Semiconductor wafer cleaning device

Abstract

The invention relates to the technical field of wafer cleaning, in particular to a semiconductor wafer cleaning device which comprises an ultrasonic cleaning machine and further comprises a mounting plate arranged above the ultrasonic cleaning machine and a plurality of arc-shaped strips arranged on one side of the mounting plate in the circumferential direction and connected with a gathering assembly. A plurality of limiting rollers are arranged on the concave surface sides of the arc-shaped strips, and the air injection assemblies are arranged on the concave surface sides of the arc-shaped strips and used for conducting air injection and dust removal on the side edge contact positions of the limiting rollers and the semiconductor wafer; according to the invention, the air injection assembly carries out air injection dust removal on the side edge contact position of the limiting roller and the semiconductor wafer, so that no pollutant exists between the side edge contact position of the limiting roller and the semiconductor wafer, and the side edge of the semiconductor wafer is prevented from being scratched and damaged due to the existence of the pollutant.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and particularly to a semiconductor wafer cleaning device. Background Art

[0002] Wafer cleaning refers to the process of removing contaminants and oxides on the wafer surface by chemical or physical methods during the manufacturing process of integrated circuits, so that the wafer surface meets the cleanliness requirements. The principle of wafer cleaning is to remove various impurities without damaging the wafer. There are mainly four mechanisms for removing particles: dissolution, oxidative decomposition, electrical repulsion between particles and the wafer surface, and slight corrosion of the wafer surface.

[0003] The patent document with publication number CN118629937B discloses a wafer cleaning device for semiconductors, including a cleaning tank. A vertical plate is fixedly connected to the lower inner wall of the cleaning tank near the left side by bolts. A rotating structure is arranged at the top of the vertical plate. Multiple inner disks are arranged in the rotating structure. A pushing and pulling structure is arranged on the inner disk. A clamping structure is arranged at one end of the pushing and pulling structure. A placing structure is clamped on the clamping structure. A loading and unloading structure is arranged above the right side of the cleaning tank. Spraying structures are arranged on the front and rear sides of the cleaning tank.

[0004] During the cleaning process of semiconductor wafers, it is usually necessary to limit the wafers. The prior art uses a pressing workpiece to press and clamp the side of the semiconductor wafer. When there are contaminants at the pressing position on the side of the semiconductor wafer, the contaminants will cause the side of the semiconductor wafer to thicken and become uneven. When the pressing workpiece contacts the side of the semiconductor wafer, the contaminants will be embedded inside the side of the semiconductor wafer under the extrusion of the pressing workpiece, thus easily causing scratch damage on the surface of the semiconductor wafer and affecting the connectivity of the wafer circuit. Summary of the Invention

[0005] The purpose of the present invention is to solve the deficiencies in the prior art and propose a semiconductor wafer cleaning device.

[0006] To achieve the above purpose, the technical solution adopted by the present invention is: a semiconductor wafer cleaning device, including an ultrasonic cleaning machine, and further including: A mounting plate is arranged above the ultrasonic cleaning machine. A lifting component is connected to the mounting plate, and the lifting component is used to drive the mounting plate to move vertically up and down; Multiple arc-shaped strips are arranged along the circumferential direction on one side of the mounting plate. A gathering component is connected to the arc-shaped strips. A plurality of limiting rollers are arranged on the concave side of each arc-shaped strip. A rotating component is connected to the limiting rollers. After the gathering component drives the arc-shaped strips to gather towards the center of the mounting plate, the limiting rollers contact and limit the side of the semiconductor wafer, and the rotating component is used to drive the plurality of limiting rollers to rotate in the same direction; A jetting assembly, which is arranged on the concave side of the arc-shaped strip and is used for jetting and dust removing at the contact position between the limiting roller and the side of the semiconductor wafer; A liquid guiding assembly, which is arranged on the mounting plate. When the semiconductor wafer rotates unidirectionally, the liquid guiding assembly is used for guiding the cleaning liquid in the reverse direction at the side of the semiconductor wafer.

[0007] Preferably, the gathering assembly includes: A plurality of sliding grooves, which are circumferentially formed on the mounting plate; A plurality of sliding blocks, which are slidably connected inside the corresponding sliding grooves, and the arc-shaped strips are respectively fixedly connected to one side of the corresponding sliding blocks; A plurality of connecting rods, which are respectively fixedly connected to the other side of the corresponding sliding blocks, and one ends of the connecting rods are all fixedly connected with round pins; A first driving unit, which is fixedly installed on the mounting plate. A guiding plate is fixedly connected to the output shaft of the first driving unit, and a plurality of inclined grooves are circumferentially formed on the guiding plate, and one ends of the round pins are respectively located inside the corresponding inclined grooves.

[0008] Preferably, the rotating assembly includes: A plurality of single-pass sleeves, which are respectively rotatably connected inside the corresponding limiting rollers, and the single-pass sleeves are all fixedly connected to the corresponding arc-shaped strips; A plurality of mating gears, which are fixedly connected to one end of the corresponding limiting rollers; An external toothed ring, which is rotatably connected to the center of one side of the mounting plate. When the arc-shaped strips are in a gathered state, the plurality of mating gears are all meshed with the external toothed ring; A second driving unit, which is fixedly installed on the mounting plate. A driving gear is fixedly connected to the output shaft of the second driving unit, and the driving gear and the external toothed ring are always meshed.

[0009] Preferably, the jetting assembly includes: A plurality of nozzles, which are all fixedly connected to the corresponding arc-shaped strips, and the nozzles are all inclined towards the corresponding limiting rollers; A plurality of connecting pipes, which are all fixedly inserted into the corresponding arc-shaped strips. One end of the connecting pipe is connected to the corresponding nozzle, and a check valve is fixedly installed at the other end of the connecting pipe; A first arc-shaped pipe, which is fixedly connected to the mounting plate. A plurality of hoses are fixedly connected to the first arc-shaped pipe. One end of the hose is fixedly connected to a sealed housing, and the sealed housing is fixedly connected to the corresponding arc-shaped strip. One end of the connecting pipe is located inside the corresponding sealed housing; An air pump, which is fixedly installed on the mounting plate, and the exhaust end of the air pump is fixedly connected to the first arc-shaped pipe.

[0010] Preferably, a scraper is provided on one side of each limiting roller. A connecting bar is slidably connected to the top of the scraper, and the connecting bar is fixedly connected to the corresponding arc-shaped bar. A circular rod is fixedly connected to one side of the scraper. A plurality of guiding frames are fixedly connected to the mounting plate, and guiding grooves are formed in the guiding frames. One end of the circular rod is located inside the corresponding guiding groove. The guiding groove includes a vertical section and an inclined section.

[0011] Preferably, the liquid guiding assembly includes: A second arc-shaped pipe, which is fixedly connected to the mounting plate, and a plurality of water outlet pipes are fixedly communicated with the second arc-shaped pipe; A liquid pump, which is fixedly installed on the mounting plate, and the water outlet end of the liquid pump is fixedly communicated with one end of the second arc-shaped pipe. When the plurality of arc-shaped bars are in a converged state, one end of the water outlet pipe is in contact and communicated with one end of the corresponding single-pass sleeve. A first water outlet groove is formed in the single-pass sleeve, and a plurality of second water outlet grooves are formed in the limiting roller along the circumferential direction.

[0012] Preferably, the lifting assembly includes: A fixing frame, which is fixedly connected to the top of the ultrasonic cleaning machine; An electric cylinder, which is fixedly installed on the fixing frame, and the piston rod of the electric cylinder is fixedly connected to the top of the mounting plate.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. During the process of the limiting roller approaching the side of the semiconductor wafer, the air jetting assembly jets air to the contact position between the limiting roller and the side of the semiconductor wafer for dust removal, so that there are no pollutants between the contact position between the limiting roller and the side of the semiconductor wafer, preventing scratches and damages from being generated at the side of the semiconductor wafer due to the existence of pollutants; 2. Through the action of the liquid guiding assembly, the cleaning liquid inside the ultrasonic cleaning machine is drained, so that part of the cleaning liquid is ejected from the contact position between the limiting roller and the side of the semiconductor wafer, and is opposite to the rotation direction of the semiconductor wafer. Under the action of the liquid flow, the side position of the semiconductor wafer is continuously washed, and the residual pollutants at the side are continuously impacted by the liquid flow, preventing the residual pollutants at the side of the semiconductor wafer from entering between the limiting roller and the semiconductor wafer during the rotation process, and further reducing the risk of scratches caused by pollutants to the cleaning of the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is the first overall structural schematic diagram of the present invention; Figure 2 is for the present invention Figure 1 The enlarged schematic diagram of the structure at A in; Figure 3 is the second overall structural schematic diagram of the present invention; Figure 4 is for the present invention Figure 3Schematic enlarged view of the structure at position B in Figure 5 Schematic diagram of the mating structure of the mounting plate, the second arc-shaped pipe and the liquid pump according to the present invention; Figure 6 According to the present invention Figure 5 Schematic enlarged view of the structure at position C in Figure 7 Schematic diagram of the mating structure of the arc-shaped strip, the limiting roller and the nozzle according to the present invention; Figure 8 Exploded schematic diagram of the mating structure of the limiting roller and the single-pass sleeve according to the present invention; Figure 9 Schematic diagram of the rotating assembly according to the present invention; Figure 10 Schematic diagram of the mating structure of the mounting plate, the first arc-shaped pipe and the air pump according to the present invention (the sealed housing is cut); Figure 11 According to the present invention Figure 10 Schematic enlarged view of the structure at position D in

[0015] In the figure: 100, ultrasonic cleaning machine; 200, mounting plate; 300, lifting assembly; 310, fixing frame; 320, electric cylinder; 400, arc-shaped strip; 500, gathering assembly; 510, chute; 520, slider; 530, connecting rod; 531, round pin; 540, first driving unit; 541, guiding plate; 542, inclined slot; 600, limiting roller; 610, scraping plate; 611, connecting strip; 612, round rod; 613, guiding frame; 614, guiding slot; 6141, vertical section; 6142, inclined section; 620, second water outlet groove; 700, rotating assembly; 710, single-pass sleeve; 711, first water outlet groove; 720, mating gear; 730, external tooth ring; 740, second driving unit; 741, driving gear; 800, jetting assembly; 810, nozzle; 820, connecting pipe; 821, one-way valve; 830, first arc-shaped pipe; 831, hose; 832, sealed housing; 840, air pump; 900, liquid guiding assembly; 910, second arc-shaped pipe; 911, water outlet pipe; 920, liquid pump. Detailed implementation manners

[0016] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations.

[0017] As Figures 1 to 11 shown, a semiconductor wafer cleaning device includes an ultrasonic cleaning machine 100, and further includes: The mounting plate 200 is arranged above the ultrasonic cleaning machine 100. A lifting component 300 is connected to the mounting plate 200. The lifting component 300 is used to drive the mounting plate 200 to move vertically up and down. A plurality of arc-shaped strips 400 are arranged on one side of the mounting plate 200 in the circumferential direction. A gathering component 500 is connected to the arc-shaped strips 400. A plurality of limiting rollers 600 are arranged on the concave side of each arc-shaped strip 400. A rotating component 700 is connected to the limiting rollers 600. After the gathering component 500 drives the arc-shaped strips 400 to gather towards the center of the mounting plate 200, the limiting rollers 600 are in contact with and limit the side of the semiconductor wafer. The rotating component 700 is used to drive the plurality of limiting rollers 600 to rotate in the same direction. An air jet component 800 is arranged on the concave side of the arc-shaped strip 400. The air jet component 800 is used to jet air to remove dust at the contact position between the limiting roller 600 and the side of the semiconductor wafer. A liquid guiding component 900 is arranged on the mounting plate 200. When the semiconductor wafer rotates in one direction, the liquid guiding component 900 is used to guide the cleaning liquid in the reverse direction at the side of the semiconductor wafer. During the cleaning process of the semiconductor wafer, it is usually necessary to limit the wafer. In the prior art, a pressing workpiece is used to press and clamp the side of the semiconductor wafer. When there are contaminants at the pressing position on the side of the semiconductor wafer, the contaminants will cause the side of the semiconductor wafer to thicken and become uneven. When the pressing workpiece contacts the side of the semiconductor wafer, the contaminants will be embedded into the side of the semiconductor wafer under the extrusion of the pressing workpiece, which is likely to cause scratch damage to the surface of the semiconductor wafer and affect the connectivity of the wafer circuit. Before cleaning the semiconductor wafer, place the semiconductor wafer on one side of the mounting plate 200 and between the plurality of arc-shaped strips 400. Through the action of the gathering component 500, the plurality of arc-shaped strips 400 are synchronously gathered towards the center on one side of the mounting plate 200, and the limiting rollers 600 at the concave side of the arc-shaped strips 400 are driven to move synchronously, so that the limiting rollers 600 are in contact with the side of the semiconductor wafer and perform circumferential limitation on the semiconductor wafer. During the process of the limiting rollers 600 approaching the side of the semiconductor wafer, the air jet component 800 jets air to remove dust at the contact position between the limiting rollers 600 and the side of the semiconductor wafer, so that there are no contaminants between the contact positions of the limiting rollers 600 and the side of the semiconductor wafer, preventing scratch damage to the side of the semiconductor wafer caused by the presence of contaminants. After the semiconductor wafer is positioned by multiple positioning rollers 600, it is driven by the lifting assembly 300 to vertically move the mounting plate 200 downward into the ultrasonic cleaning machine 100, thereby driving the semiconductor wafer to move synchronously and soak in the cleaning liquid inside the ultrasonic cleaning machine 100. When the ultrasonic cleaning machine 100 works, it drives the cleaning liquid to vibrate at an ultra-high frequency to perform ultrasonic cleaning on the semiconductor wafer; When the positioning rollers 600 contact the side of the semiconductor wafer, it is difficult for the cleaning liquid to enter the contact position between the positioning rollers 600 and the side of the semiconductor wafer, resulting in the formation of cleaning dead corners at the side of the semiconductor wafer. When the semiconductor wafer is soaked in the cleaning liquid for ultrasonic cleaning, the rotation assembly 700 is used to drive the multiple positioning rollers 600 to rotate in the same direction. Since the positioning rollers 600 contact the side of the semiconductor wafer, the semiconductor wafer is driven to rotate unidirectionally between the multiple positioning rollers 600 under the action of the contact friction force, so that the contact position between the semiconductor wafer and the positioning rollers 600 continuously changes, ensuring that the side of the semiconductor wafer can come into contact with the cleaning liquid during the rotation process, preventing the generation of cleaning dead corners when the semiconductor wafer contacts the position limit, and effectively improving the cleaning effect of the semiconductor wafer; After the contact position between the positioning rollers 600 and the side of the semiconductor wafer is blown with air and dust removed by the air jet assembly 800, there are still certain pollutants in other positions on the side. Therefore, when the semiconductor wafer is soaked in the cleaning liquid for cleaning, the semiconductor wafer rotates unidirectionally through the contact rotation of the multiple positioning rollers 600, and the liquid guiding assembly 900 is used to drain the cleaning liquid inside the ultrasonic cleaning machine 100, so that part of the cleaning liquid is ejected from the contact position between the positioning rollers 600 and the side of the semiconductor wafer, and is opposite to the rotation direction of the semiconductor wafer. Under the action of the liquid flow, the side position of the semiconductor wafer is continuously washed, so that when the contact position between the positioning rollers 600 and the side of the semiconductor wafer changes during rotation, the liquid flow generated by the liquid guiding assembly 900 washes away the pollutants about to approach the positioning rollers 600 on the side of the semiconductor wafer and separates them from the side of the semiconductor wafer, preventing the pollutants remaining on the side of the semiconductor wafer from entering between the positioning rollers 600 and the semiconductor wafer during rotation, and further reducing the risk of scratches on the semiconductor wafer caused by pollutants during cleaning.

[0018] As a further embodiment of the present invention, the gathering assembly 500 includes: Multiple sliding grooves 510, which are circumferentially formed on the mounting plate 200; Multiple sliders 520, which are slidably connected inside the corresponding sliding grooves 510, and multiple arc-shaped strips 400 are respectively fixedly connected to one side of the corresponding sliders 520; Multiple connecting rods 530, which are respectively fixedly connected to the other side of the corresponding sliders 520, and one end of each connecting rod 530 is fixedly connected with a round pin 531; The first driving unit 540 is fixedly installed on the mounting plate 200. A guiding plate 541 is fixedly connected to the output shaft of the first driving unit 540. A plurality of inclined slots 542 are circumferentially formed in the guiding plate 541, and one ends of the circular pins 531 are respectively located inside the corresponding inclined slots 542. When it is necessary to perform contact limiting on the semiconductor wafer, the output shaft of the first driving unit 540 rotates unidirectionally, thereby driving the guiding plate 541 to rotate synchronously. A plurality of inclined slots 542 are formed in the guiding plate 541. The inclined slots 542 limit and guide the internal circular pins 531 during the rotation process, and drive the corresponding connecting rods 530 and sliders 520 to move, so that the sliders 520 slide along the inside of the corresponding sliding slots 510 and converge towards the center of the mounting plate 200. The arc-shaped strips 400 are fixedly connected to one side of the corresponding sliders 520, and move synchronously with the sliders 520 to converge and approach the side of the semiconductor wafer. The limiting rollers 600 on the concave side of the arc-shaped strips 400 contact the side of the semiconductor wafer, so that a plurality of limiting rollers 600 converge towards the center synchronously and perform circumferential limiting on the side of the semiconductor wafer. When the output shaft of the first driving unit 540 rotates in the reverse direction, the limiting rollers 600 on the concave side of the arc-shaped strips 400 move away from the semiconductor wafer and release the limiting on its side.

[0019] As a further embodiment of the present invention, the rotating assembly 700 includes: A plurality of single-pass sleeves 710 are respectively rotatably connected inside the corresponding limiting rollers 600, and the single-pass sleeves 710 are fixedly connected to the corresponding arc-shaped strips 400. A plurality of mating gears 720 are fixedly connected to one end of the corresponding limiting rollers 600. An external toothed ring 730 is rotatably connected to the center of one side of the mounting plate 200. When a plurality of arc-shaped strips 400 are in a converged state, a plurality of mating gears 720 are all meshed with the external toothed ring 730. A second driving unit 740 is fixedly installed on the mounting plate 200. A driving gear 741 is fixedly connected to the output shaft of the second driving unit 740, and the driving gear 741 and the external toothed ring 730 are always meshed. When multiple arc-shaped bars 400 gather towards the center on the side of the mounting plate 200, the arc-shaped bars 400 drive the corresponding single-pass sleeves 710 and the limiting rollers 600 to move synchronously. One end of the mating gear 720 at the limiting roller 600 approaches the external gear ring 730. When the limiting roller 600 contacts and limits the side of the semiconductor wafer, the mating gear 720 and the external gear ring 730 are fully meshed. The output shaft of the second driving unit 740 drives the driving gear 741 to rotate. The driving gear 741 and the external gear ring 730 are always meshed. Under the meshing action, the external gear ring 730 is driven to rotate meshingly. Under the meshing action between the external gear ring 730 and the mating gear 720, multiple mating gears 720 are driven to rotate in the same direction, so that multiple limiting rollers 600 rotate in the same direction on the surface of the corresponding single-pass sleeves 710, and the semiconductor wafer rotates unidirectionally under the contact and limiting action with the limiting rollers 600; It should be noted that before the limiting roller 600 contacts the side of the semiconductor wafer, the mating gear 720 first approaches the external gear ring 730 and moves for meshing. During the meshing process of the mating gear 720 and the external gear ring 730, the limiting roller 600 is restricted from freely rotating. Therefore, after multiple limiting rollers 600 contact and limit the side of the semiconductor wafer, multiple limiting rollers 600 cannot freely rotate. Thus, after the limiting roller 600 contacts the dust removal position on the side of the semiconductor wafer, the semiconductor wafer cannot automatically rotate between multiple limiting rollers 600, preventing the semiconductor wafer from freely rotating and causing pollutants in the non-contact area on the side to move to the contact position between the limiting roller 600 and the side of the semiconductor wafer.

[0020] As a further embodiment of the present invention, the jetting assembly 800 includes: Multiple nozzles 810, and multiple nozzles 810 are all fixedly connected to the corresponding arc-shaped bars 400, and the nozzles 810 are all inclined towards the corresponding limiting rollers 600; Multiple connecting pipes 820, and multiple connecting pipes 820 are all fixedly inserted into the corresponding arc-shaped bars 400. One end of the connecting pipe 820 is connected to the corresponding nozzle 810, and a one-way valve 821 is fixedly installed at the other end of the connecting pipe 820; The first arc-shaped pipe 830, the first arc-shaped pipe 830 is fixedly connected to the mounting plate 200. Multiple hoses 831 are fixedly connected to the first arc-shaped pipe 830. One end of the hose 831 is fixedly connected to a sealing housing 832, and the sealing housing 832 is fixedly connected to the corresponding arc-shaped bar 400. One end of the connecting pipe 820 is located inside the corresponding sealing housing 832; An air pump 840, the air pump 840 is fixedly installed on the mounting plate 200, and the exhaust end of the air pump 840 is fixedly connected to the first arc-shaped pipe 830; When multiple arc-shaped strips 400 converge towards the center on the side of the mounting plate 200, the air pump 840 operates and continuously pumps gas into the interior of the first arc-shaped tube 830. The gas moves along the interior of the first arc-shaped tube 830 into the interiors of multiple hoses 831, then enters the corresponding sealed housings 832, then enters the corresponding connecting tubes 820, and finally is discharged from the nozzles 810. The jetting ends of the nozzles 810 are inclined towards the corresponding limiting rollers 600, so that the gas discharged from the nozzles 810 continuously approaches the side of the semiconductor wafer as the arc-shaped strips 400 move, and jet dust removal is performed on the contact position between the side of the semiconductor wafer and the limiting roller 600. Before the side of the semiconductor wafer comes into contact with the corresponding limiting roller 600, the gas discharged from the nozzles 810 jets and eliminates the pollutants at the contact position, ensuring that the contact position between the limiting roller 600 and the side is clean; A one-way valve 821 is installed on the connecting tube 820, so that the connecting tube 820 can only conduct one-way gas transportation, preventing liquid backflow when the connecting tube 820 is located inside the cleaning liquid, and connecting the first arc-shaped tube 830 and the sealed housing 832 through the hose 831, so that the movement of the sealed housing 832 is not affected.

[0021] As a further implementation of the present invention, a scraper 610 is provided on one side of each limiting roller 600. A connecting strip 611 is slidably connected to the top of the scraper 610, and the connecting strip 611 is fixedly connected to the corresponding arc-shaped strip 400. A circular rod 612 is fixedly connected to one side of the scraper 610. A plurality of guiding frames 613 are fixedly connected to the mounting plate 200. A guiding groove 614 is formed in the guiding frame 613. One end of the circular rod 612 is located inside the corresponding guiding groove 614. The guiding groove 614 includes a vertical section 6141 and an inclined section 6142; When multiple arc-shaped strips 400 converge towards the center on the side of the mounting plate 200, the gas discharged from the nozzles 810 performs jet dust removal on the contact position between the side of the semiconductor wafer and the limiting roller 600. And because the jetting ends of the nozzles 810 are inclined towards the corresponding limiting rollers 600, part of the gas comes into contact with the surface of the limiting roller 600 and performs jet dust removal on the surface of the limiting roller 600. When the mating gear 720 and the external gear ring 730 have not been engaged yet, the limiting roller 600 can freely rotate along the rotational connection on the surface of the single-pass sleeve 710. The nozzle 810 thus causes the limiting roller 600 to rotate along the surface of the single-pass sleeve 710 under the action of the air flow, and comprehensively dust the arc surface of the limiting roller 600 during the rotation of the limiting roller 600, preventing the pollutants carried on the surface of the limiting roller 600 from affecting the contact and clamping between the semiconductor wafer and the limiting roller 600; When the limiting roller 600 rotates under the action of the gas from the nozzle 810, the arc-shaped strip 400 drives the connecting strip 611 to move in a converging manner. The scraper 610 is slidably connected to the connecting strip 611 and limits the circular rod 612 through the guiding groove 614. When the circular rod 612 is inside the vertical section 6141, the scraping end of the scraper 610 is located on one side of the limiting roller 600. During the process of the gas discharged from the nozzle 810 causing the limiting roller 600 to rotate, the pollutants on the surface of the limiting roller 600 are scraped off, further improving the smoothness of the surface of the limiting roller 600. During the process of the mating gear 720 meshing with the external tooth ring 730, the circular rod 612 moves from the inside of the vertical section 6141 to the inside of the inclined section 6142, so that the scraper 610 moves along the sliding connection of the connecting strip 611 and moves away from the corresponding limiting roller 600. When the limiting roller 600 drives the semiconductor wafer to rotate unidirectionally, the scraper 610 no longer acts on the surface of the limiting roller 600, improving the smoothness of the rotation of the limiting roller 600 and preventing the pollutants scraped off on the scraper 610 from returning to the surface of the limiting roller 600 during continuous contact with the limiting roller 600.

[0022] As a further embodiment of the present invention, the liquid guiding assembly 900 includes: The second arc-shaped pipe 910, the second arc-shaped pipe 910 is fixedly connected to the mounting plate 200, and a plurality of water outlet pipes 911 are fixedly communicated with the second arc-shaped pipe 910; The liquid pump 920, the liquid pump 920 is fixedly installed on the mounting plate 200, the water outlet end of the liquid pump 920 is fixedly communicated with one end of the second arc-shaped pipe 910. When the plurality of arc-shaped strips 400 are in a converging state, one end of the water outlet pipe 911 is in contact and communicated with one end of the corresponding single-pass sleeve 710. The single-pass sleeve 710 is provided with a first water outlet groove 711, and a plurality of second water outlet grooves 620 are circumferentially arranged on the limiting roller 600; When multiple arc-shaped bars 400 move and gather together, the single-pass sleeve 710 moves synchronously with the arc-shaped bars 400. When the multiple arc-shaped bars 400 are in the gathered state, the side of the semiconductor wafer is in contact and limited by multiple limiting rollers 600. And when the multiple arc-shaped bars 400 are in the gathered state, one end of the single-pass sleeve 710 is in contact and communicated with one end of the water outlet pipe 911. Under the action of the lifting assembly 300, the mounting plate 200 moves into the ultrasonic cleaning machine 100, so that the semiconductor wafer is immersed in the cleaning liquid and rotates unidirectionally as the limiting rollers 600 rotate. By the operation of the liquid pump 920, the cleaning liquid is pumped into the second arc-shaped pipe 910 and moves into the multiple water outlet pipes 911. The cleaning liquid enters the single-pass sleeve 710 along the connection between the water outlet pipe 911 and the single-pass sleeve 710 and is discharged from the first water outlet groove 711. During the rotation of the limiting rollers 600, multiple second water outlet grooves 620 on the surface are sequentially communicated with the first water outlet groove 711, and during the communication process, the cleaning liquid is discharged from the connection between the first water outlet groove 711 and the second water outlet groove 620, so that the outflow direction of the cleaning liquid remains unchanged all the time and is opposite to the rotation direction of the semiconductor wafer, and the side position of the semiconductor wafer is continuously washed under the action of the hydraulic liquid flow, preventing the pollutants remaining on the side of the semiconductor wafer from entering between the limiting rollers 600 and the semiconductor wafer during the rotation process.

[0023] As a further embodiment of the present invention, the lifting assembly 300 includes: A fixed frame 310, and the fixed frame 310 is fixedly connected to the top of the ultrasonic cleaning machine 100; An electric cylinder 320, the electric cylinder 320 is fixedly installed on the fixed frame 310, and the piston shaft of the electric cylinder 320 is fixedly connected to the top of the mounting plate 200; The output shaft of the electric cylinder 320 moves to drive the mounting plate 200 to move vertically downward, so that the mounting plate 200 moves into the ultrasonic cleaning machine 100 and performs immersion cleaning on the semiconductor wafer. When the output shaft of the electric cylinder 320 moves unidirectionally, the mounting plate 200 moves upward and returns to the initial position, thereby completing the cleaning of the semiconductor wafer.

[0024] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer cleaning device, comprising an ultrasonic cleaning machine (100), characterized in that, Further comprising: A mounting plate (200) is disposed above the ultrasonic cleaning machine (100). A lifting assembly (300) is connected to the mounting plate (200), and the lifting assembly (300) is used to drive the mounting plate (200) to perform lifting movement in the vertical direction; A plurality of arc-shaped strips (400) are circumferentially arranged on one side of the mounting plate (200). A gathering assembly (500) is connected to the arc-shaped strips (400). A plurality of limiting rollers (600) are provided on the concave side of each arc-shaped strip (400). A rotating assembly (700) is connected to the limiting rollers (600). After the gathering assembly (500) drives the arc-shaped strips (400) to gather towards the center of the mounting plate (200), the limiting rollers (600) are in contact with and limit the side of the semiconductor wafer, and the rotating assembly (700) is used to drive the plurality of limiting rollers (600) to rotate in the same direction; An air jet assembly (800) is disposed on the concave side of the arc-shaped strip (400), and the air jet assembly (800) is used to jet and remove dust from the contact position between the limiting rollers (600) and the side of the semiconductor wafer; A liquid guiding assembly (900) is disposed on the mounting plate (200). When the semiconductor wafer rotates in one direction, the liquid guiding assembly (900) is used to guide the cleaning liquid in the reverse direction at the side of the semiconductor wafer.

2. The semiconductor wafer cleaning device according to claim 1, wherein, The gathering assembly (500) includes: A plurality of sliding grooves (510) are circumferentially formed on the mounting plate (200); A plurality of sliding blocks (520) are slidably connected inside the corresponding sliding grooves (510), and the plurality of arc-shaped strips (400) are respectively fixedly connected to one side of the corresponding sliding blocks (520); A plurality of connecting rods (530) are respectively fixedly connected to the other side of the corresponding sliding blocks (520), and one end of each connecting rod (530) is fixedly connected with a circular pin (531); A first driving unit (540) is fixedly installed on the mounting plate (200). A guiding plate (541) is fixedly connected to the output shaft of the first driving unit (540). A plurality of inclined grooves (542) are circumferentially formed on the guiding plate (541), and one end of each circular pin (531) is located inside the corresponding inclined groove (542).

3. A semiconductor wafer cleaning device according to claim 1, wherein The rotating assembly (700) includes: A plurality of single-pass sleeves (710) are respectively rotatably connected inside the corresponding limiting rollers (600), and the single-pass sleeves (710) are fixedly connected to the corresponding arc-shaped strips (400); A plurality of mating gears (720) are fixedly connected to one end of the corresponding limiting rollers (600); An external toothed ring (730) is rotatably connected to the center of one side of the mounting plate (200). When the plurality of arc-shaped strips (400) are in a gathered state, the plurality of mating gears (720) are all meshed with the external toothed ring (730); The second driving unit (740) is fixedly installed on the mounting plate (200). A driving gear (741) is fixedly connected to the output shaft of the second driving unit (740), and the driving gear (741) is always engaged with the external gear ring (730).

4. A semiconductor wafer cleaning device according to claim 3, characterized in that, The jet component (800) includes: A plurality of nozzles (810), each of the plurality of nozzles (810) is fixedly connected to a corresponding arc-shaped strip (400), and the nozzles (810) are all inclined towards the corresponding limiting roller (600); A plurality of connecting pipes (820), each of the plurality of connecting pipes (820) is fixedly inserted into a corresponding arc-shaped strip (400). One end of the connecting pipe (820) is connected to a corresponding nozzle (810), and a check valve (821) is fixedly installed at the other end of the connecting pipe (820); A first arc-shaped pipe (830) is fixedly connected to the mounting plate (200). A plurality of hoses (831) are fixedly connected to the first arc-shaped pipe (830). One end of the hose (831) is fixedly connected to a sealing housing (832), and the sealing housing (832) is fixedly connected to a corresponding arc-shaped strip (400). One end of the connecting pipe (820) is located inside the corresponding sealing housing (832); An air pump (840) is fixedly installed on the mounting plate (200), and the exhaust end of the air pump (840) is fixedly connected to the first arc-shaped pipe (830).

5. A semiconductor wafer cleaning device according to claim 4, wherein Scrapers (610) are arranged on one side of each limiting roller (600). A connecting strip (611) is slidably connected to the top of the scraper (610), and the connecting strip (611) is fixedly connected to a corresponding arc-shaped strip (400). A circular rod (612) is fixedly connected to one side of the scraper (610). A plurality of guiding frames (613) are fixedly connected to the mounting plate (200), and guiding grooves (614) are formed in the guiding frames (613). One end of the circular rod (612) is located inside the corresponding guiding groove (614), and the guiding groove (614) includes a vertical section (6141) and an inclined section (6142).

6. A semiconductor wafer cleaning device according to claim 3, characterized in that, The liquid guiding component (900) includes: A second arc-shaped pipe (910) is fixedly connected to the mounting plate (200), and a plurality of water outlet pipes (911) are fixedly connected to the second arc-shaped pipe (910); A liquid pump (920) is fixedly installed on the mounting plate (200), and the water outlet end of the liquid pump (920) is fixedly connected to one end of the second arc-shaped pipe (910). When the plurality of arc-shaped strips (400) are in a gathered state, one end of the water outlet pipe (911) is in contact and connected to one end of a corresponding single-pass sleeve (710). A first water outlet groove (711) is formed in the single-pass sleeve (710), and a plurality of second water outlet grooves (620) are formed in the circumferential direction of the limiting roller (600).

7. A semiconductor wafer cleaning device according to claim 1, wherein, The lifting component (300) includes: A fixing frame (310) is fixedly connected to the top of the ultrasonic cleaning machine (100); Electric cylinder (320), the electric cylinder (320) is fixedly installed on the fixed frame (310), and the piston shaft of the electric cylinder (320) is fixedly connected to the top of the mounting plate (200).

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