A chip package testing device and a package testing method

Abstract

The application relates to a chip packaging test device and a packaging test method, belonging to the technical field of chips, which comprises a workbench, a feeding mechanism penetrating through the workbench, the feeding mechanism being movably connected to the workbench along a horizontal direction; a plurality of test slots for storing packaging chips are arranged on the feeding mechanism along the moving direction of the feeding mechanism, the bottom of the test slot is provided with two rows of detection plates corresponding to the pins on the two sides of the packaging chip; the chip packaging test device further comprises a lifting mechanism arranged on the workbench, the lifting end of the lifting mechanism is connected with a test mechanism, the lifting mechanism drives the test mechanism to move along a vertical direction, so that the test mechanism is inserted into or withdrawn from the test slot located directly below. The application controls the actions of the lifting mechanism and the test mechanism through a linkage mechanism, reduces manual intervention, thereby improving the safety, accuracy and efficiency of the test process, and also reduces the cost loss and production risk caused by manual operation errors.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor testing, and particularly relates to a chip packaging testing device and a packaging testing method. BACKGROUND

[0002] Chip packaging refers to a shell for mounting a semiconductor integrated circuit chip, which plays a role of placing, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, and is also a bridge between the internal world of the chip and the external circuit. The contacts on the chip are connected to the pins of the packaging shell by wires, and the pins are connected to other devices through wires on the printed board.

[0003] For example, the patent with the patent authorization announcement number CN115144732A discloses a computer chip packaging testing device, which comprises a workbench, a bearing seat for storing chips is arranged on the workbench, a positioning mechanism for positioning the chips is arranged in the workbench, a lifting mechanism for driving the testing mechanism to lift is arranged on one side of the workbench, and the testing mechanism is arranged above the workbench. A plurality of positioning grooves are symmetrically formed on the two sides of the bearing seat. The positioning mechanism is arranged in the workbench to adjust the position of the chips on the bearing seat, so that the chips can be centrally arranged on the bearing seat, the chip pins are facilitated to contact the detection board, and the quality of chip detection is improved. The rotatable taking handle arranged on the bearing seat facilitates taking the chips out of the bearing seat, avoids the chips being too close to the detection board and being difficult to be taken out manually by the operator, and improves the detection efficiency of the chips.

[0004] Based on the above patent authorization announcement number and in combination with the deficiencies in the above patent, it is found that:

[0005] The above embodiment has the taking handle capable of lifting the chips from the bearing seat, but still needs manual placement of the chips on the testing station or taking the chips out of the testing station. Such manual operation has the risk of being pressed by the lifting mechanism due to misoperation. SUMMARY

[0006] To solve the existing problems, the application provides a chip packaging testing device and a packaging testing method.

[0007] The purpose of the application can be achieved by the following technical solutions:

[0008] The application provides a chip package testing device, which comprises a workbench and a feeding mechanism penetrating through the workbench, the feeding mechanism being movably connected to the workbench in a horizontal direction; a plurality of testing slots for storing package chips are arranged on the feeding mechanism along the moving direction of the feeding mechanism, the bottom of each testing slot is provided with two rows of detection plates corresponding to the pins on both sides of the package chip; the chip package testing device further comprises a lifting mechanism arranged on the workbench, the lifting end of the lifting mechanism is connected with a testing mechanism, and the lifting mechanism drives the testing mechanism to move in a vertical direction so that the testing mechanism can be inserted into or withdrawn from the testing slot located directly below the testing mechanism.

[0009] The chip package testing device further comprises a linkage mechanism, the linkage mechanism has a first state and a second state; when any testing slot moves to the position directly below the testing mechanism, the first state of the linkage mechanism is triggered, the linkage mechanism responds and drives the lifting mechanism to lower the testing mechanism to insert into the corresponding testing slot; when any testing slot moves away from the position directly below the testing mechanism, the second state of the linkage mechanism is triggered, the linkage mechanism responds and drives the lifting mechanism to raise the testing mechanism to withdraw from the corresponding testing slot.

[0010] As a preferred technical scheme of the application, the feeding mechanism comprises a moving plate, a transmission gear and a driving member, the workbench is provided with two symmetrical horizontal sliding rails, the two sides of the moving plate are in sliding fit with the two horizontal sliding rails, and the testing slots are arranged on the upper side of the moving plate; the bottom side of the moving plate is provided with a toothed portion, the transmission gear is rotationally connected to the workbench below the moving plate, and the transmission gear is in mesh with the toothed portion; and the driving member is transmissionally connected to the transmission gear.

[0011] The driving member comprises a manual rotating wheel, the transmission gear is driven to rotate by rotating the manual rotating wheel, so that the moving plate moves in the horizontal direction; and / or the driving member comprises a first stepping motor, the transmission gear is driven to rotate by the first stepping motor, so that the moving plate moves in the horizontal direction.

[0012] As a preferred technical scheme of the application, the plurality of testing slots are arranged at equal intervals on the upper side of the moving plate along the moving direction of the moving plate.

[0013] As a preferred technical scheme of the present application, the lifting mechanism comprises a mounting frame, a second stepper motor, a transmission screw, a positioning bearing and a transmission sliding block, the mounting frame is mounted on the workbench, the second stepper motor and the positioning bearing are mounted on the vertical two sides of the mounting frame, and the two ends of the transmission screw are connected to the second stepper motor and the positioning bearing respectively; the transmission sliding block is in threaded cooperation with the transmission screw, and a vertical sliding rail is arranged on the mounting frame, and the transmission sliding block is in sliding cooperation with the vertical sliding rail.

[0014] As a preferred technical scheme of the present application, the testing mechanism comprises a guide base and a probe module, the guide base is fixed to the lifting end of the lifting mechanism, and the probe module is connected to the lower side of the guide base; wherein the probe module comprises two rows of elastic probes arranged in parallel, the arrangement spacing of the elastic probes matches the pin spacing of the two rows of pins of the detection plate, each of the elastic probes is internally provided with a compression spring and is provided with a gold-plated contact head at the end; the guide base is internally provided with a test circuit board, and the probe module is electrically connected to the test circuit board.

[0015] As a preferred technical scheme of the present application, one side of the guide base is provided with an indicator light, and the indicator light is electrically connected to the test circuit board.

[0016] As a preferred technical scheme of the present application, the linkage mechanism comprises a controller and a spring wave bead, the spring wave bead is embedded in the horizontal sliding rail, the moving plate is provided with a plurality of clearance holes on one side corresponding to the horizontal sliding rail, and a plurality of the clearance holes correspond to a plurality of the test slots one by one in the horizontal direction perpendicular to the horizontal sliding rail; when any of the test slots is located directly below the testing mechanism, the spring wave bead is released and extends into the clearance hole; when all the test slots are not directly below the testing mechanism, the spring wave bead is compressed on the lower side of the moving plate.

[0017] The pressure sensor is electrically connected to the controller, and the controller is electrically connected to the second stepper motor; when the spring wave bead is released, the pressure sensor senses that the pressure is less than a first preset pressure value, the controller sends a first pulse signal to the second stepper motor, and the lifting mechanism drives the testing mechanism to descend.

[0018] As a preferred technical scheme of the present application, the linkage mechanism further comprises a laser emitter and a laser receiver, the laser emitter and the laser receiver are arranged on the two sides of the workbench respectively, and the laser beam of the laser emitter relative to the laser receiver is blocked when the testing mechanism extends into the test slot.

[0019] The laser receiver and the controller are electrically connected, when the laser receiver continuously has no laser input for a first preset time, the controller sends a second pulse signal opposite to the first pulse signal to the second stepper motor, and the lifting mechanism drives the test mechanism to rise.

[0020] As a preferred technical solution of the present application, the controller is also electrically connected to the first stepper motor, when the controller sends the second pulse signal to the second stepper motor, the controller also sends a third pulse signal to the first stepper motor; wherein the first stepper motor drives the moving plate to move a distance equal to the interval distance between two adjacent test slots after receiving the third pulse signal.

[0021] In the second aspect, the present application provides a packaging test method, applied to the chip packaging test device of the first aspect, including the following steps:

[0022] The feeding mechanism is controlled to move horizontally, so that the target test slot moves directly below the test mechanism;

[0023] When the target test slot is in place, the linkage mechanism triggers a first state to drive the lifting mechanism to lower the test mechanism, so that the probe module of the test mechanism contacts the test plate pin;

[0024] The probe module performs electrical testing on the packaged chip;

[0025] If the test is completed and the laser receiver detects the blocking signal for a second preset time, the linkage mechanism triggers a second state to drive the lifting mechanism to rise and reset;

[0026] The feeding mechanism is controlled to move to the next test slot position.

[0027] The present application has the following advantages:

[0028] This scheme controls the action of the lifting mechanism and the test mechanism through the linkage mechanism, reduces manual intervention, thereby improving the safety, accuracy and efficiency of the test process, and also reduces the cost loss and production risk caused by manual operation errors, solves the problem that the existing manual placement of chips in the test station or the manual removal of chips from the test station causes the problem of being pressed by the lifting mechanism due to manual operation errors. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to facilitate those skilled in the art to understand, the present application will be further described below with reference to the drawings.

[0030] Figure 1 is a structural schematic diagram of a chip packaging test device of the present application;

[0031] Figure 2 A part structure amplification schematic diagram of Figure 1

[0032] Figure 3 The spring wave bead extension structure schematic diagram of the chip packaging test device of the application;

[0033] Figure 4 The moving plate structure schematic diagram of the chip packaging test device of the application;

[0034] Figure 5 The flow chart of the chair packaging test method of the application.

[0035] Main symbol explanation

[0036] In the figure: 10, workbench; 11, horizontal slide rail; 20, feeding mechanism; 21, moving plate; 211, test slot; 212, detection plate; 213, clearance hole; 22, transmission gear; 23, manual rotating wheel; 24, first stepping motor; 30, lifting mechanism; 31, mounting frame; 32, second stepping motor; 33, transmission screw; 34, vertical slide rail; 40, test mechanism; 41, guide base; 42, probe module; 43, indicator light; 50, controller; 51, spring wave bead; 52, laser emitter; 53, laser receiver. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical scheme and advantages of the application more clear, specific embodiments of the application will be further described in detail below with reference to the drawings and specific embodiments.

[0038] The technical scheme in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the application.

[0039] In the description of the application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship described based on the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0040] ​In addition, the terms "first", "second", etc. are used only to describe the purpose and should not be construed as indicating or implying relative importance or implying a specified number thereof. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0041] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be connected, or detachable, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate media, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0042] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include the direct contact between the first and second features, or the contact between the first and second features through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "below" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0043] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0044] Please refer to Figures 1 to 4The embodiment provides a chip package testing device, which comprises a workbench 10 and a feeding mechanism 20 penetrating through the workbench 10, the feeding mechanism 20 being movably connected to the workbench 10 in a horizontal direction; the feeding mechanism 20 is provided with a plurality of test grooves 211 for storing package chips along the moving direction of the feeding mechanism 20, the bottom of each test groove 211 is provided with two rows of detection plates 212 corresponding to the pins on two sides of the package chip; the chip package testing device further comprises a lifting mechanism 30 arranged on the workbench 10, a testing mechanism 40 being connected to the lifting end of the lifting mechanism 30, the lifting mechanism 30 drives the testing mechanism 40 to move in a vertical direction so that the testing mechanism 40 can be inserted into or taken out of the test groove 211 located directly below; wherein the chip package testing device further comprises a linkage mechanism, the linkage mechanism has a first state and a second state; when any test groove 211 moves to the position directly below the testing mechanism 40, the first state of the linkage mechanism is triggered, the linkage mechanism responds and drives the lifting mechanism 30 to drive the testing mechanism 40 to descend so as to be inserted into the corresponding test groove 211; when any test groove 211 moves away from the position directly below the testing mechanism 40, the second state of the linkage mechanism is triggered, the linkage mechanism responds and drives the lifting mechanism 30 to drive the testing mechanism 40 to ascend so as to be taken out of the corresponding test groove 211.

[0045] In the embodiment, the workbench 10 serves as the support base of the whole device, the feeding mechanism 20 penetrates through the workbench 10 and moves in a horizontal direction, and is used for storing and conveying the package chips. The lifting mechanism 30 drives the testing mechanism 40 to move in a vertical direction, so as to complete the testing operation on the chips. The linkage mechanism has a first state and a second state, and can automatically trigger the corresponding action according to the position of the test groove 211. When the test groove 211 moves to the position directly below the testing mechanism 40, the linkage mechanism is in the first state, the lifting mechanism 30 is driven to drive the testing mechanism 40 to descend, so that the testing mechanism 40 is inserted into the test groove 211; when the test groove 211 moves away from the position directly below the testing mechanism 40, the linkage mechanism is switched to the second state, the lifting mechanism 30 is driven to drive the testing mechanism 40 to ascend, so that the testing mechanism 40 is taken out of the test groove 211. The testing of the chips is realized in an automatic manner, the risk that the operator is pressed by the lifting mechanism 30 when manually placing and taking out the chips is avoided, the personal safety of the operator is ensured, the full automation of the chip package testing is realized, the movement of the test groove 211, the lifting control of the testing mechanism 40 and the electrical testing of the chips are all realized without manual intervention, and the production efficiency and the consistency of the testing are improved.

[0046] Further, the feeding mechanism 20 comprises a moving plate 21, a transmission gear 22 and a driving member, the workbench 10 is provided with two symmetrical horizontal slide rails 11, the two sides of the moving plate 21 are in sliding fit with the two horizontal slide rails 11, and a test groove 211 is arranged on the upper side of the moving plate 21; the bottom side of the moving plate 21 is provided with a toothed portion, the transmission gear 22 is rotationally connected to the workbench 10 below the moving plate 21, and the transmission gear 22 is in mesh with the toothed portion; the driving member is transmissionally connected to the transmission gear 22; wherein the driving member comprises a manual rotating wheel 23, the transmission gear 22 is driven to rotate by rotating the manual rotating wheel 23, so that the moving plate 21 moves in the horizontal direction; and / or the driving member comprises a first stepping motor 24, the transmission gear 22 is driven to rotate by the first stepping motor 24, so that the moving plate 21 moves in the horizontal direction.

[0047] In the dynamic process, when the test groove 211 needs to be moved, the operator can choose manual or automatic mode. In the manual mode, the operator rotates the manual rotating wheel 23, the manual rotating wheel 23 drives the transmission gear 22 to rotate, the transmission gear 22 is in mesh with the toothed portion on the bottom side of the moving plate 21, so that the moving plate 21 moves along the horizontal slide rail 11. In the automatic mode, the first stepping motor 24 starts to work after receiving the pulse signal, drives the transmission gear 22 to rotate, and then drives the moving plate 21 to move. Whether in manual or automatic mode, the movement of the moving plate 21 is realized through the meshing of the transmission gear 22 and the toothed portion, which ensures the stability and accuracy of the movement.

[0048] Further, the several test grooves 211 are arranged on the upper side of the moving plate 21 along the movement direction at equal intervals. By arranging the test grooves 211 at equal intervals, the moving distance of the moving plate 21 is fixed each time, the controller 50 can pre-set the moving step length, so that the next test groove 211 can be quickly and accurately moved to the test position, the positioning time and error are reduced, and the test efficiency is improved.

[0049] Further, the lifting mechanism 30 comprises a mounting frame 31, a second stepping motor 32, a transmission screw 33, a positioning bearing and a transmission sliding block, the mounting frame 31 is installed on the workbench 10, the second stepping motor 32 and the positioning bearing are installed on the vertical two sides of the mounting frame 31, and the two ends of the transmission screw 33 are respectively connected to the second stepping motor 32 and the positioning bearing; the transmission sliding block is in screw fit with the transmission screw 33, and the mounting frame 31 is provided with a vertical slide rail 34, and the transmission sliding block is in sliding fit with the vertical slide rail 34.

[0050] Specifically, when the linkage mechanism triggers the lifting mechanism 30 to work, the second stepper motor 32 receives a pulse signal to start rotating, driving the transmission screw rod 33 to rotate. The rotation of the transmission screw rod 33 causes the transmission slider in threaded cooperation with it to move linearly under the constraint of the vertical slide rail 34. The upward or downward movement of the transmission slider is transmitted to the test mechanism 40 through the connecting component, realizing the lifting of the test mechanism 40. During the downward movement of the test mechanism 40, the probe module 42 gradually approaches the detection board 212 in the test slot 211 until the elastic probe contacts the pin of the detection board 212, completing the electrical test of the chip; after the test is completed, the second stepper motor 32 reverses, driving the transmission screw rod 33 to rotate in the opposite direction, causing the transmission slider to rise, driving the test mechanism 40 to rise and reset.

[0051] Further, the test mechanism 40 includes a guide base 41 and a probe module 42, the guide base 41 is fixed to the lifting end of the lifting mechanism 30, and the probe module 42 is connected to the lower side of the guide base 41; wherein the probe module 42 includes two rows of parallel arranged elastic probes, the arrangement interval of the elastic probes matches the interval of the two rows of pins of the detection board 212, each elastic probe is internally provided with a compression spring and has a gold-plated contact head at the end; the guide base 41 is internally provided with a test circuit board, and the probe module 42 is electrically connected to the test circuit board.

[0052] Specifically, during the test, when the linkage mechanism triggers the lifting mechanism 30 to drive the test mechanism 40 to descend, the probe module 42 moves downward. The gold-plated contact head at the end of the elastic probe gradually approaches and finally contacts the pin of the detection board 212. During the contact process, the built-in compression spring can absorb a certain impact force, ensuring stable contact between the probe and the pin. The test circuit board obtains the electrical signal of the chip through the probe module 42 and processes and analyzes it. After the test is completed, the lifting mechanism 30 drives the test mechanism 40 to rise, and the probe module 42 is separated from the pin of the detection board 212, preparing for the next round of test.

[0053] Further, the side of the guide base 41 is provided with an indicator light 43, and the indicator light 43 is electrically connected to the test circuit board.

[0054] Specifically, during the test, when the probe module 42 of the test mechanism 40 contacts the pins of the detection board 212 and completes the electrical test, the test circuit board immediately analyzes the collected signals. If the performance indicators of the chip meet the preset standards, the test circuit board will light up the green indicator light 43; otherwise, if defects or performance problems are detected in the chip, the red indicator light 43 will be lit. The operator can quickly determine the test result of the chip by observing the color of the indicator light 43. After the test is completed, the lifting mechanism 30 drives the test mechanism 40 to rise and reset, and the indicator light 43 automatically turns off during the resetting process, preparing for the next round of testing. In this embodiment, the intuitive display of the indicator light 43 enables the operator to quickly determine the test result of the chip without having to delve into complex test data or reports, but only by observing the color of the indicator light 43. This intuitive feedback method reduces the learning cost and operation time of the operator, and improves the production efficiency.

[0055] Please refer to Figure 1 , Figure 2 and Figure 3 , further, the linkage mechanism includes a controller 50 and a spring wave bead 51, the spring wave bead 51 is embedded in the horizontal slide rail 11, the moving plate 21 is provided with a plurality of clearance holes 213 corresponding to one side of the horizontal slide rail 11, and the plurality of clearance holes 213 correspond one by one to the plurality of test slots 211 in the horizontal direction of the vertical horizontal slide rail 11; when any test slot 211 is located directly below the test mechanism 40, the spring wave bead 51 is released and extends into the clearance hole 213; when all test slots 211 are not directly below the test mechanism 40, the spring wave bead 51 is compressed on the lower side of the moving plate 21; wherein a pressure sensor is arranged between the spring wave bead 51 and the horizontal slide rail 11, the pressure sensor is electrically connected with the controller 50, and the controller 50 is electrically connected with the second stepping motor 32; when the spring wave bead 51 is released, the pressure sensor senses that the pressure is less than a first preset pressure value, the controller 50 sends a first pulse signal to the second stepping motor 32, and the lifting mechanism 30 drives the test mechanism 40 to descend.

[0056] It should be explained that when the test slot 211 moves to be directly below the test mechanism 40, the spring wave bead 51 extends into the clearance hole 213 under the action of the elastic force, at this time, the pressure detected by the pressure sensor decreases to below the first preset pressure value. After receiving the signal of the pressure sensor, the controller 50 judges that the test slot 211 has been positioned, and immediately sends a first pulse signal to the second stepping motor 32. The second stepping motor 32 drives the transmission screw 33 to rotate, drives the transmission sliding block to move downward along the vertical slide rail 34, and thus drives the test mechanism 40 to descend, so that the probe module 42 contacts the pins of the detection board 212, and prepares for the electrical test. After the test is completed, the linkage mechanism triggers a rising signal to drive the test mechanism 40 to reset.

[0057] Optionally, the first preset pressure value can be 5N, which is determined according to the elastic force of the spring wave bead 51 and the weight of the moving plate 21, etc., to ensure that when the test slot 211 is accurately moved directly below the test mechanism 40, the spring wave bead 51 can smoothly extend into the avoidance hole 213, and the pressure sensor can reliably detect the pressure change.

[0058] Further, the linkage mechanism further includes a laser emitter 52 and a laser receiver 53, which are respectively arranged on both sides of the workbench 10, and the laser beam of the laser emitter 52 relative to the laser receiver 53 is blocked when the test mechanism 40 extends into the test slot 211; the laser receiver 53 is electrically connected with the controller 50, and when the continuous time of no laser input of the laser receiver 53 reaches a first preset time, the controller 50 sends a second pulse signal opposite to the first pulse signal to the second stepper motor 32, and the lifting mechanism 30 drives the test mechanism 40 to rise.

[0059] In the embodiment, the laser emitter 52 and the laser receiver 53 are respectively arranged on both sides of the workbench 10, so that the path of the laser beam passing through the test mechanism 40 extending into the test slot 211 is formed. When the test mechanism 40 extends into the test slot 211, the laser beam is blocked; when the test mechanism 40 rises and leaves the test slot 211, the laser beam is restored; the laser receiver 53 continuously monitors the state of the laser beam, and when it is detected that the laser beam is blocked and the duration reaches the first preset time, a signal is sent to the controller 50 to trigger the rising reset action of the test mechanism 40.

[0060] Specifically, during the test process, when the probe module 42 of the test mechanism 40 contacts the detection plate 212 and starts testing, the laser beam emitted by the laser emitter 52 is blocked by the test mechanism 40. The laser receiver 53 detects that the laser beam is blocked and starts timing. If the time of the laser beam being blocked reaches the first preset time (for example, 2 seconds), the laser receiver 53 sends a signal to the controller 50. After receiving the signal, the controller 50 sends a second pulse signal to the second stepper motor 32 to drive the lifting mechanism 30 to drive the test mechanism 40 to rise, so that the test mechanism 40 leaves the test slot 211 and completes the reset action.

[0061] Further, the controller 50 is also electrically connected with the first stepper motor 24, and when the controller 50 sends the second pulse signal to the second stepper motor 32, the controller 50 also sends a third pulse signal to the first stepper motor 24; wherein the moving distance of the moving plate 21 driven by the first stepper motor 24 after receiving the third pulse signal is the same as the interval distance of the adjacent two test slots 211.

[0062] In the embodiment, the driving member of the feeding mechanism 20 is the first stepper motor 24, the controller 50 is connected with the second stepper motor 32 to control the lifting of the testing mechanism 40, and is also connected with the first stepper motor 24 to control the horizontal movement of the moving plate 21. When the controller 50 sends a second pulse signal to the second stepper motor 32 (for driving the testing mechanism 40 to rise and reset), a third pulse signal is sent to the first stepper motor 24 at the same time. After receiving the third pulse signal, the first stepper motor 24 drives the moving plate 21 to move a distance equal to the interval distance between two adjacent test slots 211, so that the next test slot 211 is accurately moved to the position directly below the testing mechanism 40. Specifically, after the test is completed, the controller 50 sends a second pulse signal to the second stepper motor 32 to drive the lifting mechanism 30 to drive the testing mechanism 40 to rise and reset. At the same time, the controller 50 sends a third pulse signal to the first stepper motor 24, and after receiving the signal, the first stepper motor 24 drives the transmission gear 22 to rotate, so that the moving plate 21 moves along the horizontal slide rail 11, thereby accurately moving the next test slot 211 to be tested to the position directly below the testing mechanism 40, and preparing for the next round of test.

[0063] The application provides a packaging test method applied to the chip packaging test device of the first aspect, and the method comprises the following steps:

[0064] S100, the feeding mechanism is controlled to move horizontally, so that the target test slot is moved to the position directly below the testing mechanism;

[0065] S200, when the target test slot is in place, the linkage mechanism triggers a first state, drives the lifting mechanism to drive the testing mechanism to descend, so that the probe module of the testing mechanism is in contact with the pins of the test board;

[0066] S300, the probe module is used to perform electrical test on the packaging chip;

[0067] S400, if the test is completed and the laser receiver detects the shielding signal for a second preset time, the linkage mechanism triggers a second state, drives the lifting mechanism to rise and reset;

[0068] S500, the feeding mechanism is controlled to move to the position of the next test slot.

[0069] The above merely describes the preferred embodiments of the present application, and is not intended to limit the present application in any form. Although the present application has been disclosed with the preferred embodiments as above, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments with equivalent changes, as long as the changes or modifications do not deviate from the technical solution of the present application. Any modification, change, equivalent change and modification of the above embodiments made according to the technical essence of the present application still belong to the scope of the technical solution of the present application.

Claims

1. A chip package testing apparatus, characterized by: The chip package testing device comprises a workbench and a feeding mechanism passing through the workbench, the feeding mechanism being movably connected to the workbench in a horizontal direction; the feeding mechanism is provided with a plurality of test slots for storing packaged chips along the moving direction of the feeding mechanism, the bottom of the test slot is provided with two rows of detection plates corresponding to the pins on both sides of the packaged chip; the chip package testing device further comprises a lifting mechanism provided on the workbench, the lifting end of the lifting mechanism is connected with a testing mechanism, the lifting mechanism drives the testing mechanism to move in a vertical direction so as to make the testing mechanism probe into or out of the test slot located directly below the testing mechanism; The chip package testing device further comprises a linkage mechanism, the linkage mechanism has a first state and a second state; when any test slot moves to the position directly below the testing mechanism, the first state of the linkage mechanism is triggered, the linkage mechanism responds and drives the lifting mechanism to lower the testing mechanism to probe into the corresponding test slot; when any test slot moves away from the position directly below the testing mechanism, the second state of the linkage mechanism is triggered, the linkage mechanism responds and drives the lifting mechanism to raise the testing mechanism to out of the corresponding test slot; The feeding mechanism comprises a moving plate, a transmission gear and a driving member, the workbench is provided with two symmetrical horizontal sliding rails, the two sides of the moving plate are in sliding fit with the two horizontal sliding rails, and the test slots are opened on the upper side of the moving plate; the bottom side of the moving plate is provided with a toothed portion, the transmission gear is rotationally connected to the workbench below the moving plate, and the transmission gear is in mesh with the toothed portion; the driving member is in transmission connection with the transmission gear; The driving member comprises a manual rotating wheel, the transmission gear is driven to rotate by operating the manual rotating wheel, so that the moving plate moves in a horizontal direction; and / or the driving member comprises a first stepping motor, the transmission gear is driven to rotate by the first stepping motor, so that the moving plate moves in a horizontal direction; The lifting mechanism comprises a mounting frame, a second stepping motor, a transmission screw, a positioning bearing and a transmission sliding block, the mounting frame is mounted on the workbench, the second stepping motor and the positioning bearing are mounted on the vertical two sides of the mounting frame, and the two ends of the transmission screw are respectively connected to the second stepping motor and the positioning bearing; the transmission sliding block is in screw fit with the transmission screw, and the mounting frame is provided with a vertical sliding rail, and the transmission sliding block is in sliding fit with the vertical sliding rail; The linkage mechanism comprises a controller and a spring wave bead, the spring wave bead is embedded in the horizontal sliding rail, a plurality of clearance holes are provided on the side of the moving plate corresponding to the horizontal sliding rail, and the plurality of clearance holes and the plurality of test slots correspond to each other in a horizontal direction perpendicular to the horizontal sliding rail; when any test slot is located directly below the testing mechanism, the spring wave bead is released and extends into the clearance hole; when all the test slots are not located directly below the testing mechanism, the spring wave bead is compressed on the lower side of the moving plate. The spring wave beads are provided with a pressure sensor between the horizontal sliding rail, the pressure sensor is electrically connected with the controller, and the controller is electrically connected with the second stepper motor; when the spring wave beads are released, the pressure sensor senses that the pressure is less than a first preset pressure value, the controller sends a first pulse signal to the second stepper motor, and the lifting mechanism drives the test mechanism to descend; The linkage mechanism further comprises a laser emitter and a laser receiver, the laser emitter and the laser receiver are arranged on both sides of the workbench, and the laser beam of the laser emitter relative to the laser receiver is blocked when the test mechanism extends into the test groove; The laser receiver is electrically connected with the controller, and when the laser receiver continuously inputs no laser for a first preset time, the controller sends a second pulse signal opposite to the first pulse signal to the second stepper motor, and the lifting mechanism drives the test mechanism to ascend.

2. The chip package testing apparatus of claim 1, wherein: A plurality of test grooves are arranged on the upper side of the moving plate along the movement direction of the moving plate.

3. The chip package testing apparatus of claim 1, wherein: The test mechanism comprises a guide base and a probe module, the guide base is fixed to the lifting end of the lifting mechanism, and the probe module is connected to the lower side of the guide base; wherein the probe module comprises two rows of elastic probes arranged in parallel, the arrangement spacing of the elastic probes matches the spacing of the two rows of pins of the detection plate, each elastic probe is internally provided with a compression spring and has a gold-plated contact head at the end; the guide base is internally provided with a test circuit board, and the probe module is electrically connected to the test circuit board.

4. The chip package testing apparatus of claim 3, wherein: One side of the guide base is provided with an indicator light, and the indicator light is electrically connected to the test circuit board.

5. The chip package testing apparatus of claim 1, wherein: The controller is further electrically connected to the first stepper motor, and when the controller sends the second pulse signal to the second stepper motor, the controller also sends a third pulse signal to the first stepper motor; wherein the moving distance of the moving plate driven by the first stepper motor after receiving the third pulse signal is the same as the interval distance between the two adjacent test grooves.

6. A method of packaging testing, characterized by, The chip package testing device is applied to any one of claims 1-5, comprising the following steps: The feeding mechanism is controlled to move horizontally, so that the target test groove moves directly below the test mechanism; When the target test groove is in place, the linkage mechanism triggers a first state to drive the lifting mechanism to lower the test mechanism, so that the probe module of the test mechanism contacts the pins of the detection plate; The probe module performs electrical testing on the packaged chip; If the testing is completed and the laser receiver detects a blocking signal for a second preset time, the linkage mechanism triggers a second state to drive the lifting mechanism to rise and reset; The feeding mechanism is controlled to move to the next test groove position.

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