Automatic aging equipment for semiconductor

Abstract

A semiconductor automatic aging device disclosed by the present invention is characterized in that the semiconductor automatic aging device comprises a box body, a test mechanism and a transmission mechanism, the test mechanism and the transmission mechanism are arranged in the box body, the test mechanism comprises a feeding table and a test table, and the feeding table comprises a feeding plate. The test bench comprises a water cooling plate, an input member used for inputting a power supply, an output member used for outputting a feedback signal, and a follow current capacitor used for carrying out follow current on a member to be tested. The input member is electrically connected with the follow current capacitor. The transmission mechanism comprises a horizontal transmission assembly, a first vertical assembly and a second vertical assembly, the first vertical assembly is in sliding connection with the horizontal transmission assembly, and the first vertical assembly comprises a first air cylinder and a manipulator connected with a transmission shaft of the first air cylinder; the second vertical assembly comprises a second air cylinder and a signal plate connected with a transmission shaft of the second air cylinder. The device is very convenient and safe to test a large-scale semiconductor device, and is power-saving.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor testing, and particularly to a semiconductor automatic aging device. Background Art

[0002] In the semiconductor field, as a commonly used large semiconductor device, the IGBT device is generally tested by manually installing the device under test (usually an IGBT device) on the test device. During the test, the position of the device under test also needs to be manually adjusted, which is very inconvenient and unsafe. Because testing large semiconductor devices usually requires high temperature and high pressure tests with large currents, and as long as the test device is powered on, the device under test will be continuously tested, often resulting in ineffective testing of the device under test and high power consumption. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a semiconductor automatic aging device, which is very convenient, safe and power-saving for testing large semiconductor devices.

[0004] The purpose of the present invention is achieved by the following technical solutions: A semiconductor automatic aging device includes a box body, a testing mechanism and a transmission mechanism arranged in the box body. The testing mechanism includes a loading platform and a testing platform. The loading platform includes a loading plate. The testing platform includes a water-cooled plate, an input component for inputting power, an output component for outputting feedback signals, and a freewheeling capacitor for freewheeling the device under test. The input component is electrically connected to the freewheeling capacitor. The transmission mechanism includes a horizontal transmission component, a first vertical component and a second vertical component. The first vertical component is slidably connected to the horizontal transmission component. The first vertical component includes a first cylinder and a manipulator connected to the transmission shaft of the first cylinder. The second vertical component includes a second cylinder and a signal plate connected to the transmission shaft of the second cylinder. When the manipulator grabs the device under test from the loading plate, the manipulator drives the device under test to the water-cooled plate through the horizontal transmission component. When the input end of the device under test is electrically connected to the input component, the transmission shaft of the second cylinder drives the signal plate to be electrically connected to the device under test, and the signal plate enables the device under test to enter the test state. The output end of the device under test is electrically connected to the output component, and the output component outputs feedback signals.

[0005] Preferably, the loading platform further includes a first platform body and an air knife. A first opening is provided on the first platform body. One end of the air knife is fixed in the first opening. The loading plate is fixed to the upper end of the first platform body. Installation holes and first sliding holes facilitating the manipulator to clamp the device under test are provided on the loading plate. The first opening is communicated with the installation holes.

[0006] Preferably, the test bench further includes a second body and a conductive block. The water-cooling plate is fixed to the upper end of the second body. The water-cooling plate is provided with water inlet and outlet holes, a second sliding hole, and a water tank for installing the device under test. The input member and the output member are respectively fixed to both ends of the water-cooling plate through the conductive block, and the water inlet and outlet holes are communicated with the water tank.

[0007] Preferably, the test mechanism further includes a dehydration table, which includes a dehydration plate and a third body. The third body is provided with a second opening, and the other end of the air knife extends into the second opening. The dehydration plate is provided with a mounting groove, a third sliding hole, and a drain pipe. The second opening and the drain pipe are both communicated with the mounting groove.

[0008] Preferably, the test mechanism further includes a control console, which includes a control switch. The control switch is electrically connected to the input member. The first sliding hole, the second sliding hole, and the third sliding hole are all arranged in parallel. The manipulator includes two clamping arms and two clamping fingers that can pass through the first sliding hole, the second sliding hole, and the third sliding hole. The clamping fingers are fixed to one end of the clamping arms.

[0009] Preferably, the transmission mechanism further includes a third vertical assembly, which includes a third cylinder and a pressing plate connected to the transmission shaft of the third cylinder. When the device under test is tested, the transmission shaft of the second cylinder drives the signal plate to separate from the device under test. When the manipulator brings the device under test to the mounting groove of the dehydration plate through the horizontal transmission assembly, the transmission shaft of the third cylinder drives the pressing plate to press the device under test steadily, and the air knife dehydrates the device under test.

[0010] Preferably, the second vertical assembly further includes a cylinder frame, a pressing rod, and a temperature sensor for detecting the temperature of the device under test. The second cylinder is arranged in the cylinder frame, the signal plate is arranged at the lower end of the cylinder frame, and the pressing rod and the temperature sensor are both arranged on both sides of the signal plate. When the second cylinder drives the signal plate to press down, the pressing rod presses the output member to electrically connect the output member with the output end of the device under test.

[0011] Preferably, the second vertical assembly further includes a signal pin, an insulating block, and a pressing rod for pressing the device under test. The pressing rod and the signal pin are both fixed to the lower end of the signal plate. The signal plate is electrically connected to the device under test through the signal pin. The insulating block is fixed to the lower end of the pressing rod, and the output member is a reed.

[0012] Preferably, the box body includes a test cabinet, a support plate is arranged in the test cabinet, the horizontal transmission assembly includes a transmission shaft and a conveyor belt for driving the first vertical assembly to slide, the transmission shaft is arranged on the conveyor belt, and the transmission shaft is fixed on the support plate.

[0013] Preferably, the box body further includes a power supply cabinet and a bottom cabinet, the power supply cabinet is arranged at the upper end of the test cabinet, the bottom cabinet is arranged at the lower end of the test cabinet, an industrial control computer and an integrated power supply are arranged in the power supply cabinet, the signal board is electrically connected to the industrial control computer, and the input component is electrically connected to the integrated power supply.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: The semiconductor automatic aging equipment disclosed in the present application discloses a test mechanism and a transmission mechanism. When a user places a device under test on the loading table of the test mechanism, the manipulator on the transmission mechanism can transport the device under test to the test table through the horizontal transmission assembly, and then the test can be carried out. During the test, there is no need for manual adjustment of the device under test, and the test is convenient and safe.

[0015] In addition, when the transmission shaft of the second cylinder on the second vertical assembly presses down in this aging equipment, the device under test can be tested. The pressing time of the transmission shaft of the second cylinder can be set as needed to adjust the test time, so it is not easy to continuously test the device under test invalidly. Moreover, a freewheeling capacitor is also provided. The freewheeling capacitor can not only filter, but also store electricity. The freewheeling capacitor can also supply power to the device under test through discharging, thereby saving electricity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a three-dimensional structural schematic diagram of the semiconductor automatic aging equipment of the present invention; Figure 2 is a three-dimensional structural schematic diagram of the transmission mechanism and the test mechanism of the present invention; Figure 3 is a three-dimensional structural schematic diagram of a part of the transmission mechanism of the present invention; Figure 4 is a three-dimensional structural schematic diagram of the second vertical assembly of the present invention; Figure 5 is Figure 1 an enlarged structural schematic diagram of part A in; Figure 6 is a three-dimensional structural schematic diagram of the test table of the present invention; Figure 7 is a three-dimensional structural schematic diagram of the dehydration table of the present invention; Figure 8 is a three-dimensional structural schematic diagram of the frame of the present invention; Figure 9 is a three-dimensional structural schematic diagram of the integrated power supply and the industrial control computer of the present invention; Figure 10 This is a schematic perspective view of a partial bottom cabinet of the present invention.

[0017] In the figure: 10, box body; 11, power cabinet; 111, integrated power supply; 112, industrial control computer; 113, heat dissipation holes; 224, handle; 225, connecting piece; 12, test cabinet; 121, support plate; 122, middle hole; 13, bottom cabinet; 131, bottom cover; 132, water pipe; 133, solenoid valve; 134, flowmeter; 14, frame body; 20, transmission mechanism; 21, horizontal transmission assembly; 211, transmission shaft; 212, conveyor belt; 22, first vertical assembly; 221, first cylinder; 222, manipulator; 223, clamping arm; 224, clamping finger; 23, second vertical assembly; 231, cylinder frame; 232, signal plate; 233, pressing rod; 234, temperature sensor; 235, pressing rod; 236, signal pin; 237, insulating block; 24, third vertical assembly; 241, third cylinder; 242, pressing plate; 30, test mechanism; 31, loading platform; 311, loading plate; 312, first table body; 313, first sliding hole; 32, test table; 321, water-cooled plate; 322, second table body; 323, capacitor; 324, input part; 325, output part; 326, conductive block; 327, water tank; 328, second sliding hole; 329, water inlet and outlet hole; 33, dehydration platform; 331, dehydration plate; 332, third table body; 333, air knife; 334, second opening; 335, third sliding hole; 336, drain pipe; 34, control console; 35, wire groove; 40, part to be tested. Detailed implementation manners

[0018] In order to more clearly understand the specific technical solutions, features and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0019] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "horizontal", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the present invention is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0020] Such as Figures 1-6As shown in the figure, a semiconductor automatic aging device disclosed in the present application includes a box body 10, a testing mechanism 30 and a transmission mechanism 20 arranged in the box body 10. The testing mechanism 30 includes a loading table 31 and a testing table 32. The loading table 31 includes a loading plate 311. The testing table 32 includes a water-cooling plate 321, an input component 324 for inputting power, an output component 325 for outputting feedback signals, and a freewheeling capacitor 323 for freewheeling the device under test 40. The input component 324 is electrically connected to the freewheeling capacitor 323. The transmission mechanism 20 includes a horizontal transmission component 21, a first vertical component 22 and a second vertical component 23. The first vertical component 22 is slidably connected to the horizontal transmission component 21. The first vertical component 22 includes a first cylinder 221 and a manipulator 222 connected to the transmission shaft of the first cylinder 221. The second vertical component 23 includes a second cylinder (not shown) and a signal plate 232 connected to the transmission shaft of the second cylinder. After the manipulator 222 grabs the device under test 40 from the loading plate 311, the manipulator 222 transfers the device under test 40 to the water-cooling plate 321 through the horizontal transmission component 21. When the input end of the device under test 40 is electrically connected to the input component 324, the transmission shaft of the second cylinder drives the signal plate 232 to be electrically connected to the device under test 40. The signal plate 232 enables the device under test 40 to enter the test state. The output end of the device under test is electrically connected to the output component 325, and the output component 325 outputs feedback signals.

[0021] In the above embodiment, the semiconductor automatic aging device disclosed in the present application includes a testing mechanism 30 and a transmission mechanism 20. After the user places the device under test 40 on the loading table 31 of the testing mechanism 30, the manipulator 222 can grab the device under test, and the horizontal transmission component 21 transfers the manipulator 222 to the testing table 32. The manipulator 222 then places the device under test on the water-cooling plate 321 for testing. During the test, there is no need for manual adjustment of the position of the device under test 40, which is convenient and safe for testing. In addition, in this aging device, when the transmission shaft 211 of the second cylinder on the second vertical component 23 presses down, the device under test 40 can be tested. The pressing time of the transmission shaft of the second cylinder can be set as needed to adjust the test time, so that the device under test will not be continuously tested invalidly. A freewheeling capacitor 323 is also provided. The freewheeling capacitor 323 can not only filter, but also store electricity. The freewheeling capacitor 323 can also supply power to the device under test 40 by discharging, thereby saving electricity.

[0022] Among them, the device under test is generally an IGBT device. The input component 324 can input a large current to the IGBT device under test. The input component 324 can be electrically connected to the emitter or collector of the IGBT device. When the second cylinder drives the signal board 232 to be electrically contacted with the gate of the IGBT device, the test of the IGBT device starts. The user or the industrial control computer can judge the performance of the IGBT device under test according to the feedback signal (current signal) output by the IGBT device under test.

[0023] As Figures 2-4 shown, in a preferred embodiment, the second vertical component 24 further includes a cylinder frame 231, a pressing rod 233, a signal pin 236, an insulating block 237, a temperature sensor 234 for detecting the temperature of the device under test, and a pressing rod 235 for pressing the device under test. The second cylinder is arranged in the cylinder frame 231. The signal board 232 is arranged at the lower end of the cylinder frame 231. The pressing rod 233 and the temperature sensor 234 are both arranged on both sides of the signal board 232. When the second cylinder drives the signal board 232 to press down, the pressing rod 233 presses the output component 325, so that the output component 325 is electrically connected to the output end of the device under test 40. The pressing rod 235 and the signal pin 236 are both fixed at the lower end of the signal board 232. The signal board 232 is electrically connected to the device under test 40 through the signal pin 236. The insulating block 237 is fixed at the lower end of the pressing rod 233. The output component 325 is a reed.

[0024] In the above embodiment, the pressing rod 233 can press the output component 325 through the conductive block 326. The signal pin 236 is conducive to transmitting the signal on the signal board 232 to the device under test 40. The signal pin 236 can be a copper probe. The insulating block 237 can prevent the pressing rod 233 from conducting electricity. The pressing rod 235 can make the device under test 40 be more stably installed in the water tank. The temperature sensor 234 can be electrically connected to the console 34. When the temperature of the device under test 40 is too high, the console 34 can disconnect the device under test 40 from the test. Both the reed and the output component 325 can be elastic copper sheets. The output component 325 can also be directly fixed at the lower end of the pressing rod 233.

[0025] In a preferred embodiment, as Figure 2 and Figure 5As shown, the loading table 31 further includes a first table body 225 and an air knife 333. A first opening (not shown) is provided on the first table body 225, and one end of the air knife 333 is fixed in the first opening. The loading plate 311 is fixed to the upper end of the first table body 312. The loading plate 311 is provided with a mounting hole and a first sliding hole 313 that facilitates the manipulator 222 to grip the test piece 40. The first opening is communicated with the mounting hole.

[0026] In the above embodiment, the first sliding hole 313 facilitates the manipulator 222 to place the test piece 40. The mounting hole can prevent the test piece from slipping. The air knife 333 can blow air to the test piece 40 through the first opening, which is beneficial to drying the test piece 40.

[0027] In a preferred embodiment, as Figure 6 shown, the test table 32 further includes a second table body 322 and a conductive block 326. The water-cooled plate 321 is fixed to the upper end of the second table body 322. The water-cooled plate 321 is provided with a water inlet and outlet hole 329, a second sliding hole 328, and a water tank 327 for mounting the test piece. The input member 324 and the output member 325 are respectively fixed to both ends of the water-cooled plate 321 through the conductive block 326. The water inlet and outlet hole 329 is communicated with the water tank 327.

[0028] In the above embodiment, the water-cooled plate 321 is beneficial to cooling the test piece 40. The conductive block 326 makes the electrical connection between the input member 324 and the freewheeling capacitor 323 more stable. The water inlet and outlet hole 329 is beneficial to the water inlet and outlet of the water tank. The second sliding hole 328 is beneficial to placing the test piece 40. The output member 325 can output a large current.

[0029] In a preferred embodiment, as Figure 7 shown, the test mechanism 30 further includes a dehydration table 33. The dehydration table 33 includes a dehydration plate 331 and a third table body 332. A second opening 334 is provided on the third table body 332. The other end of the air knife 333 extends into the second opening 334. The dehydration plate 331 is provided with a mounting groove, a third sliding hole 335, and a drain pipe 336. The second opening 334 and the drain pipe 336 are both communicated with the mounting groove. As Figure 5As shown, the transmission mechanism 20 further includes a third vertical component 24, and the third vertical component 24 includes a third cylinder 241 and a pressing plate 242 connected to the transmission shaft of the third cylinder 241; when the test piece 40 has been tested, the transmission shaft of the second cylinder drives the signal plate 232 to disengage from the test piece 40, and when the manipulator 222 brings the test piece 40 to the installation groove of the dehydration plate 331 through the horizontal transmission component 21, the transmission shaft of the third cylinder 241 drives the pressing plate 242 to press the test piece 40 firmly, and the air knife 333 dehydrates the test piece 40.

[0030] In the above embodiment, the installation groove can prevent the test piece 40 from sliding, the third sliding hole 335 is conducive to placing the test piece 40, and the drain pipe 336 passes through the dehydration plate 331 and communicates with the installation groove. Since the test piece 40 is taken out from the water tank 327, there are easily water droplets or water vapor at the bottom of the test piece 40. The air knife 333 blows air to the test piece 40 in the installation groove through the second opening 334, so that the water droplets on the test piece 40 are discharged through the drain pipe 336. The pressing plate 242 makes the test piece more stably installed in the water tank 327.

[0031] As Figures 2-7 shown, in a preferred embodiment, the testing mechanism 30 further includes a console 34, the console 34 includes a control switch, the control switch is electrically connected to the input member 324, the first sliding hole 313, the second sliding hole 328 and the third sliding hole 335 are all arranged in parallel, the manipulator 222 includes two clamping arms 223 and two clamping fingers 224 that can pass through the first sliding hole 313, the second sliding hole 328 and the third sliding hole 335, and the clamping fingers 224 are fixed at one end of the clamping arms 223.

[0032] In the above embodiment, the control switch can control the on and off of the power supply. In order to make it more conducive for the clamping fingers 224 to pass through the first sliding hole 313, the second sliding hole 328 and the third sliding hole 335, position sensors are arranged on the loading table 31, the testing table 32, the dehydration table 33 and the console 34. The clamping fingers 224 are L-shaped copper sheets, and a PLC controller is also arranged on the console 34. The position sensors are electrically connected to the PLC controller.

[0033] As Figures 8-10 shown, in a preferred embodiment, the box body 10 includes a power cabinet 11, a testing cabinet 12 and a bottom cabinet 13, and a support plate 121 is arranged in the testing cabinet 12. As Figure 3As shown, the horizontal transmission assembly 21 includes a transmission shaft 211 and a conveyor belt 212 for driving the first vertical assembly 22 to slide. The transmission shaft 211 is disposed on the conveyor belt 212 and fixed to the support plate 121. The power cabinet 11 is disposed at the upper end of the test cabinet 12, and the bottom cabinet 13 is disposed at the lower end of the test cabinet 12. An industrial control computer 112 and an integrated power supply 111 are provided in the power cabinet 11. The signal board 232 is electrically connected to the industrial control computer 112, and the input member 324 is electrically connected to the integrated power supply 111.

[0034] In the above embodiment, the cylinder frame 231 is also fixed to the support plate 121. To prevent short circuits, the wires on the test cabinet 12 can be arranged in a wire groove 35. The industrial control computer 112 and the integrated power supply 111 are respectively electrically connected to the console 34. The industrial control computer 112 can control the console 34, and the integrated power supply 111 can input a test current to the test bench 32. Heat dissipation holes 113 are provided on the industrial control computer 112. Connecting members 225 and handles 224 are provided on both the integrated power supply 111 and the industrial control computer 112. Both the integrated power supply 111 and the industrial control computer 112 can be fixed in the power cabinet 11 through the connecting members 225. A bottom cover 131 is provided in the bottom cabinet 13. A water pipe 132, a solenoid valve 133, and a flow meter 134 that communicate with each other are provided on the bottom cover 131. The solenoid valve 133 is used to control the water flow, and the flow meter 134 is used to measure the water flow. A middle hole 122 is further provided on the support plate 121. One end of the water pipe 132 communicates with the water inlet and outlet hole 329 through the middle hole 122 for supplying water to the water tank 327, and the other end of the water pipe 132 is connected to a water circulation machine or an automatic water pipe.

[0035] In summary, this semiconductor automatic aging device automatically transports the device under test on the loading table 31 to the test bench 32 through the transmission mechanism 20 for automatic testing. During the test, there is no need to manually adjust the position of the device under test 40, which is convenient and safe; the test time is easy to control, there is no invalid test, and the shunt capacitor can supply current to the device under test 40 by discharging, which is very power-saving.

[0036] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The descriptions in the above embodiments and the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor automatic aging device, characterized in that: It includes a box body, a testing mechanism and a transmission mechanism arranged in the box body. The testing mechanism includes a loading table and a testing table. The loading table includes a loading plate. The testing table includes a water-cooling plate, an input component for inputting power, an output component for outputting feedback signals, and a freewheeling capacitor for providing freewheeling for the device under test. The input component is electrically connected to the freewheeling capacitor. The transmission mechanism includes a horizontal transmission component, a first vertical component and a second vertical component. The first vertical component is slidably connected to the horizontal transmission component. The first vertical component includes a first air cylinder and a manipulator connected to the transmission shaft of the first air cylinder. The second vertical component includes a second air cylinder and a signal board connected to the transmission shaft of the second air cylinder. When the manipulator grabs the device under test from the loading plate, the manipulator drives the device under test to the water-cooling plate through the horizontal transmission component. When the input end of the device under test is electrically connected to the input component, the transmission shaft of the second air cylinder drives the signal board to be electrically connected to the device under test, and the signal board makes the device under test enter the test state. The output end of the device under test is electrically connected to the output component, and the output component outputs feedback signals.

2. The semiconductor automatic aging device according to claim 1, characterized in that: The loading table further includes a first table body and an air knife. A first opening is provided on the first table body. One end of the air knife is fixed in the first opening. The loading plate is fixed to the upper end of the first table body. Mounting holes and first sliding holes facilitating the manipulator to clamp the device under test are provided on the loading plate. The first opening communicates with the mounting holes.

3. The semiconductor automatic aging device according to claim 2, wherein: The testing table further includes a second table body and a conductive block. The water-cooling plate is fixed to the upper end of the second table body. Water inlet and outlet holes, second sliding holes and a water tank for mounting the device under test are provided on the water-cooling plate. The input component and the output component are respectively fixed to both ends of the water-cooling plate through the conductive block. The water inlet and outlet holes communicate with the water tank.

4. The semiconductor automatic aging device according to claim 3, characterized in that: The testing mechanism further includes a dehydration table. The dehydration table includes a dehydration plate and a third table body. A second opening is provided on the third table body. The other end of the air knife extends into the second opening. An installation groove, third sliding holes and a drain pipe are provided on the dehydration plate. The second opening and the drain pipe both communicate with the installation groove.

5. The semiconductor automatic aging device according to claim 4, characterized in that: The testing mechanism further includes a control console. The control console includes a control switch. The control switch is electrically connected to the input component. The first sliding holes, the second sliding holes and the third sliding holes are all arranged in parallel. The manipulator includes two clamping arms and two clamping fingers that can pass through the first sliding holes, the second sliding holes and the third sliding holes. The clamping fingers are fixed to one ends of the clamping arms.

6. The semiconductor automatic aging device according to claim 4, characterized in that: The transmission mechanism further includes a third vertical component. The third vertical component includes a third air cylinder and a pressing plate connected to the transmission shaft of the third air cylinder. When the device under test is tested, the transmission shaft of the second air cylinder drives the signal board to disengage from the device under test. When the manipulator drives the device under test to the installation groove of the dehydration plate through the horizontal transmission component, the transmission shaft of the third air cylinder drives the pressing plate to press the device under test firmly, and the air knife dehydrates the device under test.

7. The semiconductor automatic aging device according to claim 1, characterized in that: The second vertical component further includes a cylinder frame, a pressing rod, and a temperature sensor for detecting the temperature of the device under test. The second cylinder is disposed within the cylinder frame, the signal board is disposed at the lower end of the cylinder frame, the pressing rod and the temperature sensor are both disposed on two sides of the signal board. When the second cylinder drives the signal board to press downwards, the pressing rod presses the output component, so that the output component is electrically connected to the output end of the device under test.

8. The semiconductor automatic aging device according to claim 7, characterized in that: The second vertical component further includes a signal pin, an insulating block, and a pressing rod for pressing the device under test. The pressing rod and the signal pin are both fixed to the lower end of the signal board. The signal board is electrically connected to the device under test through the signal pin. The insulating block is fixed to the lower end of the pressing rod, and the output component is a reed.

9. The semiconductor automatic aging device according to claim 1, wherein: The box body includes a test cabinet, a support plate is disposed within the test cabinet. The horizontal transmission component includes a transmission shaft and a conveyor belt for driving the first vertical component to slide. The transmission shaft is disposed on the conveyor belt, and the transmission shaft is fixed to the support plate.

10. The semiconductor automatic aging device according to claim 9, wherein: The box body further includes a power supply cabinet and a bottom cabinet. The power supply cabinet is disposed at the upper end of the test cabinet, the bottom cabinet is disposed at the lower end of the test cabinet. An industrial control computer and an integrated power supply are disposed within the power supply cabinet. The signal board is electrically connected to the industrial control computer, and the input component is electrically connected to the integrated power supply.

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