Integrated circuit packaging test device

Abstract

The utility model discloses an integrated circuit packaging testing device in the technical field of integrated circuit production, which comprises an installation box body, an installation groove is arranged at the upper end of the installation box body, two fixing frames are arranged on the inner walls of the two sides of the installation groove, and detection structures are arranged in the two fixing frames. The detection structure comprises two mounting plates, a plurality of slots, a plurality of conductive components and two mounting bolts; the mounting plate is fixed in an embedded fixing mode, when the integrated circuit is tested, the specification of the mounting plate can be quickly changed according to the integrated circuits of different specifications, and the packaging test requirements of the integrated circuits of multiple specifications can be met; according to the integrated circuit testing device, the pushing structure is matched with the clamping structure, the upper end of the integrated circuit is pressed through the gravity of the pressing pushing block, the integrated circuit can be rapidly fixed during testing, the pushing structure and the clamping structure can be adjusted, and the integrated circuits of different specifications can be adjusted and fixed.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, specifically to an integrated circuit packaging and testing device. Background Technology

[0002] An integrated circuit is a miniature electronic device or component. Using certain processes, the transistors, resistors, capacitors, inductors, and other components required for a circuit, along with interconnected wiring, are fabricated on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a package to become a miniature structure with the required circuit function.

[0003] The existing integrated circuit packaging and testing equipment uses test fixtures that require fixing the connector pins to the corresponding connector sleeves during use, which is complicated and reduces work efficiency. Furthermore, when the integrated circuit is placed in the test fixture, it is prone to displacement. When limiting it, the limiting component directly connects to the integrated circuit, which can easily crush or scratch the integrated circuit, thus causing damage to the integrated circuit and affecting product quality. Therefore, a new technical solution needs to be designed to solve this problem. Utility Model Content

[0004] The purpose of this utility model is to provide an integrated circuit packaging and testing device to solve the problems mentioned in the background art. In the existing integrated circuit packaging and testing devices, the test fixtures used in the existing integrated circuit packaging and testing devices require fixing the connecting pins to the corresponding connecting sleeves during use, which is complicated and reduces work efficiency. In addition, when the integrated circuit is placed in the test fixture, it is easy to shift. When limiting it, the limiting component directly connects with the integrated circuit, which can easily crush or scratch the integrated circuit, thereby causing damage to the integrated circuit and affecting the quality of the product.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an integrated circuit packaging and testing device, comprising a mounting box, wherein a mounting groove is provided at the upper end of the mounting box, and two fixing frames are provided on the inner walls of both sides of the mounting groove, wherein a detection structure is installed in the two fixing frames, and the detection structure includes two mounting plates, several slots, several conductive components and two mounting bolts.

[0006] The two mounting plates are respectively movably embedded in the two fixed frames, the plurality of slots are evenly opened on the upper part of the two mounting plates, the plurality of conductive components are respectively located in the lower part of the plurality of slots, and the two mounting bolts are respectively movably embedded in one side wall of the two fixed frames.

[0007] As a preferred embodiment of the integrated circuit packaging and testing device of this utility model, a clamping structure is installed on one side of the lower wall of the mounting groove. The clamping structure includes a clamping groove, a moving block, a lead screw, a first threaded sleeve, a hinged rod, and a pressing and pushing block.

[0008] The clamping groove is formed on one side of the lower wall of the mounting groove. The moving block is movably embedded in the clamping groove. One end of the lead screw movably passes through one side of the clamping groove, and the other end is movably connected to the inner wall of the clamping groove through a bearing. The moving block is movably fitted onto the upper end of the lead screw. The first threaded sleeve is fixedly embedded in the upper wall of the moving block. The bottom end of the hinge rod is movably embedded in the first threaded sleeve. One end of the pressing and pushing block is hinged to the upper end of the hinge rod.

[0009] As a preferred embodiment of the integrated circuit packaging and testing device of this utility model, a pushing structure is installed on one side wall of the mounting groove, and the pushing structure includes a second threaded sleeve, a pushing screw and a top plate;

[0010] The second threaded sleeve is embedded in one side wall of the mounting groove, the push screw is movably embedded in the second threaded sleeve, and the top plate is fixedly installed at one end of the push screw.

[0011] As a preferred embodiment of the integrated circuit packaging and testing device of this utility model, the mounting box is provided with a cooling structure, which includes two semiconductor cooling chips and two heat dissipation boxes.

[0012] The two semiconductor cooling chips are respectively embedded in the lower two sides of the mounting groove, and the two heat dissipation boxes are respectively installed in the two sides of the mounting box, and are respectively located at the lower ends of the two semiconductor cooling chips.

[0013] As a preferred embodiment of the integrated circuit packaging and testing device of this utility model, each of the conductive components includes a spring and a conductive sheet.

[0014] The spring is fixedly installed in the lower end of the slot, and the conductive sheet is fixedly installed in the upper end of the spring.

[0015] As a preferred embodiment of the integrated circuit packaging and testing device of this utility model, two heat dissipation holes are provided on both sides of the lower wall of the mounting box.

[0016] As a preferred embodiment of the integrated circuit packaging and testing device of this utility model, air inlets are provided on both sides of the mounting box and both sides of the heat dissipation box.

[0017] Compared with the prior art, the beneficial effects of this utility model are: the integrated circuit packaging and testing device has a reasonable structural design;

[0018] 1. The mounting plate is fixed by an embedded mounting method. When testing integrated circuits, the specifications of the mounting plate can be quickly changed according to the specifications of integrated circuits of different specifications, which can be applied to the packaging and testing needs of integrated circuits of multiple specifications.

[0019] 2. By combining the push-up structure and the clamping structure, the upper end of the integrated circuit is pressed by the weight of the push-up block, which can quickly fix the integrated circuit during testing. Both the push-up structure and the clamping structure are adjustable, so that integrated circuits of different specifications can be adjusted and fixed. Attached Figure Description

[0020] Figure 1 This is a front-view three-dimensional structural schematic diagram of the present invention;

[0021] Figure 2 This is a rear-view three-dimensional structural diagram of the present invention;

[0022] Figure 3 This is a schematic diagram of the main sectional view of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure at point A of this utility model.

[0024] In the diagram: 1. Mounting housing, 2. Mounting slot, 3. Fixing frame, 4. Mounting plate, 5. Slot, 6. Mounting bolt, 7. Clamping slot, 8. Moving block, 9. Lead screw, 10. First threaded sleeve, 11. Hinge rod, 12. Pressing push block, 13. Second threaded sleeve, 14. Push screw, 15. Top plate, 16. Semiconductor cooling chip, 17. Heat sink housing, 18. Spring, 19. Conductive plate, 20. Heat dissipation hole, 21. Air inlet. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1-4 This utility model provides a technical solution:

[0027] In this technical solution, an integrated circuit packaging and testing device includes a mounting box 1, a mounting groove 2 is provided at the upper end of the mounting box 1, and two fixing frames 3 are provided on the inner walls of both sides of the mounting groove 2. A detection structure is installed in the two fixing frames 3. The detection structure includes two mounting plates 4, several slots 5, several conductive components and two mounting bolts 6.

[0028] Two mounting plates 4 are movably embedded in two fixed frames 3 respectively. Several slots 5 are evenly opened on the upper end of the two mounting plates 4. Several conductive components are located at the lower end of several slots 5 respectively. Two mounting bolts 6 are movably embedded in one side wall of the two fixed frames 3 respectively.

[0029] In this technical solution, when testing the packaged integrated circuit, the operator first places the mounting box 1 in the designated position, then connects the plug on one side of the mounting box 1 to the designated test system. Then, according to the specifications of the integrated circuit, the designated mounting plate 4 is embedded into two fixed frames 3 and fixed with two mounting bolts 6. The conductive components are connected to the plug on one side of the mounting box 1 through a cable. Then, the push structure is adjusted to the designated position to limit one end of the designated integrated circuit, and the integrated circuit is placed into the mounting slot 2. The pins on both sides of the integrated circuit are respectively embedded into several slots 5 in the mounting plates 4 on both sides, making contact with the conductive components, and the integrated circuit is tested. Finally, the integrated circuit is clamped and pressed by the clamping structure.

[0030] In some technical solutions, reference Figure 1 A clamping structure is installed on one side of the lower wall of the mounting groove 2. The clamping structure includes a clamping groove 7, a moving block 8, a lead screw 9, a first threaded sleeve 10, a hinge rod 11, and a pressing and pushing block 12.

[0031] The clamping groove 7 is opened on one side of the lower wall of the mounting groove 2. The moving block 8 is movably embedded in the clamping groove 7. One end of the screw 9 movably passes through one side of the clamping groove 7, and the other end is movably connected to the inner wall of the clamping groove 7 through a bearing. The moving block 8 is movably fitted on the upper end of the screw 9. The first threaded sleeve 10 is fixedly embedded in the upper wall of the moving block 8. The bottom end of the hinge rod 11 is movably embedded in the first threaded sleeve 10. One end of the pressing and pushing block 12 is hinged to the upper end of the hinge rod 11.

[0032] In this technical solution, when clamping and testing the integrated circuit, the screw 9 is turned, and the internal thread of the moving block 8 cooperates with the screw 9 to move the moving block 8 to a designated position. Then, the pressing and pushing block 12 is flipped on the hinge rod 11, so that the pressing and pushing block 12 is located at the upper end of the integrated circuit and the integrated circuit is pressed. Then, the screw 9 is turned again, and the protrusion at the lower end of the pressing and pushing block 12 pushes one side of the integrated circuit. In cooperation with the pushing structure, the integrated circuit is fully fixed. Through the first threaded sleeve 10 and the hinge rod 11, the hinge rod 11 and the pressing and pushing block 12 can be disassembled and replaced, which can easily meet the fixing requirements of integrated circuits of different specifications.

[0033] In some technical solutions, reference Figure 1A propulsion structure is installed on one side wall of the mounting slot 2. The propulsion structure includes a second threaded sleeve 13, a propulsion screw 14, and a top plate 15.

[0034] The second threaded sleeve 13 is embedded in one side wall of the mounting groove 2, the push screw 14 is movably embedded in the second threaded sleeve 13, and the top plate 15 is fixedly installed at one end of the push screw 14.

[0035] In this technical solution, when fixing the integrated circuit, the push screw 14 inside the second threaded sleeve 13 is turned. The push screw 14 moves inside the second threaded sleeve 13, changing the position of the top plate 15, and the top plate 15 limits one end of the integrated circuit.

[0036] In some technical solutions, reference Figure 1 The mounting box 1 is equipped with a cooling structure, which includes two semiconductor cooling chips 16 and two heat dissipation boxes 17.

[0037] Two thermoelectric coolers 16 are respectively embedded in the lower two sides of the mounting slot 2, and two heat sinks 17 are respectively installed in the two sides of the mounting box 1, and are respectively located at the lower ends of the two thermoelectric coolers 16.

[0038] In this technical solution, when testing integrated circuits, in order to ensure the low-temperature operation of the integrated circuits, the fan inside the heat sink 17 works in conjunction with the semiconductor cooling chip 16 to cool the integrated circuits as a whole.

[0039] In some technical solutions, reference Figure 1 Several conductive components include a spring 18 and a conductive sheet 19;

[0040] Spring 18 is fixedly installed in the lower end of slot 5, and conductive sheet 19 is fixedly installed in the upper end of spring 18.

[0041] In this technical solution, when testing the integrated circuit, the conductive plate 19 at the upper end of the spring 18 contacts the pins on both sides of the integrated circuit, and with the cooperation of the spring 18 and the pressing push block 12, it can be ensured that the pins of the integrated circuit are in full contact with the conductive plate 19.

[0042] In some technical solutions, reference Figure 1 Two heat dissipation holes 20 are provided on both sides of the lower wall of the mounting box 1, and air inlets 21 are provided on both sides of the mounting box 1 and both sides of the heat dissipation box 17.

[0043] Working principle:

[0044] When testing the packaged integrated circuit, the operator first places the mounting box 1 in the designated position, then connects the plug on one side of the mounting box 1 to the designated test system. Next, according to the specifications of the integrated circuit, the designated mounting plate 4 is embedded into two fixed frames 3 and secured with two mounting bolts 6. Then, by turning the push screw 14 inside the second threaded sleeve 13, the position of the top plate 15 is changed, and the top plate 15 limits one end of the integrated circuit. The integrated circuit is then placed into the mounting slot 2, and the pins on both sides of the integrated circuit are respectively embedded into several slots 5 in the mounting plates 4 on both sides. The conductive plate 19 at the upper end of the spring 18 contacts the pins on both sides of the integrated circuit. With the cooperation of the spring 18 and the pressing push block 12, the pins of the integrated circuit and the conductive plate 19 are kept in contact. 9. After full contact, the integrated circuit is tested. Then, by turning the lead screw 9, the moving block 8 is moved to the designated position through the cooperation of the internal thread in the moving block 8 and the lead screw 9. Then, the pressing push block 12 is flipped on the hinge rod 11 so that the pressing push block 12 is located at the upper end of the integrated circuit and the integrated circuit is pressed. Then, the lead screw 9 is turned again, and the protrusion at the lower end of the pressing push block 12 pushes one side of the integrated circuit. In cooperation with the pushing structure, the integrated circuit is fully fixed. Through the set first threaded sleeve 10 and hinge rod 11, the hinge rod 11 and the pressing push block 12 can be disassembled and replaced, which can meet the fixing requirements of integrated circuits of different specifications. When testing the integrated circuit, in order to ensure the low temperature working state of the integrated circuit, the fan in the heat sink 17 cooperates with the semiconductor cooling chip 16 to cool the integrated circuit as a whole.

[0045] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0046] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. An integrated circuit package testing apparatus comprising a mounting cabinet (1), characterized in that, The mounting box (1) is provided with a mounting groove (2) at the upper end, two fixed frames (3) are arranged at the inner walls of the two sides of the mounting groove (2), and a detection structure is mounted in the two fixed frames (3). The two mounting plates (4) are movably embedded in the two fixed frames (3), a plurality of insertion grooves (5) are evenly arranged at the upper end of the two mounting plates (4), a plurality of conductive assemblies are arranged at the lower end of the insertion grooves (5), and two mounting bolts (6) are movably embedded in the inner wall of one side of the two fixed frames (3).

2. The integrated circuit package testing apparatus of claim 1, wherein A clamping structure is mounted on one side of the lower wall of the mounting groove (2), which comprises a clamping groove (7), a moving block (8), a lead screw (9), a first threaded sleeve (10), a hinged rod (11) and a pressing advancing block (12). The clamping groove (7) is arranged on one side of the lower wall of the mounting groove (2), the moving block (8) is movably embedded in the clamping groove (7), one end of the lead screw (9) is movably penetrated through one side of the clamping groove (7), and the other end is movably connected with the inner wall of the clamping groove (7) through a bearing, the moving block (8) is movably sleeved on the upper end of the lead screw (9), the first threaded sleeve (10) is fixedly embedded in the upper wall of the moving block (8), the hinged rod (11) is movably embedded in the first threaded sleeve (10), and one end of the pressing advancing block (12) is hinged with the upper end of the hinged rod (11).

3. The integrated circuit package testing apparatus of claim 1, wherein An advancing structure is mounted on one side wall of the mounting groove (2), which comprises a second threaded sleeve (13), an advancing screw (14) and a top sheet (15). The second threaded sleeve (13) is embedded in the side wall of the mounting groove (2), the advancing screw (14) is movably embedded in the second threaded sleeve (13), and the top sheet (15) is fixedly mounted on one end of the advancing screw (14).

4. The integrated circuit package testing apparatus of claim 1, wherein A cooling structure is arranged in the mounting box (1), which comprises two semiconductor refrigeration sheets (16) and two heat dissipation boxes (17). The two semiconductor refrigeration sheets (16) are movably embedded in the lower end of the mounting groove (2), and the two heat dissipation boxes (17) are movably embedded in the two sides of the mounting box (1) and are arranged below the two semiconductor refrigeration sheets (16).

5. The integrated circuit package testing apparatus of claim 1, wherein A plurality of conductive assemblies each comprise a spring (18) and a conductive sheet (19). The spring (18) is fixedly mounted at the lower end of the insertion groove (5), and the conductive sheet (19) is fixedly mounted at the upper end of the spring (18).

6. The integrated circuit package testing apparatus of claim 1, wherein Two heat dissipation holes (20) are arranged on the lower wall of the mounting box (1).

7. The integrated circuit package testing apparatus of claim 3, wherein Air inlets (21) are arranged on the two sides of the mounting box (1) and the two sides of the heat dissipation box (17).

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