A polishing and grinding fluid supply system for a wafer polishing machine

Abstract

The present invention discloses a polishing and grinding fluid supply system for a wafer polishing machine, which relates to the technical field of polishing machine fluid supply, and comprises: a filter assembly, which is used to receive and filter the polishing and grinding fluid from the polishing chamber; a pulse assembly, one end of which is connected to the polishing chamber, and the other end of which is connected to the filter assembly via a fluid supply pipe; and a fluid replenishing tank, which selectively supplies fluid to the filter assembly; wherein the pulse assembly can receive the polishing and grinding fluid from the filter assembly and deliver it to the polishing chamber in a stable pressure manner or in a pulse manner, and the overall working mode is relatively flexible.

Description

Technical Field

[0001] The invention relates to the technical field of polishing machine liquid supply, in particular to a polishing and grinding liquid supply system for a wafer polishing machine. Background Art

[0002] In the field of fluid supply technology for wafer polishers, the stability and filtration accuracy of polishing and grinding fluids directly impact wafer surface quality and production yield. Existing fluid supply systems often utilize a single, constant-pressure supply mode. This mode maintains a static equilibrium at the polishing interface, ensuring basic polishing efficiency but hindering dynamic response. Consequently, minor defects are masked by stable process parameters, making it difficult to ensure consistent wafer quality.

[0003] In addition, the filter components of traditional liquid supply devices mostly adopt a fixed-level or single-precision filter structure. For example, multi-stage filtration is achieved by connecting multiple sets of fixed filter discs in series, but the filter disc precision and flow path cannot be adjusted as needed.

[0004] Therefore, it is necessary to provide a wafer polishing machine polishing grinding fluid supply system to solve the above problems. Summary of the Invention

[0005] To solve the above problems, the present invention provides the following technical solutions: a polishing and grinding fluid supply system for a wafer polishing machine, for supplying polishing and grinding fluid to a polishing chamber, comprising:

[0006] A filter assembly, which is used to receive and filter the polishing and grinding fluid from the polishing chamber;

[0007] A pulse assembly, one end of which is connected to the polishing chamber, and the other end of which is connected to the filter assembly via a liquid supply pipe;

[0008] a fluid replenishing tank, which selectively supplies fluid to the filter assembly;

[0009] The pulse assembly can receive the polishing and grinding fluid from the filter assembly and deliver it to the polishing chamber in a steady pressure manner or in a pulse manner.

[0010] Furthermore, as a preference, the polishing chamber is equipped with a built-in sensor assembly;

[0011] During operation, the pulse component first delivers the polishing grinding fluid to the polishing chamber in a steady-state manner, and then delivers the polishing grinding fluid to the polishing chamber in a pulsed manner. At the same time, the sensor component compares the difference between the front and rear workpieces, and then adjusts the filtering effect of the filter component or controls the fluid replenishment tank to selectively supply fluid to the filter component.

[0012] Furthermore, preferably, the pulse component includes:

[0013] A pulse cylinder, which is fixed to one side of the polishing chamber;

[0014] A liquid outlet pipe, one end of which is used to receive the polishing and grinding fluid from the filter assembly, and the other end of which is sealed and slidably extended into the pulse cylinder, and a piston is fixed on the liquid outlet pipe located in the pulse cylinder;

[0015] The pulse cylinder includes a first cylinder, the inner diameter of which is adapted to the piston. The first cylinder is divided into two parts, the left and right parts, which are connected by a second cylinder. The inner diameter of the second cylinder is larger than that of the first cylinder. A discharge pipe is also provided at the liquid outlet end of the first cylinder.

[0016] The liquid outlet pipe is also provided with a pump body.

[0017] Furthermore, preferably, the pulse component further comprises:

[0018] A track on which a pulse seat is slidably arranged, and the pulse seat is driven by a cylinder;

[0019] The rotary bin has one end connected to the liquid outlet pipe and the other end connected to a rotary drum, and the rotary drum is rotatably arranged on the pulse seat.

[0020] Furthermore, as a preference, the drum is further connected to the liquid inlet pipe by a swivel joint, and the liquid inlet pipe is connected to the filter assembly via the retractable liquid supply pipe;

[0021] The rotating drum is also driven by a motor to rotate around its own axis.

[0022] Furthermore, preferably, the sensor assembly includes a visual sensor, a temperature sensor, and an acoustic sensor.

[0023] Furthermore, preferably, the filter assembly includes:

[0024] A filter chamber having a window on its side;

[0025] A positioning column, which is vertically fixed in the filter chamber;

[0026] Three filter discs distributed in a vertical array and fixed on the positioning column;

[0027] A flow limiting ring is slidably sleeved on the outside of each filter disc, and the inner diameter of the flow limiting ring is in transition fit with the outer diameter of the filter disc.

[0028] Furthermore, preferably, a drive sleeve corresponding to the flow-limiting ring is provided in the filter bin, the drive sleeve is respectively connected to the corresponding flow-limiting ring, the drive sleeve is driven by a telescopic cylinder, and the three drive sleeves are gathered and distributed toward the side away from the window.

[0029] Furthermore, preferably, a guide ring is fixed to the upper surface of the flow limiting ring, and the inner diameter of the guide ring is larger than the outer diameter of the filter disc.

[0030] Furthermore, preferably, the interior of the flow limiting ring has a cavity, the inner wall of the flow limiting ring is provided with a spray hole connected to the cavity, and the cavity is connected to the clean water pipe.

[0031] Compared with the prior art, the present invention provides a polishing and grinding fluid supply system for a wafer polishing machine, which has the following beneficial effects:

[0032] In this invention, after establishing a baseline state using steady-pressure fluid supply, pulsed fluid supply stimulates a dynamic response at the polishing interface. By mapping conventional detection blind spots through data differences, this system achieves a closed-loop feedback loop between fluid supply strategy and defect identification. For example, when a visual sensor detects a surface anomaly, the system can automatically adjust the filtration accuracy or fluid supply in the refill tank to optimize the grinding fluid composition, significantly improving wafer yield.

[0033] In this invention, the filter assembly adopts a three-stage progressive filtration method, combined with an independently driven flow-limiting ring, to achieve the desired combination of filtration accuracy. In addition, the flow-limiting ring receives the upper layer of filtrate through the guide ring, and the built-in cavity spray hole can flush the filter disc, extending the life of the filter material. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic diagram of the main structure of a polishing and grinding fluid supply system for a wafer polishing machine;

[0035] Figure 2 The figure is a schematic diagram of the three-dimensional structure of a polishing and grinding fluid supply system for a wafer polishing machine;

[0036] Figure 3 Schematic diagram of the three-dimensional structure of the pulse component;

[0037] Figure 4 Schematic diagram of the cross-sectional structure of the pulse tube;

[0038] Figure 5 Schematic diagram of the three-dimensional structure of the filter assembly;

[0039] In the figure: 1. Polishing chamber; 2. Three-way valve; 3. Recovery pipe; 4. Filter assembly; 5. Liquid supply pipe; 6. Pulse assembly; 7. Liquid replenishing tank; 61. Track; 62. Pulse seat; 63. Rotating chamber; 64. Rotating cylinder; 65. Motor; 66. Rotatable joint; 67. Liquid inlet pipe; 68. Liquid outlet pipe; 69. Pulse cylinder; 610. Piston; 691. First cylinder; 692. Second cylinder; 693. Liquid drain pipe; 41. Filter chamber; 42. Window; 43. Positioning column; 44. Filter disc; 45. Limiting ring; 46. Guide ring; 47. Drive sleeve; 48. Telescopic cylinder. DETAILED DESCRIPTION

[0040] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned description of the drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, and this is merely a way of distinguishing the objects of the same attributes when describing them in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0041] Example: Please refer to Figure 1-Figure 5 In an embodiment of the present invention, a polishing and grinding fluid supply system for a wafer polishing machine is provided, which is used to supply polishing and grinding fluid to a polishing chamber 1, comprising:

[0042] a filter assembly 4 for receiving and filtering the polishing and grinding fluid from the polishing chamber 1. Specifically, a three-way valve 2 is provided at the bottom of the polishing chamber 1. One outlet of the three-way valve 2 is used to discharge waste fluid, and the other outlet is connected to a recovery pipe 3, which is connected to the filter assembly 4. In addition, the recovery pipe 3 is also provided with a recovery pump (not shown in the figure);

[0043] A pulse assembly 6, one end of which is connected to the polishing chamber 1, and the other end of which is connected to the filter assembly 4 via a liquid supply pipe 5;

[0044] a fluid replenishing tank 7, which selectively supplies fluid to the filter assembly 4;

[0045] The pulse assembly 6 can receive the polishing and grinding fluid from the filter assembly 4 and deliver it to the polishing chamber 1 in a steady pressure manner or in a pulse manner.

[0046] Furthermore, the polishing chamber 1 is equipped with a sensor assembly;

[0047] During operation, the pulse component 6 first delivers the polishing grinding fluid to the polishing chamber 1 in a stable pressure manner, and then delivers the polishing grinding fluid to the polishing chamber 1 in a pulse manner. At the same time, the sensor component compares the difference between the front and rear workpieces, and then adjusts the filtering effect of the filter component 4 or controls the fluid replenishment tank 7 to selectively supply fluid to the filter component 4.

[0048] It should be explained that, when working, the pulse component 6 first delivers the polishing grinding fluid to the polishing chamber 1 in a steady-state manner, the sensor component performs the first detection, and then introduces disturbance, that is, delivers the polishing grinding fluid to the polishing chamber 1 in a pulsed manner, and the sensor component performs a second detection, and identifies potential problems by comparing the two results. Furthermore, the dynamic response of the polishing interface is stimulated by the sudden change of the liquid supply parameters, and the data difference under the two liquid supply modes is used to expose minor defects (such as minor scratches, local material removal anomalies), and reversely optimize the liquid supply strategy.

[0049] The liquid supply strategy includes the optimization of the filtering effect and the optimization of the polishing and grinding fluid components. When it comes to the optimization of the polishing and grinding fluid components, the liquid replenishing tank 7 can be used to complete it.

[0050] In this embodiment, the pulse component 6 includes:

[0051] A pulse cylinder 69 is fixed to one side of the polishing chamber 1;

[0052] A liquid outlet pipe 68 has one end for receiving the polishing and grinding fluid from the filter assembly 4 and the other end for sealing and slidingly extending into the pulse cylinder 69. A piston 610 is fixed to the liquid outlet pipe 68 in the pulse cylinder 69.

[0053] The pulse cylinder 69 includes a first cylinder 691, whose inner diameter is adapted to the piston 610. The first cylinder 691 is divided into two parts, the left and right parts, which are connected by a second cylinder 692. The inner diameter of the second cylinder 692 is larger than that of the first cylinder 691. A discharge pipe 693 is also provided at the liquid outlet end of the first cylinder 691.

[0054] The liquid outlet pipe 68 is further provided with a pump body (not shown in the figure).

[0055] Among them, the meaning that the inner diameter of the first cylinder 691 is adapted to the piston 610 is that the inner diameter of the first cylinder 691 is slightly larger than the piston 610. Although the inner diameter of the first cylinder 691 is slightly larger than the piston 610, when the piston 610 slides in the first cylinder 691, it can still produce a pressurization or suction effect on the liquid. In other words, the purpose of the inner diameter of the first cylinder 691 being slightly larger than the piston 610 is only to ensure the service life of the piston 610 at the expense of a certain precision, so that it will not generate friction with the first cylinder 691. Moreover, since the piston 610 will not generate friction with the first cylinder 691, no additional debris will be generated between the two, thereby ensuring the polishing accuracy of the chip.

[0056] In addition, when the piston 610 is located in the second cylinder 692, even if the piston moves back and forth, it will not cause much disturbance to the liquid.

[0057] The pulse assembly 6 further comprises:

[0058] A track 61 on which a pulse seat 62 is slidably provided, and the pulse seat 62 is driven by a cylinder;

[0059] One end of the rotating chamber 63 is connected to the liquid outlet pipe 68 , and the other end is connected to the rotating drum 64 . The rotating drum 64 is rotatably disposed on the pulse seat 62 .

[0060] The rotating bin 63 can be used as an auxiliary buffer bin or a mixing bin. By driving the rotating bin 63 to rotate or move, the uniformity of the polishing and grinding fluid filtered by the filter assembly 4 can be improved.

[0061] Furthermore, the rotating drum 64 is connected to the liquid inlet pipe 67 by a swivel joint 66, and the liquid inlet pipe 67 is connected to the filter assembly 4 through the retractable liquid supply pipe 5;

[0062] The rotating drum 64 is also driven by a motor 65 to rotate around its own axis.

[0063] Specifically, a driven wheel is coaxially fixed on the rotating drum 64, a motor 65 is fixed on the pulse seat 62, a driving wheel is coaxially fixed on the output end of the motor 65, and a transmission belt can be configured between the driving wheel and the driven wheel.

[0064] In this embodiment, the sensor assembly includes a visual sensor, a temperature sensor, and an acoustic sensor. For example, the visual sensor can directly observe conditions on the wafer surface, such as minor scratches. When such conditions are observed, it indicates that the filter assembly 4 needs to improve its filtering effect or that the refill tank 7 needs to be intervened.

[0065] In this embodiment, the filter assembly 4 includes:

[0066] The filter chamber 41 has a window 42 on its side, and an openable observation window (not shown in the figure) needs to be installed at the window 42;

[0067] A positioning column 43 is vertically fixed in the filter chamber 41;

[0068] Three filter discs 44 distributed in a vertical array and fixed on the positioning posts 43;

[0069] A flow limiting ring 45 is slidably sleeved on the outside of each filter disc 44 , and the inner diameter of the flow limiting ring 45 is transitionally matched with the outer diameter of the filter disc 44 .

[0070] Among them, a driving sleeve 47 corresponding to the limiting ring 45 is provided in the filter chamber 41, and the driving sleeve 47 is respectively connected to the corresponding limiting ring 45. The driving sleeve 47 is driven by a telescopic cylinder 48, and the three driving sleeves 47 are gathered and distributed to the side away from the window 42.

[0071] The position of the flow limiting ring 45 can be adjusted by cooperating with the telescopic cylinder 48 and the drive sleeve 47. When the flow limiting ring 45 and the adjacent filter disc 44 are completely overlapped, the polishing grinding fluid cannot be discharged from the gap between the two. At this time, the filter disc 44 plays a filtering role.

[0072] That is, the filter disc 44 can be selectively used by independently controlling the flow restriction ring 45;

[0073] Furthermore, from top to bottom, the filtering accuracy of the three filter discs 44 increases gradually.

[0074] Furthermore, a guide ring 46 is fixed to the upper surface of the flow limiting ring 45 . The inner diameter of the guide ring 46 is larger than the outer diameter of the filter disc 44 . The guide ring 46 can receive the liquid filtered by the filter disc 44 above it.

[0075] In order to clean the filter disc 44 , the flow limiting ring 45 has a cavity inside, and the inner wall of the flow limiting ring 45 is provided with a spray hole connected to the cavity, and the cavity is connected to the clean water pipe.

[0076] The above is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A polishing and grinding fluid supply system for a wafer polishing machine, for supplying polishing and grinding fluid to a polishing chamber (1), characterized in that: include: A filter assembly (4) for receiving and filtering the polishing and grinding fluid from the polishing chamber (1); A pulse assembly (6), one end of which is connected to the polishing chamber (1), and the other end of which is connected to the filter assembly (4) via a liquid supply pipe (5); a fluid replenishing tank (7) capable of supplying fluid to the filter assembly (4); The pulse assembly (6) is capable of receiving the polishing and grinding fluid from the filter assembly (4) and delivering it to the polishing chamber (1) in a steady-pressure manner or in a pulsed manner; The pulse assembly (6) comprises: A pulse cylinder (69) fixed to one side of the polishing chamber (1); A liquid outlet pipe (68), one end of which is used to receive the polishing and grinding fluid from the filter assembly (4), and the other end of which is sealed and slidably extended into the pulse cylinder (69), and a piston (610) is fixed on the liquid outlet pipe (68) located in the pulse cylinder (69); The pulse cylinder (69) includes a first cylinder (691) whose inner diameter is adapted to the piston (610); the first cylinder (691) is divided into two parts, the left and right parts, which are connected by a second cylinder (692); the inner diameter of the second cylinder (692) is larger than that of the first cylinder (691); and a liquid discharge pipe (693) is further provided at the liquid outlet end of the first cylinder (691); The liquid outlet pipe (68) is also provided with a pump body; The filter assembly (4) comprises: A filter chamber (41) having a window (42) on its side; A positioning column (43) vertically fixed in the filter chamber (41); Three filter discs (44) distributed in a vertical array and fixed on the positioning column (43); A flow limiting ring (45) is slidably sleeved on the outside of each filter disc (44), and the inner diameter of the flow limiting ring (45) is in transitional fit with the outer diameter of the filter disc (44).

2. A wafer polishing machine polishing and grinding fluid supply system according to claim 1, characterized in that: The polishing chamber (1) is equipped with a built-in sensor assembly; During operation, the pulse assembly (6) first delivers the polishing and grinding fluid to the polishing chamber (1) in a constant pressure manner, and then delivers the polishing and grinding fluid to the polishing chamber (1) in a pulse manner. At the same time, the sensor assembly compares the difference between the front and rear workpieces, thereby adjusting the filtering effect of the filter assembly (4) or controlling the fluid replenishment tank (7) to supply fluid to the filter assembly (4).

3. A wafer polishing machine polishing and grinding fluid supply system according to claim 1, characterized in that: The pulse assembly (6) further comprises: A track (61) on which a pulse seat (62) is slidably provided, wherein the pulse seat (62) is driven by a cylinder; The rotating bin (63) has one end in communication with the liquid outlet pipe (68) and the other end connected to a rotating drum (64). The rotating drum (64) is rotatably disposed on the pulse seat (62).

4. A wafer polishing machine polishing and grinding fluid supply system according to claim 3, characterized in that: The rotating drum (64) is further connected to the liquid inlet pipe (67) by a swivel joint (66), and the liquid inlet pipe (67) is connected to the filter assembly (4) via the retractable liquid supply pipe (5); The rotating drum (64) is also driven by a motor (65) to rotate around its own axis.

5. A wafer polishing machine polishing and grinding fluid supply system according to claim 2, characterized in that: The sensor assembly includes a visual sensor, a temperature sensor, and an acoustic sensor.

6. A wafer polishing machine polishing and grinding fluid supply system according to claim 1, characterized in that: A drive sleeve (47) corresponding to the flow-limiting ring (45) is provided in the filter chamber (41). The drive sleeves (47) are respectively connected to the corresponding flow-limiting ring (45). The drive sleeves (47) are driven by a telescopic cylinder (48). The three drive sleeves (47) are distributed together on a side away from the window (42).

7. A wafer polishing machine polishing and grinding fluid supply system according to claim 1, characterized in that: A guide ring (46) is fixed to the upper surface of the flow limiting ring (45), and the inner diameter of the guide ring (46) is larger than the outer diameter of the filter disc (44).

8. The polishing and grinding fluid supply system for a wafer polishing machine according to claim 1, characterized in that: The flow limiting ring (45) has a cavity inside, and the inner wall of the flow limiting ring (45) is provided with a spray hole connected to the cavity, and the cavity is connected to the clean water pipe.

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