Heating device and crushing equipment

Abstract

The heating device comprises a machine table, a first carrier, the heating device, a second carrier and a driving module, the first carrier is arranged on the machine table, and a plurality of first containing grooves are sequentially formed in the first carrier in the extending direction of the first carrier; the heating device is arranged on the machine table and is used for heating the silicon column on the first carrier; the second carrier is arranged on the machine table, the first carrier and the second carrier are arranged in parallel, and the second carrier is sequentially provided with a plurality of second containing grooves in the extending direction of the second carrier; the driving module is arranged on the machine table and used for driving the second carrier to move in the length direction and the up-down direction of the second carrier so that the silicon columns can be sequentially conveyed in the extending direction of the first carrier through the second carrier, and therefore the second carrier can move left and right and up and down in a reciprocating mode, and the silicon columns can be well conveyed; therefore, the heating device can better heat the silicon column, so that the silicon column can be crushed subsequently.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and in particular to a heating device and a crushing device. Background Art

[0002] In the related art, polysilicon needs to be crushed before use, and the polysilicon needs to be subjected to high-temperature and cooling treatment to facilitate subsequent crushing operations.

[0003] During the heating process of polysilicon, a conveyor belt is usually used to transport the polysilicon to the heating area, thereby subjecting the polysilicon conveyed by the conveyor belt to high-temperature treatment. Usually, the polysilicon is heated to 450℃-500℃ and then immediately placed in high-purity water at room temperature to rapidly cool it. Due to the physical properties of polysilicon's thermal expansion and contraction, the internal stress changes drastically, resulting in many cracks. As a result, the silicon pillars can be better broken later.

[0004] However, the use of a conveyor belt to transport polysilicon has a poor transport effect, which results in a poor heating effect of the polysilicon, thereby affecting the subsequent crushing of the polysilicon. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a heating device that can better transport the silicon pillars so as to fully heat the silicon pillars.

[0006] In a first aspect, an embodiment of the present application provides a heating device, comprising:

[0007] Machine;

[0008] A first carrier is extended along a first horizontal direction and is disposed on the machine platform, wherein the first carrier is provided with a plurality of first placement slots in sequence along the extension direction thereof;

[0009] a heating device, disposed on the machine platform, for heating the silicon pillar on the first carrier;

[0010] A second carrier is movably disposed on the machine platform along a first horizontal direction and arranged in parallel with the first carrier, wherein the first carrier is provided with a plurality of second placement slots in sequence along its extension direction;

[0011] The driving module is disposed on the machine platform and is used to drive the second carrier to move along a first horizontal direction and a vertical direction so as to place the silicon column carried by the second placement groove in the first placement groove.

[0012] According to some embodiments of the present invention, first guiding inclined surfaces that are relatively expanded are provided on both sides of the first placement groove; first guiding inclined surfaces that are relatively expanded are provided on both sides of the first placement groove.

[0013] According to some embodiments of the present invention, when the second carrier places the silicon pillar on the first carrier, the first placement groove and the second placement groove are partially staggered.

[0014] According to some embodiments of the present invention, a first support pad is provided on the sidewall of the first placement groove to guide the silicon pillar to roll along the sidewall of the first support pad.

[0015] According to some embodiments of the present invention, when the second carrier lifts the silicon pillar from the first carrier, the first placement groove and the second placement groove are partially staggered to guide the silicon pillar to roll along the sidewall of the second placement groove.

[0016] According to some embodiments of the present invention, a second support pad is provided on the sidewall of the first placement groove, for driving the silicon pillar to roll along the sidewall of the second support pad.

[0017] According to some embodiments of the present invention, a plurality of the second carrier and a plurality of the first carrier are provided, and the plurality of the second carriers and the plurality of the first carriers are arranged in an alternating manner.

[0018] According to some embodiments of the present invention, the second carrier includes a feed section and a discharge section, and the feed section and the discharge section are arranged at an equal distance. When the discharge section is extended relative to the first carrier, the discharge section is aligned with the first carrier; or, when the discharge section is extended relative to the first carrier, the feed section is aligned with the first carrier.

[0019] According to some embodiments of the present invention, the second carrier further includes an intermediate section connected between the feed section and the discharge section; wherein the length of the intermediate section is X1, and the lengths of the feed section and the discharge section are X2, X1=nX2, and n is greater than or equal to 1.

[0020] In a second aspect, an embodiment of the present application provides a polysilicon crushing device, comprising:

[0021] The above-mentioned heating device:

[0022] a cooling device, configured to receive and cool the silicon column transmitted from the heating device;

[0023] The crushing device is used to receive the silicon columns transmitted from the cooling device and crush them.

[0024] As can be seen from the above technical solution, the embodiment of the present application has the following advantages: the second carrier is mainly divided into four working stages. In the first working stage, the drive module drives the second carrier upward, and the second carrier lifts the silicon pillar upward through the second placement groove, separating the silicon pillar from the first placement groove. In the second working stage, the drive module drives the second carrier to move rightward a distance X, thereby moving the lifted silicon pillar to the right a distance X. In the third working stage, the drive module drives the second carrier downward, and the second carrier places the lifted silicon pillar downward into the first placement groove until the second placement groove separates from the silicon pillar. In the fourth working stage, the drive module drives the second carrier to the leftward a distance X, returning to the position of the first working stage, and repeating the steps of the first working stage to the fourth working stage. Thus, the second carrier transports the silicon pillars sequentially from left to right. This arrangement allows the second carrier to move back and forth left and right and up and down, thereby transporting the silicon pillars sequentially, thereby ensuring that the heating mechanism can effectively heat the silicon pillars, facilitating the subsequent crushing of the silicon pillars. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the overall structure of a heating device according to an embodiment of the present invention;

[0026] Figure 2 Schematic diagram of the structure of the first carrier and the second carrier according to an embodiment of the present invention;

[0027] Figure 3 Schematic diagram of the structure of the second carrier and the driving module according to an embodiment of the present invention;

[0028] Figure 4 is a schematic diagram of the partial structure of the first carrier and the second carrier according to an embodiment of the present invention;

[0029] Figure 5 FIG. 4 is a structural diagram of a second carrier in an extended state according to an embodiment of the present invention.

[0030] The meanings of the reference numerals are as follows:

[0031] 100. Machine; 200. First carrier; 210. First placement groove; 211. First guide slope; 220. First support pad; 300. Heating mechanism; 400. Second carrier; 410. Second placement groove; 411. Second guide slope; 420. Second support pad; 430. Feed section; 440. Middle section; 450. Discharge section; 500. Drive module; 600. Silicon pillar. DETAILED DESCRIPTION

[0032] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0033] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, upper, lower, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0037] The present invention will be further described in detail below with reference to the accompanying drawings.

[0038] See also Figures 1 to 3, a heating device provided by an embodiment of the present invention includes a machine 100, a first carrier 200, a heating mechanism 300, a second carrier 400, and a driving module 500, wherein the first carrier 200 is extended along a first horizontal direction on the machine 100, that is, the length direction of the first carrier 200, and the first carrier 200 is sequentially provided with a plurality of first placement slots 210 along its extension direction; the heating mechanism 300 is provided on the machine 100, and is used to heat the silicon pillars 600 on the first carrier 200; the second carrier 400 is provided with a heating mechanism 300; the first carrier 2 ... The second carrier 400 is movably arranged on the machine 100 along a first horizontal direction, i.e., the length direction of the second carrier 400. The first carrier 200 is provided with a plurality of second placement slots 410 in sequence along its extension direction. The first carrier 200 and the second carrier 400 are arranged side by side. The driving module 500 is arranged on the machine 100 and is used to drive the second carrier 400 to move along the first horizontal direction and the up and down directions, so as to sequentially transfer the silicon pillars 600 along the extension direction of the first carrier 200 through the second carrier 400.

[0039] For the convenience of description, the first horizontal direction can be understood as a direction from left to right, and the second carrier 400 carries the silicon pillars 600 from left to right.

[0040] In practical applications, the second carrier 400 operates in four main phases. In the first phase, the driving module 500 drives the second carrier 400 upward, lifting the silicon pillar 600 upward through the second placement groove 410, separating the silicon pillar 600 from the first placement groove 210. In the second phase, the driving module 500 drives the second carrier 400 to move rightward a distance X1, thereby moving the lifted silicon pillar 600 rightward a distance X1. In the third phase, the driving module 500 drives the second carrier 400 downward, placing the lifted silicon pillar 600 downward into the first placement groove 210 until the second placement groove 410 separates from the silicon pillar 600. In the fourth working phase, the drive module 500 drives the second carrier 400 to move leftward a distance X1, returning to the position in the first working phase, and repeating the steps from the first working phase to the fourth working phase. Thus, the second carrier 400 sequentially transports the silicon pillars 600 from left to right. This arrangement allows the second carrier 400 to reciprocate left and right, as well as up and down, to sequentially transport the silicon pillars 600, thereby ensuring that the heating mechanism 300 can optimally heat the silicon pillars 600, facilitating subsequent crushing of the silicon pillars 600.

[0041] For example, the first carrier 200 is provided with 12 first placement slots 210, and accordingly, the first carrier 200 can simultaneously load 12 silicon pillars 600. At the same time, the second carrier 400 is provided with at least 8 second placement slots 410, and accordingly, the second carrier 400 can simultaneously load 8 silicon pillars 600. In a specific application, the second carrier 400 moves forward at least a distance of 4 first placement slots 210 each time it loads 8 silicon pillars 600. This is repeated four times. The second carrier 400 can sequentially move the silicon pillars 600 from the first four positions on the first carrier 200 to the last four positions on the first carrier 200, thereby achieving sequential transportation of the silicon pillars 600, and the heating mechanism 300 can evenly heat the silicon pillars 600.

[0042] In some embodiments, see Figure 2 and Figure 4 , the first placement groove 210 is provided with first guide slopes 211 that are relatively extended on both sides, or in other words, the first placement groove 210 is generally V-shaped. Similarly, the first placement groove 210 is provided with first guide slopes 211 that are relatively extended on both sides, or in other words, the first placement groove 210 is generally V-shaped. It can be understood that the first placement groove 210 and the second placement groove 410 adopt the above-mentioned structural form. The first placement groove 210 and the second placement groove 410 can be flexibly adapted to place silicon pillars 600 of various diameters. Thus, the heating mechanism 300 can more conveniently heat silicon pillars 600 of various diameters. Moreover, the placement openings of the first placement groove 210 and the second placement groove 410 are relatively large, so that the silicon pillars 600 can be more conveniently placed in the first placement groove 210 and the second placement groove 410, or the silicon pillars 600 can be more conveniently removed from the first placement groove 210 and the second placement groove 410.

[0043] In some embodiments, see Figure 2 and Figure 4 When the second carrier 400 places the silicon pillar 600 on the first carrier 200, the first placement groove 210 and the second placement groove 410 are partially offset. Specifically, the bottom of the second placement groove 410 is located directly above the first guide slope 211. When the second placement groove 410 places the silicon pillar 600 on the first guide slope 211, the silicon pillar 600 rolls downward along the first guide slope 211, causing the silicon pillar 600 to rotate. As a result, the heating mechanism 300 located above the silicon pillar 600 can fully and evenly heat the silicon pillar 600, so that the silicon pillar 600 can be better crushed later.

[0044] Furthermore, a first support pad 220 is provided on the sidewall of the first placement groove 210 to guide the silicon pillar 600 to roll along the sidewall of the first support pad 220. Specifically, through the provision of the first support pad 220, when the silicon pillar 600 is placed on the first support pad 220, there is a sufficiently large friction force between the silicon pillar 600 and the first support pad 220, so that the silicon pillar 600 can rotate itself during the sliding process along the first guide inclined surface 211. As a result, the heating mechanism 300 located above the silicon pillar 600 can fully and evenly heat the four sides of the silicon pillar 600, so that the silicon pillar 600 can be better crushed later.

[0045] In some embodiments, see Figure 2 and Figure 4 When the second carrier 400 lifts the silicon pillar 600 from the first carrier 200, the first placement groove 210 and the second placement groove 410 are partially staggered to guide the silicon pillar 600 to roll along the sidewall of the second placement groove 410. Specifically, the bottom of the second placement groove 410 is located directly below the first guide slope 211. When the second placement groove 410 lifts the silicon pillar 600 from the first placement groove 210, the silicon pillar 600 rolls downward along the second placement groove 410, causing the silicon pillar 600 to rotate. As a result, the heating mechanism 300 located above the silicon pillar 600 can fully and evenly heat the four sides of the silicon pillar 600, so that the silicon pillar 600 can be better crushed later.

[0046] Furthermore, a second support pad 420 is provided on the sidewall of the second placement groove 410 to guide the silicon pillar 600 to roll along the sidewall of the second support pad 420. Specifically, through the provision of the second support pad 420, there is a sufficiently large friction between the silicon pillar 600 and the second support pad 420, so that the silicon pillar 600 can rotate itself during the sliding process along the second guide inclined surface 411. As a result, the heating mechanism 300 located above the silicon pillar 600 can fully and evenly heat the four sides of the silicon pillar 600, thereby performing high-temperature treatment on the four sides of the silicon pillar 600, and then conveniently crushing the silicon pillar 600.

[0047] In some embodiments, see Figure 1 、 Figure 2 and Figure 5The second carrier 400 includes a feed section 430, an intermediate section 440, and a discharge section 450, with the feed section 430 and the discharge section 450 being equidistant. The intermediate section 326 is connected between the feed section 324 and the discharge section 325; the length of the intermediate section 326 is X1, and the lengths of the feed section 324 and the discharge section 325 are X2, where X1 = nX2, and n is greater than or equal to 1. When the feed section 430 is extended relative to the first carrier 200, the discharge section 450 is aligned with the first carrier 200; alternatively, when the discharge section 450 is extended relative to the first carrier 200, the feed section 430 is aligned with the first carrier 200.

[0048] Specifically, during the feeding phase, the drive module 500 drives the second carrier 400 to move a set distance to the left. At this time, the feeding section 430 is in an extended position relative to the first carrier 200, and an external device can add silicon pillars 600 to the feeding section 430. At the same time, the discharging section 450 is aligned with the first carrier 200, and the second carrier 400 simultaneously carries each silicon pillar 600 on the first carrier 200. During the discharging phase, the drive module 500 drives the second carrier 400 to move a set distance to the right. At this time, the discharging section 450 is in an extended position relative to the first carrier 200, and an external device can grab the silicon pillars 600 from the discharging section 450. At the same time, the feeding section 430 is aligned with the first carrier 200, thereby placing the received silicon pillars 600 on the first carrier 200.

[0049] During the feeding phase, the middle section 440 carries the silicon pillars 600 on the first carrier 200. During the discharging phase, the middle section 440 shifts the silicon pillars 600 to the right by a set distance and replaces them in the first placement slot 210 of the first carrier 200. Thus, the middle section 440 continuously shifts the silicon pillars 600 on the first carrier 200 to the right during the feeding and discharging phases.

[0050] The present application also discloses a crushing device, comprising the above-mentioned heating device, cooling device and crushing device, wherein the cooling device is used to receive the silicon column 600 transmitted from the heating device and cool it; the crushing device is used to receive the silicon column transmitted from the cooling device and crush it.

[0051] In specific applications, the silicon column 600 to be heated is placed in the feed section 430 of the second carrier 400. The second carrier 400 transfers the silicon column 600 to the first carrier and moves it in the heating mechanism 300. The heating mechanism 500 fully heats the silicon column 600. The heated silicon column 600 is transferred to the cooling device 400 through the discharge section 450. The cooling device 400 cools the silicon column 600. The cooled silicon column 600 is transferred to the feeding device 100. The handling robot 300 grabs the silicon column 600 to be crushed from the feeding device 100 and puts it into the crushing device 200 to crush the silicon column 600.

[0052] The technical means disclosed in the solutions of the present invention are not limited to those disclosed in the above-mentioned embodiments, but also include technical solutions composed of any combination of the above-mentioned technical features. It should be noted that those skilled in the art may make various improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A heating device, characterized in that: include: Machine; A first carrier is disposed on the machine, wherein the first carrier is provided with a plurality of first placement slots in sequence along its extension direction; a heating mechanism, provided on the machine platform, for heating the silicon pillar on the first carrier; A second carrier is provided on the machine, wherein the first carrier and the second carrier are arranged side by side, and the second carrier is provided with a plurality of second placement slots in sequence along its extension direction; The driving module is disposed on the machine platform and is used to drive the second carrier to move along its length direction and up and down directions, so as to sequentially transfer the silicon columns along the extension direction of the first carrier through the second carrier.

2. The heating device according to claim 1, characterized in that Two sides of the first placement groove are provided with first guiding inclined surfaces that are relatively extended; two sides of the second placement groove are provided with second guiding inclined surfaces that are relatively extended.

3. The heating device according to claim 2, characterized in that When the second carrier places the silicon column on the first carrier, the first placement groove and the second placement groove are partially staggered.

4. The heating device according to claim 2 or 3, characterized in that A first support pad is provided on the side wall of the first placement groove, for guiding the silicon column to roll along the side wall of the first support pad.

5. The heating device according to claim 2, characterized in that When the second carrier lifts the silicon column from the first carrier, the first placement groove and the second placement groove are partially staggered to guide the silicon column to roll along the side wall of the second placement groove.

6. The heating device according to claim 2 or 5, characterized in that A second support pad is provided on the side wall of the first placement groove, which is used to drive the silicon column to roll along the side wall of the second support pad.

7. The heating device according to claim 1, characterized in that A plurality of the second carriers and a plurality of the first carriers are provided, and the plurality of the second carriers and the plurality of the first carriers are arranged in an alternating manner.

8. The heating device according to claim 1, characterized in that The second carrier includes a feed section and a discharge section, and the feed section and the discharge section are arranged at equal distances. When the feed section extends relative to the first carrier, the discharge section is aligned with the first carrier; or, when the discharge section extends relative to the first carrier, the feed section is aligned with the first carrier.

9. The heating device according to claim 8, characterized in that The second carrier further includes a middle section connected between the feed section and the discharge section; wherein the length of the middle section is X1, and the lengths of the feed section and the discharge section are X2, X1=nX2, and n is greater than or equal to 1.

10. A polysilicon crushing device, characterized in that: include: The heating device according to any one of claims 1 to 9: a cooling device, configured to receive and cool the silicon column transmitted from the heating device; The crushing device is used to receive the silicon columns transmitted from the cooling device and crush them.

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