Chromatographic degassing assembly packaging equipment and process thereof

Abstract

The invention relates to the technical field of packaging equipment, and discloses chromatographic degassing assembly packaging equipment and a technology thereof.The chromatographic degassing assembly packaging equipment comprises a carrying rod, a packaging mechanism is arranged on the surface of the carrying rod, the packaging mechanism comprises a first mounting block, a placement barrel, an upper telescopic cylinder and a lower telescopic cylinder, and the first mounting block is fixedly connected with the surface of the carrying rod; a first carrying frame is fixedly connected to the end, away from the carrying rod, of the first mounting block, a first clamping block is placed on one side of the first carrying frame, a heating coil is fixedly connected to the surface of the containing barrel, and the containing barrel is located between the first carrying frame and the first clamping block. According to the invention, the heating coil is accurately controlled to stabilize the temperature at 300-360 DEG C, and the upper and lower telescopic cylinders are matched to carry out 3-5 times of dynamic compression cycles and 150Hz high-frequency vibration defoaming, so that the problems of non-uniform melting of fluororesin, residual internal bubbles and the like are effectively solved, the packaging yield is greatly improved, and the rejection rate and the production cost are remarkably reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of encapsulation equipment, and particularly to a chromatographic degassing component encapsulation equipment and its process. Background Technique

[0002] The chromatographic degassing component is a key component in the chromatographic analysis system, mainly used to remove dissolved gases in the mobile phase (such as the solvent in liquid chromatography). Its working principle usually uses technologies such as vacuum, purging, or membrane separation to precipitate and discharge the gases (such as oxygen, nitrogen) in the mobile phase, avoiding the formation of bubbles in the chromatographic column or detector, which affects the accuracy and repeatability of the analysis results; fluororesins, especially materials such as polytetrafluoroethylene (PTFE), have significant advantages in the application of chromatographic degassing components due to their unique physical and chemical properties. First of all, fluororesins have excellent chemical corrosion resistance and can resist the erosion of most chemical substances, which makes the encapsulated chromatographic degassing components perform well when dealing with various solvents and chemical substances.

[0003] In the existing process, due to the narrow processing temperature window and easy deformation of fluororesins, the encapsulation yield is low. Moreover, when traditional equipment is used for encapsulating degassing components, vacuum equipment is often used, which further increases the production difficulty and leads to increased costs. Therefore, we propose a chromatographic degassing component encapsulation equipment and its process. Summary of the Invention

[0004] (I) Technical Problems to be Solved Aiming at the deficiencies of the existing technology, the present invention provides a chromatographic degassing component encapsulation equipment and its process, which solve the problems that the existing fluororesins have a narrow processing temperature window and are easy to deform, resulting in a low encapsulation yield, and when traditional equipment is used for encapsulating degassing components, vacuum equipment is often used, which further increases the production difficulty and leads to increased costs.

[0005] (II) Technical Solutions To achieve the above objectives, the present invention is implemented through the following technical solutions: A chromatographic degassing component encapsulation device includes a carrier rod, on the surface of which an encapsulation mechanism is provided. The encapsulation mechanism includes a first mounting block, a placement cylinder, an upper telescopic cylinder, and a lower telescopic cylinder. The first mounting block is fixedly connected to the surface of the carrier rod. One end of the first mounting block away from the carrier rod is fixedly connected to a first carrier frame. A first clamping block is placed on one side of the first carrier frame. A heating coil is fixedly connected to the surface of the placement cylinder. The placement cylinder is located between the first carrier frame and the first clamping block. On one side of the carrier rod close to the first mounting block, two symmetrically arranged second mounting blocks are fixedly connected. One end of the second mounting block is fixedly connected to a second carrier frame. A second mounting block is placed on one side of the second carrier frame. The upper telescopic cylinder and the lower telescopic cylinder are respectively placed between the two second carrier frames and the second clamping blocks. The driving end of the upper telescopic cylinder is fixedly connected to an upper pressing block. The driving end of the lower telescopic cylinder is fixedly connected to a lower pressing block. Both the upper pressing block and the lower pressing block are adapted to the inside of the placement cylinder. By precisely controlling the heating coil to keep the temperature stable at 300 - 360 °C, and cooperating with the upper and lower telescopic cylinders to perform 3 - 5 dynamic compression cycles and 150 Hz high-frequency vibration defoaming, the problems of uneven melting of fluororesin and residual internal bubbles are effectively solved, the encapsulation yield is greatly improved, and the scrap rate and production cost are significantly reduced.

[0006] Preferably, a controller is placed on one side of the carrier rod. A knob is installed on the upper surface of the controller. An operation panel is fixedly connected to the upper surface of the controller. A first wire is installed at the output end of the controller. The end of the first wire away from the controller is electrically connected to the heating coil. A second wire is installed at the output end of the controller. The end of the second wire away from the controller is electrically connected to the lower telescopic cylinder. A third wire is installed at the output end of the controller. The end of the third wire away from the controller is electrically connected to the upper telescopic cylinder. A power supply interface is provided on the side of the controller away from the carrier rod. The modular encapsulation design reduces material waste and optimizes the processing flow. On the other hand, the yield is improved and the component life is extended through process improvement, effectively reducing the production cost and enhancing the market competitiveness of the product, laying a foundation for large-scale production.

[0007] Preferably, a cross bar is fixedly connected to the lower end of the carrier rod. A vibration motor is fixedly connected to the upper surface of the cross bar. A fourth wire is installed at the output end of the controller. The end of the fourth wire away from the controller is electrically connected to the vibration motor. By the vibration motor, mechanical vibration is applied at a frequency of 150 Hz, and the surface tension of the internal bubbles of the material is broken by the force field generated by the vibration to achieve the defoaming operation and ensure the density of the formed material.

[0008] Preferably, a first bolt passes through between the first carrier frame and the first clamping block, and a first nut is threadedly connected to the first bolt, which is convenient for subsequent maintenance of the placement cylinder.

[0009] Preferably, a second bolt passes through the second carrier and the second clamping block, and a second nut is threadedly connected to the second bolt. The surface of the second carrier is fixedly connected to a limit frame, and the two limit frames are respectively buckled on the upper telescopic cylinder and the lower telescopic cylinder. The upper telescopic cylinder and the lower telescopic cylinder are clamped by the limit frames, which effectively prevents them from shifting during frequent telescopic and extension processes, thereby ensuring the accuracy of the compression molding process.

[0010] Preferably, a support mechanism is provided on the surface of the cross bar, and the support mechanism includes a stabilizing bar and a base plate. The stabilizing bar is fixedly connected to the surface of the cross bar, and the base plate is located below the cross bar and the stabilizing bar. Both ends of the cross bar are fixedly connected with positioning plates, and a through hole is provided on the surface of the positioning plate, and a threaded groove is provided on the upper surface of the base plate. A fastening bolt is inserted into the through hole, and one end of the fastening bolt is threadedly inserted into the threaded groove.

[0011] Preferably, a clamping sleeve is fixedly connected to the upper surface of the base plate, and one end of the stabilizing rod is inserted into the clamping sleeve, which limits the displacement of the stabilizing rod and plays a role in stably supporting and restraining the carrier rod.

[0012] Preferably, the lower surface of the base plate is fixedly connected with an anti-slip strip, and the lower surface of the base plate is fixedly connected with a support washer. The stabilizing rod cooperates with the ferrule, the base plate, and the fastening bolts. The anti-slip strip and the support washer are combined to structurally enhance the stability of the equipment, avoid packaging errors caused by shaking during operation, and provide reliable guarantees for the precise implementation of the process.

[0013] Preferably, there are multiple anti-slip strips, which are arranged at equal intervals, and the edges of the support washer are rounded.

[0014] Preferably, the method comprises the following steps: S1: A porous plug is used as a packaging matrix. A single hollow fiber membrane with a diameter of 0.8-1.2 mm and a microporous surface structure is inserted into each pore of the porous plug. The porous plug is then placed in a placement cylinder. S2: Filling the placement cylinder with fluororesin material; S3: Using the controller to control the heating coil to start through the first wire, the temperature in the placement cylinder is raised to 300-360°C, so that the fluororesin material reaches a molten state; S4: The controller drives the lower telescopic cylinder and the upper telescopic cylinder via the second and third wires respectively. The driving end of the upper telescopic cylinder drives the upper pressing block, and the driving end of the lower telescopic cylinder drives the lower pressing block. The molten fluororesin material is compressed 3-5 times, with each holding time of 30-60 seconds, so that the fluororesin fully fills the gap between the porous plug and the membrane wire. S5: During the compression cycle, the controller activates the vibration motor on the crossbar through the fourth wire, applying mechanical vibration at a frequency of 150 Hz to achieve the defoaming operation. S6: After completion of compression and defoaming, heating is stopped, allowing the temperature inside the placement cylinder to gradually decrease. During the cooling process, the fluororesin gradually solidifies, forming a dense interfacial bonding layer with the membrane filaments to obtain a degassing membrane module for gas-liquid separation.

[0015] Using a precision-machined porous plug as the encapsulation matrix, hollow fiber membrane filaments are uniformly implanted in its pores. Based on the diffusion principle of gas-liquid separation, the gas-liquid contact area is greatly increased. At the same time, the microporous structure on the surface of the membrane filaments can selectively block water molecules and allow gas molecules to pass through. In combination with the dense interfacial bonding layer formed by the fluororesin and the membrane filaments, when applied to high-performance liquid chromatography, the sensitivity and accuracy of chromatographic analysis are significantly improved.

[0016] In summary, the technical effects and advantages of the present invention are as follows: 1. In the present invention, by precisely controlling the heating coil, the temperature is stabilized at 300 - 360 °C, and in combination with the upper and lower telescopic cylinders for 3 - 5 dynamic compression cycles and 150 Hz high-frequency vibration defoaming, the problems of uneven melting of fluororesin and residual internal bubbles are effectively solved, significantly improving the encapsulation yield rate and significantly reducing the scrap rate and production cost.

[0017] 2. In the present invention, a precision-machined porous plug is used as the encapsulation matrix, and hollow fiber membrane filaments are uniformly implanted in its pores. Based on the diffusion principle of gas-liquid separation, the gas-liquid contact area is greatly increased. At the same time, the microporous structure on the surface of the membrane filaments can selectively block water molecules and allow gas molecules to pass through. In combination with the dense interfacial bonding layer formed by the fluororesin and the membrane filaments, when applied to high-performance liquid chromatography, the sensitivity and accuracy of chromatographic analysis are significantly improved.

[0018] 3. In the present invention, by utilizing the excellent chemical inertness and high-temperature resistance of the fluororesin material, the encapsulated degassing membrane module can work stably in a strongly corrosive mobile phase for a long time, effectively avoiding the problems of easy corrosion of materials and rapid decay of performance in traditional degassing technologies, greatly extending the service life of the module and reducing the equipment maintenance and replacement frequency.

[0019] 4. In the present invention, the modular encapsulation design reduces material waste and optimizes the processing flow. On the other hand, by improving the process to increase the yield rate and extend the service life of the module, the production cost is effectively reduced, the market competitiveness of the product is improved, and a foundation for large-scale production is laid.

[0020] 5. In the present invention, the upper telescopic cylinder and the lower telescopic cylinder are clamped by the limit frame, effectively preventing them from shifting during frequent telescoping, ensuring the accuracy of the compression molding process. The stabilizing rod cooperates with the bushing, the bottom plate, and the fastening bolt, and together with the anti-slip strip and the support washer, enhances the stability of the equipment structurally, avoiding packaging errors caused by shaking during operation, and providing a reliable guarantee for the precise implementation of the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of the overall structure of a chromatographic degassing component packaging device according to the present invention; Figure 2 is a schematic side view structure diagram of a chromatographic degassing component packaging device according to the present invention; Figure 3 is a schematic bottom view structure diagram of a chromatographic degassing component packaging device according to the present invention; Figure 4 is an exploded structure diagram of a support mechanism in a chromatographic degassing component packaging device according to the present invention; Figure 5 In a chromatographic degassing component packaging device according to the present invention Figure 4 schematic diagram of the structure at position A; Figure 6 is an exploded structure diagram of a packaging mechanism in a chromatographic degassing component packaging device according to the present invention; Figure 7 In a chromatographic degassing component packaging device according to the present invention Figure 6 schematic diagram of the structure at position B; Figure 8 is a flowchart of a chromatographic degassing component packaging process according to the present invention.

[0022] In the figure: 1, carrier rod; 2, packaging mechanism; 21, controller; 22, operation panel; 23, knob; 24, first mounting block; 25, placement cylinder; 26, first clamping block; 27, first bolt; 28, heating coil; 29, first nut; 210, first carrier; 211, second carrier; 212, second mounting block; 213, limit frame; 214, second clamping block; 215, second bolt; 216, second nut; 217, upper telescopic cylinder; 218, first wire; 219, lower telescopic cylinder; 220, second wire; 221, third wire; 222, power supply interface; 223, lower pressing block; 224, upper pressing block; 225, cross bar; 226, vibration motor; 227, fourth wire; 3, support mechanism; 31, bottom plate; 32, threaded groove; 33, stabilizing rod; 34, positioning plate; 35, through hole; 36, fastening bolt; 37, bushing; 38, pressing plate; 39, anti-slip strip; 310, support washer. DETAILED DESCRIPTION OF THE INVENTION

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0024] Refer to Figures 1-8 A chromatographic degassing component encapsulation device as shown, which includes a carrier rod 1. An encapsulation mechanism 2 is arranged on the surface of the carrier rod 1. The encapsulation mechanism 2 includes a first mounting block 24, a placement cylinder 25, an upper telescopic cylinder 217 and a lower telescopic cylinder 219. The first mounting block 24 is fixedly connected to the surface of the carrier rod 1. One end of the first mounting block 24 away from the carrier rod 1 is fixedly connected to a first carrier 210. A first clamping block 26 is placed on one side of the first carrier 210. A heating coil 28 is fixedly connected to the surface of the placement cylinder 25. The placement cylinder 25 is located between the first carrier 210 and the first clamping block 26. Two symmetrically arranged second mounting blocks 212 are fixedly connected to one side of the carrier rod 1 close to the first mounting block 24. One end of the second mounting block 212 is fixedly connected to a second carrier 211. A second mounting block 212 is placed on one side of the second carrier 211. The upper telescopic cylinder 217 and the lower telescopic cylinder 219 are respectively placed between the two second carriers 211 and the second clamping block 214. The driving end of the upper telescopic cylinder 217 is fixedly connected to an upper pressing block 224. The driving end of the lower telescopic cylinder 219 is fixedly connected to a lower pressing block 223. Both the upper pressing block 224 and the lower pressing block 223 are adapted to the inside of the placement cylinder 25. By precisely controlling the heating coil 28 to stabilize the temperature at 300 - 360 °C, and cooperating with the upper and lower telescopic cylinders 219 to perform 3 - 5 times of dynamic compression cycles and 150 Hz high-frequency vibration to eliminate bubbles, the problems of uneven melting of fluororesin and residual internal bubbles are effectively solved, the encapsulation yield is greatly improved, and the rejection rate and production cost are significantly reduced.

[0025] Among them, a controller 21 is placed on one side of the carrier rod 1. A knob 23 is installed on the upper surface of the controller 21. An operation panel 22 is fixedly connected to the upper surface of the controller 21. A first wire 218 is installed at the output end of the controller 21. One end of the first wire 218 away from the controller 21 is electrically connected to the heating coil 28. A second wire 220 is installed at the output end of the controller 21. One end of the second wire 220 away from the controller 21 is electrically connected to the lower telescopic cylinder 219. A third wire 221 is installed at the output end of the controller 21. One end of the third wire 221 away from the controller 21 is electrically connected to the upper telescopic cylinder 217. A power supply interface 222 is arranged on one side of the controller 21 away from the carrier rod 1. The modular encapsulation design reduces material waste and optimizes the processing flow. On the other hand, the yield is improved and the component life is extended through process improvement, effectively reducing the production cost and enhancing the market competitiveness of the product, laying a foundation for large-scale production.

[0026] Among them, the lower end of the carrier rod 1 is fixedly connected to the cross bar 225, the upper surface of the cross bar 225 is fixedly connected to the vibration motor 226, and the output end of the controller 21 is installed with a fourth wire 227. The end of the fourth wire 227 away from the controller 21 is electrically connected to the vibration motor 226. Through the vibration motor 226, mechanical vibration is applied at a frequency of 150 Hz, and the force field generated by the vibration is used to break the surface tension of the bubbles inside the material, thereby realizing the defoaming operation and ensuring the density of the material after molding.

[0027] A first bolt 27 passes through the first carrier 210 and the first clamping block 26 , and a first nut 29 is threadedly connected to the first bolt 27 to facilitate subsequent maintenance of the placement tube 25 .

[0028] Among them, a second bolt 215 passes through the second carrier 211 and the second clamping block 214, and a second nut 216 is threadedly connected to the second bolt 215. The surface of the second carrier 211 is fixedly connected to the limit frame 213, and the two limit frames 213 are respectively buckled on the upper telescopic cylinder 217 and the lower telescopic cylinder 219. The upper telescopic cylinder 217 and the lower telescopic cylinder 219 are clamped by the limit frames 213, which effectively prevents them from shifting during frequent telescopic expansion and contraction, thereby ensuring the accuracy of the compression molding process.

[0029] Among them, a support mechanism 3 is provided on the surface of the cross bar 225, and the support mechanism 3 includes a stabilizing rod 33 and a base plate 31. The stabilizing rod 33 is fixedly connected to the surface of the cross bar 225, and the base plate 31 is located below the cross bar 225 and the stabilizing rod 33. Both ends of the cross bar 225 are fixedly connected with a positioning plate 34, and a through hole 35 is provided on the surface of the positioning plate 34. A threaded groove 32 is provided on the upper surface of the base plate 31, and a fastening bolt 36 is inserted in the through hole 35. One end of the fastening bolt 36 is threadedly inserted into the threaded groove 32.

[0030] Among them, a clamping sleeve 37 is fixedly connected to the upper surface of the bottom plate 31, and one end of the stabilizing rod 33 is inserted into the clamping sleeve 37, which limits the displacement of the stabilizing rod 33 and plays a role in stably supporting and restraining the carrier rod 1.

[0031] Among them, the lower surface of the base plate 31 is fixedly connected with an anti-slip strip 39, and the lower surface of the base plate 31 is fixedly connected with a support washer 310. The stabilizing rod 33 cooperates with the sleeve 37, the base plate 31, and the fastening bolt 36. Combined with the anti-slip strip 39 and the support washer 310, the stability of the equipment is enhanced structurally, avoiding packaging errors caused by shaking during operation, and providing reliable guarantee for the precise implementation of the process.

[0032] There are multiple anti-slip strips 39 , which are arranged at equal intervals, and the edges of the support washer 310 are rounded.

[0033] The steps include: S1: Use the porous plug as the encapsulation matrix, insert a single hollow fiber membrane filament with a diameter of 0.8 - 1.2 mm and a microporous structure on its surface into each pore of the porous plug, and then place the porous plug into the placement cylinder 25; S2: Fill the fluororesin material into the placement cylinder 25; S3: Use the controller 21 to control the heating coil 28 to start through the first wire 218, raise the temperature inside the placement cylinder 25 to 300 - 360 °C, and make the fluororesin material reach the molten state; S4: The controller 21 drives the lower telescopic cylinder 219 and the upper telescopic cylinder 217 to work through the second wire 220 and the third wire 221 respectively. The driving end of the upper telescopic cylinder 217 drives the upper pressing block 224, and the driving end of the lower telescopic cylinder 219 drives the lower pressing block 223 to perform 3 - 5 compression cycles on the molten fluororesin material, with a holding pressure time of 30 - 60 s each time, so as to promote the full filling of the gap between the porous plug and the membrane filament by the fluororesin; S5: During the compression cycle, the controller 21 starts the vibration motor 226 on the cross bar 225 through the fourth wire 227, and applies mechanical vibration at a frequency of 150 Hz to achieve the defoaming operation; S6: After the compression and defoaming are completed, stop heating, and gradually reduce the temperature inside the placement cylinder 25. During the cooling process, the fluororesin gradually solidifies to form a dense interfacial bonding layer with the membrane filament, and a degassing membrane module for gas - liquid separation is obtained.

[0034] Among them, a precision - machined porous plug is used as the encapsulation matrix, and hollow fiber membrane filaments are uniformly implanted in its pores. Based on the diffusion principle of gas - liquid separation, the gas - liquid contact area is greatly increased. At the same time, the microporous structure on the surface of the membrane filament can selectively block water molecules and allow gas molecules to pass through. Combined with the dense interfacial bonding layer formed by the fluororesin and the membrane filament, when applied to high - performance liquid chromatography, the sensitivity and accuracy of chromatographic analysis are significantly improved.

[0035] The working principle of the present invention: Use the porous plug as the encapsulation matrix, insert a single hollow fiber membrane filament with a diameter of 0.8 - 1.2 mm and a microporous structure on its surface into each pore, and then place it into the placement cylinder 25. The placement cylinder 25 is placed between the first carrier 210 and the first clamping block 26, and is tightened and fixed by the first bolt 27 and the first nut 29 to ensure the stable position of the placement cylinder 25 during the encapsulation process without deviation; Fill the fluororesin material into the placement cylinder 25. The controller 21 controls the heating coil 28 to start through the first wire 218, raises the temperature inside the placement cylinder 25 to 300 - 360 °C, and makes the fluororesin material reach the molten state to create conditions for subsequent compression molding; The controller 21 drives the lower telescopic cylinder 219 and the upper telescopic cylinder 217 to work through the second wire 220 and the third wire 221 respectively. The driving end of the upper telescopic cylinder 217 drives the upper pressing block 224, and the driving end of the lower telescopic cylinder 219 drives the lower pressing block 223 to perform 3 - 5 compression cycles on the molten fluororesin material, with a holding pressure time of 30 - 60 s each time. Through mechanical pressure, the fluororesin is fully filled into the gap between the porous plug and the membrane filaments. At the same time, the controller 21 starts the vibration motor 226 on the cross bar 225 through the fourth wire 227, applies mechanical vibration at a frequency of 150 Hz, and uses the force field generated by the vibration to break the surface tension of the bubbles inside the material, realizing the defoaming operation and ensuring the density of the formed material. After the compression and defoaming are completed, the heating is stopped, and the temperature inside the placement cylinder 25 gradually decreases. During the cooling process, the molten fluororesin gradually solidifies, forming a dense interfacial bonding layer with the membrane filaments, and finally obtaining a degassing membrane module for gas - liquid separation. During the entire working process, the limit frame 213 holds the upper telescopic cylinder 217 and the lower telescopic cylinder 219 to prevent them from shifting during frequent telescoping, which may affect the encapsulation accuracy. The stabilizing rod 33 cooperates with the bushing 37, and then through the bottom plate 31 and the fastening bolt 36, the carrier rod 1 is stably supported from the bottom. The anti - slip strips 39 and the support washers 310 on the lower surface of the bottom plate 31 increase the friction between the equipment and the placement surface, avoid equipment shaking, and ensure the stable and precise progress of the encapsulation work.

[0036] The electrical components appearing in this text are all connected to the external main controller and the 220V mains electricity, and the main controller can be a conventional known device such as a computer for control.

[0037] Finally, it should be noted that the above - mentioned are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A chromatographic degassing component encapsulation device, comprising a carrier rod (1), characterized in that: The surface of the carrier rod (1) is provided with a packaging mechanism (2). The packaging mechanism (2) includes a first mounting block (24), a placement cylinder (25), an upper telescopic cylinder (217) and a lower telescopic cylinder (219). The first mounting block (24) is fixedly connected to the surface of the carrier rod (1). One end of the first mounting block (24) away from the carrier rod (1) is fixedly connected to a first carrier (210). A first clamping block (26) is placed on one side of the first carrier (210). The surface of the placement cylinder (25) is fixedly connected with a heating coil (28). The placement cylinder (25) is located between the first carrier (210) and the first clamping block (26). Two symmetrically arranged second mounting blocks (212) are fixedly connected to one side of the carrier rod (1) close to the first mounting block (24). One end of the second mounting block (212) is fixedly connected to a second carrier (211). A second mounting block (212) is placed on one side of the second carrier (211). The upper telescopic cylinder (217) and the lower telescopic cylinder (219) are respectively placed between two second carriers (211) and second clamping blocks (214). The driving end of the upper telescopic cylinder (217) is fixedly connected to an upper pressing block (224). The driving end of the lower telescopic cylinder (219) is fixedly connected to a lower pressing block (223). Both the upper pressing block (224) and the lower pressing block (223) are adapted to the inside of the placement cylinder (25).

2. The chromatographic degassing component encapsulation device according to claim 1, wherein: A controller (21) is placed on one side of the carrier rod (1). A knob (23) is installed on the upper surface of the controller (21). An operation panel (22) is fixedly connected to the upper surface of the controller (21). A first wire (218) is installed at the output end of the controller (21). One end of the first wire (218) away from the controller (21) is electrically connected to the heating coil (28). A second wire (220) is installed at the output end of the controller (21). One end of the second wire (220) away from the controller (21) is electrically connected to the lower telescopic cylinder (219). A third wire (221) is installed at the output end of the controller (21). One end of the third wire (221) away from the controller (21) is electrically connected to the upper telescopic cylinder (217). A power supply interface (222) is arranged on one side of the controller (21) away from the carrier rod (1).

3. The encapsulation device for a chromatographic degassing component according to claim 2, characterized in that: A cross bar (225) is fixedly connected to the lower end of the carrier rod (1). A vibration motor (226) is fixedly connected to the upper surface of the cross bar (225). A fourth wire (227) is installed at the output end of the controller (21). One end of the fourth wire (227) away from the controller (21) is electrically connected to the vibration motor (226).

4. A chromatographic degassing component encapsulation device according to claim 1, characterized in that: A first bolt (27) passes through between the first carrier (210) and the first clamping block (26). A first nut (29) is threadedly connected to the first bolt (27).

5. A chromatographic degassing component encapsulation device according to claim 1, characterized in that: A second bolt (215) passes through between the second carrier (211) and the second clamping block (214). A second nut (216) is threadedly connected to the second bolt (215). A limiting frame (213) is fixedly connected to the surface of the second carrier (211). The two limiting frames (213) are respectively buckled on the upper telescopic cylinder (217) and the lower telescopic cylinder (219).

6. The chromatographic degassing component encapsulation device according to claim 3, wherein: A support mechanism (3) is arranged on the surface of the cross bar (225). The support mechanism (3) includes a stabilizing rod (33) and a bottom plate (31). The stabilizing rod (33) is fixedly connected to the surface of the cross bar (225). The bottom plate (31) is located below the cross bar (225) and the stabilizing rod (33). Positioning plates (34) are fixedly connected to both ends of the cross bar (225). Through holes (35) are formed in the surfaces of the positioning plates (34). Threaded grooves (32) are formed in the upper surface of the bottom plate (31). A fastening bolt (36) is inserted into the through hole (35). One end of the fastening bolt (36) is threadedly inserted into the threaded groove (32).

7. A chromatographic degassing component encapsulation device according to claim 6, characterized in that: A clamping sleeve (37) is fixedly connected to the upper surface of the bottom plate (31). One end of the stabilizing rod (33) is inserted into the clamping sleeve (37).

8. A chromatographic degassing component encapsulation device according to claim 6, characterized in that: An anti-slip strip (39) is fixedly connected to the lower surface of the bottom plate (31). A support washer (310) is fixedly connected to the lower surface of the bottom plate (31).

9. A chromatographic degassing component encapsulation device according to claim 8, characterized in that: The number of the anti-slip strips (39) is multiple. The multiple anti-slip strips (39) are arranged at equal intervals. The edge of the support washer (310) is rounded.

10. A chromatographic degassing component encapsulation process, characterized in that, Including the following steps: S1: Using the porous plug as the encapsulation matrix, inserting a single hollow fiber membrane filament with a diameter of 0.8 - 1.2 mm and a microporous structure on the surface into each pore of the porous plug, and then placing the porous plug into the placement cylinder (25). S2: Filling the placement cylinder (25) with a fluororesin material. S3: Using the controller (21) to control the heating coil (28) to start through the first wire (218), raising the temperature inside the placement cylinder (25) to 300 - 360 °C, so that the fluororesin material reaches the molten state. S4: The controller (21) drives the lower telescopic cylinder (219) and the upper telescopic cylinder (217) to work through the second wire (220) and the third wire (221) respectively. The driving end of the upper telescopic cylinder (217) drives the upper pressing block (224), and the driving end of the lower telescopic cylinder (219) drives the lower pressing block (223), performing 3 - 5 compression cycles on the molten fluororesin material, with a holding pressure time of 30 - 60 s each time, to promote the full filling of the gap between the porous plug and the membrane filament by the fluororesin. S5: During the compression cycle, the controller (21) starts the vibration motor (226) on the cross bar (225) through the fourth wire (227), applying mechanical vibration at a frequency of 150 Hz to achieve the defoaming operation. S6: After completing the compression and defoaming, stop heating, and gradually reduce the temperature inside the placement cylinder (25). During the temperature reduction process, the fluororesin gradually solidifies, forming a dense interfacial bonding layer with the membrane filament, obtaining a degassing membrane module for gas - liquid separation.

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