Reliable wafer-level packaging test platform deck

Abstract

The invention discloses a reliable wafer-level packaging test platform deck, and relates to the field of semiconductor equipment, the test platform deck is applied to the packaging test of a wafer with a blue film and a wafer patch ring, and the test platform deck comprises a supporting platform, a central rotating shaft, a lifting platform, a platform deck sucker, a lifting mechanism, a rotating mechanism and a patch ring supporting mechanism, the carrying table sucker is mounted at the top of the central rotating shaft and used for adsorbing and fixing a wafer, one side of the lifting table is connected with a lifting mechanism used for driving the lifting table to move in the axial direction of the central rotating shaft, and one side of the central rotating shaft is connected with a rotating mechanism used for driving the central rotating shaft to rotate around the axis of the central rotating shaft; according to the reliable wafer-level packaging test carrying table, the wafer patch ring is effectively supported through the patch ring supporting mechanism, it is ensured that the wafer patch ring and a wafer are kept relatively static in the test process, a blue film is prevented from being stretched, and therefore the stability of the position of a chip is ensured, and favorable conditions are provided for subsequent image alignment and wafer scanning.

Description

Technical Field

[0001] The present invention relates to semiconductor device technology, and particularly to a reliable wafer-level packaging test stage. Background Art

[0002] Packaging test refers to the process of testing the internal chip in the later stage of chip manufacturing, which is carried out after chip packaging. Usually, the chip is fixed on the blue film by directly fixing the surface of the chip, and is fixed to the wafer patch ring. The wafer patch ring fixes the wafer and binds the die chip, protects the chip from damage, and ensures the accurate alignment of the wafer and the patch equipment by precise clamping. The main purpose of the packaging test is to complete the screening and grading of the defective rate after chip packaging.

[0003] Since the wafer for packaging test is provided with a blue film and a wafer patch ring, during the entire automatic transfer and test process of the wafer, the integrity of the blue film must be ensured. If the blue film is stretched, the position of the cut chip will change with the stretching of the blue film, resulting in the inability to carry out the subsequent test process normally. Therefore, it is necessary to ensure that there is no large displacement between the wafer patch ring and the wafer, which may cause the blue film to be stretched. However, the ordinary wafer test stage will cause the wafer patch ring to have no support, making it droop naturally, resulting in the stretching of the blue film. And during the needle-punch test process, the wafer patch ring will swing up and down with the lifting of the stage, causing the blue film to be repeatedly pulled, exacerbating the instability of the chip position. Summary of the Invention

[0004] The purpose of the present invention is to provide a reliable wafer-level packaging test stage to solve the problem that the wafer patch ring in the prior art will swing up and down with the lifting of the stage, resulting in the blue film being repeatedly pulled and making the chip position unstable.

[0005] To achieve the above purpose, the present invention provides the following technical solution: a reliable wafer-level packaging test stage, which is applied to the packaging test of a wafer with a blue film and a wafer patch ring, including a support stage, a central rotating shaft, a lifting stage, a stage suction cup, a lifting mechanism, a rotating mechanism, and a patch ring support mechanism;

[0006] The central rotating shaft is rotatably installed on the lifting stage, and the stage suction cup is installed on the top of the central rotating shaft, and the stage suction cup is used for adsorbing and fixing the wafer;

[0007] One side of the lifting stage is connected to a lifting mechanism for driving the lifting stage to move axially along the central rotating shaft;

[0008] One side of the central rotating shaft is connected to a rotating mechanism for driving the central rotating shaft to rotate around its own axis;

[0009] The chip ring support mechanism is used to support and fix the wafer chip ring. The chip ring support mechanism is installed on the central rotating shaft. The chip ring support mechanism includes a chip ring support frame, a moving drive assembly, and four vacuum claws. All four vacuum claws are used to adsorb and fix the wafer chip ring. All four vacuum claws are installed on the chip ring support frame. One side of the chip ring support frame is connected to the moving drive assembly for driving the chip ring support frame to move axially along the central rotating shaft.

[0010] Further, the lifting mechanism includes an A ball screw, a rotary drive assembly, and four sets of ball splines. The outer wall of the A ball screw is threadedly connected to the lifting table. The lower outer wall of the A ball screw is rotatably connected to the support table. The bottom end of the A ball screw is connected to the rotary drive assembly for driving the A ball screw to rotate about its own axis. The four sets of ball splines are evenly installed on the lifting table. The ball splines are used to guide the movement of the lifting table.

[0011] Further, the rotary drive assembly is an A rotary drive member. The output shaft end of the A rotary drive member drives the A ball screw to rotate through a synchronous belt drive. The A rotary drive member is fixedly installed on the support table.

[0012] Further, the rotating mechanism includes a lever, a pushing member, a support seat, and a moving drive member. One end of the lever is fixedly connected to the central rotating shaft. The other end of the lever is connected to the pushing member. The pushing member is used to push the lever to rotate about the axis of the central rotating shaft. One side of the pushing member is connected to the moving drive member for driving the pushing member to move along the length direction of the support seat. One side of the support seat is fixedly connected to the support table.

[0013] Further, the pushing member includes a fixed seat and two limit wheels. Both limit wheels are rotatably installed on the fixed seat. The end of the lever away from the central rotating shaft is located between the two limit wheels, and the closer sides of the two limit wheels are respectively in tight contact with the outer wall of the lever.

[0014] Further, the moving drive member includes a B ball screw, a slide table, and a B rotary drive member. The slide table is slidably installed on the support seat. The fixed seat is fixedly installed on the slide table. The outer wall of the B ball screw is threadedly connected to the slide table. One end of the B ball screw is connected to the B rotary drive member for driving the B ball screw to rotate about its own axis through a coupling.

[0015] Further, the moving driving member includes a B ball screw, a sliding table, a B rotary driving member, a fixed rack, a moving rack, a moving gear, an A limiting member, and a B limiting member. The moving gear is rotatably mounted on the sliding table through a rotating shaft. The sliding table is slidably mounted on the support base. The outer sidewall of the B ball screw is threadedly connected to the sliding table. One end of the B ball screw is connected to a B rotary driving member through a coupling for driving the B ball screw to rotate about its own axis. One side of the fixed rack is fixedly connected to the support base. One side of the fixed rack meshes with the moving gear. One side of the moving gear meshes with the moving rack. One side of the moving rack is slidably connected to the sliding table. The other side of the fixed seat is connected to an A limiting member for preventing the fixed seat from moving relative to the moving rack. One side of the fixed seat is connected to a B limiting member for preventing the fixed seat from moving relative to the sliding table.

[0016] Further, the A limiting member includes an A pin, an A telescopic driving member, and a plurality of A jacks formed on the moving rack. The outer sidewall of the A pin is slidably connected to the fixed seat. The A pin can be partially inserted into one of the A jacks. The plurality of A jacks are arranged at equal intervals along the length direction of the moving rack. One end of the A pin is connected to an A telescopic driving member for driving the A pin to move axially.

[0017] Further, the B limiting member includes a B pin, a B telescopic driving member, and a plurality of B jacks formed on the sliding table. The outer sidewall of the B pin is slidably connected to the fixed seat. The B pin can be partially inserted into one of the B jacks. The plurality of B jacks are arranged at equal intervals along the length direction of the sliding table. One end of the B pin is connected to a B telescopic driving member for driving the B pin to move axially.

[0018] Further, the moving driving assembly includes two C telescopic driving members and two guide rods. The moving ends of the two C telescopic driving members are respectively fixedly connected to the patch ring support frame. The fixed ends of the two C telescopic driving members are respectively fixedly connected to the central rotating shaft. The outer sidewalls of the two guide rods are respectively slidably connected to the patch ring support frame. The bottom ends of the two guide rods are respectively fixedly connected to the central rotating shaft.

[0019] Compared with the prior art, a reliable wafer-level packaging test stage provided by the present invention effectively supports the wafer patch ring through the patch ring support mechanism, ensures that the wafer patch ring and the wafer remain relatively stationary during the test process, prevents the blue film from being stretched, thereby ensuring the stability of the chip position, and providing favorable conditions for subsequent image alignment and wafer scanning;

[0020] By performing packaging and testing through the test stage of the present application, the automation degree of the equipment is improved, the influence of the wafer patch ring on the wafer during the test process is greatly reduced, the pulling of the blue film by the patch ring to cause the change of the chip position is prevented, and favorable conditions for subsequent image alignment and wafer scanning are provided;

[0021] By adopting a high-precision lifting mechanism and a rotating mechanism, the repeatability between the wafer and the test needles during the test process is ensured, making the size of the needle marks uniform, the depth appropriate, reducing the inaccurate test data caused by too shallow needle insertion or chip damage caused by too deep needle insertion. In addition, this test stage can be compatible with the packaging tests of 4-inch and 6-inch wafers, and can also be compatible with the semi-automatic tests of ordinary wafers. By using the lifting mechanism and the rotating mechanism of the stage, the image alignment and wafer scanning during the ordinary wafer test process can be completed, and the needle insertion test can be completed.

[0022] Through the design of the moving driving part, the rapid large-scale movement and precise fine-tuning of the wafer during the image alignment process are realized, improving the alignment efficiency and accuracy. Brief Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0024] Figure 1 Schematic diagram of the combination of the wafer, the blue film and the wafer patch ring provided by the embodiment of the present invention;

[0025] Figure 2 Schematic diagram of the external overall structure provided by the embodiment of the present invention;

[0026] Figure 3 Schematic diagram of the first sectional structure provided by the embodiment of the present invention;

[0027] Figure 4 Schematic diagram of the second sectional structure provided by the embodiment of the present invention;

[0028] Figure 5 Schematic diagram of the combination of the patch ring support mechanism, the central rotating shaft and the stage suction cup provided by the embodiment of the present invention;

[0029] Figure 6 Schematic diagram of the structure of a rotating mechanism provided by the embodiment of the present invention;

[0030] Figure 7 Schematic diagram of the structure of another rotating mechanism (except for the A limiting part and the B limiting part) provided by the embodiment of the present invention;

[0031] Figure 8 Schematic diagram of the local three-dimensional structure provided by the embodiment of the present invention;

[0032] Figure 9 Schematic diagram of the local sectional structure provided by the embodiment of the present invention.

[0033] Description of Reference Numerals of the Drawings:

[0034] 1. Wafer; 2. Blue film; 3. Wafer patch ring; 4. Lifting mechanism; 41. A ball screw; 42. Ball spline; 43. A rotary drive; 5. Rotating mechanism; 51. Lever; 52. Pushing member; 521. Fixed seat; 522. Limiting wheel; 53. Support seat; 54. Moving drive; 541. B ball screw; 542. Slide table; 543. B rotary drive; 544. Fixed rack; 545. Moving rack; 546. Moving gear; 547. A limiting member; 5471. A pin; 5472. A telescopic drive; 5473. A jack; 548. B limiting member; 5481. B pin; 5482. B telescopic drive; 5483. B jack; 6. Patch ring support mechanism; 61. Patch ring support frame; 62. Vacuum gripper; 63. C telescopic drive; 64. Guide rod; 7. Central rotating shaft; 8. Lifting table; 9. Support table; 10. Stage suction cup. Detailed Implementation Manner

[0035] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0036] Please refer to Figures 1 to 5 , a reliable wafer-level packaging and testing stage, which includes a testing stage applied to the packaging and testing of a wafer 1 with a blue film 2 and a wafer patch ring 3, and includes a support table 9, a central rotating shaft 7, a lifting table 8, a stage suction cup 10, a lifting mechanism 4, a rotating mechanism 5, and a patch ring support mechanism 6;

[0037] The central rotating shaft 7 is rotatably installed on the lifting table 8, and the stage suction cup 10 is installed on the top of the central rotating shaft 7. The stage suction cup 10 can be fixedly installed on the central rotating shaft 7 through fixing members such as bolts. The stage suction cup 10 is used to adsorb and fix the wafer 1. The stage suction cup 10 is connected to the equipment vacuum pipeline to provide a vacuum negative pressure for the wafer 1. The wafer 1 is firmly adsorbed through the vacuum channel on the stage suction cup 10. The stage suction cup 10 is a prior art and will not be elaborated here;

[0038] One side of the lifting table 8 is connected to a lifting mechanism 4 for driving the lifting table 8 to move axially along the central rotating shaft 7;

[0039] One side of the central rotating shaft 7 is connected to a rotating mechanism 5 for driving the central rotating shaft 7 to rotate around its own axis;

[0040] The chip mounting ring support mechanism 6 is used to support and fix the wafer chip mounting ring 3. The chip mounting ring support mechanism 6 is installed on the central rotating shaft 7. The chip mounting ring support mechanism 6 includes a chip mounting ring support frame 61, a moving drive assembly, and four vacuum claws 62. The four vacuum claws 62 are all used to adsorb and fix the wafer chip mounting ring 3. The vacuum claws 62 are connected to the equipment vacuum pipeline. The wafer chip mounting ring 3 is firmly adsorbed through the vacuum channels on the vacuum claws 62. The vacuum claws 62 are prior art and will not be elaborated here. The four vacuum claws 62 are all installed on the chip mounting ring support frame 61. One side of the chip mounting ring support frame 61 is connected to a moving drive assembly for driving the chip mounting ring support frame 61 to move axially along the central rotating shaft 7.

[0041] As Figure 1 shown, since the wafer 1 for packaging and testing is provided with a blue film 2 and a wafer chip mounting ring 3, during the entire automatic transfer and testing process of the wafer 1, the integrity of the blue film 2 must be ensured. If the blue film 2 is stretched, the positions of the cut chips will change with the stretching of the blue film 2, resulting in the inability to carry out the subsequent testing process normally. Therefore, it is necessary to ensure that there is no large displacement between the wafer chip mounting ring 3 and the wafer 1 that causes the blue film 2 to be stretched. However, a common wafer 1 testing stage will cause the wafer chip mounting ring 3 to have no support, making it sag naturally, resulting in the stretching of the blue film 2. Moreover, during the probing test process, the wafer chip mounting ring 3 will swing up and down as the stage rises and falls, causing the blue film 2 to be repeatedly pulled;

[0042] To this end, when testing the wafer 1, the manipulator picks up the wafer 1 and places it directly above the test stage. Four vacuum claws 62 inside the chip mounting ring support mechanism 6 rise, so that the four vacuum claws 62 contact and vacuum-adsorb and fix the chip mounting ring 3 of the wafer. After the manipulator withdraws, the four vacuum claws 62 fall, causing the wafer 1 to land on the stage chuck 10 and be vacuum-adsorbed and fixed. At this time, the chip mounting ring 3 supported by the vacuum claws 62 is relatively stationary with the wafer 1 on the stage chuck 10. The rotation mechanism 5 drives the central rotating shaft 7 to rotate around the axis of the central rotating shaft 7, and the lifting mechanism 4 drives the lifting table 8 to move along the axial direction of the central rotating shaft 7. When the central rotating shaft 7 rotates, it drives the stage chuck 10 and the chip mounting ring support mechanism 6 to rotate synchronously. When the lifting table 8 moves up and down, it drives the stage chuck 10 and the chip mounting ring support mechanism 6 to move up and down synchronously through the central rotating shaft 7. After the test is completed, the stage chuck 10 disconnects the vacuum, the vacuum claws 62 inside the chip mounting ring support mechanism 6 rise, and the vacuum of the vacuum claws 62 is disconnected, so that the wafer 1 can be taken away and preparations can be made for the placement of the next wafer 1. Through this test stage for encapsulation testing, the automation degree of the equipment is improved, the influence of the chip mounting ring 3 of the wafer on the wafer 1 during the test is greatly reduced, and the chip mounting ring 3 of the wafer is prevented from pulling the blue film 2 to change the chip position, providing favorable conditions for subsequent image alignment and wafer 1 scanning. In addition, this stage can be compatible with the encapsulation testing of four-inch and six-inch wafers 1, and can also be compatible with the semi-automatic testing of ordinary wafers 1. By using the lifting mechanism 4 and the rotation mechanism 5 of the test stage, the image alignment and wafer 1 scanning during the test process of ordinary wafers 1 can be completed, and the probing test can be completed.

[0043] Please refer to Figures 3 to 4 , in an embodiment of the present invention, the lifting mechanism 4 includes a ball screw 41, a rotation drive assembly, and four sets of ball splines 42. The outer side wall of the ball screw 41 is threadedly connected to the lifting table 8. The lower outer side wall of the ball screw 41 is rotatably connected to the support table 9. The bottom end of the ball screw 41 is connected to a rotation drive assembly for driving the ball screw 41 to rotate around its own axis. The four sets of ball splines 42 are evenly installed on the lifting table 8. The ball splines 42 are used to guide the movement of the lifting table 8. The ball spline 42 is composed of a spline outer cylinder (spline female), steel balls, end caps, sealing rings, a retaining cylinder wall, and a spline shaft. The spline outer cylinder inside the ball spline 42 is fixedly connected to the lifting table 8. The two ends of the spline shaft inside the ball spline 42 are respectively fixedly connected to the support table 9. This is prior art and will not be elaborated here;

[0044] Specifically, during use, the lifting table 8 is guided by the ball spline 42. The A ball screw 41 is rotated by the rotation drive assembly. When the A ball screw 41 rotates, it drives the lifting table 8 to move up and down. The high-precision A ball screw 41 and ball spline 42 ensure the repeatability between the wafer 1 and the test needle during the test process, making the size of the needle marks uniform and the depth appropriate, reducing inaccurate test data caused by shallow needle insertion or chip damage caused by deep needle insertion.

[0045] Please refer to Figure 3 , in an embodiment of the present invention, the rotation drive assembly is an A rotation drive member 43. The output shaft end of the A rotation drive member 43 drives the A ball screw 41 to rotate through a synchronous belt drive. The A rotation drive member 43 is fixedly installed on the support table 9. The A rotation drive member 43 uses a servo motor or a rotary cylinder. Synchronous wheels are fixedly sleeved on the outside of the output shaft of the A rotation drive member 43 and the bottom of the A ball screw 41, and the same synchronous belt is sleeved outside the two synchronous wheels;

[0046] Specifically, when the stage chuck 10 needs to be lifted, when the output shaft of the A rotation drive member 43 rotates, it drives the A ball screw 41 to rotate through a synchronous belt drive. Under the guidance of the ball spline 42, the lifting table 8 is driven by the A ball screw 41 to perform a lifting action. When the lifting table 8 moves up and down, it drives the stage chuck 10 to move up and down through the central rotating shaft 7.

[0047] Please refer to Figure 2 and Figure 6 , in an embodiment of the present invention, the rotation mechanism 5 includes a lever 51, a pushing member 52, a support seat 53, and a moving drive member 54. One end of the lever 51 is fixedly connected to the central rotating shaft 7, and the other end of the lever 51 is connected to the pushing member 52. The pushing member 52 is used to push the lever 51 to rotate around the axis of the central rotating shaft 7. One side of the pushing member 52 is connected to the moving drive member 54 for driving the pushing member 52 to move along the length direction of the support seat 53, and one side of the support seat 53 is fixedly connected to the support table 9;

[0048] Specifically, the moving drive member 54 drives the pushing member 52 to move along the length direction of the support seat 53. When the pushing member 52 moves, it drives the lever 51 to rotate around the axis of the central rotating shaft 7. The lever 51 drives the central rotating shaft 7 to rotate, and the central rotating shaft 7 drives the stage chuck 10 installed thereon to rotate, thereby realizing the rotation of the wafer 1. By rotating, the direction of the wafer 1 is made consistent with the predetermined direction, solving the problem of image alignment of the wafer 1 on the stage chuck 10;

[0049] Please refer to Figure 6, in an embodiment of the present invention, the pushing member 52 includes a fixed seat 521 and two limiting wheels 522. The two limiting wheels 522 are both rotatably mounted on the fixed seat 521. One end of the lever 51 away from the central rotating shaft 7 is located between the two limiting wheels 522, and the closer sides of the two limiting wheels 522 are respectively in close contact with the outer side wall of the lever 51;

[0050] Specifically, the two limiting wheels 522 drive the movement of the end of the lever 51. When the end of the lever 51 moves, it drives the central rotating shaft 7 to rotate;

[0051] Please refer to Figure 6 , in an embodiment of the present invention, the moving driving member 54 includes a B ball screw 541, a sliding table 542 and a B rotary driving member 543. The sliding table 542 is slidably mounted on the support seat 53, and the fixed seat 521 is fixedly mounted on the sliding table 542. The outer side wall of the B ball screw 541 is threadedly connected to the sliding table 542. One end of the B ball screw 541 is connected by a coupling to a B rotary driving member 543 for driving the B ball screw 541 to rotate about its own axis. The B rotary driving member 543 is fixedly mounted on the support seat 53. The B rotary driving member 543 adopts a stepping motor or a rotary cylinder, and the B rotary driving member 543 is connected to the end of the B ball screw 541 through a coupling;

[0052] Specifically, the B rotary driving member 543 drives the B ball screw 541 to rotate through the coupling. Driven by the B ball screw 541, the sliding table 542 moves. The sliding table 542 drives the pushing member 52 to move through the fixed seat 521. The two limiting wheels 522 on the pushing member 52 drive the central rotating shaft 7 to rotate through the lever 51. The central rotating shaft 7 drives the stage chuck 10 to rotate, thereby driving the wafer 1 on the stage chuck 10 to rotate, realizing the image alignment of the wafer 1.

[0053] Please refer to Figures 7 to 9, in order to improve the alignment efficiency, in an embodiment of the present invention, the moving driving member 54 includes a B ball screw 541, a slide table 542, a B rotary driving member 543, a fixed rack 544, a moving rack 545, a moving gear 546, an A restricting member 547 and a B restricting member 548. The B rotary driving member 543 is fixedly installed on the support base 53. The moving gear 546 is rotatably installed on the slide table 542 through a rotating shaft. The slide table 542 is slidably installed on the support base 53. The outer sidewall of the B ball screw 541 is threadedly connected to the slide table 542. One end of the B ball screw 541 is connected by a coupling to the B rotary driving member 543 for driving the B ball screw 541 to rotate about its own axis. The B rotary driving member 543 adopts a stepping motor or a rotary cylinder. The B rotary driving member 543 is connected to the end of the B ball screw 541 through a coupling. One side of the fixed rack 544 is fixedly connected to the support base 53. One side of the fixed rack 544 is engaged with the moving gear 546. One side of the moving gear 546 is engaged with the moving rack 545. One side of the moving rack 545 is slidably connected to the slide table 542. The other side of the fixed seat 521 is connected to the A restricting member 547 for preventing the fixed seat 521 from moving relative to the moving rack 545. One side of the fixed seat 521 is connected to the B restricting member 548 for preventing the fixed seat 521 from moving relative to the slide table 542;

[0054] Specifically, when it is necessary to drive the central rotating shaft 7 to rotate to drive the wafer 1 on the stage suction cup 10 to rotate for image alignment, the B rotary driving member 543 drives the B ball screw 541 to rotate through the coupling. Under the drive of the B ball screw 541, the slide table 542 moves. The slide table 542 drives the moving gear 546 to move. Since the fixed rack 544 is fixed, when the moving gear 546 moves, the moving gear 546 rotates synchronously. The moving gear 546 drives the moving rack 545 to move relative to the slide table 542. In order to improve the alignment efficiency, initially, the rotation speed and rotation amplitude of the stage suction cup 10 are increased. The A restricting member 547 prevents the fixed seat 521 from moving relative to the moving rack 545, and the B restricting member 548 does not prevent the fixed seat 521 from moving relative to the slide table 542. At this time, the pushing member 52 moves with the moving rack 545, and the moving speed of the moving rack 545 is a multiple of the moving speed of the slide table 542, so that the moving speed of the pushing member 52 is increased to increase the rotation speed of the central rotating shaft 7 and the stage suction cup 10, so that the wafer 1 can move quickly and greatly during the initial alignment, improving the alignment efficiency;

[0055] During precise alignment, the A restricting member 547 does not hinder the relative movement of the fixed seat 521 with respect to the moving rack 545, while the B restricting member 548 hinders the relative movement of the fixed seat 521 with respect to the sliding table 542. At this time, the fixed seat 521 moves with the movement of the sliding table 542, that is, the moving speed of the pushing member 52 is the same as that of the sliding table 542, so as to slow down the moving speed of the pushing member 52. The sliding table 542 is driven by a B ball screw 541, which can effectively improve the alignment accuracy, thereby achieving fast and precise image alignment of the wafer 1.

[0056] Please refer to Figures 8 to 9 , in an embodiment of the present invention, the A restricting member 547 includes an A pin 5471, an A telescopic driving member 5472, and a plurality of A jacks 5473 formed on the moving rack 545. The outer side wall of the A pin 5471 is slidably connected to the fixed seat 521. The A pin 5471 can be partially inserted into one of the A jacks 5473. The plurality of A jacks 5473 are arranged at equal intervals along the length direction of the moving rack 545. One end of the A pin 5471 is connected to the A telescopic driving member 5472 for driving the A pin 5471 to move along its axial direction. The moving end of the A telescopic driving member 5472 is fixedly connected to the end of the A pin 5471, and the fixed end of the A telescopic driving member 5472 is fixedly connected to the fixed seat 521. The A telescopic driving member 5472 uses a telescopic cylinder or a hydraulic cylinder;

[0057] Specifically, when the moving end of the A telescopic driving member 5472 expands and contracts, it drives the A pin 5471 to move along the axial direction of the A pin 5471. When the A pin 5471 is partially inserted into one of the A jacks 5473, under the action of the A pin 5471, the fixed seat 521 cannot move relative to the moving rack 545.

[0058] Please refer to Figures 8 to 9 , in an embodiment of the present invention, the B restricting member 548 includes a B pin 5481, a B telescopic driving member 5482, and a plurality of B jacks 5483 formed on the sliding table 542. The outer side wall of the B pin 5481 is slidably connected to the fixed seat 521. The B pin 5481 can be partially inserted into one of the B jacks 5483. The plurality of B jacks 5483 are arranged at equal intervals along the length direction of the sliding table 542. One end of the B pin 5481 is connected to the B telescopic driving member 5482 for driving the B pin 5481 to move along its axial direction. The moving end of the B telescopic driving member 5482 is fixedly connected to the end of the B pin 5481, and the fixed end of the B telescopic driving member 5482 is fixedly connected to the fixed seat 521. The B telescopic driving member 5482 uses a telescopic cylinder or a hydraulic cylinder;

[0059] Specifically, when the mobile end of the B telescopic driving member 5482 expands and contracts, it drives the B pin 5481 to move along the axial direction of the B pin 5481. When the B pin 5481 is partially inserted into one of the B jacks 5483, the fixed seat 521 cannot move relative to the sliding table 542 under the action of the B pin 5481.

[0060] In an embodiment of the present invention, a displacement sensor is further provided, and the displacement sensor is used to monitor the moving distances of the moving gear 545 and the moving rack 546 relative to the sliding table 542.

[0061] Please refer to Figures 2 to 5 , in an embodiment of the present invention, the moving driving assembly includes two C telescopic driving members 63 and two guide rods 64. The mobile ends of the two C telescopic driving members 63 are respectively fixedly connected to the patch ring support frame 61, the fixed ends of the two C telescopic driving members 63 are respectively fixedly connected to the central rotating shaft 7, the outer side walls of the two guide rods 64 are respectively slidably connected to the patch ring support frame 61, the bottom ends of the two guide rods 64 are respectively fixedly connected to the central rotating shaft 7, and the C telescopic driving member 63 is a cylinder or a hydraulic cylinder;

[0062] Specifically, during use, the mobile end of the C telescopic driving member 63 extends, the patch ring support frame 61 rises, and drives the four vacuum claws 62 to move upward, so that the four vacuum claws 62 contact and vacuum adsorb and fix the wafer patch ring 3. After the manipulator for transporting the wafer 1 withdraws, the mobile end of the C telescopic driving member 63 contracts, and the wafer 1 falls on the stage suction cup 10. The stage suction cup 10 vacuum adsorbs and fixes the wafer 1. At this time, the wafer patch ring 3 supported by the vacuum claws 62 and the wafer 1 on the stage suction cup 10 are relatively stationary and lift and rotate together. After the test is completed, the stage suction cup 10 disconnects the vacuum, the mobile end of the C telescopic driving member 63 extends, and the vacuum of the vacuum claws 62 is disconnected, then the wafer 1 can be taken away and preparations are made for the placement of the next wafer 1.

[0063] In an embodiment of the present invention, a corresponding control unit can be provided for cooperation. The control unit can select any one of the controllers to be connected to the electrical components in the present application, so as to control the opening and closing operations of the electrical components. This part is the prior art. Here, a single-chip microcomputer can be provided as the control unit for display. The single-chip microcomputer in this embodiment is a typical embedded microcontroller (Microcontroller Unit), which is composed of an arithmetic unit, a controller, a memory, input and output devices, etc., and is equivalent to a miniature computer. Compared with the general-purpose microprocessor applied in a personal computer, it emphasizes more on self-supply (without external hardware) and cost savings. Its greatest advantage is its small size, which can be placed inside the instrument, but its storage capacity is small, the input and output interfaces are simple, and the function consumption is low.

[0064] Only certain exemplary embodiments of the present invention have been described above by way of illustration. Without doubt, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A reliable wafer-level package test carrier, characterized in that, The test stage is applied to the packaging test of a wafer (1) with a blue film (2) and a wafer patch ring (3), and includes a support stage (9), a central rotating shaft (7), a lifting stage (8), a stage suction cup (10), a lifting mechanism (4), a rotating mechanism (5) and a patch ring support mechanism (6); The central rotating shaft (7) is rotatably installed on the lifting stage (8), and the stage suction cup (10) is installed at the top of the central rotating shaft (7). The stage suction cup (10) is used to adsorb and fix the wafer (1); One side of the lifting stage (8) is connected to a lifting mechanism (4) for driving the lifting stage (8) to move axially along the central rotating shaft (7); One side of the central rotating shaft (7) is connected to a rotating mechanism (5) for driving the central rotating shaft (7) to rotate about its own axis; The patch ring support mechanism (6) is used to support and fix the wafer patch ring (3). The patch ring support mechanism (6) is installed on the central rotating shaft (7). The patch ring support mechanism (6) includes a patch ring support frame (61), a moving drive assembly and four vacuum claws (62). The four vacuum claws (62) are all used to adsorb and fix the wafer patch ring (3). The four vacuum claws (62) are all installed on the patch ring support frame (61). One side of the patch ring support frame (61) is connected to a moving drive assembly for driving the patch ring support frame (61) to move axially along the central rotating shaft (7).

2. The reliable wafer-level packaging test carrier according to claim 1, wherein The lifting mechanism (4) includes a ball screw A (41), a rotating drive assembly and four ball splines (42). The outer wall of the ball screw A (41) is threadedly connected to the lifting stage (8). The lower outer wall of the ball screw A (41) is rotatably connected to the support stage (9). The bottom end of the ball screw A (41) is connected to a rotating drive assembly for driving the ball screw A (41) to rotate about its own axis. The four ball splines (42) are evenly installed on the lifting stage (8). The ball splines (42) are used to guide the movement of the lifting stage (8).

3. The reliable wafer-level packaging test carrier according to claim 2, wherein, The rotating drive assembly is a rotary drive member A (43). The output shaft end of the rotary drive member A (43) drives the ball screw A (41) to rotate through a synchronous belt drive. The rotary drive member A (43) is fixedly installed on the support stage (9).

4. A reliable wafer-level packaging test carrier according to claim 1, characterized in that, The rotating mechanism (5) includes a lever (51), a pushing member (52), a support seat (53) and a moving drive member (54). One end of the lever (51) is fixedly connected to the central rotating shaft (7). The other end of the lever (51) is connected to the pushing member (52). The pushing member (52) is used to push the lever (51) to rotate about the axis of the central rotating shaft (7). One side of the pushing member (52) is connected to a moving drive member (54) for driving the pushing member (52) to move along the length direction of the support seat (53). One side of the support seat (53) is fixedly connected to the support stage (9).

5. A reliable wafer-level packaging test carrier according to claim 4, wherein, The pushing member (52) includes a fixed seat (521) and two limit wheels (522). The two limit wheels (522) are both rotatably installed on the fixed seat (521). The end of the lever (51) far from the central rotating shaft (7) is located between the two limit wheels (522), and the closer sides of the two limit wheels (522) are respectively in tight contact with the outer wall of the lever (51).

6. A reliable wafer-level packaging test carrier according to claim 4, characterized in that, The moving driving member (54) includes a B ball screw (541), a slide table (542), and a B rotary driving member (543). The slide table (542) is slidably mounted on the support base (53), and the fixed seat (521) is fixedly mounted on the slide table (542). The outer sidewall of the B ball screw (541) is threadedly connected to the slide table (542). One end of the B ball screw (541) is connected by a coupling to the B rotary driving member (543) for driving the B ball screw (541) to rotate about its own axis.

7. A reliable wafer-level packaging test carrier according to claim 4, characterized in that, The moving driving member (54) includes a B ball screw (541), a slide table (542), a B rotary driving member (543), a fixed rack (544), a moving rack (545), a moving gear (546), an A limiting member (547), and a B limiting member (548). The moving gear (546) is rotatably mounted on the slide table (542) through a rotating shaft. The slide table (542) is slidably mounted on the support base (53). The outer sidewall of the B ball screw (541) is threadedly connected to the slide table (542). One end of the B ball screw (541) is connected by a coupling to the B rotary driving member (543) for driving the B ball screw (541) to rotate about its own axis. One side of the fixed rack (544) is fixedly connected to the support base (53). One side of the fixed rack (544) meshes with the moving gear (546). One side of the moving gear (546) meshes with the moving rack (545). One side of the moving rack (545) is slidably connected to the slide table (542). The other side of the fixed seat (521) is connected to the A limiting member (547) for preventing the fixed seat (521) from moving relative to the moving rack (545). One side of the fixed seat (521) is connected to the B limiting member (548) for preventing the fixed seat (521) from moving relative to the slide table (542).

8. A reliable wafer-level packaging test carrier according to claim 7, characterized in that, The A limiting member (547) includes an A pin (5471), an A telescopic driving member (5472), and a plurality of A jacks (5473) formed in the moving rack (545). The outer sidewall of the A pin (5471) is slidably connected to the fixed seat (521). The A pin (5471) can be partially inserted into one of the A jacks (5473). The plurality of A jacks (5473) are arranged at equal intervals along the length direction of the moving rack (545). One end of the A pin (5471) is connected to the A telescopic driving member (5472) for driving the A pin (5471) to move axially.

9. A reliable wafer-level packaging test carrier according to claim 7, characterized in that, The B limiting member (548) includes a B pin (5481), a B telescopic driving member (5482), and a plurality of B jacks (5483) formed in the slide table (542). The outer sidewall of the B pin (5481) is slidably connected to the fixed seat (521). The B pin (5481) can be partially inserted into one of the B jacks (5483). The plurality of B jacks (5483) are arranged at equal intervals along the length direction of the slide table (542). One end of the B pin (5481) is connected to the B telescopic driving member (5482) for driving the B pin (5481) to move axially.

10. A reliable wafer-level package test carrier according to claim 1, characterized in that, The moving drive assembly includes two C-shaped telescopic drive members (63) and two guide rods (64). The moving ends of the two C-shaped telescopic drive members (63) are respectively fixedly connected to the patch ring support frame (61). The fixed ends of the two C-shaped telescopic drive members (63) are respectively fixedly connected to the central rotating shaft (7). The outer side walls of the two guide rods (64) are respectively slidably connected to the patch ring support frame (61). The bottom ends of the two guide rods (64) are respectively fixedly connected to the central rotating shaft (7).

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