Semiconductor device welding positioning device

Abstract

The invention belongs to the technical field of semiconductor production, and provides a semiconductor device welding positioning device which comprises a base, a rotating frame is rotationally installed on the base, a rotating power piece for driving the rotating frame to rotate is arranged on the base, the rotating frame is in an L shape, and an L-shaped placing plate is fixedly installed on the rotating frame; a moving plate for fixing a circuit board is arranged on the placing plate; a lifting plate is arranged on the placing plate, a first telescopic piece for driving the lifting plate to move up and down is fixedly mounted on the placing plate, and a plurality of groups of positioning pipes which are distributed in an array are mounted on the lifting plate in a sliding manner. Compared with the prior art, the positioning device has the beneficial effects that the positioning pipe moves downwards to position the position of the device, the weight of the positioning pipe is light, the pressure applied to the device is small, and the acting force applied to the device by the positioning pipe is in the vertical direction, so that the device is prevented from being pushed to move transversely; and the position accuracy of the device on the circuit board is ensured.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production, and particularly relates to a welding positioning device for semiconductor devices. Background Art

[0002] The circuit board welding of semiconductor devices generally includes patch welding and pin welding respectively. When welding pins, generally, the components are inserted into the wiring holes for preliminary fixing, and then the circuit board is flipped, and welding is performed from the side of the circuit board far from the components through a soldering iron and solder at the position of the pin wiring.

[0003] When the number of components is large and the size difference is large, generally, welding needs to be carried out one by one. The fixing strength of the components after being inserted into the wiring holes is weak, and directly flipping the circuit board will cause some components to fall off from the wiring holes, affecting the welding efficiency. For the above technical problems, in the Chinese patent with the patent publication number CN119187764B, after the circuit board is installed during use, the airbag is inflated, and the devices on the circuit board are pressed and fixed by the expansion of the airbag. However, since the airbag is made of soft material, it needs to be filled with internal gas to produce a fixing effect. After the airbag is filled, the pressure on the devices is large, which will push the devices to move in the wiring holes on the circuit board, so that the length of the device connection antenna extending out of the circuit board changes, resulting in contact between the device and the circuit board and affecting subsequent use. Summary of the Invention

[0004] The purpose of the present invention is to provide a welding positioning device for semiconductor devices, aiming to solve the technical problem that the position of the device cannot be stably positioned in the prior art.

[0005] The present invention is realized as follows. A welding positioning device for semiconductor devices includes a base. A rotating frame is rotatably installed on the base, and a rotating power member for driving the rotating frame to rotate is provided on the base. The rotating frame is L-shaped, and an L-shaped placement plate is fixedly installed on the rotating frame. A moving plate for fixing the circuit board is provided on the placement plate. A lifting plate is provided on the placement plate, and a first telescopic member for driving the lifting plate to move up and down is fixedly installed on the placement plate. A plurality of groups of positioning tubes distributed in an array are slidably installed on the lifting plate. A first iron sheet is fixedly installed at one end of the positioning tube away from the placement plate. The lifting plate is provided with a fixing plate for fixing the positioning tubes.

[0006] Further technical solution: A plurality of groups of guide plates are fixedly installed on the placement plate at parallel intervals. The moving plate is slidably installed on the guide plates. The cross-section of the moving plate is T-shaped, and the upper surface of the horizontal section of the moving plate is flush with the upper surface of the placement plate. An adjusting screw for driving the moving plate to move is rotatably installed on the placement plate.

[0007] Further technical solution: A sliding groove is formed in the moving plate, a limiting plate is slidably installed in the sliding groove, the limiting plate penetrates the moving plate, and fixing screws are arranged on the limiting plate.

[0008] Further technical solution: Two groups of guiding frames are fixedly installed on the lifting plate. The guiding frames are located on both sides of the distribution area of the positioning tubes. A moving frame is slidably installed on the guiding frames, a fixing plate is fixedly installed in the moving frame, and a second telescopic member for driving the moving frame to move is fixedly installed on the lifting plate.

[0009] Further technical solution: A plurality of groups of fixing plates are provided, and the fixing plates and the rows of positioning tubes are distributed at intervals.

[0010] Further technical solution: A substrate is fixedly installed on the rotating frame. The substrate is made of magnetic material. A plurality of groups of fixed tubes arranged in an array are slidably installed on the substrate. The positions of the fixed tubes correspond to the positions of the positioning tubes one by one. Electromagnets are fixedly installed in the fixed tubes. The electromagnets are distributed along the length direction of the fixed tubes. One end of the electromagnet close to the lifting plate is flush with the end of the fixed tube.

[0011] Further technical solution: An airbag is fixedly installed at one end of the fixed tube away from the lifting plate. The airbag is filled with gas, and the buoyancy generated by the gas filled in the airbag and the gravity of the fixed tube and its upper structure are set with a set difference, and the buoyancy generated by the gas filled in the airbag is small.

[0012] Further technical solution: A plurality of L-shaped brackets are fixedly installed at one end of the fixed tube close to the lifting plate. An L-shaped limiting frame is arranged on the bracket. The limiting frame is used in cooperation with the connecting groove formed in the first iron sheet. When the electromagnet is energized, it drives the limiting frame to move into the connecting groove.

[0013] Further technical solution: An elastic cord is fixedly connected to the limiting frame. One end of the elastic cord away from the limiting frame is fixedly connected to the end of the bracket. A support rod pointing to the fixed tube is fixedly installed on the limiting frame, and a second iron sheet is fixedly installed at the end of the support rod.

[0014] Further technical solution: An installation frame is fixedly installed on the substrate, and a plurality of cameras for detecting the position of the fixed tube are fixedly installed on the installation frame.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. After the circuit board is installed, the position of the device is positioned by moving the positioning tube downward. Since the positioning tube is light in weight, the pressure exerted on the device is small, avoiding applying a large force to the device to push it to move. Moreover, the force exerted by the positioning tube on the device is in the vertical direction, preventing the device from being pushed to shift horizontally, ensuring the accuracy of the device's position on the circuit board, improving the quality of subsequent soldering. After the positioning tube is fixed by the fixing plate, the positioning tube will not exert an additional force on the device on the circuit board during subsequent use, further improving the stability and accuracy of the device's position. During soldering, both the circuit board and the device are supported by the positioning tube. Since the positioning tube is fixed, the circuit board and the device can maintain a stable static state, further improving the stability of the positions of the circuit board and the device and enhancing the soldering quality.

[0016] 2. When the positioning of the device by the positioning tube is completed, the electromagnet in the corresponding fixing tube is simultaneously energized. Under the action of the magnetic force, the first iron sheet is connected to the fixing tube. Since the fixing tube is fixed to the substrate by the magnetic force, the positioning tube is in a fixed state, realizing the early fixation of the positioning tube that has completed the positioning function during the positioning process. The frictional force generated by the subsequent downward movement of the lifting plate on the positioning tube is offset by the fixation of the fixing tube to the substrate, ensuring the stability of the positioning tube's position, further reducing the pressure of the positioning tube on the device, guaranteeing the accuracy of the device's position on the circuit board, and further improving the soldering quality. Subsequently, the positioning tube can be fixed again by the fixing plate to achieve double fixation of the positioning tube, further improving the stability and accuracy of the device's position on the circuit board.

[0017] 3. After the electromagnet in the corresponding fixing tube is energized, it will adsorb the first iron sheet and the second iron sheet. The preliminary connection between the fixing tube and the first iron sheet is achieved by the electromagnet adsorbing the first iron sheet. Then, under the action of the magnetic force, the second iron sheet moves towards the fixing tube. The second iron sheet drives the limiting frame to move and stretches the elastic wire through the support rod, enabling the limiting frame to enter the connection groove, realizing the stable mechanical connection between the fixing tube and the first iron sheet, and further enabling the stable connection between the fixing tube and the positioning tube, improving the stability of the connection between the fixing tube and the positioning tube, and thus enhancing the stability of the positioning tube for positioning the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 It is a schematic diagram of the rotating frame in the present invention.

[0020] Figure 3 It is a schematic diagram of the lifting plate in the present invention.

[0021] Figure 4 is Figure 2 an enlarged schematic diagram of area A1 in

[0022] Figure 5 For Figure 3 an enlarged schematic view of area A2 in

[0023] Figure 6 a schematic structural view of the substrate in the present invention.

[0024] Figure 7 a schematic structural view of the fixing tube in the present invention.

[0025] Figure 8 For Figure 6 an enlarged schematic view of area A3 in

[0026] Figure 9 For Figure 7 an enlarged schematic view of area A4 in

[0027] In the drawings: 1, base; 2, rotating frame; 3, rotating power member; 4, placing plate; 5, guide plate; 6, moving plate; 7, adjusting screw; 8, sliding groove; 9, limiting plate; 10, first telescopic member; 11, lifting plate; 12, positioning tube; 13, first iron sheet; 14, connecting groove; 15, moving frame; 16, second telescopic member; 17, fixing plate; 18, guiding frame; 19, substrate; 20, fixing tube; 21, airbag; 22, electromagnet; 23, bracket; 24, limiting frame; 25, elastic cord; 26, support rod; 27, second iron sheet; 28, mounting frame; 29, camera. Detailed implementation manners

[0028] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0029] The following describes in detail the specific implementation of the present invention with reference to specific embodiments.

[0030] As Figures 1-9 shown, a semiconductor device welding positioning device provided by the present invention includes a base 1, a rotating frame 2 is rotatably installed on the base 1, and a rotating power member 3 for driving the rotating frame 2 to rotate is arranged on the base 1. The rotating frame 2 is L-shaped, and an L-shaped placing plate 4 is fixedly installed on the rotating frame 2. A moving plate 6 for fixing a circuit board is arranged on the placing plate 4. A plurality of groups of parallel and spaced guide plates 5 are fixedly installed on the placing plate 4. The moving plate 6 is slidably installed on the guide plates 5. The cross-section of the moving plate 6 is T-shaped, and the upper surface of the horizontal section of the moving plate 6 is flush with the upper surface of the placing plate 4. An adjusting screw 7 for driving the moving plate 6 to move is rotatably installed on the placing plate 4. A sliding groove 8 is formed in the moving plate 6, and a limiting plate 9 is slidably installed in the sliding groove 8. The limiting plate 9 penetrates through the moving plate 6 and a fixing screw is arranged on the limiting plate 9; A lifting plate 11 is arranged on the placing plate 4, and a first telescopic member 10 for driving the lifting plate 11 to move up and down is fixedly installed on the placing plate 4. A plurality of groups of positioning tubes 12 distributed in an array are slidably installed on the lifting plate 11. A first iron sheet 13 is fixedly installed at one end of the positioning tube 12 away from the placing plate 4. The lifting plate 11 is provided with a fixing plate 17 for fixing the positioning tube 12. Two groups of guiding frames 18 are fixedly installed on the lifting plate 11. The guiding frames 18 are located on both sides of the distribution area of the positioning tubes 12. A moving frame 15 is slidably installed on the guiding frames 18. The fixing plate 17 is fixedly installed in the moving frame 15. A second telescopic member 16 for driving the moving frame 15 to move is fixedly installed on the lifting plate 11. There are multiple groups of fixing plates 17, and the fixing plates 17 and the row of positioning tubes 12 are distributed at intervals.

[0031] In actual application of this embodiment, the circuit board with the device to be welded is placed on the placing plate 4, and a corner of the circuit board is made to contact the rotating frame 2, so that the device on the circuit board is located above the circuit board. The moving plate 6 is driven to move by adjusting the screw rod 7, so that the horizontal section of the moving plate 6 moves to the lower side of the circuit board until the vertical section of the moving plate 6 contacts the side of the circuit board. Then the limiting plate 9 is moved to contact the other side of the circuit board and fixed by the fixing screw. At this time, the installation of the circuit board is completed. The circuit board is supported by the moving plate 6 and the placing plate 4, and at the same time, the fixing and positioning of the circuit board are completed by the rotating frame 2, the moving plate 6 and the limiting plate 9. In the initial state, the lifting plate 11 is at the highest position, and the first iron sheet 13 contacts the lifting plate 11. Then the first telescopic member 10 drives the lifting plate 11 to move downward. The downward movement of the lifting plate 11 drives the positioning tubes 12 to move synchronously. Since the multiple groups of positioning tubes 12 are densely distributed, the upper surface of the device on the circuit board will contact one or more groups of positioning tubes 12 after the positioning tubes 12 descend. When the lower end of the positioning tube 12 contacts the device on the circuit board, this group of positioning tubes 12 will no longer continue to move downward. At this time, the lifting plate 11 continues to move downward until other positioning tubes 12 contact the circuit board and the first iron sheet 13 disengages from the lifting plate 11. At this time, the second telescopic member 16 drives the moving frame 15 to move so that the fixing plate 17 abuts against the corresponding row of positioning tubes 12, thereby realizing the fixation of the positioning tubes 12. Since the positioning tubes 12 are light in weight, the pressure exerted on the device is small, avoiding generating a large acting force on the device to push the device to move. Moreover, the acting force exerted by the positioning tubes 12 on the device is in the vertical direction, avoiding pushing the device to shift horizontally, ensuring the accuracy of the position of the device on the circuit board, improving the quality of subsequent welding. And after the positioning tubes 12 are fixed by the fixing plate 17, the positioning tubes 12 will no longer exert an additional acting force on the device on the circuit board during subsequent use, further improving the stability and accuracy of the position of the device. After the positioning tube 12 is fixed, the rotating power member 3 drives the rotating frame 2 to rotate 180 degrees, causing the circuit board to flip. At this time, the device can be welded to the circuit board through the welding equipment. During welding, both the circuit board and the device are supported by the positioning tube 12. Since the positioning tube 12 is fixed, the circuit board and the device can maintain a stable static state, further improving the stability of the positions of the circuit board and the device and enhancing the welding quality. After welding is completed, the rotating frame 2 is reset. Then, the fixing of the positioning tube 12 by the fixing plate 17 is released. Subsequently, the first telescopic member 10 drives the lifting plate 11 to reset upward, and the welded circuit board is removed and a new circuit board is replaced to continue the welding operation.

[0032] In an example of this embodiment, the rotating power member 3 is a motor. Of course, it can also be other components such as a hydraulic motor that can output rotational power. The motor drives the rotating frame 2 to rotate to achieve the flipping of the circuit board. The first telescopic member 10 and the second telescopic member 16 are respectively a first electric telescopic rod and a second electric telescopic rod. Of course, they can also be other components such as a hydraulic cylinder that can actively change in length. The first electric telescopic rod drives the lifting plate 11 to move up and down, and the second electric telescopic rod drives the fixing plate 17 to move.

[0033] As Figures 1-9 shown, a semiconductor device welding positioning device provided by the present invention. A substrate 19 is fixedly installed on the rotating frame 2. The substrate 19 is made of a magnetic material. A plurality of fixed tubes 20 distributed in an array are slidably installed on the substrate 19. The positions of the fixed tubes 20 correspond to the positions of the positioning tubes 12 one by one. An electromagnet 22 is fixedly installed in the fixed tube 20. The electromagnet 22 is distributed along the length direction of the fixed tube 20. One end of the electromagnet 22 close to the lifting plate 11 is flush with the end of the fixed tube 20.

[0034] Specifically, an airbag 21 is fixedly installed at one end of the fixed tube 20 away from the lifting plate 11. The airbag 21 is filled with gas, and the buoyancy generated by the gas filled in the airbag 21 has a set difference from the gravity of the fixed tube 20 and its upper structures. The buoyancy generated by the gas filled in the airbag 21 is relatively small.

[0035] Specifically, a plurality of L-shaped brackets 23 are fixedly installed at one end of the fixed tube 20 close to the lifting plate 11. An L-shaped limiting frame 24 is arranged on the bracket 23. The limiting frame 24 is used in cooperation with the connecting groove 14 opened on the first iron sheet 13. When the electromagnet 22 is energized, it drives the limiting frame 24 to move into the connecting groove 14.

[0036] Specifically, an elastic wire 25 is fixedly connected to the limiting frame 24. One end of the elastic wire 25 away from the limiting frame 24 is fixedly connected to the end of the bracket 23. A support rod 26 pointing to the fixed tube 20 is fixedly installed on the limiting frame 24. A second iron sheet 27 is fixedly installed at the end of the support rod 26.

[0037] Specifically, a mounting bracket 28 is fixedly installed on the substrate 19, and multiple cameras 29 for detecting the position of the fixed tube 20 are fixedly installed on the mounting bracket 28.

[0038] In actual application of this embodiment, in the initial state, the electromagnet 22 is powered off, and the lower end of the fixed tube 20 contacts the first iron sheet 13. The moving state of the fixed tube 20 is photographed by the camera 29 to detect whether the fixed tube 20 moves downward. When the lifting plate 11 moves downward, the fixed tube 20 moves downward synchronously with the corresponding positioning tube 12. The buoyancy generated by the gas in the airbag 21 offsets the weight of the fixed tube 20 and its upper structure, so that the pressure of the fixed tube 20 on the first iron sheet 13 reaches a set value, ensuring that the pressure generated on the device after the positioning tube 12 contacts the device is small enough to prevent the device from generating displacement. When the positioning tube 12 contacts the device, at this time, this group of positioning tubes 12 no longer move downward, and at the same time, the fixed tube 20 maintains a fixed height. After the camera 29 photographs and detects that the height of the upper end of the fixed tube 20 remains unchanged, the electromagnet 22 is powered on. After the electromagnet 22 is powered on, under the action of magnetic force, the fixed tube 20 is fixed on the substrate 19. At this time, the position of the fixed tube 20 is fixed, and at the same time, the electromagnet 22 also adsorbs the first iron sheet 13 and the second iron sheet 27. The initial connection between the fixed tube 20 and the first iron sheet 13 is realized by the electromagnet 22 adsorbing the first iron sheet 13. Then, under the action of magnetic force, the second iron sheet 27 moves towards the direction close to the fixed tube 20. The second iron sheet 27 drives the limiting frame 24 to move and stretch the elastic cord 25 through the support rod 26, so that the limiting frame 24 enters the connection groove 14, and the stable mechanical connection between the fixed tube 20 and the first iron sheet 13 is realized through the limiting frame 24, and further the stable connection between the fixed tube 20 and the positioning tube 12 is realized. Since the fixed tube 20 is fixed on the substrate 19 by magnetic force, the positioning tube 12 is in a fixed state, realizing the early fixation of the positioning tube 12 that has completed the positioning function during the positioning process. The friction force generated by the subsequent downward movement of the lifting plate 11 on the positioning tube 12 is offset by the fixation of the fixed tube 20 and the substrate 19, ensuring the stability of the position of the positioning tube 12, further reducing the pressure of the positioning tube 12 on the device, ensuring the accuracy of the position of the device on the circuit board, and further improving the welding quality. Subsequently, the positioning tube 12 can be fixed again through the fixing plate 17 to realize the double fixation of the positioning tube 12, further improving the stability and accuracy of the position of the device on the circuit board.

[0039] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

[0040] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment contains only an independent technical solution. This narrative style of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in various embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor device welding positioning device, comprising a base (1), characterized in that, The base (1) is rotatably installed with a rotating frame (2), and a rotating power member (3) for driving the rotation of the rotating frame (2) is arranged on the base (1). The rotating frame (2) is L-shaped, and an L-shaped placing plate (4) is fixedly installed on the rotating frame (2). A moving plate (6) for fixing the circuit board is arranged on the placing plate (4). An elevating plate (11) is arranged on the placing plate (4), and a first telescopic member (10) for driving the elevating plate (11) to move up and down is fixedly installed on the placing plate (4). A plurality of groups of positioning tubes (12) distributed in an array are slidably installed on the elevating plate (11). A first iron sheet (13) is fixedly installed at one end of the positioning tube (12) away from the placing plate (4). The elevating plate (11) is provided with a fixing plate (17) for fixing the positioning tube (12).

2. The semiconductor device welding positioning device according to claim 1, characterized in that A plurality of groups of parallel and spaced guide plates (5) are fixedly installed on the placing plate (4). The moving plate (6) is slidably installed on the guide plates (5). The cross section of the moving plate (6) is T-shaped, and the upper surface of the horizontal section of the moving plate (6) is flush with the upper surface of the placing plate (4). An adjusting screw (7) for driving the moving plate (6) to move is rotatably installed on the placing plate (4).

3. A semiconductor device welding positioning device according to claim 2, characterized in that, A sliding groove (8) is formed in the moving plate (6), and a limiting plate (9) is slidably installed in the sliding groove (8). The limiting plate (9) penetrates through the moving plate (6), and fixing screws are arranged on the limiting plate (9).

4. A semiconductor device welding positioning device according to claim 1, wherein, Two groups of guide frames (18) are fixedly installed on the elevating plate (11). The guide frames (18) are located on both sides of the distribution area of the positioning tubes (12). A moving frame (15) is slidably installed on the guide frames (18). The fixing plate (17) is fixedly installed in the moving frame (15). A second telescopic member (16) for driving the moving frame (15) to move is fixedly installed on the elevating plate (11).

5. A semiconductor device welding positioning device according to claim 4, characterized in that, A plurality of groups of fixing plates (17) are provided, and the fixing plates (17) are distributed at intervals from the row of positioning tubes (12).

6. The semiconductor device soldering and positioning device according to claim 1, wherein A substrate (19) is fixedly installed on the rotating frame (2). The substrate (19) is made of a magnetic material. A plurality of groups of fixing tubes (20) distributed in an array are slidably installed on the substrate (19). The positions of the fixing tubes (20) correspond to the positions of the positioning tubes (12) one by one. Electromagnets (22) are fixedly installed in the fixing tubes (20). The electromagnets (22) are distributed along the length direction of the fixing tubes (20). One end of the electromagnet (22) close to the elevating plate (11) is flush with the end of the fixing tube (20).

7. A semiconductor device welding positioning device according to claim 6, characterized in that, An airbag (21) is fixedly installed at one end of the fixing tube (20) away from the elevating plate (11). The airbag (21) is filled with gas, and the buoyancy generated by the gas filled in the airbag (21) has a set difference from the gravity of the fixing tube (20) and its upper structure.

8. A semiconductor device welding positioning device according to claim 7, characterized in that, A plurality of groups of L-shaped brackets (23) are fixedly installed at one end of the fixing tube (20) close to the elevating plate (11). An L-shaped limiting frame (24) is arranged on the bracket (23). The limiting frame (24) is used in cooperation with a connecting groove (14) formed in the first iron sheet (13). When the electromagnet (22) is energized, it drives the limiting frame (24) to move into the connecting groove (14).

9. A semiconductor device welding positioning device according to claim 8, characterized in that, A elastic cord (25) is fixedly connected to the limiting frame (24), one end of the elastic cord (25) far from the limiting frame (24) is fixedly connected to the end of the bracket (23), a support rod (26) pointing to the fixed tube (20) is fixedly installed on the limiting frame (24), and a second iron sheet (27) is fixedly installed at the end of the support rod (26).

10. A semiconductor device welding positioning device according to claim 6, characterized in that, A mounting frame (28) is fixedly installed on the substrate (19), and multiple cameras (29) for detecting the position of the fixed tube (20) are fixedly installed on the mounting frame (28).

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