Display assembly, manufacturing method thereof and electronic equipment

Abstract

The invention provides a display assembly, a manufacturing method thereof and electronic equipment. The display assembly is applied to the electronic equipment. The display assembly comprises a plurality of light-emitting units, and each light-emitting unit comprises a circuit substrate which comprises a mounting surface; the light-emitting chip is arranged on the mounting surface and is electrically connected with the circuit substrate; and the packaging colloid is arranged on the mounting surface, the packaging colloid is arranged around the light-emitting chip and covers the light-emitting chip, and the light-emitting chip is packaged on the circuit substrate. Therefore, according to the display assembly, flexible and personalized customization design of the arrangement form of the light-emitting chips can be achieved, the light-emitting chips are installed and fixed to the circuit substrate, the installation reliability of the light-emitting chips can be improved, and the risks of loosening, falling off and the like are avoided.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and in particular, to a display component, a manufacturing method of a display component, and an electronic device having the display component. Background Art

[0002] With the continuous progress of technology and the development of society, electronic devices such as smart phones and tablet computers have become increasingly popular and have become indispensable products in people's daily life and work. At present, the electronic devices on the market mainly achieve the function of a dot matrix screen by arranging a light strip formed by a plurality of light-emitting chips on their backs. However, the dot matrix screens in related technologies cannot achieve flexible and customized design, and moreover, the installation reliability of the light-emitting chips in the dot matrix screen is poor, and there are risks such as loosening and falling off. Summary of the Invention

[0003] In view of the above deficiencies in related technologies, the purpose of the present application is to provide a display component, a manufacturing method of a display component, and an electronic device having the display component, which can achieve flexible and personalized customized design of the arrangement form of light-emitting chips. By mounting and fixing the light-emitting chips to a circuit board, the installation reliability of the light-emitting chips can be increased, and risks such as loosening and falling off can be avoided.

[0004] To solve the above technical problems, an embodiment of the present application provides a display component, which is applied to an electronic device. The display component includes a plurality of light-emitting units, and each light-emitting unit includes: a circuit board, the circuit board includes a mounting surface; a light-emitting chip, the light-emitting chip is disposed on the mounting surface and electrically connected to the circuit board; a packaging colloid, the packaging colloid is disposed on the mounting surface, the packaging colloid is disposed around the light-emitting chip and covers the light-emitting chip, and the light-emitting chip is encapsulated on the circuit board.

[0005] In an exemplary embodiment, the display component further includes a circuit board, and the circuit boards of a plurality of the light-emitting units are connected to the circuit board; each circuit board corresponds to one or more of the light-emitting chips, a gap is provided between a plurality of the circuit boards, and a plurality of the light-emitting units are arranged in a matrix on the circuit board to form the display component.

[0006] In an exemplary embodiment, each packaging colloid includes a first packaging colloid and a second packaging colloid, the first packaging colloid is disposed on the circuit board and wraps the light-emitting chip, the second packaging colloid is disposed around the first packaging colloid and forms a cavity with the circuit board, and the light-emitting chip is disposed in the cavity.

[0007] In an exemplary embodiment, the second encapsulation colloid is a closed frame formed by a retaining wall, and the wall thickness of the retaining wall of the second encapsulation colloid is greater than or equal to 0.035 mm and less than or equal to 0.15 mm.

[0008] In an exemplary embodiment, when the shape of the positive projection of the second encapsulation colloid in the direction of the circuit board is a rectangular frame, the side length of the rectangle is greater than or equal to 0.55 mm, and the minimum distance between any two adjacent second encapsulation colloids is greater than or equal to 0.2 mm; or, when the shape of the positive projection of the second encapsulation colloid in the direction of the circuit board is an annular frame, the outer diameter of the annulus is greater than or equal to 0.55 mm, and the minimum distance between any two adjacent second encapsulation colloids is greater than or equal to 0.2 mm.

[0009] In an exemplary embodiment, the display assembly further includes a lamp shade that covers all the light-emitting units; or, the display assembly further includes a plurality of lamp shades, and each lamp shade covers one or more of the light-emitting units. Each lamp shade includes an effect layer located in the light-emitting direction of the light-emitting unit, and the effect layer is configured to transmit the light emitted by the light-emitting chip and form a preset display effect.

[0010] In an exemplary embodiment, the inner surface of each lamp shade has a plurality of light-transmitting regions, and each light-transmitting region corresponds to at least one of the light-emitting chips, and the light emitted by the light-emitting chips presents different light-emitting effects through different light-transmitting regions of the lamp shade.

[0011] In an exemplary embodiment, the effect layer of each lamp shade includes one or more of: a colored light-filtering film, a light-transmitting film with a preset light transmittance, a textured film, a light homogenizing film, and a light-enhancing film.

[0012] In an exemplary embodiment, the lamp shade is provided with a light-shielding portion corresponding to the second encapsulation colloid in a direction parallel to the light-emitting direction of the light-emitting unit, and the light-shielding portion abuts against the second encapsulation colloid of the light-emitting unit.

[0013] In an exemplary embodiment, the display assembly further includes a plurality of driving circuits, and the same driving circuit controls one or more of the light-emitting chips.

[0014] In an exemplary embodiment, the display assembly further includes a decorative piece that surrounds the outer edge of the lamp shade.

[0015] In an exemplary embodiment, the display assembly further includes at least one pressure-sensitive button, and the pressure-sensitive button is disposed on the back cover or the frame of the electronic device, and the pressing button is configured to control the lighting or extinguishing of the display assembly.

[0016] Based on the same inventive concept, an embodiment of the present application further provides an electronic device, which includes a middle frame, a rear cover, and a display component disposed between the middle frame and the rear cover. The display component includes a plurality of light-emitting units, and each light-emitting unit includes: a circuit board, the circuit board includes a mounting surface; a light-emitting chip, the light-emitting chip is disposed on the mounting surface and electrically connected to the circuit board; a packaging colloid, the packaging colloid is disposed on the mounting surface, the packaging colloid is disposed around the light-emitting chip and covers the light-emitting chip to encapsulate the light-emitting chip on the circuit board.

[0017] In an exemplary embodiment, the electronic device further includes a driving control unit, the driving control unit is electrically connected to the light-emitting chips of the display component, and is configured to control the display component to light up or present different display patterns according to a preset manner.

[0018] In an exemplary embodiment, the display component further includes at least one lamp shade, each lamp shade covers one or more of the light-emitting units, and the surface of the lamp shade facing away from the light-emitting unit abuts against the rear cover of the electronic device; or, the side of the lamp shade facing away from the light-emitting unit constitutes a part of the rear cover of the electronic device.

[0019] Based on the same inventive concept, an embodiment of the present application further provides a manufacturing method of a display component for manufacturing the above display module. The manufacturing method includes:

[0020] Electrically connecting a plurality of light-emitting chips to a circuit board;

[0021] Providing a packaging colloid layer on the circuit board, the packaging colloid layer wrapping and covering the light-emitting chips to the circuit board;

[0022] Cutting the packaging colloid layer to divide the packaging colloid layer into a plurality of packaging colloids, each packaging colloid covering the light-emitting chip to form a plurality of light-emitting units;

[0023] Arranging a plurality of the light-emitting units in a matrix on a circuit board, and electrically connecting the circuit boards of the plurality of light-emitting units to the circuit board.

[0024] In an exemplary embodiment, the "cutting the packaging colloid layer to divide the packaging colloid layer into a plurality of packaging colloids, each packaging colloid covering the light-emitting chip to form a plurality of light-emitting units" includes:

[0025] Cutting a plurality of grooves on the packaging colloid layer to divide the packaging colloid layer into a plurality of first packaging colloids, the first packaging colloids wrapping the light-emitting chips;

[0026] Fill the trench with a packaging colloid layer so that the packaging colloid layer surrounds the first packaging colloid;

[0027] Cut the packaging colloid layer and penetrate through to the circuit board to divide the packaging colloid layer into a plurality of second packaging colloids, and the second packaging colloids surround the first packaging colloid to form a packaging colloid covering the light-emitting chip

[0028] In summary, in the display component, manufacturing method thereof, and electronic device provided by the embodiments of the present application, the electronic device provided by the embodiments of the present application includes a middle frame, a rear cover, and the above display component, and the display component is disposed between the middle frame and the rear cover. The display component includes a plurality of light-emitting units, and each light-emitting unit includes a circuit board, a light-emitting chip, and a packaging colloid. The circuit board includes a mounting surface, the light-emitting chip is disposed on the mounting surface and electrically connected to the circuit board, the packaging colloid is disposed on the mounting surface, the packaging colloid is disposed around the light-emitting chip and covers the light-emitting chip, and the light-emitting chip is encapsulated on the circuit board. Therefore, in the display component of the present application, by arranging a plurality of the light-emitting chips independently on the circuit board as required and electrically connecting them to the circuit board, a flexible and personalized customized design of the arrangement form of the light-emitting chips can be realized. For example, a plurality of the light-emitting chips can be arranged to form different patterns according to design requirements. Moreover, the display component can increase the mounting reliability of the light-emitting chip by mounting and fixing the light-emitting chip through the circuit board, and avoid risks such as loosening and falling off. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 It is a schematic structural diagram of a display component disclosed in an embodiment of the present application.

[0031] Figure 2 It is Figure 1 A schematic structural diagram of a light-emitting unit of the display component shown.

[0032] Figure 3 It is Figure 2 A schematic diagram of relevant dimensions of the second packaging colloid shown.

[0033] Figure 4 It is a schematic cross-sectional structural diagram of the display component disclosed in an embodiment of the present application.

[0034] Figure 5 The Figure 4 schematic diagram of the exploded structure of the display component shown.

[0035] Figure 6 The Figure 5 schematic diagram of the assembled structure of the lamp shade shown.

[0036] Figure 7 The

[0037] Figure 8 The Figure 7 schematic diagram of the corresponding layer structure formed in step S100 shown.

[0038] Figure 9 The Figure 7 schematic diagram of the corresponding layer structure formed in step S200 shown.

[0039] Figure 10 The Figure 7 schematic diagram of the corresponding layer structure formed in step S300 shown.

[0040] Figure 11 The Figure 7 schematic diagram of the corresponding layer structure formed in step S400 shown.

[0041] Figure 12 The Figure 7 schematic diagram of the process of step S300 in the manufacturing method of the display component shown.

[0042] Figure 13 The

[0043] Figure 14 The Figure 13 schematic diagram of the structure of the electronic device from another perspective shown.

[0044] Figure 15 The

[0045] Explanation of reference numerals:

[0046] 1 - Electronic device; 10 - Display component; 11 - Light-emitting unit; 111 - Circuit board; 112 - Light-emitting chip; 114 - Encapsulation colloid; 1111 - Mounting surface; 1112 - Connection surface; 13 - Circuit board; 1141 - First encapsulation colloid; 1142 - Second encapsulation colloid; 14 - Lamp shade; 15 - Adhesive layer; 17 - Decorative piece; 18 - Pressure-sensitive button; 100 - Encapsulation colloid layer; 20 - Main display module; 30 - Drive control unit; 40 - Camera module; 50 - Housing; 60 - Rear cover assembly; 51 - Middle frame; 61 - Rear cover, 611 - First surface; 612 - Second surface; 63 - First film layer; 64 - Second film layer; 65 - Color-tuning and explosion-proof layer; 66 - Electrochromic layer; 67 - Anti-glare layer; 68 - Anti-fingerprint layer; S100 to S400 - Steps of the manufacturing method of the display component; S310 to S330 - Sub-steps of step S300. Detailed implementation manners

[0047] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0048] The descriptions of the following embodiments refer to the attached drawings for illustrating specific embodiments in which the present application can be implemented. The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meanings. The directional terms mentioned in the present application, such as "up", "down", "front", "rear", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer illustration and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present application.

[0049] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances. It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising", "may comprise", "including", or "may include" used in the present application indicate the existence of the corresponding functions, operations, elements, etc. disclosed, and do not limit one or more other functions, operations, elements, etc. In addition, the term "comprising" or "including" means the existence of the corresponding features, numbers, steps, operations, elements, components, or combinations thereof disclosed in the specification, and does not exclude the existence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, and is intended to cover non-exclusive inclusion. In the exemplary embodiments of the present application, "the orthographic projection of B is within the range of the orthographic projection of A" or "the orthographic projection of A includes the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the specification of this application herein are only for the purpose of describing specific embodiments, and are not intended to limit this application.

[0051] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic structural diagram of a display component disclosed in an embodiment of the present application. Figure 2 is Figure 1 a schematic structural diagram of a light-emitting unit of the display component shown in Figure 1 and Figure 2 . As shown in Figure 13 , the display component 10 provided in the embodiment of the present application is applied to an electronic device 1 (such as

[0052] shown). The electronic device 1 may include, but is not limited to, mobile terminal devices such as smart phones, tablet computers, handheld computers, handheld game consoles, and personal digital assistants (PDAs).

[0053] In the embodiment of the present application, the display assembly 10 includes a plurality of light-emitting units 11, each of which includes a circuit substrate 111, a light-emitting chip 112, and an encapsulant 114. The circuit substrate 111 includes a mounting surface 1111 and a connection surface 1112 that are oppositely disposed. The light-emitting chip 112 is disposed on the mounting surface 1111 and electrically connected to the circuit substrate 111. The encapsulant 114 is disposed on the mounting surface 1111, surrounding the light-emitting chip 112 and covering the light-emitting chip 112, thereby encapsulating the light-emitting chip 112 in the circuit substrate 111.

[0054] In an exemplary embodiment, the light-emitting chip 112 can be a light-emitting diode (LED), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), or a quantum dot light-emitting diode (QLED), etc., and this application does not make any specific limitations on this.

[0055] In the embodiment of the present application, the display assembly 10 may further include a circuit board 13. A circuit substrate 111 of each of the light-emitting units 11 is disposed on and electrically connected to the circuit board 13. Each circuit substrate 111 may be mounted with one or more light-emitting chips 112. Gaps are provided between the circuit substrates 111, and the light-emitting units 11 are arranged in a matrix on the circuit board 13 to form the display assembly 10.

[0056] The multiple circuit boards 111 may be separate blocks, and the blocks of the multiple circuit boards 111 may be freely arranged on the circuit board 13 according to actual needs. The connection surface 1112 of the circuit board 111 is connected to the circuit board 13, so that the circuit board 111 is electrically connected to the circuit board 13. It can be understood that when the blocks of the multiple circuit boards 111 are separately arranged, gaps are provided between the multiple circuit boards 111, so that the respective light-emitting units 11 can be kept insulated. Moreover, since the blocks of the multiple circuit boards 111 are separately arranged, the gaps between the circuit boards 111 can be compressed or reduced according to actual needs, thereby increasing the arrangement density of the light-emitting chips 112 on the circuit board 13 of the display assembly 10, and further increasing the display brightness of the display assembly 10. Further, a colloid such as waterproof glue or insulating glue may be provided in the gap to improve the overall bonding strength of the display assembly, so that the light-emitting chip 112 is firmly fixed and not easily loosened or fallen off, and the insulation between the light-emitting units 11 or the waterproof performance of the entire display assembly can also be improved.

[0057] It can be understood that in an exemplary embodiment, the multiple circuit boards 111 may be interconnected to form a flat plate structure, which is integrally disposed on the circuit board 13 and electrically connected to the circuit board 13, and the respective light-emitting units 11 are insulated by providing insulating partition walls.

[0058] In the embodiments of the present application, the multiple light-emitting units 11 may be arranged regularly or irregularly on the circuit board 13 according to actual needs and design requirements. It can be understood that irregular polygon arrangements, rectangular arrangements, rhombus arrangements, triangular arrangements, star arrangements, etc. are not specifically limited in the present application. For example, three adjacent light-emitting units 11 arranged on the circuit board 13 are combined into a light-emitting unit group, and the three light-emitting chips 112 in the light-emitting unit group are respectively arranged to output light of different colors (for example: the three primary colors of red, green, and blue), and by adjusting the light output ratio of different light-emitting chips 112, the purpose of mixing light or dimming light is achieved.

[0059] In an embodiment of the present application, the circuit board 13 may integrate electronic components such as a processor, a storage unit, a baseband chip, and a power management unit of the electronic device 1. The circuit board 13 may be a printed circuit board (PCB), which is composed of an insulating base plate, connecting wires, and pads for assembling and soldering electronic components, and has the dual functions of a conductive circuit and an insulating base plate. The circuit board may be a single-sided board, a double-sided board, or a multi-layer board, which can replace complex wiring and can achieve wiring, electrical connection, or electrical insulation between various electronic components, providing the required electrical characteristics.

[0060] In an embodiment of the present application, each encapsulation colloid 114 includes a first encapsulation colloid 1141 and a second encapsulation colloid 1142. The first encapsulation colloid 1141 is disposed on the circuit substrate 111 and wraps the light-emitting chip 112. The second encapsulation colloid 1142 is disposed around the first encapsulation colloid 1141 and forms a cavity with the circuit substrate 111, and the light-emitting chip 112 is disposed in the cavity, thereby encapsulating the light-emitting chip 112 on the circuit substrate 111.

[0061] In an embodiment of the present application, the first encapsulation colloid 1141 may be made of a silicone elastic material. For example, the first encapsulation colloid 1141 may be made of a fluorescent glue, which has advantages such as high light transmittance, high refractive index, good thermal stability, and low hygroscopicity. Moreover, the first encapsulation colloid 1141 is also used for conducting and dissipating the heat generated after the light-emitting chip 112 emits light.

[0062] In this exemplary embodiment, a light reflection material (such as aluminum oxide, titanium dioxide) may be added to the first encapsulation colloid 1141 to improve the light-emitting efficiency of the light-emitting chip 112 or improve the light mixing effect.

[0063] In an embodiment of the present application, the second encapsulation colloid 1142 is disposed on the mounting surface 1111 of the circuit substrate 111. The top surface of the second encapsulation colloid 1142 is flush with the top surface of the first encapsulation colloid 1141 and surrounds the outside of the first encapsulation colloid 1141. The second encapsulation colloid 1142 may be made of dam glue, which can prevent light interference caused by light crosstalk between the light-emitting units 11.

[0064] Please refer to Figure 3 , Figure 3 For Figure 2 the schematic diagram of the relevant dimensions of the second encapsulation colloid shown. As Figure 3As shown, the second encapsulation colloid 1142 as a whole can be a closed frame formed by a retaining wall. The wall thickness D1 of the retaining wall of the second encapsulation colloid 1142 is greater than or equal to 0.035 mm and less than or equal to 0.15 mm. For example, 0.035 mm, 0.04 mm, 0.05 mm, 0.07 mm, 0.08 mm, 0.085 mm, 0.1 mm, 0.11 mm, 0.115 mm, 0.12 mm, 0.14 mm, 0.15 mm, or other values. This application does not make specific limitations on this.

[0065] In the embodiment of the present application, when the shape of the orthographic projection of the second encapsulation colloid 1142 in the direction of the circuit board 111 is a rectangular frame, the side length D2 of the rectangle is greater than or equal to 0.55 mm, and the minimum distance D3 between any two adjacent second encapsulation colloids 1142 is greater than or equal to 0.2 mm. Or, when the shape of the orthographic projection of the second encapsulation colloid 1142 in the direction of the circuit board 111 is an annular frame, the outer diameter D2 of the annulus is greater than or equal to 0.55 mm, and the minimum distance D3 between any two adjacent second encapsulation colloids 1142 is greater than or equal to 0.2 mm.

[0066] It can be understood that by setting the minimum distance between two adjacent second encapsulation colloids 1142, it is possible to ensure that interference is avoided during assembly, and it is also possible to prevent short circuits between adjacent circuit boards 111. If the distance between two adjacent second encapsulation colloids 1142 is too narrow, for example, the minimum distance between any two adjacent second encapsulation colloids 1142 is less than 0.2 mm, it will cause problems in ensuring tolerances during assembly, resulting in interference at the assembly position. Moreover, when the circuit board 111 is installed on the circuit board 13 by soldering, the solder paste is likely to connect adjacent circuit boards 111 and cause a short circuit. In addition, by setting the minimum distance between two adjacent second encapsulation colloids 1142, it is also beneficial to the heat dissipation of the light-emitting unit 11 and the display component 10.

[0067] Please refer to Figure 4 and Figure 5 , Figure 4 which is a schematic cross-sectional structure diagram of the display component disclosed in the embodiment of the present application, Figure 5 and Figure 4 is a schematic exploded structure diagram of the display component shown. As shown in Figure 4 and Figure 5As shown, the display component 10 of the present application may further include a lamp shade 14, and the lamp shade 14 covers all the light-emitting units 11. Specifically, the display component 10 includes a lamp shade 14, and the lamp shade 14 is disposed on the mounting surface 1111 of the circuit board 111 and covers all the light-emitting units 11 on the mounting surface 1111 of the circuit board 111.

[0068] In an embodiment of the present application, the display component 10 may further include a plurality of lamp shades 14, and each lamp shade 14 covers one or more of the light-emitting units 11. Specifically, the plurality of lamp shades 14 are all disposed on the mounting surface 1111 of the circuit board 111, and each lamp shade 14 covers one or more of the light-emitting units 11 to the mounting surface 1111 of the circuit board 111.

[0069] In an embodiment of the present application, the lamp shade 14 includes an effect layer, and the effect layer is located in the light-emitting direction of the light-emitting unit 11, for example, the effect layer is disposed on the inner top surface or the outer top surface of the lamp shade 14 to allow the light of the light-emitting unit 11 to pass through. The effect layer is used to transmit the light emitted by the light-emitting chip 112 and form a preset display effect, such as forming a preset color, a preset brightness, a preset texture, a foggy display, and other display effects.

[0070] In an exemplary embodiment, the effect layer of each lamp shade 14 may include: one or more of a color filter film, a light-transmitting film with a preset light transmittance, a film with a texture, a light homogenizing film, and a light enhancing film.

[0071] In an embodiment of the present application, the inner surface of each lamp shade 14 has a plurality of light-transmitting regions, and each light-transmitting region corresponds to at least one light-emitting chip 112. The light emitted by the light-emitting chip 112 presents different light-emitting effects through different light-transmitting regions of the lamp shade 14, such as presenting different colors, different brightnesses, different textures, and other light-emitting effects.

[0072] In an embodiment of the present application, the lamp shade 14 is provided with a light-shielding portion corresponding to the second encapsulation colloid 1142 in a direction parallel to the light-emitting direction of the light-emitting unit 11, and the light-shielding portion abuts against the second encapsulation colloid 1142 of the light-emitting unit 11. For example, the lamp shade 14 protrudes in the direction towards the light-emitting unit 11 to form a plurality of light-shielding portions. The light-shielding portions are located in the light-emitting direction of the light-emitting unit 11, and the end of the light-shielding portion abuts against the side of the second encapsulation colloid 1142 of the light-emitting unit 11 facing away from the circuit board 111, so that the light-shielding portion covers the light-emitting unit 11. The light-shielding portion is used to prevent the light between the light-emitting chips 112 of the light-emitting unit 11 from crosstalking, and further prevent the light between different light-emitting units 11 from interfering with each other.

[0073] In an embodiment of the present application, the lamp cover 14 may be a glass cover plate, or a sapphire cover plate, or a plastic cover plate. The lamp cover 14 has a relatively high light transmittance to facilitate the emission of light from the light-emitting unit 11. The outer shape of the lamp cover 14 may be circular, or a rounded rectangle, or a racetrack shape, or a pentagon, or a hexagon, or other shapes. The lamp cover 14 may have relatively high scratch resistance to prevent the lamp cover 14 from being easily scratched. It can be understood that an optical film layer or other film layers with enhanced properties may be coated on the surface of the lamp cover 14. The optical film layer may include one or more of an infrared filter layer, a ultraviolet filter layer, an anti-reflection film, and a strengthening layer.

[0074] In an embodiment of the present application, the transmittance of the lamp cover 14 may be 5% - 20%. For example, 6%, 6.5%, 7%, 7.2%, 8%, 8.5%, 9%, 10%, 10.4%, 11%, 12%, 12.5%, 12.8%, 13%, 13.5%, 14%, or other values. The present application does not make specific limitations thereto. Therefore, the transmittance design of the lamp cover 14 can ensure that when the light-emitting chip 112 is in a non-operating state, the light-emitting chip 112 does not look too obvious from the outside, having a good visual effect. The color temperature of the light-emitting chip 112 may be 5000 Kelvin (K) - 9000K. For example, 5000K, 5500K, 5580K, 5800K, 6000K, 6500K, 7000K, 7050K, 7250K, 7500K, 7600K, 7900K, 8000K, 8300K, 8500K, 8600K, 8800K, 8900K, 8950K, 9000K, or other values. The present application does not make specific limitations thereto. Therefore, the color temperature of the light-emitting chip 112 can ensure that after the light of the light-emitting chip 112 passes through the light transmittance of the lamp cover, it is not too dazzling, and in terms of visual effect, it is not easy for users to see individual light-emitting chips on the entire machine, ensuring the appearance effect. Therefore, the display component 10 can ensure controllability of the display brightness and a good visual effect without being dazzling.

[0075] Such as Figure 4 and Figure 5As shown, in the embodiment of the present application, the display component 10 may further include an adhesive layer 15. The adhesive layer 15 is disposed between the lamp cover 14 and the mounting surface 1111 of the circuit board 111, and the lamp cover 14 is fixedly attached to the circuit board 111 through the adhesive layer 15. Among them, the adhesive layer 15 may be an optical adhesive layer, or an adhesive layer, or a double-sided adhesive layer. The adhesive layer 15 can reliably fix the lamp cover 14 to the mounting surface 1111 of the circuit board 111, and the adhesive layer 15 can also play a role in buffering and shock absorption when the electronic device 1 accidentally drops. Moreover, the circumferential direction of the lamp cover 14 is fixedly attached to the adhesive layer 15, so the sealing performance between the lamp cover 14 and the circuit board 111 can be improved, and thus the waterproof and dustproof performance of the electronic device 1 can be improved.

[0076] In the embodiment of the present application, the display component 10 may further include a plurality of driving circuits. The same driving circuit is electrically connected to one or more of the light-emitting chips 112 and is used to control one or more of the light-emitting chips 112. When one driving circuit is electrically connected to one light-emitting chip 112, the driving circuit independently controls parameters such as the lighting, brightness, and color of one light-emitting chip 112. Therefore, by independently controlling each light-emitting chip 112, more precise brightness control and adjustment can be achieved, the light intensity can be adjusted according to needs, energy is saved, and moreover, independently controlling each light-emitting chip 112 can also prevent some light-emitting chips from being overloaded or overheated, thereby extending the service life of the entire display component 10. In addition, by independently controlling each light-emitting chip 112, local dimming can also be achieved, only the required light-emitting chips are lit, unnecessary energy consumption is reduced, and it can also adapt to different lighting requirements and environmental changes. Additionally, by independently controlling each light-emitting chip 112, fault diagnosis and maintenance can be conveniently carried out. If a certain light-emitting chip 112 fails, it can be replaced independently without affecting the normal operation of other light-emitting chips.

[0077] In an embodiment of the present application, the driving circuit may be a Driver Integrated Circuit (Driver IC), which can be electrically connected to the Microcontroller Unit (MCU) of the display component 10 through a Flexible Printed Circuit (FPC). It can be understood that the display component 10 may further include various connectors for realizing electrical connections between different electronic components, electrical connections between electronic components and circuit boards, electrical connections between different circuit boards, etc. For example, the display component 10 includes a BTB connector, which is used to connect different electronic boards or circuit boards to realize the transmission of electricity, signals and data. The display component 10 may further include a ZIF connector, which is applied to the connection between a cable and a circuit board, especially suitable for scenarios that require frequent plugging and unplugging. When connecting, no mechanical force needs to be applied, and a stable connection can be achieved by loosening the buckle mechanism.

[0078] Please refer to Figure 6 , Figure 6 for Figure 5 the schematic assembly structure diagram of the lamp shade shown. In an embodiment of the present application, the display component 10 may further include a decorative sheet 17, and the decorative sheet 17 is disposed around the outer edge of the lamp shade 14. For example, the decorative sheet 17 may be an overall annular sheet body, which fits on the mounting surface 1111 of the circuit board 111 and is disposed around the outer edge of the lamp shade 14. That is to say, the decorative sheet 17 is bounded by the lamp shade 14, so that the appearance surface is not affected by the shapes of other electronic components (such as circuit boards). It can be understood that the decorative sheet 17 can block other electronic components on the circuit board 111 and be visualized through a transparent rear cover, which is beneficial to improving the appearance performance and overall aesthetic feeling of the electronic device 1. Moreover, the decorative sheet 17 can also be used to provide labeled information of the electronic components to the user. The user can know the distribution of relevant electronic components inside the electronic device 1 through the decorative sheet 17, so that the user can know the installation positions of some electronic components, the names corresponding to the electronic components, the functions of the electronic components and other characteristic information through the decorative sheet 17, enhancing the information transmission of the electronic device 1.

[0079] In an embodiment of the present application, the display component 10 may further include at least one pressure-sensitive button 18 (such as Figure 14As shown in the figure, the pressure-sensitive button 18 is disposed on the back cover or the frame of the electronic device 1. The pressure-sensitive button 18 is electrically connected to the light-emitting chip 112 and is used to control the lighting or extinguishing of the display component 10. For example, the pressure-sensitive button 18 is electrically connected to the circuit board and the display component 10, and can control the display component 10 to display corresponding image information. For example, it can control the display component 10 to light up the screen. Also, for example, long pressing the pressure-sensitive button 18 can extinguish the screen of the display component 10. Double-clicking the pressure-sensitive button 18 can adjust the display brightness of the display component 10 or change the display pattern. It can be understood that the manner in which the pressure-sensitive button 18 controls the display component 10 can be adjusted and preset according to specific needs, and the present application does not make specific limitations thereto.

[0080] In the embodiment of the present application, the display component 10 may be a dot matrix screen, which is used to display functional image information for the user. The functional image information includes, but is not limited to, for example, image information such as displaying time, date, preset patterns, logos, etc., so as to increase the functional diversity, ornamental value, and personalized design of the electronic device 1.

[0081] In summary, the display component 10 disclosed in the embodiment of the present application is applied to the electronic device 1. The display component 10 includes a plurality of light-emitting units 11, and each light-emitting unit 11 includes a circuit substrate 111, a light-emitting chip 112, and a packaging colloid 114. The circuit substrate 111 includes a mounting surface 1111. The light-emitting chip 112 is disposed on the mounting surface 1111 and is electrically connected to the circuit substrate 111. The packaging colloid 114 is disposed on the mounting surface 1111. The packaging colloid 114 is disposed around the light-emitting chip 112 and covers the light-emitting chip 112, encapsulating the light-emitting chip 112 on the circuit substrate 111. Therefore, the display component 10 of the present application can achieve flexible and personalized customized design of the arrangement form of the light-emitting chips 112 by independently arranging a plurality of the light-emitting chips 112 on the circuit substrate 111 according to needs and electrically connecting them to the circuit substrate 111. For example, a plurality of the light-emitting chips 112 can be arranged to form different patterns according to design needs. Moreover, the display component 10 can increase the mounting reliability of the light-emitting chip 112 by mounting and fixing the light-emitting chip 112 through the circuit substrate 111, avoiding risks such as loosening and falling off.

[0082] In addition, by disposing the first encapsulation colloid 1141 to wrap the light-emitting chip 112 on the circuit board 111 and disposing the second encapsulation colloid 1142 around the first encapsulation colloid 1141, not only can the effective light-emitting area of the light-emitting chip 112 be increased, but also light crosstalk between adjacent light-emitting chips 112 can be prevented, thereby preventing light interference between adjacent optical paths, and further improving the appearance delicacy and light effect of the display component 10.

[0083] Based on the same technical concept, an embodiment of the present application further provides a manufacturing method of a display component. Please refer to Figure 7 , Figure 7 which is a schematic flowchart of a manufacturing method of a display component disclosed in an embodiment of the present application. The manufacturing method of the display component is used to form the above-mentioned display component 10. For the description of the same parts between the structure involved in the manufacturing method of the display component and the structure of the above-mentioned display component 10, please refer to the relevant description of the display component 10 in the above embodiment, which will not be elaborated here. Please refer to Figure 7 , and the manufacturing method of the display component specifically includes the following steps.

[0084] S100. Electrically connect a plurality of light-emitting chips 112 to a circuit board 111.

[0085] Specifically, please refer to Figure 8 , Figure 8 which is Figure 7 a schematic diagram of the corresponding layer structure formed by step S100 shown in the figure. Provide a circuit board 111, the circuit board includes a mounting surface 1111, dispose a plurality of light-emitting chips 112 on the mounting surface 1111, and electrically connect them to the circuit board 111.

[0086] S200. Dispose an encapsulation colloid layer 100 on the circuit board 111, and the encapsulation colloid layer 100 wraps and covers the light-emitting chips 112 to the circuit board 111.

[0087] Specifically, please refer to Figure 9 , Figure 9 which is Figure 7 a schematic diagram of the corresponding layer structure formed by step S200 shown in the figure. Electrically connect a plurality of the light-emitting chips 112 to the circuit board 111, dispose an encapsulation colloid layer 100 on the circuit board 111, the encapsulation colloid layer 100 wraps the light-emitting chips 112, and covers a plurality of the light-emitting chips 112 to the circuit board 111.

[0088] S300. Cut the encapsulation colloid layer 100 to divide the encapsulation colloid layer 100 into a plurality of encapsulation colloids 114, and each encapsulation colloid 114 covers the light-emitting chip 112 to form a plurality of light-emitting units 11.

[0089] Specifically, please refer to Figure 10 , Figure 10 which is Figure 7 a schematic diagram of the corresponding layer structure formed by step S300 shown. An encapsulation colloid layer 100 is disposed on the circuit board 111 to wrap and cover a plurality of the light-emitting chips 112 on the circuit board 111. Cut the encapsulation colloid layer 100 to divide the encapsulation colloid layer 100 into a plurality of encapsulation colloids 114, and each encapsulation colloid 114 covers the light-emitting chip 112 to form a plurality of light-emitting units 11.

[0090] S400. Arrange a plurality of the light-emitting units 11 in a matrix on the circuit board 13, and electrically connect the circuit boards 111 of the plurality of light-emitting units 11 to the circuit board 13.

[0091] Specifically, please refer to Figure 11 , Figure 11 which is Figure 7 a schematic diagram of the corresponding layer structure formed by step S400 shown. Cut the encapsulation colloid layer 100 to divide the encapsulation colloid layer 100 into a plurality of encapsulation colloids 114, and each encapsulation colloid 114 covers the light-emitting chip 112 to form a plurality of light-emitting units 11. Arrange a plurality of the light-emitting units 11 in a matrix on the circuit board 13, and electrically connect the circuit boards 111 of the plurality of light-emitting units 11 to the circuit board 13. Each circuit board 111 corresponds to one or more of the light-emitting chips 112. There is a gap between a plurality of the circuit boards 111, and a plurality of the light-emitting units 11 are arranged in a matrix on the circuit board 13 to form the display component 10.

[0092] Please refer to Figure 12 , Figure 12 which is Figure 7 a schematic flow chart of step S300 in the manufacturing method of the display component shown. The step S300 includes the following sub-steps.

[0093] S310. Cut a plurality of grooves in the encapsulation colloid layer 100 to divide the encapsulation colloid layer 100 into a plurality of first encapsulation colloids 1141, and the first encapsulation colloids 1141 wrap the light-emitting chips 112.

[0094] S320. Fill the encapsulation colloid layer 100 in the grooves so that the encapsulation colloid layer 100 is disposed around the first encapsulation colloids 1141.

[0095] S330 cuts the encapsulation colloid layer 1141 and penetrates through to the circuit board 111 to divide the encapsulation colloid layer into a plurality of second encapsulation colloids 1142, and the second encapsulation colloids 1142 are arranged around the first encapsulation colloid 1141 to form an encapsulation colloid 114 covering the light-emitting chip 112.

[0096] In the embodiment of the present application, the first encapsulation colloid 1141 can be made of an organosilicon elastic material. For example, the first encapsulation colloid 1141 can be made of a fluorescent glue, which has advantages such as high light transmittance, high refractive index, good thermal stability, and low hygroscopicity. Moreover, the first encapsulation colloid 1141 is also used for conducting and dissipating the heat generated after the light-emitting chip 112 emits light.

[0097] In the embodiment of the present application, the second encapsulation colloid 1142 is disposed on the mounting surface 1111 of the circuit board 111. The top surface of the second encapsulation colloid 1142 is flush with the top surface of the first encapsulation colloid 1141 and surrounds the outside of the first encapsulation colloid 1141. The second encapsulation colloid 1142 can be made of a dam glue, which can prevent light interference caused by light crosstalk between the light-emitting units 11.

[0098] Based on the same technical concept, the embodiment of the present application further provides an electronic device, which includes a middle frame, a rear cover, and the above-mentioned display component 10, and the display component 10 is disposed between the middle frame and the rear cover. Since the display component 10 has been described in detail in the above embodiment, it will not be elaborated here. Therefore, the electronic device provided by the embodiment of the present application has the technical effects of the technical solutions in any of the above embodiments, and the explanations of the same or corresponding structures and terms as those in the above embodiments will not be elaborated here either.

[0099] Please refer to Figure 13 and Figure 14 , Figure 13 which is a schematic structural diagram of an electronic device disclosed in the embodiment of the present application, Figure 14 is Figure 13 a schematic structural diagram of another perspective of the electronic device shown in Figure 13 and Figure 14As shown, the electronic device 1 provided in the embodiment of the present application further includes a main display module 20, and the main display module 20 has a display function and a touch function, that is, the electronic device 1 can be operated by clicking on the main display module 20. The main display module 20 may include structural layers such as a touch screen, a light-emitting layer, a backplane layer, and a substrate layer, and its specific structure can be selected according to different products. In the embodiment of the present application, the main display module 20 may be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, an active matrix organic light-emitting diode (AMOLED) display, a flexible light-emitting diode (FLED) display, or a quantum dot light-emitting diode (QLED) display, etc. The main display module 20 can be used to display image information and provide an interaction interface for users.

[0100] In the embodiment of the present application, the electronic device 1 further includes a drive control unit 30, and the drive control unit 30 is electrically connected to the light-emitting chip 112 of the display component 10 for controlling the display component 10 to light up or present different display patterns according to a preset manner.

[0101] In the embodiment of the present application, the electronic device 1 may further include a camera module 40, and the camera module 40 may include multiple cameras, and the multiple cameras are used for taking pictures and videos. The multiple cameras may be any different cameras among periscope cameras, conventional cameras, wide-angle cameras, ultra-wide-angle cameras, telephoto cameras, black-and-white cameras, and depth cameras.

[0102] It can be understood that the camera module 40 may further include an image sensor, a filter, an image signal processor, a flash, a focusing and optical image stabilization element, and other auxiliary components, etc., to improve the imaging quality of the camera module 40.

[0103] Such as Figure 13 and Figure 14As shown, the electronic device 1 further includes a housing 50 and a rear cover assembly 60. The housing 50 can be used to position, support, and protect the display assembly 10, the main display module 20, the drive control unit 30, the battery module, the camera module 40, and the rear cover assembly 60. The circuit board 13 is installed and fixed within the housing 50. The circuit board 13 is electrically connected to the battery module and the drive control unit 30 respectively, and the circuit board 13 can also integrate electronic components such as the processor, storage unit, baseband chip, and power management unit of the electronic device 1.

[0104] The housing 50 includes a middle frame 51. The main display module 20 and the rear cover assembly 60 are respectively located on opposite sides of the middle frame 51 and are fixedly connected to the middle frame 51 respectively. Specifically, the main display module 20 and the rear cover assembly 60 can be fixedly connected to the middle frame 51 through a dispensing process to improve the reliability and stability of the connection. In the embodiment of the present application, the main display module 20 and the rear cover assembly 60 are respectively fixedly connected to opposite sides of the housing 50. The main display module 20, the rear cover assembly 60, and the housing 50 jointly enclose a receiving space for receiving and installing electronic components such as the battery module, camera module 40, display assembly 10, and circuit board of the electronic device 1. Specifically, a first receiving space can be formed between the middle frame 51 and the rear cover assembly 60, and at least part of the above-mentioned electronic components can be disposed in the first receiving space. A second receiving space can be formed between the middle frame 51 and the main display module 20, and part of the above-mentioned electronic components can be disposed in the second receiving space. It can be understood that the battery module can supply electrical energy to the main display module 20, the drive control unit 30, the camera module 40, and the display assembly 10.

[0105] The middle frame 51 includes a frame. The material of the frame can be a metal material such as aluminum alloy, magnesium alloy, or stainless steel, a ceramic material, a glass material, a plastic material, etc., but is not limited thereto. Function keys such as volume keys and screen-off keys can be provided through the frame, and the function keys are electrically connected to the processor of the electronic device 1. In an exemplary embodiment, the frame can be made by at least one of injection molding, compression molding, extrusion molding, forging, die casting, and computer numerical control (CNC) machine tool processing.

[0106] In the embodiment of the present application, the frame can be entirely or partially made of a transparent material (not limited to glass, transparent plastic, etc.). By making the frame of a transparent material, it is not only convenient for processing and preparation, but also can make the electronic components within the electronic device 1 visually displayed.

[0107] In an embodiment of the present application, the rear cover assembly 60 includes a rear cover 61 with a transparent design. The rear cover 61 is disposed opposite to the main display module 20 and is detachably mounted on the housing 50. The display assembly 10 is disposed between the middle frame 51 and the rear cover 61. The rear cover 61 includes a first surface 611 and a second surface 612 (as shown in Figure 15 ), the first surface 611 is the outer surface of the rear cover 61, which can be seen by the user, and the second surface 612 is the inner surface of the rear cover 61, facing the inside of the electronic device 1.

[0108] In an embodiment of the present application, the pressure-sensitive button 18 is disposed on the first surface 611 of the rear cover 61, and an opaque bonding sheet area is formed on the first surface 611. The user can perform an input operation of the pressure-sensitive button 18 by pressing the opaque bonding sheet area.

[0109] It can be understood that, in order to prevent accidental operation when grasping the electronic device 1, the pressure-sensitive button 18 is disposed at a position close to the edge of the first surface 611 of the rear cover 61.

[0110] In an embodiment of the present application, the display assembly 10 further includes at least one of the lamp covers 14. Each lamp cover 14 covers one or more of the light-emitting units 11. The surface of the lamp cover 14 facing away from the light-emitting unit 11 abuts against the rear cover 61 of the electronic device 1. Alternatively, the side of the lamp cover 14 facing away from the light-emitting unit 11 constitutes a part of the rear cover 61 of the electronic device 1. It can be understood that since the lamp cover 14 constitutes the outermost surface of the electronic device 1, the thickness of the rear cover 61 at this position can be reduced, thereby reducing the overall thickness of the rear cover assembly 60. At the same time, since the lamp cover 14 constitutes the outermost surface of the electronic device 1, it is possible to prevent light from passing through the lamp cover 14 and then passing through the relevant partial area of the rear cover 61, and to avoid the influence of the surface design (such as surface texture, color, etc.) of the rear cover 61 on the lamp array effect.

[0111] In an embodiment of the present application, the rear cover 61 can be a battery cover of the electronic device 1 made of a transparent material (such as glass, transparent plastic, etc.).

[0112] In an embodiment of the present application, the rear cover 61 and the frame can be made entirely or partially of a transparent material (such as glass, transparent plastic, etc.). This not only facilitates processing and manufacturing, but also enables at least some electronic components such as the camera module 40 and the display component 10 of the electronic device 1 to be visualized through the transparent rear cover 61. The user can see at least some of the electronic components and their arrangements on the back of the electronic device 1, which is beneficial to enhancing the technological sense, personalization, and overall aesthetic feeling of the electronic device 1.

[0113] In an embodiment of the present application, after the rear cover 61 is fixedly connected to the middle frame 51, the first surface 611 of the rear cover 61 is exposed so that the user can directly view the appearance of the rear cover 61, enabling the first surface 611 of the rear cover 61 to present an appearance effect, thereby enhancing the appearance characteristics of the electronic device 1. Moreover, the material of the rear cover 61 is glass, for example, high-aluminum silicon glass, nano-crystalline glass, etc., which has characteristics such as high hardness, wear resistance, and scratch resistance. It can be understood that the first surface 611 (i.e., the appearance surface) of the rear cover 61 is a relatively smooth surface so that the rear cover 61 has better appearance characteristics.

[0114] Please refer to Figure 15 , Figure 15 , which is a schematic diagram of the layer structure of the rear cover assembly of the electronic device disclosed in the embodiment of the present application. In an embodiment of the present application, the rear cover assembly 60 further includes a first film layer 63 and a second film layer 64. The first film layer 63 is attached to the first surface 611 of the rear cover 61, and the position of the first film layer 63 corresponds to the position of the display component 10. The second film layer 64 is attached to the first surface 611 of the rear cover 61, and the position of the second film layer 64 corresponds to the position of the camera module 40.

[0115] In an embodiment of the present application, the first film layer 63 can be an anti-reflection (AR) film, which can increase the hardness of the rear cover 61 at the position corresponding to the display component 10 and prevent the first surface 611 at this position from being scratched. Therefore, by providing the first film layer 63 at the position of the rear cover 61 corresponding to the display component 10, the hardness of the surface at this position can be increased, and the anti-scratch and anti-abrasion effects are enhanced, thereby improving the picture display clarity of the display component 10 and further enhancing the display effect of the display component 10. For example, the Mohs hardness of the first surface 611 where the first film layer 63 is attached is 7H (Hard).

[0116] In an embodiment of the present application, the second diaphragm layer 64 may be an anti-reflection film, which can increase the hardness of the corresponding position of the rear cover 61 at the camera module 40, and prevent the first surface 611 at this position from being scratched. In addition, by performing an anti-reflection treatment on the first surface 611 of the rear cover 61 corresponding to the camera module 40, the light transmittance of the camera module 40 corresponding to the first surface 611 can be improved, and the glass reflectivity can be reduced to achieve the purpose of increasing light transmittance. Therefore, by disposing the second diaphragm layer 64 at the position of the rear cover 61 corresponding to the camera module 40, the hardness of the corresponding surface of the camera module 40 can be increased, and the anti-scratch and anti-scratch effects can be enhanced, thereby improving the light transmittance of the camera module 40, and further improving the shooting effect of the camera module 40. For example, the Mohs hardness of the first surface 611 where the second diaphragm layer 64 is attached may be 7H.

[0117] In an embodiment of the present application, the first diaphragm layer 63 and the second diaphragm layer 64 may be directly formed on the first surface 611 of the rear cover 61 by vacuum evaporation coating. Specifically, by performing an anti-reflection coating treatment on the first surface 611 of the rear cover 61 corresponding to the display component 10, an anti-reflection film is formed; by performing an anti-reflection coating treatment on the first surface 611 of the rear cover 61 corresponding to the camera module 40, an anti-reflection film with a Mohs hardness of 7H is formed.

[0118] In an exemplary embodiment, the thickness of the first diaphragm layer 63 and the second diaphragm layer 64 is 650 nm - 750 nm. For example, 650 nm, 670 nm, 680 nm, 700 nm, 710 nm, 730 nm, 740 nm, 750 nm, or other values. The present application does not make specific limitations on this.

[0119] Therefore, the rear cover 61 is integrally designed to be transparent, realizing the hierarchical display of the entire electronic device 1, and solving the problem of the lack of overall appearance integrity of the rear cover of the related technology electronic device. Moreover, by respectively disposing the first diaphragm layer 63 and the second diaphragm layer 64 at the positions of the outer surface (i.e., the first surface 611) of the rear cover 61 corresponding to the display component 10 and the camera module 40, not only the protection of the display component 10 and the camera module 40 is increased, and the integrity and aesthetics of the electronic device 1 are improved, but also the rear cover assembly 60 does not require a decorative ring (CAM Deco) design, making the structure of the rear cover 61 simple and the appearance more concise, with a high overall appearance integrity, further improving the overall appearance integrity of the electronic device 1.

[0120] In an embodiment of the present application, as Figure 15As shown, the rear cover assembly 60 further includes a color - adjusting explosion - proof layer 65. The color - adjusting explosion - proof layer 65 is attached to the first surface 611 of the rear cover 61 and covers the first diaphragm layer 63 and the second diaphragm layer 64. The color - adjusting explosion - proof layer 65 is used to adjust the color and brightness of the image displayed by the display assembly 10. Therefore, the color - adjusting explosion - proof layer 65 is color - adjustable. By attaching the color - adjusting explosion - proof layer 65 to the first surface 611 of the rear cover 61, the color and brightness of the image displayed by the display assembly 10 can be adjusted, enabling the display assembly 10 to display a preset image color and brightness. Moreover, by setting the color - adjusting explosion - proof layer 65 to adjust the screen brightness and color of the display assembly 10, the display assembly 10 does not need to add a dot - matrix screen cover on the rear cover 61, making the structure of the product simpler and the appearance more minimalist, further improving the overall appearance integrity, aesthetics, and appearance display effect of the electronic device 1.

[0121] It can be understood that by attaching the color - adjusting explosion - proof layer 65 to a part of the first surface 611 of the rear cover 61, it can effectively buffer impacts, prevent the screen from cracking, or prevent the glass rear cover of the electronic device 1 from breaking and scattering accidentally when it is impacted, reducing the hidden damage of the glass rear cover. It can also maintain the unique luster, texture, and improve the surface hardness of the strengthened glass rear cover. The structure of the color - adjusting explosion - proof layer 65 can sequentially include: a protective film, a hardening layer, a transparent polyester film, an adhesive layer, and a release film.

[0122] In the embodiment of the present application, the rear cover assembly 60 may further include a bonding layer. The bonding layer is disposed between the color - adjusting explosion - proof layer 65 and the first surface 611 of the rear cover 61. The color - adjusting explosion - proof layer 65 is attached and fixed to the rear cover 61 through the bonding layer. Among them, the bonding layer can be an optical adhesive layer, or an adhesive layer, or a double - sided adhesive layer. The bonding layer can reliably fix the color - adjusting explosion - proof layer 65 to the first surface 611 of the rear cover 61, and the bonding layer can also play a role in buffering and shock absorption when the electronic device 1 accidentally drops. Moreover, the circumferential direction of the rear cover 61 is attached and fixedly connected to the bonding layer, so the sealing performance between the rear cover 61 and the color - adjusting explosion - proof layer 65 can be improved, and further the waterproof and dust - proof performance of the electronic device 1 can be improved.

[0123] In other embodiments of the present application, the rear cover 61 may further include at least one decorative area, which is disposed on the first surface 611 of the rear cover 61, and the decorative areas are respectively provided with the same or different texture patterns. It can be understood that when there are multiple decorative areas, the multiple decorative areas may be adjacent to each other, may be spaced apart, or may be spliced into different patterns. The multiple decorative areas may have the same texture pattern or may have different texture patterns. For example, the multiple decorative areas may form a texture pattern, or form a texture pattern by means of glazing or the like, so as to obtain a better appearance effect, and further improve the appearance characteristics of the electronic device 1.

[0124] In an exemplary embodiment, the position of one of the decorative areas may correspond to the position of the coil in the electronic device 1. In order to increase the layering and aesthetics of the electronic device 1, the shape of the decorative area may be set to match the shape of the coil. Correspondingly, the texture pattern and color on the decorative area are also consistent with the winding method and color of the coil.

[0125] In this embodiment, through the design of the texture and color of the decorative area, the transparent rear cover presents a variety of visual effects. Among them, the ultraviolet texture transfer technology can be used for the texture design of the decorative area, that is, a process of replicating a fine texture structure by using the phenomenon that the liquid UV glue cures under the irradiation of ultraviolet light, so as to make a wire drawing pattern, a sun pattern, a sandblasting pattern, a 3D surface, a leather pattern, a color-changing effect, a bulging effect, a matte surface, a shiny surface, a high-brightness surface effect. The color can be made into a single color or a gradient color. The present application does not make specific limitations on this.

[0126] In an embodiment of the present application, the rear cover assembly 60 further includes an electrochromic layer 66, which is disposed on the surface of the color-adjusting explosion-proof layer 65 facing away from the rear cover 61, and positions corresponding to the camera module 40 and the display assembly 10 are reserved. The electrochromic layer 66 is used to adjust the color and transparency of the rear cover 61, so as to improve the appearance visual effect and aesthetics of the electronic device 1. It can be understood that the electrochromic layer 66 can be adhered and fixed to the surface of the color-adjusting explosion-proof layer 65 facing away from the rear cover 61 through any one of an optical glue layer, an adhesive layer, and a double-sided adhesive layer. The positions corresponding to the camera module 40 and the display assembly 10 reserved by the electrochromic layer 66 mean that the electrochromic layer 66 does not cover the positions corresponding to the camera module 40 and the display assembly 10. For example, through holes with corresponding shapes and sizes may be hollowed out at the positions of the electrochromic layer 66 corresponding to the camera module 40 and the display assembly 10, so that the positions corresponding to the camera module 40 and the display assembly 10 expose the electrochromic layer 66.

[0127] In an embodiment of the present application, the rear cover assembly 60 may further include an anti-glare layer 67. The anti-glare layer 67 is disposed on the surface of the electrochromic layer 66 facing away from the color-tuning explosion-proof layer 65. The anti-glare layer 67 is used to improve the viewing angle of the rear cover 61 and the display assembly 10, reduce the interference of ambient light, and reduce the reflection of the rear cover 61. It can be understood that the anti-glare layer 67 can be adhered and fixed to the surface of the electrochromic layer 66 facing away from the color-tuning explosion-proof layer 65 through any one of an optical adhesive layer, an adhesive layer, and a double-sided adhesive layer.

[0128] In other embodiments of the present application, in order to reduce the overall thickness of the rear cover assembly 60, the electrochromic layer 66 can be omitted, and the anti-glare layer 67 is disposed on the surface of the color-tuning explosion-proof layer 65 facing away from the rear cover 61. Moreover, the anti-glare layer 67 can be adhered and fixed to the surface of the color-tuning explosion-proof layer 65 facing away from the rear cover 61 through any one of an optical adhesive layer, an adhesive layer, and a double-sided adhesive layer.

[0129] In an embodiment of the present application, the rear cover assembly 60 further includes an anti-fingerprint (AF) layer 68. The anti-fingerprint layer 68 is disposed on the surface of the anti-glare layer 67 facing away from the electrochromic layer 66. The anti-fingerprint layer 68 is used to protect the rear cover assembly 60 from being eroded by the external environment, and can also improve the appearance characteristics and visual effects of the rear cover assembly 60. The principle of the anti-fingerprint layer is to disperse the texture of fingerprints so that the fingerprints on the rear cover assembly cannot be displayed, playing a certain antibacterial role; after the anti-fingerprint coating treatment, the surface of the object will exhibit good hydrophobicity and oleophobicity. Therefore, the anti-fingerprint film can also reduce the attachment of various stains, prevent water and oil, and the attached stains can be easily removed. Since it is a high-density film layer, it can continue to function after being wiped with a thin gauze, etc.; at the same time, the film layer will not peel off, so the appearance will not deteriorate. It can be understood that the anti-fingerprint layer 68 can be adhered and fixed to the surface of the anti-glare layer 67 facing away from the electrochromic layer 66 through any one of an optical adhesive layer, an adhesive layer, and a double-sided adhesive layer.

[0130] In an exemplary embodiment, the thickness of the anti-fingerprint layer 68 is 80 nm - 120 nm. For example, 80 nm, 82 nm, 85 nm, 88 nm, 90 nm, 95 nm, 98 nm, 100 nm, 105 nm, 108 nm, 110 nm, 115 nm, 118 nm, 120 nm, or other values. The present application does not make specific limitations thereto.

[0131] It can be understood that in other embodiments of the present application, the rear cover assembly 60 may further include other optical film layers or film layers with other enhanced properties. The optical film layer may include one or more of an infrared filtering layer, an ultraviolet filtering layer, an anti-reflection film, and a strengthening layer.

[0132] In an embodiment of the present application, the rear cover 61 may further include a brightening area, which is disposed on the second surface 612 of the rear cover 61 and corresponds to the position of the flash of the camera module 40. By providing a plurality of concentric annular patterns or spiral patterns in the brightening area of the rear cover 61, the light of the flash can be utilized more efficiently, the illumination brightness of the brightening area is increased, and thus the shooting effect of the camera module 40 is improved.

[0133] It can be understood that in some embodiments, the electronic device 1 may have a communication function, that is, it can establish communication with a network through 4G (the fourth-generation mobile communication technology standard), 5G (the fifth-generation mobile communication technology standard), 6G (the sixth-generation mobile communication technology standard), or W-LAN (Wireless Local Area Network), or communication methods that may emerge in the future. For the sake of simplicity, no further limitation is made in the embodiments of the present application.

[0134] In an exemplary embodiment, the electronic device 1 may further include a processor and a memory. The processor is electrically connected to the main display module 20, the camera module 40, and the display component 10, and is configured to control the main display module 20 and the display component 10 to perform display, and control the camera module 40 to perform shooting. The memory is electrically connected to the processor, and the memory is used to store the program code required for the operation of the processor, control the display content of the main display module 20 and the display component 10, and so on.

[0135] In an exemplary embodiment, the memory may include a volatile memory, such as a random access memory (RAM); the memory may also include a non-volatile memory (NVM), such as a read-only memory (ROM), a flash memory (FM), a hard disk drive (HDD), or a solid-state drive (SSD). The memory may further include a combination of the above types of memories.

[0136] In an exemplary embodiment, the processor includes one or more general-purpose processors. Among them, the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and so on. The processor is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory, which can enable the computing device to provide a wide variety of services.

[0137] In summary, the electronic device 1 provided in the embodiment of the present application includes a middle frame 51, a rear cover 61, and the above-mentioned display component 10. The display component 10 is disposed between the middle frame 51 and the rear cover 61. The display component 10 includes a plurality of light-emitting units 11. Each light-emitting unit 11 includes a circuit board 111, a light-emitting chip 112, and a packaging colloid 114. The circuit board 111 includes a mounting surface 1111. The light-emitting chip 112 is disposed on the mounting surface 1111 and is electrically connected to the circuit board 111. The packaging colloid 114 is disposed on the mounting surface 1111. The packaging colloid 114 is disposed around the light-emitting chip 112 and covers the light-emitting chip 112, encapsulating the light-emitting chip 112 on the circuit board 111. Therefore, by independently arranging a plurality of the light-emitting chips 112 on the circuit board 111 as needed and electrically connecting them to the circuit board 111, the display component 10 of the present application can achieve a flexible and personalized customized design of the arrangement form of the light-emitting chips 112. For example, a plurality of the light-emitting chips 112 can be arranged to form different patterns according to design requirements. Moreover, by mounting and fixing the light-emitting chip 112 through the circuit board 111, the display component 10 can increase the mounting reliability of the light-emitting chip 112 and avoid risks such as loosening and falling off.

[0138] In addition, by providing the first packaging colloid 1141 to wrap the light-emitting chip 112 on the circuit board 111 and providing the second packaging colloid 1142 around the first packaging colloid 1141, not only can the effective light-emitting area of the light-emitting chip 112 be increased, but also light crosstalk between adjacent light-emitting chips 112 can be prevented, resulting in light interference between adjacent optical paths. Furthermore, the appearance delicacy and light effect of the display component 10 are improved.

[0139] It should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second" may explicitly or implicitly include one or more of the said features. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0140] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples" or "some examples", etc. means that the specific features, structures, materials or characteristics described in connection with the said embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

[0141] It should be understood that the application of the present application is not limited to the above examples. For those of ordinary skill in the art, improvements or changes can be made according to the above description. All such improvements and changes should fall within the protection scope of the appended claims of the present application. Those of ordinary skill in the art can understand all or part of the methods for realizing the above embodiments, and the equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. A display component is applied to an electronic device. The display component includes: A plurality of light-emitting units, each of the light-emitting units includes: A circuit board, the circuit board includes a mounting surface; A light-emitting chip, the light-emitting chip is disposed on the mounting surface and electrically connected to the circuit board; A packaging colloid, the packaging colloid is disposed on the mounting surface, the packaging colloid is disposed around the light-emitting chip and covers the light-emitting chip, and the light-emitting chip is encapsulated on the circuit board.

2. The display component according to claim 1, wherein The display component further includes a circuit board, and the circuit boards of the plurality of light-emitting units are connected to the circuit board; Each of the circuit boards corresponds to one or more of the light-emitting chips. There is a gap between the plurality of circuit boards, and the plurality of light-emitting units are arranged in a matrix on the circuit board to form the display component.

3. The display component according to claim 1, wherein Each of the packaging colloids includes a first packaging colloid and a second packaging colloid. The first packaging colloid is disposed on the circuit board and wraps the light-emitting chip. The second packaging colloid is disposed around the first packaging colloid and forms a cavity with the circuit board, and the light-emitting chip is disposed in the cavity.

4. The display component according to claim 3, characterized in that The second packaging colloid is a closed frame formed by a retaining wall. The wall thickness of the retaining wall of the second packaging colloid is greater than or equal to 0.035 mm and less than or equal to 0.15 mm.

5. The display component according to claim 4, characterized in that, When the shape of the positive projection of the second packaging colloid in the direction of the circuit board is a rectangular frame, the side length of the rectangle is greater than or equal to 0.55 mm, and the minimum distance between any two adjacent second packaging colloids is greater than or equal to 0.2 mm; or, When the shape of the positive projection of the second packaging colloid in the direction of the circuit board is an annular frame, the outer diameter of the ring is greater than or equal to 0.55 mm, and the minimum distance between any two adjacent second packaging colloids is greater than or equal to 0.2 mm.

6. The display component according to claim 2, characterized in that, The display component further includes a lamp shade that covers all the light-emitting units; Or, the display component further includes a plurality of lamp shades, and each lamp shade covers one or more of the light-emitting units; Each of the lamp shades includes an effect layer, the effect layer is located in the light-emitting direction of the light-emitting unit, and the effect layer is used to transmit the light emitted by the light-emitting chip and form a preset display effect.

7. The display component according to claim 6, wherein The inner surface of each of the lamp shades has a plurality of light-transmitting regions, and each light-transmitting region corresponds to at least one of the light-emitting chips, and the light emitted by the light-emitting chips presents different light-emitting effects through different light-transmitting regions of the lamp shade.

8. The display component according to claim 6, wherein, The effect layer of each of the lamp shades includes: one or more of a colored filter film, a light-transmitting film with a preset light transmittance, a textured film, a light homogenizing film, and a light enhancing film.

9. The display component according to any one of claims 6-8, characterized in that, The lamp shade is provided with a light-shielding portion corresponding to the second packaging colloid in a direction parallel to the light-emitting direction of the light-emitting unit, and the light-shielding portion abuts against the second packaging colloid of the light-emitting unit.

10. The display component according to any one of claims 1-8, characterized in that, The display component further includes a plurality of driving circuits, and the same driving circuit controls one or more of the light-emitting chips.

11. The display component according to any one of claims 6-8, characterized in that, The display component further includes a decorative sheet that surrounds the outer edge of the lamp shade.

12. The display component according to claims 1-8, characterized in that, The display component further includes at least one pressure-sensitive button, which is disposed on the rear cover or the frame of the electronic device, and the pressing button is used to control the lighting or extinguishing of the display component.

13. An electronic device, characterized in that, It includes a middle frame, a rear cover, and a display component disposed between the middle frame and the rear cover. The display component includes: A plurality of light-emitting units, and each light-emitting unit includes: A circuit board, and the circuit board includes a mounting surface; A light-emitting chip, which is disposed on the mounting surface and electrically connected to the circuit board; Encapsulation colloids, and a plurality of the encapsulation colloids are disposed on the mounting surface. The encapsulation colloids are disposed around the light-emitting chip and cover the light-emitting chip to encapsulate the light-emitting chip on the circuit board.

14. The electronic device according to claim 13, wherein, The electronic device further includes a drive control unit, which is electrically connected to the light-emitting chips of the display component and is used to control the display component to light up or present different display patterns according to a preset manner.

15. The electronic device according to claim 13 or 14, characterized in that, The display component further includes at least one lamp shade, and each lamp shade covers one or more of the light-emitting units. The surface of the lamp shade facing away from the light-emitting unit abuts against the rear cover of the electronic device; or, the side of the lamp shade facing away from the light-emitting unit constitutes a part of the rear cover of the electronic device.

16. A manufacturing method of a display component, characterized in that The manufacturing method is used to manufacture the display component according to any one of claims 1 to 12. The manufacturing method includes: Electrically connecting a plurality of light-emitting chips to a circuit board; Providing an encapsulation colloid layer on the circuit board, and the encapsulation colloid layer wraps and covers the light-emitting chips to the circuit board; Cutting the encapsulation colloid layer to divide the encapsulation colloid layer into a plurality of encapsulation colloids, and each encapsulation colloid covers the light-emitting chip to form a plurality of light-emitting units; Arranging a plurality of the light-emitting units in a matrix on a circuit board, and the circuit boards of the plurality of light-emitting units are electrically connected to the circuit board.

17. The manufacturing method of the display component according to claim 16, characterized in that, The "cutting the encapsulation colloid layer to divide the encapsulation colloid layer into a plurality of encapsulation colloids, and each encapsulation colloid covers the light-emitting chip to form a plurality of light-emitting units" includes: Cutting a plurality of grooves in the encapsulation colloid layer to divide the encapsulation colloid layer into a plurality of first encapsulation colloids, and the first encapsulation colloids wrap the light-emitting chips; Filling the grooves with an encapsulation colloid layer such that the encapsulation colloid layer is disposed around the first encapsulation colloids; Cutting the encapsulation colloid layer and penetrating through to the circuit board to divide the encapsulation colloid layer into a plurality of second encapsulation colloids, and the second encapsulation colloids are disposed around the first encapsulation colloids to form the encapsulation colloids covering the light-emitting chips.

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