Carrier heating device, carrier, and heating system

Abstract

The present disclosure discloses a carrier heating device, a carrier, and a heating system. The carrier heating device comprises a base, a carrier frame heating plate, and a carrier plate heating plate. The carrier frame heating plate is connected to one side of the base. The carrier frame heating plate has a carrier frame heating surface facing away from the base, and the carrier frame heating surface is configured to contact a carrier frame bottom surface. The carrier plate heating plate is connected to a side of the carrier frame heating plate away from the base. The carrier plate heating plate has a carrier plate heating surface facing away from the base, and the carrier plate heating surface is configured to contact a carrier plate bottom surface. A vertical projection of the carrier plate heating plate on the carrier frame heating plate does not overlap with the carrier frame heating surface.

Description

Carrier heating device, carrier and heating system

[0001] Cross-reference to related applications

[0002] The present disclosure is based on and claims priority from Chinese Patent Application No. 202422375068.X filed on September 27, 2024, the contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of vacuum coating technology, and in particular to a carrier heating device, a carrier and a heating system. BACKGROUND

[0004] In the production process of photovoltaic cells, a coating process of a substrate is involved. In the coating process, effective heating of the substrate on the carrier is an important link to ensure the performance of the cell. SUMMARY

[0005] A first aspect of the embodiments of the present disclosure provides a carrier heating device, including a base, a carrier frame heating plate and a carrier plate heating plate. The carrier frame heating plate is connected to one side of the base, and the carrier frame heating plate has a carrier frame heating surface facing away from the base, which is used to contact the bottom surface of the carrier frame. The carrier plate heating plate is connected to the side of the carrier frame heating plate away from the base, and the carrier plate heating plate has a carrier plate heating surface facing away from the base, which is used to contact the bottom surface of the carrier plate. The vertical projection of the carrier plate heating plate on the carrier frame heating plate does not overlap the carrier frame heating surface.

[0006] The carrier heating device provided by the embodiments of the present disclosure provides support for the carrier frame heating plate and the carrier plate heating plate. Since the vertical projection of the carrier plate heating plate on the carrier frame heating plate does not overlap the carrier frame heating surface, the carrier frame heating surface and the carrier plate heating surface can provide mutual avoidance. Thus, after the carrier is placed on the carrier heating device, the carrier frame heating surface can contact the bottom surface of the carrier frame, and the carrier plate heating surface can contact the bottom surface of the carrier plate.

[0007] Thus, the carrier frame heating surface can heat the bottom surface of the carrier frame. Since the carrier plate is arranged on the carrier frame, heat is conducted to the carrier plate and then to the substrate on the carrier plate. At the same time, the carrier plate heating surface also heats the bottom surface of the carrier plate, and heat is directly conducted to the substrate through the carrier plate. Thus, the carrier can be heated by contact, and the heating effect is good.

[0008] In a possible implementation manner of the present disclosure, the carrier frame heating plate has an invalid area opposite the carrier plate heating plate, the vertical projection of the carrier plate heating plate on the carrier frame heating plate is located in the invalid area, and the carrier frame heating surface surrounds the invalid area.

[0009] In this way, the vertical projection of the carrier plate heating plate on the carrier frame heating plate is located in the invalid area, and the carrier frame heating surface surrounds the invalid area, so that the carrier plate heating plate can avoid the carrier frame heating surface. Since the carrier frame heating surface surrounds the invalid area, the carrier frame heating surface is also frame-shaped, similar to the carrier frame bottom surface, so that the carrier frame heating surface and the carrier frame bottom surface are more matched, facilitating heating of the carrier frame bottom surface.

[0010] In a possible implementation of the present disclosure, the invalid area includes a plurality of sub-areas arranged at intervals and opposite to the carrier plate heating plate. The carrier plate heating plate includes a plurality of heating sub-plates, which are arranged in correspondence with the plurality of sub-areas, and the vertical projection of the heating sub-plate on the carrier frame heating plate is located in the corresponding sub-area. The side surface of the plurality of heating sub-plates away from the base constitutes the carrier plate heating surface.

[0011] In this way, it can be applied to different types of carrier frame forms, and the carrier frame heating plate can heat the carrier frame bottom surface.

[0012] In a possible implementation of the present disclosure, a strip-shaped hole is formed on the side surface of the heating sub-plate, and the opening of the strip-shaped hole extends in a direction away from each other of the plurality of heating sub-plates.

[0013] In this way, when the heating sub-plate is deformed by heat, the strip-shaped hole can guide the deformation direction of the heating sub-plate, so that the heating sub-plate deforms in a direction away from each other, avoiding the gap between the heating sub-plates to narrow, and ensuring that part of the carrier frame can smoothly pass through the gap between the heating sub-plates and contact the carrier frame heating surface.

[0014] In a possible implementation of the present disclosure, the sub-area has an opening penetrating through the carrier frame heating plate.

[0015] By forming an opening in the sub-area, the production material of the carrier frame heating plate can be reduced without affecting the heating of the carrier frame bottom surface by the carrier frame heating plate, thereby reducing the material cost.

[0016] In a possible implementation of the present disclosure, the carrier frame heating plate includes a plurality of first strips and at least one second strip, and the plurality of first strips are sequentially connected end to end to form a closed first frame structure. The at least one second strip is arranged in the first frame structure and connected with the first strips; the side surface of the first strips and the second strips away from the base includes the carrier frame heating surface; and the first strips and the second strips form a plurality of openings.

[0017] By arranging the carrier plate heating plate in the form of the first strips and the second strips, it is suitable for the frame strip structure of the carrier frame, and facilitates heating of the carrier frame bottom surface.

[0018] In a possible implementation of the present disclosure, the leveling assembly is further included, and at least one leveling assembly is connected between the base and at least one of the carrier frame heating plate and the carrier plate heating plate; the leveling assembly is configured to drive at least one of the carrier frame heating plate and the carrier plate heating plate to move relative to the base in a direction perpendicular to the plane on which the carrier is located.

[0019] By arranging the leveling assembly, the flatness of the carrier frame heating plate can be adjusted to facilitate the contact between the carrier frame heating surface and the carrier frame bottom surface; and / or the flatness of the carrier plate heating plate can be adjusted to facilitate the contact between the carrier plate heating surface and the carrier plate bottom surface.

[0020] In a possible implementation of the present disclosure, the leveling assembly includes a connecting part and an adjusting part, the connecting part is connected to the base, and the connecting part is configured to move along the arrangement direction of the base and the carrier frame heating plate, and the adjusting part is arranged on the side of the connecting part away from the base and is threadedly connected to the connecting part.

[0021] The side of the connecting part away from the base is abutted against the carrier frame heating plate, the first through hole is arranged on the carrier frame heating surface, the adjusting part is partially arranged in the first through hole, the end of the adjusting part away from the connecting part has an abutting part, and the abutting part is abutted against the side on which the carrier frame heating surface is located; and / or,

[0022] The side of the connecting part away from the base is abutted against the carrier plate heating plate, the second through hole is arranged on the carrier plate heating surface, the adjusting part is partially arranged in the second through hole, the end of the adjusting part away from the connecting part has an abutting part, and the abutting part is abutted against the side on which the carrier plate heating surface is located.

[0023] By the above arrangement, at least one of the carrier frame heating surface and the carrier plate heating surface can be raised or lowered by adjusting the connecting part and the adjusting part, so as to adjust the flatness of the carrier frame heating surface and the carrier plate heating surface. Meanwhile, the relative distance between the carrier frame heating surface and the carrier plate heating surface can also be adjusted to adapt to different types of carriers.

[0024] In a possible implementation of the present disclosure, the carrier heating device further includes a carrier frame heat reflecting plate and / or a carrier plate heat reflecting plate. The carrier frame heat reflecting plate is arranged between the carrier frame heating plate and the base and opposite to the carrier frame heating plate; and / or the carrier plate heat reflecting plate is arranged between the carrier plate heating plate and the base and opposite to the carrier plate heating plate.

[0025] By the above arrangement, the heat radiated by the carrier frame heating plate to the carrier frame heat reflecting plate can be reflected to the carrier frame heating plate, and / or the heat radiated by the carrier plate heating plate to the carrier plate heat reflecting plate can be reflected to the carrier plate heating plate, so as to improve the utilization rate of heat.

[0026] The second aspect of the embodiments of the present disclosure provides a carrier, comprising a carrier frame and a carrier plate, the carrier frame has a carrier frame bottom surface, the carrier frame bottom surface has a through hole for avoiding the carrier plate, the carrier frame bottom surface is configured to be arranged opposite to and in contact with a carrier frame heating surface of a carrier heating device. The carrier plate is connected to a side of the carrier frame away from the carrier frame bottom surface, the carrier plate has a carrier plate bottom surface, a vertical projection of the carrier plate bottom surface on the carrier frame is located in the through hole for avoiding the carrier plate, and the carrier plate bottom surface is configured to be arranged opposite to and in contact with a carrier plate heating surface of the carrier heating device through the through hole for avoiding the carrier plate.

[0027] In the carrier provided by the embodiments of the present disclosure, the carrier frame provides support for the carrier plate, and a substrate can be placed on the carrier plate. Since the carrier frame heating surface heats the carrier frame bottom surface, and the carrier plate is arranged on the carrier frame, heat is conducted to the carrier plate and then to the substrate on the carrier plate. Meanwhile, the carrier plate heating surface also heats the carrier plate bottom surface, and heat is directly conducted to the substrate through the carrier plate. By using the contact heating mode, the heating effect can be improved.

[0028] In a possible implementation of the present disclosure, the carrier further comprises a pressing member, the pressing member comprises a body part and a pressing part, the body part passes through the carrier plate and is connected to the carrier frame, and the pressing part is connected to an end of the body part away from the carrier frame and abuts against the side of the carrier plate away from the carrier frame.

[0029] By arranging the pressing member, the carrier plate is pressed on the carrier frame, so that the vibration frequency of the carrier plate on the carrier frame can be reduced or the carrier plate can be prevented from vibrating on the carrier frame during transportation of the carrier, thereby ensuring stable transportation of the carrier plate.

[0030] In a possible implementation of the present disclosure, the carrier further comprises a first connecting member and a second connecting member, the first connecting member is arranged in the through hole for avoiding the carrier plate and is connected to the carrier frame. The second connecting member is arranged on a side of the carrier frame away from the first connecting member and is connected to the carrier frame. The body part passes through the carrier plate and is connected to the first connecting member and the second connecting member respectively.

[0031] In this way, the pressing member can be connected to the carrier frame through the first connecting member and the second connecting member. Since the first connecting member and the second connecting member are respectively located on the inner side and the outer side of the carrier frame, the stability of the connection of the pressing member can be improved, and the vibration reduction effect of the carrier plate can be improved.

[0032] In a possible implementation of the present disclosure, the carrier frame comprises a plurality of frame strips, the plurality of frame strips comprise a plurality of first frame strips and at least one second frame strip, the plurality of first frame strips are sequentially connected end to end to form a closed second frame structure. The at least one second frame strip is arranged in the second frame structure and is connected to the first frame strips, and the first frame strips and the second frame strips form a plurality of through holes for avoiding the carrier plate. The bottom surface opposite to the carrier frame heating surface of the first frame strips and the second frame strips constitutes the carrier frame bottom surface.

[0033] By setting the carrier frame as the first frame structure and the second frame strip structure, the stability of the carrier frame as a whole can be improved, and the carrier plate can be better supported.

[0034] In a possible implementation of the present disclosure, the adjacent frame strips are connected through the mortise and tenon structure.

[0035] The mortise and tenon structure is used to connect the adjacent frame strips, so that the stability of the connection can be improved.

[0036] In a possible implementation of the present disclosure, in a plane of the frame strip perpendicular to the extension direction of the frame strip, the dimension of the frame strip in a direction perpendicular to the plane in which the carrier is located is greater than the dimension of the frame strip in a direction parallel to the plane in which the carrier is located.

[0037] In this way, the probability of deformation of at least one of the first frame strip and the second frame strip can be reduced, and the stability of the overall structure of the carrier frame can be ensured.

[0038] In a possible implementation of the present disclosure, the frame strip includes a plurality of frame plates stacked in a stacking direction, and the stacking direction is perpendicular to the extension direction of the frame strip and parallel to the plane in which the carrier is located.

[0039] In this way, the production and manufacture of the frame strip can be facilitated.

[0040] In a possible implementation of the present disclosure, the carrier further includes a third connecting piece, the third connecting piece is arranged in the avoiding area, the third connecting piece is arranged at the intersection of the adjacent frame strips, and the third connecting piece is connected to the adjacent frame strips.

[0041] The third connecting piece is arranged at the intersection of at least one of the adjacent first frame strip, the adjacent second frame strip, and the adjacent first frame strip and the second frame strip, so that the stability of the connection between the frame strips can be improved.

[0042] The third aspect of the embodiments of the present disclosure further provides a heating system, including a carrier heating device and a carrier, the carrier heating device being the carrier heating device mentioned in any of the above embodiments. The carrier is the carrier mentioned in any of the above embodiments; the carrier is arranged on the carrier heating device, and a carrier frame heating surface of the carrier heating device is in contact with a carrier frame bottom surface of the carrier, and a carrier plate heating surface of the carrier heating device is in contact with a carrier plate bottom surface of the carrier.

[0043] In the heating system provided by the embodiments of the present disclosure, the carrier frame heating surface can heat the carrier frame bottom surface, and the carrier plate heating surface can heat the carrier plate bottom surface, so that the entire carrier can be heated by the carrier heating device, and a better heating effect on the carrier plate can be achieved.

[0044] In a possible implementation of the present disclosure, the carrier frame heating surface is adapted to the carrier frame bottom surface; and / or, the carrier plate heating surface is adapted to the carrier plate bottom surface.

[0045] In this way, the carrier frame heating surface can better adhere to the carrier frame bottom surface for heating, achieving better heating effect. And / or, the carrier plate heating surface can better adhere to the carrier plate bottom surface for heating, achieving better heating effect. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the specific embodiments of the present disclosure or the prior art, the drawings needed to be used in the specific embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0047] FIG. 1 is a partial cross-sectional view of a heating system according to an embodiment of the present disclosure;

[0048] FIG. 2 is an exploded view of a carrier heating device according to an embodiment of the present disclosure;

[0049] FIG. 3 is a top view of a carrier heating device according to an embodiment of the present disclosure;

[0050] FIG. 4 is a cross-sectional view of a leveling assembly and a carrier plate, a carrier frame, and a base according to an embodiment of the present disclosure;

[0051] FIG. 5 is another cross-sectional view of a leveling assembly and a carrier plate, a carrier frame, and a base according to an embodiment of the present disclosure;

[0052] FIG. 6 is an external structure view of a carrier according to an embodiment of the present disclosure;

[0053] FIG. 7 is an external structure view of a carrier frame according to an embodiment of the present disclosure;

[0054] FIG. 8 is a partial enlarged view of a pressing piece and a carrier frame and a carrier plate according to an embodiment of the present disclosure;

[0055] FIG. 9 is another partial enlarged view of a pressing piece and a carrier frame and a carrier plate according to an embodiment of the present disclosure;

[0056] FIG. 10 is a partial enlarged view of a second connecting piece provided with an inclined surface according to an embodiment of the present disclosure;

[0057] FIG. 11 is a partial enlarged view of a first frame strip and a second frame strip connected by a mortise and tenon structure according to an embodiment of the present disclosure;

[0058] FIG. 12 is another partial enlarged view of a first frame strip and a second frame strip connected by a mortise and tenon structure according to an embodiment of the present disclosure;

[0059] FIG. 13 is a partial enlarged view of frame plates on a frame strip connected to each other according to an embodiment of the present disclosure;

[0060] Fig. 14 is another partial enlarged view of the connection between the frame plates on the frame strip according to an embodiment of the present disclosure;

[0061] Fig. 15 is a cross-sectional view of the connection between the frame plates on the frame strip according to an embodiment of the present disclosure;

[0062] Fig. 16 is a partial enlarged view of the connection between the third connecting member and the frame strip according to an embodiment of the present disclosure;

[0063] Fig. 17 is another partial enlarged view of the connection between the third connecting member and the frame strip according to an embodiment of the present disclosure;

[0064] Fig. 18 is yet another partial enlarged view of the connection between the third connecting member and the frame strip according to an embodiment of the present disclosure.

[0065] Legend: 01 - heating system; 1 - carrier heating device; 11 - base; 111 - bearing plate; 1111 - body plate; 1112 - bearing block; 112 - lifting seat; 12 - carrier frame heating plate; 121 - carrier frame heating surface; b - opening; d - first through hole; 122 - first plate strip; 123 - second plate strip; 13 - carrier plate heating plate; 131 - carrier plate heating surface; e - second through hole; 132 - heating sub-plate; c - strip-shaped hole; a - invalid area; a1 - sub-area; 14 - leveling assembly; 141 - connecting part; 1411 - connecting column; 1412 - adjusting column; 142 - adjusting part; 1421 - abutting part; 15 - carrier frame heat reflecting plate; 16 - carrier plate heat reflecting plate; 2 - carrier; f - avoiding area; 211 - carrier frame bottom surface; W - frame strip; W1 - frame plate; 212 - first frame strip; 213 - second frame strip; 22 - carrier plate; 221 - carrier plate bottom surface; 222 - sub-plate block; 23 - pressing member; 231 - body part; B1 - first body column; B2 - second body column; 232 - pressing part; 24 - first connecting member; 25 - second connecting member; 251 - inclined surface; C1 - first screw; C2 - first anti-loosening top screw; C3 - second screw; C4 - second anti-loosening top screw; C5 - third screw; D1 - anti-collision block; F - mortise and tenon structure; F1 - protruding part; F2 - recessed part; 26 - third connecting member; 261 - first connecting plate; 262 - second connecting plate. DETAILED DESCRIPTION

[0066] In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the specific technical solutions of the present disclosure will be further described in detail below with reference to the drawings in the embodiments of the present disclosure. The following embodiments are used to illustrate the present disclosure but not to limit the scope of the present disclosure.

[0067] In the embodiments of the present disclosure, the terms "first", "second" are used only for descriptive purposes, and cannot be construed as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0068] In addition, in the embodiments of the present disclosure, the orientation terms such as "upper", "lower", "left" and "right" are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0069] In the embodiments of the present disclosure, unless otherwise explicitly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through intermediate medium.

[0070] In the embodiments of the present disclosure, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device. Without more limitations, the element defined by the sentence "including a…" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0071] In the embodiments of the present disclosure, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design presented as "exemplary" or "for example" in the embodiments of the present disclosure should not be construed as being more preferred or advantageous than other embodiments or designs. Rather, the use of the words "exemplary" or "for example" is intended to present concepts in a concrete manner.

[0072] The production process of the battery piece mainly involves heating and coating of the substrate. Specifically, the substrate is placed on a carrier, and the carrier can be transported on a conveying line. During the transportation, the carrier passes through a heating space, and the substrate is heated in the heating space to facilitate subsequent coating process of the substrate.

[0073] In the related art, a heating device is arranged in a heating space, and the heating device is arranged opposite and spaced apart from the carrier, so as to heat the carrier and the substrate by a non-contact heating mode, and facilitate subsequent conveying of the carrier. However, the non-contact heating mode has poor heating effect.

[0074] Based on this, as shown in FIG. 1 and FIG. 2, the present disclosure provides a heating system 01, which comprises a carrier 2 and a carrier heating device 1. The carrier 2 is used to carry a substrate. The carrier heating device 1 has a carrier frame heating surface 121 and a carrier plate heating surface 131. The carrier frame heating surface 121 is in contact with a carrier frame bottom surface 211 of the carrier 2. The carrier plate heating surface 131 is in contact with a carrier plate bottom surface 221 of the carrier 2.

[0075] The substrate can include a silicon wafer, for example, a single crystal silicon wafer or a polycrystalline silicon wafer, etc. Of course, the substrate can also be any other suitable sheet structure.

[0076] In this way, the carrier frame heating surface 121 can heat the carrier frame bottom surface 211. The heat is conducted to the carrier plate 22 through the part (part of the bottom surface of the carrier plate 22) of the carrier frame 21 in contact with the carrier plate 22, and then to the substrate on the carrier plate 22. The carrier plate heating surface 131 can heat the carrier plate bottom surface 221. The heat is directly conducted to the substrate through the carrier plate bottom surface 221. In this way, the entire carrier 2 is heated by the carrier heating device 1, achieving better heating effect of the carrier plate 22. Compared with the non-contact heating mode, the present disclosure adopts contact heating, which can achieve better heating effect.

[0077] In some embodiments, as shown in FIG. 1, the carrier frame heating surface 121 is adapted to the carrier frame bottom surface 211. In this way, the carrier frame heating surface 121 can achieve better heating of the carrier frame 21, thereby ensuring the heating efficiency of the substrate.

[0078] It can be understood that the carrier frame heating surface 121 is adapted to the carrier frame bottom surface 211, which means that the shape of the carrier frame heating surface 121 is consistent with the shape of the carrier frame bottom surface 211, and the carrier frame heating surface 121 can be perfectly combined with the entire carrier frame bottom surface 211 for heating.

[0079] In some embodiments, as shown in FIG. 1, the carrier plate heating surface 131 is adapted to the carrier plate bottom surface 221. In this way, the carrier plate heating surface 131 can achieve better heating of the carrier plate 22, thereby ensuring the heating efficiency of the substrate.

[0080] It should be explained that the carrier plate heating surface 131 is adapted to the carrier plate bottom surface 221, which means that the shape of the carrier plate heating surface 131 is consistent with the shape of the part of the carrier plate bottom surface 221 not covered by the carrier frame 21, and the carrier plate heating surface 131 is perfectly combined with the part of the carrier plate bottom surface 221 not covered by the carrier frame 21 for heating.

[0081] In some embodiments, as shown in FIG. 1, the carrier frame heating surface 121 is adapted to the carrier frame bottom surface 211, and the carrier plate heating surface 131 is adapted to the carrier plate bottom surface 221. In this way, the carrier frame heating surface 121 can achieve better heating of the carrier frame 21, thereby ensuring the heating efficiency of the substrate. At the same time, the carrier plate heating surface 131 can achieve better heating of the carrier plate 22, thereby ensuring the heating efficiency of the substrate.

[0082] Based on the above design idea, the present disclosure also provides a carrier heating device 1 and a carrier 2, respectively. The following will be described in detail.

[0083] For the carrier heating device 1, as shown in FIG. 1 and FIG. 2, the carrier heating device 1 in some embodiments of the present disclosure includes a base 11, a carrier frame heating plate 12, and a carrier plate heating plate 13. The carrier frame heating plate 12 is connected to one side of the base 11, and the carrier frame heating plate 12 has a carrier frame heating surface 121 facing away from the base 11, which is used to contact the carrier frame bottom surface 211. The carrier plate heating plate 13 is connected to the side of the carrier frame heating plate 12 away from the base 11, and the carrier plate heating plate 13 has a carrier plate heating surface 131 facing away from the base 11, which is used to contact the carrier plate bottom surface 221. The vertical projection of the carrier plate heating plate 13 on the carrier frame heating plate 12 does not overlap the carrier frame heating surface 121.

[0084] It can be understood that the carrier plate heating plate 13 connected to the side of the carrier frame heating plate 12 away from the base 11 can be that the carrier plate heating plate 13 is connected to the carrier frame heating plate 12, or the carrier plate heating plate 13 can be connected to the base 11.

[0085] In some examples, as shown in FIG. 2, the base 11 includes a bearing plate 111 and a lifting seat 112, the bearing plate 111 is arranged on the lifting seat 112, the lifting seat 112 can drive the bearing plate 111 to lift, and the carrier frame heating plate 12 and the carrier plate heating plate 13 are connected to the side of the bearing plate 111 away from the lifting seat 112. In this way, the bearing plate 111 can facilitate the connection of the carrier frame heating plate 12 and the carrier plate heating plate 13, and the lifting seat 112 can drive the carrier frame heating plate 12 and the carrier plate heating plate 13 to lift. When the carrier 2 passes through the carrier heating device 1, the bearing plate 111 drives the carrier frame heating plate 12 and the carrier plate heating plate 13 to rise, so that the carrier frame heating surface 121 contacts the carrier frame bottom surface 211, and the carrier plate heating surface 131 contacts the carrier plate bottom surface 221. After heating is completed, the carrier frame heating plate 12 and the carrier plate heating plate 13 are lowered again, so that the carrier 2 can continue to be transmitted.

[0086] In some examples, as shown in FIG. 1, the carrier plate 111 includes a body plate 1111 and a plurality of carrier blocks 1112 arranged around the body plate 1111, the body plate 1111 is connected with the lifting seat 112, the carrier blocks 1112 are connected at the bottom edge of the body plate 1111, the carrier frame heating plate 12 is connected with the carrier blocks 1112, and the carrier plate heating plate 13 is connected with the body plate 1111. In this way, the carrier frame heating plate 12 can be arranged in the form of surrounding the carrier plate heating plate 13, which facilitates the connection of the two with the carrier plate 111.

[0087] Through the above arrangement, the base 11 provides support for the carrier frame heating plate 12 and the carrier plate heating plate 13. Since the vertical projection of the carrier plate heating plate 13 on the carrier frame heating plate 12 does not overlap the carrier frame heating surface 121, the carrier frame heating surface 121 and the carrier plate heating surface 131 can provide mutual avoidance, so that after the carrier 2 is placed on the carrier heating device 1, the carrier frame heating surface 121 can be in contact with the carrier frame bottom surface 211, and the carrier plate heating surface 131 can be in contact with the carrier plate bottom surface 221.

[0088] In this way, the carrier frame heating surface 121 can heat the carrier frame bottom surface 211, and since the carrier plate 22 is arranged on the carrier frame 21, heat will be conducted to the carrier plate 22, and then to the substrate on the carrier plate 22. At the same time, the carrier plate heating surface 131 also heats the carrier plate bottom surface 221, and the heat is directly conducted to the substrate through the carrier plate 22. In this way, the carrier 2 as a whole can be heated by contact, and the heating effect is good.

[0089] On this basis, in some embodiments, as shown in FIG. 1 and FIG. 3, the carrier frame heating plate 12 has an invalid area a opposite to the carrier plate heating plate 13, the vertical projection of the carrier plate heating plate 13 on the carrier frame heating plate 12 is located in the invalid area a, and the carrier frame heating surface 121 surrounds the invalid area a.

[0090] The vertical projection of the carrier plate heating plate 13 on the carrier frame heating plate 12 in the invalid area a can coincide with the invalid area a, or can only occupy part of the invalid area a.

[0091] In some examples, the outer contour of the invalid area a can be a regular shape such as a square or a circle, or the outer contour of the invalid area a can also be an irregular shape.

[0092] In some examples, as shown in FIG. 1, the invalid area a has an opening b penetrating through the carrier frame heating plate 12, so that the material cost of the carrier frame heating plate 12 can be reduced without affecting the heating of the carrier frame 21 by the carrier frame heating plate 12.

[0093] For example, the outer contour of the opening b coincides with the outer contour of the invalid area a, so that the material cost of the carrier frame heating plate 12 can be reduced to the maximum extent.

[0094] With the above settings, since the vertical projection of the carrier plate heating plate 13 on the carrier frame heating plate 12 is located within the invalid area a, and the carrier frame heating surface 121 surrounds the invalid area a, the carrier plate heating plate 13 can avoid the carrier frame heating surface 121 so that the carrier frame heating surface 121 can contact the bottom surface 211 of the carrier frame. And because the carrier frame heating surface 121 surrounds the invalid area a, the carrier frame heating surface 121 surrounds the carrier plate heating plate 13. Thus, the carrier frame heating surface 121 is in a frame shape, similar to the frame-shaped bottom surface 211 of the carrier frame, which can make the carrier frame heating surface 121 more fitting with the bottom surface 211 of the carrier frame and facilitate heating of the bottom surface 211 of the carrier frame.

[0095] On this basis, as shown in FIGS. 2 and 3, the invalid area a includes a plurality of sub-areas a1 arranged at intervals and opposite to the carrier plate heating plate 13. The carrier plate heating plate 13 includes a plurality of heating sub-plates 132, and the plurality of heating sub-plates 132 are correspondingly arranged with the plurality of sub-areas a1. The vertical projection of the heating sub-plate 132 on the carrier frame heating plate 12 is located within the corresponding sub-area a1. The side surfaces of the plurality of heating sub-plates 132 facing away from the base 11 constitute the carrier plate heating surface 131.

[0096] It can be understood that in this case, the carrier frame heating surface 121 includes the side surfaces of the carrier frame heating plate 12 within the area between the sub-areas a1 and the side surfaces of the carrier frame heating plate 12 within the area surrounding the plurality of sub-areas a1 at the same time.

[0097] In some examples, the number of the sub-areas a1 can be two, three, four, five, etc.

[0098] Exemplarily, both the number of the heating sub-plates 132 and the number of the sub-areas a1 are four. The four sub-areas a1 are arranged at intervals in a two-row and two-column manner. Thus, the area between the four sub-areas a1 is in a shape similar to a "plus" sign, and then the overall carrier frame heating surface 121 is in a shape similar to a "field" sign, so it is suitable for contact heating of the bottom surface 211 of the carrier frame 21 in a shape similar to a "field" sign.

[0099] Exemplarily, both the number of the heating sub-plates 132 and the number of the sub-areas a1 are two. Thus, the area between the four sub-areas a1 is in a shape similar to a "one" sign, and then the overall carrier frame heating surface 121 is in a shape similar to a "day" sign, so it is suitable for contact heating of the bottom surface 211 of the carrier frame 21 in a shape similar to a "day" sign.

[0100] With the above settings, the carrier frame heating surface 121 can be suitable for heating the carrier frame 21 with a reinforcing frame bar inside the carrier frame 21 in a shape similar to a "day" sign or a "field" sign, etc. Since such a carrier frame 21 has high structural strength, it is widely used. Therefore, this design of the carrier frame heating plate 12 has a wider range of use.

[0101] On this basis, in some embodiments, as shown in FIG. 2 and FIG. 3, a strip-shaped hole c is formed on the side surface of the heating sub-plate 132, and the opening of the strip-shaped hole c extends in the direction away from each other of the plurality of heating sub-plates 132.

[0102] It should be explained that the side surface of the heating sub-plate 132 refers to the two side surfaces of the heating sub-plate 132 arranged opposite to each other in the arrangement direction of the carrier frame heating plate 12 and the carrier plate heating plate 13.

[0103] Among them, the strip-shaped hole c can be a through hole penetrating through the heating sub-plate 132, or can also be a blind hole.

[0104] In some examples, the strip-shaped hole c is formed on each heating sub-plate 132, so that the strip-shaped hole c can guide the thermal expansion of each heating sub-plate 132.

[0105] In some examples, as shown in FIG. 3, the number of heating sub-plates 132 is four, and the four heating sub-plates 132 are arranged in two rows and two columns, and the strip-shaped holes c on the two heating sub-plates 132 arranged diagonally extend in the diagonal direction. In this way, when the heating sub-plate 132 is deformed by heating, the deformation direction of the heating sub-plate 132 will simultaneously move away from the other three heating sub-plates 132, so that the heating sub-plate 132 can be prevented from being squeezed inward, and it is ensured that the middle frame strip part of the carrier frame 21 can smoothly pass through the gap between the adjacent heating sub-plates 132 and contact the carrier frame heating surface 121.

[0106] Through the above arrangement, when the heating sub-plate 132 is deformed by heating, the strip-shaped hole c can guide the deformation direction of the heating sub-plate 132, so that the heating sub-plate 132 deforms in the direction away from each other, avoiding the gap between the adjacent heating sub-plates 132 to be narrowed, ensuring that the middle frame strip part of the carrier frame 21 can smoothly pass through the gap between the heating sub-plates 132 and contact the carrier frame heating surface 121, and improving the reliability of the carrier heating device 1 as a whole.

[0107] In some embodiments, as shown in FIG. 2, the sub-area a1 has an opening b penetrating through the carrier frame heating plate 12. In this way, since the opening b is located in the sub-area a1, the arrangement of the opening b will not affect the carrier frame heating surface 121, and will not affect the heating of the carrier frame heating plate 12 to the carrier frame 21, while reducing the material cost of the carrier frame heating plate 12.

[0108] In some examples, the outer contour of the opening b coincides with the outer contour of the sub-area a1, so that the material cost of the carrier frame heating plate 12 can be reduced to the maximum extent.

[0109] On this basis, as shown in FIG. 2, the carrier heating plate 12 comprises a plurality of first slats 122 and at least one second slat 123, the plurality of first slats 122 are sequentially connected end to end to form a closed first frame structure. The at least one second slat 123 is arranged in the first frame structure and connected with the first slats 122. The side surface of the first slats 122 and the second slat 123 away from the base 11 comprises a carrier heating surface 121. The first slats 122 and the second slat 123 form a plurality of openings b.

[0110] It can be understood that the plurality of first slats 122 and the second slat 123 should be located in a plane parallel to the plane where the carrier 2 is located, so that the assembly of the first slats 122 and the second slat 123 can be facilitated.

[0111] Among them, the number of first slats 122 can be two, three, four or five, etc.

[0112] Exemplarily, the number of first slats 122 is four, the four first slats 122 are sequentially connected end to end, and adjacent two first slats 122 are perpendicular to each other, so as to form a square frame structure.

[0113] In addition, the number of second slats 123 can be one, two, three or four, etc.

[0114] Exemplarily, the number of second slats 123 is two, and the two second slats 123 are arranged in cross perpendicular.

[0115] In some examples, adjacent two first slats 122 can be connected by a mortise and tenon structure F, or can also be fastened by screws.

[0116] In some examples, the first slats 122 and the second slat 123 can be connected by a mortise and tenon structure F, or can also be fastened by screws.

[0117] Through the above arrangement, the carrier heating plate 12 is combined by the first slats 122 and the second slat 123, and since the openings b are formed by the first slats 122 and the second slat 123, the formation of the openings b is relatively convenient. In addition, the form of the first slats 122 and the second slat 123 can also facilitate the transportation and assembly of the carrier heating plate 12.

[0118] Of course, in other embodiments, openings b can also be directly formed on the carrier frame 21.

[0119] After the carrier heating plate 12 and the carrier heating plate 13 are heated, they can be deformed, so that the carrier heating surface 121 and the carrier heating surface 131 are deformed. Therefore, in order to ensure that the carrier heating surface 121 can better contact the carrier bottom surface 211 and the carrier heating surface 131 can better contact the carrier bottom surface 221, it is necessary to ensure the flatness of the carrier heating surface 121 and the carrier heating surface 131.

[0120] Based on this, as shown in FIG. 1, in some embodiments of the present disclosure, the carrier heating device 1 further comprises a leveling assembly 14, and at least one leveling assembly 14 is connected between the base 11 and at least one of the carrier heating plate 12 and the carrier heating plate 13. In the direction perpendicular to the plane where the carrier 2 is located (the vertical direction in FIG. 1), the leveling assembly 14 is used to drive at least one of the carrier heating plate 12 and the carrier heating plate 13 to move relative to the base 11.

[0121] In some examples, a plurality of leveling assemblies 14 are arranged between the carrier heating plate 12 and the base 11, and the plurality of leveling assemblies 14 are arranged at intervals. Different leveling assemblies 14 correspond to different positions of the carrier heating plate 12. In this way, by adjusting different leveling assemblies 14, the carrier heating plate 12 at different positions can be driven to rise or fall relative to the base 11, so as to adjust the flatness of the carrier heating surface 121, so that the carrier heating surface 121 can better contact the carrier bottom surface 211. In addition, by simultaneously adjusting a plurality of leveling assemblies 14, the height of the carrier heating plate 12 as a whole can also be adjusted.

[0122] For example, the plurality of leveling assemblies 14 between the carrier heating plate 12 and the base 11 are arranged in the shape of the carrier heating surface 121.

[0123] Of course, one leveling assembly 14 can also be arranged between the carrier heating plate 12 and the base 11. In this case, the carrier heating plate 12 needs to be fixed to the base 11 by other fasteners. In this way, the distance between the carrier heating plate 12 at the corresponding position and the base 11 can be adjusted by adjusting the leveling assembly 14.

[0124] In some examples, a plurality of leveling assemblies 14 are arranged between the carrier heating plate 13 and the base 11, and the plurality of leveling assemblies 14 are arranged at intervals. Different leveling assemblies 14 correspond to different positions of the carrier heating plate 13. In this way, by adjusting different leveling assemblies 14, the carrier heating plate 13 at different positions can be driven to rise or fall relative to the base 11, so as to adjust the flatness of the carrier heating surface 131, so that the carrier heating surface 131 can better contact the carrier bottom surface 221. In addition, by simultaneously adjusting a plurality of leveling assemblies 14, the height of the carrier heating plate 13 as a whole can also be adjusted.

[0125] Exemplarily, the plurality of leveling assemblies 14 between the carrier plate heating plate 13 and the base 11 are arranged in the shape of the carrier plate heating surface 131.

[0126] Of course, one leveling assembly 14 can also be arranged between the carrier plate heating plate 13 and the base 11, in which case the carrier plate heating plate 13 needs to be fixed to the base 11 by other fasteners, so that the distance between the carrier plate heating plate 13 and the base 11 at the corresponding position can be adjusted by adjusting the leveling assembly 14.

[0127] Exemplarily, the leveling assembly 14 is connected to the base 11 and the carrier plate heating plate 13 through the opening b in the invalid area a.

[0128] Through the above arrangement, the different positions of the carrier frame heating plate 12 can be driven to move up and down relative to the base 11 by adjusting the leveling assembly 14, so as to adjust the distance between the different positions of the carrier frame heating surface 121 and the base 11, thereby adjusting the flatness of the carrier frame heating surface 121, facilitating the contact between the carrier frame heating surface 121 and the carrier frame bottom surface 211. And / or, the different positions of the carrier plate heating plate 13 can be driven to move up and down relative to the base 11 by adjusting the leveling assembly 14, so as to adjust the distance between the different positions of the carrier plate heating surface 131 and the base 11, thereby adjusting the flatness of the carrier plate heating surface 131, facilitating the contact between the carrier plate heating surface 131 and the carrier plate bottom surface 221. In this way, the heating effect of the carrier heating device 1 on the carrier 2 is ensured.

[0129] On this basis, in some embodiments, as shown in FIG. 4, the leveling assembly 14 includes a connecting part 141 and an adjusting part 142, the connecting part 141 is connected to the base 11, and the connecting part 141 can move along the arrangement direction of the base 11 and the carrier frame heating plate 12, the adjusting part 142 is arranged on the side of the connecting part 141 away from the base 11 and is threadedly connected to the connecting part 141.

[0130] As shown in FIG. 4, the side of the connecting part 141 away from the base 11 abuts against the carrier frame heating plate 12, the carrier frame heating surface 121 is provided with a first through hole d, and the adjusting part 142 is partially arranged in the first through hole d, one end of the adjusting part 142 away from the connecting part 141 is provided with an abutting part 1421 abutting against the side where the carrier frame heating surface 121 is located; and / or,

[0131] As shown in FIG. 4, the side of the connecting part 141 away from the base 11 abuts against the carrier plate heating plate 13, the carrier plate heating surface 131 is provided with a second through hole e, and the adjusting part 142 is partially arranged in the second through hole e, one end of the adjusting part 142 away from the connecting part 141 is provided with an abutting part 1421 abutting against the side where the carrier plate heating surface 131 is located.

[0132] In some examples, the connecting part 141 is threadedly connected with the base 11, so that the connecting part 141 can be lifted or lowered by rotating the connecting part 141.

[0133] In some examples, the first through hole d is a counterbore hole, the abutting part 1421 abutting against the side where the carrier heating surface 121 is located is located in the first through hole d and abuts against the step surface of the counterbore hole, so that the counterbore hole can provide a containing space for the abutting part 1421, and when the carrier heating surface 121 contacts the carrier bottom surface 211, the abutting part 1421 can avoid interfering with the contact, so that the carrier heating surface 121 can better heat the carrier 21.

[0134] In some examples, the second through hole e is a counterbore hole, the abutting part 1421 abutting against the side where the carrier heating surface 121 is located is located in the second through hole e and abuts against the step surface of the counterbore hole, so that the counterbore hole can provide a containing space for the abutting part 1421, and when the carrier heating surface 121 contacts the carrier bottom surface 211, the abutting part 1421 can avoid interfering with the contact, so that the carrier heating surface 121 can better heat the carrier 21.

[0135] In this case, for example, the second through hole e is a strip-shaped hole c, so that the second through hole e can not only guide the thermal deformation of the heating sub-plate 132, but also can realize the setting of the adjusting part 142.

[0136] Through the above setting, the position of at least one of the carrier heating surface 121 and the carrier heating surface 131 can be lifted or lowered by adjusting the connecting part 141 and the adjusting part 142, so as to adjust the flatness of at least one of the carrier heating surface 121 and the carrier heating surface 131, so that the carrier heating surface 121 can better contact and heat the carrier bottom surface 211, and / or the carrier heating surface 131 can better contact and heat the carrier bottom surface 221. At the same time, the relative distance between the carrier heating surface 121 and the carrier heating surface 131 can be adjusted to adapt to different types of carriers 2.

[0137] On this basis, as shown in FIG. 5, the connecting part 141 includes a connecting column 1411 and an adjusting column 1412, the connecting column 1411 is connected with the base 11, the adjusting column 1412 is arranged on the side of the connecting column 1411 away from the base 11 and is threadedly connected with the connecting column 1411, and the end of the adjusting part 142 close to the connecting part 141 passes through the adjusting column 1412 and is threadedly connected with the connecting column 1411.

[0138] The side of the adjusting column 1412 away from the connecting column 1411 abuts against the carrier heating plate 12, and / or the side of the adjusting column 1412 away from the connecting column 1411 abuts against the carrier heating plate 13.

[0139] By the above arrangement, the position of at least one of the carrier heating surface 121 and the carrier plate heating surface 131 can be raised or lowered by adjusting the adjusting column 1412 and the adjusting portion 142, so as to adjust the flatness of at least one of the carrier heating surface 121 and the carrier plate heating surface 131, so that the carrier heating surface 121 can better contact and heat the carrier bottom surface 211, and / or the carrier plate heating surface 131 can better contact and heat the carrier plate bottom surface 221. At the same time, the relative distance between the carrier heating surface 121 and the carrier plate heating surface 131 can also be adjusted to adapt to different types of carriers 2. In addition, since the leveling assembly 14 is connected to the base 11 through the connecting column 1411, the stability of the arrangement of the leveling assembly 14 can be improved.

[0140] In some embodiments, as shown in FIG. 1, the carrier heating device 1 further comprises a carrier heat reflecting plate 15 and / or a carrier plate heat reflecting plate 16. The carrier heat reflecting plate 15 is arranged between the carrier heating plate 12 and the base 11 and opposite to the carrier heating plate 12. And / or, the carrier plate heat reflecting plate 16 is arranged between the carrier plate heating plate 13 and the base 11 and opposite to the carrier plate heating plate 13.

[0141] In some examples, the carrier heat reflecting plate 15 can be coated with a heat reflecting material on the surface to make the carrier heat reflecting plate 15 have the heat reflecting capability.

[0142] In some examples, the carrier plate heat reflecting plate 16 can be coated with a heat reflecting material on the surface to make the carrier plate heat reflecting plate 16 have the heat reflecting capability.

[0143] In some examples, the number of the carrier heat reflecting plates 15 can be multiple, and the multiple carrier heat reflecting plates 15 are arranged in sequence and at intervals along the arrangement direction of the base 11 and the carrier 21, and the heat on the carrier heating plate 12 is reflected by the multiple carrier heat reflecting plates 15, so as to improve the utilization rate of heat.

[0144] For example, the number of the carrier heat reflecting plates 15 can be two, three, four or five, etc.

[0145] Of course, the number of the carrier heat reflecting plates 15 can also be one.

[0146] In some examples, the number of the carrier plate heat reflecting plates 16 can be multiple, and the multiple carrier plate heat reflecting plates 16 are arranged in sequence and at intervals along the arrangement direction of the base 11 and the carrier plate 22, and the heat on the carrier plate heating plate 13 is reflected by the multiple carrier plate heat reflecting plates 16, so as to improve the utilization rate of heat.

[0147] For example, the number of the carrier plate heat reflecting plates 16 can be two, three, four or five, etc.

[0148] Of course, the number of the carrier plate heat reflecting plate 16 can also be one.

[0149] Through the above arrangement, the heat radiated by the carrier frame heating plate 12 to the carrier frame heat reflecting plate 15 can be reflected to the carrier frame heating plate 12. And / or, the heat radiated by the carrier plate heating plate 13 to the carrier plate heat reflecting plate 16 can be reflected to the carrier plate heating plate 13, so as to improve the utilization rate of heat.

[0150] For the carrier 2, as shown in FIG. 1, FIG. 6, FIG. 7, some embodiments of the present disclosure provide a carrier 2 including a carrier frame 21 and a carrier plate 22. The carrier frame 21 has a carrier frame bottom surface 211, and the carrier frame bottom surface 211 has a through-carrier frame avoiding area f. The carrier frame bottom surface 211 is arranged opposite to the carrier frame heating surface 121 of the carrier heating device 1 and in contact. The carrier plate 22 is connected to the side of the carrier frame 21 away from the carrier frame bottom surface 211. The carrier plate 22 has a carrier plate bottom surface 221, and the vertical projection of the carrier plate bottom surface 221 on the carrier frame 21 is located in the avoiding area f. The carrier plate bottom surface 221 is arranged opposite to the carrier plate heating surface 131 of the carrier heating device 1 through the avoiding area f and in contact.

[0151] It can be understood that the carrier plate heating surface 131 is only in contact with the part of the carrier plate bottom surface 221 that is not blocked by the carrier frame 21.

[0152] In some examples, as shown in FIG. 6, the carrier plate 22 includes a plurality of sub-plate blocks 222, and the plurality of sub-plate blocks 222 are located in a plane parallel to the plane where the carrier 2 is located. The plurality of sub-plate blocks 222 are spliced into a whole carrier plate 22, and the bottom surface of the plurality of sub-plate blocks 222 towards the carrier plate heating surface 131 constitutes the carrier plate bottom surface 221.

[0153] For example, the number of the sub-plate blocks 222 includes four, and the four sub-plate blocks 222 are in contact with the carrier plate heating surface 131 through the avoiding area f.

[0154] In some examples, as shown in FIG. 7, a plurality of avoiding areas f are arranged, and the plurality of avoiding areas f are arranged at intervals. In this way, the whole carrier frame 21 is a frame structure with a reinforcing frame strip in the middle, which can ensure the structural strength of the whole carrier frame 21.

[0155] In some examples, the number of the avoiding areas f is four, and the number of the sub-plate blocks 222 is four. Each sub-plate block 222 corresponds to an avoiding area f, and part of the bottom surface of each sub-plate block 222 is in contact with the carrier plate heating surface 131 through the corresponding avoiding area f to be heated.

[0156] In some examples, the vertical projection of the carrier plate 22 on the carrier frame 21 coincides with the outer contour of the carrier frame 21, so that the carrier frame 21 can exactly provide support for the whole carrier plate 22.

[0157] In some examples, the carrier plate 22 further has a carrier plate top surface opposite to the carrier plate bottom surface 221, and the carrier plate top surface has a plurality of grooves for loading the substrates, so as to ensure the stability of the substrates during transportation.

[0158] Through the above arrangement, the carrier frame 21 supports the carrier plate 22, and the substrates can be placed on the carrier plate 22. Since the carrier frame heating surface 121 heats the carrier frame bottom surface 211, and the carrier plate 22 is arranged on the carrier frame 21, heat is conducted to the carrier plate 22, and then to the substrates on the carrier plate 22. At the same time, the carrier plate heating surface 131 also heats the carrier plate bottom surface 221, and heat is directly conducted to the substrates through the carrier plate 22. By using the contact heating mode, the heating effect can be improved.

[0159] In some embodiments, as shown in FIGS. 8 and 9, the carrier 2 further comprises a pressing piece 23, which comprises a body part 231 and a pressing part 232. The body part 231 passes through the carrier plate 22 and is connected to the carrier frame 21. The pressing part 232 is connected to one end of the body part 231 away from the carrier frame 21 and abuts against the side of the carrier plate 22 away from the carrier frame 21.

[0160] It can be understood that the side of the carrier plate 22 is provided with a through hole, and the pressing piece 23 passes through the carrier plate 22 through the through hole.

[0161] In some examples, a plurality of pressing pieces 23 are arranged along the edge region of the side of the carrier plate 22 away from the carrier frame 21. In this way, each pressing piece 23 can exert a pressure on the carrier plate 22 in a direction close to the carrier frame 21, so as to better press the carrier plate 22 on the carrier frame 21. In this way, during transportation of the carrier 2, the vibration frequency of the carrier plate 22 can be reduced, and the stability of the substrates during transportation can be ensured.

[0162] In some examples, the pressing part 232 is a plate structure, and the side of the plate structure abuts against the side of the carrier plate 22 away from the carrier frame 21. In this way, the abutting area can be increased, and the damping effect can be improved.

[0163] Through the above arrangement, the body part 231 connects the pressing part 232 to the carrier frame 21, and the pressing part 232 can press the carrier plate 22 on the carrier frame 21. In this way, during transportation of the carrier 2, the vibration frequency of the carrier plate 22 on the carrier frame 21 can be reduced, or the carrier plate 22 can be prevented from vibrating on the carrier frame 21, so as to ensure the stable transportation of the carrier plate 22 and the stable transportation of the substrates.

[0164] After the pressing piece 23 passes through the carrier plate 22, the pressing piece 23 can be directly connected to the carrier frame 21, or can be connected to the carrier frame 21 through the first connecting piece 24 and the second connecting piece 25.

[0165] In some embodiments, as shown in FIG. 8 and FIG. 9, the carrier 2 further comprises a first connecting piece 24 and a second connecting piece 25, the first connecting piece 24 is arranged in the avoiding area f and connected with the carrier frame 21. The second connecting piece 25 is arranged on the side of the carrier frame 21 away from the first connecting piece 24 and connected with the carrier frame 21. The body part 231 penetrates through the carrier plate 22 and connected with the first connecting piece 24 and the second connecting piece 25 respectively.

[0166] In some embodiments, the first connecting piece 24 and the second connecting piece 25 can be block-shaped structures.

[0167] In some embodiments, the first connecting piece 24 and the second connecting piece 25 are fixed on the carrier frame 21 by screw fastening.

[0168] In some embodiments, the number of the first connecting piece 24 and the second connecting piece 25 is multiple, and corresponding to the pressing piece 23.

[0169] For example, as shown in FIG. 8 and FIG. 10, the second connecting piece 25 is arranged on both sides of the carrier frame 21 in the conveying direction (X direction in FIG. 8), and the bottom of the second connecting piece 25 is an inclined surface 251, which extends towards the carrier plate 22 along the conveying direction of the carrier frame 21. In this way, the inclined surface 251 on the second connecting piece 25 can guide the conveying wheel for carrying the carrier frame 21, facilitating the stable transportation of the carrier frame 21 on the conveying line.

[0170] In some embodiments, as shown in FIG. 8, the front end of the carrier frame 21 is connected with a bumper D1 along the conveying direction of the carrier frame 21. In this way, when the carrier frame 21 moves to the end of the conveying line, the bumper D1 can prevent the carrier frame 21 from directly colliding with the end of the conveying line, thereby protecting the carrier frame 21 from damage.

[0171] In some embodiments, as shown in FIG. 8 and FIG. 9, the body part 231 comprises a first body column B1 and a second body column B2, the first body column B1 is arranged in the avoiding area f and connected with the first connecting piece 24 located in the avoiding area f, the second body column B2 is arranged on the side of the carrier frame 21 away from the first body column B1 and connected with the second connecting piece 25, and the ends of the first body column B1 and the second body column B2 away from the carrier frame 21 are connected with the pressing part 232. In this way, the arrangement of the pressing part 232 is facilitated.

[0172] In some embodiments, as shown in FIG. 8 and FIG. 9, the carrier 2 further comprises a first screw C1, the first screw C1 penetrates through the first connecting piece 24 from the side of the first connecting piece 24 away from the pressing part 232 and is threadedly connected with the first body column B1. In this way, the stability of the connection is ensured.

[0173] Exemplarily, the carrier 2 further comprises a first anti-loosening top screw C2 abutting against a top of the first screw C1 and connected with the first connecting piece 24. The first anti-loosening top screw C2 can prevent the first screw C1 from falling off, thereby ensuring the connection stability of the first connecting piece 24 and the pressing piece 23.

[0174] In some examples, as shown in FIG. 8 and FIG. 9, the carrier 2 further comprises a second screw C3 penetrating through the second connecting piece 25 from a side of the second connecting piece 25 away from the pressing portion 232 and threadedly connected with the second body column B2. In this way, the connection stability is ensured.

[0175] Exemplarily, the carrier 2 further comprises a second anti-loosening top screw C4 abutting against a top of the second screw C3 and connected with the second connecting piece 25. The second anti-loosening top screw C4 can prevent the second screw C3 from falling off, thereby ensuring the connection stability of the second connecting piece 25 and the pressing piece 23.

[0176] In this way, the pressing piece 23 can be connected with the carrier frame 21 through the first connecting piece 24 and the second connecting piece 25. Since the first connecting piece 24 and the second connecting piece 25 are respectively located on the inner side and the outer side of the carrier frame 21, the connection stability of the pressing piece 23 can be improved, the pressing stability of the pressing piece 23 can be improved, and the damping effect can be improved.

[0177] In some examples, as shown in FIG. 7, the carrier frame 21 comprises a plurality of frame strips W, which comprises a first frame strip 212 and at least one second frame strip 213. The plurality of first frame strips 212 are sequentially connected in a head-to-tail manner to form a closed second frame structure. The at least one second frame strip 213 is arranged in the second frame structure and connected with the first frame strip 212. The first frame strip 212 and the second frame strip 213 form a plurality of avoiding areas f. The bottom surface of the first frame strip 212, the second frame strip 213 and the carrier frame heating surface 121 constitutes a carrier frame bottom surface 211.

[0178] It can be understood that the plurality of first frame strips 212 and the second frame strip 213 are located in a plane parallel to the carrier frame heating surface 121. In this way, the assembly of the carrier frame 21 can be facilitated.

[0179] The number of the first frame strips 212 can be two, three, four or five, etc.

[0180] Exemplarily, the number of the first frame strips 212 is four. The four first frame strips 212 are sequentially connected in a head-to-tail manner, and adjacent two first frame strips 212 are perpendicular to each other, so as to form a square frame structure.

[0181] In addition, the number of the second frame strips 213 can be one, two, three or four, etc.

[0182] Exemplarily, the number of the second frame strips 213 is two, and the two second frame strips 213 are arranged perpendicularly.

[0183] In some examples, the material of the frame strip W can include carbon fiber. The carbon fiber has good heat conductivity, and the frame strip W made of the carbon fiber has light weight and high structural strength.

[0184] By arranging the carrier frame 21 as the first frame structure and the structure combined with the second frame strip 213, the stability of the carrier frame 21 as a whole can be improved, and the carrier plate 22 can be better supported.

[0185] In some embodiments, as shown in FIG. 11 and FIG. 12, the adjacent frame strips W are connected through the mortise and tenon structure F. In this way, the overall appearance of the carrier frame 21 can be more concise, and the connection stability is higher.

[0186] It can be understood that the adjacent frame strips W are connected through the mortise and tenon structure F, that is, at least one adjacent first frame strip 212 and / or second frame strip 213 are connected through the mortise and tenon structure F.

[0187] In some examples, as shown in FIG. 11 and FIG. 12, the mortise and tenon structure F includes a protruding portion F1 and a recessed portion F2. One of the protruding portion F1 and the recessed portion F2 is arranged on one of the adjacent frame strips W, the other of the protruding portion F1 and the recessed portion F2 is arranged on the other of the adjacent frame strips W, and the protruding portion F1 extends into the recessed portion F2, so as to achieve the connection.

[0188] In some embodiments, as shown in FIG. 11, in a plane of the frame strip W perpendicular to the extension direction of the frame strip W, the size Y of the frame strip W in a direction perpendicular to the plane in which the carrier 2 is located is greater than the size Z of the frame strip W in a direction parallel to the plane in which the carrier 2 is located.

[0189] In this way, during the transportation of the carrier 2, the probability of deformation of at least one of the first frame strip 212 and the second frame strip 213 downward can be reduced, the stability of the overall structure of the carrier frame 21 is ensured, and the support stability of the carrier frame 21 to the carrier plate 22 is ensured.

[0190] In some embodiments, as shown in FIG. 11, the frame strip W includes a plurality of frame plates W1 arranged in a stacked manner. The direction of the stacked arrangement is a direction perpendicular to the extension direction of the frame strip W and parallel to the plane in which the carrier 2 is located. In this way, the frame strip W can be produced by producing a plurality of frame plates W1 and then arranging the plurality of frame plates W1 in a stacked manner. In this way, the production and manufacturing of the frame strip W can be facilitated.

[0191] In some examples, the ratio between the size of the frame plate W1 in the Y direction and the size of the frame plate W1 in the Z direction is greater than or equal to four and less than or equal to ten. In this way, the deformation of the frame strip W downward can be better prevented.

[0192] For example, the ratio between the dimension of the frame plate W1 in the Y direction and the dimension of the frame plate W1 in the Z direction can be four, five, six, eight or ten.

[0193] In some examples, as shown in Figure 7, there are four first frame bars 212 and two second frame bars 213. Adjacent first frame bars 212 are perpendicular to each other, and two second frame bars 213 intersect each other perpendicularly, with the second frame bars 213 perpendicular to the first frame bars 212. The two first frame bars 212 located on either side of the conveying direction of the carrier 2 each include three stacked frame plates W1. The two first frame bars 212 arranged along the conveying direction of the carrier 2 each include two stacked frame plates W1. The second frame bars 213 extending along the conveying direction of the carrier 2 include one frame plate W1, and the second frame bars 213 perpendicular to the conveying direction of the carrier 2 include two stacked frame plates W1. This design minimizes the material cost of the carrier frame 21 while ensuring its overall structural strength.

[0194] In some examples, as shown in Figures 13-15, multiple frame plates W1 can be connected by the cooperation of a second connector 25 and a third screw C5. Specifically, the third screw C5 passes through the multiple frame plates W1 sequentially from the side of the frame bar W away from the second connector 25 and is threadedly connected to the second connector 25.

[0195] A nut can be installed at the tail of the third screw C5 to improve the stability of the fixation.

[0196] In addition, the number of third screws C5 can be one or more, such as two, three or four, etc.

[0197] In some embodiments, as shown in Figures 16 and 17, the vehicle 2 further includes a third connector 26, which is disposed within the clearance area f. The third connector 26 is disposed at the intersection of adjacent frame bars W and is connected to the adjacent frame bars W respectively.

[0198] In some examples, as shown in Figure 17, the first connector 24 can replace the third connector 26. That is, the first connector 24 is located at the intersection of adjacent frame bars W and is connected to the adjacent frame bars W respectively. The first connector 24 is also connected to the pressing member 23.

[0199] In some examples, as shown in Figure 18, there are two second frame bars 213. The two second frame bars 213 are arranged perpendicularly to form a cross shape, thus forming four clearance zones f. Four third connectors 26 are provided at the center intersection of the cross shape. The four third connectors 26 are respectively provided in the four clearance zones f, and the third connectors 26 are respectively connected to the adjacent second frame bars 213.

[0200] Exemplarily, a screw or the like fastener is arranged to pass through the second frame strip 213 and the two third connecting pieces 26 on both sides of the second frame strip 213, so as to fix the two third connecting pieces 26 on both sides of the second frame strip 213 on the second frame strip 213 at one time. In this case, a nut can also be arranged at the tail of the screw or the like fastener, so as to improve the stability of the connection.

[0201] Exemplarily, the carrier plate 22 comprises four sub-plate blocks 222, which correspond to the four avoiding areas f respectively, and the pressing piece 23 can also be arranged at the joint of the adjacent sub-plate blocks 222, and the pressing part 232 abuts against the adjacent sub-plate blocks 222 respectively, and the body part 231 is connected with the third connecting piece 26 in the avoiding area f of the adjacent two sub-plate blocks 222 respectively, so that the plurality of sub-plate blocks 222 can be pressed on the carrier frame 21 better.

[0202] In some examples, as shown in FIG. 18, the third connecting piece 26 comprises a first connecting plate 261 and a second connecting plate 262 connected with each other, and the first connecting plate 261 and the second connecting plate 262 are arranged at a certain angle, so that the corners of the first connecting plate 261 and the second connecting plate 262 are adapted to the intersecting corners of the adjacent frame strips W, and then the first connecting plate 261 is connected with the frame strip W to which it is attached, and the second connecting plate 262 is connected with the other frame strip W to which it is attached, so as to be arranged.

[0203] Exemplarily, the angle between the first connecting plate 261 and the second connecting plate 262 can be 80°, 85°, 90°, 95° or 100°, etc., which is arranged according to the angle of the intersecting part of the adjacent first frame strip 212 and / or the second frame strip 213.

[0204] In this way, the arrangement of the third connecting piece 26 can improve the connection strength between the adjacent first frame strip 212, the adjacent second frame strip 213, and at least one of the adjacent first frame strip 212 and the second frame strip 213, so as to ensure the structural strength of the carrier frame 21 as a whole, improve the stability of the carrier frame 21 in transportation, avoid the shaking of the carrier plate 22, and also prolong the service life of the carrier 2.

[0205] The above is only the preferred embodiment of the present disclosure, and does not limit the patent scope of the present disclosure, and any equivalent structure or equivalent flow transformation made by using the content of the specification and drawings of the present disclosure, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present disclosure.

Claims

1. A vehicle heating device, wherein, The utility model relates to a kind of heating plate for carrier, including: Base (11); Carrier frame heating plate (12) is connected to one side of the base (11), the carrier frame heating plate (12) has carrier frame heating surface (121) away from the base (11), and the carrier frame heating surface (121) is used to contact with the carrier frame bottom surface (211) of the carrier (2); Carrier plate heating plate (13) is connected to the side of the carrier frame heating plate (12) away from the base (11), and the carrier plate heating plate (13) has carrier plate heating surface (131) away from the base (11), and the carrier plate heating surface (131) is used to contact with the carrier plate bottom surface (221) of the carrier (2); The vertical projection of the carrier plate heating plate (13) on the carrier frame heating plate (12) does not overlap with the carrier frame heating surface (121).

2. The vehicle heating device of claim 1, wherein, The carrier frame heating plate (12) has invalid area (a) opposite to the carrier plate heating plate (13), and the vertical projection of the carrier plate heating plate (13) on the carrier frame heating plate (12) is located in the invalid area (a), and the carrier frame heating surface (121) surrounds the invalid area (a).

3. The vehicle heating device of claim 2, wherein, The invalid area (a) includes a plurality of subareas (a1) arranged at intervals and opposite to the carrier plate heating plate (13);The carrier plate heating plate (13) includes a plurality of heating sub-plates (132), and a plurality of the heating sub-plates (132) are arranged corresponding to a plurality of the subareas (a1), and the vertical projection of the heating sub-plate (132) on the carrier frame heating plate (12) is located in the corresponding subarea (a1);The side surface of the plurality of heating sub-plates (132) away from the base (11) constitutes the carrier plate heating surface (131).

4. The vehicle heating device of claim 3, wherein, A strip-shaped hole (c) is formed on the side surface of the heating sub-plate (132), and the opening of the strip-shaped hole (c) extends in the direction away from each other of the plurality of heating sub-plates (132).

5. The vehicle heating device according to claim 3 or 4, wherein, The subarea (a1) has an opening (b) penetrating through the carrier frame heating plate (12).

6. The vehicle heating device of claim 5, wherein, The carrier frame heating plate (12) includes: A plurality of first strips (122) are sequentially connected end to end to form a closed first frame structure; At least one second strip (123) is arranged in the first frame structure and connected with the first strip (122);The side surface of the first strip (122) and the second strip (123) away from the base (11) includes the carrier frame heating surface (121);The first strip (122) and the second strip (123) form the plurality of openings (b).

7. The carrier heating device according to any one of claims 1 to 6, wherein Further comprising leveling assembly (14), at least one leveling assembly (14) is connected between the base (11) and at least one of the carrier frame heating plate (12) and the carrier plate heating plate (13);In the direction perpendicular to the plane where the carrier (2) is located, the leveling assembly (14) is used to drive at least one of the carrier frame heating plate (12) and the carrier plate heating plate (13) to move relative to the base (11).

8. The vehicle heating device of claim 7, wherein, The leveling assembly comprises a connecting part (141) connected with the base (11), and the connecting part (141) can move along the arrangement direction of the base (11) and the carrier frame heating plate (12), and an adjusting part (142) provided on the side of the connecting part (141) away from the base (11) and threadedly connected with the connecting part (141); The side of the connecting part (141) away from the base (11) abuts against the carrier frame heating plate (12), the carrier frame heating surface (121) is provided with a first through hole (d), the adjusting part (142) is partially arranged in the first through hole (d), and one end of the adjusting part (142) away from the connecting part (141) has an abutting part (1421) abutting on the side where the carrier frame heating surface (121) is located. And / or, The side of the connecting part (141) away from the base (11) abuts against the carrier frame heating plate (12), the carrier frame heating surface (121) is provided with a first through hole (d), the adjusting part (142) is partially arranged in the first through hole (d), and one end of the adjusting part (142) away from the connecting part (141) has an abutting part (1421) abutting on the side where the carrier frame heating surface (121) is located.

9. The carrier heating device according to any one of claims 1 to 8, wherein, Also includes: A carrier frame heat reflecting plate (15) is arranged between the carrier frame heating plate (12) and the base (11) and opposite to the carrier frame heating plate (12); and / or A carrier plate heat reflecting plate (16) is arranged between the carrier plate heating plate (13) and the base (11) and opposite to the carrier plate heating plate (13).

10. A carrier, wherein, Including: A carrier frame (21) has a carrier frame bottom surface (211), the carrier frame bottom surface (211) has a avoiding area (f) penetrating through the carrier frame (21), the carrier frame bottom surface (211) is arranged opposite to the carrier frame heating surface (121) of the carrier heating device (1) and in contact; A carrier plate (22) is connected to the side of the carrier frame (21) away from the carrier frame bottom surface (211), the carrier plate (22) has a carrier plate bottom surface (221), the vertical projection of the carrier plate bottom surface (221) on the carrier frame (21) is located in the avoiding area (f), and the carrier plate bottom surface (221) is arranged opposite to and in contact with the carrier plate heating surface (131) of the carrier heating device (1) through the avoiding area (f).

11. The vehicle of claim 10, wherein, Further comprising a pressing piece (23), the pressing piece (23) comprises a body part (231) and a pressing part (232), the body part (231) penetrates through the carrier plate (22) and is connected with the carrier frame (21), and the pressing part (232) is connected to one end of the body part (231) away from the carrier frame (21) and abuts on the side of the carrier plate (22) away from the carrier frame (21).

12. The vehicle of claim 11, wherein, Further comprising: A first connecting piece (24) is arranged in the avoiding area (f) and connected with the carrier frame (21); A second connecting piece (25) is arranged on the side of the carrier frame (21) away from the first connecting piece (24) and connected with the carrier frame (21); the body part (231) penetrates the carrier plate (22) and is connected with the first connecting piece (24) and the second connecting piece (25) respectively.

13. The carrier of any one of claims 10-12, wherein, The carrier frame (21) comprises a plurality of frame strips (W), which comprise: A plurality of first frame strips (212) are connected end to end in sequence to form a closed second frame structure; At least one second frame strip (213) is arranged in the second frame structure and connected with the first frame strip (212); the first frame strip (212) and the second frame strip (213) form a plurality of avoiding areas (f); the bottom surface opposite to the carrier frame heating surface (121) of the first frame strip (212) and the second frame strip (213) constitutes the carrier frame bottom surface (211).

14. The vehicle of claim 13, wherein, The adjacent frame strips (W) are connected through a mortise and tenon structure (F).

15. The carrier of claim 13 or 14, wherein, In the plane perpendicular to the extension direction of the frame strip (W), the dimension of the frame strip (W) in the direction perpendicular to the plane of the carrier (2) is greater than the dimension of the frame strip (W) in the direction parallel to the plane of the carrier (2).

16. The vehicle of claim 15, wherein, The frame strip (W) comprises a plurality of frame plates (W1) arranged in layers, and the direction of the layered arrangement is perpendicular to the extension direction of the frame strip (W) and parallel to the plane of the carrier (2).

17. The carrier of any one of claims 13-16, wherein, The carrier (2) further comprises a third connecting piece (26), which is arranged in the avoiding area (f) and at the intersection of adjacent frame strips (W); the third connecting piece (26) is connected with adjacent frame strips (W) respectively.

18. A heating system, wherein, Comprise: The carrier heating device (1) is the carrier heating device (1) according to any one of claims 1-9; The carrier (2) is the carrier (2) according to any one of claims 10-17; the carrier (2) is arranged on the carrier heating device (1), and the carrier frame heating surface (121) of the carrier heating device (1) is in contact with the carrier frame bottom surface (211) of the carrier (2); the carrier plate heating surface (131) of the carrier heating device (1) is in contact with the carrier plate bottom surface (221) of the carrier (2).

19. The heating system of claim 18, wherein, The carrier frame heating surface (121) is matched with the carrier frame bottom surface (211); and / or, the carrier plate heating surface (131) is matched with the carrier plate bottom surface (221). The carrier frame heating surface (121) is matched with the carrier frame bottom surface (211); and / or, the carrier plate heating surface (131) is matched with the carrier plate bottom surface (221).

Images