Multilayer glass substrate and preparation method thereof
By flip-fitting welding of multi-layer glass substrates and using glass sheet support and resin filling, the problems of substrate flatness and low manufacturing yield are solved, and a high yield multi-layer glass substrate preparation is achieved.
Patent Information
- Application Number
- CN202510480014.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-17
- Publication Date
- 2025-08-01
AI Technical Summary
In the prior art, as the chip test pins increase, the area of the adapter card substrate increases, resulting in the deterioration of the surface flatness and the test PAD position, which is especially serious in high-temperature testing, and the traditional glass substrate manufacturing process has many steps and low yield.
The preparation method of multi-layer glass substrate is adopted, by flip-fitting welding of multiple glass sub-substrates, and using glass sheet support and resin filling during the welding process, ensuring good surface planarity of the substrate is reduced and the working steps of a single glass core are improved to improve manufacturing yield.
When the total number of substrate layers is large, the substrate has good flatness and improved manufacturing yield, which solves the problem of low flatness and yield in traditional processes.
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of probe cards, and specifically to a multi-layer glass substrate and a preparation method thereof. Background Art
[0002] In the semiconductor industry, before a chip is packaged, a probe card is usually used to detect the functions of the chip, so as to reduce the risk of defective chips being packaged and reduce production costs. The adapter substrate is one of the main components of the probe card. As the number of chip test pins increases, the area of the adapter substrate gradually increases. Currently used substrates are mostly organic boards. After the area of such substrates becomes larger, the surface flatness becomes worse, and the positional accuracy of the test PADs also becomes worse, especially during high-temperature testing. This phenomenon causes great trouble to the production and testing of probe cards.
[0003] The glass substrate has a small thermal expansion coefficient and is not easily deformed, so it can well solve the above problems. However, the traditional glass substrate manufacturing process is similar to the manufacturing process of packaging substrates, that is, multiple (usually more than five or six) redistribution layers are made on both sides of a glass core. Such a process results in more operation steps on one glass core and a lower manufacturing yield. Summary of the Invention
[0004] In order to overcome the defects in the prior art, an embodiment of the present invention provides a multi-layer glass substrate and a preparation method thereof, which are used to solve the above problems.
[0005] An embodiment of the present application discloses: a preparation method of a multi-layer glass substrate, including the following steps:
[0006] Provide a first glass sub-substrate, and redistribution layers are provided on both sides of the first glass sub-substrate;
[0007] Provide a second glass sub-substrate, and redistribution layers are provided on both sides of the second glass sub-substrate;
[0008] Flip-chip bond the first glass sub-substrate and the second glass sub-substrate to form a multi-layer glass substrate.
[0009] Specifically, the method for flip-chip bonding the first glass sub-substrate and the second glass sub-substrate includes the following steps:
[0010] Print copper paste at the solder joint positions on the side of the first glass sub-substrate facing the second glass sub-substrate;
[0011] Flip the first glass sub-substrate and attach it to the second glass sub-substrate, and then heat and apply pressure for welding.
[0012] Specifically, before the step of "inverting and attaching the first glass substrate onto the second glass substrate, and then heating and pressing for welding", the following steps are further included:
[0013] Take a plurality of glass flakes, the thickness of the glass flakes being between 90 and 110 μm;
[0014] Place the plurality of glass flakes on the second glass substrate, and the plurality of glass flakes are evenly placed at non-welding points of the second glass substrate.
[0015] Specifically, after the step of "inverting and attaching the first glass substrate onto the second glass substrate, and then heating and pressing for welding", the following steps are further included:
[0016] Fill resin between the first glass substrate and the second glass substrate, and cure the resin.
[0017] Specifically, the preparation method of the first glass substrate includes the following steps:
[0018] Provide a first glass core, and fabricate a plurality of first through-holes on the first glass core by TGV via process;
[0019] Fill the first through-holes with metallic copper by electroplating process to form a plurality of first vias;
[0020] Polish both sides of the first glass core;
[0021] Fabricate at most two redistribution layers on each of the two surfaces of the first glass core to form the first glass substrate, and the redistribution layers on the two surfaces of the first glass core are connected by the first vias.
[0022] Specifically, before the step of "providing a first glass core, and fabricating a plurality of first through-holes on the first glass core by TGV via process", the following steps are further included: provide a first glass plate, divide the first glass plate into a plurality of regions, each region being used to form one first glass core; after the step of "fabricate at most two redistribution layers on each of the two surfaces of the first glass core to form the first glass substrate, and the redistribution layers on the two surfaces of the first glass core are connected by the first vias", the following steps are further included: cut the first glass plate to obtain a plurality of independent first glass substrates.
[0023] Specifically, the preparation method of the second glass substrate includes the following steps:
[0024] Provide a second glass core, and fabricate a plurality of second through-holes on the second glass core by TGV via process;
[0025] Fill the second through-holes with metallic copper by electroplating to form a plurality of second vias.
[0026] Polish both sides of the second glass core.
[0027] Fabricate at most two redistribution layers on each of the two sides of the second glass core to form the second glass sub-substrate, and the redistribution layers on the two sides of the second glass core are connected through the second vias.
[0028] Specifically, before the step of "providing a second glass core and fabricating a plurality of second through-holes on the second glass core by TGV via process", it further includes: providing a second glass plate, dividing the second glass plate into a plurality of regions, and each region is used to form a second glass core; after the step of "fabricating at most two redistribution layers on each of the two sides of the second glass core to form the second glass sub-substrate, and the redistribution layers on the two sides of the second glass core are connected through the second vias", it further includes: cutting the second glass plate to obtain a plurality of independent second glass sub-substrates.
[0029] Specifically, in the step of "flip-chip bonding the first glass sub-substrate and the second glass sub-substrate to form a multi-layer glass substrate", it further includes: flip-chip bonding a third glass sub-substrate to the first glass sub-substrate or the second glass sub-substrate, and redistribution layers are provided on both sides of the third glass sub-substrate.
[0030] The embodiment of the present application also discloses: a multi-layer glass substrate prepared by the method described in this embodiment.
[0031] The present invention has at least the following beneficial effects:
[0032] 1. The multi-layer glass substrate of this embodiment is formed by flip-chip bonding a plurality of glass sub-substrates. In this way, when the total number of layers of the substrate is relatively large, the total number of layers of the substrate can be distributed on a plurality of different glass cores, which can reduce the operation steps of a single glass core and is beneficial to improving the manufacturing yield.
[0033] 2. When the glass sub-substrates of this embodiment are flip-chip bonded, a glass thin sheet is provided between the two glass sub-substrates, and the glass thin sheet supports the upper glass sub-substrate during the welding process to ensure good flatness of the glass substrate after welding. Detailed implementation manners
[0034] The technical solutions in the embodiments of the present invention will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected", "fixed", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood through specific circumstances.
[0036] In the present invention, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first feature and the second feature, or may include the situation where the first feature and the second feature are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "below", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath", and "under" the second feature includes that the first feature is below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.
[0037] In the description of this embodiment, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation on the protection scope of this application.
[0038] In addition, the terms "first", "second", etc. are only used for distinction in description and have no special meanings.
[0039] The preparation method of the multi-layer glass substrate of this embodiment mainly includes the following steps:
[0040] Step 1: Provide a first glass sub-substrate, and redistribution layers are provided on both the front and back surfaces of the first glass sub-substrate.
[0041] Step 2: Provide a second glass sub-substrate, and redistribution layers are provided on both the front and back surfaces of the second glass sub-substrate.
[0042] Step 3: Flip-chip bond the first glass sub-substrate and the second glass sub-substrate to form a multi-layer glass substrate.
[0043] Preferably, in this embodiment, the third glass substrate can also be flip-chip welded to the first glass substrate or the second glass substrate, and redistribution layers are respectively provided on both the front and back sides of the third glass substrate.
[0044] The multi-layer glass substrate of this embodiment is formed by sequentially flip-chip welding a plurality of glass substrates, and the number of layers of the glass substrate corresponds to the number of glass substrates.
[0045] Specifically, the method for flip-chip welding the first glass substrate and the second glass substrate includes the following steps:
[0046] Step 1: Print solder paste at the solder joint positions on the surface of the first glass substrate to be connected to the second glass substrate.
[0047] Step 2: Flip-chip attach the first glass substrate onto the second glass substrate, and then heat and press for welding.
[0048] Furthermore, before flip-chip attaching the first glass substrate onto the second glass substrate, the following steps are also included:
[0049] Step 1: Take a plurality of glass flakes with the same thickness. The thickness of each glass flake is between 90 and 110 μm (preferably 100 μm). The shape of the glass flake can be rectangular, square or circular. Taking the square glass flake as an example, its size is controlled between 1 mm × 1 mm. If the glass flake is rectangular, its length is between 1.0 and 1.2 mm, its width is between 0.6 and 0.8 mm, and the diameter of the circular glass flake is about 1 mm.
[0050] Step 2: Place a plurality of glass flakes on the second glass substrate, and the plurality of glass flakes are evenly distributed at the non-solder joint positions of the second glass substrate.
[0051] Adopting the above solution, glass flakes are arranged at the non-solder joint positions of the first glass substrate and the second glass substrate, which can support the two substrates during heating and pressing welding, ensuring good flatness of the multi-layer glass substrate after flip-chip welding.
[0052] Furthermore, after flip-chip attaching the first glass substrate onto the second glass substrate and heating and pressing for welding, the following steps are also included:
[0053] Step 1: Fill resin between the first glass substrate and the second glass substrate, and cure the resin.
[0054] Adopting the above solution, filling resin between the first glass substrate and the second glass substrate, on the one hand, the resin can play a supporting role, and on the other hand, the resin can make the two substrates stick more firmly.
[0055] Specifically, the preparation method of the first glass substrate in this embodiment includes the following steps:
[0056] Step 1: Provide a first glass core, and fabricate a plurality of first through-holes on the first glass core by the TGV via process.
[0057] Step 2: Fill the plurality of first through-holes with metallic copper by electroplating to form a plurality of first vias.
[0058] Step 3: Polish both sides of the first glass core so that the end faces at both ends of the first through-holes are respectively flush with the front and back surfaces of the first glass core. In other words, make the flatness of the two surfaces of the first glass core meet the design requirements.
[0059] Step 4: Fabricate at most two redistribution layers on both surfaces of the first glass core respectively to form the first glass substrate, and the redistribution layers on the front and back surfaces of the first glass core are connected through the first vias.
[0060] Further, before fabricating the first through-holes on the first glass core, it further includes: providing a first glass plate, preprocessing the first glass plate, and then dividing the first glass plate into a plurality of regions, each region being used to correspondingly form a first glass core. That is to say, in this embodiment, when performing hole punching, hole filling, etc. on not only one first glass core but also multiple first glass cores simultaneously, the convenience and efficiency of the operation can be improved. After a plurality of first glass substrates are formed on the first glass plate, the first glass plate is cut to obtain a plurality of independent first glass substrates, that is, the plurality of first glass substrates are no longer connected by the waste tape on the first glass plate, for subsequent welding.
[0061] The preparation method of the second glass substrate in this embodiment is generally the same as that of the first glass substrate, including the following steps:
[0062] Step 1: Provide a second glass core, and fabricate a plurality of second through-holes on the second glass core by the TGV via process.
[0063] Step 2: Fill the plurality of second through-holes with metallic copper by electroplating to form a plurality of second vias.
[0064] Step 3: Polish both sides of the second glass core, and the function of this step is the same as that of polishing both sides of the first glass core.
[0065] Step 4: Fabricate at most two redistribution layers on both surfaces of the second glass core respectively to form the second glass substrate, and the redistribution layers on the front and back surfaces of the second glass core are connected through the second vias.
[0066] Similar to the first glass substrate, multiple second glass substrates can also be fabricated on a second glass plate simultaneously and then cut into multiple individual second glass substrates.
[0067] The following uses a specific case to elaborate in detail on the preparation method of the multi-layer glass substrate of this embodiment.
[0068] Case 1
[0069] Step 1: Laser process the first glass plate to perform laser drilling on the first glass plate.
[0070] Step 2: Immerse the first glass plate in an etching solution for etching to etch through the holes drilled by laser in Step 1 to form first through-holes.
[0071] Step 3: Fill the first through-holes on the first glass plate with copper through electroplating.
[0072] Step 4: Polish both sides of multiple first glass cores on the first glass plate so that both ends of the first vias are on the same horizontal plane as the two surfaces of the first glass cores.
[0073] Step 5: Fabricate two layers on each of the two surfaces of the first glass core, that is, two redistribution layers are provided on each surface of the first glass core, and a total of four redistribution layers on both the front and back sides to form the first glass substrate.
[0074] Step 6: Conduct electrical performance tests on each first glass substrate on the first glass plate, and mark the first glass substrates with problems.
[0075] Step 7: Cut each first glass substrate on the first glass plate, and take out the substrates without electrical performance problems for standby.
[0076] Repeat the above Steps 1 to 7 to fabricate the second glass substrate and the third glass substrate.
[0077] Step 8: Take a glass sheet with a thickness of 100 μm, cut it into multiple glass flakes of 1 mm × 1 mm size for standby.
[0078] Step 9: Print copper paste at the solder joint positions of the first glass substrate.
[0079] Step 10: Uniformly place several glass flakes at non-solder joint positions of the second glass substrate, then attach the first glass substrate to the second glass substrate, and perform flip-chip soldering by heating and pressing.
[0080] Step 11: Fill the resin between the first glass substrate and the second glass substrate, and cure the resin.
[0081] Repeat steps 8 to 11 to flip-chip bond the second glass substrate and the third glass substrate to obtain a multi-layer glass substrate.
[0082] Step 12: Conduct a final electrical performance test on the multi-layer glass substrate, check the flatness and PAD position of the multi-layer glass substrate without problems in the test, and those that pass the inspection are determined to be qualified products.
[0083] In the present invention, specific embodiments are used to elaborate on the principles and implementation manners of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present invention.
Claims
1. A method for preparing a multi-layer glass substrate, characterized in that, Including the following steps: Providing a first glass substrate, wherein redistribution layers are provided on both sides of the first glass substrate; Providing a second glass substrate, wherein redistribution layers are provided on both sides of the second glass substrate; Flip-chip welding the first glass substrate and the second glass substrate to form a multi-layer glass substrate.
2. The manufacturing method of the multi-layer glass substrate according to claim 1, characterized in that, The method for flip-chip welding the first glass substrate and the second glass substrate includes the following steps: Printing copper paste at the solder joint positions on the side of the first glass substrate facing the second glass substrate; Flip-chip attaching the first glass substrate to the second glass substrate, and then heating and pressurizing for welding.
3. The method for preparing a multi-layer glass substrate according to claim 2, wherein Before the step of "flip-chip attaching the first glass substrate to the second glass substrate, and then heating and pressurizing for welding", it further includes: Taking a plurality of glass flakes, the thickness of the glass flakes being between 90 and 110 μm; Placing the plurality of glass flakes on the second glass substrate, and the plurality of glass flakes being evenly placed at non-solder joint positions on the second glass substrate.
4. The manufacturing method of the multi-layer glass substrate according to claim 2, characterized in that, After the step of "flip-chip attaching the first glass substrate to the second glass substrate, and then heating and pressurizing for welding", it further includes: Filling resin between the first glass substrate and the second glass substrate, and curing the resin.
5. The method for preparing a multi-layer glass substrate according to claim 1, wherein, The preparation method of the first glass substrate includes the following steps: Providing a first glass core, and fabricating a plurality of first through-holes on the first glass core by TGV via process; Filling the first through-holes with metallic copper by electroplating process to form a plurality of first vias; Polishing both sides of the first glass core; Fabricating at most two redistribution layers on each of the two sides of the first glass core to form the first glass substrate, and the redistribution layers on the two sides of the first glass core are connected through the first vias.
6. The manufacturing method of the multi-layer glass substrate according to claim 5, characterized in that, Before the step of "providing a first glass core, and fabricating a plurality of first through-holes on the first glass core by TGV via process", it further includes: providing a first glass plate, dividing the first glass plate into a plurality of regions, each region being used to form one first glass core; after the step of "fabricating at most two redistribution layers on each of the two sides of the first glass core to form the first glass substrate, and the redistribution layers on the two sides of the first glass core are connected through the first vias", it further includes: cutting the first glass plate to obtain a plurality of independent first glass substrates.
7. The manufacturing method of the multi-layer glass substrate according to claim 1, characterized in that, The preparation method of the second glass substrate includes the following steps: Providing a second glass core, and fabricating a plurality of second through-holes on the second glass core by TGV via process; Filling the second through-holes with metallic copper by electroplating process to form a plurality of second vias; Polishing both sides of the second glass core; Fabricating at most two redistribution layers on each of the two sides of the second glass core to form the second glass substrate, and the redistribution layers on the two sides of the second glass core are connected through the second vias.
8. The manufacturing method of the multi-layer glass substrate according to claim 7, characterized in that, Before the step of "providing a second glass core and fabricating a plurality of second vias on the second glass core by means of TGV via process", the following steps are further included: providing a second glass plate, dividing the second glass plate into a plurality of regions, each region being used for forming a second glass core; after the step of "fabricating at most two redistribution layers on two faces of the second glass core respectively to form the second glass sub-substrate, and connecting the redistribution layers on the two faces of the second glass core through the second vias", the following step is further included: cutting the second glass plate to obtain a plurality of independent second glass sub-substrates.
9. The manufacturing method of the multi-layer glass substrate according to claim 1, wherein, In the step of "flip-chip bonding the first glass sub-substrate and the second glass sub-substrate to form a multi-layer glass substrate", the following step is further included: flip-chip bonding a third glass sub-substrate to the first glass sub-substrate or the second glass sub-substrate, and redistribution layers are provided on both faces of the third glass sub-substrate.
10. A multi-layer glass substrate, characterized in that, Prepared by the method according to any one of claims 1 to 9.