Wide-range passive wireless temperature sensor with push-pull structure

Abstract

The invention discloses a wide-range passive wireless temperature sensor with a push-pull structure. The temperature sensor comprises a substrate, a planar inductor, a V-shaped beam, the push-pull structure, an interdigital capacitor and a metal wire. When the temperature rises, thermal expansion of the V-shaped beam is caused, then the push-pull structure driving rod is driven to output displacement in the X-axis direction, the honeycomb type hexagonal structure is expanded, the bow-tie type hexagonal structure is contracted, the capacitance value of the second interdigital capacitor is increased, the resonant frequency of an LC resonant circuit composed of the interdigital capacitors and the planar inductor is decreased, and high-temperature measurement is achieved. When the temperature is reduced, the V-shaped beam is contracted, the bow-tie-shaped hexagonal structure is expanded, the honeycomb-shaped hexagonal structure is contracted, the capacitance value of the first interdigital capacitor is reduced, the resonant frequency is increased, and low-temperature measurement is achieved. The temperature sensor has the advantages of simple structure, sensitive response, wide measuring range, process compatibility and the like.

Description

Technical Field

[0001] The present invention belongs to the technical field of sensors, and particularly relates to a wide-range passive wireless temperature sensor with a push-pull structure. Background Art

[0002] Temperature monitoring plays a crucial role in many fields such as industrial production, transportation, environmental protection, and aerospace. Traditional temperature sensors mainly include thermal resistance temperature sensors, thermoelectric temperature sensors, and thermal radiation temperature sensors. Among them, thermal resistance temperature sensors have problems such as slow response speed, limited measurement range, and the need for power supply excitation; thermoelectric temperature sensors have problems such as complex signal processing, limited measurement range, and the accuracy is easily affected by the environment; thermal radiation temperature sensors have problems such as high cost, limited measurement range, and are easily affected by the environment. These obstacles will limit the further development and wide application of temperature sensors. Nowadays, sensors tend to develop in the direction of passive wireless, highly integrated, and miniaturized. Therefore, in view of the defects existing in the above-mentioned prior art, it is necessary to develop a passive wireless temperature sensor with a simple structure, sensitive response, wide measurement range, and system integration. Summary of the Invention

[0003] In view of this, the present invention is precisely aimed at the problems existing in the prior art, and provides a wide-range passive wireless temperature sensor with a push-pull structure to solve the problems faced by current temperature sensors such as high power consumption, limited measurement range, complex structure, and susceptibility to environmental influence. When the temperature rises, it causes the V-shaped beam to thermally expand, and then drives the push-pull structure drive rod to output displacement along the X-axis direction, causing the honeycomb-shaped hexagonal structure to expand and the bow-tie-shaped hexagonal structure to contract, resulting in an increase in the capacitance value of the second interdigital capacitor, and making the resonant frequency of the LC resonant circuit composed of the interdigital capacitor and the planar inductor smaller, realizing high-temperature measurement. When the temperature drops, it causes the V-shaped beam to contract, making the bow-tie-shaped hexagonal structure expand and the honeycomb-shaped hexagonal structure contract, resulting in a decrease in the capacitance value of the first interdigital capacitor, and making the resonant frequency larger, realizing low-temperature measurement.

[0004] To achieve the above object, the technical solution of the present invention is as follows. A wide-range passive wireless temperature sensor with a push-pull structure, the push-pull structure temperature sensor includes: a substrate, a planar inductor, a V-shaped beam, a push-pull structure, an interdigital capacitor, and a metal wire. The wide-range passive wireless temperature sensor with a push-pull structure is placed on a horizontal substrate as a whole.

[0005] As an improvement of the present invention, the V-shaped beam includes a first V-shaped beam, a second V-shaped beam, a first V-shaped beam anchorage area, and a second V-shaped beam anchorage area. Among them, the first V-shaped beam includes a first V-shaped beam branch, a second V-shaped beam branch, and a first V-shaped beam connection point; the second V-shaped beam includes a third V-shaped beam branch, a fourth V-shaped beam branch, and a second V-shaped beam connection point. The first V-shaped beam anchorage area and the second V-shaped beam anchorage area are both fixed on the substrate.

[0006] As an improvement of the present invention, the push-pull structure includes a honeycomb-shaped hexagonal structure, a bowtie-shaped hexagonal structure, a push-pull structure drive rod, and a push-pull structure baffle. Among them, the push-pull structure drive rod includes a first push-pull structure drive rod, a second push-pull structure drive rod, a third push-pull structure drive rod, and a fourth push-pull structure drive rod; the push-pull structure baffle includes a first push-pull structure baffle, a second push-pull structure baffle, a third push-pull structure baffle, and a fourth push-pull structure baffle. The first push-pull structure baffle, the second push-pull structure baffle, the third push-pull structure baffle, and the fourth push-pull structure baffle are all fixed on the substrate. This solution uses a honeycomb-shaped hexagon and a bowtie-shaped hexagon to achieve complementary structures, which contract or expand at high and low temperatures respectively, thereby only changing the capacitance value of the first interdigital capacitor or the second interdigital capacitor, and realizing wide-range temperature measurement.

[0007] As an improvement of the present invention, the interdigital capacitor includes a first interdigital capacitor and a second interdigital capacitor. Among them, the first interdigital capacitor includes a first interdigital electrode and a second interdigital electrode, and the second interdigital capacitor includes a third interdigital electrode and a fourth interdigital electrode. The first interdigital electrode and the fourth interdigital electrode are both fixed on the substrate.

[0008] As an improvement of the present invention, the metal wire includes a first metal wire and a second metal wire.

[0009] As an improvement of the present invention, one end of the first beam of the V-shaped beam and one end of the second beam of the V-shaped beam are respectively connected to one end of the first anchor area of the V-shaped beam and the second anchor area of the V-shaped beam. The other ends of the first beam of the V-shaped beam and the second beam of the V-shaped beam are connected to the first connection point of the V-shaped beam. One end of the third beam of the V-shaped beam and one end of the fourth beam of the V-shaped beam are respectively connected to the other end of the first anchor area of the V-shaped beam and the second anchor area of the V-shaped beam. The other ends of the third beam of the V-shaped beam and the fourth beam of the V-shaped beam are connected to the second connection point of the V-shaped beam; the second interdigital electrode, the first driving rod of the push-pull structure, the honeycomb hexagonal structure, the second driving rod of the push-pull structure, and the first connection point of the V-shaped beam are connected in sequence. The second connection point of the V-shaped beam, the third driving rod of the push-pull structure, the bow-tie hexagonal structure, the fourth driving rod of the push-pull structure, and the third interdigital electrode are connected in sequence; one end of the first metal wire is connected to the first interdigital electrode, the other end of the first metal wire is connected to one end of the planar inductor, one end of the second metal wire is connected to the fourth interdigital electrode, and the other end of the second metal wire is connected to the other end of the planar inductor.

[0010] As an improvement of the present invention, the method for using the sensor includes the following steps:

[0011] Step S1: When the temperature rises, it causes the thermal expansion of the first beam of the V-shaped beam, the second beam of the V-shaped beam, the third beam of the V-shaped beam, and the fourth beam of the V-shaped beam, and then drives the second driving rod of the push-pull structure and the third driving rod of the push-pull structure to output displacements along the negative X-axis direction and the positive X-axis direction respectively, so that the honeycomb hexagonal structure expands and contacts the first baffle of the push-pull structure and the second baffle of the push-pull structure. The bow-tie hexagonal structure contracts, resulting in the second interdigital electrode remaining stationary and the third interdigital electrode moving along the positive X-axis direction. Furthermore, the capacitance value of the first interdigital capacitor remains unchanged, and the capacitance value of the second interdigital capacitor increases, causing the resonant frequency of the LC resonant circuit composed of the interdigital capacitor and the planar inductor to become smaller, realizing high-temperature measurement.

[0012] Step S2: When the temperature drops, the first beam of the V-shaped beam, the second beam of the V-shaped beam, the third beam of the V-shaped beam, and the fourth beam of the V-shaped beam contract, and then pull the second driving rod of the push-pull structure and the third driving rod of the push-pull structure to output displacements along the positive X-axis direction and the negative X-axis direction respectively, so that the honeycomb hexagonal structure contracts, and the bow-tie hexagonal structure expands and contacts the third baffle of the push-pull structure and the fourth baffle of the push-pull structure, resulting in the second interdigital electrode moving along the positive X-axis direction and the third interdigital electrode remaining stationary. Furthermore, the capacitance value of the first interdigital capacitor decreases, and the capacitance value of the second interdigital capacitor remains unchanged, causing the resonant frequency of the resonant circuit to become larger, realizing low-temperature measurement.

[0013] Beneficial effects:

[0014] Compared with the prior art, the present invention has the following advantages. The push-pull structure temperature sensor provided by this technical solution is characterized by high sensitivity and wide range. When the temperature rises, it causes the thermal expansion of the V-shaped beam, which in turn drives the displacement of the push-pull structure drive rod along the X-axis direction, causing the honeycomb-shaped hexagonal structure to expand and the bow-tie-shaped hexagonal structure to contract, resulting in an increase in the capacitance value of the second interdigital capacitor, and making the resonance frequency of the LC resonance circuit composed of the interdigital capacitor and the planar inductor decrease, thus realizing high-temperature measurement. When the temperature drops, it causes the V-shaped beam to contract, making the bow-tie-shaped hexagonal structure expand and the honeycomb-shaped hexagonal structure contract, resulting in a decrease in the capacitance value of the first interdigital capacitor, and making the resonance frequency increase, thus realizing low-temperature measurement. This temperature sensor has the advantages of simple structure, sensitive response, wide range, and process compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. is a schematic structural diagram of a wide-range passive wireless temperature sensor with a push-pull structure provided in the present invention.

[0016] Figure 2 FIG. is a sectional view taken along line A-A' of a wide-range passive wireless temperature sensor with a push-pull structure provided in the present invention.

[0017] The notations in the figures are as follows:

[0018] 1. Substrate; 2. Planar inductor; 311. First beam of V-shaped beam; 312. Second beam of V-shaped beam; 313. Third beam of V-shaped beam; 314. Fourth beam of V-shaped beam; 321. First connection point of V-shaped beam; 322. Second connection point of V-shaped beam; 331. First anchor area of V-shaped beam; 332. Second anchor area of V-shaped beam; 411. Honeycomb-shaped hexagonal structure; 412. Bow-tie-shaped hexagonal structure; 421. First drive rod of push-pull structure; 422. Second drive rod of push-pull structure; 423. Third drive rod of push-pull structure; 424. Fourth drive rod of push-pull structure; 431. First baffle of push-pull structure; 432. Second baffle of push-pull structure; 433. Third baffle of push-pull structure; 434. Fourth baffle of push-pull structure; 511. First interdigital electrode; 512. Second interdigital electrode; 513. Third interdigital electrode; 514. Fourth interdigital electrode; 61. First metal wire; 62. Second metal wire. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] To deepen the understanding of the present invention, the following detailed description is given in conjunction with the accompanying drawings for this embodiment:

[0020] Embodiment 1: Refer to Figure 1 - Figure 2 , this embodiment provides a wide-range passive wireless temperature sensor with a push-pull structure, and this temperature sensor includes:

[0021] Substrate 1, planar inductor 2, V-shaped beam, push-pull structure, interdigital capacitor, metal wire. The planar inductor and the metal wire are both fixed on the substrate.

[0022] The V-shaped beam includes a first V-shaped beam, a second V-shaped beam, a first anchor area 331 of the V-shaped beam, and a second anchor area 332 of the V-shaped beam. Among them, the first V-shaped beam includes a first beam 311 of the V-shaped beam, a second beam 312 of the V-shaped beam, and a first connection point 321 of the V-shaped beam; the second V-shaped beam includes a third beam 313 of the V-shaped beam, a fourth beam 314 of the V-shaped beam, and a second connection point 322 of the V-shaped beam. The first anchor area 331 of the V-shaped beam and the second anchor area 332 of the V-shaped beam are both fixed on the substrate 1.

[0023] The push-pull structure includes a honeycomb-shaped hexagonal structure 411, a bow-tie-shaped hexagonal structure 412, a driving rod of the push-pull structure, and a baffle of the push-pull structure. Among them, the driving rod of the push-pull structure includes a first driving rod 421 of the push-pull structure, a second driving rod 422 of the push-pull structure, a third driving rod 423 of the push-pull structure, and a fourth driving rod 424 of the push-pull structure; the baffle of the push-pull structure includes a first baffle 431 of the push-pull structure, a second baffle 432 of the push-pull structure, a third baffle 433 of the push-pull structure, and a fourth baffle 434 of the push-pull structure. The first baffle 431 of the push-pull structure, the second baffle 432 of the push-pull structure, the third baffle 433 of the push-pull structure, and the fourth baffle 434 of the push-pull structure are all fixed on the substrate 1.

[0024] The interdigital capacitor includes a first interdigital capacitor and a second interdigital capacitor. Among them, the first interdigital capacitor includes a first interdigital electrode 511 and a second interdigital electrode 512, and the second interdigital capacitor includes a third interdigital electrode 513 and a fourth interdigital electrode 514. The first interdigital electrode 511 and the fourth interdigital electrode 514 are both fixed on the substrate 1.

[0025] The metal wire includes a first metal wire 61 and a second metal wire 62.

[0026] One end of the first beam 311 of the V-shaped beam and one end of the second beam 312 of the V-shaped beam are respectively connected to one end of the first anchor area 331 of the V-shaped beam and one end of the second anchor area 332 of the V-shaped beam. The other ends of the first beam 311 of the V-shaped beam and the second beam 312 of the V-shaped beam are connected to the first connection point 321 of the V-shaped beam. One end of the third beam 313 of the V-shaped beam and one end of the fourth beam 314 of the V-shaped beam are respectively connected to the other end of the first anchor area 331 of the V-shaped beam and the other end of the second anchor area 332 of the V-shaped beam. The other ends of the third beam 313 of the V-shaped beam and the fourth beam 314 of the V-shaped beam are connected to the second connection point 322 of the V-shaped beam; the second interdigital electrode 512, the first driving rod 421 of the push-pull structure, the honeycomb-shaped hexagonal structure 411, the second driving rod 422 of the push-pull structure, and the first connection point 321 of the V-shaped beam are connected in sequence. The second connection point 322 of the V-shaped beam, the third driving rod 423 of the push-pull structure, the bow-tie-shaped hexagonal structure 412, the fourth driving rod 424 of the push-pull structure, and the third interdigital electrode 513 are connected in sequence; one end of the first metal wire 61 is connected to the first interdigital electrode 511, the other end of the first metal wire 61 is connected to one end of the planar inductor 2, one end of the second metal wire 62 is connected to the fourth interdigital electrode 514, and the other end of the second metal wire 62 is connected to the other end of the planar inductor 2.

[0027] The usage method of the wide-range passive wireless temperature sensor with a push-pull structure described in this embodiment includes the following steps:

[0028] Step S1, referring to Figure 1 - Figure 2 , when the temperature rises, it causes the thermal expansion of the first beam 311 of the V-shaped beam, the second beam 312 of the V-shaped beam, the third beam 313 of the V-shaped beam, and the fourth beam 314 of the V-shaped beam, and then drives the second driving rod 422 of the push-pull structure and the third driving rod 423 of the push-pull structure to output displacements along the negative X-axis direction and the positive X-axis direction respectively, so that the honeycomb-shaped hexagonal structure 411 expands and contacts the first baffle 431 of the push-pull structure and the second baffle 432 of the push-pull structure, and the bow-tie-shaped hexagonal structure 412 contracts, resulting in the immobility of the second interdigital electrode 512 and the movement of the third interdigital electrode 513 along the positive X-axis direction. Furthermore, the capacitance value of the first interdigital capacitor remains unchanged, the capacitance value of the second interdigital capacitor increases, causing the resonance frequency of the LC resonance circuit formed by the interdigital capacitor and the planar inductor 2 to become smaller, realizing high-temperature measurement.

[0029] Step S2: When the temperature decreases, the first V-beam 311, the second V-beam 312, the third V-beam 313, and the fourth V-beam 314 contract, thereby pulling the second driving rod 422 and the third driving rod 423 of the push-pull structure to output displacements along the positive X-axis direction and the negative X-axis direction respectively, causing the honeycomb hexagonal structure 411 to contract, and the bow-tie hexagonal structure 412 to expand and contact the third baffle 433 and the fourth baffle 434 of the push-pull structure. As a result, the second interdigital electrode 512 moves along the positive X-axis direction and the third interdigital electrode 513 remains stationary. Furthermore, the capacitance value of the first interdigital capacitor decreases and the capacitance value of the second interdigital capacitor remains unchanged, causing the resonance frequency of the resonance circuit to increase, realizing low-temperature measurement.

[0030] In summary, a wide-range passive wireless temperature sensor with a push-pull structure in the present invention is different from other temperature sensors. The push-pull structure temperature sensor has the following main characteristics: First, it realizes temperature measurement by the change of the capacitance value of the interdigital capacitor, improving sensitivity and accuracy; Second, through the expansion or contraction of the V-beam, the horizontal displacement directions output by the driving rods of the push-pull structure are different, thereby causing the change of the capacitance values of different interdigital capacitors; Third, it realizes wide-range temperature measurement through the push-pull structure.

[0031] The criteria for distinguishing whether it is this structure are as follows:

[0032] (a) Using the interdigital capacitor structure to realize temperature measurement;

[0033] (b) Using the honeycomb and bow-tie hexagonal structures to form a push-pull structure;

[0034] (c) Driving the push-pull structure through the V-beam;

[0035] (d) Realizing wide-range temperature measurement through the push-pull structure.

[0036] A structure that meets the above four conditions should be regarded as the push-pull structure temperature sensor of this structure.

[0037] Those not detailed in the present invention are all well-known technologies to those skilled in the art.

[0038] The preferred specific embodiments of the present invention have been described in detail above. It should be understood that those of ordinary skill in the art can make many modifications and variations according to the concept of the present invention without creative work. Therefore, all technical solutions that can be obtained by those skilled in the art in the technical field of the present invention based on the concept of the present invention through logical analysis, reasoning, or limited experiments on the basis of the existing technology should be within the protection scope determined by the claims.

Claims

1. A wide-range passive wireless temperature sensor with a push-pull structure, characterized in that The push-pull structure temperature sensor includes a substrate (1), a planar inductor (2), a V-shaped beam, a push-pull structure, interdigital capacitors, and metal wires, and the planar inductor and the metal wires are both fixed on the substrate (1).

2. The wide-range passive wireless temperature sensor with a push-pull structure according to claim 1, characterized in that, The V-shaped beam includes a first V-shaped beam, a second V-shaped beam, a first V-shaped beam anchor region (331), and a second V-shaped beam anchor region (332). Among them, the first V-shaped beam includes a first V-shaped beam branch (311), a second V-shaped beam branch (312), and a first V-shaped beam connection point (321); the second V-shaped beam includes a third V-shaped beam branch (313), a fourth V-shaped beam branch (314), and a second V-shaped beam connection point (322). The first V-shaped beam anchor region (331) and the second V-shaped beam anchor region (332) are both fixed on the substrate (1).

3. The wide-range passive wireless temperature sensor with a push-pull structure according to claim 2, characterized in that, The push-pull structure includes a honeycomb hexagonal structure (411), a bowtie hexagonal structure (412), a push-pull structure drive rod, and a push-pull structure baffle. Among them, the push-pull structure drive rod includes a first push-pull structure drive rod (421), a second push-pull structure drive rod (422), a third push-pull structure drive rod (423), and a fourth push-pull structure drive rod (424); the push-pull structure baffle includes a first push-pull structure baffle (431), a second push-pull structure baffle (432), a third push-pull structure baffle (433), and a fourth push-pull structure baffle (434). The first push-pull structure baffle (431), the second push-pull structure baffle (432), the third push-pull structure baffle (433), and the fourth push-pull structure baffle (434) are all fixed on the substrate (1).

4. The wide-range passive wireless temperature sensor with a push-pull structure according to claim 3, characterized in that, The interdigital capacitors include a first interdigital capacitor and a second interdigital capacitor. Among them, the first interdigital capacitor includes a first interdigital electrode (511) and a second interdigital electrode (512), and the second interdigital capacitor includes a third interdigital electrode (513) and a fourth interdigital electrode (514). The first interdigital electrode (511) and the fourth interdigital electrode (514) are both fixed on the substrate (1).

5. The wide-range passive wireless temperature sensor with a push-pull structure according to claim 4, characterized in that, The metal wires include a first metal wire (61) and a second metal wire (62).

6. The wide-range passive wireless temperature sensor with a push-pull structure according to claim 5, characterized in that, One end of the first V-beam (311) and the second V-beam (312) is respectively connected to one end of the first V-beam anchor area (331) and the second V-beam anchor area (332). The other ends of the first V-beam (311) and the second V-beam (312) are connected to the first V-beam connection point (321). One end of the third V-beam (313) and the fourth V-beam (314) is respectively connected to the other ends of the first V-beam anchor area (331) and the second V-beam anchor area (332). The other ends of the third V-beam (313) and the fourth V-beam (314) are connected to the second V-beam connection point (322). The second interdigital electrode (512), the first driving rod of the push-pull structure (421), the honeycomb hexagonal structure (411), the second driving rod of the push-pull structure (422), and the first V-beam connection point (321) are connected in sequence. The second V-beam connection point (322), the third driving rod of the push-pull structure (423), the bow-tie hexagonal structure (412), the fourth driving rod of the push-pull structure (424), and the third interdigital electrode (513) are connected in sequence. One end of the first metal wire (61) is connected to the first interdigital electrode (511), and the other end of the first metal wire (61) is connected to one end of the planar inductor (2). One end of the second metal wire (62) is connected to the fourth interdigital electrode (514), and the other end of the second metal wire (62) is connected to the other end of the planar inductor (2).

7. The wide-range passive wireless temperature sensor with a push-pull structure according to claim 6, characterized in that, The usage method of the sensor includes the following steps: Step S1: When the temperature rises, it causes the thermal expansion of the first V-beam (311), the second V-beam (312), the third V-beam (313), and the fourth V-beam (314), thereby driving the second driving rod (422) and the third driving rod (423) of the push-pull structure to output displacements along the negative X-axis direction and the positive X-axis direction respectively, expanding the honeycomb hexagonal structure (411) and making it contact with the first baffle (431) and the second baffle (432) of the push-pull structure. The bow-tie hexagonal structure (412) contracts, resulting in the immobility of the second interdigital electrode (512) and the movement of the third interdigital electrode (513) along the positive X-axis direction. Furthermore, the capacitance value of the first interdigital capacitor remains unchanged, and the capacitance value of the second interdigital capacitor increases, causing the resonance frequency of the LC resonance circuit formed by the interdigital capacitor and the planar inductor (2) to become smaller, realizing high-temperature measurement; Step S2: When the temperature decreases, the first V-shaped beam (311), the second V-shaped beam (312), the third V-shaped beam (313), and the fourth V-shaped beam (314) contract, thereby pulling the second driving rod (422) and the third driving rod (423) of the push-pull structure to output displacements along the positive X-axis direction and the negative X-axis direction respectively, causing the honeycomb hexagonal structure (411) to contract, and the bowtie hexagonal structure (412) to expand and contact the third baffle (433) and the fourth baffle (434) of the push-pull structure, resulting in the second interdigital electrode (512) moving along the positive X-axis direction and the third interdigital electrode (513) remaining stationary. Furthermore, the capacitance value of the first interdigital capacitor decreases and the capacitance value of the second interdigital capacitor remains unchanged, causing the resonance frequency of the resonant circuit to increase, achieving low-temperature measurement.

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