Water quantity control method for vapor chamber in vacuum environment and vapor chamber

Abstract

The invention relates to the technical field of vapor chamber processes, in particular to a vapor chamber vacuum environment water quantity control method and a vapor chamber. The water quantity control method for the vapor chamber in the vacuum environment comprises the steps that S1, after the vapor chamber with a reserved opening is subjected to ultrasonic cleaning treatment, a preset quantity of cooling medium is injected through the reserved opening; wherein the cooling medium is deionized water or an ethylene glycol solution; s2, carrying out pre-freezing treatment on the uniform-temperature plate treated in the step S1; s3, the vapor chamber treated in the step S2 is subjected to vacuumizing treatment; and S4, performing sealing treatment on the uniform-temperature plate treated in the step S3. According to the invention, pre-freezing, vacuumizing and sealing treatment are carried out on the vapor chamber after liquid injection, so that a cooling medium is changed into a solid medium, and moisture loss caused by a boiling state in the vacuumizing process is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of heat pipe processes, and more specifically, to a method for controlling the water volume of a heat pipe in a vacuum environment and a heat pipe. Background Art

[0002] During the heat dissipation process of a heat pipe, when the heat of an external heat source (such as a CPU / GPU) is transferred to the evaporation area of the heat pipe, the working medium (usually water) in the capillary wick near the heat source quickly absorbs heat. The working medium is vaporized by heat in a vacuum and low-pressure environment, changing from a liquid state to a gaseous vapor. This phase change process absorbs a large amount of latent heat, effectively reducing the temperature of the heat source.

[0003] However, in an ultra-low pressure situation, the water molecules of liquid water in the heat pipe are very likely to violently escape, causing a boiling phenomenon and absorbing a large amount of heat, resulting in the remaining liquid water quickly freezing. In this process, due to the extremely low environmental pressure, the intermolecular forces between water molecules are weakened, making it easier for water molecules to change from a liquid state to a gaseous state, thus triggering a violent boiling phenomenon. This boiling not only quickly absorbs the heat of the surrounding environment but also causes the temperature of the remaining liquid water to drop rapidly, eventually forming ice crystals. Since the heat transfer speed in this process is extremely fast, it is difficult to accurately control the amount of water evaporation by conventional means, increasing the operation difficulty and uncertainty. Summary of the Invention

[0004] In view of this, the present invention proposes a method for controlling the water volume of a heat pipe in a vacuum environment and a heat pipe, aiming to solve the problems existing in the current technology.

[0005] On the one hand, the present invention proposes a method for controlling the water volume of a heat pipe in a vacuum environment, which specifically includes the following steps: S1. After ultrasonic cleaning the heat pipe with a reserved opening, inject a preset amount of cooling medium through the reserved opening; Wherein, the cooling medium is deionized water or ethylene glycol solution; S2. Perform pre-freezing treatment on the heat pipe processed in step S1, and the cooling medium forms a solid medium after pre-freezing treatment; S3. Perform vacuum pumping treatment on the heat pipe processed in step S2; S4. Seal the reserved opening of the heat pipe processed in step S3.

[0006] In some embodiments of the present application, when the cooling medium injected in step S1 is deionized water, the freezing temperature range of the pre-freezing treatment in step S2 is -5°C to -10°C.

[0007] In some embodiments of the present application, when the cooling medium injected in step S1 is an ethylene glycol solution, the freezing temperature range of the pre-freezing treatment in step S2 is -10°C to -20°C.

[0008] In some embodiments of the present application, the sealing material during the sealing treatment in step S4 is solder or glue.

[0009] In some embodiments of the present application, the sealing material during the sealing treatment in step S4 is a tin-zinc solder, the welding temperature is 210°C to 230°C, and the welding time is 5s to 20s.

[0010] In some embodiments of the present application, the sealing material during the sealing treatment in step S4 is anaerobic glue, and the reserved opening of the heat pipe is sealed by curing the anaerobic glue. Among them, the relative humidity of the environment during curing is 40% to 60%, and the curing temperature is 20°C to 25°C.

[0011] In some embodiments of the present application, the conductivity of the deionized water is less than .

[0012] In some embodiments of the present application, the cleaning time of the ultrasonic cleaning treatment in step S1 is 10 min to 30 min, and after cleaning, it is dried at a drying temperature of 80°C to 120°C for 1 h to 2 h.

[0013] In some embodiments of the present application, the air extraction rate during the vacuum pumping treatment in step S3 is 1 to 10 L / s, and the vacuum degree of the heat pipe after the vacuum pumping treatment is less than 10 Pa.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: In the present invention, through step S1, the heat pipe is ultrasonically cleaned to ensure that the surface of the heat pipe is clean and does not affect the effect of subsequent processes; through step S2, the heat pipe is pre-frozen to form an ice structure of the cooling medium, ensuring the stability of the cooling medium, preventing water evaporation loss, and improving the heat conduction efficiency of the heat pipe; through step S3, the heat pipe is vacuum pumped to extract the air inside the heat pipe to form a vacuum environment, effectively reducing the thermal resistance during the heat conduction process, enhancing the heat dissipation ability of the heat pipe, and at the same time preventing external gas from entering and maintaining the stability of the internal environment, further optimizing the heat conduction path and reducing heat loss; through step S4, the heat pipe is sealed to obtain a finished heat pipe product, ensuring that the internal vacuum state is not damaged and maintaining high-efficiency heat conduction performance.

[0015] On the other hand, the present invention provides a heat pipe, which adopts the method for controlling the water amount in a vacuum environment of the heat pipe, and includes: a first cover plate and a second cover plate, which are hermetically sealed with each other and a reserved opening is provided therebetween, and the reserved opening is used for injecting a cooling medium and performing vacuum pumping treatment; a capillary structure layer is provided on the first cover plate, and a plurality of accommodating grooves are provided on the second cover plate, and the top end surfaces of the groove walls of the plurality of accommodating grooves fix the capillary structure layer on the opposite side surfaces of the first cover plate and the second cover plate, and the accommodating grooves are used for accommodating the solid medium obtained after the pre-freezing treatment of the cooling medium.

[0016] It can be understood that the heat pipe provided in this embodiment has the same beneficial effects as the method for controlling the water amount in a vacuum environment of the above-mentioned heat pipe, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present invention. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings: Figure 1 is a flowchart of a method for controlling the water amount in a vacuum environment of a heat pipe provided by an embodiment of the present invention; Figure 2 is a schematic structural diagram of a heat pipe provided by an embodiment of the present invention.

[0018] In the figure: 1, the first cover plate; 2, the second cover plate; 21, the accommodating groove; 3, the capillary structure layer; 4, the solid medium. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] Hereinafter, exemplary embodiments of the present disclosure will be described in more detail with reference to the drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be fully conveyed to those skilled in the art. It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other. Hereinafter, the present invention will be described in detail with reference to the drawings and in conjunction with the embodiments.

[0020] Refer to Figure 1 , this embodiment provides a method for controlling the water amount in a vacuum environment of a heat pipe, which specifically includes the following steps: S1. After performing ultrasonic cleaning treatment on the heat pipe with the reserved opening, inject a preset amount of cooling medium through the reserved opening; Among them, the cooling medium is deionized water or ethylene glycol solution; S2. Perform pre-freezing treatment on the heat pipe after the treatment of step S1, and the cooling medium forms a solid medium after pre-freezing treatment; S3. Perform vacuum pumping treatment on the heat pipe after the treatment of step S2; S4. Seal the reserved opening of the heat pipe after the treatment of step S3.

[0021] It can be understood that in this embodiment, through steps S1 to S4, the heat pipe is pre-frozen, vacuum-pumped, and sealed after liquid injection, so that the cooling medium becomes a solid medium, and water loss caused by the boiling state during the vacuum pumping process is avoided.

[0022] In step S1, first perform ultrasonic cleaning treatment on the heat pipe with a reserved opening to ensure the cleanliness of the heat pipe surface and microscopic gaps, thereby improving the effect of subsequent processes. After cleaning, inject a preset amount of cooling medium through the reserved opening. The cooling medium can be deionized water or ethylene glycol solution. The cooling medium has good thermal conductivity and a low boiling point, and is suitable for use in low-temperature environments. In step S2, perform pre-freezing treatment on the heat pipe injected with the cooling medium. The pre-freezing treatment forms an ice structure of the cooling medium, preventing the medium from evaporating due to temperature rise during the subsequent vacuum pumping process, thereby maintaining the water volume stability. In step S3, perform vacuum pumping treatment on the pre-frozen heat pipe to reduce the air content in the heat pipe, lower the thermal resistance during the heat transfer process, and improve the heat transfer efficiency. At the same time, since the cooling medium has been frozen, water loss caused by the boiling state during the vacuum pumping process is avoided. Finally, in step S4, perform sealing treatment on the vacuum-pumped heat pipe to ensure that the inside of the heat pipe is in a vacuum state, further ensuring that the cooling medium will not undergo a phase change due to changes in the external environment and maintaining its solid state characteristics. This embodiment ensures a stable amount of cooling medium in the heat pipe under a vacuum environment through a series of treatment steps, improving the heat transfer performance and service life of the heat pipe.

[0023] In a specific embodiment of the present application, the cleaning time of the ultrasonic cleaning treatment in step S1 is 10 min to 30 min, and after cleaning, it is dried at a drying temperature of 80 °C to 120 °C for 1 h to 2 h.

[0024] Specifically, the cooling medium injected in step S1 of this embodiment is specifically selected according to the usage requirements and working environment of the heat pipe, and no specific limitation is made in this embodiment.

[0025] Specifically, in this embodiment, a high-precision injection pump or measuring cylinder is preferably used for liquid injection operation to accurately control the injection amount of the cooling medium, and the error range between the injection amount and the preset amount is ±5%.

[0026] It is understandable that when the heat pipe is ultrasonically cleaned in step S1 of this embodiment, organic solvents are first used for cleaning to remove oil stains, impurities, oxides, etc. on the surface of the heat pipe, and then the heat pipe is cleaned by an ultrasonic cleaning device to ensure that the microscopic gaps and the surface of the heat pipe are both cleaned. After the cleaning is completed, the heat pipe is placed in a drying oven for drying to prevent the residual solvent from affecting the effect of subsequent processes.

[0027] In a specific embodiment of the present application, when the cooling medium injected in step S1 is deionized water, the freezing temperature range of the pre-freezing treatment in step S2 is -5°C to -10°C.

[0028] In a specific embodiment of the present application, the conductivity of the deionized water is less than .

[0029] It is understandable that in this embodiment, water is used as the cooling medium, and at the same time, deionization treatment is carried out through a deionization device to obtain deionized water, so as to avoid the adverse effects of impurities in the water during the subsequent pre-freezing process.

[0030] In a specific embodiment of the present application, when the cooling medium injected in step S1 is an ethylene glycol solution, the freezing temperature range of the pre-freezing treatment in step S2 is -10°C to -20°C.

[0031] Specifically, when the cooling medium injected in step S1 is an ethylene glycol solution, the concentration of the ethylene glycol solution can be selected according to specific circumstances, and this embodiment does not make specific limitations on this.

[0032] Specifically, the pre-freezing equipment during the pre-freezing treatment in step S2 of this embodiment can be one or several of a low-temperature refrigerator, a freezer, and a dedicated refrigeration device.

[0033] Specifically, the freezing time during the pre-freezing treatment in step S2 of this embodiment is specifically determined according to the injection amount of the cooling medium, ensuring that the cooling medium can be completely frozen.

[0034] It is understandable that during the pre-freezing treatment in step S2 of this embodiment, a temperature sensor is used to monitor the temperature of the cooling medium inside the heat pipe in real time. Among them, the temperature sensor can be for contact measurement or buried inside the heat pipe for measurement, and the measured temperature data is transmitted to the control system. The accuracy of the temperature sensor is ±0.1°C. The control system compares the set freezing temperature range with the actual temperature value, and automatically adjusts the power of the pre-freezing equipment to ensure that the temperature of the cooling medium is stable within the set freezing temperature range and can be evenly frozen, avoiding the occurrence of local supercooling or incomplete freezing.

[0035] In a specific embodiment of the present application, the air extraction rate during the vacuum pumping process in step S3 is 1 to 10 L / s, and the vacuum degree of the heat pipe after the vacuum pumping process is less than 10 Pa.

[0036] In a specific embodiment of the present application, the vacuum degree of the heat pipe after the vacuum pumping process in step S3 is less than 5 Pa.

[0037] It can be understood that during the vacuum pumping process in step S3 of this embodiment, the heat pipe is connected to the vacuum pumping device to ensure good sealing at the connection part. Specifically, a sealing rubber ring, sealing tape or sealing joint can be selected to ensure the sealing of the vacuum system.

[0038] Specifically, in this embodiment, through the vacuum pumping process, the air and other volatile gases inside the heat pipe are discharged as much as possible, and at the same time, the air extraction rate is limited to avoid excessive disturbance of the cooling medium inside the heat pipe due to too fast air extraction rate. During the vacuum pumping process, the vacuum degree is monitored in real time through a vacuum gauge. After the vacuum degree is less than the set range, it is maintained for a period of time to ensure that the internal gas is fully extracted.

[0039] In a specific embodiment of the present application, the sealing material during the sealing process in step S4 is solder or glue.

[0040] It can be understood that the sealing material in this embodiment can be selected according to the structure and usage requirements of the heat pipe, and no specific limitation is made in this embodiment.

[0041] Specifically, when solder is selected as the sealing material, after the vacuum pumping process is completed, the sealing operation is carried out quickly. The solder is heated above the melting point to make the solder melt and fill the reserved opening position, and the solder is solidified by cooling. During the welding process, the welding temperature and time are selected according to the specific situation to avoid overheating causing the melting of the internal cooling medium of the heat pipe or the deformation of the heat pipe.

[0042] Specifically, when glue is selected as the sealing material, the glue is evenly applied to the reserved opening position, and then pressure is applied to make the glue fill the reserved opening and discharge the air. During the curing process of the glue, the curing temperature and humidity are selected according to the specific situation to ensure firm sealing and good airtightness.

[0043] In some embodiments of the present application, the sealing material during the sealing process in step S4 is tin-zinc solder, the welding temperature is 210°C to 230°C, and the welding time is 5 s to 20 s.

[0044] In a specific embodiment of the present application, the sealing material during the sealing treatment in step S4 is anaerobic glue, and the reserved opening of the heat pipe is sealed and cured with the anaerobic glue. Among them, the relative humidity of the environment during curing is 40% - 60%, and the curing temperature is 20°C - 25°C.

[0045] Example 1

[0046] (1)Preparation before liquid injection First, use an organic solvent for cleaning to remove oil stains, impurities, oxides, etc. on the surface of the heat pipe, and then perform ultrasonic cleaning on the heat pipe through an ultrasonic cleaning device for 10 - 30 minutes. After the ultrasonic cleaning is completed, place the heat pipe in a drying oven and dry it at 80 - 120°C for 1 - 2 hours. After drying, inject deionized treated water into the heat pipe through the reserved opening. The conductivity of the deionized treated water is less than .

[0047] (2)Pre-freezing treatment Freeze the heat pipe injected with deionized treated water through a refrigeration device for 1 - 2 hours to form a solid structure of the deionized treated water, and use a temperature sensor to monitor the temperature of the heat pipe in real time, so that the temperature of the heat pipe is between -5°C and -10°C.

[0048] (3)Vacuum pumping treatment Connect the pre-frozen heat pipe to a vacuum pump. Before starting the vacuum pump, check the oil level of the vacuum pump and the cooling water supply to ensure that the vacuum pump can work properly. Start the vacuum pump and perform vacuum pumping treatment on the heat pipe at a pumping rate of 1 - 10 L / s, so that the vacuum degree inside the heat pipe is less than 10 Pa.

[0049] (4)Sealing treatment Seal the reserved opening position of the heat pipe after vacuum pumping treatment with tin-zinc solder. Heat the tin-zinc solder to 210°C - 230°C and weld for 5 - 20 seconds to ensure that the reserved opening is completely sealed.

[0050] Example 2

[0051] (1)Preparation before liquid injection First, use an organic solvent for cleaning to remove oil stains, impurities, oxides, etc. on the surface of the heat pipe, and then perform ultrasonic cleaning on the heat pipe through an ultrasonic cleaning device for 10 - 30 minutes. After the ultrasonic cleaning is completed, place the heat pipe in a drying oven and dry it at 80 - 120°C for 1 - 2 hours. After drying, inject ethylene glycol solution into the heat pipe through the reserved opening.

[0052] (2)Pre-freezing treatment The heat pipe is frozen for 1 - 2 hours by a refrigeration device after injecting ethylene glycol solution, so that the ethylene glycol solution forms a solid structure, and the temperature of the heat pipe is monitored in real time by a temperature sensor, so that the temperature of the heat pipe is between -10°C and -20°C.

[0053] (3)Vacuum pumping treatment Connect the pre-frozen heat pipe to a vacuum pump. Check the oil level of the vacuum pump and the cooling water supply before starting the vacuum pump to ensure that the vacuum pump can work properly. Start the vacuum pump and conduct vacuum pumping treatment on the heat pipe at a pumping rate of 1 - 10 L / s, so that the vacuum degree inside the heat pipe is less than 5 Pa.

[0054] (4)Sealing treatment Seal the reserved opening position of the heat pipe after vacuum pumping treatment with anaerobic glue. Apply the anaerobic glue evenly on the reserved opening position, apply pressure to make the glue fill the reserved opening position and expel air, and cure it at a curing humidity of 40% - 60% and a curing temperature of 20°C - 25°C to ensure that the reserved opening is firmly sealed.

[0055] On the other hand, referring to Figure 2 , the present invention provides a heat pipe, which adopts the method for controlling the water volume in the vacuum environment of the above-mentioned heat pipe, including: a first cover plate 1 and a second cover plate 2, which are mutually sealed and have a reserved opening between them. The reserved opening is used for injecting a cooling medium and conducting vacuum pumping treatment; a capillary structure layer 3 is arranged on the first cover plate 1, and a plurality of accommodating grooves 21 are arranged on the second cover plate. The groove walls of the plurality of accommodating grooves 21 fix the capillary structure layer 3 on the opposite side surface of the first cover plate 1 and the second cover plate 2, and the accommodating grooves 21 are used for accommodating the solid medium 4 obtained after pre-freezing treatment of the cooling medium.

[0056] It can be understood that the heat pipe proposed in this embodiment has the same beneficial effects as the above-mentioned method for controlling the water volume in the vacuum environment of the heat pipe, and will not be elaborated here.

[0057] Those skilled in the art should understand that the embodiments of the present application can be provided as methods, systems or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0058] This application is described with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems) and computer program products according to embodiments of the present application. It should be understood that each flow and / or block in the flowchart and / or block diagram can be implemented by computer program instructions, and the combination of flows and / or blocks in the flowchart and / or block diagram can also be implemented. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing devices to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices generate means for implementing the functions specified in the flow Figure 1 one flow or multiple flows and / or blocks Figure 1 or means for implementing the functions specified in multiple blocks.

[0059] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory generate a manufactured product including instruction means, and the instruction means implement the functions specified in the flow Figure 1 one flow or multiple flows and / or blocks Figure 1 or means for implementing the functions specified in multiple blocks.

[0060] These computer program instructions can also be loaded onto a computer or other programmable data processing device, so that a series of operation steps are executed on the computer or other programmable device to generate a computer-implemented process, and thus the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in the flow Figure 1 one flow or multiple flows and / or blocks Figure 1 or means for implementing the functions specified in multiple blocks.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: modifications or equivalent replacements can still be made to the specific embodiments of the present invention, and any modification or equivalent replacement that does not depart from the spirit and scope of the present invention should be covered by the protection scope of the claims of the present invention.

Claims

1. A method for controlling the water volume in a heat pipe under a vacuum environment, characterized in that, Specifically, it includes the following steps: S1. After ultrasonic cleaning the heat pipe with a reserved opening, inject a preset amount of cooling medium through the reserved opening; Wherein, the cooling medium is deionized water or ethylene glycol solution; S2. Perform pre-freezing treatment on the heat pipe processed in step S1, and the cooling medium forms a solid medium after pre-freezing treatment; S3. Perform vacuum pumping treatment on the heat pipe processed in step S2; S4. Seal the reserved opening of the heat pipe processed in step S3.

2. The water volume control method of a heat pipe under a vacuum environment according to claim 1, characterized in that When the cooling medium injected in step S1 is deionized water, the freezing temperature range of the pre-freezing treatment in step S2 is -5°C to -10°C.

3. The water volume control method of a heat pipe under a vacuum environment according to claim 1, characterized in that When the cooling medium injected in step S1 is ethylene glycol solution, the freezing temperature range of the pre-freezing treatment in step S2 is -10°C to -20°C.

4. A method for controlling the water volume of a heat pipe under a vacuum environment according to claim 1, characterized in that The sealing material during the sealing treatment in step S4 is solder or glue.

5. A method for controlling the water volume of a heat pipe in a vacuum environment according to claim 1, characterized in that, The sealing material during the sealing treatment in step S4 is tin-zinc solder, the welding temperature is 210°C to 230°C, and the welding time is 5s to 20s.

6. The water volume control method of a heat pipe under a vacuum environment according to claim 1, characterized in that, The sealing material during the sealing treatment in step S4 is anaerobic glue, and the reserved opening of the heat pipe is sealed by curing the anaerobic glue. Among them, the relative humidity of the environment during curing is 40% to 60%, and the curing temperature is 20°C to 25°C.

7. A method for controlling the water volume of a heat pipe under a vacuum environment according to claim 1, characterized in that The conductivity of the deionized treated water is less than .

8. A method for controlling the water volume of a heat pipe under a vacuum environment according to claim 1, characterized in that, The cleaning time of the ultrasonic cleaning treatment in step S1 is 10min to 30min, and after cleaning, it is dried at a drying temperature of 80°C to 120°C for 1h to 2h.

9. A method for controlling the water volume of a heat pipe in a vacuum environment according to claim 1, characterized in that The air extraction rate during the vacuum pumping treatment in step S3 is 1 to 10L / s, and the vacuum degree of the heat pipe after the vacuum pumping treatment is less than 10Pa.

10. A heat pipe, characterized in that, Adopt a method for controlling the water volume of a heat pipe in a vacuum environment as described in any one of claims 1-9, including: a first cover plate (1) and a second cover plate (2), the first cover plate (1) and the second cover plate (2) are mutually sealed and have a reserved opening, and the reserved opening is used for injecting a cooling medium and performing vacuum pumping treatment; a capillary structure layer (3) is provided on the first cover plate (1), and a plurality of accommodating grooves (21) are provided on the second cover plate (2), and the groove walls of the plurality of accommodating grooves (21) fix the capillary structure layer (3) on the opposite side surface of the first cover plate (1) and the second cover plate (2), and the accommodating groove (21) is used for accommodating the solid medium (4) obtained after pre-freezing treatment of the cooling medium.

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