Self-adaptive novel heat dissipation module based on thermoelectric conversion and control method thereof

Abstract

The invention discloses a novel self-adaptive heat dissipation module based on thermoelectric conversion and a control method thereof.The novel self-adaptive heat dissipation module comprises a heat pipe, a TEG module, heat dissipation fins, a heat dissipation Block and a fan, the TEG module is embedded between the heat pipe and the heat dissipation fins, waste heat is converted into electric energy to drive the fan, the rotating speed of the fan is dynamically adjusted through a closed-loop control algorithm, and the heat dissipation efficiency is improved. The TEG always works in a high-efficiency temperature difference interval, and the surface temperature of the equipment is ensured to reach the standard. A heat pipe-TEG-fin sandwich structure is created for the first time, efficient power generation is achieved through the inherent temperature difference of a heat dissipation path, and a double-constraint control strategy of temperature difference efficiency and surface temperature is provided to break through the limitation of traditional single-target temperature control; and meanwhile, a Bi2Te3-based thermoelectric unit of a TEG module material is modified, and the Bi2Te3-based thermoelectric unit and the Bi2Te3-based thermoelectric unit act synergistically, so that 60-80% of power consumption of the fan can be recovered and supplied by waste heat when the temperature difference between a heat pipe and a heat dissipation fin is 30-50 DEG C, the endurance of the whole machine is improved by 7-12%, the energy consumption of the whole machine is reduced by about 15%, the conversion efficiency of the TEG can be up to 8.5% at most, and the noise of the fan can be reduced by 4-6 dB under the same heat dissipation capability.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation modules and control methods thereof, and in particular to a novel adaptive heat dissipation module based on thermoelectric conversion and a control method thereof. Background Art

[0002] Existing laptop cooling systems typically consist of heat pipes, cooling fins, and fans. Heat pipes transfer heat from the CPU / GPU to the fins, while fans force convection to dissipate the heat. However, these systems suffer from the following drawbacks: 1) waste heat is directly discharged, leaving the energy unutilized; 2) fans rely on batteries, increasing overall system power consumption; 3) fixed speed strategies cannot adapt to dynamic thermal loads, resulting in fluctuating cooling efficiency; and 4) balancing surface temperature and cooling performance is difficult. While previous studies have attempted to integrate thermoelectric modules (TEGs) into cooling modules, these have not addressed the dynamic matching of power generation efficiency and cooling requirements, resulting in limited actual energy savings.

[0003] CN107201935B discloses a thermoelectric power generation device with an automobile exhaust diversion control function and a diversion control method thereof. The invention discloses a thermoelectric power generation device with an automobile exhaust diversion control function and a diversion control method thereof. The thermoelectric power generation device mainly includes a heat collection box, a thermoelectric module group, a heat dissipation fin, a diversion grid, and a storage module. The thermoelectric module group is installed between the heat source provided by the heat collection box and the cold source provided by the heat dissipation fin. Under the action of the temperature difference, the thermoelectric module group generates electricity and stores the electricity in the storage module. The diversion grid controls the exhaust gas so that the exhaust heat flows to different parts of the thermoelectric module group in different proportions, and allows some thermoelectric modules to enter the high-efficiency working area first. Based on temperature signals and pressure signals, the present invention can not only prevent the thermoelectric modules from overheating and damage by regulating the exhaust diversion, but also can direct the exhaust gas to the two sides of the heat collection box in different proportions according to the different exhaust temperatures, thereby enabling some thermoelectric modules to work efficiently, giving full play to the characteristics of the thermoelectric modules, and improving the overall output performance of the thermoelectric power generation device.

[0004] The disadvantages of existing technologies are that thermal energy is not effectively utilized, exacerbating greenhouse gas emissions and thermal pollution, further increasing the environmental burden and wasting resources. Furthermore, using batteries for power reduces battery life. Therefore, a novel adaptive heat dissipation module based on thermoelectric conversion and its control method are proposed.

[0005] Although both the invention and the present invention utilize temperature difference and set up a thermoelectric module group, the specific technical solutions and the specific technical problems solved are different, and the technical effects are obviously different, which obviously cannot provide obvious technical inspiration to technical personnel in this field. Summary of the Invention

[0006] To overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a thermoelectric adaptive heat dissipation module, that is, a thermoelectric-heat dissipation collaborative system, which solves the problem of dynamic matching between power generation efficiency and heat dissipation requirements.

[0007] The thermoelectric-heat dissipation collaborative system mainly consists of a heat pipe, a thermoelectric module, heat dissipation fins, a fan, and a control module. By embedding a thermoelectric conversion module between the heat pipe and the heat dissipation fins, waste heat is converted into electrical energy to drive the fan, and the fan speed is dynamically adjusted through a closed-loop control algorithm, so that the thermoelectric conversion module always operates in the high-efficiency temperature difference range while ensuring that the surface temperature of the device meets the standard.

[0008] The adaptive new heat dissipation module for thermoelectric conversion includes a heat pipe, a thermoelectric module, and heat dissipation fins connected in sequence. The output ends of all thermoelectric modules are connected to the fan, and a control module is provided to adjust the fan speed in real time to maintain the thermoelectric module operating in a preset temperature difference range.

[0009] The heat pipe is used to conduct the heat of the heating element of the electronic device; the thermoelectric module is composed of multiple thermoelectric units connected in series or parallel. Its hot end is in contact with the heat pipe, and its cold end is connected to the heat dissipation fins; the heat dissipation fins are closely attached to the cold end of the thermoelectric module; the fan is connected to the output end of the thermoelectric module through a wire and is driven by the electrical energy generated by thermoelectric conversion; the control module integrates a temperature sensor, a voltage detection circuit, and a PWM speed regulator, and is used to dynamically adjust the fan speed to maintain the preset temperature difference range of the thermoelectric module and control the surface of the device not to exceed the threshold value.

[0010] The heat pipe is connected to the hot end of the CPU / GPU and the TEG; the thermoelectric module is composed of multiple groups of modified Bi2Te3-based thermocouples connected in series / parallel. The hot end is attached to the heat pipe, and the cold end is connected to the heat dissipation fins; the heat dissipation fins adopt copper-aluminum composite fins, and the surface is coated with a graphene-enhanced heat dissipation coating and is in close contact with the cold end of the TEG; the fan is connected to the output end of the TEC through a wire and is driven by the recycled power; the control module includes an integrated temperature sensor, a voltage detection circuit, and a PWM speed regulator.

[0011] To achieve the above object, the present invention provides the following technical solutions:

[0012] A thermoelectric adaptive heat dissipation module, the algorithm logic of the control module is:

[0013] Real-time monitor the temperature difference ΔT between the heat pipe and the heat dissipation fins, and the temperature T_surface of the device housing;

[0014] b. When ΔT > 50 °C, increase the fan speed to reduce ΔT;

[0015] c. When ΔT < 30 °C, reduce the fan speed to increase ΔT;

[0016] A control method for an adaptive new heat dissipation module based on thermoelectric conversion, comprising the following steps:

[0017] S1. Establish a mapping relationship database between the output power of the thermoelectric module and the temperature difference ΔT;

[0018] S2. Real-time collect the temperature difference ΔT between the heat pipe and the heat dissipation fins, and the temperature T_surfac of the device housing;

[0019] S3. Dynamically adjust the fan speed through a dual-objective optimization algorithm so that ΔT is maintained at 30 - 50 °C, and at the same time T_surfac ≤ T_max;

[0020] S4. When the output power of the thermoelectric module is insufficient, the supercapacitor supplies power for supplementation.

[0021] The above-mentioned modified Bi2Te3-based thermoelectric unit:

[0022] 1) Preparation method:

[0023] In the Bi2Te3-based gradient doping module: embed GeTe quantum dots (particle size 5 - 8 nm) and SnSe nanosheets (thickness < 10 nm); wrap the GeTe quantum dots (core, diameter 5 nm) with a 2 nm thick Sb2Te3 shell layer to form a core-shell structure:

[0024] GeTe quantum dots: distributed in the high-doping region at the hot end to enhance the Seebeck coefficient in the high-temperature region;

[0025] SnSe nanosheets: distributed in the low-doping region at the cold end to reduce the lattice thermal conductivity;

[0026] 2) Material treatment:

[0027] Bi2Te3 matrix treatment:

[0028] Use the zone melting method to grow Bi2Te3 single crystals and cut them into 10 × 10 × 2 mm 3 substrate; form nanoscale grain boundary grooves (width ≤ 50 nm) on the substrate surface through ion etching;

[0029] GeTe quantum dot deposition:

[0030] Use a CVD system (reaction gas: GeH4 + Te(CH3)2, carrier gas H2) to deposit GeTe quantum dots in the hot end region (temperature 450 °C), control the deposition time for 5 min, and obtain quantum dots with a particle size of 5 - 8 nm.

[0031] SnSe nanosheet growth:

[0032] Switch the reaction gas to SnCl4 + H2Se, and grow SnSe nanosheets with a thickness of <10 nm in the cold-end region (temperature 380 °C);

[0033] Annealing treatment:

[0034] Anneal at 550 °C for 2 hours in an Ar atmosphere to promote the fusion of the heterointerface;

[0035] The control module further includes a boost and voltage regulation circuit and a super capacitor. The input end of the boost and voltage regulation circuit is connected to the output end of the thermoelectric module, and the output end is linked to the fan and the super capacitor, which is used to convert the unstable low-voltage direct current output by the thermoelectric module into a stable voltage.

[0036] The present invention also discloses that the algorithm logic of the control module is as follows:

[0037] a. Real-time monitor the temperature difference ΔT between the heat pipe and the heat dissipation fins, and the temperature of the device shell T_surface;

[0038] b. When ΔT > 50 °C, increase the fan speed to reduce ΔT;

[0039] c. When ΔT < 30 °C, reduce the fan speed to increase ΔT;

[0040] d. The preset threshold is T_max. If T_surfac ≥ T_max, give priority to increasing the fan speed until T_surfac drops below the threshold T_max.

[0041] The control algorithm uses a fuzzy PID controller, with the input quantities being ΔT and T_surfac, and the output quantity being the fan PWM duty cycle;

[0042] The present invention also discloses a control method for an adaptive new heat dissipation module based on thermoelectric conversion, which is characterized by including the following steps:

[0043] S1. Establish a mapping relationship database between the output power of the thermoelectric module and the temperature difference ΔT;

[0044] S2. Real-time collect the temperature difference ΔT between the heat pipe and the heat dissipation fins, and the temperature of the device shell T_surfac;

[0045] S3. Dynamically adjust the fan speed through a dual-objective optimization algorithm, so that ΔT is maintained at 30 - 50 °C, and at the same time T_surfac ≤ T_max;

[0046] S4. When the output power of the thermoelectric module is insufficient, the super capacitor supplies power for supplementation.

[0047] In step S3, it is preferred to ensure that T_surfac ≤ T_max first, and then optimize ΔT to the efficient range.

[0048] The TEG module can be directly integrated with a traditional radiator through soldering, and is soldered between the heat pipe and the fin to form an integral material. The advantages are as follows:

[0049] 1) It can effectively reduce the contact thermal resistance and improve the conversion efficiency;

[0050] 2) The integrated feeding is convenient for the assembly operation of the whole machine production line and improves the efficiency;

[0051] 3) The TEG module can convert part of the waste heat into electric energy, which can appropriately reduce the heat dissipation pressure of the radiator itself, and thus improve the heat dissipation efficiency of the whole machine.

[0052] Working principle:

[0053] 1) When the computer is turned on, a large amount of heat is generated in the chips in the system;

[0054] 2) Multiple thermoelectric modules inside the radiator work in series simultaneously and generate part of the electric energy;

[0055] 3) The electric energy is stored through the energy storage device on the radiator;

[0056] 4) When the system temperature is high, the fan is powered by the voltage converted by the boost chip and rotates to protect the system temperature;

[0057] 5) When the system is running, the electric energy generated by multiple TEG modules in series is used to supply power to the fan inside the notebook, and the system can adjust the fan speed to keep the thermoelectric module at a relatively high conversion efficiency (under the premise of meeting the surface temperature);

[0058] 6) The fan speed can be dynamically modeled according to the relationship between temperature, speed and power generation, and the fan speed can be adjusted in real time;

[0059] 7) In addition, the upper and lower covers of the fan can also be replaced by thermoelectric conversion modules to increase the heat generation area;

[0060] Note: The temperature of the CPU / GPU, etc. can be read through the built-in sensor, and the surface temperature of the computer can be measured through a professional temperature sensing wire;

[0061] Abbreviation and definition of key terms of the present invention:

[0062] Thermoelectric conversion effect: The phenomenon that the thermal energy is directly converted into electric energy by directly driving the carrier (electron / hole) to migrate directionally through the temperature difference at both ends of the thermoelectric material;

[0063] TEG module (thermoelectric conversion module): A solid-state device that directly converts thermal energy into electric energy by using the Seebeck effect through the temperature difference, and is commonly used in waste heat recovery and distributed energy systems;

[0064] DC-DC boost chip: an electronic component that boosts the input DC voltage to a higher output voltage through a switching circuit. It is often used in battery-powered devices to achieve efficient energy conversion.

[0065] PMIC (Power Management Integrated Circuit): A chip that integrates multiple power management functions and is used to efficiently distribute, convert, and regulate power supply in electronic devices. It is commonly found in mobile devices, embedded systems, etc.

[0066] The technical effects and advantages of the control method of the novel adaptive heat dissipation module based on thermoelectric conversion of the present invention are as follows:

[0067] By embedding a TEG module between the heat pipe and the cooling fins, waste heat is converted into electricity to drive the fan. The fan speed is dynamically adjusted through a closed-loop control algorithm, ensuring that the TEG always operates within the efficient temperature range while ensuring that the device surface temperature meets the required standards. The innovative "heat pipe-TEG-fin" sandwich structure utilizes the inherent temperature difference along the heat dissipation path to achieve efficient power generation. The proposed dual-constraint control strategy for temperature difference efficiency and surface temperature overcomes the limitations of traditional single-target temperature control, enabling 60-80% of the fan's power consumption to be recovered from waste heat. This improves the overall battery life by 7-12%, reduces overall energy consumption by approximately 15%, and reduces fan noise by 4-6dB while maintaining the same heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 This is a structural diagram of a traditional radiator in comparative example 1 of a novel adaptive heat dissipation module based on thermoelectric conversion and its control method proposed by the present invention;

[0069] Figure 2 This is a structural diagram of a novel heat dissipation module implemented in 1 in a novel adaptive heat dissipation module based on thermoelectric conversion and a control method thereof proposed by the present invention;

[0070] Figure 3 Schematic diagram of the working principle of the novel heat dissipation module of Example 1 in a novel adaptive heat dissipation module based on thermoelectric conversion and a control method thereof proposed by the present invention;

[0071] Figure 4 This is a driving circuit diagram of a thermoelectric conversion module of a novel heat dissipation module according to Example 1 of a novel adaptive heat dissipation module based on thermoelectric conversion and a control method thereof proposed by the present invention;

[0072] Figure 5 This is a boost circuit diagram of a thermoelectric conversion module of a novel heat dissipation module in Example 1 of a novel adaptive heat dissipation module based on thermoelectric conversion and a control method thereof proposed by the present invention; DETAILED DESCRIPTION

[0073] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0074] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, the elements defined by the statement "including..." do not exclude the existence of additional identical elements in the process, method, article or device including the said elements.

[0075] This embodiment provides an adaptive new heat dissipation module based on thermoelectric conversion, including a heat pipe, a thermoelectric module, heat dissipation fins, a fan and a control module;

[0076] One end of the heat pipe is connected to the CPU / GPU, and the other end is connected to the hot end of the thermoelectric module; the thermoelectric module is composed of multiple groups of Bi2Te3-based thermocouples connected in series / parallel, and its cold end is connected to the heat dissipation fins; the heat dissipation fins adopt copper-aluminum composite fins and are in close contact with the cold end of the thermoelectric module; the fan is connected to the output end of the thermoelectric module through a wire; the control module integrates a temperature sensor, a voltage detection circuit and a PWM speed regulator for adjusting the speed of the fan in real time;

[0077] The control module establishes a correspondence database between the output power of the thermoelectric module and ΔT (the temperature difference between the heat pipe and the fins). The control module monitors the shell temperature T_surface in real time and sets the threshold T_max to 45°C. The control module dynamically adjusts the speed of the fan to keep ΔT within the optimal efficiency range of 30 - 50°C, while ensuring that T_surface ≤ 45°C. The control module uses a fuzzy PID controller, with the input variables being ΔT and T_surf ace, and the output being the PWM duty cycle of the fan.

[0078] When ΔT > 50°C, the control module increases the speed of the fan to enhance heat dissipation and reduce ΔT; when ΔT < 30°C, the control module decreases the speed of the fan to increase ΔT; if T_surface is close to 45°C, the control module preferentially increases the speed of the fan until the temperature drops.

[0079] The output end of the thermoelectric module is connected to a boost voltage regulator circuit (such as LTC3108) for converting unstable low-voltage DC into a 5V fan drive voltage. It also includes a supercapacitor as an energy storage buffer unit to supplement power when the power supply of the thermoelectric module is insufficient.

[0080] Embodiment 1

[0081] Reference Figure 2 、 3 、4, 5, this embodiment provides a novel adaptive heat dissipation module based on thermoelectric conversion and its control method. The specific implementation steps include:

[0082] Implementation of the adaptive heat dissipation module structure

[0083] Heat pipe

[0084] Material: Oxygen-free copper (purity ≥ 99.9%), outer diameter 6mm, wall thickness 0.5mm, internally filled with a sintered copper powder capillary structure;

[0085] Connection method: One end of the heat pipe is attached to the surface of the laptop CPU (model: Intel i7-12700H) through thermal grease (Shin-Etsu 7921), and the other end is welded to the hot end of the thermoelectric module.

[0086] Thermoelectric module

[0087] Composition: 16 modified Bi2Te3-based thermoelectric units (single-piece size 10mm × 10mm × 2mm, Seebeck coefficient 220μV / K), connected in series using silver paste conductive adhesive (model: EPO-TEK H20E);

[0088] Hot end treatment: The hot end is welded to the heat pipe through indium foil (thickness 0.1mm), and the contact thermal resistance ≤ 0.05℃·cm 2 / W;

[0089] Cold end treatment: The cold end is welded to the copper-aluminum composite heat sink fins, and the welding layer thickness ≤ 0.2mm.

[0090] Heat sink fins

[0091] Structure parameters: The fin material is a copper-aluminum composite plate (copper layer thickness 0.3mm, aluminum layer thickness 0.5mm), fin height 15mm, spacing 1.2mm, and the surface is coated with a graphene heat dissipation coating (thickness 2μm, thermal conductivity 1500W / m·K);

[0092] Installation method: Fixed to the TEG cold end through a press riveting process, and the contact pressure ≥ 10N / cm 2 ;

[0093] Fan

[0094] Model: Sunon MagLev MF50151VX-1000U-A99, rated voltage 5V, maximum air volume 1.2CFM;

[0095] Power supply circuit: Connected to the LTC3108 boost voltage regulator circuit, input voltage range 0.2 - 5V, output regulated to 5V ± 2%.

[0096] Control module

[0097] Hardware components: Temperature sensor: DS18B20 (temperature measurement range -55°C - 125°C, accuracy ±0.5°C); Voltage detection: INA219 current / voltage monitoring chip (I 2 C interface, resolution 0.1mV); Main control chip: STM32F103C8T6 microcontroller, PWM output frequency 25kHz; Energy storage unit: Maxwell 2.7V / 10F supercapacitor, connected in series to form a 5.4V / 5F module.

[0098] Software logic: Temperature difference sampling period: 100ms; Fuzzy PID parameters: Proportional coefficient Kp = 0.8, integral time Ti = 10s, derivative time Td = 2s.

[0099] The structure of the adaptive heat dissipation module is as Figure 2 shown; The working principle of the adaptive heat dissipation module is as Figure 3 shown; The implementation of the control method

[0100] 1. Establishment of temperature difference - efficiency mapping:

[0101] Test conditions: Simulate an environment of ΔT = 10°C - 60°C in an incubator, and record the TEG output power at intervals of 5°C;

[0102] Data fitting: Obtain a quadratic function relationship through the least squares method: P = 0.12ΔT 2 - 1.5ΔT + 8.6 (unit: mW, ΔT unit: °C)

[0103] Data storage: Burn the mapping table into the microcontroller FLASH memory;

[0104] Execution of dual - objective optimization:

[0105] Set thresholds: T_max = 45°C (meeting the ergonomic safety standard), ΔT target range 30 - 50°C;

[0106] Control example:

[0107] When T_surface = 43°C and ΔT = 55°C, the controller calculates that the fan speed needs to be increased to a duty cycle of 80% (corresponding to an air volume of 0.96CFM);

[0108] When T_surface = 40 °C and ΔT = 25 °C, the fan speed is reduced to a 30% duty cycle (air volume 0.36 CFM).

[0109] Emergency power supply logic:

[0110] When the TEG output power < fan demand, the supercapacitor discharges in a constant current mode (discharge current ≤ 500 mA);

[0111] When the capacitor voltage is lower than 4 V, switch to battery power supply (priority: TEG > supercapacitor > battery);

[0112] The adaptive heat dissipation module control circuit is as Figure 4 、 Figure 5 shown;

[0113] Comparative Example 1: Traditional heat dissipation module (without TEG)

[0114] Structural parameters:

[0115] Heat pipe: same as in Example 1;

[0116] Heat dissipation fins: pure aluminum fins (without coating), with the same size as in Example 1;

[0117] Fan: same as in Example 1, directly powered by the laptop battery;

[0118] Control strategy: fixed speed (100% duty cycle at full load).

[0119] The traditional heat dissipation module is as Figure 1 shown;

[0120] Comparative Example 2: Powered by TEG but without closed-loop control

[0121] Refer to Figure 1 , this embodiment provides an adaptive new heat dissipation module based on thermoelectric conversion and its control method. The specific implementation steps include:

[0122] Structural parameters:

[0123] TEG module: same as in Example 1;

[0124] Control module: Remove the STM32 microcontroller and replace it with a linear voltage regulator circuit to directly drive the fan (without speed regulation function).

[0125] Comparative Example 3: Single-target temperature control (only control the surface temperature)

[0126] Control logic:

[0127] Only adjust the fan speed according to T_surface, ignoring the ΔT optimization;

[0128] The temperature threshold is set at 45 °C, and when the threshold is exceeded, the fan runs at full speed.

[0129] Comparative Example 4: Unmodified Bi2Te3-based thermoelectric unit

[0130] The difference between Comparative Example 4 and Example 1 is that in Comparative Example 4, the thermoelectric module uses a modified Bi2Te3-based thermoelectric unit;

[0131] Test items:

[0132] Test item 1. Heat dissipation performance test

[0133] Test method:

[0134] 1. Install the heat dissipation module of the present invention in a laptop computer to replace the original heat dissipation system.

[0135] 2. Run the laptop computer in an environment of 25 °C room temperature to make the CPU / GPU run at full load.

[0136] 3. Use a temperature sensor to record the temperature of the CPU / GPU, the surface temperature T_surface, and the temperature difference ΔT between the heat pipe and the heat sink fins.

[0137] 4. Record the rotation speed and current of the fan.

[0138] 5. Continuously run for 30 minutes and record data every 5 minutes.

[0139] Table 1 Test results of heat dissipation performance

[0140]

[0141] As can be seen from Table 1 above, the fan energy consumption is reduced by 75%, the CPU temperature is reduced by 7°C, and the surface temperature is reduced by 5°C. The possible reasons are as follows: Comparative Example 1 (traditional heat dissipation module): Low heat dissipation efficiency: Only relying on heat pipes and fans for passive heat dissipation, without waste heat recovery function, the fan is completely powered by the battery (power consumption 1200 mW), and the heat dissipation ability is limited by the fixed rotation speed strategy; High surface temperature: Without TEG module, the heat dissipation path is single, and heat accumulation causes the shell temperature to rise; Comparative Example 2 (TEG-powered but without closed-loop control): Insufficient dynamic response: Although the TEG module recovers some waste heat (power consumption reduced to 600 mW), due to the lack of closed-loop control, the fan speed cannot be adjusted in real time according to ΔT and surface temperature; Large ΔT fluctuation: When the heat load suddenly increases, the fan cannot accelerate in time, resulting in a short-term overlimit of ΔT (>50°C), and part of the heat remains in the heat pipe, and the CPU temperature is only reduced by 4°C compared with Comparative Example 1; Limited surface temperature optimization: The fan only relies on TEG power supply, and the rotation speed is too low at low load (ΔT < 30°C), the heat dissipation ability is insufficient, and the shell temperature is still high (46°C); Comparative Example 3 (single-target temperature control): Sacrificing ΔT optimization: Only taking the surface temperature T_surface ≤ 45°C as the control target, ignoring the influence of ΔT on the TEG efficiency; Insufficient ΔT under high load: When T_surface approaches the threshold, the fan runs at full speed (700 mW), resulting in ΔT being quickly reduced to below 20°C, and the TEG output power drops sharply (<100 mW), and the heat dissipation ability is limited (CPU temperature 86°C); Example 1 (dual-target optimization control): Dynamic balance strategy: Through the fuzzy PID algorithm, simultaneously optimize ΔT (30 - 50°C) and T_surface (≤ 45°C); Under high load: When ΔT = 55°C, give priority to increasing the fan speed to 80% duty cycle, quickly reduce ΔT to the efficient interval (50°C), and at the same time avoid surface overheating (43°C); Under low load: When ΔT = 25°C, reduce the fan speed to 30% duty cycle, gradually increase ΔT to above 30°C, and maintain efficient TEG power generation; Maximize waste heat utilization: The TEG power supply accounts for 60 - 80%, the fan power consumption is only 300 mW, and the heat dissipation efficiency is significantly improved (CPU temperature 85°C).

[0142] Test Item 2. Energy Efficiency Recovery Test

[0143] Test method: Install the heat dissipation module of the present invention in a notebook computer to replace the original heat dissipation system; Under the environment of room temperature 25°C, run the notebook computer to make the CPU / GPU run at full load; Use a power meter to record the total power consumption of the notebook computer; Continuously run for 1 hour, and record data every 5 minutes.

[0144] Steady-state operation with ΔT = 50°C;

[0145] Table 2 Energy Efficiency Recovery Test Results

[0146]

[0147] As can be seen from Table 2 above, the reasons for the differences between Example 1 and Comparative Example 2 may be as follows: Comparative Example 2 (without closed-loop control): TEG operating point deviation: Under the fixed rotational speed strategy, ΔT cannot be stabilized at 50°C; actual ΔT fluctuation: When the TEG output power is temporarily excessive, the fan cannot accelerate energy consumption, resulting in ΔT dropping to 40°C and the TEG power dropping to 300 mW.

[0148] Power supply and demand imbalance: The instantaneous power gap requires the supercapacitor to supply 150 mW of energy, and the total power consumption reaches 600 mW; Example 1 (closed-loop control): ΔT locking technology: By adjusting the fan rotational speed in real time, ΔT is strictly controlled within 50±2°C, enabling the TEG to always be in the peak efficiency range (output power 450 mW); Power matching optimization: The fuzzy PID algorithm dynamically matches the fan power consumption and the TEG output power, eliminating the need for supercapacitor energy supply, and the total power consumption is only 450 mW.

[0149] Test item 3. Battery life improvement and noise verification

[0150] Video playback scenario

[0151] Test conditions: 1) Notebook computer model: Dell XPS15, battery capacity 86 Wh; 2) Test load: 4K video playback (screen brightness 150 nit, volume 50%).

[0152] Noise test conditions: Install the heat dissipation module of the present invention in the notebook computer to replace the original heat dissipation system; in an environment with a room temperature of 25°C, run the notebook computer to fully load the CPU / GPU; use a noise meter to measure the noise level of the notebook computer, run continuously for 1 hour, and record data every 5 minutes.

[0153] Table 3 Battery life improvement and noise verification

[0154]

[0155] As can be seen from Table 3 above, the overall battery life is improved by 10.3%. The possible reasons are as follows: Comparative Example 1 (traditional heat dissipation): High fan power consumption: The fan completely relies on battery power supply (power consumption accounts for 12%), resulting in increased overall energy consumption of the machine; Heat accumulation effect: After long-term operation, the heat dissipation efficiency decreases, and the CPU downclocking frequency increases, indirectly increasing the computing power consumption; Example 1 (TEG collaboration): Waste heat recovery offsets power consumption: In the video playback scenario, the CPU load is relatively low (ΔT≈35°C), the output power of the TEG is about 250 mW, covering 80% of the fan power consumption (200 mW), and the battery burden is only 5%; System-level energy efficiency optimization: Surface temperature control: T_surface is stabilized below 43°C, reducing the passive heat dissipation demand of the fuselage (such as heat conduction of the metal shell); Dynamic frequency adjustment: The CPU can maintain a higher turbo frequency in a low-temperature environment, shortening the task processing time and further reducing energy consumption.

[0156] Analysis of the possibility of noise reduction: 1. Energy recovery and utilization: The waste heat is converted into electrical energy through a thermoelectric module (TEG), and this part of the electrical energy is used to drive the fan. This means that the fan no longer completely relies on battery power supply, thereby reducing the power consumption and operating intensity of the fan, and further reducing the noise; 2. Dynamic speed control: A closed-loop control algorithm is used to dynamically adjust the fan speed, so that the TEG always operates in the high-efficiency temperature difference range. This intelligent speed control strategy can adjust the fan speed according to the actual heat dissipation requirements, avoiding the situation where the fan always runs at high speed under the traditional fixed speed strategy, thereby reducing the generation of noise; 3. Efficient heat dissipation design: The "heat pipe - TEG - fin" sandwich structure design improves the heat dissipation efficiency and reduces heat accumulation. Efficient heat dissipation means that the fan does not need to run at high speed for a long time to maintain the heat dissipation effect, thereby reducing the noise.

[0157] Generally speaking: 1. Heat dissipation performance difference: In Example 1, through dual-target optimization control, the dynamic balance of ΔT and surface temperature is achieved, while in the comparative case, due to the single or missing control strategy, it is impossible to balance heat dissipation efficiency and energy consumption; 2. Energy efficiency recovery difference: The closed-loop control enables the TEG to work stably in the high-efficiency range, and the power utilization rate is increased by 30%, reducing the dependence on external energy supplementation; 3. Battery life difference: Waste heat recovery directly reduces the consumption of the fan on the battery. Combined with the system-level optimization in a low-temperature environment, the overall energy efficiency of the machine is significantly improved.

[0158] Test item 4. TEG conversion efficiency test

[0159] Table 4 TEG conversion efficiency test results

[0160] Conversion efficiency / % Example 1 6.2 Comparative Example 4 8.5

[0161] Comparing the measurement results in Table 4 above, it can be seen that the modified Bi2Te3-based TEG module material significantly improves the TEG conversion efficiency in the novel adaptive heat dissipation module based on thermoelectric conversion according to the present invention. This may be due to the following: 1. The significant improvement in the Seebeck coefficient (α): 1) Quantum confinement enhances carrier energy filtering: The nanoscale size of GeTe quantum dots (5-8nm) causes quantum confinement, resulting in energy band splitting into discrete energy levels. High-energy carriers preferentially tunnel through the quantum dot interface barrier, while low-energy carriers are reflected, thereby increasing the effective Seebeck coefficient; the interface band matching of the core-shell structure (GeTe@Sb2Te3) optimizes carrier transport, and the Sb2Te3 shell (2nm thick) serves as a highly conductive interface, reducing the contact resistance between the quantum dots and the matrix, retaining the advantages of the quantum confinement effect while reducing conductivity loss; 2. Coordinated optimization of conductivity (σ): balance between carrier concentration and mobility: hot end high-doping region: The Bi2Te3 matrix increases the carrier concentration through gradient doping to compensate for the mobility drop caused by the quantum dots, and the core-shell interface conductive channel: the high conductivity characteristics of the Sb2Te3 shell (σ = 1200S / cm) form a localized conductive network around the quantum dots , reducing carrier scattering losses; 3. Comprehensive improvement of ZT value; 4. System-level energy efficiency gain mechanism: 1) Thermal-electrical-heat dissipation collaborative design: "heat pipe-TEG-fin" sandwich structure: utilize the inherent temperature difference of the heat dissipation path (ΔT=30-50℃) to maximize the TEG working range, avoiding the temperature difference waste in traditional design; dual-constraint control strategy: by dynamically adjusting the fan speed, maintaining ΔT in the high-efficiency range (30-50℃), and controlling the surface temperature ≤T_max, so that the TEG output power is accurately matched with the heat dissipation requirements; 2) Energy recovery closed loop: waste heat is used to generate electricity to drive the fan, reducing battery consumption (60-80% of the fan power consumption is supplied by TEG), while reducing the heat load of the heat dissipation system, forming a "power generation-heat dissipation-regeneration" positive feedback.

[0162] This invention solves the contradiction of "high power consumption and low efficiency" in traditional heat dissipation systems through the deep integration of thermoelectric conversion and intelligent control, and provides an innovative paradigm for thermal management of electronic equipment.

[0163] Finally, it should be noted that the above embodiments are used to illustrate the technical solutions of the present invention rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.

[0164] The above embodiments may be implemented in whole or in part through software, hardware, firmware or any other combination. When implemented using software, the above embodiments may be implemented in whole or in part in the form of a computer program product.

[0165] Those of ordinary skill in the art can realize that the modules and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of this application.

[0166] In addition, each functional module in various embodiments of this application can be integrated into one processing module, can exist separately as individual physical modules, or two or more modules can be integrated into one module.

[0167] Finally: The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A thermoelectric adaptive heat dissipation module, characterized in that: It mainly consists of a heat pipe, a thermoelectric module, heat dissipation fins, a fan, and a control module. By embedding a thermoelectric conversion module between the heat pipe and the heat dissipation fins, waste heat is converted into electrical energy to drive the fan, and the fan speed is dynamically adjusted through a closed-loop control algorithm, enabling the thermoelectric conversion module to always operate in the high-efficiency temperature difference range while ensuring that the surface temperature of the device meets the standard.

2. The thermoelectric self - adaptive heat dissipation module according to claim 1, wherein: It includes a heat pipe, a thermoelectric module, and heat dissipation fins connected in sequence. The output ends of all thermoelectric modules are connected to the fan, and a control module is provided to adjust the fan speed in real time to maintain the thermoelectric module operating in a preset temperature difference range.

3. The thermoelectric self-adaptive heat dissipation module according to claim 1, wherein: The heat pipe is used to conduct the heat of the heating element of the electronic device; the thermoelectric module is composed of multiple thermoelectric units connected in series or in parallel. Its hot end is in contact with the heat pipe, and its cold end is connected to the heat dissipation fins; the heat dissipation fins are closely attached to the cold end of the thermoelectric module; the fan is connected to the output end of the thermoelectric module through a wire and is driven by the electrical energy generated by thermoelectric conversion; the control module integrates a temperature sensor, a voltage detection circuit, and a PWM speed regulator, and is used to dynamically adjust the fan speed to maintain the preset temperature difference range of the thermoelectric module and control the surface temperature of the device not to exceed the threshold value.

4. The thermoelectric self - adaptive heat dissipation module according to claim 1, characterized in that: The heat pipe is connected to the hot end of the CPU / GPU and the TEG; the thermoelectric module is composed of multiple groups of modified Bi2Te3-based thermocouples connected in series / parallel. The hot end is attached to the heat pipe, and the cold end is connected to the heat dissipation fins; the heat dissipation fins adopt copper-aluminum composite fins, and the surface is coated with a graphene-enhanced heat dissipation coating and is in close contact with the cold end of the TEG; the fan is connected to the output end of the TEC through a wire and is driven by the recycled electricity; the control module includes an integrated temperature sensor, a voltage detection circuit, and a PWM speed regulator.

5. The thermoelectric self - adaptive heat dissipation module according to claim 1, characterized in that: The preparation steps of the modified Bi2Te3-based modified thermoelectric unit are as follows: S1. Wrap GeTe quantum dots with a particle size of 4 - 6 nm in a 2 - 3 nm thick Sb2Te3 shell layer to form a core-shell structure; S2. Embed the GeTe quantum dots wrapped in the Sb2Te3 shell layer and SnSe nanosheets in the Bi2Te3-based gradient doping module, with a thickness < 10 nm.

6. The thermoelectric self - adaptive heat dissipation module according to claim 1, wherein: The control module further includes a boost voltage regulator circuit and a super capacitor. The input end of the boost voltage regulator circuit is connected to the output end of the thermoelectric module, and the output end is connected to the fan and the super capacitor, and is used to convert the unstable low-voltage direct current output by the thermoelectric module into a stable voltage.

7. The thermoelectric self - adapting heat dissipation module according to claim 1, wherein, The algorithm logic of the control module is as follows: a. Real-time monitor the temperature difference ΔT between the heat pipe and the heat dissipation fins, and the temperature T_surface of the device housing; b. When ΔT > 50 °C, increase the fan speed to reduce ΔT; c. When ΔT < 30 °C, decrease the fan speed to increase ΔT; d. The preset threshold value is T_max. If T_surfac ≥ T_max, give priority to increasing the fan speed until T_surfac drops below the threshold value T_max.

8. The thermoelectric self - adaptive heat dissipation module according to claim 1, characterized in that: The control algorithm uses a fuzzy PID controller, with the input variables being ΔT and T_surfac, and the output variable being the PWM duty cycle of the fan.

9. The control method of an adaptive new heat dissipation module based on thermoelectric conversion according to claim 1, characterized in that, It includes the following steps: S1. Establish a mapping relationship database between the output power of the thermoelectric module and the temperature difference ΔT; S2. Real-time collect the temperature difference ΔT between the heat pipe and the heat dissipation fins, and the temperature T_surfac of the device housing; S3. Dynamically adjust the fan speed through a dual-objective optimization algorithm so that ΔT is maintained within 30 - 50 °C while T_surfac ≤ T_max; S4. When the output power of the thermoelectric module is insufficient, it is supplemented by the supercapacitor.

10. A control method for an adaptive new heat dissipation module based on thermoelectric conversion according to claim 9, characterized in that: In the step S3, it is preferred to ensure T_surfac ≤ T_max first, and then optimize ΔT to the efficient range.

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