually or jointly. Alternatively, each spoke can be divided into zones (regions) and the LEDs in each zone (region) can be controlled individually. Many other variations are conceivable.

[0041] In addition, when a resistive heater and an LED heater are juxtaposed in the bottom plate of the susceptor, a cooling channel is provided in the bottom plate of the susceptor to control the temperature of the substrate and prevent overheating of the LEDs. Additionally, as explained in detail below, overheating of the LEDs can be prevented by controlling the resistive heater and the LEDs (e.g., the LEDs in a string, section, or zone) individually (e.g., in a time-interleaved manner and with different illumination intensities). Further, in addition to individually controlling the resistive heater and the LEDs, overheating of the LEDs can be prevented by rotating the substrate such that different portions of the substrate can be heated by different resistive heaters and / or LEDs at different times. Additionally, one or more resistive heating elements of the resistive heater can be controlled individually or jointly, while the regions of the LED heater are controlled individually or jointly by controlling the illumination intensity of the LEDs.

[0042] In the systems and methods of the present disclosure, resistive heating can be used for coarse or overall heating of the substrate, and radiant heating by the LEDs can be used for fine or adjustable heating of the substrate to compensate for and eliminate temperature non-uniformities across the substrate. Thus, LED-based radiant heating can be integrated (combined) within resistive heating to heat specific regions of the substrate in a controlled manner, thereby heating the substrate uniformly. In some examples, LED-based radiant heating can be used to heat the central region of the substrate, while resistive heating can be used to heat the outer regions of the substrate to compensate for and eliminate cold spots in the central region of the substrate. In some examples, LED-based radiant heating can be used to heat the outer (peripheral) regions of the substrate, while resistive heating can be used to heat the remainder of the substrate to compensate for and eliminate cold spots in the outer (peripheral) regions of the substrate. The combination of these two features can be used to compensate for and eliminate cold spots in both the central and outer (peripheral) regions of the substrate. Additionally, the radiant heating power of the LEDs can be controlled (e.g., modulated) along the azimuthal direction to compensate for and eliminate azimuthal temperature non-uniformities in the substrate. These and other features of the present disclosure are described in detail below. Examples of Substrate Processing Systems

[0043] Figure 1AShows a first example of a substrate processing system (hereinafter referred to as System 100-1) that includes resistive and radiative heating according to the present disclosure. System 100-1 can be used to process substrates using chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), chemically enhanced plasma vapor deposition (CEPVD), atomic layer deposition (ALD), or plasma-enhanced ALD (PEALD) processes. System 100-1 includes a processing chamber 101 and a gas distribution system 102. The gas distribution system 102 includes a plurality of gas sources 104, a plurality of valves 106 connected to the gas sources 104, and a plurality of mass flow controllers (MFCs) 108 connected to the valves 106. The gas sources 104 supply various gases, including process gases, precursors, purge gases, inert gases, cleaning gases, etc. The MFCs 108 control the mass flow of the gases.

[0044] In some applications, the gas distribution system 102 further includes a vapor delivery system 110 to supply one or more vaporized precursors via one or more valves 112. One or more gases from the MFCs 108, and one or more vaporized precursors (when used) are supplied to a mixing manifold 114. The gas or gas mixture from the mixing manifold 114 is supplied to the processing chamber 101 via a valve assembly (such as a pulse valve manifold or PVM assembly) 116.

[0045] The processing chamber 101 includes a showerhead 120 and a susceptor 130. The showerhead 120 is connected to the top plate of the processing chamber 101. The showerhead 120 receives the gas or gas mixture from the mixing manifold 114 via the valve assembly 116. The showerhead 120 includes a base 122 and a stem 124. The stem 124 extends from the center of the base 122 and is connected to the top plate of the processing chamber 101. The base 122 is cylindrical and includes a plurality of through-holes (not shown), and the gas or gas mixture is supplied into the processing chamber 101 via the through-holes.

[0046] The susceptor 130 includes a base 132 and a stem 134. The stem 134 is generally cylindrical or Y-shaped, and the tapered (i.e., the top of the Y-shape) portion is connected to the bottom of the base 132. The stem 134 extends from the base 132 and is connected to the bottom of the processing chamber 101. The base 132 is also cylindrical. The stem 134 has a smaller diameter than the base 132. During processing, a substrate 140 is disposed on the top surface of the base 132 of the susceptor 130.

[0047] Although not shown, the base 132 of the pedestal 130 may include lift pins to hold, lower, and raise the substrate 140 relative to the base 132 of the pedestal 130. Optionally, a shaft (shown and described below) extending through the stem portion 134 and the base 132 of the pedestal 130 may be used to hold, lower, and raise the substrate 140 relative to the base 132 of the pedestal 130. The lift pins and the shaft may be used in combination to hold, lower, and raise the substrate 140 relative to the base 132 of the pedestal 130.

[0048] The substrate 140 may be clamped to the base 132 using one of a variety of clamping schemes. Examples of clamping schemes include vacuum clamping, electrostatic clamping, and mechanical clamping. An example of the pedestal 130 including vacuum clamping is shown and described below. Any pedestal shown and described below may be used as the pedestal 130 in the processing chamber 101.

[0049] The base 132 includes an LED heater 150 and a resistive heater 151 to heat the substrate 140, as shown and described in detail below. For example, the resistive heater 151 may include one or more resistive heating elements (described and illustrated in detail below). The resistive heater 151 heats the base 132, which in turn heats the substrate 140. The resistive heater 151 provides coarse heating, while the LED heater 150 provides fine (adjustable) heating, as described in detail below.

[0050] The LED heater 150 includes an array of optical elements (such as LEDs) and a transparent window (shown and described below). Through the window, light from the optical elements in the LED heater 150 is incident on the bottom surface of the substrate 140 to heat the substrate 140. Since the LED heater 150 heats the substrate by radiation from the optical elements (i.e., since the LED heater 150 provides radiative heating by emitting light to optically heat the substrate 140), the LED heater 150 may also be referred to as a radiative heater 150.

[0051] The substrate 140 may be heated while being clamped above the LED heater 150 (e.g., by lift pins passing through the LED heater 150 or by a shaft). The substrate 140 may be heated when it is resting on the LED heater 150 without being clamped (e.g., on a tabletop on the top surface of the base 132, not shown). The substrate 140 may be heated when it is clamped to the pedestal 130 using any clamping method and is resting on the LED heater 150. The LEDs in the LED heater 150 emit light having a wavelength preferably selected between 530 nm and 1000 nm for optically heating the substrate 140.

[0052] A purge gas (e.g., an inert gas) from one of the gas sources 104 is supplied to the stem 134 through the valve 152. The purge gas flows radially over and across the window of the LED heater 150 to clean the window and maintain its transparency, as explained in detail below. An example of the susceptor 130 that includes the LED heater 150 and employs a purge scheme is shown below and described with reference to the subsequent figures.

[0053] In some applications (e.g., in PECVD and PEALD processes), a plasma can be used to process the substrate 140. The system 100-1 includes a radio frequency (RF) system 142 for generating a plasma in the processing chamber 101. The RF system 142 includes an RF generator 144 and a matching circuit 146. When the susceptor 130 is grounded, the RF system 142 supplies RF power to the showerhead 120. Alternatively, although not shown, when the showerhead 120 is grounded, RF power can be supplied to the susceptor 130. The RF power activates the gas or gas mixture supplied through the showerhead 120 and generates a plasma between the showerhead 120 and the substrate 140 disposed on the susceptor 130.

[0054] The showerhead 120 and the susceptor 130 include temperature sensors 126, 136 to sense the temperatures of the showerhead 120 and the susceptor 130. The showerhead 120 and the susceptor 130 include cooling channels (not shown). A coolant circulates through the cooling channels to control the temperatures of the showerhead 120 and the susceptor 130. A coolant supply source 160 can supply coolant to the cooling channels in the showerhead 120 and the susceptor 130 via valves 162, 164.

[0055] One or more actuators, generally designated 170, can be used to move the susceptor 130 relative to the showerhead 120. One of the actuators 170 can also be used to move and rotate the axis of the stem 134 that passes through the susceptor 130 (shown and described in detail below) to raise and rotate the substrate 140. The purge gas for cleaning the window of the LED heater 150 is supplied through a line in the axis through the valve 152, as shown and described in detail below.

[0056] A vacuum pump 180 is connected to the bottom of the processing chamber 101 through a valve 182. The vacuum pump 180 is used to maintain a vacuum in the processing chamber 101 and evacuate reactants and process by-products from the processing chamber 101. Additionally, when vacuum chucking is used, the vacuum pump 180 is connected to the stem 134 of the susceptor 130 through a valve 184. The vacuum pump 180 maintains a vacuum through an annular volume around the axis in the stem 134 of the susceptor 130 (shown and described below) to chuck the substrate 140 to the susceptor 130.

[0057] In addition, the stem portion 134 includes a conduit (shown and described below), through which electrical connections are provided to a number of electrical components disposed in the base 132 of the base 130. For example, the electrical components include a resistive heater 151, an LED heater 150, temperature sensors 126, 136, and other electrical components (e.g., the clamping electrodes shown and described below) disposed in the base 132 of the base 130.

[0058] The controller 190 controls various components of the system 100 (e.g., the gas distribution system 102, valves, the RF system 142, the resistive heater 151, the LED heater 150, the coolant supply source 160, the actuator 170, the vacuum pump 180, etc.). The controller 190 receives data from the temperature sensors 126, 136 and controls the temperatures of the nozzle 120 and the base 130 by controlling the resistive heater 151, the LED heater 150, and the coolant supply source 160. These and other features of the system 100-1 are described in more detail below.

[0059] Figure 1B A second example of a substrate processing system incorporating resistive and radiative heating (hereinafter referred to as system 100-2) according to the present disclosure is shown. System 100-2 is the same as Figure 1A the system 100-1 shown, except that the LED heater 150 is disposed below the base 130 instead of in the base 132 of the base 130. The LED heater 150 heats the base 132 of the base 130, which is also heated by the resistive heater 151. The resistive heater 151 provides coarse heating, while the LED heater 150 provides fine (adjustable) heating, as described in detail below. The combined heat from the resistive heater 151 and the LED heater 150 is used to heat the substrate 140. Figure 1B All other components of the system 100-2 shown are the same as Figure 1A the system 100-1 shown and will not be described again for the sake of brevity.

[0060] Figure 1CShows a third example of a substrate processing system (hereinafter referred to as system 100-3) that includes resistive heating and radiative heating according to the present disclosure. System 100-3 is the same as system 100-1 shown in FIG. 1, except that the LED heater 150 is disposed in the showerhead 120 instead of in the base 132 of the susceptor 130. The LED heater 150 in the showerhead 120 heats the substrate 140 from the top of the substrate 140. The resistive heater 151 in the base 132 of the susceptor 130 heats the substrate 140 from the bottom of the substrate 140. The resistive heater 151 provides coarse heating, while the LED heater 150 provides fine (adjustable) heating, as described in detail below. The combined heat from the resistive heater 151 and the LED heater 150 is used to heat the substrate 140. Figure 1C All other elements of the system 100-3 shown are the same as those of Figure 1A the system 100-1 shown, and for the sake of brevity, will not be described again. Systems 100-1, 100-2, and 100-3 are collectively referred to as system 100.

[0061] Figure 1D Shows a fourth example of a substrate processing system (hereinafter referred to as system 100-4) that includes resistive heating and radiative heating according to the present disclosure. System 100-4 is a Figure 1A combination of 1C the systems 100-1 and 100-3 shown. Specifically, in Figure 1D the system 100-4 shown, a first LED heater 150-1 that is the same as the LED heater 150 of the system 100-1 shown in FIG. 1 is disposed in the base 132 of the susceptor 130. Additionally, a second LED heater 150-2 that is the same as the LED heater 150 of the system 100-3 shown Figure 1C is disposed in the showerhead 120. The resistive heater 151 and the first LED heater 150-1 in the base 132 of the susceptor 130 heat the substrate 140 from the bottom of the substrate 140. The LED heater 150-2 in the showerhead 120 heats the substrate 140 from the top of the substrate 140. The resistive heater 151 provides coarse heating, while the LED heaters 150-1 and 150-2 provide fine (adjustable) heating, as described in detail below. The combined heat from the resistive heater 151 and the LED heaters 150-1 and 150-2 is used to heat the substrate 140. Figure 1D All other elements of the system 100-4 shown are the same as those of Figure 1A the Figure 1C systems 100-1 and 100-3 shown, and for the sake of brevity, will not be described again.

[0062] Figure 1EShows a fifth example of a substrate processing system (hereinafter referred to as system 100-5) that includes resistive heating and radiative heating according to the present disclosure. System 100-5 is Figure 1B and Figure 1C a combination of the systems 100-2 and 100-3 shown. Specifically, in the system 100-5 shown in Figure 1E , a first LED heater 150-1 identical to the LED heater 150 of the system 100-2 shown in Figure 1B is provided in the base 132 of the susceptor 130. Additionally, a second LED heater 150-2 identical to the LED heater 150 of the system 100-3 shown in Figure 1C is provided in the showerhead 120. The resistive heater 151 and the first LED heater 150-1 in the base 132 of the susceptor 130 heat the substrate 140 from the bottom of the substrate 140. The LED heater 150-2 in the showerhead 120 heats the substrate 140 from the top of the substrate 140. The resistive heater 151 provides coarse heating, while the LED heaters 150-1 and 150-2 provide fine (adjustable) heating, as described in detail below. The combined heat from the resistive heater 151 and the LED heaters 150-1 and 150-2 is used to heat the substrate 140. Figure 1E All other elements of the system 100-5 shown in Figure 1B and 1C are the same as those of the systems 100-2 and 100-3 shown, and for the sake of brevity, will not be described again. The systems 100-1, 100-2, 100-3, 100-4, and 100-5 are collectively referred to as system 100. First example of resistive and radiative heating

[0063] Figure 2 Schematically shows a first example of resistive and radiative heating according to the present disclosure. In the first example, the resistive heater 151 and the LED heater 150 are provided in the base 132 of the susceptor 130. The susceptor 130 includes a ceramic material. The LED heater 150 can be arranged above the resistive heater 151 and can be closer to the substrate 140 than the resistive heater 151. In some examples shown and described below, the resistive heater 151 and the LED heater 150 can be coplanar. A cooling channel 153 is arranged below the resistive heater 151 in the base 132 of the susceptor 130. Coolant from a coolant supply source 160 (shown in Figure 1A ) flows through the cooling channel 153. Various configurations and arrangements of the resistive heater 151 and the LED heater 150 in the base 132 of the susceptor 130 are shown in the subsequent figures and described in detail below with reference to the figures.

[0064] Figure 3 More particularly, the LED heater 150, the resistive heater 151, and the cooling channel 153 are shown. The LED heater 150 includes LEDs 200. The LEDs 200 can be arranged in the LED string in various ways. For example, the LEDs 200 can be arranged in concentric circles, poke-like, pie-shaped regions, etc. The various configurations and arrangements of the LEDs 200 in the LED heater 150 and additional structural details (such as windows) are shown and described in detail below with reference to the subsequent figures.

[0065] The resistive heater 151 may include one or more resistive heating elements 203. For example, the resistive heating elements 203 can be arranged in an annular concentric circle pattern, a spoke-like pattern, a pie-shaped region, etc. The various configurations and arrangements of the resistive heating elements 203 in the resistive heater 151 are shown and described in detail below with reference to the subsequent figures. The cooling channel 153 may include one or more conduits 155. For example, the conduits 155 can be arranged in an annular concentric circle pattern, a spiral pattern, etc. The coolant supplied by the coolant supply source 160 (as Figure 1A shown) flows through the conduits 155 of the cooling channel 153. The cooling channel 153 controls the temperature of the base 130. The cooling channel 153 prevents the LED heater 150 in the base 132 of the base 130 from overheating.

[0066] Figures 4A - 4C Examples of different configurations and arrangements of the LEDs 200 in the LED heater 150 and the resistive heating elements 203 in the resistive heater 151 in the base 132 of the base 130 are shown. Figures 4A - 4C A top view of the LED heater 150 and the resistive heater 151 provided in the base 132 of the base 130 is shown. The LED heater 150 can be provided above the resistive heater 151 in the base 132 of the base 130. Alternatively, the LED heater 150 and the resistive heater 151 provided in the base 132 of the base 130 can be coplanar.

[0067] Figure 4AAn example showing a schematic annular concentric circle pattern, where the LEDs 200 in the LED heater 150 and the resistive heating elements 203 in the resistive heater 151 are arranged in the base 132 of the base 130. Specifically, the LEDs 200 in the LED heater 150 are arranged in one or more concentric groups (collectively referred to as the group 205 of the LEDs 200 in the LED heater 150) of the LED strings 205-1, 205-2, 205-3, 205-4 in the base 132 of the base 130. The resistive heating elements 203 in the resistive heater 151 are also arranged in the base 132 of the base 130 in an annular concentric circle pattern, as shown at 203-1, 203-2, 203-3, 203-4 (collectively referred to as the resistive heating elements 203 in the resistive heater 151).

[0068] The LED strings in the group 205 of the LED strings in the LED heater 150 and the resistive heating elements 203 in the resistive heater 151 are arranged in an annular concentric circle pattern in the base 132 of the base 130 in a non-overlapping manner. For example, the LED strings in the group 205 of the LED strings in the LED heater 150 and the resistive heating elements 203-1, 203-2, 203-3, 203-4 in the resistive heater 151 are arranged in an alternating (staggered) pattern from the inner diameter (ID) of the base 132 of the base 130 to the outer diameter (OD) of the base 132 of the base 130.

[0069] Figure 4B The annular concentric circle pattern is shown in more detail, where the LEDs 200 in the LED heater 150 and the resistive heating elements 203 in the resistive heater 151 are arranged in the base 132 of the base 130. For example, each LED string group 205 may include one or more LED strings 200. In addition, in each LED string group 205, one or more LED strings 200 may be segmented and arranged in the regions as shown and described in the following references Figures 7A - 7C shown and described. In each LED string group 205, the segments and regions can be controlled individually, as shown and described in the following with reference to the subsequent figures. As used herein, a segment is a part of an LED string, and a region is a group of parts of an LED string. Additionally, the resistive heating elements 203-1, 203-2, 203-3, 203-4 in the resistive heater 151 can also be controlled individually in combination with controlling the segments and regions in each LED string group 205, as shown in the figure and described below with reference to the subsequent figures.

[0070] Throughout this disclosure, controlling the LED 200 and controlling the resistive heating element 203 includes controlling the amount of electrical current supplied to the LED 200 and the resistive heating element 203. The range of the amount of electrical current can start from zero (which turns off the corresponding LED 200 and the corresponding resistive heating element 203) to any value greater than zero (which controls the amount of radiant and resistive heat provided by the corresponding LED 200 and the corresponding resistive heating element 203).

[0071] Figure 4C It is shown that the LED string groups 205 in the LED heater 150 can be divided into pie-shaped regions (e.g., divided into regions 1 to 8 as shown). Each region can be controlled individually, as shown and described below with reference to the subsequent figures. Additionally, portions of the groups 205 in each region can also be controlled individually, as shown and described below with reference to the subsequent figures. In some examples, the LED string groups 205 in the LED heater 150 can be divided into radially overlapping regions, as shown and described below Figures 7A - 7C and described. Further, in each portion of the group 205, one or more LED strings 200 can be segmented, as shown and described below Figures 7A - 7C and described. The segments, regions, and portions of the LED strings can be controlled individually, as shown and described below with reference to the subsequent figures. Additionally, the resistive heating elements 203-1, 203-2, 203-3, 203-4 in the resistive heater 151 can also be controlled individually in combination with the segments and regions in each individually controllable LED string group 205, as shown and described below with reference to the subsequent figures.

[0072] Figure 5 and Figure 6 Additional examples showing different configurations and arrangements of the LEDs 200 in the LED heater 150 and the resistive heating elements 203 in the resistive heater 151 disposed at the base 132 of the base 130. Figure 5 It is shown that the resistive heating elements 203 of the resistive heater 151 are arranged in the same concentric circular pattern as shown in Figures 4A - 4C . However, the LEDs 200 in the LED heater 150 are arranged in a spoke-like pattern. Figure 6 It is shown that both the resistive heating elements 203 of the resistive heater 151 and the LEDs 200 in the LED heater 150 are arranged in a spoke-like pattern. Figure 5 and Figure 6 It is shown a top view of the LED heater 150 and the resistive heater 151 disposed in the base 132 of the base 130. The LED heater 150 can be disposed above the resistive heater 151 in the base 132 of the base 130, as Figure 5As shown. Alternatively, the LED heater 150 and the resistive heater 151 can be coplanar, as Figure 6 shown. In these different configurations and arrangements of the resistive heater 151 and the LED heater 150, the cooling channels 153 in the base 132 of the base 130 remain as shown with respect to the resistive heater 151 and the LED heater 150 and are described above with reference to Figure 2 and Figure 3 described.

[0073] In Figure 5 , the resistive heating elements 203-1, 203-2, 203-3, 203-4 (collectively referred to as the resistive heating elements 203 in the resistive heater 151) in the resistive heater 151 are arranged in an annular pattern in the base 132 of the base 130. The LEDs 200 in the LED heater 150 are arranged in one or more spoke-shaped radially extending LED string groups 207-1, 207-2, …, 207-8 (collectively referred to as the LED 200 group 207 in the LED heater 150) in the base 132 of the base 130. The group 207 of the LEDs 200 in the LED heater 150 radially extends from the ID of the base 132 of the base 130 to the OD of the base 132 of the base 130.

[0074] For example, each group 207 of the LED strings may include one or more LED strings 200 that radially extend from the ID of the base 132 of the base 130 to the OD of the base 132 of the base 130. In addition, in each group 207 of the LED strings, one or more LED strings 200 can be segmented and arranged in regions, as described below with reference to Figures 7A - 7C shown and described. In each group 207 of the LED strings, the segments and regions can be controlled individually, as shown and described below with reference to the subsequent figures. In some examples, the group 207 of the LED strings in the LED heater 150 can be divided into radially overlapping regions, as shown and described below with reference to Figures 7A - 7C shown and described. Additionally, the resistive heating elements 203-1, 203-2, 203-3, 203-4 in the resistive heater 151 can also be individually controlled in combination with individually controlling the segments and regions in each group 207 of the LED strings, as shown and described with reference to the subsequent figures.

[0075] In Figure 6 , the LEDs 200 in the LED heater 150 are arranged to be located in one or more spoke-shaped radially extending LED string groups 207-1, 207-2, …, 207-8 (collectively referred to as the group 207 of the LEDs 200 in the LED heater 150) in the base 132 of the base 130, as Figure 5As shown. The resistive heater 151 includes resistive heating elements 209-1, 209-2, …, 209-8 (collectively referred to as the resistive heating elements 209 in the resistive heater 151) located in the base 132 of the base 130. The resistive heating elements 209 in the resistive heater 151 are also arranged in a spoke-like radially extending pattern similar to the LED string groups 207 of the LEDs 200 in the LED heater 150.

[0076] The group 207 of the LEDs 200 in the LED heater 150 and the resistive heating elements 209 in the resistive heater 151 are configured in a non-overlapping manner. For example, the group 207 of the LEDs 200 in the LED heater 150 and the resistive heating elements 209 in the resistive heater 151 are arranged in an alternating (staggered) pattern. That is, the group 207 of the LEDs 200 in the LED heater 150 and the resistive heating elements 209 in the resistive heater 151 are radially offset from each other. The group 207 of the LEDs 200 in the LED heater 150 and the resistive heating elements 209 in the resistive heater 151 radially extend from the ID of the base 132 of the base 130 to the OD of the base 132 of the base 130.

[0077] For example, each group 207 of LED strings may include one or more LED strings 200 that radially extend from the ID of the base 132 of the base 130 to the OD of the base 132 of the base 130. In addition, in each group 207 of LED strings, one or more LED strings 200 may be segmented and arranged in regions, as shown and described below with reference to Figures 7A - 7C shown and described. In each group 207 of LED strings, the segments and regions can be individually controlled, as shown and described below with reference to the subsequent figures. In some examples, the groups 207 of LED strings in the LED heater 150 may be divided into regions that radially overlap each other, as shown and described below with reference to Figures 7A - 7C shown and described. Additionally, the resistive heating elements 203-1, 203-2, 203-3, 203-4 in the resistive heater 151 can also be individually controlled in combination with individually controlling the segments and regions in each group 207 of LED strings, as shown and described below with reference to the subsequent figures.

[0078] Figures 7A - 7B Shows an example of the arrangement of the LEDs 200 in the above groups 205 and 207. Figures 7A - 7C Only shows one of the groups 205 and a part of one of the groups 207. The following description applies to each of the groups 205 and 207. As Figure 7AAs shown, groups 205 and 207 of LEDs 200 can include one or more strings of LEDs 200. For example, three strings of LEDs 200 are shown. However, any number of strings can be used. One or more strings of LEDs 200 can be segmented, as shown at 211, 213, 215, 217, 219. For example, segment 215 overlaps segments 211, 213, 217, 219. The LEDs 200 in segment 215 can be controlled separately from the LEDs 200 in segments 211, 213, 217, 219. The LEDs 200 in segment 215 can be controlled in combination with the LEDs 200 in segments 211, 213. The LEDs 200 in segment 215 can be controlled in combination with the LEDs 200 in segments 217, 219. Controlling the LEDs 200 in segments 211, 213, 215, 217, 219 in this way can provide the ability to finely control heating of substrate 140 in combination with separately controlling resistive heating elements 203, 209.

[0079] In Figure 7B and 7C for example, each of groups 205 and 207 of LEDs 200 can include regions (e.g., Figure 7B the two regions 221 and 223 shown in Figure 7C and Figures 4A - 4C the three regions 221, 223, 225 shown in Figure 5 ). For example, referring to Figure 6 assume Figure 7B the group 205 (or 207) shown in Figure 7C is group 205-1 (or 207-1), while Figure 7B and 7C the group 205 (or 207) shown in Figure 7A is group 205-2 (or 207-2). In this example, region 225 in group 205-2 (or 207-2) will overlap regions 221 and 223 in group 205-1 (or 207-1). Additionally, although not shown to avoid cluttering the drawings, Figure 7B and 7C the portions of groups 205 and 207 shown in Figure 7A can be further segmented in a manner similar to that shown in

[0080] By electrically connecting the LED 200 and portions of the LED string with different configurations as described above, the above-described sections and regions can be formed in the LED heater 150. For example, these connections can be hard-wired to the printed circuit board (PCB) of the LED 200 on which the LED heater 150 is arranged. Alternatively, combinational logic circuits can be used to implement different connections and configurations of the LED 200 to form different sections and regions of the LED 200 in the LED heater 150. In some examples, the above-described segmentation and partitioning can also be achieved by controlling the current flowing through different parts of the LED heater 150. Second Example of Resistive Heating and Radiative Heating

[0081] Figure 8 Schematically shows a second example of resistive and radiative heating according to the present disclosure. In the second example, the resistive heater 151 and the LED heater 150 are not juxtaposed in the base 132 of the base 130. Instead, the resistive heater 151 is disposed in the base 132 of the base 130, while the LED heater 150 is disposed below and adjacent to the base 132 of the base 130. The LED heater 150 includes a through hole 204 in the central region. The stem 134 of the base 130 passes through the through hole 204. Since the resistive heater 151 and the LED heater 150 are not juxtaposed in the base 132 of the base 130, the base 130 can include a ceramic material or a metal material. A cooling channel 153 is arranged below the resistive heater 151 in the base 132 of the base 130. Coolant from a coolant supply source 160 ( Figure 1A as shown) flows through the cooling channel 153.

[0082] Except in the second example where the LED heater 150 is disposed below the base 132 of the base 130 instead of in the base 132 of the base 130, all of the various configurations and arrangements of the resistive heater 151 and the LED heater 150 described above with reference to Figures 4A - 7C the display and description can be implemented in the second example Figure 8 shown. Therefore, for the sake of brevity, the second example does not repeat the description of the various configurations and arrangements of the resistive heater 151 and the LED heater 150 in the first example.

[0083] Except for the different positions, Figure 8 the LED heater 150 shown Figures 2 - 6 differs from the LED heater 150 shown Figure 8 only in that the LED heater 150 Figure 9 additionally includes the lens 231 shown and described below. Figure 8The LED heater 150 shown also includes a window 210 (described below with reference to Figure 9 the display and description). Although Figures 2 - 6 not shown, Figures 2 - 6 the LED heater 150 shown also includes a window 210. In addition, as described below, all of the LED heaters 150 described throughout the present disclosure include a PCB 201 on which LEDs 200 and a driver 206 for driving the LEDs 200 are provided (described below with reference to Figure 10 the display and description).

[0084] Figure 9 An LED heater 150 with a lens 231 is schematically shown. Figure 9 A simplified cross-sectional view showing the LED heater 150 with the lens 231 is shown. Specifically, the LED heater 150 includes a PCB 201 on which the LEDs 200 are arranged as described above with reference to Figures 4A - 7C the display and description. A lens array 233 including the lens 231 is provided on the LEDs 200. The lenses 231 in the lens array 233 are vertically aligned with the LEDs 200. In some examples, the lens 231 can be built into the LED (i.e., integrated therewith). That is, the LED 200 can be manufactured to integrally include the lens 231 within the package of the LED 200. In other words, in some examples, each LED 200 can include a corresponding one of the lenses 231.

[0085] The window 210 is arranged on the lens 231 (when the lens 231 is used). For example, the window 210 can include an optically transparent, chemically resistant, and electrically insulating material such as quartz or sapphire. When the lens 231 is not used (e.g., in the first and third examples), the window 210 is arranged on the LEDs 200. When Figure 9 the LED heater 150 shown is mounted Figure 8 below the base 132 of the base 130 as shown, the lens 231 will direct and focus the light emitted by the LEDs 200 onto the base 132 of the base 130.

[0086] In the above first and second examples, the LED heater 150 (specifically, the window 210, the PCB 201 of the LED heater 150, and the lens array 233 (when used)) includes a through hole 204 in the central region. The diameter of the through hole 204 is less than or equal to the diameter of the stem 134 of the base 130. For example, in the first example, the diameter of the through hole 204 can be less than the diameter of the stem 134 of the base 130. In the second example, the diameter of the through hole 204 is equal to the diameter of the stem 134 of the base 130.

[0087] A through-hole 204 is provided such that a shaft (described below) can pass through the stem portion 134 of the base 130 and through the through-hole 204 to move and rotate the substrate 140 (e.g., raise the substrate 140 above the window 210 to clean the window 210 as described below). In implementations where the shaft is not used, there is no need to provide the through-hole 204, and the LEDs 200 can be arranged throughout the LED heater from the OD to the center of the LED heater 150.

[0088] The inner and outer circumferences of the window 210 are sealingly attached to the inner and outer circumferences of the LED heater 150, respectively. Thus, the LED heater 150 and the window 210 form a sealed enclosure that houses the LEDs 200 and the PCB 201. Additionally, the interior portions (e.g., bottom and sides) of the sealed enclosure can be shaped and / or equipped with reflective materials (e.g., a reflective ring) to reflect and / or direct the light emitted by the LEDs 200 onto the substrate 140 in the first example, and onto the bottom of the base portion 132 of the base 130 in the second example.

[0089] Since the window 210 (and the lens 231 when in use) is integrated with the LED heater 150 (including the LEDs 200 and the driver 206) disposed on the PCB 201, the entire assembly including the PCB 201, the LEDs 200, the driver 206, the lens 231 (when in use), and the window 210 is collectively referred to as the LED heater 150.

[0090] Figure 10 A top view of the LED heater 150 is shown. The lens 231 is omitted here to avoid cluttering the figure and to clearly show the LEDs 200 and the driver 206. Each driver 206 can control a group (cluster) of LEDs 200. For example, as seen in the first, second, and third examples Figures 4A - 7C shown and described, the driver 206 can control the LEDs 200 in sections, regions, and portions of the LED strings in the LED heater 150. The controller 190 ( Figures 1A - 1C shown therein) can control the LEDs 200 by controlling the driver 206.

[0091] In Figure 10 , the reference numeral 202 denotes the LED strings arranged in the concentric circle pattern described above. Although the LED strings 202 are shown as a single string for simplicity of illustration, each LED string shown at 202 can include multiple LED strings, as Figures 4A - 4CAs shown. That is, the description of the LED string 202, its parts (such as sections and regions), and the control thereof is not limited to the concentric arrangement of the LEDs 200, but also covers the spoke-like arrangement of the LEDs 200. In addition, the LEDs 200 in the LED string 202 can be organized and controlled in sections, regions, and parts, as described above. In addition, in the third example, the LED heater 150 is disposed in the showerhead 120, and the LED string 202 can extend from the center of the LED heater 150 to the OD of the LED heater 150. That is, when disposed in the showerhead 120, the LED heater 150 can be completely filled with the LEDs 200. When the LED heater 150 is disposed in the showerhead 120, the LED heater 150 also does not include the through hole 204.

[0092] For example, after the substrate 140 is loaded into the processing chamber 101, the driver 206 can supply power to the LED 200 at a first power level to preheat the substrate 140 while holding the substrate 140 above the susceptor 130 before lowering the substrate 140 onto the susceptor 130 to deposit a film on the substrate 140. Subsequently, after preheating the substrate 140 for a predetermined amount of time, the driver 206 can supply a reduced amount of power to the LED 200 at a second power level to heat the substrate 140 before or after lowering the substrate 140 onto the susceptor 130. Subsequently, after depositing the film on the substrate 140, the driver 206 can supply a reduced amount of power to the LED 200 at a third power level before the substrate 140 is lifted off the susceptor 130 and removed from the processing chamber 101.

[0093] In addition, in any of the above steps, the driver 206 can also control the power supplied to the LED 200. For example, each driver 206 can control the duty cycle (on / off time) of the corresponding LED 200. For example, each driver 206 can control the intensity (brightness) of the corresponding LED 200. For example, the controller 190 can control the driver 206 such that only the LEDs 202 in the selected LED string 202 or its part are turned on or off at different times. For example, the controller 190 can control the driver 206 such that only one or more LEDs 200 in a group (such as a region or part of the LED heater 150) are turned on or off at different times. For example, the controller 190 can control the driver 206 such that the LEDs 200 or different parts of the LEDs 200 can output different amounts of light (i.e., optical heating power) at different times. The driver 206 can control the power supplied to the LED 200 gradually or step by step. Any combination of these and additional controls can be used to control the LED 200.

[0094] In some examples, some or all of the control provided by the controller 190 for the LEDs 200 can be transferred (in the form of hardware, firmware, or a combination thereof) to one or more drivers 206. In some examples, one or more drivers 206 can control the remaining drivers 206. The controller 190 and / or the drivers 206 can control the LEDs 200 differently before and after the substrate 140 is rotated. In addition to the control of the LEDs 200 described above, the controller 190 can also control the resistive heater 151 in conjunction with the LED heater 150, as described above with reference to FIG. Figures 4A - 7C In the description of the first, second, and third examples. In addition, the controller 190 can also control the rotation of the substrate 140 and the flow of coolant from the coolant supply through the cooling channel 153. Therefore, the combination of resistive heating and radiative (optical) heating of different portions of the substrate 140 can be controlled by controlling the rotation of the resistive heater 151, the LED heater 150, the substrate 140, and the flow of coolant through the cooling channel 153. Third Example of Resistive and Radiant Heating

[0095] Figure 11 A third example of resistive and radiant heating according to the present disclosure is shown. In the third example, the resistive heater 151 and the LED heater 150 are not juxtaposed in the base 132 of the pedestal 130. Instead, the resistive heater 151 is disposed in the base 132 of the pedestal 130, while the LED heater 150 is disposed in the showerhead 120 near the faceplate 125 of the base 122 of the showerhead 120. The LED heater 150 disposed in the showerhead 120 is similar to the LED heater 150 disposed in the base 132 of the pedestal 130. The LED heater 150 disposed in the showerhead 120 includes the LED heater 150 described above with reference to FIG. Figures 8 - 10 201, window 210, and driver 206 shown and described in the drawings, except that the LED heater 150 disposed in the showerhead 120 does not include the lens 231. The LED heater 150 disposed in the showerhead 120 also does not include the through hole 204. Further, the LED heater 150 disposed in the showerhead 120 is completely filled with LEDs 200 from the center of the LED heater 150 to the OD of the LED heater 150. The layout of the LEDs 200 disposed in the LED heater 150 in the showerhead 120 can be referred to as Figures 4A - 4C , 5, 7A-7C or 10.

[0096] In a third example, the base 122 of the showerhead 120 includes an inflation chamber 235 defined by a panel 125, sidewalls 129, and an upper surface 131 of the base 122 of the showerhead 120. The stem 124 of the showerhead includes an inlet 133 through which one or more processing gases are supplied through the gas distribution system 102 to the showerhead 120. A conduit (or hole) 135 is drilled from the inlet 133 through the center of the stem 124 of the showerhead 120 to reach the inflation chamber 235. The panel 125 includes a plurality of through-holes 127.

[0097] The LED heater 150 is disposed within or below the inflation chamber 235 in the base 122 of the showerhead 120. The window 210 of the LED heater 150 faces the substrate 140 and the susceptor 130. The window 210 of the LED heater 150 is coplanar with the panel 125 of the showerhead 120. In some examples, the panel 125 can be an annular ring, which together with the window 210 forms the panel 125 of the showerhead 120. Thus, the inflation chamber 235 is defined by the upper surface 131 of the base 122 of the showerhead 120, the sidewalls 129, and the bottom surface of the LED heater 150 opposite the window 210.

[0098] The diameters of the LED heater 150 and the inflation chamber 235 are smaller than the OD of the base 122 of the showerhead 120. The diameter of the LED heater 150 is equal to the diameter of the inflation chamber 235. The LED heater 150 and the inflation chamber 235 radially extend from the center of the base 122 of the showerhead 120 up to the OD of the base 122 of the showerhead 120. The diameters of the LED heater 150 and the inflation chamber 235 are greater than or equal to the diameter of the substrate 140.

[0099] The through-holes 127 extend vertically through the LED heater 150 (i.e., through the bottom surface of the LED heater 150, the PCB 201, and the window 210). The through-holes 127 are parallel to the vertical axis of the showerhead 120, which is perpendicular to the diameter of the base 122 of the showerhead 120. The through-holes 127 are distributed from the center of the base 122 of the showerhead 120 to the OD of the base 122 of the showerhead 120. The through-holes 127 are in fluid communication with the inflation chamber 235, the conduit 135, and the inlet 133 of the showerhead 120. The LEDs 200 are arranged on the PCB 201 of the LED heater 150 with a gap from the through-holes 127 in the panel 125.

[0100] The cooling plate 157 is disposed on the upper surface 131 of the base 122 of the showerhead 120. The cooling plate 157 includes one or more cooling channels 159. By a coolant supply source 160 ( Figure 1CAs shown, the coolant supplied flows through the cooling channel 159. The cooling plate 157 controls the temperature of the nozzle 120. The coolant flowing through the cooling channel 159 prevents the LED heater 150 in the nozzle 120 from overheating. The base 132 of the base 130 also includes a resistive heater 151 and a cooling channel 153. The coolant supplied by the coolant supply source 160 ( Figure 1C as shown) also flows through the cooling channel 153.

[0101] Except in the third example where the LED heater 150 is provided in the nozzle 120 instead of in the base 132 of the base 130, all the various configurations and arrangements of the resistive heater 151 and the LED heater 150 referred to above for the first example with reference to Figures 4A - 7C display and description can be implemented in the third example shown in Figure 11 shown. Therefore, for the sake of brevity, the third example does not repeat the descriptions of the various configurations and arrangements of the resistive heater 151 and the LED heater 150 in the first example and the second example. In addition, the various controls for the LED heater 150 and the resistive heater 151 described above for the first and second examples with reference to Figures 4A - 10 described can be applied to the third example, and thus are not repeated for the third example for the sake of brevity. Fourth Example of Resistive Heating and Radiative Heating

[0102] Figure 12 Shows a fourth example of resistive and radiative heating used in the system 100 according to the present disclosure. In the fourth example, the resistive heater 151 and the first LED heater 150-1 are juxtaposed in the base 132 of the base 130, as referred to above with reference to Figure 1D and Figure 1A and 2 -7C shown and described. Figure 12 The resistive heater 151 and the first LED heater 150-1 shown as such are respectively the same as the resistive heater 151 and the LED heater 150 shown in Figure 1A and 2 -7C, and thus are not described for the sake of brevity. Additionally, the second LED heater 150-2 provided in the nozzle 120 is the same as the LED heater 150 provided in the nozzle 120 referred to above with reference to Figure 11 shown and described, and thus is not described for the sake of brevity.

[0103] The geometries of the first LED heater 150-1 and the second LED heater 150-2 are the same as those referred to above with reference to Figures 2 - 11 and below with reference to Figure 14 and Figure 15The geometries of the described LED heaters 150 are the same, and thus for the sake of brevity will not be described again. The geometric relationships of the first LED heater 150-1 and the second LED heater 150-2 with the resistive heater 151, the base 130, the components of the base 130 (such as the base 132, the cooling channels 153 and 159, etc.), the printhead 120, and the components of the printhead 120 are the same as those referred to above Figures 2 - 11 and those referred to below Figure 14 and Figure 15 for the described geometric relationships of the LED heater 150, and thus for the sake of brevity will not be described again.

[0104] The second LED heater 150-2 can be controlled in the same manner as the first LED heater 150-1. The second LED heater 150-2 can be controlled in combination with the resistive heater 151 in the same manner as the first LED heater 150-1 can be controlled in combination with the resistive heater 151. The second LED heater 150-2 can be controlled in combination with the first LED heater 150-1 in any manner. The first LED heater 150-1 and the second LED heater 150-2 can be controlled in combination with the resistive heater 151 in any manner. For the above references Figures 4A - 11 and those referred to below Figures 14 - 34 the various controls of the LED heater 150 and the resistive heater 151 in the first and third examples described apply to the fourth example, and thus will not be repeated for the third example for the sake of brevity. Fifth example of resistive heating and radiative heating

[0105] Figure 13 shows a fifth example of resistive and radiative heating used in the system 100 shown according to the present disclosure. In the fifth example, the resistive heater 151 is disposed in the base 132 of the base 130, as shown and described above with reference to Figure 1E and Figure 1A and 2 -7C. The first LED heater 150-1 is disposed below the base 132 of the base 130, as shown Figures 8 - 10 and described above. The resistive heater 151 and the first LED heater 150-1 are respectively the same as the resistive heater 151 and the LED heater 150 shown in Figures 8 - 10 and thus will not be described again for the sake of brevity. Additionally, the second LED heater 150-2 disposed in the printhead 120 is the same as the LED heater 150 disposed in the printhead 120 shown and described above with reference to Figure 11 and thus will not be described for the sake of brevity.

[0106] Similarly, the geometries of the first LED heater 150-1 and the second LED heater 150-2 are the same as those of the LED heater 150 described above with reference to Figures 2 - 11 and below with reference to Figure 14 and Figure 15 and thus will not be described again for the sake of brevity. The geometric relationships of the first LED heater 150-1 and the second LED heater 150-2 with the resistive heater 151, the base 130, the components of the base 130 (such as the base 132, the cooling channels 153 and 159, etc.), the nozzle 120, and the components of the nozzle 120 are the same as those of the LED heater 150 described above with reference to Figures 2 - 11 and below with reference to Figure 14 and Figure 15 and thus will not be described again for the sake of brevity.

[0107] The second LED heater 150-2 can be controlled in the same manner as the first LED heater 150-1. The second LED heater 150-2 can be controlled in combination with the resistive heater 151 in the same manner as the first LED heater 150-1 can be controlled in combination with the resistive heater 151. The second LED heater 150-2 can be controlled in combination with the first LED heater 150-1 in any manner. The first LED heater 150-1 and the second LED heater 150-2 can be controlled in combination with the resistive heater 151 in any manner. For the above references Figures 8 - 11 and the references below Figures 14 - 34 the various controls of the LED heater 150 and the resistive heater 151 in the second and third examples described apply to the fifth example and thus will not be repeated for the third example for the sake of brevity. Examples of substrate rotation and window cleaning

[0108] Figure 14 and Figure 15 show examples of the LED heater 150 installed in the base 130 according to the first example above, where the substrate 140 is clamped to the base 130 using vacuum chucking. In addition, in addition to vacuum chucking, these figures also show cleaning and rotation schemes for keeping the window 210 clean and rotating the substrate 140 relative to the LED heater 150. Figure 14 Show an example of vacuum chucking. Figure 15 Show cleaning the window 210 when the substrate 140 is lifted and rotated from the base 130. For the sake of brevity, the elements that have been shown and described above will not be described again.

[0109] In Figure 14In this case, the LED heater 150 and the window 210 are disposed together in an annular cavity 138 formed in a base portion 132 of the base 130. The annular cavity 138 is formed by removing material from the top surface of the base portion 132 of the base 130. The depth of the annular cavity 138 is equal to the height of the LED heater 150 and the window 210. The LED heater 150 and the base portion 132 of the base 130 are coplanar. Thus, the top surface of the window 210 is flush with the top edge 139 of the base portion 132 of the base 130. During processing, the substrate 140 is disposed on the top surface of the window 210. The vacuum chuck described below is used to chuck the substrate 140 to the base 130.

[0110] The stem portion 134 of the base 130 contains a shaft 250. The shaft 250 extends through the center of the stem portion 134 of the base 130 and the base portion 132. The shaft 250 includes a T-shaped end portion (i.e., the horizontal portion forming the top of the T-shape) and a distal end (i.e., the vertical portion forming the bottom of the T-shape). The T-shaped end portion of the shaft 250 extends through a through hole 204 in the LED heater 150 and through the central region of the top surface of the base portion 132 of the base 130. The top surface of the T-shaped end portion of the shaft 250 is flush with the top surface of the window 210. The bottom surface of the T-shaped end portion of the shaft 250 is flush with and rests on the top of the central region of the top surface of the base portion 132 of the base 130. The diameter of the T-shaped end portion of the shaft 250 is slightly smaller than the diameter of the through hole 204 in the LED heater 150.

[0111] The distal end of the shaft 250 extends through the resistive heater 151 and the cooling channel 153 and through the bottom end of the stem portion 134 of the base 130. The distal end of the shaft 250 extends through a vacuum pump 180 attached to the bottom end of the stem portion 134 of the base 130. One of the actuators 170 is attached to the distal end of the shaft 250. The actuator 170 can move the shaft 250 through the vacuum pump 180 and through the stem portion 134 of the base 132 of the base 130 to raise and lower the substrate 140. As Figure 15 shown, when lifted, the substrate 140 is supported by the T-shaped end portion of the shaft 250. When lifted, the actuator 170 can also rotate the shaft 250 to rotate the substrate 140 relative to the LED heater 150.

[0112] A conduit 252 passes through the shaft 250. The conduit 252 and the shaft 250 are coaxial. The conduit 252 extends through the shaft 250 to the T-shaped end portion of the shaft 250. The shaft 250 includes a plurality of holes 254 that radially pass through the T-shaped end portion of the shaft 250. Near the T-shaped end of the shaft 250, one end of the conduit 252 is connected to the plurality of holes 254. The distal end of the conduit 252 extends beyond the distal end of the shaft 250. The distal end of the conduit 252 is connected to one of the gas sources 104 through a valve 152 (as Figure 1A shown). In Figure 15When the shaft 250 raises the substrate 140, purge gas is supplied via the conduit 252. The purge gas flows through the conduit 252, exits via the hole 254, and radially flows over the window 210 and above the window 210 in the direction of the arrow shown to clean the window 210.

[0113] The stem portion 134 of the base 130 also includes a conduit 256 through which electrical connectors (such as insulated wires or conductors) are routed to electrical components (such as the resistive heater 151 and the LED heater 150) in the base 132 of the base 130. The distal end of the electrical connector is connected to the controller 190 (as Figure 1A shown). The conduit 256 is drilled through the stem portion 134 of the base 130 and extends through the stem portion 134 of the base 130. The conduit 256 extends into the base 132 of the base 130, through the resistive heater 151 and the cooling channel 153, until the through-hole 204 of the LED heater 150. The conduits 252, 256, and the shaft 250 are coaxial. The diameter of the conduit 256 is greater than the diameter of the shaft 250.

[0114] The stem portion 134 of the base 130 also includes a conduit 258. The diameter of the conduit 258 is greater than the diameter of the conduit 256 and less than the diameter of the stem portion 134 of the base 130. The conduits 258, 252, 256, and the shaft 250 are coaxial. The first end of the conduit 258 is in fluid communication with the vacuum pump 180. The second end of the conduit 258 extends through the stem portion 134 of the base 130 and into the base 132 of the base 130. The conduit 258 extends into the base 132 of the base 130 to a point below the cooling channel 153. At the second end, the conduit 258 is connected to a first set of conduits (or channels) 260 that are drilled radially through the base 132 of the base 130. The conduits 260 extend radially to the OD of the base 132 of the base 130. The conduits 260 are in fluid communication with the conduit 258.

[0115] A second set of conduits 262 is drilled through the base 132 of the base 130 perpendicular to the first set of conduits 260. The conduits 262 extend from the conduits 260 through the cooling channel 153, the resistive heater 151, and the LED heater 150 to the top surface of the base 132 of the base 130 where the substrate 140 is rested during processing. The conduits 262 are in fluid communication with the conduits 260, 258.

[0116] When the substrate 140 is to be clamped to the base 130, the controller 190 activates the vacuum pump 180 and opens the valve 184 (as Figure 1Aas shown) to create a vacuum in conduits 258, 260, 262. The vacuum within conduits 258, 260, 262 clamps substrate 140 to base 132 of pedestal 130. After clamping substrate 140 to base 132 of pedestal 130, controller 190 controls resistive heater 151, LED heater 150, and cooling channel 153 to heat substrate 140 as described above according to the process to be performed on substrate 140.

[0117] In Figure 15 when substrate 140 needs to be rotated relative to LED heater 150, controller 190 controls vacuum pump 180 and valve 184 such that the vacuum in conduits 258, 260, 262 is reduced. The vacuum in conduits 258, 260, 262 is reduced sufficiently to allow shaft 250 to resist the force of the vacuum and lift substrate 140. Controller 190 activates actuator 170 such that shaft 250 lifts and rotates substrate 140. In some applications, substrate 140 can be lifted and held stationary, and pedestal 130 can be rotated to rotate LED heater 150 relative to substrate 140.

[0118] When substrate 140 is lifted, controller 190 opens valve 152 (as Figure 1A shown) to allow purge gas to flow through conduit 252 and through holes 254. The purge gas flows through conduit 252 and holes 254 and radially over and through window 210 as Figure 15 shown by the arrows in. The purge gas flowing over and through window 210 removes any material that may have deposited on window 210. Controller 190 controls valves 152 and 184 ( Figure 1A shown in) such that vacuum pump 180 continues to pump conduits 258, 260, 262 and process chamber 101 (as Figure 1A shown). Thus, the material removed from window 210 is exhausted from process chamber 101.

[0119] Next, actuator 170 lowers shaft 250 to place substrate 140 again on base 132 of pedestal 130. Then substrate 140 is vacuum clamped as described above. Controller 190 again controls resistive heater 151, LED heater 150, and cooling channel 153 to heat substrate 140 as described above. This process is repeated as needed until the processing of substrate 140 is complete.

[0120] In Figure 14 and Figure 15 the description of the rotation of substrate 140 and the cleaning of window 210 of LED heater 150 refers to the above Figures 4A - 4CThe LED heater 150 and the resistive heater 151 arranged in a concentric pattern as shown and described. When the LED heater 150 and the resistive heater 151 are arranged as shown and described in reference Figure 5 and Figure 6 When shown and described, the substrate 140 can be lifted and rotated in a similar manner and the window 210 of the LED heater 150 can be cleaned. When the first LED heater 150-1 and the resistive heater 151 are arranged as shown and described in Figure 12 When shown and described, the substrate 140 can be lifted and rotated in a similar manner and the window 210 of the first LED heater 150-1 can be cleaned. In addition, when the LED heater 150 is arranged as shown and described below the base 132 of the base 130 as shown in Figure 8 and when the LED heater 150 is arranged as shown and described in the nozzle 120 as in reference Figure 11 When shown and described, the substrate 140 can be lifted and rotated in a similar manner. In addition, when the first LED heater 150-1 is arranged as shown and described below the base 132 of the base 130 as in Figure 13 and when the second LED heater 150-2 is arranged as shown and described in the nozzle 120 as in Figure 13 When shown and described, the substrate 140 can be lifted and rotated in a similar manner.

[0121] In addition, in Figure 14 and Figure 15 Vacuum chucking is shown and described as an example of a chucking mechanism for chucking the substrate 140 to the base 132 of the base. Instead, any other chucking mechanism can be used. Non-limiting examples of other chucking mechanisms include electrostatic chucking and mechanical chucking that can be employed in the base 130.

[0122] In addition, although not shown, in some examples, a mesa can be used to support the substrate 140 on the base 130 instead of using a chucking scheme. In a first example, the resistive heater 151 and the LED heater 150 are juxtaposed in the base 130, and the mesa is a small bump or a generally cylindrical element that is raised above the top surface of the window 210 and protrudes towards the substrate 140. The mesa can be formed integrally (i.e., uniformly) on the top surface of the window 210. The mesa comprises the same optically transparent, chemically resistant, and electrically insulating material as the window 210, such as quartz or sapphire. The mesa can be distributed with a gap from the LED 200 anywhere on the top surface of the window 210 (e.g., between the LEDs 200).

[0123] In a third example, in which the resistive heater 151 is disposed in the base 132 of the pedestal 130 and the LED heater 150 is disposed in the showerhead 120, the mesas are tiny bumps or generally cylindrical elements that are raised above the top surface of the window 210 and protrude toward the substrate 140. The mesas can be integrally (i.e., uniformly) formed on the top surface of the base 132 of the pedestal 130. The mesas comprise the same material as the base 132 of the pedestal 130. The mesas can be distributed anywhere on the top surface of the base 132 of the pedestal 130. In the first and third examples, the number, size, and shape of the mesas can vary. The mesas can be circular, square, hexagonal, or any other polygonal shape (or any combination thereof).

[0124] Figure 16 An example of a system for controlling the resistive heater 151, the LED heater 150, the first LED heater 150-1 and the second LED heater 150-2, and the cooling channels 153 and 159 in the first to fifth examples of the resistive heating and radiant heating described above is shown. The controller 190 controls the resistive heater 151, the LED heater 150, the first LED heater 150-1 and the second LED heater 150-2, and the cooling channels 153 and 159, as described above with reference to FIG. Figures 2 - 15 And as referenced below Figures 15 - 34 The controller 190 and the driver 206 perform the above reference Figures 2 - 15 The control operations described and the following references Figures 15 - 34 The method described.

[0125] In short, in the first through fifth examples of resistive heating and radiant heating described above, the controller 190 controls the driver 206, which in turn controls the LEDs 200 in different portions (e.g., sections and zones) of the LED heaters 150, 150-1, and 150-2, as described above and below. The controller 190 also controls the resistive heating elements 203 and 207 of the resistive heater 151, as described above and below. The controller 190 controls the different portions (e.g., sections and zones) of the LED heaters 150, 150-1, and 150-2, as well as different ones of the resistive heating elements 203 and 207 of the resistive heater 151, in a time-staggered manner as described in detail below. In addition, the controller 190 rotates the substrate 140, as described above and below. Furthermore, the controller 190 controls the flow of coolant supplied by the coolant supply 160 through the cooling channels 153 and 159, as described above and below. The controller 190 may perform all of these control operations in combination to fine-tune the heating of the substrate 140 using any combination of these controls.

[0126] In the following description, generally only the names of the respective components of the resistive heater 151 and the LED heaters 150, 150-1, 150-2 are used, while the reference numerals of the respective components of the resistive heater 151 and the LED heaters 150, 150-1, 150-2 are omitted. In addition, the methods described below are applicable to resistively and radiatively heating the substrate 140 using any one of the first to fifth examples of resistive and radiative heating described above. Resistive and Radiative Heating Method

[0127] Figure 17 A method 300 for resistively and radiatively heating a substrate 140 according to the present disclosure is shown. At 302, the substrate 140 is heated using resistive heating (also referred to as rough heating) provided by a resistive heater 151 disposed in a base 132 of a susceptor 130. At 304, the substrate 140 is heated using radiative heating (also referred to as fine tuning heating) provided by an LED heater 150 disposed in the base 132 of the susceptor 130, below the susceptor 130, or in a nozzle 120. In all of the following methods, although not shown, in conjunction with controlling the resistive heater 151 and the LED heater 150, a controller 190 also controls the flow of coolant through cooling channels 153, 159 to control the temperature of the substrate 140, the nozzle 120, and the LED heater 150.

[0128] Figure 18 A method 310 for resistively and radiatively heating a substrate 140 including a rotating substrate according to the present disclosure is shown. At 312, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed in a base 132 of a susceptor 130. At 314, the controller 190 actuates a shaft 250 and rotates the substrate 140. At 316, the controller 190 adjusts the current supplied to a resistive heating element of the resistive heater 151. In addition, the controller 190 and / or a driver 206 adjusts the illumination intensity of different portions (such as the above-described sections and / or regions) of the LED heater 150. For example, the controller 190 controls different combinations of the resistive heating element of the resistive heater 151 and the sections and / or regions of the LED heater 150. These different controls of the resistive heater 151 and the LED heater 150 result in: minimizing cold spots in the substrate 140; increasing temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the LED heater 150.

[0129] Figure 19Disclosed is a method 320 for resistively and radiatively heating a substrate 140 including a rotating substrate according to the present disclosure. At 322, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed in a base 132 of a susceptor 130. At 324, a controller 190 selects a first portion (e.g., a first region) of an LED heater 150 to heat the substrate 140. At 326, the controller 190 actuates a shaft 250 and rotates the substrate 140. At 328, the controller 190 deselects the first portion and selects a second portion (e.g., a second region) of the LED heater 150 to heat the substrate 140.

[0130] In this manner, the controller 190 can rotate the substrate 140 again and select different portions of the LED heater 150 to heat the substrate 140. Selecting different portions of the LED heater 150 to heat the substrate 140 at different times while also periodically rotating the substrate 140 results in: minimizing cold spots in the substrate 140; increasing temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the LED heater 150.

[0131] Figure 20 Disclosed is a method 340 for resistively and radiatively heating a substrate 140 including a rotating substrate according to the present disclosure. At 342, the controller 190 selects a first set of resistive heating elements of a resistive heater 151 disposed in a base 132 of a susceptor 130 to heat the substrate 140. At 344, the controller 190 selects a first portion (e.g., a first region) of an LED heater 150 to heat the substrate 140. At 346, the controller 190 actuates a shaft 250 and rotates the substrate 140. At 348, the controller 190 deselects the first set of resistive heating elements of the resistive heater 151 and the first portion of the LED heater 150, and instead selects a second set of resistive heating elements of the resistive heater 151 and a second portion (e.g., a second region) of the LED heater 150 to heat the substrate 140.

[0132] In this manner, the controller 190 can rotate the substrate 140 again and select and deselect different sets of resistive heating elements of the resistive heater 151 and different portions of the LED heater 150 to heat the substrate 140. Selecting different sets of resistive heating elements of the resistive heater 151 and different portions of the LED heater 150 to heat the substrate 140 at different times while also periodically rotating the substrate 140 results in: minimizing cold spots in the substrate 140; increasing temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the LED heater 150.

[0133] Figure 21Disclosed is a method 360 for resistively and radiatively heating a substrate 140 including a rotating substrate according to the present disclosure. At 362, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed in a base 132 of a pedestal 130. At 364, a controller 190 selects a portion (e.g., a first region) of an LED heater 150 to heat the substrate 140. The controller 190 controls the selected portion (e.g., the first region) of the LED heater 150 to heat the substrate 140 such that the substrate 140 is heated using a first illumination intensity of LEDs 200 in the selected portion. At 366, the controller 190 actuates a shaft 250 and rotates the substrate 140. At 368, the controller 190 controls the selected portion (e.g., the first region) of the LED heater 150 to heat the substrate 140 using a second illumination intensity of LEDs 200 in the selected portion.

[0134] In this manner, the controller 190 can rotate the substrate 140 again and vary the illumination intensity of the selected portion of the LED heater 150 to heat the substrate 140. Selecting different illumination intensities of the selected portion of the LED heater 150 to heat the substrate 140 at different times and also rotating the substrate 140 periodically results in: minimizing cold spots in the substrate 140, increasing temperature uniformity across the substrate 140, and reducing overheating of the LEDs 200 in the LED heater 150.

[0135] Figure 22 Disclosed is a method 380 for resistively and radiatively heating a substrate 140 including a rotating substrate according to the present disclosure. At 382, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed in a base 132 of a pedestal 130. At 384, a controller 190 selects a first portion and a second portion (e.g., a first region and a second region) of an LED heater 150 to heat the substrate 140. The controller 190 controls the selected portions (e.g., the first region and the second region) of the LED heater 150 to heat the substrate 140 using a first illumination intensity and a second illumination intensity of LEDs 200 in the first and second portions, respectively. At 386, the controller 190 actuates a shaft 250 and rotates the substrate 140. At 388, the controller 190 controls the selected portions (e.g., the first and second regions) of the LED heater 150 to heat the substrate 140 using a third and a fourth illumination intensity of LEDs 200 in the selected portions.

[0136] In this manner, the controller 190 can rotate the substrate 140 again and change the illumination intensity of the selected portion of the LED heater 150 to heat the substrate 140. Selecting different illumination intensities of the selected portion of the LED heater 150 to heat the substrate 140 at different times and also rotating the substrate 140 periodically results in: minimizing cold spots in the substrate 140; increasing the temperature uniformity on the substrate 140; and reducing overheating of the LEDs 200 in the LED heater 150.

[0137] Figure 23 Figure 400 shows a method of resistively and radiatively heating a substrate 140 including a rotating substrate according to the present disclosure. At 402, the controller 190 selects a first set of resistive heating elements and a second set of resistive heating elements (e.g., a first resistive heating element and a second resistive heating element) of the resistive heater 151 disposed in the base 132 of the base 130 to heat the substrate 140. The controller 190 controls the selected resistive heating elements of the resistive heater 151 (e.g., the first resistive heating element and the second resistive heating element) to heat the substrate 140 by supplying a first current and a second current to the first set of resistive heating elements and the second set of resistive heating elements, respectively.

[0138] At 404, the controller 190 selects a first portion and a second portion (e.g., a first region and a second region) of the LED heater 150 to heat the substrate 140. The controller 190 controls the selected portions of the LED heater 150 (e.g., the first region and the second region) to heat the substrate 140 using a first illumination intensity and a second illumination intensity of the LEDs 200 in the first portion and the second portion, respectively. At 406, the controller 190 actuates the shaft 250 and rotates the substrate 140.

[0139] At 408, the controller 190 controls the selected resistive heating elements of the resistive heater 151 (e.g., the first resistive heating element and the second resistive heating element) to heat the substrate 140 by supplying a third current and a fourth current to the first set of resistive heating elements and the second set of resistive heating elements, respectively. The controller 190 controls the selected portions of the LED heater 150 (e.g., the first region and the second region) to heat the substrate 140 using a third illumination intensity and a fourth illumination intensity of the LEDs 200 in the first portion and the second portion, respectively.

[0140] In this manner, the controller 190 can rotate the substrate 140 again, change the current supplied to the selected resistive heating elements of the resistive heater 151, and change the illumination intensity of the selected portions of the LED heater 150 to heat the substrate 140. Supplying different currents to the selected resistive heating elements of the resistive heater 151 at different times and selecting different illumination intensities of the selected portions of the LED heater 150 to heat the substrate 140 at different times and also periodically rotate the substrate 140 results in: minimizing cold spots in the substrate 140; increasing the temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the LED heater 150.

[0141] Figure 24 Displays a method 420 of resistively and radiatively heating a substrate 140 including a rotating substrate according to the present disclosure. At 422, the controller 190 selects a first set of resistive heating elements and a second set of resistive heating elements (e.g., a first resistive heating element and a second resistive heating element) of the resistive heater 151 disposed in the base 132 of the base 130 to heat the substrate 140. The controller 190 controls the selected resistive heating elements of the resistive heater 151 (e.g., the first resistive heating element and the second resistive heating element) to heat the substrate 140 by supplying a first current and a second current to the first set of resistive heating elements and the second set of resistive heating elements, respectively.

[0142] At 424, the controller 190 selects a first portion and a second portion (e.g., a first region and a second region) of the LED heater 150 to heat the substrate 140. The controller 190 controls the selected portions of the LED heater 150 (e.g., the first region and the second region) to heat the substrate 140 using a first illumination intensity and a second illumination intensity of the LEDs 200 in the first portion and the second portion, respectively. At 426, the controller 190 actuates the shaft 250 and rotates the substrate 140.

[0143] At 428, the controller 190 controls the selected resistive heating elements of the resistive heater 151 (e.g., the first resistive heating element and the second resistive heating element) to heat the substrate 140 by supplying a third current and a fourth current to the first set of resistive heating elements and the second set of resistive heating elements, respectively. The controller 190 controls the selected portions of the LED heater 150 (e.g., the first region and the second region) to heat the substrate 140 using a third illumination intensity and a fourth illumination intensity of the LEDs 200 in the first portion and the second portion, respectively.

[0144] At 430, the controller 190 deselects the first set of resistive heating elements of the resistive heater 151 and the first portion of the LED heater 150, and selects the third set of resistive heating elements of the resistive heater 151 and the third portion (e.g., the third region) of the LED heater 150 to heat the substrate 140. At 432, the controller 190 controls the selected resistive heating elements of the resistive heater 151 (e.g., the second and third resistive heating elements) to heat the substrate 140 by supplying a second current and a third current to the second and third sets of resistive heating elements, respectively. The controller 190 controls the selected portions of the LED heater 150 (e.g., the second and third regions) to heat the substrate 140 using the second and third illumination intensities of the LEDs 200 in the second and third portions, respectively. In step 432, the controller 190 may also change the current supplied to the second set of resistive heating elements and change the illumination intensity of the LEDs 200 in the second portion.

[0145] In this manner, the controller 190 can rotate the substrate 140 again, select and deselect different sets of resistive heating elements of the resistive heater 151, change the current supplied to the selected resistive heating elements of the resistive heater 151, select and deselect different portions of the LED heater 150, and change the illumination intensity of the selected portions of the LED heater 150 to heat the substrate 140. Selecting different sets of resistive heating elements of the resistive heater 151 at different times, supplying different currents to the different selected sets of resistive heating elements at different times, selecting different portions of the LED heater 150 at different times, and selecting different illumination intensities of the selected portions of the LED heater 150 to heat the substrate 140 while also periodically rotating the substrate 140 results in: minimizing cold spots in the substrate 140; increasing the temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the LED heater 150.

[0146] Figure 25Method 440 of resistively and radiatively heating substrate 140 in accordance with the present disclosure is shown. At 442, the substrate 140 is heated using resistive heating (also referred to as coarse heating) provided by a resistive heater 151 disposed in the base 132 of the susceptor 130. At 444, the substrate 140 is heated using radiative heating (also referred to as fine tuning heating) provided by an LED heater 150 disposed below the base 132 of the susceptor 130. The method of combining the coarse heating and fine tuning heating provided by the resistive heater 151 and the LED heater 150 as described in detail above is also applicable when the resistive heater 151 is disposed in the base 132 of the susceptor 130 and the LED heater 150 is disposed below the base 132 of the susceptor 130. In all of the above methods, although not shown, while controlling the resistive heater 151 and the LED heater 150, the controller 190 also controls the flow of coolant through the cooling channels 153, 159 to control the temperature of the substrate 140 and the LED heater 150.

[0147] Figure 26 Method 460 of resistively and radiatively heating substrate 140 including a rotating substrate in accordance with the present disclosure is shown. At 462, the substrate 140 is heated using resistive heating provided by a resistive heater 151 embedded in the susceptor 130 with an LED heater 150 disposed below the base 132 of the susceptor 130. At 464, the controller 190 actuates the shaft 250 and rotates the substrate 140. At 466, the controller 190 adjusts the current supplied to the resistive heating element of the resistive heater 151. Additionally, the controller 190 and / or the driver 206 adjusts the illumination intensity of different portions (such as the segments and / or regions described above) of the LED heater 150, as described in the above method. For example, the controller 190 controls different combinations of the resistive heating element of the resistive heater 151 and the segments and / or regions of the LED heater 150, as described in the above method. These different controls of the resistive heater 151 and the LED heater 150 result in: minimizing cold spots in the substrate 140; increasing temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the LED heater 150.

[0148] Figure 27Method 500 for resistively and radiatively heating substrate 140 in accordance with the present disclosure is shown. At 502, substrate 140 is heated using resistive heating (also referred to as coarse heating) provided by resistive heater 151 disposed in base 132 of susceptor 130. At 504, substrate 140 is heated using radiative heating (also referred to as fine tuning heating) provided by first LED heater 150-1 disposed in base 132 of susceptor 130 or below susceptor 130 and / or by second LED heater 150-2 disposed in showerhead 120. The combined method of controlling the coarse heating and fine tuning heating provided by resistive heater 151 and first LED heater 150-1 and second LED heater 150-2 is detailed below.

[0149] In all of the methods below, although not shown, while controlling resistive heater 151 and first and second LED heaters 150-1, 150-2, controller 190 also controls the flow of coolant through coolant channels 153, 159 to control the temperature of substrate 140, showerhead 120, and first and second LED heaters 150-1, 150-2. Additionally, in the methods below, the description of first LED heater 150-1 and second LED heater 150-2 may be interchanged (i.e., first LED heater 150-1 may be understood to replace second LED heater 150-2 and vice versa).

[0150] Figure 28 Method 510 for resistively and radiatively heating substrate 140 including a rotating substrate in accordance with the present disclosure is shown. At 512, substrate 140 is heated using resistive heating provided by resistive heater 151 disposed in base 132 of susceptor 130. At 514, controller 190 actuates shaft 250 and rotates substrate 140. At 516, controller 190 adjusts the current supplied to the resistive heating element of resistive heater 151. Additionally, controller 190 and / or driver 206 adjusts the illumination intensity of different portions (such as the segments and / or regions described above) of first and second LED heaters 150-1, 150-2. For example, controller 190 controls different combinations of the resistive heating element of resistive heater 151 and segments and / or regions of first and second LED heaters 150-1, 150-2. These different controls of resistive heater 151 and first and second LED heaters 150-1, 150-2 result in: minimizing cold spots in substrate 140; increasing temperature uniformity across substrate 140; and reducing overheating of LEDs 200 in first and second LED heaters 150-1, 150-2.

[0151] Figure 29Method 520 of displaying a resistive and radiative heating substrate 140 including a rotating substrate according to the present disclosure. At 522, a resistive heater 151 disposed in a base 132 of a susceptor 130 is used to heat the substrate 140. At 524, a controller 190 selects a first portion (e.g., a first region) of a first LED heater 150-1 to heat the substrate 140. At 526, the controller 190 actuates a shaft 250 and rotates the substrate 140. At 528, the controller 190 deselects the first portion of the first LED heater 150-1 and selects a second portion (e.g., a second region) of a second LED heater 150-2 to heat the substrate 140.

[0152] Although not shown, the controller 190 can also alternately activate and deactivate the first LED heater 150-1 and the second LED heater 150-2. Additionally, the controller 190 can vary the duration for which the first LED heater 150-1 and the second LED heater 150-2 are activated and deactivated. The controller 190 can control the first LED heater 150-1 and the second LED heater 150-2 in this manner while also controlling the resistive heater 151 and rotating the substrate 140 as described throughout the present disclosure.

[0153] In this manner, the controller 190 can rotate the substrate 140 again and select different portions of the first LED heater 150-1 and the second LED heater 150-2 to heat the substrate 140. Selecting different portions of the first LED heater 150-1 and the second LED heater 150-2 to heat the substrate 140 at different times and also periodically rotating the substrate 140 results in: minimizing cold spots in the substrate 140; increasing temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the first LED heater 150-1 and the second LED heater 150-2.

[0154] Figure 30A method 540 of displaying a resistive and radiative heating substrate 140 including a rotating substrate according to the present disclosure is shown. At 542, a controller 190 selects a first set of resistive heating elements of a resistive heater 151 disposed in a base 132 of a susceptor 130 to heat the substrate 140. At 544, the controller 190 selects a first portion (e.g., a first region) of a first LED heater 150-1 to heat the substrate 140. At 546, the controller 190 actuates a shaft 250 and rotates the substrate 140. At 548, the controller 190 deselects the first set of resistive heating elements of the resistive heater 151 and the first portion of the first LED heater 150-1 (or the second LED heater 150-2), and selects a second set of resistive heating elements of the resistive heater 151 and a second portion (e.g., a second region) of the second LED heater 150-2 to heat the substrate 140.

[0155] In this manner, the controller 190 can rotate the substrate 140 again, select and deselect different sets of resistive heating elements of the resistive heater 151, and different portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140. Selecting different sets of resistive heating elements of the resistive heater 151 and different portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 at different times, while also periodically rotating the substrate 140 results in: minimizing cold spots in the substrate 140; increasing temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the first and second LED heaters 150-1, 150-2.

[0156] Figure 31Method 560 of showing a resistive and radiative heating substrate 140 including a rotating substrate according to the present disclosure. At 562, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed in a base 132 of a pedestal 130. At 564, the controller 190 selects a first portion (e.g., a first region) of the first LED heater 150-1 and a second portion (e.g., a second region) of the second LED heater 150-2 to heat the substrate 140. The first portion (e.g., the first region) of the first LED heater 150-1 and the second portion (e.g., the second region) of the second LED heater 150-2 may or may not overlap. The controller 190 controls the selected portions (e.g., the first region of the first LED heater 150-1 and the second region of the second LED heater 150-2) to heat the substrate 140 using first and second illumination intensities of the LEDs 200 in the selected portions. At 566, the controller 190 actuates the shaft 250 and rotates the substrate 140. At 568, the controller 190 controls the selected portions (e.g., the first region of the first LED heater 150-1 and the second region of the second LED heater 150-2) to heat the substrate 140 using second and first illumination intensities of the LEDs 200 in the selected portions, respectively.

[0157] In this way, the controller 190 can rotate the substrate 140 again and can change the illumination intensities of the LEDs 200 in the selected portions of the first LED heater 150-1 and the second LED heater 150-2 to heat the substrate 140. Selecting different illumination intensities of the selected portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 at different times and also periodically rotating the substrate 140 results in: minimizing cold spots in the substrate 140; increasing temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the first and second LED heaters 150-1, 150-2.

[0158] Figure 32A method 580 of displaying a resistively and radiatively heated substrate 140 including a rotating substrate according to the present disclosure is shown. At 582, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed in a base 132 of a susceptor 130. At 584, the controller 190 selects a first portion and a second portion (e.g., a first region and a second region) of a first LED heater 150-1 and does not change the state of a second LED heater 150-2 (i.e., keeps the second LED heater 150-2 partially or fully on or off) to heat the substrate 140. The controller 190 controls the selected portions (e.g., the first region and the second region) of the first LED heater 150-1 to heat the substrate 140 using a first illumination intensity and a second illumination intensity of the LEDs 200 in the first portion and the second portion, respectively. At 586, the controller 190 actuates a shaft 250 and rotates the substrate 140. At 588, the controller 190 controls the selected portions (e.g., the first region and the second region) of the first LED heater 150-1 to heat the substrate 140 using a third illumination intensity and a fourth illumination intensity of the LEDs 200 in the selected portions and does not change the state of the second LED heater 150-2.

[0159] In this way, the controller 190 can rotate the substrate 140 again and can change the illumination intensity of the LEDs 200 in the selected portions of the first LED heater 150-1 to heat the substrate 140 without changing the state of the second LED heater 150-2. Selecting different illumination intensities of the selected portions of the first LED heater 150-1 to heat the substrate 140 at different times and also periodically rotating the substrate 140 while not changing the state of the second LED heater 150-2 results in: minimizing cold spots in the substrate 140; increasing temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the first LED heater 150-1.

[0160] Figure 33 A method 600 of displaying a resistively and radiatively heated substrate 140 including a rotating substrate according to the present disclosure is shown. At 602, the controller 190 selects a first set of resistive heating elements and a second set of resistive heating elements (e.g., a first resistive heating element and a second resistive heating element) of a resistive heater 151 disposed in a base 132 of a susceptor 130 to heat the substrate 140. The controller 190 controls the selected resistive heating elements (e.g., the first resistive heating element and the second resistive heating element) of the resistive heater 151 to heat the substrate 140 by supplying a first current and a second current to the first set of resistive heating elements and the second set of resistive heating elements, respectively.

[0161] At 604, the controller 190 selects first and second portions (e.g., first and second regions) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140, respectively. The controller 190 controls the selected portions (e.g., first and second regions) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 using a first illumination intensity and a second illumination intensity of the LEDs 200 in the first and second portions, respectively. At 606, the controller 190 actuates the shaft 250 and rotates the substrate 140.

[0162] At 608, the controller 190 controls selected resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying a third current and a fourth current to the first set and the second set of resistive heating elements, respectively. The controller 190 controls the selected portions (e.g., first and second regions) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 using a third illumination intensity and a fourth illumination intensity of the LEDs 200 in the first and second portions, respectively.

[0163] In this way, the controller 190 can rotate the substrate 140 again, change the current supplied to the selected resistive heating elements of the resistive heater 151, and change the illumination intensity of the selected portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140. Supplying different currents to the selected resistive heating elements of the resistive heater 151 at different times, selecting different illumination intensities of the selected portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 at different times, and also periodically rotating the substrate 140 simultaneously results in: minimizing cold spots in the substrate 140; increasing the temperature uniformity across the substrate 140; and reducing overheating of the LEDs 200 in the first and second LED heaters 150-1, 150-2.

[0164] Figure 34 A method 620 of resistively and radiatively heating a substrate 140 including a rotating substrate in accordance with the present disclosure is shown. At 622, the controller 190 selects first and second sets of resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 disposed in the base 132 of the pedestal 130 to heat the substrate 140. The controller 190 controls the selected resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying a first current and a second current to the first set and the second set of resistive heating elements, respectively.

[0165] At 624, the controller 190 selects first and second portions (e.g., a first region and a second region) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140. The controller 190 controls the selected portions (e.g., the first region and the second region) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 using a first illumination intensity and a second illumination intensity of the LEDs 200 in the first and second portions, respectively. At 626, the controller 190 actuates the shaft 250 and rotates the substrate 140.

[0166] At 628, the controller 190 controls selected resistive heating elements (e.g., a first resistive heating element and a second resistive heating element) of the resistive heater 151 to heat the substrate 140 by supplying a third current and a fourth current to the first set of resistive heating elements and the second set of resistive heating elements, respectively. The controller 190 controls the selected portions (e.g., the first region and the second region) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 using a third illumination intensity and a fourth illumination intensity of the LEDs 200 in the first and second portions, respectively.

[0167] At 630, the controller 190 deselects the first set of resistive heating elements of the resistive heater 151 and the first portion of the first LED heater 150-1 and selects a third set of resistive heating elements of the resistive heater 151 and a third portion (e.g., a third region) of the first LED heater 150-1 to heat the substrate 140. At 632, the controller 190 controls the selected resistive heating elements (e.g., the second resistive heating element and the third resistive heating element) of the resistive heater 151 to heat the substrate 140 by supplying a second current and a third current to the second set of resistive heating elements and the third set of resistive heating elements, respectively. The controller 190 controls the selected portions (e.g., the second region and the third region) of the second and first LED heaters 150-2, 150-1 to heat the substrate 140 using a second illumination intensity and a third illumination intensity of the LEDs 200 in the second and third portions, respectively. In step 632, the controller 190 may also change the current supplied to the second set of resistive heating elements of the resistive heater 151 and change the illumination intensity of the LEDs 200 in the second portion of the second LED heater 150-2.

[0168] In this way, the controller 190 can rotate the substrate 140 again, select and deselect different groups of resistive components of the resistive heater 151, change the current supplied to the selected resistive heating elements of the resistive heater 151, select and deselect different portions of the first and second LED heaters 150-1 and 150-2, and change the illumination intensity of the selected portions of the first and second LED heaters 150-1 and 150-2 to heat the substrate 140. Selecting different groups of resistive heating elements of the resistive heater 151 at different times, supplying different currents to the selected different groups of resistive heating elements of the resistive heater 151 at different times, selecting different portions of the first and second LED heaters 150-1 and 150-2 at different times, and selecting different illumination intensities of the selected portions of the first and second LED heaters 150-1 and 150-2 to heat the substrate 140 at different times, while also periodically rotating the substrate 140 results in: minimizing cold spots in the substrate 140; increasing the temperature uniformity on the substrate 140; and reducing the overheating of the LEDs 200 in the first and second LED heaters 150-1 and 150-2.

[0169] The method of combining the coarse heating and fine-tuning heating provided by controlling the resistive heater 151, the LED heater 150, the first and second LED heaters 150-1 and 150-2, and substrate rotation, as described in detail above, is also applicable when the resistive heater 151 is disposed in the base 132 of the base 130 and the LED heater 150 is disposed below the base 132 of the base 130, and when the resistive heater 151 and the first and second LED heaters 150-1 and 150-2 are arranged as shown and described above, as described in the above method. In addition, in all of the above methods, although not shown, while controlling the resistive heater 151, the LED heater 150, and the first and second LED heaters 150-1 and 150-2, the controller 190 also controls the flow of coolant through the cooling channels 153 and 159 to control the temperatures of the substrate 140, the nozzle 120, and the LED heater 150. Figure 12 and 13 shown and as described above. Further, in all of the above methods, although not shown, while controlling the resistive heater 151, the LED heater 150, and the first and second LED heaters 150-1 and 150-2, the controller 190 also controls the flow of coolant through the cooling channels 153 and 159 to control the temperatures of the substrate 140, the nozzle 120, and the LED heater 150.

[0170] Accordingly, the systems and methods of the present disclosure provide various ways of combining resistive and radiative (LED) heating to minimize or eliminate cold spots on the substrate 140 and increase the temperature uniformity across the substrate 140. The resistive heater 151 provides coarse heating, while the LED heaters 150, and the first LED heater 150-1 and the second LED heater 150-2 supplement the resistive heater 151 by providing the fine-tuning heating as described above. When the resistive and LED heaters 151, 150, 150-1 are juxtaposed in the base 130 as in the first and fourth examples, controlling (turning on and off and regulating the supplied power) different portions of the resistive and LED heaters 151, 150, 150-1 at different times (i.e., in a time-staggered manner) in combination with substrate rotation can prevent overheating of the radiative heaters 151, 150, 150-1. Separating the LED heater 150 from the resistive heater 151 and positioning the LED heaters 150, 150-1 below the base 130 as in the second and fifth examples, or separating the LED heater 150 from the resistive heater 151 and positioning the LED heaters 150, 150-2 in the printhead 120 as in the third and fourth examples can further reduce overheating of the LED heaters 150, 150-1. Additionally, overheating of the LED heaters 150, 150-1 in the second and fourth examples can be prevented by controlling different portions of the resistive and LED heaters 151, 150, 150-1 in a time-staggered manner in combination with substrate rotation as in the first example. Overheating of the LED heater 150-1 in the fourth and fifth examples can be prevented by controlling different portions of the resistive and LED heaters 151, 150-1, 150-2 in a time-staggered manner in combination with substrate rotation similar to that in the first example.

[0171] In addition to preventing overheating of the LED heaters 150, 150-1, 150-2 in the first to fifth examples, controlling different portions of the resistive and LED heaters 151, 150, 150-1, 150-2 in a time-staggered manner in combination with substrate rotation further results in: minimizing or eliminating cold spots on the substrate 140 and increasing the temperature uniformity across the entire substrate 140. Cooling channels 153, 159 are also provided in the base 130 and the printhead 120 to further control the temperature of the base 130 and the printhead 120, to further prevent overheating of the LED heater 150, and to further improve the temperature uniformity of the substrate 140.

[0172] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Thus, while the disclosure includes specific examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon study of the drawings, the specification, and the appended claims.

[0173] It should be understood that, without changing the principles of the disclosure, one or more steps in a method can be performed in a different order (or simultaneously). Additionally, while each implementation is described above as having certain features, any one or more of those features described with respect to any implementation of the disclosure can be implemented in and / or combined with the features of any other implementation, even if the combination is not explicitly described. In other words, the described implementations are not mutually exclusive, and permutations of one or more implementations with each other remain within the scope of the disclosure.

[0174] Various terms are used to describe spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.), and the various terms include "connected", "joined", "coupled", "adjacent", "next to", "on top of", "above", "below", and "disposed". Unless the relationship between a first and a second element is explicitly described as "direct", when describing such a relationship in the foregoing disclosure, the relationship can be a direct relationship in which no other intervening elements exist between the first and second elements, but can also be an indirect relationship in which one or more intervening elements exist (spatially or functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be construed to mean a logical (A or B or C) using a non-exclusive logical OR, and should not be construed to mean "at least one of A, at least one of B, and at least one of C".

[0175] In some implementations, the controller is part of a system, and such a system can be part of the foregoing examples. Such systems can include semiconductor processing equipment, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or particular processing components (wafer pedestals, gas flow systems, etc.). These systems can be integrated with electronics for controlling their operation before, during, and after the processing of semiconductor wafers or substrates. The electronics can be referred to as a "controller", which can control various components or sub-components of one or more systems.

[0176] Depending on the processing requirements and / or system type, the controller can be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer in and out of tools connected or docked to a particular system and other transfer tools and / or load locks.

[0177] Broadly speaking, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software for receiving instructions, issuing instructions, controlling operations, enabling cleaning operations, enabling endpoint measurements, etc. The integrated circuits can include chips in the form of firmware storing program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software).

[0178] The program instructions can be instructions sent to the controller in the form of various individual settings (or program files) that define the operating parameters for performing a specific process on or for a semiconductor wafer or system. In some embodiments, the operating parameters can be part of a recipe defined by a process engineer to complete one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or die of a wafer.

[0179] In some implementations, the controller can be part of or coupled to a computer that is integrated with, coupled to, otherwise networked to the system, or a combination thereof. For example, the controller can be in the "cloud" or be all or part of a fab host system, which can allow remote access to wafer processing. The computer can enable remote access to the system to monitor the current progress of manufacturing operations, examine the history of past manufacturing operations, examine trends or performance criteria for multiple manufacturing operations, to change the parameters of the current process, set processing steps to follow the current process, or initiate a new process.

[0180] In some examples, a remote computer (e.g., a server) can provide a processing recipe to the system via a network, which can include a local network or the Internet. The remote computer can include a user interface that enables the input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify the parameters for each processing step to be performed during one or more operations. It should be understood that the parameters can be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control.

[0181] Thus, as described above, the controller can be distributed, for example, by including one or more discrete controllers networked together and working towards a common purpose, such as the processing and control described herein. An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber communicating with one or more integrated circuits remote (e.g., at the platform level or as part of a remote computer), which combine to control processing on the chamber.

[0182] Exemplary systems can include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, metal plating chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that can be associated with and / or used in the manufacture and / or preparation of semiconductor wafers.

[0183] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in the material transport that shuttles the wafer container to and from the tool locations and / or load ports in a semiconductor manufacturing factory.

Claims

1. A substrate processing system, comprising: a susceptor configured to support a substrate; a resistive heater disposed in the susceptor, wherein the resistive heater is configured to heat the substrate; and a radiative heater disposed in the susceptor, wherein the radiative heater is configured to heat the substrate.

2. The substrate processing system according to claim 1, wherein: the resistive heater includes one or more resistive heating elements; and the radiative heater includes a plurality of optical elements.

3. The substrate processing system according to claim 2, wherein the optical elements include light emitting diodes.

4. The substrate processing system according to claim 1, wherein: the susceptor includes a base portion and a stem portion; and the resistive heater and the radiative heater are disposed in the base portion of the susceptor.

5. The substrate processing system according to claim 4, wherein the base portion is cylindrical, and wherein the resistive heater and the radiative heater extend from a central region of the base portion toward an outer diameter of the base portion.

6. The substrate processing system according to claim 4, wherein: the radiative heater is disposed near a surface of the base portion on which the substrate is placed; and the resistive heater is disposed below the radiative heater in the base portion.

7. The substrate processing system according to claim 4, wherein the resistive heater and the radiative heater are coplanar.

8. The substrate processing system according to claim 4, wherein: the base portion of the susceptor is cylindrical; the resistive heater includes a plurality of resistive heating elements disposed in a first concentric circle in the base portion; the radiative heater includes a plurality of optical elements disposed in a second concentric circle in the base portion; and the first concentric circle and the second concentric circle are staggered with each other and extend from a central region of the base portion toward an outer diameter of the base portion.

9. The substrate processing system according to claim 8, wherein: the radiative heater is disposed near a surface of the base portion on which the substrate is placed; and the resistive heater is disposed below the radiative heater in the base portion.

10. The substrate processing system according to claim 8, wherein the resistive heater and the radiative heater are coplanar.

11. The substrate processing system according to claim 4, wherein: the base portion of the susceptor is cylindrical; the resistive heater includes a plurality of resistive heating elements disposed in concentric circles in the base portion; the radiative heater includes a plurality of optical elements disposed in radially extending spokes in the base portion; and the concentric circles and the radially extending spokes extend from a central region of the base portion toward an outer diameter of the base portion.

12. The substrate processing system according to claim 11, wherein: the radiative heater is disposed near a surface of the base portion on which the substrate is placed; and the resistive heater is disposed below the radiative heater in the base portion.

13. The substrate processing system according to claim 4, wherein: the base of the susceptor is cylindrical; the resistive heater includes a plurality of resistive heating elements disposed in a first radially extending spoke in the base; the radiant heater includes a plurality of optical elements disposed in a second radially extending spoke in the base; and the first radially extending spoke and the second radially extending spoke are staggered with each other and extend from a central region of the base toward an outer diameter of the base.

14. The substrate processing system according to claim 13, wherein: the radiant heater is disposed near a surface of the base on which the substrate is placed; and the resistive heater is disposed below the radiant heater in the base.

15. The substrate processing system according to claim 14, wherein the resistive heater and the radiant heater are coplanar.

16. The substrate processing system according to claim 4, further comprising: a cooling channel disposed in the base and below the resistive heater and the radiant heater.

17. The substrate processing system according to claim 4, wherein the resistive heater includes a plurality of resistive heating elements and the radiant heater includes a plurality of optical elements, and the substrate processing system further includes a controller configured to control different ones of the resistive heating elements in the resistive heater and different ones of the optical elements in the optical elements in a time-interleaved manner.

18. The substrate processing system according to claim 17, further comprising: a shaft disposed to pass through the stem portion and the base; and an actuator coupled to the shaft, wherein the controller is configured to move the substrate relative to the susceptor.

19. The substrate processing system according to claim 4, wherein the radiant heater includes: a plurality of optical elements disposed on a printed circuit board (PCB); one or more drivers disposed on the PCB, wherein the one or more drivers are configured to control the optical elements; and a window covering the optical elements, the window being optically transparent and sealingly attached to the PCB.

20. The substrate processing system according to claim 19, wherein the susceptor further includes: a shaft disposed to pass through the center of the stem portion, the base, and the PCB, wherein the shaft includes a conduit and a plurality of holes, the conduit being configured to receive a gas, and the plurality of holes being in fluid communication with the conduit near a first end of the shaft and adjacent to the radiant heater; and an actuator coupled to a second end of the shaft, wherein the actuator is configured to move the substrate vertically relative to a plane in which the base is located, wherein when the shaft is raised above the window, the plurality of holes radially supply the gas above the window.

21. The substrate processing system according to claim 1, wherein: the susceptor includes a base and a stem portion; the resistive heater is disposed in the base of the susceptor; and The radiant heater is disposed below the base and surrounds the stem adjacent to the base.

22. The substrate processing system according to claim 21, wherein the base is cylindrical; and wherein the resistive heater and the radiant heater extend from a central region of the base toward an outer diameter of the base.

23. The substrate processing system according to claim 21, wherein the radiant heater comprises: a plurality of optical elements disposed on a printed circuit board (PCB); one or more drivers disposed on the PCB, wherein the one or more drivers are configured to control the optical elements; a plurality of lenses disposed on the optical elements; and a window covering the optical elements and the lenses, the window being optically transparent and sealingly attached to the PCB.

24. The substrate processing system according to claim 21, wherein: the base of the pedestal is cylindrical; the resistive heater comprises a plurality of resistive heating elements disposed in a first concentric circle in the base; the radiant heater comprises a plurality of optical elements disposed in a second concentric circle in the base; and the first concentric circle and the second concentric circle are interleaved with each other and extend from a central region of the base toward an outer diameter of the base.

25. The substrate processing system according to claim 21, wherein: the base of the pedestal is cylindrical; the resistive heater comprises a plurality of resistive heating elements disposed in concentric circles in the base; the radiant heater comprises a plurality of optical elements disposed in radially extending spokes in the base; and the concentric circles and the radially extending spokes extend from a central region of the base toward an outer diameter of the base.

26. The substrate processing system according to claim 21, wherein: the base of the pedestal is cylindrical; the resistive heater comprises a plurality of resistive heating elements disposed in a first radially extending spoke in the base; the radiant heater comprises a plurality of optical elements disposed in a second radially extending spoke in the base; and the first radially extending spoke and the second radially extending spoke are interleaved with each other and extend from a central region of the base toward an outer diameter of the base.

27. The substrate processing system according to claim 21, further comprising: a cooling channel disposed in the base and below the resistive heater.

28. The substrate processing system according to claim 21, wherein the resistive heater comprises a plurality of resistive heating elements and the radiant heater comprises a plurality of optical elements, and the substrate processing system further comprises a controller configured to control different ones of the resistive heating elements and different ones of the optical elements in a time-interleaved manner.

29. The substrate processing system according to claim 28, further comprising: a shaft disposed to pass through the stem and the base; and an actuator coupled to the shaft, wherein the controller is configured to move the substrate relative to the susceptor.

30. A substrate processing system, comprising: a showerhead including a panel, the panel including a plurality of through-holes; and a radiant heater disposed in the showerhead, the radiant heater including a plurality of optical elements disposed with a gap from the plurality of through-holes of the panel.

31. The substrate processing system according to claim 30, wherein the optical element includes a light-emitting diode.

32. The substrate processing system according to claim 30, wherein the showerhead is cylindrical and wherein the radiant heater extends from the center of the showerhead toward the outer diameter of the showerhead.

33. The substrate processing system according to claim 30, wherein the radiant heater includes: a printed circuit board (PCB) on which the optical elements are disposed; one or more drivers disposed on the PCB, wherein the one or more drivers are configured to control the optical elements; and a window covering the optical elements, the window being optically transparent and sealingly attached to the PCB and coplanar with the panel.

34. The substrate processing system according to claim 33, wherein: the showerhead includes an inflation portion defined by a sidewall and an upper surface of the showerhead and a surface of the radiant heater opposite the window; and the through-holes pass through the radiant heater and are in fluid communication with the inflation portion.

35. The substrate processing system according to claim 30, wherein the showerhead is cylindrical and wherein the optical elements are disposed in concentric circles in the radiant heater.

36. The substrate processing system according to claim 30, wherein the showerhead is cylindrical and wherein the optical elements are disposed in radially extending spokes in the radiant heater.

37. The substrate processing system according to claim 30, further comprising a susceptor configured to support a substrate, wherein the susceptor includes a resistive heater configured to heat the substrate.

38. The substrate processing system according to claim 37, wherein the susceptor is cylindrical and wherein the resistive heater extends from a central region of the susceptor toward the outer diameter of the susceptor.

39. The substrate processing system according to claim 37, wherein the susceptor is cylindrical and wherein the resistive heater includes resistive heating elements disposed in concentric circles in the susceptor.

40. The substrate processing system according to claim 37, wherein the susceptor is cylindrical and wherein the resistive heater includes resistive heating elements disposed in radially extending spokes in the susceptor.

41. The substrate processing system according to claim 37, wherein: the susceptor and the showerhead are cylindrical; the resistive heater includes a plurality of resistive heating elements disposed in a first concentric circle in the susceptor, the first concentric circle extending from a central region of the susceptor toward the outer diameter of the susceptor; and The optical element is arranged in a second concentric circle in the radiant heater, and the second concentric circle extends from the center of the showerhead towards the outer diameter of the showerhead.

42. The substrate processing system according to claim 41, wherein the first concentric circle and the second concentric circle are staggered with each other.

43. The substrate processing system according to claim 37, wherein: The base and the showerhead are cylindrical; The resistive heater includes a plurality of resistive heating elements arranged in concentric circles in the base, and the concentric circles extend from the central region of the base towards the outer diameter of the base; And The optical element is arranged in radially extending spokes in the radiant heater, and the radially extending spokes extend from the center of the showerhead towards the outer diameter of the showerhead.

44. The substrate processing system according to claim 37, wherein: The base and the showerhead are cylindrical; The resistive heater includes a plurality of resistive heating elements arranged in a first radially extending spoke in the base, and the first radially extending spoke extends from the central region of the base towards the outer diameter of the base; And The optical element is arranged in a second radially extending spoke in the radiant heater, and the second radially extending spoke extends from the center of the showerhead towards the outer diameter of the showerhead.

45. The substrate processing system according to claim 44, wherein the radially extending spoke and the second radially extending spoke are staggered with each other.

46. The substrate processing system according to claim 37, wherein: The showerhead includes a first cooling channel arranged on the upper surface of the showerhead; and The base includes a second cooling channel arranged below the resistive heater.

47. The substrate processing system according to claim 37, wherein the resistive heater includes a plurality of resistive heating elements, and the substrate processing system further includes a controller configured to control different resistive heating elements in the resistive heater and different optical elements in the optical element in a time-interleaved manner.

48. The substrate processing system according to claim 47, which further includes: A shaft arranged to pass through the center of the base; and An actuator coupled to the shaft, wherein the controller is configured to move the substrate relative to the base.

49. A substrate processing system, which includes: A base configured to support a substrate; A resistive heater arranged in the base, wherein the resistive heater is configured to heat the substrate; A first radiant heater arranged in the base, wherein the radiant heater is configured to heat the substrate; A showerhead separated from the base; And A second radiant heater arranged in the showerhead, wherein the second radiant heater is configured to heat the substrate.

50. The substrate processing system according to claim 49, wherein: The resistive heater includes one or more resistive heating elements; and The first radiant heater and the second radiant heater include a plurality of optical elements.

51. The substrate processing system according to claim 50, wherein the optical element includes a light-emitting diode.

52. The substrate processing system according to claim 49, wherein: the susceptor includes a base portion and a rod portion; and the resistive heater and the first radiant heater are disposed in the base portion of the susceptor.

53. The substrate processing system according to claim 52, wherein the base portion is cylindrical, and wherein the resistive heater and the first radiant heater extend from a central region of the base portion toward an outer diameter of the base portion.

54. The substrate processing system according to claim 52, wherein: the first radiant heater is disposed near a surface of the base portion on which the substrate is placed; and the resistive heater is disposed below the first radiant heater in the base portion.

55. The substrate processing system according to claim 52, wherein the resistive heater and the first radiant heater are coplanar.

56. The substrate processing system according to claim 52, wherein: the base portion of the susceptor is cylindrical; the resistive heater includes a plurality of resistive heating elements disposed in a first concentric circle in the base portion; the first radiant heater includes a plurality of optical elements disposed in a second concentric circle in the base portion; and the first concentric circle and the second concentric circle are staggered with each other and extend from a central region of the base portion toward an outer diameter of the base portion.

57. The substrate processing system according to claim 56, wherein: the first radiant heater is disposed near a surface of the base portion on which the substrate is placed; and the resistive heater is disposed below the first radiant heater in the base portion.

58. The substrate processing system according to claim 56, wherein the resistive heater and the first radiant heater are coplanar.

59. The substrate processing system according to claim 52, wherein: the base portion of the susceptor is cylindrical; the resistive heater includes a plurality of resistive heating elements disposed in concentric circles in the base portion; the first radiant heater includes a plurality of optical elements disposed in radially extending spokes in the base portion; and the concentric circles and the radially extending spokes extend from a central region of the base portion toward an outer diameter of the base portion.

60. The substrate processing system according to claim 59, wherein: the first radiant heater is disposed near a surface of the base portion on which the substrate is placed; and the resistive heater is disposed below the first radiant heater in the base portion.

61. The substrate processing system according to claim 52, wherein: the base portion of the susceptor is cylindrical; the resistive heater includes a plurality of resistive heating elements disposed in a first radially extending spoke in the base portion; the first radiant heater includes a plurality of optical elements disposed in a second radially extending spoke in the base portion; and The first radially extending spoke and the second radially extending spoke are interleaved with each other and extend from a central region of the base toward an outer diameter of the base.

62. The substrate processing system according to claim 61, wherein: The first radiant heater is disposed near a surface of the base on which the substrate is placed; and The resistive heater is disposed below the first radiant heater in the base.

63. The substrate processing system according to claim 62, wherein the resistive heater and the first radiant heater are coplanar.

64. The substrate processing system according to claim 52, further comprising: a cooling channel disposed in the base and below the resistive heater and the first radiant heater.

65. The substrate processing system according to claim 52, wherein the resistive heater includes a plurality of resistive heating elements and the first radiant heater includes a plurality of optical elements, and the substrate processing system further includes a controller configured to control different ones of the resistive heating elements and different ones of the optical elements in a time-interleaved manner.

66. The substrate processing system according to claim 65, further comprising: A shaft disposed to pass through the stem portion and the base; and An actuator coupled to the shaft, Wherein the controller is configured to move the substrate relative to the base.

67. The substrate processing system according to claim 52, wherein the first radiant heater includes: A plurality of optical elements disposed on a printed circuit board (PCB); One or more drivers disposed on the PCB, wherein the one or more drivers are configured to control the optical elements; And A window covering the optical elements, the window being optically transparent and sealingly attached to the PCB.

68. The substrate processing system according to claim 67, wherein the base further includes: A shaft disposed to pass through the center of the stem portion, the base, and the PCB, wherein the shaft includes a conduit and a plurality of holes, the conduit being configured to receive gas, and the plurality of holes being in fluid communication with the conduit near a first end of the shaft and adjacent to the first radiant heater; and An actuator coupled to a second end of the shaft, wherein the actuator is configured to vertically move the substrate relative to a plane in which the base is located, Wherein when the shaft is raised above the window, the plurality of holes radially supply the gas above the window.

69. The substrate processing system according to claim 49, wherein: The base includes a base portion and a stem portion; The resistive heater is disposed in the base portion of the base; And The first radiant heater is disposed below the base and around the stem portion adjacent to the base.

70. The substrate processing system according to claim 69, wherein the base is cylindrical; and wherein the resistive heater and the first radiant heater extend from a central region of the base toward an outer diameter of the base.

71. The substrate processing system according to claim 69, wherein the first radiant heater comprises: A plurality of optical elements disposed on a printed circuit board (PCB); One or more drivers disposed on the PCB, wherein the one or more drivers are configured to control the optical elements; A plurality of lenses disposed on the optical elements; And A window covering the optical elements and the lenses, the window being optically transparent and sealingly attached to the PCB.

72. The substrate processing system according to claim 69, wherein: The base of the pedestal is cylindrical; The resistive heater comprises a plurality of resistive heating elements disposed in a first concentric circle in the base; The first radiant heater comprises a plurality of optical elements disposed in a second concentric circle in the base; And The first concentric circle and the second concentric circle are interleaved with each other and extend from a central region of the base toward an outer diameter of the base.

73. The substrate processing system according to claim 69, wherein: The base of the pedestal is cylindrical; The resistive heater comprises a plurality of resistive heating elements disposed in concentric circles in the base; The first radiant heater comprises a plurality of optical elements disposed in radially extending spokes in the base; And The concentric circles and the radially extending spokes extend from a central region of the base toward an outer diameter of the base.

74. The substrate processing system according to claim 69, wherein: The base of the pedestal is cylindrical; The resistive heater comprises a plurality of resistive heating elements disposed in a first radially extending spoke in the base; The first radiant heater comprises a plurality of optical elements disposed in a second radially extending spoke in the base; And The first radially extending spoke and the second radially extending spoke are interleaved with each other and extend from a central region of the base toward an outer diameter of the base.

75. The substrate processing system according to claim 69, further comprising: a cooling channel disposed in the base and located below the resistive heater.

76. The substrate processing system according to claim 69, wherein the resistive heater comprises a plurality of resistive heating elements and the first radiant heater comprises a plurality of optical elements, and the substrate processing system further comprises a controller configured to control different resistive heating elements among the resistive heating elements and different optical elements among the optical elements in a time-interleaved manner.

77. The substrate processing system according to claim 76, further comprising: A shaft disposed to pass through the stem portion and the base; and An actuator coupled to the shaft, Wherein the controller is configured to move the substrate relative to the pedestal.

78. The substrate processing system according to claim 76, wherein: The showerhead comprises a panel, the panel comprising a plurality of through holes; and The second radiant heater comprises a plurality of optical elements disposed with a gap from the plurality of through holes of the panel.

79. The substrate processing system according to claim 78, wherein the optical element comprises a light emitting diode.

80. The substrate processing system according to claim 78, wherein the showerhead is cylindrical and wherein the second radiant heater extends from the center of the showerhead towards the outer diameter of the showerhead.

81. The substrate processing system according to claim 78, wherein the second radiant heater comprises: a printed circuit board (PCB) on which the optical element is disposed; one or more drivers disposed on the PCB, wherein the one or more drivers are configured to control the optical element; and a window covering the optical element, the window being optically transparent and sealingly attached to the PCB and coplanar with the panel.

82. The substrate processing system according to claim 81, wherein: the showerhead comprises an inflation portion defined by a sidewall and an upper surface of the showerhead and a surface of the second radiant heater opposite the window; and the through hole passes through the second radiant heater and is in fluid communication with the inflation portion.

83. The substrate processing system according to claim 78, wherein the showerhead is cylindrical and wherein the optical elements are arranged in concentric circles in the second radiant heater.

84. The substrate processing system according to claim 78, wherein the showerhead is cylindrical and wherein the optical elements are arranged in radially extending spokes in the second radiant heater.

85. The substrate processing system according to claim 78, wherein the susceptor is cylindrical and wherein the resistive heater extends from a central region of the susceptor towards the outer diameter of the susceptor.

86. The substrate processing system according to claim 78, wherein the susceptor is cylindrical and wherein the resistive heater comprises resistive heating elements arranged in concentric circles in the susceptor.

87. The substrate processing system according to claim 78, wherein the susceptor is cylindrical and wherein the resistive heater comprises resistive heating elements arranged in radially extending spokes in the susceptor.

88. The substrate processing system according to claim 78, wherein: the susceptor and the showerhead are cylindrical; the resistive heater comprises a plurality of resistive heating elements disposed in a first concentric circle in the susceptor, the first concentric circle extending from a central region of the susceptor towards the outer diameter of the susceptor; and the optical elements are arranged in a second concentric circle in the second radiant heater, the second concentric circle extending from the center of the showerhead towards the outer diameter of the showerhead.

89. The substrate processing system according to claim 88, wherein the first concentric circle and the second concentric circle are staggered with each other.

90. The substrate processing system according to claim 78, wherein: the susceptor and the showerhead are cylindrical; the resistive heater comprises a plurality of resistive heating elements disposed in concentric circles in the susceptor, the concentric circles extending from a central region of the susceptor towards the outer diameter of the susceptor; and The optical element is disposed in a radially extending spoke of the second radiant heater, the radially extending spoke extending from the center of the showerhead towards the outer diameter of the showerhead.

91. The substrate processing system according to claim 78, wherein: The susceptor and the showerhead are cylindrical; The resistive heater includes a plurality of resistive heating elements disposed in a first radially extending spoke in the susceptor, the first radially extending spoke extending from a central region of the susceptor towards the outer diameter of the susceptor; And The optical element is disposed in a second radially extending spoke of the second radiant heater, the second radially extending spoke extending from the center of the showerhead towards the outer diameter of the showerhead.

92. The substrate processing system according to claim 91, wherein the radially extending spoke and the second radially extending spoke are staggered with each other.

93. The substrate processing system according to claim 78, wherein: The showerhead includes a first cooling channel disposed on an upper surface of the showerhead; and The susceptor includes a second cooling channel disposed below the resistive heater.

94. The substrate processing system according to claim 78, wherein the resistive heater includes a plurality of resistive heating elements, and the substrate processing system further includes a controller configured to control different ones of the resistive heating elements in the resistive heater and different ones of the optical elements in the optical element in a time-interleaved manner.

95. The substrate processing system according to claim 49, wherein the susceptor and the showerhead are cylindrical and the first radiant heater and the second radiant heater have a diameter smaller than the outer diameter of the susceptor and the showerhead.

96. The substrate processing system according to claim 78, wherein the resistive heater includes a plurality of resistive heating elements, wherein the first radiant heater includes additional optical elements, and the substrate processing system further includes a controller configured to control different ones of the resistive heating elements in the resistive heater, different ones of the optical elements in the second radiant heater, and different ones of the additional optical elements in the first radiant heater in a time-interleaved manner.

97. The substrate processing system according to claim 94, further comprising: A shaft disposed to pass through the center of the susceptor; and An actuator coupled to the shaft, Wherein the controller is configured to move the substrate relative to the susceptor.

Images