A probe for chip or package substrate prober and its manufacturing process

Abstract

The present application relates to a kind of probe for chip or package substrate test, by being plated with metal layer between insulating coating and probe body in the end of needle head, to form annular positioning member, the clearance is formed between annular positioning member and probe body, since the better uniformity of the outer ring surface of annular positioning member, uneven support point such as burr cannot appear;At the same time, the hardness and stability of metal layer are superior to insulating coating, even if being subjected to the collision stress with the surface of fixture plate in long-term use process, it is not easy to deform or shift, can keep good perpendicularity, to make the coating side of probe middle section have high uniformity and perpendicularity, form uniform support when contacting with fixture plate, avoid the probe skewing caused by insulating coating burr or deformation, ensure the needle head top of all probes on detection fixture is on the same plane, guarantee all probes and chip good contact, to improve the precision of chip detection.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chip detection, in particular to a probe for chip or package substrate detection and a preparation process thereof. BACKGROUND

[0002] As a basic material for manufacturing semiconductor devices (such as chips), a wafer needs to be contacted with a chip circuit on the wafer by means of a probe in the manufacturing process, so as to detect various electrical parameters of the chip, such as voltage, current, resistance, capacitance, etc. Vertical probe contact is the most common form of contact, in which the probe is perpendicular to the wafer surface, and the test fixture is brought close to the wafer by means of precise mechanical control devices, so as to make the probe on the test fixture contact the pads or test points on the wafer.

[0003] A plurality of rhenium-tungsten alloy probes are densely arranged on a fixture clamping plate of the existing test fixture. The surface of each probe is gold-plated, and the middle section of the probe is coated with an insulating coating layer, and only the gold-plated layers at both ends are exposed. The plurality of probes on the fixture clamping plate are in one-to-one correspondence with the test points on the wafer, the end of each probe is electrically connected to the test equipment, and the needle of the probe penetrates through the fixture clamping plate so as to directly contact the test points when the wafer is close. The fixture clamping plate is composed of a front plate and a rear plate, the front plate is provided with a plurality of through holes corresponding to the number of probes, and the rear plate is provided with a plurality of fixing holes corresponding to the number of probes. The end of the probe is connected to the fixing hole and completes the electrical connection in the hole; the needle of the probe penetrates through the front plate and the needle is movably arranged in the through hole. A gap is reserved between the front plate and the rear plate, and the insulating coating layer at the middle section of the probe is located at the gap position of the front plate and the rear plate.

[0004] In the test process of the test fixture, since the rhenium-tungsten alloy probe has a certain elasticity and toughness, when the needle of the probe contacts the chip pad and is subjected to force, the middle end portion of the probe needle body is bent and deformed at the gap of the fixture clamping plate, and the needle of the probe is retracted into the front plate. When the needle of the probe is away from the chip, the middle end portion of the probe needle body returns to the straight state, and the retracted needle again penetrates through the front plate, at this time, the edge side of the insulating coating layer at the middle section of the probe abuts against the front plate of the fixture clamping plate, and plays a limiting role.

[0005] In practical use, it was found that the flatness of the edge of the probe's insulating coating was not ideal, with some burrs present. When the edge of the insulating coating contacts the front panel, some protruding burrs or uneven areas contact the front panel first, forming uneven support points and causing the probe to tilt. Furthermore, even if the flatness of the edge of the insulating coating is initially controlled, the insulating coating material is relatively soft and its adhesion to the probe body is insufficient. When the probe returns to a straight position, the edge of the insulating coating collides with the front panel, and after prolonged impact, the edge of the insulating coating is prone to irregular deformation or displacement, resulting in insufficient perpendicularity of the edge of the insulating coating, which also leads to probe tilting.

[0006] As is well known, the tip of some skewed probes in a test fixture will inevitably not be on the same plane as the tips of other probes. During chip testing, it is impossible to guarantee that all probes make good contact with the chip, which seriously affects the testing accuracy.

[0007] The above problems are worth solving. Summary of the Invention

[0008] To overcome the problem that the edge perpendicularity of the insulating coating layer of existing chip test probes is insufficient, resulting in insufficient detection accuracy of the test fixture, this invention provides a probe for chip or packaged substrate packaging and its fabrication process.

[0009] The technical solution of this invention is as follows:

[0010] A probe for chip or packaging substrate packaging testing includes a gold-plated probe body, with an insulating coating layer deposited outside the gold-plated layer in the middle section of the probe body. The probe body is characterized by having an annular metal layer deposited around it near the probe tip end of the insulating coating layer, between the insulating coating layer and the probe body, to form an annular positioning element near the probe tip end of the insulating coating layer. The outer annular surface of the annular positioning element is perpendicular to the probe body, forming a clear angle between the annular positioning element and the probe body. When the probe is reset and its tip passes through a fixture plate, the outer annular surface of the annular positioning element abuts against the surface of the fixture plate.

[0011] As a preferred embodiment of the present invention, the thickness of the annular positioning member is uniform.

[0012] As a preferred embodiment of the present invention, the thickness of the annular positioning element gradually increases along the direction from the needle tail to the needle tip, and the thickness of the annular positioning element remains consistent in the circumferential direction of the probe body.

[0013] As a preferred embodiment of the present invention, the probe body surface in the region between the annular positioning element and the needle is coated with a self-lubricating film layer.

[0014] As a preferred embodiment of the present invention, the annular positioning element is made of metal, such as nickel, gold, or silver.

[0015] As a preferred embodiment of the present invention, the probe body is made of tungsten, rhenium-tungsten alloy or P7 alloy.

[0016] As a preferred embodiment of the present invention, the probe body has a pointed tip, a round tip, a chisel-shaped tip, or a pointed-round tip.

[0017] As a preferred embodiment of the present invention, the length of the probe body is 200 micrometers to 30 millimeters; the diameter of the probe body is 10 micrometers to 110 micrometers.

[0018] As a preferred embodiment of the present invention, the thickness of the insulating coating layer is 10±5 micrometers.

[0019] The present invention also provides a process for preparing the probes for chip or packaging substrate packaging described above, comprising the following steps:

[0020] Step 1: Probe body preparation;

[0021] A short section of material that meets the required length is cut from the roll, one of the elements selected from gold, silver, copper, nickel, iron, lead, and zinc in the gold salt content is added, and the material is straightened to form the probe body.

[0022] Step 2: Gold salt pretreatment;

[0023] Electrolysis is used to remove a certain element from the gold salt content, and the element removed is the same as the element added in step 1.

[0024] Step 3: The treated gold salt is electroplated onto the surface of the probe body to form a gold plating layer;

[0025] Step 4: Electroplat a metal layer around the gold-plated surface of the probe body near the tip in the middle section of the probe body to form a ring-shaped positioning element on the probe body.

[0026] Step 5: Use 3D photolithography and micro-etching processes to process the outer ring surface of the annular positioning component so that the outer ring surface is perpendicular to the probe body and the connection between the annular positioning component and the probe body is a clear corner.

[0027] Step 6: Apply an insulating coating to the middle section of the probe body, ensuring that the edge of the insulating coating near the tip does not extend beyond the outer ring surface of the annular positioning element.

[0028] Step 7: Apply a self-lubricating coating to the gold-plated surface in the area between the annular positioning element and the needle.

[0029] Furthermore, the straightening process is carried out in a vacuum environment, using clamps to hold both ends of the cut section, and through several hot and cold cycles, until the bent cut section is straightened.

[0030] According to the above-described solution, the beneficial effects of this invention are as follows:

[0031] This invention replaces the soft limiting of the insulating coating layer with a rigid limiting ring-shaped positioning component. The outer ring surface of the ring-shaped positioning component is perpendicular to the probe body. Because the outer ring surface of the ring-shaped positioning component has better flatness, there will be no uneven support points such as burrs. At the same time, the hardness and stability of the metal ring-shaped positioning component are better than those of the insulating coating layer. During long-term use, even if it is subjected to collision force with the surface of the fixture plate, it is not easy to deform or shift, and it can maintain good perpendicularity and form uniform support when in contact with the fixture plate.

[0032] It is evident that the annular positioning element plays a stable limiting role during the probe reset process, preventing probe skew caused by burrs or deformation of the insulating coating, ensuring that the tips of all probes on the testing fixture are on the same plane, and guaranteeing good contact between all probes and the chip, thereby improving the accuracy of chip testing. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present invention;

[0034] Figure 2 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0035] Figure 3 This is a schematic diagram illustrating the application scenarios of the probe;

[0036] Figure 4 This is a schematic diagram of the structure of an existing probe.

[0037] In the diagram,

[0038] 1. Probe body; 2. Insulating coating layer; 3. Annular positioning element; 4. Self-lubricating coating layer; 5. Corner clearing element; 6. Fixture plate. Detailed Implementation

[0039] To better understand the purpose, technical solution, and technical effects of this invention, the invention will be further explained and described below in conjunction with the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It is also stated that the embodiments described below are only for explaining this invention and are not intended to limit this invention.

[0040] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as "connected to" another component, it can be directly connected to the other component or there may be an intermediate component.

[0041] The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product is usually placed when in use, or the orientation or positional relationship in which a person skilled in the art would normally understand it, or the orientation or positional relationship in which the product is usually placed when in use. It is only for the purpose of facilitating the description of this application and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0042] Example 1

[0043] like Figure 1 and Figure 3 As shown, a probe for chip or packaging substrate packaging testing includes a probe body 1 with gold plating on its surface. An insulating coating layer 2 is plated on the gold plating layer in the middle section of the probe body 1. An annular metal layer is plated around the probe body 1 near the end of the insulating coating layer 2 and between the insulating coating layer 2 and the probe body 1, so as to form an annular positioning member 3 at this end of the insulating coating layer 2. The outer annular surface of the annular positioning member 3 is perpendicular to the probe body 1, and a clear angle 5 is formed between the annular positioning member 3 and the probe body 1. When the probe is reset and the needle tip passes through the fixture plate 6 (the front plate of the test fixture), the outer annular surface of the annular positioning member 3 abuts against the surface of the fixture plate 6.

[0044] This invention forms an annular positioning element 3 by plating a metal layer between the insulating coating layer 2 and the probe body 1 near the needle tip. During the electroplating process, metal ions can be deposited relatively uniformly on the surface of the probe body 1. Compared with the soft material used in the insulating coating layer 2, the metal material is relatively hard and uniform after solidification and forming. The hard texture makes it less likely for irregular protrusions or depressions to be generated during the formation of the annular surface, thus helping to ensure the flatness of the side. Moreover, once the annular positioning element 3 is formed, due to the good strength and toughness of the metal, it can better resist surface deformation caused by external forces and maintain flatness for a long time.

[0045] The outer ring surface of the annular positioning element 3 is perpendicular to the probe body 1. When the probe is reset and the needle tip passes through the fixture plate 6, the outer ring surface of the annular positioning element 3 abuts against the surface of the fixture plate 6. Compared with the original edge side of the insulating coating layer 2, the outer ring surface of the annular positioning element 3 has better flatness, which effectively avoids the probe skew problem caused by uneven support points, ensures that the tip of all probes on the testing fixture is on the same plane, and ensures that all probes have good contact with the chip, thereby improving the accuracy of chip testing.

[0046] The probe body 1 is made of one of the following materials: tungsten, rhenium-tungsten alloy, or P7 alloy (P7 alloy is a special metal alloy containing a certain proportion of nickel, chromium, and other alloying elements). Each of these materials has its advantages, ensuring the probe's service life. For example, the high strength and toughness of rhenium-tungsten alloy allow the probe body 1 to withstand these external forces without easily breaking or excessively deforming, effectively protecting the probe's structural integrity. Rhenium-tungsten alloy also has excellent fatigue resistance, enabling it to withstand long-term, high-frequency cyclic loading without fatigue damage. P7 alloy has good machinability, allowing for the use of more suitable processes during manufacturing to enhance the bond strength between the annular positioning element 3 and the probe body 1, further ensuring the overall stability and service life of the probe.

[0047] The probe body 1 has a pointed, round, chisel-shaped, or pointed-rounded tip shape. A pointed tip has a sharp end and a small contact area, suitable for detecting tiny test points on a chip. A round tip has a smooth, rounded end and a relatively large contact area, suitable for detecting chip test points with sensitive or easily damaged surfaces. A pointed-rounded tip has a tip that is both sharp and rounded, similar to a round tip but with a finer point, suitable for scenarios requiring high accuracy in test point positioning while also needing some protection of the test point surface. A chisel-shaped tip resembles a chisel, with a wide, flat end and a specific angle, suitable for testing scenarios requiring a large contact area and strong scratching ability.

[0048] In this embodiment, the annular positioning member 3 has a uniform thickness, forming a regular and stable limiting structure. When the probe is reset, its uniform thickness ensures that the stress distribution of each part of the probe is balanced when it is under force, effectively avoiding the probe tilting phenomenon caused by uneven local force, and greatly improving the stability of the probe during the test process.

[0049] like Figure 2As shown, in other preferred embodiments, the thickness of the annular positioning element 3 gradually increases from the needle tail to the needle tip, and the thickness of the annular positioning element 3 remains consistent along the circumference of the probe body 1. The annular positioning element 3 forms a slope near the insulating coating layer 2. This slope provides a larger surface area for coating the insulating material, allowing for the application of more insulating material than in conventional designs. This increased insulating material provides better insulation protection. Furthermore, from a structural mechanics perspective, the insulating coating layer 2 acts as a buffer on the slope of the annular positioning element 3. When the outer side of the metal positioning ring is impacted by an external force, the insulating coating layer 2 can absorb some of the energy, reducing the impact force on the annular positioning element 3 and the probe body 1.

[0050] In this embodiment, the annular positioning element 3 can be made of nickel, gold, or silver. Nickel and common probe body 1 materials (such as rhenium-tungsten alloy) have certain similarities in crystal structure, allowing nickel atoms to better match and combine with the atoms of the probe body 1 material during deposition, forming a stable crystal interface and thus enhancing the bonding force between the two. Gold has a low surface energy, and during electroplating, gold atoms can effectively wet the surface of the probe body 1, allowing it to adhere uniformly to the probe body 1, which helps to form a tight contact between gold and the probe body 1, achieving a strong bond. Silver has high chemical reactivity, and during electroplating, silver ions can react chemically with the surface of the probe body 1, forming a strong chemical bond, making the bond between silver and the probe body 1 even stronger. During chip packaging and testing, the probe undergoes frequent stretching, contraction, and collision actions. A strong bond ensures that the annular positioning element 3 remains tightly attached to the probe body 1, continuously fulfilling its limiting and positioning functions.

[0051] The length of the probe body 1 is 200 micrometers to 30 millimeters, and can be 200 micrometers, 500 micrometers, 1 millimeter, 2 millimeters, 5 millimeters, 11 millimeters, 15 millimeters, 20 millimeters, or 30 millimeters.

[0052] The diameter of the probe body 1 is from 10 micrometers to 110 micrometers, and can be 10 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, 70 micrometers, 90 micrometers, or 110 micrometers.

[0053] The insulating coating layer 2 has a thickness of 10±5 micrometers, providing stable and reliable insulation protection for the probe. In actual chip testing, the middle section of the probe will bend to a certain extent. The appropriate thickness of the insulating coating layer 2 can accommodate this deformation and maintain the integrity of its insulation function. The flexible insulating coating layer 2 also helps to improve the toughness of the middle section of the probe. The stable and reliable insulating coating layer 2 can reduce failures and repeated tests caused by insulation problems during the testing process, thereby improving the efficiency of chip packaging and testing. It can be seen that the characteristic of the insulating coating layer 2 having a thickness of 10±5 micrometers is of great significance in terms of the probe's insulation performance, flexibility, and chip packaging and testing efficiency. It is one of the key factors to ensure the normal operation of the probe and accurate chip testing.

[0054] To achieve micron-level thicknesses in the insulating coating, advanced coating processes are typically employed. In the spraying process, the deposition amount of insulating material is adjusted by precisely controlling the parameters of the spraying equipment, thereby achieving the desired thickness. For example, using high-precision spraying equipment, the insulating material is uniformly sprayed into the gold-plated layer of the probe body 1 in a mist-like manner. Through multiple thin coats and precise parameter adjustments, the final thickness of the insulating coating 2 is stabilized within the target range.

[0055] Example 2

[0056] like Figure 2 As shown, due to the frequent friction between the probe and the test fixture during long-term use, the surface of the probe body will wear down, affecting its service life and test accuracy. This embodiment is an improvement on the first embodiment.

[0057] A probe for chip or packaging substrate packaging testing includes a gold-plated probe body 1. Similar to Embodiment 1, the probe body 1 has an insulating coating layer 2 plated outside the gold-plated layer in the middle section. Near the tip of the insulating coating layer 2, a metal layer is plated between the insulating coating layer 2 and the probe body 1 to form an annular positioning element 3. The difference is that the probe body 1 surface in the area between the annular positioning element 3 and the tip is coated with a self-lubricating coating layer 4, which has an extremely low coefficient of friction. During use, it generates friction with the inner wall of the hole. In the continuous friction process, it can automatically "repair" the surface unevenness, so that the surface of the probe body 1 maintains a good lubrication state.

[0058] In one optional embodiment, the self-lubricating coating layer is made of Teflon. During use, as Teflon rubs against other objects, the molecules on its surface undergo a certain degree of directional alignment. Teflon molecular chains possess high flexibility and fluidity; when the surface is subjected to friction, the molecular chains gradually adjust their orientation, making the friction surface smoother, thereby further reducing the coefficient of friction and exhibiting the characteristic of becoming increasingly lubricated with use. Just as Teflon can automatically "repair" surface unevenness during continuous friction, maintaining a good lubricated state.

[0059] During chip packaging and testing, probes need to frequently extend and retract through the perforations of the test fixture board 6. After coating with a self-lubricating film layer 4, the frictional resistance between the probe body 1 and the test fixture can be significantly reduced, making the extension and retraction of the probe smoother and reducing the jamming caused by excessive friction, thereby improving testing efficiency.

[0060] In summary, this invention innovatively introduces a metal transition layer at the end of the insulating layer to form a composite coating structure, thereby creating an annular positioning element on the side of the coating on the probe body. This effectively avoids the probe skewing problem caused by uneven support points on the side of the coating. During long-term use, even when subjected to collision forces with the surface of the fixture plate, the annular positioning element is not prone to deformation or displacement, maintaining good perpendicularity of the coating side. This further ensures that the probe will not skew due to the edge of the insulating coating, providing stable support for the probe and making it more stable during use. This reduces detection errors or other problems that may be caused by probe instability, improving the overall performance and reliability of the test fixture.

[0061] This invention also provides a method for fabricating probes for chip packaging and testing, comprising the following steps:

[0062] Step 1: Probe body preparation;

[0063] A short section of the required length is cut from a coil of material, which can be tungsten coil or rhenium-tungsten alloy coil. One element from the gold, silver, copper, nickel, iron, lead, or zinc content is added to the cut section, and the section is then straightened to form the probe body. The straightening process is carried out in a vacuum environment, using clamps to hold both ends of the cut section, and through several cycles of hot and cold treatment, the bent section is straightened.

[0064] The principle of straightening is as follows: During the winding process, metal coils accumulate significant internal stress. During straightening, clamps hold both ends of the cut section and apply external force. Simultaneously, a hot-cold cycle causes the metal material to undergo expansion and contraction. In this process, the internal stress is released and redistributed. When the stress state changes, the driving force for the metal material to return to its original shape also changes, making it difficult for the metal to return to its original coiled shape, thus eliminating metal memory.

[0065] Adding elements to the cut section can be achieved through alloying, specifically by fusing the desired element, in the form of a pure metal, with the coil material at high temperature, resulting in a uniform distribution of the added element within the coil material matrix. Alternatively, elements can be added through diffusion, utilizing the diffusion motion of atoms at high temperatures to allow the atoms of the added element to diffuse from high-concentration areas into the interior of the coil material, thereby achieving element addition.

[0066] Step 2: Gold salt pretreatment;

[0067] Electrolysis is used to remove a certain element from the gold salt content, and the element removed is the same as the element added in step 1.

[0068] Step 3: The treated gold salt is electroplated onto the surface of the probe body to form a gold plating layer;

[0069] Without pretreatment, gold plating on rhenium-tungsten alloys or tungsten surfaces can easily introduce crystal defects and voids, which can lead to displacement of the annular positioning element. Because the gold salt is pretreated, the elements added to the probe body can alter the crystal structure characteristics of the probe body surface, making it more compatible with the crystal structure of the gold salt. During electroplating, gold atoms can deposit and grow more orderly on the probe body surface, forming a more regular and compact crystal structure, reducing crystal defects and voids, thereby improving the adhesion between the gold plating layer and the probe body.

[0070] Step 4: Electroplat a metal layer around the gold-plated surface of the probe body near the tip in the middle section of the probe body to form a ring-shaped positioning element on the probe body.

[0071] Step 5: Use 3D photolithography and micro-etching processes to process the outer ring surface of the annular positioning component so that the outer ring surface is perpendicular to the probe body and the connection between the annular positioning component and the probe body is a clear corner.

[0072] Step 6: Apply an insulating coating to the middle section of the probe body, ensuring that the edge of the insulating coating near the tip does not extend beyond the outer ring surface of the annular positioning element.

[0073] Step 7: Apply a self-lubricating coating to the gold-plated surface in the area between the annular positioning element and the needle.

[0074] The self-lubricating coating is made of Teflon powder and can be applied by spraying. Specifically, the Teflon coating is evenly applied to the gold-plated surface in the area between the annular positioning part and the needle using spraying equipment to ensure that the Teflon coating is evenly covered on the surface.

[0075] In summary, this invention replaces the soft limiting of the insulating coating layer with a rigid, annular positioning element. The outer surface of this annular positioning element is perpendicular to the probe body. Because the outer surface of the annular positioning element has better flatness, it avoids uneven support points such as burrs. Furthermore, the hardness and stability of the metal annular positioning element are superior to the insulating coating layer. Even under impact forces from collisions with the fixture plate during long-term use, it is not prone to deformation or displacement. Therefore, the annular positioning element plays a stable limiting role during probe resetting, preventing probe skew and ensuring that the tips of all probes on the testing fixture are on the same plane, guaranteeing good contact between all probes and the chip, thereby improving the accuracy of chip testing.

[0076] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A probe for die or package substrate probers, comprising a surface gold plated probe body, an insulating cladding layer plated outside the gold plated layer of the middle section of the probe body, characterized in that, An annular metal layer is plated around the probe body between the insulating coating layer and the probe body at the end of the insulating coating layer close to the needle, so as to form an annular positioning member at the end of the insulating coating layer close to the needle; and the edge of the end of the insulating coating layer close to the needle does not exceed the outer side surface of the annular positioning member, the outer side surface of the annular positioning member is perpendicular to the probe body, and a clear corner is formed between the annular positioning member and the probe body; when the probe is reset and the needle thereof penetrates through the jig plate, the outer side surface of the annular positioning member abuts against the surface of the jig plate.

2. The probe for die or package substrate prooing according to claim 1, wherein, The thickness of the annular positioning member is uniform.

3. The probe for die or package substrate prooing according to claim 1, wherein, The thickness of the annular positioning member gradually increases in the direction from the needle tail to the needle, and the thickness of the annular positioning member remains unchanged in the circumferential direction of the probe body.

4. The probe for chip or package substrate prooing according to claim 1, wherein, The surface of the probe body in the region between the annular positioning member and the needle is coated with a self-lubricating film layer.

5. The probe for die or package substrate prooing according to claim 1, wherein, The material of the probe body is one of tungsten, rhenium-tungsten alloy or P7 alloy.

6. The probe for chip or package substrate prooing according to claim 1, wherein, The shape of the needle of the probe body is one of a pointed head, a round head, a chisel-shaped head or a pointed round head.

7. The probe for chip or package substrate prooing according to claim 1, wherein, The length of the probe body is 200 microns to 30 millimeters; and the diameter of the probe body is 10 microns to 110 microns.

8. The probe for chip or package substrate prooing according to claim 1, wherein, The thickness of the insulating coating layer is 10±5 microns.

9. A process for manufacturing a probe for probing a chip or a package substrate as claimed in any one of claims 1 to 8, characterized in that, The method comprises the following steps: Step 1, preparing the probe body A small piece with a length requirement is cut from a roll of material, one of gold, silver, copper, nickel, iron, lead and zinc is added to the gold salt content, and the small piece is straightened to form a probe body; Step 2, gold salt pretreatment An electrolytic technique is used to remove one element in the gold salt content, and the removed element is the same as the element added in step 1; Step 3, forming a gold plating layer on the surface of the probe body by electroplating the treated gold salt Step 4, electroplating a metal layer around the probe body on the surface of the gold plating layer at the end of the probe body close to the needle, so as to form an annular positioning member on the probe body; Step 5, processing the outer side surface of the annular positioning member by using a 3D photoetching process and a micro-etching process, so that the outer side surface is perpendicular to the probe body, and the joint between the annular positioning member and the probe body is a clear corner; Step 6, coating an insulating coating layer on the middle section of the probe body, and making the edge of the end of the insulating coating layer close to the needle not exceed the outer side surface of the annular positioning member; Step 7, coating a self-lubricating film layer on the surface of the gold plating layer in the region between the annular positioning member and the needle.

10. The process for probing of a chip or a package substrate according to claim 9, wherein, In step 1, the straightening process is performed in a vacuum environment, the two ends of the cut piece are clamped by a clamp plate, and several cold and hot cycles are performed until the bent cut piece is straightened.

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