Preparation method and application of novel carbon fiber electroplating single-layer polymerization functional spherical abrasive diamond wire

Abstract

The invention discloses a preparation method and application of a novel carbon fiber electroplating single-layer polymerization functional spherical abrasive diamond wire, the diamond wire is of a coating structure and is composed of a carbon fiber bus and a single-layer polymerization piezoelectric and thermoelectric spherical abrasive plated on the surface of the carbon fiber bus, the polymeric abrasive mainly comprises superhard micro powder or a piezoelectric material or a thermoelectric material and a binding agent; the binding agent is a high polymer material. The preparation method comprises the steps that in the circulating routing process of a metal bus substrate, polymeric spherical functional abrasive plating is achieved, and the single-layer polymeric functional spherical abrasive diamond wire is prepared; the cutting tool is used for cutting high-hardness and high-brittleness semiconductor crystal bars, and the Mohs hardness of the high-hardness and high-brittleness semiconductor crystal bars exceeds 8.5. The diamond wire has excellent mechanical strength and self-sharpening characteristics, the machining quality and the production efficiency are greatly improved, and meanwhile the application range and the technical boundary of a traditional diamond wire are expanded.

Description

Technical Field

[0001] The present invention relates to the technical field of high-performance cutting tools, and specifically refers to a preparation method and application of a novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire. Background Art

[0002] Diamond wire saws are widely used in the cutting of photovoltaic silicon crystals, integrated circuit silicon crystals, SiC, sapphire, etc.

[0003] Different from traditional saw blades and slurry wire cutting technologies, diamond wires greatly reduce the risks during the processing and the price cost due to their high cutting efficiency and high wire saw quality characteristics. Moreover, their stable cutting process can bring a relatively flat surface to the cut parts, thereby reducing the duration of subsequent processing for specific requirements.

[0004] Currently, electroplating technology is usually used to achieve the deposition and plating of single-crystal diamond micropowder particles on a bus bar substrate (carbon steel wire or tungsten steel wire). Generally, the geometric diameter of single-crystal diamond micropowder is 3 - 20 μm, the geometric diameter of the bus bar substrate is 20 - 40 μm, the coating thickness is 10 - 30 μm, and the plating rate of diamond micropowder is 40% - 60%.

[0005] To improve product quality and increase product usage efficiency, Patent CN116043308A discloses a preparation method of a diamond wire saw, the main feature of which is the invention of a bus bar substrate with corrosion resistance, but it cannot meet the development trend of the increasingly strict industry for refined wire saws to obtain workpieces with ultra-thin dimensions and ultra-high surface quality. To meet the requirements of large-size and thin-sheet workpieces, Patent CN115138701A discloses a preparation method of an ultra-fine diamond wire bus bar. Although it reduces the diameter of the diamond wire by reducing the diameter of the metal wire, it is prone to wire breakage, especially after increasing the wire cutting speed. Patent CN116238057A discloses a composite electroplated single-layer polymer abrasive diamond wire, a preparation method, a device and an application method, the characteristics of which are that the prepared product has a small diameter, the method is simple, the device is simple, it is applied to cutting processing, has less consumption and a long service life. Summary of the Invention

[0006] I. Technical Problems to be Solved

[0007] The technical problem to be solved by the present invention is various problems mentioned in the above background art, and provides a preparation method and application of a novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire.

[0008] II. Technical Solutions

[0009] To solve the above technical problems, the technical solution provided by the present invention is as follows: A novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire, characterized in that the diamond wire has a coating structure, which is composed of a bus bar matrix and a single-layer polymer piezoelectric and thermoelectric spherical abrasive plated on its surface. The bus bar matrix is a modified carbon fiber with a diameter between 20 and 40 μm. The polymer spherical material is composed of superhard micropowder, piezoelectric material, thermoelectric material and polymer binder. The particle size of the functional abrasive is 1 to 10 μm, the particle size of the superhard micropowder is 0.5 to 10 μm, and the content of the superhard micropowder accounts for 25 to 75% of the total mass of the superhard micropowder and the binder powder. The polymer binder is selected from resin matrices with a purity ≥ 99%, including urea-formaldehyde resin, epoxy resin, polyvinyl alcohol PVA or polyvinylpyrrolidone PVP. The volume fraction ratio of the polymer binder to the polymer functional abrasive is 3:7 to 5:5. The mass fraction ratio of the superhard micropowder to the functional abrasive is 9:1 to 7:3.

[0010] As an improvement, the preparation method of the polymer functional abrasive is as follows:

[0011] a. Mixing: Using the mechanical dry powder mixing method, the superhard micropowder and the functional abrasive micropowder are fully mixed for 8 h. The particle size of the superhard micropowder is one or more of 0.1 μm, 0.2 μm, 0.5 μm, 1 μm, 2 μm, 5 μm, 10 μm. The functional abrasive is one or more of piezoelectric materials or thermoelectric materials.

[0012] b. Green body forming: Take out the mixed powder, add the polymer resin matrix binder to the mixed powder, and then use the atmospheric pressure mechanical pressure method or the hot pressing method to make a green body. The binder is urea-formaldehyde resin, or one of epoxy resin, polyvinyl alcohol PVA, polyvinylpyrrolidone PVP. The mass of the binder is 1 to 10% of the mass of the mixed powder.

[0013] c. Atomization granulation: The green body is sintered, atomized and crushed, and classified to obtain the polymer functional abrasive.

[0014] As an improvement, the preparation method of the polymer functional abrasive is as follows:

[0015] a. Matrix synthesis: Using the organic synthesis method, the monomer raw materials of the resin matrix are heated in a water bath for 1.5 h, and after the reaction is completed, it is cooled and reserved.

[0016] b. Mixing: Using the mechanical dry powder mixing method, the superhard micropowder and the functional abrasive micropowder are fully mixed for 8 h. The particle size of the superhard micropowder is one or more of 0.1 μm, 0.2 μm, 0.5 μm, 1 μm, 2 μm, 5 μm, 10 μm. The functional abrasive is a mixed powder of piezoelectric material and thermoelectric material, and the mass ratio is 5:1 to 1:1.

[0017] c. Preparation of composite prepolymer: Add the mixed abrasive as in step b into the resin matrix, and the mass fraction ratio of the mixed abrasive to the resin matrix is 4:6 to 6:4.

[0018] d. Preparation of emulsifying dispersant: Select one of dimethylformamide, methyl cyclohexanone, acetic anhydride, and dimethyl sulfoxide as the emulsifier, and select one of sodium tripolyphosphate, sodium hexametaphosphate, sodium pyrophosphate, and sodium dodecyl sulfate as the dispersant. Mix them evenly, and the volume fraction ratio of the emulsifier to the dispersant is 7:3 to 9:1.

[0019] e. Emulsification and dispersion of core material: Dropwise add the resin matrix mixture prepared in step c into step d, and disperse it at a high speed with an electric stirrer at a certain temperature for 40 min. After the core material is completely dispersed into fine emulsion droplets, transfer it to a low speed dispersion for a period of time at room temperature. The high speed range of the stirrer is 1000 rpm to 1500 rpm, and the low speed range is 300 rpm to 500 rpm; the proportion of the core material in the emulsifying dispersant is 3.5%.

[0020] f. Granulation: Filter the suspension obtained in step e by suction, dry it, and screen it to obtain functional polymeric abrasive.

[0021] As an improvement, the embedding depth of the polymeric abrasive is 35 to 60% of the particle size of the polymeric abrasive.

[0022] As an improvement, for the preparation method of a new type of carbon fiber electroplated single-layer polymeric functional spherical abrasive diamond wire, the preparation method of the diamond wire is as follows: Adopt a double-roller type to fix the electroplating area, fix both ends of the diamond wire busbar matrix to the positive and negative electrodes of the power supply, and electroplate the polymeric functional abrasive on the busbar matrix through the rollers; the wire running speed is 15 to 20 mm / min, and the current density is 12 to 20 kA / m 2 , and the rotational speed of the double rollers is 300 rpm to 450 rpm.

[0023] As an improvement, the preparation method further includes activating and sensitizing the diamond wire busbar matrix and the polymeric functional abrasive, and the activation and sensitization formula is: PdCl2, SnCl2, H2O, HCl or PdCl2, SnCl2, Na2SnO3·3H2O, H2O, HCl or HAuCl4·H2O, Na2SnO3·3H2O, H2O, HCl or H2PtCl6, SnCl2, Na2SnO3·3H2O, H2O, HCl.

[0024] As an improvement, the preparation method further includes post-treatment of the diamond wire after electroplating the diamond wire busbar matrix. The post-treatment specifically includes ultrasonic cleaning, drying, and hydrogen removal of the diamond wire in sequence.

[0025] As an improvement, it is used for the cutting process of high-hard and brittle semiconductor wafers, and the Mohs hardness of the high-hard and brittle semiconductor wafers exceeds 8.5.

[0026] III. Beneficial Effects

[0027] The advantages of the present invention compared with the prior art are as follows:

[0028] The preparation method of a novel carbon fiber electroplated single-layer polymer-functional spherical abrasive diamond wire of the present invention successfully manufactures a diamond wire with high cutting performance by adopting a specific composition combination (superhard micropowder, piezoelectric material, thermoelectric material, and polymer binder) and a unique preparation process. Only a single layer of electroplated polymer spherical abrasive is applied on the surface of the diamond wire. The single-layer electroplated polymer spherical abrasive with a smaller particle size effectively improves the cutting efficiency. The self-trimming performance brings convenience for cost saving. The application of the functional abrasive can effectively reduce the hardness of the material for auxiliary cutting and reduce the coating thickness, thus possessing excellent mechanical strength and self-sharpening characteristics. In addition, its optimized coating structure and precisely controlled embedding depth (35-60% of the polymer abrasive particle size) make the diamond wire more stable and efficient during the cutting process and can significantly reduce the risk of wear and fracture. In addition, by activating and sensitizing the bus bar substrate and the polymer-functional abrasive, the electroplating effect is further enhanced, ensuring good bonding between the polymer abrasive and the bus bar substrate. Finally, this novel diamond wire is particularly suitable for the fine cutting process of high-hard and brittle semiconductor wafers with a Mohs hardness exceeding 8.5, showing a low wire consumption (0.9-2.4 m / kg) and excellent cutting efficiency, greatly improving the processing quality and production efficiency, while expanding the application scope and technical boundary of traditional diamond wires. Description of the Drawings

[0029] Figure 1 is the preparation flow chart of a novel carbon fiber electroplated single-layer polymer-functional spherical abrasive diamond wire of the present invention.

[0030] Figure 2 is the preparation flow chart of the polymer abrasive of a novel carbon fiber electroplated single-layer polymer-functional spherical abrasive diamond wire of the present invention;

[0031] Figure 3 is the preparation flow chart of the bus bar substrate of a novel carbon fiber electroplated single-layer polymer-functional spherical abrasive diamond wire of the present invention;

[0032] Figure 4 is the microscopic morphology diagram of the functional spherical abrasive of a novel carbon fiber electroplated single-layer polymer-functional spherical abrasive diamond wire of the present invention.

[0033] Figure 5 is the first microscopic morphology diagram after plating of a novel carbon fiber electroplated single-layer polymer-functional spherical abrasive diamond wire of the present invention.

[0034] Figure 6 This is the second micro-morphology after plating of the novel carbon fiber electroplated monolayer polymer functional spherical abrasive diamond wire of the present invention. Specific Embodiments

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments; based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Combined with the attached Figure 1 — attached Figure 6 A novel carbon fiber electroplated monolayer polymer functional spherical abrasive diamond wire has a coating structure and consists of a bus bar matrix and a monolayer polymer piezoelectric and thermoelectric spherical abrasive plated on its surface. The polymer spherical abrasive has a self-sharpening multi-micro-edge structure, and micro-crushing can be achieved during the processing. The functions include force-induced power generation and heat-induced power generation; the polymer abrasive is mainly composed of super-hard micropowder, piezoelectric material or thermoelectric material and a binder; the binder is selected from polymer materials, and the bus bar matrix is a modified carbon fiber with a diameter between 20 and 40 μm, or modified nylon, or ultra-high molecular weight polyethylene; the particle size of the functional abrasive is between 1 and 10 μm; the particle size of the super-hard micropowder is between 0.5 and 10 μm, and the content of the super-hard micropowder is 25 to 75% of the total mass of the super-hard micropowder and the binder powder; the polymer binder is selected from resin matrices, which are urea-formaldehyde resin, or epoxy resin, or epoxy resin, or polyvinyl alcohol PVA, or polyvinylpyrrolidone (PVP), and the purity of the used resin matrix binder is ≥99%.

[0037] In actual use, the polymer functional abrasive is a super-hard micropowder mixed with functional materials, such as force-induced discharge materials and heat-induced discharge materials. The super-hard micropowder is one or more of single-crystal diamond, polycrystalline diamond and cubic boron nitride, and is mixed with a piezoelectric material, such as lithium niobate (LiNbO3), lithium tantalate (LiTaO3), sodium bismuth titanate (BNT), barium titanate (BaTiO3), calcium silicate (CaSiO3), lanthanum lead zirconate titanate (PLZT), etc.; or mixed with a thermoelectric material: bismuth telluride (Bi2Te3), tin selenide (SnSe), etc.; the volume fraction ratio of the binder to the polymer functional abrasive is 3:7 to 5:5; the mass fraction ratio of the super-hard micropowder to the functional abrasive is 9:1 to 7:3.

[0038] The following are specific embodiments of the present invention:

[0039] Example 1

[0040] A novel carbon fiber electroplated monolayer polymer spherical abrasive diamond wire, the specific steps are as follows:

[0041] (1) Raw materials:

[0042] Busbar substrate: carbon fiber with a diameter of 20μm;

[0043] Superhard micropowder: single crystal diamond with an average particle size of 0.5μm;

[0044] Functional micropowder: a mixture of piezoelectric powder and thermoelectric powder in a mass ratio of 1:1, wherein the piezoelectric powder is barium titanate (BaTiO3) with an average particle size of 0.1 μm, and the thermoelectric powder is bismuth telluride (Bi2Te3) with an average particle size of 0.1 μm;

[0045] Binder: urea-formaldehyde resin;

[0046] (2) Preparation of polymerized functional abrasive (in-situ polymerization method):

[0047] ① Urea-formaldehyde resin synthesis: urea and formaldehyde are synthesized with deionized water according to conventional methods;

[0048] ② Take the resin synthesized in step ① and mix it thoroughly with superhard micropowder and functional micropowder, and put it into a constant pressure burette for use, wherein the mass ratio of binder to superhard micropowder is 1:1, and the mass ratio of superhard micropowder to functional micropowder is 5:1;

[0049] ③ Add urea-formaldehyde resin solvent, emulsifier and dispersant into a three-necked flask and stir magnetically for later use. The ratio of emulsifier to dispersant is 7:3.

[0050] ④ Add the mixed solution of step ② dropwise into the three-necked flask of step ③;

[0051] ⑤ Adjust the pH of the mixture in step ④ to ≤ 3 with citric acid and react for 3 hours;

[0052] ⑥ Filter and wash the prepared polymer functional abrasive with deionized water until it is neutral, and then dry.

[0053] The prepared polymer functional abrasive has high sphericity, uniform distribution of surface cutting edges, and automatic exposure of deep cutting edges after surface cutting edges are worn, so it has good self-sharpening properties and an average particle size of 10 μm.

[0054] (2) Preparation of carbon fiber busbar matrix

[0055] A multi-strand carbon fiber composite is prepared by using a single-strand carbon fiber monomer through a silk imitation and twisting method.

[0056] (3) Preparation of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire:

[0057] ① Pretreatment: The carbon fiber busbar substrate is acid-washed and water-washed in a spraying manner to remove rust and oil stains on the surface;

[0058] ②Activation and sensitization: The sensitizing solution is an aqueous solution of PdCl2, and the activating solution is acidic SnCl2. The polymer-functional spherical abrasive and the carbon fiber bus bar substrate are sensitized and activated in sequence.

[0059] ③Electroplating: During the carbon fiber Roll-to-Roll wire routing process, the polymer-functional spherical abrasive is electroplated onto the carbon fiber wire by means of roller brush plating. Among them, the wire routing speed is 20 mm / min. During electroplating, the current density is 15 kA / m2, and the roller brush rotation speed is 300 r / min.

[0060] ④Post-treatment: The electroplated carbon fiber diamond wire is ultrasonically cleaned, dried, and de-hydrogenated in an annealing furnace in sequence to obtain a carbon fiber composite electroplated single-layer polymer-functional spherical abrasive diamond wire.

[0061] The carbon fiber composite electroplated single-layer polymer-functional spherical abrasive diamond wire prepared by the above method has a skin-core coating structure and is composed of carbon fiber and a single layer of polymer-functional spherical abrasive plated on its surface. The average embedding depth of the polymer-functional spherical abrasive is 35% of the average particle size of the polymer-functional spherical abrasive, and the plating strength is 860 Kpa.

[0062] The application of a new type of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire uses the diamond wire prepared by the above method to cut and process a high-hard and brittle semiconductor ingot with a Mohs hardness exceeding 8.5. Among them, the semiconductor ingot is a polysilicon ingot, the ingot size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times.

[0063] When cutting and processing the high-hard and brittle semiconductor ingot, the wire consumption of the composite electroplated single-layer polymer abrasive diamond wire is 2.1 m / kg, the forming efficiency of the high-hard and brittle semiconductor ingot is 300 pieces / kg, the thickness deviation of the slices of the high-hard and brittle semiconductor ingot is 4 μm, the average surface roughness of the slices of the high-hard and brittle semiconductor ingot is 190 μm, and the average subsurface damage depth of the slices of the high-hard and brittle semiconductor ingot is 5 μm.

[0064] Example 2

[0065] A new type of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire, the specific steps are as follows:

[0066] (1) Raw materials:

[0067] Bus bar substrate: Carbon fiber with a diameter of 25 μm;

[0068] Superhard micropowder: Alumina (Al2O3) with an average particle size of 1 μm;

[0069] Functional micropowder: a mixture of piezoelectric powder and thermoelectric powder in a mass ratio of 2:1, wherein the piezoelectric powder is lithium niobate (LiNbO3) with an average particle size of 0.1 μm, and the thermoelectric powder is bismuth telluride (Bi2Te3) with an average particle size of 0.1 μm;

[0070] Adhesive: epoxy resin;

[0071] (2) Preparation of polymerized functional abrasive (in-situ polymerization method):

[0072] ① Epoxy resin synthesis: Ethylene oxide and bisphenol A are synthesized into urea-formaldehyde resin by conventional methods with deionized water;

[0073] ② Take the resin synthesized in step ① and mix it thoroughly with superhard micropowder and functional micropowder, and put it into a constant pressure burette for standby use, wherein the mass ratio of binder to superhard micropowder is 2:3, and the mass ratio of superhard micropowder to functional micropowder is 4:1;

[0074] ③ Add urea-formaldehyde resin solvent, emulsifier and dispersant into a three-necked flask and stir magnetically for later use. The ratio of emulsifier to dispersant is 4:1.

[0075] ④ Add the mixed solution of step ② dropwise into the three-necked flask of step ③;

[0076] ⑤ Adjust the pH of the mixture in step ④ to ≤3 with citric acid and react for 3 hours;

[0077] ⑥ Filter and wash the prepared polymer functional abrasive with deionized water until it is neutral, and then dry.

[0078] The prepared polymer functional abrasive has high sphericity, uniform distribution of surface cutting edges, and automatic exposure of deep cutting edges after surface cutting edges are worn, so it has good self-sharpening properties and an average particle size of 15 μm.

[0079] (2) Preparation of carbon fiber busbar matrix

[0080] A multi-strand carbon fiber composite is prepared by imitating silk and twisting a single-strand carbon fiber monomer.

[0081] (3) Preparation of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire:

[0082] ① Pretreatment: The carbon fiber busbar substrate is acid-washed and water-washed in a spraying manner to remove rust and oil stains on the surface;

[0083] ② Activation and sensitization: the sensitizing solution is PdCl2 aqueous solution, and the activating solution is acidic SnCl2; the polymerized functional spherical abrasive and the carbon fiber busbar matrix are sensitized and activated in sequence;

[0084] ③ Electroplating: During the process of carbon fiber Roll-to-Roll wire routing, polymeric functional spherical abrasives are electroplated onto the carbon fiber wire by means of roller brush plating. Among them, the wire routing speed is 20 mm / min. During electroplating, the current density is 18 kA / m2, and the roller brush rotation speed is 350 r / min;

[0085] ④ Post-treatment: The electroplated carbon fiber diamond wire is successively subjected to ultrasonic cleaning, drying, and hydrogen removal in an annealing furnace to obtain a carbon fiber composite electroplated single-layer polymeric functional spherical abrasive diamond wire.

[0086] The carbon fiber composite electroplated single-layer polymeric functional spherical abrasive diamond wire prepared by the above method has a core-shell coating structure and is composed of carbon fiber and a single layer of polymeric functional spherical abrasives plated on its surface. The average embedding depth of the polymeric functional spherical abrasives is 40% of the average particle size of the polymeric functional spherical abrasives, and the plating strength is 915 Kpa.

[0087] The application of a new type of carbon fiber electroplated single-layer polymeric spherical abrasive diamond wire uses the diamond wire prepared by the above method to cut and process a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a polysilicon rod, the crystal rod size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0088] When cutting and processing a high-hard and brittle semiconductor crystal rod, the wire consumption of the composite electroplated single-layer polymeric abrasive diamond wire is 1.9 m / / kg, the forming efficiency of the high-hard and brittle semiconductor crystal rod is 320 pieces / kg, the thickness deviation of the slices of the high-hard and brittle semiconductor crystal rod is 6 μm, the average surface roughness of the slices of the high-hard and brittle semiconductor crystal rod is 175 μm, and the average subsurface damage depth of the slices of the high-hard and brittle semiconductor crystal rod is 4 μm.

[0089] Example 3

[0090] A new type of carbon fiber electroplated single-layer polymeric spherical abrasive diamond wire, the specific steps are as follows:

[0091] (1) Raw materials:

[0092] Bus bar substrate: Carbon fiber with a diameter of 30 μm;

[0093] Superhard micropowder: Cubic boron nitride with an average particle size of 1.5 μm;

[0094] Functional micropowder: A mixture of piezoelectric 3 powder and thermoelectric powder with a mass ratio of 2:1. Among them, the piezoelectric powder is lithium niobate (LiNbO3) with an average particle size of 0.1 μm, and the thermoelectric powder is tin selenide (SnSe) with an average particle size of 0.1 μm;

[0095] Binder: Polyvinyl alcohol;

[0096] (2) Preparation of Aggregated Functional Abrasives (Powder Metallurgy Method):

[0097] a. Mixing: Using the mechanical dry powder mixing method, the superhard micropowder and functional abrasive micropowder are fully mixed for 8 hours;

[0098] b. Green body forming: Take out the mixed powder, add a polymer resin matrix binder to the mixed powder, and then use the hot pressing method to make a green body. The mass of the binder is 10% of the mass of the mixed powder;

[0099] c. Atomization granulation: The green body obtained in step b is sintered, atomized and crushed, and classified to obtain the aggregated functional abrasive. Among them, the sintering temperature is 600 °C.

[0100] The prepared aggregated functional abrasive has a high sphericity, uniform distribution of surface cutting edges. After the surface cutting edges are worn, the deep - layer cutting edges are automatically exposed, so it has good self - sharpening property, and the average particle size is 10 μm.

[0101] (2) Preparation of Carbon Fiber Busbar Matrix

[0102] Prepare a multi - strand carbon fiber composite by drawing and twisting single - strand carbon fiber monomers.

[0103] (3) Preparation of Carbon Fiber Electroplated Single - Layer Aggregated Spherical Abrasive Wire Saw:

[0104] ① Pretreatment: Spray the carbon fiber busbar matrix with pickling and then water washing in sequence to remove surface rust and oil;

[0105] ② Activation and sensitization: The sensitizing solution is an aqueous solution of PdCl2, and the activating solution is acidic SnCl2; Sensitize and activate the aggregated functional spherical abrasive and the carbon fiber busbar matrix in sequence;

[0106] ③ Electroplating: During the Roll - to - Roll wire feeding of carbon fiber, the aggregated functional spherical abrasive is electroplated on the carbon fiber wire by means of roller brush plating. Among them, the wire feeding speed is 15 mm / min. During electroplating, the current density is 12 kA / m², and the roller brush rotation speed is 400 r / min;

[0107] ④ Post - treatment: Ultrasonic clean, dry and de - hydrogenate in an annealing furnace the electroplated carbon fiber wire saw in sequence to obtain the carbon fiber composite electroplated single - layer aggregated functional spherical abrasive wire saw.

[0108] The carbon fiber composite electroplated single - layer aggregated functional spherical abrasive wire saw prepared by the above method has a skin - core coating structure, which is composed of carbon fiber and a single - layer aggregated functional spherical abrasive plated on its surface. The average embedding depth of the aggregated functional spherical abrasive is 45% of the average particle size of the aggregated functional spherical abrasive, and the plating strength is 920 Kpa.

[0109] Application of a new type of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire. The diamond wire prepared by the above method is used to cut and process high-hard and brittle semiconductor wafers with a Mohs hardness exceeding 8.5. Among them, the semiconductor wafer is a polysilicon wafer, the size of the wafer is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0110] When cutting and processing high-hard and brittle semiconductor wafers, the wire consumption of the composite electroplated single-layer polymer abrasive diamond wire is 1.7 m / kg, the wafer forming efficiency of the high-hard and brittle semiconductor wafer is 310 wafers / kg, the thickness deviation of the sliced wafer of the high-hard and brittle semiconductor wafer is 8 μm, the average surface roughness of the sliced wafer of the high-hard and brittle semiconductor wafer is 186 μm, and the average subsurface damage depth of the sliced wafer of the high-hard and brittle semiconductor wafer is 7 μm.

[0111] Example 4

[0112] A new type of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire, the specific steps are as follows:

[0113] (1) Raw materials:

[0114] Bus bar substrate: Carbon fiber with a diameter of 35 μm;

[0115] Superhard micropowder: Cubic boron nitride with an average particle size of 2 μm;

[0116] Functional micropowder: A mixture of piezoelectric powder and thermoelectric powder with a mass ratio of 3:1. Among them, the piezoelectric powder is calcium silicate (CaSiO3) with an average particle size of 0.1 μm, and the thermoelectric powder is tin selenide (SnSe) with an average particle size of 0.1 μm;

[0117] Binder: Polyvinyl alcohol;

[0118] (2) Preparation of polymer functional abrasive (powder metallurgy method):

[0119] a. Mixing: Using the mechanical dry powder mixing method, the superhard micropowder and the functional abrasive micropowder are fully mixed for 8 h;

[0120] b. Green body forming: Take out the mixed powder, add a polymer resin matrix binder to the mixed powder, and then use the hot pressing method to make a green body. The mass of the binder is 8% of the mass of the mixed powder;

[0121] c. Atomization granulation: The green body obtained in step b is sintered, atomized and crushed, and classified to obtain the polymer functional abrasive, where the sintering temperature is 800 °C.

[0122] The prepared polymeric functional abrasive has a high sphericity, with evenly distributed surface cutting edges. After the surface cutting edges are worn, deeper cutting edges are automatically exposed, so it has good self-sharpening property and an average particle size of 15 μm.

[0123] (2) Preparation of carbon fiber bus bar substrate

[0124] A multi-strand carbon fiber composite is prepared by false-twisting single-strand carbon fiber monomers.

[0125] (3) Preparation of carbon fiber electroplated single-layer polymeric spherical abrasive diamond wire:

[0126] ① Pretreatment: The carbon fiber bus bar substrate is pickled and washed in sequence by spraying to remove rust and oil on the surface.

[0127] ② Activation and sensitization: The sensitizing solution is an aqueous solution of PdCl2, and the activating solution is acidic SnCl2. The polymeric functional spherical abrasive and the carbon fiber bus bar substrate are sensitized and activated in sequence.

[0128] ③ Electroplating: During the process of carbon fiber Roll-to-Roll wire feeding, the polymeric functional spherical abrasive is electroplated on the carbon fiber wire by roller brush plating. Among them, the wire feeding speed is 15 mm / min. During electroplating, the current density is 16 kA / m2, and the roller brush rotation speed is 450 r / min.

[0129] ④ Post-treatment: The electroplated carbon fiber diamond wire is ultrasonically cleaned, dried, and de-hydrogenated in an annealing furnace in sequence to obtain a carbon fiber composite electroplated single-layer polymeric functional spherical abrasive diamond wire.

[0130] The carbon fiber composite electroplated single-layer polymeric functional spherical abrasive diamond wire prepared by the above method has a skin-core coating structure, which is composed of carbon fiber and a single-layer polymeric functional spherical abrasive electroplated on its surface. The average embedding depth of the polymeric functional spherical abrasive is 50% of the average particle size of the polymeric functional spherical abrasive, and the plating strength is 950 Kpa.

[0131] For the application of a new type of carbon fiber electroplated single-layer polymeric spherical abrasive diamond wire, the diamond wire prepared by the above method is used to cut and process a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a polysilicon rod, the crystal rod size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times.

[0132] When cutting high-hard and brittle semiconductor wafers, the wire consumption of the composite electroplated single-layer polymer abrasive diamond wire is 0.9 m / kg, the wafering efficiency of the high-hard and brittle semiconductor wafers is 350 wafers / kg, the slicing thickness deviation of the high-hard and brittle semiconductor wafers is 5 μm, the average surface roughness of the sliced high-hard and brittle semiconductor wafers is 160 μm, and the average subsurface damage depth of the sliced high-hard and brittle semiconductor wafers is 3 μm.

[0133] Example 5

[0134] A new type of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire, the specific steps are as follows:

[0135] (1) Raw materials:

[0136] Bus bar substrate: carbon fiber with a diameter of 30 μm;

[0137] Superhard micropowder: single crystal diamond with an average particle size of 5 μm;

[0138] Functional micropowder: a mixture of piezoelectric powder and thermoelectric powder with a mass ratio of 4:1, where the piezoelectric powder is barium titanate (BaTiO3) with an average particle size of 0.1 μm, and the thermoelectric powder is bismuth telluride (Bi2Te3) with an average particle size of 0.1 μm;

[0139] Binder: polyvinylpyrrolidone;

[0140] (2) Preparation of polymer functional abrasive (in-situ polymerization method):

[0141] ① Synthesis of urea-formaldehyde resin: Synthesize urea-formaldehyde resin from urea and formaldehyde with deionized water by conventional methods;

[0142] ② Take the resin synthesized in step ① and mix it fully with superhard micropowder and functional micropowder, and put it into a constant pressure burette for standby, where the mass ratio of the binder to the superhard micropowder is 1:2, and the mass ratio of the superhard micropowder to the functional micropowder is 5:1;

[0143] ③ Add urea-formaldehyde resin solvent, emulsifier and dispersant into a three-necked flask, and stir magnetically for standby, where the ratio of the emulsifier to the dispersant is 7:3;

[0144] ④ Add the mixture in step ② dropwise into the three-necked flask in step ③;

[0145] ⑤ Adjust the pH of the mixture in step ④ to ≤ 3 with citric acid and react for 3 h;

[0146] ⑥ Filter by suction, wash the prepared polymer functional abrasive with deionized water until it is neutral, and dry it.

[0147] The prepared polymer functional abrasive has a high sphericity, uniform surface edge distribution, and the deep-layer edges are automatically exposed after the surface edges are worn, so it has good self-sharpening property and an average particle size of 10 μm.

[0148] (2) Preparation of carbon fiber bus bar matrix

[0149] Prepare a multi-strand carbon fiber composite by false-twisting single-strand carbon fiber monomers.

[0150] (3) Preparation of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire:[[]]

[0151] ① Pretreatment: Remove surface rust and oil stains from the carbon fiber bus bar matrix by pickling and water washing in sequence in a spraying manner;

[0152] ② Activation and sensitization: Select PdCl2 aqueous solution as the sensitizing solution and acidic SnCl2 as the activating solution; sequentially perform sensitization and activation treatments on the polymer functional spherical abrasive and the carbon fiber bus bar matrix;

[0153] ③ Electroplating: During the Roll-to-Roll wire feeding of carbon fiber, deposit the polymer functional spherical abrasive on the carbon fiber wire by roller brush plating. Among them, the wire feeding speed is 20 mm / min. During electroplating, the current density is 15 kA / m2 and the roller brush rotation speed is 300 r / min;

[0154] ④ Post-treatment: Sequentially perform ultrasonic cleaning, drying, and hydrogen removal in an annealing furnace on the electroplated carbon fiber diamond wire to obtain a carbon fiber composite electroplated single-layer polymer functional spherical abrasive diamond wire.

[0155] The carbon fiber composite electroplated single-layer polymer functional spherical abrasive diamond wire prepared by the above method has a skin-core coating structure and is composed of carbon fiber and a single-layer polymer functional spherical abrasive plated on its surface. The average embedding depth of the polymer functional spherical abrasive is 45% of the average particle size of the polymer functional spherical abrasive, and the plating strength is 830 Kpa.

[0156] Application of a new type of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire: Use the diamond wire prepared by the above method to cut and process a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a polysilicon rod, the crystal rod size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0157] When cutting and processing a high-hard and brittle semiconductor crystal rod, the wire consumption of the composite electroplated single-layer polymer abrasive diamond wire is 1.6 m / / kg, the slicing efficiency of the high-hard and brittle semiconductor crystal rod is 300 pieces / kg, the slicing thickness deviation of the high-hard and brittle semiconductor crystal rod is 4 μm, the average surface roughness of the sliced surface of the high-hard and brittle semiconductor crystal rod is 190 μm, and the average subsurface damage depth of the sliced surface of the high-hard and brittle semiconductor crystal rod is 5 μm.

[0158] Example 6

[0159] A new type of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire, the specific steps are as follows:

[0160] (1) Raw materials:

[0161] Busbar substrate: carbon fiber with a diameter of 40μm;

[0162] Superhard micropowder: single crystal diamond with an average particle size of 10μm;

[0163] Functional micropowder: a mixture of piezoelectric powder and thermoelectric powder in a mass ratio of 4:1, wherein the piezoelectric powder is barium titanate (BaTiO3) with an average particle size of 0.1 μm, and the thermoelectric powder is bismuth telluride (Bi2Te3) with an average particle size of 0.1 μm;

[0164] Binder: polyvinyl alcohol;

[0165] (2) Preparation of polymerized functional abrasive (in-situ polymerization method):

[0166] ① Urea-formaldehyde resin synthesis: urea and formaldehyde are synthesized with deionized water according to conventional methods;

[0167] ② Take the resin synthesized in step ① and mix it thoroughly with superhard micropowder and functional micropowder, and put it into a constant pressure burette for use, wherein the mass ratio of binder to superhard micropowder is 4:1, and the mass ratio of superhard micropowder to functional micropowder is 9:1;

[0168] ③ Add urea-formaldehyde resin solvent, emulsifier and dispersant into a three-necked flask and stir magnetically for later use. The ratio of emulsifier to dispersant is 9:1.

[0169] ④ Add the mixed solution of step ② dropwise into the three-necked flask of step ③;

[0170] ⑤ Adjust the pH of the mixture in step ④ to ≤ 3 with citric acid and react for 3 hours;

[0171] ⑥ Filter and wash the prepared polymer functional abrasive with deionized water until it is neutral, and then dry.

[0172] The prepared polymer functional abrasive has high sphericity, uniform distribution of surface cutting edges, and automatic exposure of deep cutting edges after surface cutting edges are worn, so it has good self-sharpening properties and an average particle size of 25 μm.

[0173] (2) Preparation of carbon fiber busbar matrix

[0174] A multi-strand carbon fiber composite is prepared by using a single-strand carbon fiber monomer through a silk imitation and twisting method.

[0175] (3) Preparation of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire:

[0176] ① Pretreatment: The carbon fiber bus bar substrate is pickled and washed successively by spraying to remove rust and oil stains on the surface;

[0177] ② Activation and sensitization: The sensitizing solution is an aqueous solution of PdCl2, and the activating solution is acidic SnCl2; The polymeric functional spherical abrasive and the carbon fiber bus bar substrate are successively sensitized and activated;

[0178] ③ Electroplating: During the Roll-to-Roll wire routing of carbon fiber, the polymeric functional spherical abrasive is electroplated on the carbon fiber wire by means of roller brush plating. Among them, the wire routing speed is 20 mm / min. During electroplating, the current density is 20 kA / m2, and the roller brush rotation speed is 350 r / min;

[0179] ④ Post-treatment: The electroplated carbon fiber diamond wire is successively subjected to ultrasonic cleaning, drying and hydrogen removal in an annealing furnace to obtain a carbon fiber composite electroplated single-layer polymeric functional spherical abrasive diamond wire.

[0180] The carbon fiber composite electroplated single-layer polymeric functional spherical abrasive diamond wire prepared by the above method has a skin-core coating structure and is composed of carbon fiber and a single layer of polymeric functional spherical abrasive plated on its surface. The average embedding depth of the polymeric functional spherical abrasive is 60% of the average particle size of the polymeric functional spherical abrasive, and the plating strength is 845 Kpa.

[0181] The application of a new type of carbon fiber electroplated single-layer polymeric spherical abrasive diamond wire is to use the diamond wire prepared by the above method to cut and process a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a polysilicon rod, the crystal rod size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0182] When cutting and processing a high-hard and brittle semiconductor crystal rod, the wire consumption of the composite electroplated single-layer polymeric abrasive diamond wire is 1.8 m / kg, the chip efficiency of the high-hard and brittle semiconductor crystal rod is 298 pieces / kg, the thickness deviation of the slices of the high-hard and brittle semiconductor crystal rod is 6 μm, the average surface roughness of the slices of the high-hard and brittle semiconductor crystal rod is 200 μm, and the average subsurface damage depth of the slices of the high-hard and brittle semiconductor crystal rod is 7 μm.

[0183] Comparative Example 1

[0184] A preparation method of a new type of carbon fiber electroplated single-layer polymeric spherical abrasive diamond wire is basically the same as that of Example 1, except that the polymeric spherical abrasive does not contain functional micropowder (or lacks cutting data when compared with wire cutting of steel wire and tungsten wire).

[0185] A new type of carbon fiber electroplated single-layer polymeric spherical abrasive diamond wire, the specific steps are as follows:

[0186] (1) Raw materials:

[0187] Busbar substrate: carbon fiber with a diameter of 20μm;

[0188] Superhard micropowder: single crystal diamond with an average particle size of 0.5μm;

[0189] Binder: urea-formaldehyde resin;

[0190] (2) Preparation of polymerized functional abrasive (in-situ polymerization method):

[0191] ① Urea-formaldehyde resin synthesis: urea and formaldehyde are synthesized with deionized water according to conventional methods;

[0192] ② Take the resin synthesized in step ① and mix it with the superhard micropowder thoroughly, put it into a constant pressure burette for later use, wherein the mass ratio of the binder to the superhard micropowder is 1:1;

[0193] ③ Add urea-formaldehyde resin solvent, emulsifier and dispersant into a three-necked flask and stir magnetically for later use. The ratio of emulsifier to dispersant is 7:3.

[0194] ④ Add the mixed solution of step ② dropwise into the three-necked flask of step ③;

[0195] ⑤ Adjust the pH of the mixture in step ④ to ≤ 3 with citric acid and react for 3 hours;

[0196] ⑥ Filter and wash the prepared polymer functional abrasive with deionized water until it is neutral, and then dry.

[0197] The prepared polymer abrasive has high sphericity, uniform distribution of surface cutting edges, and automatic exposure of deep cutting edges after surface cutting edges are worn, so it has good self-sharpening properties and an average particle size of 10 μm.

[0198] (2) Preparation of carbon fiber busbar matrix

[0199] A multi-strand carbon fiber composite is prepared by using a single-strand carbon fiber monomer through a silk imitation and twisting method.

[0200] (3) Preparation of carbon fiber electroplated single-layer polymer spherical abrasive diamond wire:

[0201] ① Pretreatment: The carbon fiber busbar substrate is acid-washed and water-washed in a spraying manner to remove rust and oil stains on the surface;

[0202] ② Activation and sensitization: the sensitizing solution is PdCl2 aqueous solution, and the activating solution is acidic SnCl2; the polymerized functional spherical abrasive and the carbon fiber busbar matrix are sensitized and activated in sequence;

[0203] ③ Electroplating: During the process of carbon fiber Roll-to-Roll wire routing, the polymeric functional spherical abrasive is electroplated onto the carbon fiber wire by means of roller brush plating. Among them, the wire routing speed is 20 mm / min. During electroplating, the current density is 15 kA / m2, and the roller brush rotation speed is 300 r / min;

[0204] ④ Post-treatment: The electroplated carbon fiber diamond wire is successively subjected to ultrasonic cleaning, drying, and hydrogen removal in an annealing furnace to obtain a carbon fiber composite electroplated single-layer polymeric functional spherical abrasive diamond wire.

[0205] The carbon fiber composite electroplated single-layer polymeric functional spherical abrasive diamond wire prepared by the above method has a skin-core coating structure and is composed of carbon fiber and a single layer of polymeric functional spherical abrasive electroplated on its surface. The average embedding depth of the polymeric functional spherical abrasive is 45% of the average particle size of the polymeric functional spherical abrasive, and the plating strength is 910 Kpa.

[0206] The application of a new type of carbon fiber electroplated single-layer polymeric spherical abrasive diamond wire uses the diamond wire prepared by the above method to cut and process a high-hard and brittle semiconductor crystal rod with a Mohs hardness exceeding 8.5. Among them, the semiconductor crystal rod is a polysilicon rod, the crystal rod size is 230×230×100 mm, the cutting wire speed is 2000 m / min, the cutting feed speed is 0.3 mm / min, and the number of cutting times is 50 times;

[0207] When cutting and processing the high-hard and brittle semiconductor crystal rod, the wire consumption of the composite electroplated single-layer polymeric abrasive diamond wire is 2.3 m / kg, the chip efficiency of the high-hard and brittle semiconductor crystal rod is 213 pieces / kg, the slice thickness deviation of the high-hard and brittle semiconductor crystal rod is 11 μm, the average surface roughness of the slice of the high-hard and brittle semiconductor crystal rod is 312 μm, and the average subsurface damage depth of the slice of the high-hard and brittle semiconductor crystal rod is 12 μm.

[0208] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0209] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

[0210] The present invention and its implementation manners have been described above. Such description is not restrictive. What is shown in the drawings is only one of the implementation manners of the present invention, and the actual structure is not limited thereto. In general, if those of ordinary skill in the art are inspired by it and, without departing from the gist of the present invention, design similar structural manners and embodiments to this technical solution without creative efforts, they shall fall within the protection scope of the present invention.

Claims

1. A new type of carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire, characterized in that, The diamond wire has a coating structure and is composed of a bus bar substrate and a single-layer polymer piezoelectric and pyroelectric spherical abrasive coated on its surface. The bus bar substrate is a modified carbon fiber with a diameter between 20 and 40 μm. The polymer spherical material is composed of superhard micropowder, piezoelectric material, pyroelectric material, and a polymer binder. The particle size of the functional abrasive is 1 to 10 μm, and the particle size of the superhard micropowder is 0.5 to 10 μm. The content of the superhard micropowder accounts for 25 to 75% of the total mass of the superhard micropowder and the binder powder. The polymer binder is a resin matrix with a purity ≥ 99%, including urea-formaldehyde resin, epoxy resin, polyvinyl alcohol PVA, or polyvinylpyrrolidone PVP. The volume fraction ratio of the polymer binder to the polymer functional abrasive is 3:7 to 5:

5. The mass fraction ratio of the superhard micropowder to the functional abrasive is 9:1 to 7:

3.

2. A novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire according to claim 1, characterized in that, The preparation method of the polymer functional abrasive is as follows: a. Mixing: Using the mechanical dry powder mixing method, fully mix the superhard micropowder and the functional abrasive micropowder for 8 h. The particle size of the superhard micropowder is one or more of 0.1 μm, 0.2 μm, 0.5 μm, 1 μm, 2 μm, 5 μm, 10 μm. The functional abrasive is one or more of piezoelectric materials or pyroelectric materials. b. Green body forming: Take out the mixed powder, add a polymer resin matrix binder to the mixed powder, and then use the atmospheric pressure mechanical pressure method or the hot pressing method to make a green body. The binder is urea-formaldehyde resin, or one of epoxy resin, polyvinyl alcohol PVA, and polyvinylpyrrolidone PVP. The mass of the binder is 1 to 10% of the mass of the mixed powder. c. Atomization granulation: Subject the green body to sintering, atomization crushing, and classification to obtain the polymer functional abrasive.

3. A novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire according to claim 1, characterized in that, The preparation method of the polymer functional abrasive is as follows: a. Matrix synthesis: Using the organic synthesis method, water bath heat the monomer raw materials of the resin matrix for 1.5 h, and cool and reserve after the reaction is completed. b. Mixing: Using the mechanical dry powder mixing method, fully mix the superhard micropowder and the functional abrasive micropowder for 8 h. The particle size of the superhard micropowder is one or more of 0.1 μm, 0.2 μm, 0.5 μm, 1 μm, 2 μm, 5 μm, 10 μm. The functional abrasive is a mixed powder of piezoelectric material and pyroelectric material, and the mass ratio is 5:1 to 1:

1. c. Preparation of composite prepolymer: Add the mixed abrasive in step b to the resin matrix, and the mass fraction ratio of the mixed abrasive to the resin matrix is 4:6 to 6:

4. d. Preparation of emulsifying dispersant: Select one of dimethylformamide, methyl cyclohexanone, acetic anhydride, and dimethyl sulfoxide as the emulsifier, and select one of sodium tripolyphosphate, sodium hexametaphosphate, sodium pyrophosphate, and sodium dodecyl sulfate as the dispersant, and mix evenly. The volume fraction ratio of the emulsifier to the dispersant is 7:3 to 9:

1. e. Emulsification and dispersion of the core material: The resin matrix mixture prepared in step c is gradually dropped into step d, and is dispersed at a high speed with an electric stirrer for 40 min at a certain temperature. After the core material is completely dispersed into fine emulsion droplets, it is transferred to a low-speed dispersion at room temperature for a period of time. The high-speed range of the stirrer is 1000 rpm to 1500 rpm, and the low-speed range is 300 rpm to 500 rpm; the proportion of the core material in the emulsifying dispersant is 3.5%. f. Granulation: The suspension obtained in step e is filtered by suction, dried, and screened to obtain the functional abrasive grains.

4. A novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire according to claim 1, characterized in that, The embedding depth of the abrasive grains is 35-60% of the particle size of the abrasive grains.

5. The preparation method of a novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire according to claim 1, characterized in that, The method for preparing the diamond wire is as follows: A double-roller type is used to fix the brush plating area. The two ends of the diamond wire busbar substrate are fixed to the positive and negative electrodes of the power supply, and the polymer functional abrasive is plated on the busbar substrate through the rollers. The wire running speed is 15 - 20 mm / min, and the current density is 12 - 20 kA / m 2 . The rotational speed of the double rollers is 300 rpm - 450 rpm.

6. The preparation method of a novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire according to claim 5, characterized in that, The preparation method further includes activating and sensitizing the wire matrix of the diamond wire and the abrasive grains with functional polymerization. The activation and sensitization formula is: PdCl2, SnCl2, H2O, HCl or PdCl2, SnCl2, Na₂SnO₃·3H₂O, H2O, HCl or HAuCl₄·H₂O, Na₂SnO₃·3H₂O, H2O, HCl or H₂PtCl₆, SnCl2, Na₂SnO₃·3H₂O, H2O, HCl.

7. The preparation method of a novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire according to claim 5, characterized in that, The preparation method further includes post-treatment of the diamond wire after electroplating the wire matrix of the diamond wire. The post-treatment specifically includes ultrasonic cleaning, drying, and hydrogen removal of the diamond wire in sequence.

8. The application of a novel carbon fiber electroplated single-layer polymer functional spherical abrasive diamond wire according to claim 1, characterized in that It is used for the cutting process of high-hard and brittle semiconductor wafers, and the Mohs hardness of the high-hard and brittle semiconductor wafers exceeds 8.5.

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