A robot station coordinate calibration method and system, and a storage medium

Abstract

The application provides a robot station coordinate calibration method and system, and a storage medium, wherein the method steps comprise: step S1, according to wafer station initial polar coordinates and aligner station polar coordinates, the robot is sent to the wafer station to take out the wafer and is sent to the aligner; step S2, the aligner detects the wafer eccentricity and rotates the wafer to reset, the wafer is taken out by the robot and is sent back to the wafer station; step S3, the wafer eccentricity is converted into wafer eccentric coordinates relative to the robot world coordinate system; step S4, the initial polar coordinates of the wafer station are converted into Cartesian coordinates in the robot world coordinate system, and the robot is inversely taught by correction through the wafer eccentric coordinates, thereby in the working environment, the robot is automatically taught by using the wafer aligner in the vacuum chamber, so that the accumulated error of the robot caused by manual work and environmental factors is solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a robot station coordinate calibration method and system based on wafer alignment feedback, and a storage medium. Background Technology

[0002] In the semiconductor manufacturing field, wafer handling is a core step in key processes such as photolithography, etching, and ion implantation, and its positioning accuracy directly affects chip yield. The processing of semiconductor wafers (especially 300mm wafers) requires the coordinate accuracy of the workstation to be within ±5µm, and traditional teaching methods can hardly meet this requirement.

[0003] Currently, the teaching of cleanroom robots at their workstations generally relies on manual operation. For example, operators visually observe the alignment of the scale lines on the robot's end effector (such as a vacuum suction cup) with the edge of the wafer inside the chamber, and manually input or adjust the workstation coordinates. However, the precision of human visual perception is generally only about ±0.5mm, which is far below the micron-level precision required by the process. This often leads to problems such as angular offset or positional deviation during wafer transport.

[0004] Therefore, under the high-precision calibration requirements of core process equipment, manual teaching using tooling generally faces insurmountable limitations. Furthermore, traditional tooling teaching must be conducted in a non-operating environment with the vacuum chamber open. Once the chamber is opened, the internal temperature drops drastically from the high temperatures of process operation to room temperature, and the pressure returns from vacuum to atmospheric pressure. This drastic temperature and pressure change not only disrupts the actual high-temperature, vacuum conditions of the semiconductor production line, but more importantly, with process upgrades, temperature gradients of tens of degrees Celsius between different chambers trigger significant mechanical thermal expansion effects. When the equipment returns to operating conditions, the workstation coordinates determined through tooling teaching will shift due to thermal expansion.

[0005] Therefore, it is evident that in advanced manufacturing equipment, the micron-level cumulative error caused by environmental differences cannot be corrected by tooling teaching after being observed by the naked eye. Summary of the Invention

[0006] Therefore, the main objective of this invention is to provide a robot workstation coordinate calibration method and system, and a storage medium, so as to automatically teach the robot in the working environment using a wafer aligner located in the same vacuum chamber, thereby solving the problem of accumulated robot errors caused by human and environmental factors.

[0007] To achieve the above objectives, according to one aspect of the present invention, a robot workstation coordinate calibration method is provided, the steps of which include:

[0008] Step S1: Based on the initial polar coordinates of the wafer station and the polar coordinates of the aligner station, the robot is directed to the wafer station to retrieve the wafer and deliver it to the aligner.

[0009] In step S2, the aligner detects the wafer eccentricity and rotates the wafer back to its original position. The robot then removes the wafer and returns it to the wafer station.

[0010] Step S3 converts the wafer eccentricity into wafer eccentricity coordinates relative to the robot world coordinate system;

[0011] Step S4 converts the initial polar coordinates of the wafer station to Cartesian coordinates in the robot world coordinate system, and corrects them using wafer eccentricity coordinates to teach the robot in reverse.

[0012] In a possible preferred embodiment, the wafer eccentricity coordinate transformation step includes:

[0013] Read the polar coordinates of the alignment station ( , ), the workstation angle parameters Convert to radians :

[0014] Calculate wafer eccentricity ( , The wafer eccentricity angle relative to the alignment coordinate system and according to Will Transform to the robot world coordinate system to obtain the wafer eccentricity angle. :

[0015] Calculate the offset of the wafer in the alignment coordinate system ;according to and Calculate the wafer eccentricity coordinates relative to the robot world coordinate system. , ):

[0016] .

[0017] In a possible preferred embodiment, the step of transforming the initial polar coordinates of the wafer station to Cartesian coordinates in the robot world coordinate system includes:

[0018] Read the initial polar coordinates of the wafer station ( ), the workstation angle parameters Convert to radians ;

[0019] calculate

[0020] Obtain the initial Cartesian coordinates of the wafer workstation in the robot world coordinate system. , ).

[0021] In a possible preferred embodiment, the step of correcting the initial polar coordinates of the wafer station using wafer eccentric coordinates includes:

[0022] Based on the wafer eccentricity coordinates relative to the robot world coordinate system ( , Correcting the initial coordinates of the wafer fab ( , ), to obtain the corrected wafer station coordinates ( , ):

[0023]

[0024] The corrected wafer station coordinates ( , Convert to polar coordinates ( , ).

[0025] In a possible preferred embodiment, the robot station coordinate calibration method further includes the following steps:

[0026] In step S5, the robot proceeds to the wafer station according to the corrected wafer station polar coordinates to retrieve the wafer and deliver it to the aligner. After the aligner detects the wafer eccentricity, if it determines that the error exceeds the expected value, it repeats the aforementioned steps S3 to S4 for iterative teaching and correction.

[0027] In a possible preferred embodiment, the robot station coordinate calibration method further includes the following steps:

[0028] After completing the teaching in step S6, record the current environmental parameters as the baseline value;

[0029] When step S7 is working, the current environmental parameters are compared with the reference value. If they are within the threshold range, the polar coordinates of the wafer station are dynamically compensated based on the preset compensation model.

[0030] In a possible preferred embodiment, the threshold determination step includes:

[0031] Compare the current ambient temperature T and pressure P with the reference value for ambient temperature. ,pressure Compare;

[0032] If the temperature difference And pressure difference When the threshold is reached, it is considered to be within the threshold range.

[0033] In a possible preferred embodiment, the step of dynamically compensating the polar coordinates of the wafer workstation based on a preset compensation model includes:

[0034] Calculate the thermal expansion compensation value of the robot in the R-axis direction. and pressure compensation value :

[0035]

[0036]

[0037] in The coefficient of thermal expansion of the robot. This is the robot deviation model, where k is the pressure difference deformation coefficient;

[0038] calculate Dynamic compensation of the polar radius parameter in the polar coordinates of the wafer station, wherein... To compensate for the polar radius parameters of the previous wafer station polar coordinates.

[0039] In a possible preferred embodiment, the step of dynamically compensating the polar coordinates of the wafer workstation based on a preset compensation model further includes:

[0040] If step S8 exceeds the threshold range, the robot will follow the predetermined process action and execute steps S1 to S4 as appropriate.

[0041] To achieve the above objectives, in accordance with the above methods, according to another aspect of the present invention, a robot station coordinate calibration system is also provided, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the system implements the steps of any of the robot station coordinate calibration methods described above.

[0042] To achieve the above objectives, in accordance with the above methods, according to another aspect of the present invention, a computer-readable storage medium is also provided, the computer-readable storage medium storing a computer program, wherein when the computer program is executed, it implements the steps of the robot station coordinate calibration method as described in any of the above.

[0043] The robot station coordinate calibration method, system, and storage medium provided by this invention cleverly utilize the offset detection data of the wafer aligner and reverse map it to the robot world coordinate system, constructing a fully closed-loop control process of "wafer picking-detection-reverse mapping-calibration". This achieves automated correction of cross-system errors from "wafer station position calibration" to "robot station calibration", effectively replacing manual operation and directly calibrating in the actual working environment of high temperature and vacuum. It can bypass the transmission of environmental errors and is therefore unaffected by changes in chamber temperature and pressure during teaching and operation, overcoming the cumulative robot errors caused by existing human and environmental factors. Attached Figure Description

[0044] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0045] Figure 1 This is a schematic diagram illustrating the steps of the robot workstation coordinate calibration method of the present invention;

[0046] Figure 2 A schematic diagram illustrating the layout of a traditional wafer handling and inspection unit;

[0047] Figure 3 This is a schematic diagram of the robot workstation coordinate calibration system of the present invention.

[0048] Explanation of reference numerals in the attached figures

[0049] 1. Transfer cavity; 2. Robot; 3. Aligner; 4. Wafer station; 6. Vacuum gauge; 7. Temperature sensor. Detailed Implementation

[0050] To enable those skilled in the art to better understand the technical solutions of the present invention, the specific technical solutions of the present invention will be clearly and completely described below in conjunction with embodiments, so as to help those skilled in the art further understand the present invention. Obviously, the embodiments described in this application are merely some embodiments of the present invention, and not all embodiments. It should be noted that, for those skilled in the art, the embodiments and features in the embodiments of this application can be combined with each other without departing from the concept of the present invention and without conflict. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the disclosure and protection scope of the present invention.

[0051] Furthermore, the terms "first," "second," "S1," "S2," etc., used in the specification, claims, and drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such features can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those described herein. At the same time, the stages described in each step are not necessarily to be implemented in the same step; it should be understood that the implementation order of the contents of each step stage can be adjusted and interchanged without violating the inventive concept, so that embodiments of the invention described herein can be implemented in orders other than those described herein. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. Unless otherwise expressly specified and limited, the terms "set," "arrange," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or a connection within two elements. Those skilled in the art can understand the specific meaning of the above terms in this case based on the specific circumstances and in conjunction with existing technology.

[0052] Considering that traditional tooling teaching needs to be carried out in a non-working environment after the vacuum chamber is opened, sudden changes in temperature and pressure will cause mechanical thermal expansion, resulting in a shift in the workstation coordinates during actual operation. At the same time, traditional manual teaching relies on visual observation of the overlap between the robot's end effector and the wafer edge, resulting in low accuracy, far below the ±5μm requirement of semiconductor processes.

[0053] Therefore, in order to solve the cumulative errors of robots caused by human and environmental factors, such as Figures 1 to 2 As shown, the present invention provides a robot workstation coordinate calibration method, the example steps of which include:

[0054] Step S1: Based on the initial polar coordinates of the wafer station and the polar coordinates of the aligner station, the robot is directed to the wafer station to retrieve the wafer and deliver it to the aligner.

[0055] To better illustrate the implementation process of this example, as follows: Figure 2 The diagram illustrates a layout example of a conventional wafer handling and inspection unit, in which a robot is fixed inside a transfer cavity, and an aligner and a wafer station are respectively located in a side cavity connected to the transfer cavity. The end effector of the robot can move between the wafer station and the aligner, and the polar coordinates of the aligner and the initial polar coordinates of the wafer station are stored in the robot control parameters.

[0056] Taking this structure as an example, when the calibration work begins, the robot is first instructed to go to the wafer station to retrieve the wafer according to the recorded initial polar coordinates of the wafer station, and then send it to the aligner for detection according to the polar coordinates of the aligner.

[0057] In step S2, the aligner detects the wafer eccentricity and rotates the wafer back to its original position. The wafer is then removed by the robot and returned to the wafer station.

[0058] Specifically, in order to carry out automated calibration in a working environment with the transfer cavity closed, the present invention is conceived to use an aligner located in the vacuum chamber to calibrate the robot station in reverse by acquiring the wafer's off-center position. However, for those skilled in the art, the aligner is usually mainly used to detect the wafer's own offset, rotate the wafer's marking port to a specified direction, and provide data for the robot to align and deliver the wafer to the next station when picking it up. Therefore, under existing conventional operations, the aligner cannot be used to correct the robot station coordinates, nor can it be guaranteed that the corrected value will be correctly applied to the wafer station.

[0059] To address this, the present invention employs an unconventional control method, rotating the aligner 360° when detecting wafer eccentricity. This allows the wafer to be reset simultaneously with the wafer eccentricity measurement. At this point, the wafer's position on the aligner is essentially the same as before placement. Subsequently, to prevent the wafer from misaligning with the workstation coordinates after robot teaching, the wafer is removed by the robot and returned to the wafer workstation before the robot completes its teaching.

[0060] Step S3 converts the wafer eccentricity into wafer eccentricity coordinates relative to the robot world coordinate system.

[0061] Specifically, at this point, the wafer eccentricity has been obtained through step S2, and the wafer has returned to the wafer workstation. Teaching calculations can now begin. An example of the wafer eccentricity coordinate transformation steps includes:

[0062] Step S31: Read the polar coordinates of the alignment device position ( , ), the workstation angle parameters Convert to radians Among them Taking 0.001 degrees as an example, then The calculation is as follows:

[0063] .

[0064] Step S32 calculates wafer eccentricity ( , The wafer eccentricity angle relative to the alignment coordinate system :

[0065] .

[0066] Step S33 according to Will Transform to the robot world coordinate system to obtain the wafer eccentricity angle. :

[0067] .

[0068] Step S34 converts the offset in the local coordinates of the aligner into a correction value in the robot world coordinates, that is, first calculates the offset of the wafer in the aligner coordinate system. :

[0069] .

[0070] according to and Calculate the wafer eccentricity coordinates relative to the robot world coordinate system. , ):

[0071] .

[0072] Step S4 converts the initial polar coordinates of the wafer workstation into Cartesian coordinates in the robot world coordinate system and corrects them using wafer eccentricity coordinates.

[0073] Specifically, once the correction values ​​in the robot's world coordinates are obtained through the above steps, the workstation coordinates can be accurately corrected through mathematical transformation, eliminating deviations caused by manual teaching and environmental factors.

[0074] The example steps for transforming the initial polar coordinates of the wafer workstation to Cartesian coordinates in the robot world coordinate system include:

[0075] Step S41: Read the initial polar coordinates of the wafer station ( ), the workstation angle parameters Convert to radians Among them Taking 0.001 degrees as an example:

[0076]

[0077] Step S42 performs Cartesian coordinate transformation calculations on the wafer workstation:

[0078]

[0079] This is used to obtain the initial Cartesian coordinates of the wafer workstation in the robot world coordinate system. , ).

[0080] Examples of steps for correcting the initial polar coordinates of the wafer workstation using wafer eccentricity coordinates include:

[0081] Step S43: Based on the wafer eccentricity coordinates relative to the robot world coordinate system ( , Correcting the initial coordinates of the wafer fab ( , ), to obtain the corrected wafer station coordinates ( , ):

[0082]

[0083] Step S44 finally corrects the wafer station coordinates ( , Convert to polar coordinates ( , ):

[0084]

[0085]

[0086] Thus, through the above example steps, the local offset (X / Y) detected on the wafer on the aligner can be converted into a station coordinate correction value in the robot's world coordinate system. This achieves cross-system error correction from "wafer position calibration" to "robot station calibration." This overcomes the traditional calibration method where station coordinates are manually taught and enables calibration in the actual working environment, correcting the initial station coordinates when the robot picks up the wafer from the source, and avoiding the transmission of "human error → environmental motion error → process error."

[0087] Furthermore, the aforementioned automated calibration solution can reduce the calibration time per workstation from 5-10 minutes using traditional methods to less than 10 seconds (fully automated process of wafer retrieval, inspection, calculation, and correction), avoiding repeated manual adjustments. It is suitable for the 24-hour continuous production needs of semiconductor production lines, and the calibration process, operating under high temperature and vacuum conditions, eliminates teaching errors caused by different environments. More importantly, since the overall solution utilizes existing wafer alignment devices on the production line, no additional laser or vision sensors are required, making implementation extremely easy and applicable to traditional wafer handling and inspection units.

[0088] Furthermore, considering that the accuracy of a single calibration may deviate in practical applications, in order to achieve the accuracy verification and correction functions, in an optional embodiment, the robot station coordinate calibration method further includes the following example steps:

[0089] In step S5, the robot proceeds to the wafer station according to the corrected wafer station polar coordinates, retrieves the wafer, and delivers it to the aligner. After the aligner detects the wafer eccentricity, if it determines that the error exceeds the expected value (e.g., the error exceeds 5µm), it repeats the aforementioned steps S3 to S4 for iterative (preferably a maximum of 3 iterations) teaching correction. This ensures the accuracy after calibration.

[0090] Furthermore, considering that the real-time changes in the pressure difference between the vacuum side and the atmospheric side during the operation of the vacuum robot will cause continuous small deformations in the mechanical components, coupled with the thermal expansion effect caused by temperature fluctuations in the transmission chamber (the temperature difference between different process chambers can reach 30 degrees Celsius, and the opening and closing of process chamber valves leads to heat exchange), the actual coordinates of the robot joints and end effector will also fluctuate and deviate from the theoretical values ​​in real time.

[0091] Therefore, in order to minimize the impact of this fluctuation deviation on accuracy, it is necessary to automatically compensate for environmental fluctuations in real time when the equipment is operating normally according to process requirements. Considering that traditional wafer handling and inspection units are generally equipped with vacuum gauges and temperature sensors (which can also be retrofitted), in this optional embodiment, the robot station coordinate calibration method also includes the following steps:

[0092] After completing the teaching in step S6, record the current environmental parameters, such as temperature. ,pressure As a benchmark value.

[0093] During step S7, if temperature / pressure fluctuations are judged during wafer pick-up and drop-off, the current environmental parameters are compared with the reference values. If they are within the threshold range, the polar coordinates of the wafer station are dynamically compensated based on the preset compensation model.

[0094] Specifically, examples of the threshold determination steps include:

[0095] Step S71 compares the current ambient temperature T and pressure P with the reference value for ambient temperature. ,pressure Comparison:

[0096]

[0097]

[0098] If the temperature difference And pressure difference If the value is within the threshold range, then it is considered to be within the threshold range. At this time, the fluctuation range within this range is small, and it is easy to reduce the impact of the deviation through compensation.

[0099] The steps for dynamically compensating the polar coordinates of the wafer workstation based on a preset compensation model include:

[0100] Step S72: Calculate the thermal expansion compensation value in the R-axis direction of the robot. and pressure compensation value :

[0101]

[0102]

[0103] in The coefficient of thermal expansion of the robot. This is the robot deviation model, where k is the pressure difference deformation coefficient;

[0104] Step S73 Calculation Dynamic compensation of the polar radius parameter in the polar coordinates of the wafer station, wherein... To compensate for the polar radius parameters of the previous wafer station's polar coordinates, the robot will subsequently perform wafer pick-up and drop-off actions according to the new station coordinates.

[0105] Throughout the entire working process, the equipment can automatically compensate the robot's station parameters based on the real-time collected temperature / pressure data to eliminate systematic errors caused by environmental changes in real time. Generally, the compensated error can be ≤±4um.

[0106] Furthermore, if the temperature difference Pressure difference When the threshold range is exceeded, it is considered that the environmental fluctuations are drastic and the impact of the deviation cannot be resolved through compensation. Therefore, in an optional implementation, the step of dynamically compensating the polar coordinates of the wafer workstation based on a preset compensation model also includes:

[0107] If step S8 exceeds the threshold range, the robot will follow the predetermined process action and execute steps S1 to S4 as appropriate.

[0108] For example, when the robot picks up a wafer, if it detects that the temperature / pressure fluctuation exceeds the threshold, it will follow the predetermined process actions, intervene in a timely manner, and execute steps S1 to S4 to perform a new station calibration update, without iterative operations. This step does not affect the process flow and can be inserted into or follow the process steps, with minimal impact on the production rhythm.

[0109] Furthermore, corresponding to the above method embodiments, the present invention also provides a robot station coordinate calibration system, which includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the system implements the steps of the robot station coordinate calibration method as described in any of the above examples.

[0110] Furthermore, corresponding to the above method embodiments, the present invention also provides a computer-readable storage medium storing a computer program, wherein when the computer program is executed, it implements the steps of the robot station coordinate calibration method as described in any of the above examples.

[0111] In summary, the robot station coordinate calibration method, system, and storage medium provided by this invention cleverly utilize the offset detection data of the wafer aligner, which is then mapped back to the robot world coordinate system. This constructs a fully closed-loop control process of "wafer picking-detection-backtracking-calibration," enabling automated correction of cross-system errors from "wafer station position calibration" to "robot station calibration." This effectively replaces manual operation, allowing calibration directly in the actual working environment of high temperature and vacuum. It bypasses the transmission of environmental errors and is therefore unaffected by changes in chamber temperature and pressure during teaching and operation, overcoming the cumulative robot errors caused by human and environmental factors.

[0112] Furthermore, in the corresponding embodiments, the present invention can also enable the robot to automatically compensate for the station parameters based on temperature / pressure fluctuations when the equipment is working normally according to process requirements, thereby generating continuous optimization. Therefore, it can reduce the number of downtime calibrations caused by temperature and pressure fluctuations, achieve automatic maintenance of positioning accuracy, and meet the 24-hour continuous production needs of semiconductor production lines without manual intervention.

[0113] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the protection scope of the invention.

[0114] Those skilled in the art will understand that, besides implementing the system, apparatus, unit, and its modules provided by this invention in purely computer-readable program code, the same program can be implemented in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, the system, apparatus, and its modules provided by this invention can be considered a hardware component, and the modules included therein for implementing various programs can also be considered structures within the hardware component; alternatively, modules for implementing various functions can be considered both software programs implementing the method and structures within the hardware component.

[0115] Furthermore, all or part of the steps in the methods of the above embodiments can be implemented by a program instructing related hardware. This program is stored in a storage medium and includes several instructions to cause a microcontroller, chip, or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0116] Furthermore, various different implementations of the present invention can be combined arbitrarily, as long as they do not violate the spirit of the present invention, they should also be regarded as the content disclosed in the present invention.

Claims

1. A robot station coordinate calibration method, comprising the steps of: Step S1, according to the initial polar coordinates of a wafer station and the polar coordinates of an aligner station, instructing a robot to pick up a wafer from the wafer station and deliver it to the aligner; Step S2, detecting the wafer eccentricity by the aligner and rotating the wafer back to its original position, then picking it up by the robot and delivering it back to the wafer station; Step S3, converting the wafer eccentricity into wafer eccentric coordinates relative to the robot world coordinate system, comprising the steps of: Reading aligner station polar coordinates , ), converting station angle parameters to radians : Calculate wafer eccentricity , ) wafer eccentric angle relative to aligner coordinate system , according to Convert to the robot world coordinate system, get wafer eccentric angle : Calculate the offset of the wafer in the aligner coordinate system ; according to and calculate the wafer eccentric coordinates in the robot world coordinate system , ): ； Step S4, converting the initial polar coordinates of the wafer station into Cartesian coordinates in the robot world coordinate system, and correcting them by the wafer eccentric coordinates, then teaching the robot in reverse, comprising the steps of: reading wafer station initial polar coordinates , converting station angle parameters to radians ; Computing ; acquire the initial Cartesian coordinates of the wafer acquisition station in the robot world coordinate system (X0, Y0, Z0) , ) According to wafer eccentric coordinates in the robot world coordinate system ( , ), the initial coordinates of the wafer station are corrected ( , ) to obtain corrected wafer station coordinates ( , ): ； The corrected wafer station coordinates ( , Convert to polar coordinates ( , ). 2.The robot station coordinate calibration method of claim 1, wherein the steps further comprise: Step S5, instructing the robot to pick up a wafer from the wafer station according to the corrected polar coordinates of the wafer station and deliver it to the aligner; after detecting the wafer eccentricity, if it is determined that the error exceeds the expected value, repeating the aforementioned steps S3 to S4 for iterative teaching and correction. 3.The robot station coordinate calibration method of any one of claims 1 to 2, wherein the steps further comprise: Step S6, after completing the teaching, recording the current environmental parameters as reference values; Step S7, during operation, comparing the current environmental parameters with the reference values, if they are within a threshold range, then dynamically compensating the polar coordinates of the wafer station based on a preset compensation model. 4.The robot station coordinate calibration method of claim 3, wherein the threshold range determination step comprises: The current ambient temperature T, pressure P are compared with reference values of ambient temperature , pressure ; If the temperature difference and the pressure difference are within a threshold range, it is considered to be within the threshold range. 5.The robot station coordinate calibration method of claim 3, wherein the step of dynamically compensating the polar coordinates of the wafer station based on a preset compensation model comprises: Compensation value for thermal expansion of the robot R-axis direction , and pressure compensation value : ； ； wherein is the coefficient of thermal expansion of the robot, is the robot bias model, k is the coefficient of differential deformation. Computing Compensating the polar radius parameter of the polar coordinates of the wafer station dynamically, wherein Compensating the polar radius parameter of the polar coordinates of the wafer station dynamically. 6.The robot station coordinate calibration method of claim 3, wherein the step of dynamically compensating the polar coordinates of the wafer station based on a preset compensation model further comprises: Step S8, if the threshold range is exceeded, instructing the robot to follow a predetermined process action and timely execute steps S1 to S4.

7. A robotic station coordinate calibration system, comprising: A system comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the system implements the steps of the robot station coordinate calibration method according to any one of claims 1 to 6. 8.A computer readable storage medium storing a computer program, wherein when the computer program is executed, the steps of the robot station coordinate calibration method according to any one of claims 1 to 6 are implemented.

Images