Driving circuit and display device

Abstract

The application provides a driving circuit and a display device. The driving circuit comprises a temperature sensing circuit and a control module. The temperature sensing circuit is configured to sense an ambient temperature of the display device and output a first control signal or a second control signal according to the ambient temperature; and the control module is configured to control a heating element to heat based on the first control signal or control a heat dissipation element to dissipate heat based on the second control signal. The control module comprises a first control path and a second control path; the first control path and the second control path are connected to the temperature sensing circuit; the first control path is configured to receive the first control signal and control the heating element to heat, and the second control path is configured to receive the second control signal and control the heat dissipation element to dissipate heat. The ambient temperature of the display device is sensed by the temperature sensing circuit, and the control module is controlled to control the heating element to heat or the heat dissipation element to dissipate heat according to the ambient temperature, so that the display device is effectively dynamically temperature managed.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a driving circuit and a display device. Background Technology

[0002] 1) For automotive displays, the temperature of the display screen changes due to ambient temperature variations, affecting the system's response speed and ultimately the user experience. 2) During room-temperature image retention testing of LCDs (Liquid Crystal Displays), the backlight LEDs (Light Emitting Diodes) generate heat, causing the panel to heat up upon contact. This transforms the room-temperature image retention test into a high-temperature one, making it more prone to leaving ghosting images and negatively impacting image quality. 3) During LCD overdrive technology testing, the viscosity of the liquid crystal is highly sensitive to temperature, making test results potentially misleading and causing ghosting or blurring during use, thus affecting the user experience.

[0003] It is evident that display panels pose potential risks when affected by temperature, making it essential to control their temperature. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a driving circuit and a display device that solves the problem of how to control the temperature of the display panel in the prior art.

[0005] To solve the above-mentioned technical problems, the first technical solution provided in this application is: to provide a driving circuit, wherein, it includes:

[0006] A temperature sensing circuit is used to sense the ambient temperature of the display device and output a first control signal or a second control signal according to the ambient temperature.

[0007] The control module controls the heating element to heat based on a first control signal, or controls the heat dissipation element to dissipate heat based on a second control signal;

[0008] The control module includes a first control path and a second control path; the first control path and the second control path are connected to a temperature sensing circuit; the first control path is used to receive a first control signal to control the heating element to heat up, and the second control path is used to receive a second control signal to control the heat dissipation element to dissipate heat.

[0009] The first control path includes a first switch and a first Zener diode connected in series.

[0010] The control terminal of the first switch receives the first control signal, one end of the first switch is connected to the cathode of the first Zener diode, and the other end of the first switch is connected to the heating element.

[0011] The second control path includes a second switch, a current-limiting switch, a diode, and a current-limiting resistor; the current-limiting switch and the current-limiting resistor are connected in series.

[0012] The anode of the diode receives the second control signal, the cathode of the diode is connected to the control terminal of the current limiting switch, one end of the current limiting switch receives the input voltage, and the other end of the current limiting switch is connected to the control terminal of the second switch via a current limiting resistor. One end of the second switch receives the input voltage, and the other end of the second switch is connected to a heat dissipation element.

[0013] The control module also includes a microcontroller, which is connected to the temperature sensing circuit, the first control path, and the second control path.

[0014] The microcontroller selectively outputs a first drive signal and a second drive signal based on the first control signal and the second control signal.

[0015] The first control path receives the first drive signal and controls the heating element to heat up; the second control path receives the second drive signal and controls the heat dissipation element to dissipate heat.

[0016] The first control path includes a first switch, the control terminal of the first switch receives a first drive signal, and the first switch is connected in series with the heating element.

[0017] The second control path includes a second switch, the control terminal of the second switch receives a second drive signal, one end of the second switch receives an input voltage, and the other end of the second switch is connected to a heat dissipation element.

[0018] The first control path includes a first switch, and the second control path includes a second switch.

[0019] Both the first and second control paths include control switches, power amplifiers, and multi-stage shift registers.

[0020] The first input terminal of the power amplifier is connected to the control switch, the second input terminal of the power amplifier receives the reference voltage, the output terminal of the power amplifier is connected to the input terminal of the multi-stage shift register, the output terminal of the multi-stage shift register is connected to the control terminal of the first switch, and the first switch is connected in series with the heating element.

[0021] The first control path also includes a second Zener diode; in the first control path, the cathode of the second Zener diode is connected to the control switch;

[0022] The second control path also includes a current-limiting switch, a diode, and a current-limiting resistor; the current-limiting switch and the current-limiting resistor are connected in series.

[0023] In the second control path, the anode of the diode receives the second control signal, the cathode of the diode is connected to the control terminal of the current limiting switch, one end of the current limiting switch is connected to one end of the control switch, and the other end of the current limiting switch is connected to the control terminal of the control switch via a current limiting resistor.

[0024] The control module also includes a timer, which is connected to the multi-stage shift registers in the first and second control paths respectively, and is used to provide a clock signal with a fixed period to the multi-stage shift registers.

[0025] The temperature sensing circuit includes a temperature sensing module and a comparison module; the comparison module is connected to the control module.

[0026] The temperature sensing module includes a voltage divider resistor, a first node, and a temperature-sensitive element arranged in series.

[0027] The comparison module includes a first comparator and a second comparator;

[0028] The first input terminal of the first comparator and the second input terminal of the second comparator are both connected to the first node; the output terminals of the first comparator and the second comparator are both connected to the control module.

[0029] The second input terminal of the first comparator is connected to the first reference voltage, and the positive power supply voltage terminal of the first comparator is connected to the first positive power supply voltage.

[0030] The first input terminal of the second comparator is connected to the second reference voltage, and the positive power supply voltage terminal of the second comparator is connected to the second positive power supply voltage.

[0031] The first positive power supply voltage is greater than the second positive power supply voltage, and the first reference voltage is greater than the second reference voltage.

[0032] To solve the above-mentioned technical problems, the second technical solution provided by this application is: to provide a display device, which includes a heating element, a heat dissipation element and a driving circuit;

[0033] The drive circuit is used to control the heating element to heat up or the heat dissipation element to dissipate heat; the drive circuit is the drive circuit described above.

[0034] The display device includes a display panel, a backlight module, and a printed circuit board. The display panel and the backlight module are arranged opposite to each other. The driving circuit is integrated into the printed circuit board. The surface of the backlight module is provided with heat dissipation elements and air inlets.

[0035] The display panel includes:

[0036] Black matrix;

[0037] A flip-chip film is applied to the side of the display panel;

[0038] The heating element is embedded in the black matrix and connected to the printed circuit board via a flip-chip film;

[0039] A temperature sensor is embedded in the black matrix and spaced apart from the heating element; the temperature sensor is connected to the printed circuit board via a flip-chip film.

[0040] The printed circuit board is folded over a flip-chip film onto the surface of the backlight module away from the display panel and connected to the heat dissipation components.

[0041] The display panel also includes sub-pixels arranged in rows and columns, with the black matrix located on the sides of the sub-pixels;

[0042] The heating element extends along the row direction of the sub-pixel; in the column direction of the sub-pixel, the temperature sensor is located between two adjacent heating elements.

[0043] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides a driving circuit and a display device. The driving circuit includes a temperature sensing circuit and a control module. The temperature sensing circuit senses the ambient temperature of the display device and outputs a first control signal or a second control signal based on the ambient temperature. The control module controls a heating element to heat up based on the first control signal, or controls a heat dissipation element to dissipate heat based on the second control signal. The control module includes a first control path and a second control path; the first and second control paths are connected to the temperature sensing circuit; the first control path receives the first control signal and controls the heating element to heat up, and the second control path receives the second control signal and controls the heat dissipation element to dissipate heat. By sensing the ambient temperature of the display device through the temperature sensing circuit and controlling the heating element to heat up or the heat dissipation element to dissipate heat based on the ambient temperature, the display device can be effectively dynamically temperature-managed. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0045] Figure 1 This is a module example diagram of an embodiment of the driving circuit provided in this application;

[0046] Figure 2 This is a schematic diagram of the structure of the first embodiment of the driving circuit provided in this application;

[0047] Figure 3 This is a schematic diagram showing the relationship between the ambient temperature of the display device provided in this application and the resistance of the temperature-sensitive element;

[0048] Figure 4 This is a schematic diagram of the potential relationship between the first node and the second node provided in this application;

[0049] Figure 5 This is a schematic diagram of the structure of the second embodiment of the driving circuit provided in this application;

[0050] Figure 6 This is a flowchart illustrating the working principle of the microcontroller provided in this application;

[0051] Figure 7 This is a schematic diagram of the structure of the third embodiment of the driving circuit provided in this application;

[0052] Figure 8 This is a logic and timing diagram of the signals within the multi-stage shift register provided in this application;

[0053] Figure 9 This is a schematic diagram of the structure of an embodiment of the display device provided in this application;

[0054] Figure 10 This is a schematic diagram of the display device provided in this application from one viewpoint;

[0055] Figure 11 yes Figure 10 Enlarged structural diagram at point A;

[0056] Figure 12 This is a structural schematic diagram of the display device provided in this application from another perspective;

[0057] Figure 13 yes Figure 12 Left view diagram in the middle;

[0058] Figure 14 yes Figure 13 Enlarged structural diagram at point B;

[0059] Figure 15 yes Figure 12 Right view diagram in the middle;

[0060] Figure 16 yes Figure 15 A magnified structural diagram at point C.

[0061] Explanation of icon numbers:

[0062] 1. Drive circuit; 10. Temperature sensing circuit; 11. Temperature sensing module; 12. Comparison module; 20. Control module; 21. First control path; 22. Second control path; 23. Control switch; 24. Power amplifier; 25. Multi-stage shift register; 251. Logic gate; 26. Indicator unit; 100. Display device; 2. Display panel; 201. Display area; 202. Border area; 203. Black matrix; 205. Temperature sensor; 206. Wire; 207. Positive and negative interface; 20 8. Grille-like structure; 3. Backlight module; 4. Printed circuit board; 41. Input pad; 42. Ground pad; 5. Chip-on film; 6. Air inlet; U1. First comparator; U2. Second comparator; R0. Voltage divider resistor; R1. Temperature-sensitive element; R2. Heating element; R3. Current-limiting resistor; a. First node; b. Second node; Q1. First switch; Q2. Second switch; Q3. Current-limiting switch; Q4. First control switch; Q5. Second control switch; D1. First Zener diode; D2. Second Zener diode; Zener diode; D3, diode; Vin, input voltage; VSS, ground; Vref1, first reference voltage; Vref2, second reference voltage; Vin1, first positive power supply voltage; Vin2, second positive power supply voltage; Va / Vb, potential; MCU, microcontroller; GPIO, signal input; Lx1, first output pin; Lx2, second output pin; GND, ground port; VCC, power supply; CLK, clock signal; +, first input; -, second input; I N, Input signal; U3, First amplifier; U4, Second amplifier; U5, Timer; U6, First multi-stage shift register; U7, Second multi-stage shift register; U8, Heat sink; Out1 / Out2 / Out3 / Out4, Output terminals; FF / FF0 / FF1 / FF2 / FF3, Flip-flops; C, Clock input terminal; D, Input terminal; T, Ambient temperature; T1, First temperature threshold; T2, Second temperature threshold; r1, First resistance value; r2, Second resistance value; P, Sub-pixel. Detailed Implementation

[0063] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0064] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0065] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0066] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0067] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0068] Please see Figures 1 to 4 , Figure 1 This is a module example diagram of an embodiment of the driving circuit provided in this application. Figure 2 This is a schematic diagram of the structure of the first embodiment of the driving circuit provided in this application. Figure 3 This is a schematic diagram showing the relationship between the ambient temperature and the resistance of the temperature-sensitive element in the display device provided in this application. Figure 4 This is a schematic diagram of the potential relationship between the first node and the second node provided in this application.

[0069] This application provides a driving circuit 1. The driving circuit 1 includes a temperature sensing circuit 10 and a control module 20. The temperature sensing circuit 10 is used to sense the ambient temperature T of the display device 100 and output a first control signal (not shown) or a second control signal (not shown) according to the ambient temperature T; the control module 20 controls the heating element R2 to heat up based on the first control signal, or controls the heat dissipation element U8 to dissipate heat based on the second control signal.

[0070] The temperature sensing circuit 10 senses the ambient temperature T of the display device 100, and based on the ambient temperature T, the control module 20 controls the heating element R2 to heat or controls the heat dissipation element U8 to dissipate heat, thereby effectively controlling the display device 100 (see...) Figure 9 Dynamic temperature management is implemented.

[0071] For example, the temperature sensing circuit 10 also outputs a third control signal (not shown) based on the ambient temperature T, and the control module 20 controls the heating element R2 and the heat dissipation element U8 to stop working based on the third control signal.

[0072] Specifically, in response to the ambient temperature T of the display device 100 being lower than the first temperature threshold T1, the temperature sensing circuit 10 outputs a first control signal, and the control module 20 controls the heating element R2 to heat up, providing the necessary heat to the display device 100 and ensuring that it operates at a suitable temperature.

[0073] In response to the ambient temperature T of the display device 100 being higher than the second temperature threshold T2, and the second temperature threshold T2 being greater than the first temperature threshold T1, the temperature sensing circuit 10 outputs a second control signal, and the control module 20 controls the heat dissipation element U8 to dissipate heat in order to reduce the operating temperature of the display device 100.

[0074] In response to the ambient temperature T of the display device 100 being between the first temperature threshold T1 and the second temperature threshold T2, the temperature sensing circuit 10 outputs a third control signal, and the control module 20 controls the heat dissipation element U8 and the heating element R2 to stop working based on the third control signal, so as to maintain the display device 100 operating stably within a suitable temperature range.

[0075] There are no restrictions on the values ​​of the first temperature threshold T1 and the second temperature threshold T2 here; they can be selected according to actual needs.

[0076] The first and second control signals are both high-level signals, while the third control signal is low-level, and the potentials of the first and second control signals are different. The first, second, and third control signals are output in a time-division multiplexing manner.

[0077] The ambient temperature T of the display device 100 can be either the internal ambient temperature of the display device 100 or the external ambient temperature of the display device 100.

[0078] In some embodiments, such as Figure 2 As shown, the temperature sensing circuit 10 includes a temperature sensing module 11 and a comparison module 12; the comparison module 12 is connected to the control module 20; the temperature sensing module 11 includes a voltage divider resistor R0, a first node a, and a temperature-sensitive element R1 arranged in series; the comparison module 12 includes a first comparator U1 and a second comparator U2; the first input terminal + of the first comparator U1 and the second input terminal - of the second comparator U2 are both connected to the first node a; the temperature sensing module 11 also includes a second node b, and the output terminals of the first comparator U1 and the second comparator U2 are both connected to the control module 20; the second input terminal - of the first comparator U1 is connected to a first reference voltage Vref1, and the positive power supply voltage terminal of the first comparator U1 is connected to a first positive power supply voltage Vin1; the first input terminal + of the second comparator U2 is connected to a second reference voltage Vref2, and the positive power supply voltage terminal of the second comparator U2 is connected to a second positive power supply voltage Vin2; the first positive power supply voltage Vin1 is greater than the second positive power supply voltage Vin2, and the first reference voltage Vref1 is greater than the second reference voltage Vref2.

[0079] One end of the temperature sensing module 11 receives the input voltage Vin, and the other end of the temperature sensing module 11 is connected to the ground terminal VSS.

[0080] For example, the voltage divider resistor R0, the first node a, the temperature-sensitive element R1, and the ground terminal VSS are connected in series. The voltage Va at the first node a varies with temperature. The temperature-sensitive element R1 is a negative temperature coefficient element, whose resistance decreases as the temperature increases and increases as the temperature decreases.

[0081] For example, when the ambient temperature T of the display device 100 is a first temperature threshold T1, the resistance value corresponding to the temperature-sensitive element R1 is a first resistance value r1; when the ambient temperature T of the display device 100 is a second temperature threshold T2, the resistance value corresponding to the temperature-sensitive element R1 is a second resistance value r2. The first resistance value r1 is greater than the second resistance value r2.

[0082] In other embodiments, the temperature-sensitive element R1, the first node a, the voltage divider resistor R0, and the ground terminal VSS are connected in series. The voltage Va at the first node a varies with temperature. The temperature-sensitive element R1 is a positive temperature coefficient temperature-sensitive element, whose resistance increases with increasing temperature and decreases with decreasing temperature.

[0083] For example, the voltage divider resistor R0 includes a single resistor. In other embodiments, the voltage divider resistor R0 may include multiple resistors; this is not a limitation and can be selected according to actual needs.

[0084] The temperature-sensitive element R1 changes in accordance with the ambient temperature T of the display device 100.

[0085] For example, both the first comparator U1 and the second comparator U2 are operational amplifiers.

[0086] The input voltage Vin is less than the first positive power supply voltage Vin1.

[0087] The input voltage Vin is greater than the first reference voltage Vref1 and greater than the second reference voltage Vref2.

[0088] The control module 20 also includes a second node b, and the outputs of both the first comparator U1 and the second comparator U2 are connected to the second node b. That is, the comparison module 12 is connected to the control module 20 via the second node b.

[0089] In response to the ambient temperature T of the display device 100 being lower than the first temperature threshold T1, the resistance of the temperature-sensitive element R1 is large and greater than the first resistance r1. Since the voltage divider resistor R0 and the temperature-sensitive element R1 form a voltage divider circuit, the voltage Va at the first node a is greater than the first reference voltage Vref1. The output of the first comparator U1 tends to be positive saturation, that is, the high level output of the first comparator U1 is equal to the first positive power supply voltage Vin1. At the same time, the second comparator U2 outputs a low level, and the potential Vb at the second node b is the first positive power supply voltage Vin1. That is, the comparator module 12 outputs a first control signal through the second node b, and the voltage of the first control signal is the first positive power supply voltage Vin1. The control module 20 controls the heating element R2 to heat based on the first control signal.

[0090] In response to the ambient temperature T of the display device 100 being between the first temperature threshold T1 and the second temperature threshold T2, the resistance of the temperature-sensitive element R1 drops to between the first resistance r1 and the second resistance r2, causing the voltage Va of the first node a to be less than the first reference voltage Vref1 and greater than the second reference voltage Vref2. Both the first comparator U1 and the second comparator U2 output a low level, and the potential Vb of the second node b is low. That is, the comparison module 12 outputs a third control signal via the second node b, and the voltage of the third control signal is low. Based on the third control signal, the control module 20 controls both the heating element R2 and the heat dissipation element U8 to be inactive.

[0091] In response to the ambient temperature T of the display device 100 being higher than the second temperature threshold T2, the resistance of the thermistor is less than the second resistance r2, causing the voltage Va at the first node a to be less than the second reference voltage Vref2. The output of the second comparator U2 tends towards positive saturation, meaning the high level output of the second comparator U2 is equal to the second positive power supply voltage Vin2. Simultaneously, the first comparator U1 outputs a low level, and the potential Vb at the second node b is equal to the second positive power supply voltage Vin2. Therefore, the comparator module 12 outputs a second control signal via the second node b, and the voltage of the second control signal is the second positive power supply voltage Vin2. The control module 20 controls the heat dissipation element U8 to dissipate heat based on the second control signal.

[0092] In this embodiment, all first input terminals + refer to non-inverting input terminals, and all second input terminals - refer to inverting input terminals.

[0093] The temperature sensing circuit 10 employs a dual comparator architecture. It monitors the voltage Va of the first node a in real time and compares it with both the first reference voltage Vref1 and the second reference voltage Vref2 to generate differentiated control signals. Based on the comparison results, it intelligently switches the operating modes of the heating element R2 and the heat dissipation element U8: heating is activated when the ambient temperature T of the display device 100 is below the low-temperature threshold (i.e., the first temperature threshold T1); heat dissipation is activated when the ambient temperature T is above the high-temperature threshold (i.e., the second temperature threshold T2); and neither heat dissipation nor heating occurs in the intermediate temperature range (i.e., between the first temperature threshold T1 and the second temperature threshold T2). This design achieves dynamic temperature regulation of the display device 100 with a simple hardware structure. Furthermore, the driving circuit 1 actively regulates the temperature of the display device 100, achieving intelligent temperature regulation of the display device 100.

[0094] In some embodiments, the control module 20 includes a first control path 21 and a second control path 22; the first control path 21 and the second control path 22 are connected to the temperature sensing circuit 10; the first control path 21 is used to receive a first control signal to control the heating element R2 to heat up, and the second control path 22 is used to receive a second control signal to control the heat dissipation element U8 to dissipate heat.

[0095] The first control path 21 is connected to the heating element R2 and is used to control the operating mode of the heating element R2. The second control path 22 is connected to the heat dissipation element U8 and is used to control the operating mode of the heat dissipation element U8.

[0096] Specifically, when the first control path 21 receives the second control signal or the third control signal, it controls the heating element R2 to not work; when the second control path 22 receives the first control signal or the third control signal, it controls the heat dissipation element U8 to not work.

[0097] In one specific embodiment, the first control path 21 includes a first switch Q1 and a first Zener diode D1 connected in series; the control terminal of the first switch Q1 receives a first control signal, one end of the first switch Q1 is connected to the cathode of the first Zener diode D1, and the other end of the first switch Q1 is connected to the heating element R2; the second control path 22 includes a second switch Q2, a current-limiting switch Q3, a diode D3, and a current-limiting resistor R3; the current-limiting switch Q3 and the current-limiting resistor R3 are connected in series, the anode of the diode D3 receives the second control signal, the cathode of the diode D3 is connected to the control terminal of the current-limiting switch Q3, one end of the current-limiting switch Q3 receives the input voltage Vin, the other end of the current-limiting switch Q3 is connected to the control terminal of the second switch Q2 via the current-limiting resistor R3, one end of the second switch Q2 receives the input voltage Vin, and the other end of the second switch Q2 is connected to the heat dissipation element U8.

[0098] The first switch Q1 and the second switch Q2 have opposite conductivity types.

[0099] For example, the first switch Q1 is an N-channel MOSFET. The second switch Q2 is a P-channel MOSFET. A MOSFET is a metal-oxide-semiconductor field-effect transistor. Specifically, the source of the first switch Q1 is connected to the cathode of the first Zener diode D1, and the drain of the first switch Q1 is connected to the heating element R2. The source of the second switch Q2 receives the input voltage Vin, and the drain of the second switch Q2 is connected to the heat sink U8.

[0100] For example, the current limiting switch Q3 is a PNP transistor. Specifically, the emitter of the current limiting switch Q3 receives the input voltage Vin, the collector of the current limiting switch Q3 is connected to the current limiting resistor R3, and the base of the current limiting switch Q3 is connected to the cathode of the diode D3.

[0101] The anode of diode D3 is connected to the second node b, and the control terminal of the first switch Q1 is connected to the second node b. The anode of the first Zener diode D1 is connected to the ground terminal VSS. One end of the heat sink U8 is connected to the ground terminal VSS. One end of the heating element R2 receives the input voltage Vin to form a closed loop.

[0102] For example, the breakdown voltage V3 of the first Zener diode D1 is greater than the input voltage Vin and less than the first positive power supply voltage Vin1.

[0103] For example, the forward voltage of diode D3 is less than the first positive power supply voltage Vin1 and less than the second positive power supply voltage Vin2.

[0104] Specifically, in response to the output of the first control signal by the temperature sensing circuit 10, i.e., the potential Vb of the second node b is equal to the first positive power supply voltage Vin1, and the voltage of the second node b is greater than the forward voltage of diode D3, diode D3 is turned on. At this time, since the input voltage Vin is less than the first positive power supply voltage Vin1, the emitter voltage of the current limiting switch Q3 is less than the base voltage of the current limiting switch Q3, the current limiting switch Q3 is turned off, there is no voltage at the control terminal of the second switch Q2, the second switch Q2 is turned off, and the heat dissipation element U8 does not work. At this time, since the first positive power supply voltage Vin1 is greater than the breakdown voltage V3 of the first Zener diode D1, the first Zener diode D1 breaks down and conducts, the first switch Q1 is turned on, and the heating element R2 works to heat the display device 100.

[0105] In response to the output of the second control signal by the temperature sensing circuit 10, that is, the potential Vb of the second node b is the second positive power supply voltage Vin2, the voltage of the second node b is less than the breakdown voltage V3 of the first Zener diode D1 and greater than the forward voltage of the diode D3, the first switch Q1 is turned off, the diode D3 is turned on, at this time, the emitter voltage of the current limiting switch Q3 is greater than the base voltage of the current limiting switch Q3, the current limiting switch Q3 is turned on, and the voltage after passing through the current limiting resistor R3 makes the source voltage of the second switch Q2 less than the gate voltage of the second switch Q2, the second switch Q2 is turned on, and the heat dissipation element U8 works to dissipate heat from the display device 100.

[0106] In response to the third control signal output by the temperature sensing circuit 10, i.e., the potential Vb of the second node b is low, which is less than the forward voltage of diode D3, diode D3 is turned off, current limiting switch Q3 is turned off, second switch Q2 is turned off, and heat dissipation element U8 is not working. At this time, the potential Vb of the second node b is less than the breakdown voltage V3 of the first Zener diode D1, the first switch Q1 is turned off, and heating element R2 is not working.

[0107] By setting a first switch Q1 in the first control path 21 to independently drive the heating element R2, and setting a second switch Q2 in the second control path 22 to independently drive the heat dissipation element U8; at the same time, setting a current limiting switch Q3, a current limiting resistor R3 and an anti-reverse current diode D3 in the second control path 22, the first switch Q1 and the second switch Q2 can be turned off simultaneously based on the same control signal (i.e., the third control signal), so that the heating element R2 and the heat dissipation element U8 are both inactive, thereby realizing diverse temperature control of the display device 100.

[0108] Compared to solutions using complex chips or microprocessors, this embodiment uses basic components such as comparators, switches, resistors, and diode D3 to construct the driving circuit 1, which can reduce the overall cost; and the basic components of this embodiment are small in size, making them easy to integrate into a small space, and suitable for ultra-thin display devices.

[0109] Please see Figures 1 to 6 , Figure 5 This is a schematic diagram of the structure of the second embodiment of the driving circuit provided in this application. Figure 6 This is a flowchart illustrating the working principle of the microcontroller provided in this application.

[0110] In another specific embodiment, such as Figure 5 As shown, the control module 20 also includes a microcontroller (MCU), which is connected to the temperature sensing circuit 10, the first control path 21, and the second control path 22. Based on the first control signal and the second control signal, the MCU selectively outputs a first drive signal (not shown) and a second drive signal (not shown). The first control path 21 receives the first drive signal and controls the heating element R2 to heat up. The second control path 22 receives the second drive signal and controls the heat dissipation element U8 to dissipate heat.

[0111] Specifically, the general purpose input port GPIO of the microcontroller MCU is connected to the temperature sensing circuit 10 to receive the first control signal, the second control signal, and the third control signal in a time-division multiplexing manner.

[0112] The microcontroller (MCU) integrates registers (not shown in the figure).

[0113] like Figure 6 As shown, the internal program control of the microcontroller (MCU) is as follows:

[0114] The microcontroller's (MCU) general purpose input port (GPIO) receives a decimal voltage signal (voltage signal, i.e., the first, second, or third control signal). The MCU checks if a voltage signal is input. If so, the internal register of the MCU increments by 1, and then continues to read the next voltage signal. If the next voltage signal matches the previous voltage signal in the register, the counter increments by 1; otherwise, the register count is cleared, and the voltage signal is re-acquired and counted. The count is then checked to see if it is M, where M is set according to actual requirements. If the voltage signal sampled M times is the same, the MCU checks if the M consecutively sampled voltage signals are the first control signal. If so, the MCU's first output pin Lx1 outputs the first drive signal, the register count is cleared, and the voltage signal is re-acquired and counted. If not, the MCU checks if the M consecutively sampled voltage signals are the second control signal. If so, the MCU's second output pin Lx2 outputs the second drive signal, and the register count is cleared. Otherwise, the register count is cleared, and the voltage signal is re-acquired and counted.

[0115] It should be noted that the previous voltage signal and the next voltage signal in the embodiments of this application are continuous on the sampling time axis of the microcontroller MCU.

[0116] A microcontroller (MCU) is set in the drive circuit 1 to realize intelligent control of the temperature of the display device 100 through programming, and a timer counting function is added to prevent false temperature detection when the display device 100 is unstable. The circuit is simple and the function is expandable.

[0117] In some embodiments, the first control path 21 includes a first switch Q1, the control terminal of the first switch Q1 receives a first drive signal, and the first switch Q1 is connected in series with the heating element R2; the second control path 22 includes a second switch Q2, the control terminal of the second switch Q2 receives a second drive signal, one end of the second switch Q2 receives an input voltage Vin, and the other end of the second switch Q2 is connected to the heat dissipation element U8.

[0118] For example, the first switch Q1 is an N-channel MOSFET. The second switch Q2 is a P-channel MOSFET. The first drive signal is high level, and the second drive signal is low level.

[0119] For example, the source of the first switch Q1 is grounded, the drain of the first switch Q1 is connected to the heating element R2, and the control terminal of the first switch Q1 is connected to the first output pin Lx1. The source of the second switch Q2 receives the input voltage Vin, the drain of the second switch Q2 is coupled to the heat sink U8, and the control terminal of the second switch Q2 is connected to the second output pin Lx2. One end of the heat sink U8 is coupled to the ground terminal VSS.

[0120] The power supply terminal VCC of the microcontroller (MCU) receives the input voltage Vin to power the internal components of the MCU.

[0121] The ground port GND of the microcontroller (MCU) is connected to the ground terminal VSS.

[0122] In response to the first control signal that the microcontroller MCU continuously samples a set number of times (i.e., M times), that is, the microcontroller MCU receives the first control signal continuously M times, the microcontroller MCU outputs the first drive signal to control the first switch Q1 to turn on, and the heating element R2 to work.

[0123] In response to the second control signal that the microcontroller continuously samples a set number of times (i.e., M times), that is, the microcontroller receives the second control signal continuously M times, the microcontroller outputs the second drive signal to control the second switch Q2 to turn on, and the heat dissipation element U8 works.

[0124] Because the comparison voltage signal set in the MCU program does not include the third control signal, the set number M cannot be reached, and neither heating element R2 nor heat dissipation element U8 works. That is, when the MCU acquires the third control signal, the count is reset to zero, and the voltage signal is acquired again for counting.

[0125] In some embodiments, both the first control path 21 and the second control path 22 include an indicator unit 26. The indicator unit 26 is used to convert the temperature status of the display device 100 into at least one of a perceptible light, sound, or digital signal to convey the temperature status of the display device 100 to the user. The user can perform relevant operations based on the temperature status of the display device 100. For example, when the ambient temperature T of the display device 100 is higher than the high temperature threshold, the user can stop using the display device 100 as needed to avoid the display device 100 from continuously operating at high temperatures and affecting its service life.

[0126] The indicator unit 26 includes, but is not limited to, light-emitting diodes, buzzers, or liquid crystal displays.

[0127] For example, the indicator unit 26 is a light-emitting diode (LED). In the first control path 21, the indicator unit 26 is a red LED, connected in series between the heating element R2 and the first switch Q1. In the second control path 22, the indicator unit 26 is a yellow LED, connected in series between the heat dissipation element U8 and the ground terminal VSS. Specifically, when the indicator unit 26 emits red light, it indicates that the ambient temperature T of the display device 100 is below the low temperature threshold, and the driving circuit 1 controls the heating element R2 to heat the display device 100. When the indicator unit 26 emits yellow light, it indicates that the ambient temperature T of the display device 100 is above the high temperature threshold, and the driving circuit 1 controls the heat dissipation element U8 to dissipate heat from the display device 100.

[0128] In other embodiments, the indicator unit 26 and the heat dissipation element U8 can be connected in other ways, and the indicator unit 26 and the heating element R2 can be connected in other ways, as long as the heating element R2 and the corresponding indicator unit 26 work synchronously, and the heat dissipation element U8 and the corresponding indicator unit 26 work synchronously.

[0129] It should be noted that a time delay is allowed between the heating element R2 and the corresponding indicating unit 26, and a time delay is allowed between the heat dissipation element U8 and the corresponding indicating unit 26.

[0130] By setting a microcontroller MCU with timing and counting in the drive circuit 1, continuous sampling can reduce the misjudgment of the ambient temperature T of the display device 100 and realize intelligent temperature control of the display device 100. At the same time, the temperature status of the display device 100 is conveyed to the user by the prompting unit, which improves the interaction between the user and the display device 100 and thus enhances the user experience.

[0131] Please see Figure 1 , Figure 3 and Figure 4 ,as well as Figure 7 and Figure 8 , Figure 7This is a schematic diagram of the structure of the third embodiment of the driving circuit provided in this application. Figure 8 This is a logic and timing diagram of the signals within the multi-stage shift register provided in this application.

[0132] In some other specific embodiments, such as Figure 7 As shown, the first control path 21 includes a first switch Q1, and the second control path 22 includes a second switch Q2. Both the first control path 21 and the second control path 22 include a control switch 23, a power amplifier 24, and a multi-stage shift register 25. The first input terminal + of the power amplifier 24 is connected to the control switch 23, the second input terminal - of the power amplifier 24 receives a reference voltage, the output terminal of the power amplifier 24 is connected to the input terminal of the multi-stage shift register 25, and the output terminal of the multi-stage shift register 25 is connected to the control terminal of the first switch Q1. The first switch Q1 is connected in series with the heating element R2. The first control path 21 also includes a second Zener diode D2. In the first control path 21, the cathode of the second Zener diode D2... The first control path 21 is connected to the control switch 23; the second control path 22 also includes a current limiting switch Q3, a diode D3, and a current limiting resistor R3; the current limiting switch Q3 and the current limiting resistor R3 are connected in series; in the second control path 22, the anode of the diode D3 receives the second control signal, the cathode of the diode D3 is connected to the control terminal of the current limiting switch Q3, one end of the current limiting switch Q3 is connected to one end of the control switch 23, and the other end of the current limiting switch Q3 is connected to the control terminal of the control switch 23 via the current limiting resistor R3; the control module 20 also includes a timer U5, which is connected to the multi-stage shift register 25 in the first control path 21 and the second control path 22 respectively, and is used to provide a fixed-period clock signal CLK to the multi-stage shift register 25.

[0133] For example, both the first switch Q1 and the second switch Q2 are NPN transistors. The emitter of the first switch Q1 is connected to the ground terminal VSS, and the collector of the first switch Q1 is connected to the heating element R2. The emitter of the second switch Q2 is connected to the ground terminal VSS, and the collector of the second switch Q2 is connected to the heat dissipation element U8.

[0134] For example, the breakdown voltage V3 of the second Zener diode D2 is greater than the input voltage Vin and greater than the first reference voltage Vref1. The breakdown voltage V3 of the second Zener diode D2 is less than the first positive power supply voltage Vin1.

[0135] For example, power amplifier 24 is an operational amplifier.

[0136] Define the control switch 23 in the first control path 21 as the first control switch Q4, the power amplifier 24 in the first control path 21 as the first amplifier U3, and the multi-stage shift register 25 in the first control path 21 as the first multi-stage shift register U6. Define the control switch 23 in the second control path 22 as the second control switch Q5, the power amplifier 24 in the second control path 22 as the second amplifier U4, and the multi-stage shift register 25 in the second control path 22 as the second multi-stage shift register U7.

[0137] For example, the current limiting switch Q3 is a PNN type transistor. Specifically, in the first control path 21, the source of the first control switch Q4 is connected to the cathode of the second Zener diode D2, the drain of the first control switch Q4 is connected to the first input terminal + of the first amplifier U3, the second input terminal - of the first amplifier U3 receives the first reference voltage Vref1 (i.e., the reference voltage), and the output terminal of the first multi-stage shift register U6 is connected to the control terminal of the first switch Q1.

[0138] In the second control path 22, the anode of diode D3 is connected to the temperature sensing circuit 10, the cathode of diode D3 is connected to the control terminal of current limiting switch Q3, the emitter of current limiting switch Q3 receives the input voltage Vin, the collector of current limiting switch Q3 is connected to current limiting resistor R3, the source of second control switch Q5 receives the input voltage Vin, the drain of second control switch Q5 is connected to the first input terminal + of second amplifier U4, the second input terminal - of second amplifier U4 receives the second reference voltage Vref2 (i.e., reference voltage), and the output terminals Out1 / Out2 / Out3 / Out4 of second multi-stage shift register U7 are connected to the control terminal of second switch Q2.

[0139] For example, each multi-stage shift register 25 includes a logic gate 251 and multiple cascaded flip-flops FF. Specifically, the flip-flops FF are edge-triggered D flip-flops. The input D of the first-stage flip-flop FF0 is connected to the power amplifier 24, and the input D of each of the remaining flip-flops FF is connected to the output of the previous flip-flop FF. The output of each flip-flop FF is connected to the logic gate 251. The clock input C of each flip-flop FF is connected to the timer U5.

[0140] The working principle of multiple cascaded flip-flops (FFs) is as follows: the input terminal D of the first-stage flip-flop FF0 receives the external input signal IN, and the input terminals D of the remaining flip-flops FFs are sequentially connected to the output terminals of the previous stage flip-flops FF. All flip-flops FFs operate synchronously on the rising edge of the clock signal CLK. Since the flip-flops FF only respond to the state of their current input terminal D when the clock rises and produce a corresponding change at the output terminal, and this change needs a certain propagation delay to stabilize, each flip-flop FF updates according to the previous timing state when the next clock signal CLK rises. At the same time, the new input signal IN is written to the first-stage flip-flop FF0. Overall, the data is shifted one bit to the right in the multi-stage shift register 25 one level at a time.

[0141] For example, logic gate 251 is an AND gate. The multi-level shift register 25 samples at a fixed frequency under the action of timer U5. If a low level appears in the sampled signal within a continuous preset time, the AND gate outputs a low level; if the sampled signal remains at a high level for a continuous preset time and reaches a set number M, the AND gate outputs a high level.

[0142] There are no restrictions on the preset time and the number of times M can be selected according to actual needs.

[0143] For example, such as Figure 7 As shown, taking a multi-stage shift register 25 with four cascaded flip-flops FF as an example, the input terminal D of the first-stage flip-flop FF0 receives the input signal IN. The second-stage flip-flop FF1 toggles according to the original state of the output terminal Out1 of the first-stage flip-flop FF0. The third-stage flip-flop FF2 toggles according to the original state of the output terminal Out2 of the second-stage flip-flop FF1. The fourth-stage flip-flop FF3 toggles according to the original state of the output terminal Out3 of the third-stage flip-flop FF2. The output terminal Out4 of the fourth-stage flip-flop FF3 is connected to logic gate 251. Simultaneously, the input signal IN input to the multi-stage shift register 25 is stored in the first-stage flip-flop FF0.

[0144] In this embodiment, the input signal IN corresponds to the output signal of the power amplifier 24.

[0145] Specifically, in response to the output of the first control signal by the temperature sensing circuit 10, i.e., the potential Vb of the second node b is the first positive power supply voltage Vin1, since the first positive power supply voltage Vin1 is greater than the breakdown voltage V3 of the second Zener diode D2, the second Zener diode D2 breaks down and conducts, the first control switch Q4 is turned on, and the voltage at the first input terminal + of the first amplifier U3 is clamped to the breakdown voltage V3 of the second Zener diode D2. Since the breakdown voltage V3 of the second Zener diode D2 is greater than the first reference voltage Vref1, the first amplifier U3 outputs a high level to the first multi-stage shift register U6. If the sampling signal remains high for a continuous preset time and reaches a set number M, the AND gate outputs a high level, the first switch Q1 is turned on, and the heating element R2 is heated. Since the voltage at the second node b is greater than the forward voltage of diode D3, diode D3 conducts. At this time, because the input voltage Vin is less than the first positive power supply voltage Vin1, the emitter voltage of current limiting switch Q3 is less than the base voltage of current limiting switch Q3, so current limiting switch Q3 is turned off. Therefore, there is no voltage at the control terminal of the second control switch Q5, and the second control switch Q5 is turned off. There is no voltage at the first input terminal + of the second amplifier U4, so the second amplifier U4 is turned off, and the heat sink U8 does not work.

[0146] In response to the output of the second control signal from the temperature sensing circuit 10, i.e., the potential Vb of the second node b is the second positive power supply voltage Vin2, the voltage of the second node b is less than the breakdown voltage V3 of the second Zener diode D2, and greater than the forward voltage of the diode D3, the first control switch Q4 is turned off, and the diode D3 is turned on. At this time, the emitter voltage of the current limiting switch Q3 is greater than the base voltage of the current limiting switch Q3, and the current limiting switch Q3 is turned on. After the voltage passes through the current limiting resistor R3, the source voltage of the second control switch Q5 is less than the gate voltage of the second control switch Q5, and the second control switch Q5 is turned on. The voltage at the first input terminal + of the second amplifier U4 is clamped to the input voltage Vin. Since the input voltage Vin is greater than the second reference voltage Vref2, the second amplifier U4 outputs a high level to the second multi-stage shift register. If the sampling signal remains high for a continuous preset time and reaches a set number M, the AND gate outputs a high level, the second switch Q2 is turned on, and the heat dissipation element U8 dissipates heat.

[0147] In response to the third control signal output by the temperature sensing circuit 10, i.e., the potential Vb of the second node b is low, which is less than the forward voltage of diode D3, diode D3 is turned off, current limiting switch Q3 is turned off, second control switch Q5 is turned off, and heat dissipation element U8 is not working. At this time, the potential Vb of the second node b is less than the breakdown voltage V3 of the second Zener diode D2, the first control switch Q4 is turned off, and heating element R2 is not working.

[0148] In this embodiment, the timing and counting function is implemented through digital circuits, which is more cost-effective than the hardware and software implementation of intelligent adjustment by a microcontroller (MCU).

[0149] Please see Figure 1 , Figure 2 , Figures 9 to 16 , Figure 9 This is a schematic diagram of the structure of an embodiment of the display device provided in this application. Figure 10 This is a schematic diagram of the display device provided in this application from one viewpoint. Figure 11 yes Figure 10 Enlarged structural diagram at point A in the middle. Figure 12 This is a structural schematic diagram of the display device provided in this application from another perspective. Figure 13 yes Figure 12 The left-view diagram in the image. Figure 14 yes Figure 13 Enlarged structural diagram at point B. Figure 15 yes Figure 12 The diagram on the right side of the image. Figure 16 yes Figure 15 A magnified structural diagram at point C.

[0150] This application provides a display device 100. The display device 100 includes a heating element R2, a heat dissipation element U8, and a driving circuit 1; the driving circuit 1 is used to control the heating element R2 to heat or control the heat dissipation element U8 to dissipate heat; the driving circuit 1 is the aforementioned driving circuit 1.

[0151] The heating element R2 in the display device 100 is the heating element R2 described above.

[0152] For example, the heating element R2 is a heating wire.

[0153] For example, the heat dissipation element U8 is an ion heat sink. Compared with traditional fans, ion heat sinks are ultra-thin and small, saving more space and achieving a higher degree of feasibility; secondly, compared with the existing passive heat dissipation method of reserved air intake holes in the backlight, the ion heat sink of this application embodiment uses the negative pressure generated by the ionization and decomposition of air to generate suction for active air intake and heat dissipation, which has higher heat dissipation efficiency.

[0154] In some embodiments, the display device 100 includes a display panel 2, a backlight module 3, and a printed circuit board 4, with the display panel 2 and the backlight module 3 disposed opposite to each other; a driving circuit 1 is integrated into the printed circuit board 4; a heat dissipation element U8 and an air inlet 6 are disposed on the surface of the backlight module 3; the display panel 2 includes a black matrix 203, a flip-chip film 5, a heating element R2, and a temperature sensor 205; the flip-chip film 5 is disposed on the side of the display panel 2; the heating element R2 is embedded in the black matrix 203 and connected to the printed circuit board 4 through the flip-chip film 5; the temperature sensor 205 is embedded in the black matrix 203 and is spaced apart from the heating element R2; the temperature sensor 205 is connected to the printed circuit board 4 through the flip-chip film 5; wherein, the printed circuit board 4 is folded onto the surface of the backlight module 3 away from the display panel 2 via the flip-chip film 5 and connected to the heat dissipation element U8.

[0155] Display panel 2 is an LCD panel.

[0156] For example, the display panel 2 has a display area 201 and a border area 202, with the flip-chip film 5 partially located in the border area 202.

[0157] The black matrix 203 is used to block the gaps between sub-pixels P, preventing light from the backlight (not shown) or adjacent sub-pixels P from leaking into other sub-pixel P areas, thereby ensuring that each sub-pixel P emits only the expected color and brightness.

[0158] There are no restrictions on the material of Black Matrix 203 here; it can be selected according to actual needs.

[0159] Printed circuit board 4 is used to transmit image signals to display panel 2. The flip-chip film 5 transmits the output signals of printed circuit board 4 to display panel 2, achieving the dense signal transmission required for high-resolution display.

[0160] For example, the air inlet 6 has a mesh structure.

[0161] For example, the ion heat sink includes wires 206 and a grid-like structure 208. Positive and negative interfaces 207 are reserved at both ends of the grid-like structure 208, and the wires 206 are connected to the two positive and negative interfaces 207 respectively. One of the two positive and negative interfaces 207 is a positive interface, and the other is a negative interface. A ground pad 42 and an input pad 41 are reserved on the printed circuit board 4. The two positive and negative interfaces 207 of the heat sink U8 are connected to the ground pad 42 and the input pad 41 respectively. The input pad 41 is connected to the drive circuit 1 so that the heat sink U8 can be connected to the drive circuit 1 through the input pad 41. When the ion heat sink is working, positive and negative voltages are applied to the wires 206, causing the wires 206 to become conductive and ionize the surrounding air, generating positive ions. These positive ions are adsorbed onto the grid-like structure 208. When tens of thousands of air molecules are simultaneously ionized and adsorbed, a pressure difference is generated, thus producing airflow, which propels the air within the backlight module 3, achieving the effect of heat dissipation.

[0162] For example, the heat dissipation element U8 and the air inlet 6 are respectively embedded on two opposite side surfaces of the backlight module 3 and are positioned close to the printed circuit board 4 so that the heat dissipation element U8 can be connected to the ground pad 42 and the input pad 41 of the printed circuit board 4. When the ion cooler receives sufficient voltage to operate, the generated negative pressure forces air to form a loop between the air inlet 6 and the ion cooler in a short time, achieving rapid cooling. Secondly, the backlight module 3 is a side-lit backlight structure, and the heat dissipation element U8 is positioned on the side of the backlight module 3 so that the heat dissipation element U8 can be positioned closer to the backlight source (not shown) of the backlight module 3, so as to better dissipate heat from the display device 100.

[0163] In other embodiments, the backlight module 3 is a direct-lit backlight structure, and the heat dissipation element U8 and the air inlet 6 can be embedded on the surface of the backlight module 3 away from the display panel 2.

[0164] For example, the temperature sensor 205 is a thermistor.

[0165] Temperature sensor 205 is at least one.

[0166] In some embodiments, the temperature information collected by all temperature sensors 205 is processed to generate a comprehensive temperature value, which corresponds to the local temperature sensed by the temperature-sensitive element R1 in the drive circuit 1, thereby achieving unified temperature feedback control.

[0167] In other embodiments, there are multiple temperature sensors 205. The mode, median, or average of the temperature values ​​collected by the multiple temperature sensors 205 are selected as the comprehensive temperature value. This comprehensive temperature value corresponds to the local temperature sensed by the temperature-sensitive element R1 in the drive circuit 1, thereby realizing unified temperature feedback control.

[0168] For example, there are multiple temperature sensors 205, distributed at different locations in the black matrix 203, to accurately measure the overall temperature distribution of the display panel 2. The multiple temperature sensors 205 are arranged in series and / or in parallel.

[0169] The existing black matrix 203 is only used to prevent light leakage between sub-pixels P. In this embodiment, heating elements R2 and temperature sensors 205 are embedded in different positions of the black matrix 203, which not only retains the original function of the black matrix 203, but also plays the role of temperature detection and regulation.

[0170] In some embodiments, the display panel 2 further includes sub-pixels P arranged in rows and columns, with a black matrix 203 located on the side of the sub-pixels P; heating elements R2 extending along the row direction of the sub-pixels P; and in the column direction of the sub-pixels P, a temperature sensor 205 located between two adjacent heating elements R2.

[0171] For example, the display panel 2 includes sub-pixels P of three different colors: red, green, and blue. In the row direction of the sub-pixels P, the sub-pixels P of the three different colors are arranged sequentially and periodically, and in the column direction of the sub-pixels P, the sub-pixels P are arranged repeatedly.

[0172] In other embodiments, the display panel 2 may include sub-pixels P of other colors, and the sub-pixels P may be arranged in other ways. No restrictions are imposed here, and the choice is made according to actual needs.

[0173] For example, multiple temperature sensors 205 are arranged at intervals along the row direction of sub-pixel P and connected in series to form a group of series temperature sensors 205; multiple groups of series temperature sensors are connected in parallel, and each group of series temperature sensors 205 is disposed between two adjacent heating elements R2.

[0174] In other embodiments, the heating element R2 may also extend along the column direction of the sub-pixel P. There are no major restrictions here, and the choice can be made according to actual needs.

[0175] The temperature sensor 205 is placed between two adjacent heating elements R2 to collect the temperature of the display panel 2 after thermal equilibrium, so as to accurately measure the internal ambient temperature of the display panel 2.

[0176] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0177] The above are merely embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A drive circuit characterized by comprising: The application relates to a temperature sensing circuit, a control module and a display device. The temperature sensing circuit is used for sensing the ambient temperature of the display device and outputting a first control signal, a second control signal or a third control signal according to the ambient temperature. The control module controls the heating element to heat based on the first control signal, controls the heat-dissipating element to dissipate heat based on the second control signal, or controls the heating element and the heat-dissipating element to stop working based on the third control signal. The control module comprises a first control path and a second control path; the first control path and the second control path are connected with the temperature sensing circuit; the first control path is used for receiving the first control signal and controlling the heating element to heat, and the second control path is used for receiving the second control signal and controlling the heat-dissipating element to dissipate heat. The temperature sensing circuit comprises a temperature sensing module and a comparison module; the comparison module is connected with the control module. The temperature sensing module comprises a voltage dividing resistor, a first node and a temperature-sensitive element which are sequentially and serially arranged. The comparison module comprises a first comparator and a second comparator. The first input end of the first comparator and the second input end of the second comparator are connected with the first node; the output end of the first comparator and the output end of the second comparator are connected with the control module. The second input end of the first comparator is connected with a first reference voltage, and the positive power supply voltage end of the first comparator is connected with a first positive power supply voltage. The first input end of the second comparator is connected with a second reference voltage, and the positive power supply voltage end of the second comparator is connected with a second positive power supply voltage. The first positive power supply voltage is greater than the second positive power supply voltage, and the first reference voltage is greater than the second reference voltage. The control module further comprises a second node, and the output end of the first comparator and the output end of the second comparator are connected with the second node. In response to the ambient temperature of the display device being lower than a first temperature threshold value, the temperature sensing circuit outputs the first control signal, and the voltage of the first control signal is the first positive power supply voltage. In response to the ambient temperature of the display device being higher than a second temperature threshold value which is greater than the first temperature threshold value, the temperature sensing circuit outputs the second control signal, and the voltage of the second control signal is the second positive power supply voltage. In response to the ambient temperature of the display device being between the first temperature threshold value and the second temperature threshold value, the temperature sensing circuit outputs the third control signal, and the voltage of the third control signal is a low level.

2. The drive circuit according to claim 1, characterized in that, The first control path comprises a first switch and a first voltage stabilizing diode which are serially arranged. The control end of the first switch receives the first control signal, one end of the first switch is connected with the cathode of the first voltage stabilizing diode, and the other end of the first switch is connected with the heating element. The second control path comprises a second switch, a current-limiting switch, a diode and a current-limiting resistor; the current-limiting switch and the current-limiting resistor are serially arranged. An anode of the diode receives a second control signal, a cathode of the diode is connected to a control end of the current-limiting switch, one end of the current-limiting switch receives an input voltage, and the other end of the current-limiting switch is connected to a control end of the second switch through the current-limiting resistor, one end of the second switch receives the input voltage, and the other end of the second switch is connected to the heat-dissipating element.

3. The drive circuit according to claim 1, characterized by The control module further comprises a single-chip microcomputer, which is connected to the temperature sensing circuit, the first control path and the second control path respectively. The single-chip microcomputer selectively outputs a first driving signal and a second driving signal based on the first control signal and the second control signal. The first control path receives the first driving signal to control the heating element to heat, and the second control path receives the second driving signal to control the heat-dissipating element to dissipate heat.

4. The drive circuit according to claim 3, characterized in that, The first control path comprises a first switch, and a control end of the first switch receives the first driving signal. The second control path comprises a second switch, a control end of the second switch receives the second driving signal, one end of the second switch receives an input voltage, and the other end of the second switch is connected to the heat-dissipating element.

5. The drive circuit according to claim 1, characterized by The first control path comprises a first switch, and the second control path comprises a second switch. The first control path and the second control path each comprise a control switch, a power amplifier and a multi-stage shift register. A first input end of the power amplifier is connected to the control switch, a second input end of the power amplifier receives a reference voltage, an output end of the power amplifier is connected to an input end of the multi-stage shift register, an output end of the multi-stage shift register is connected to a control end of the first switch, and the first switch is connected in series to the heating element. The first control path further comprises a second stabilizing diode, and in the first control path, a cathode of the second stabilizing diode is connected to the control switch. The second control path further comprises a current-limiting switch, a diode and a current-limiting resistor, and the current-limiting switch is connected in series to the current-limiting resistor. In the second control path, an anode of the diode receives a second control signal, a cathode of the diode is connected to a control end of the current-limiting switch, one end of the current-limiting switch is connected to one end of the control switch, and the other end of the current-limiting switch is connected to a control end of the control switch through the current-limiting resistor.

6. The drive circuit according to claim 5, characterized in that, The control module further comprises a timer, which is connected to the multi-stage shift register in the first control path and the second control path respectively, and is configured to provide a clock signal with a fixed period for the multi-stage shift register.

7. A display device, characterized by comprising: The display device comprises a display panel, a backlight module and a printed circuit board, the display panel and the backlight module are arranged oppositely, and the driving circuit is integrated on the printed circuit board. The display device comprises a display panel, a backlight module and a printed circuit board, the display panel and the backlight module are arranged oppositely, and the driving circuit is integrated on the printed circuit board.

8. The display device according to claim 7, wherein ​ The surface of the backlight module is provided with a heat dissipation element and an air inlet; The display panel comprises: A black matrix; A chip on film arranged at the side of the display panel; A heating element embedded in the black matrix and connected with the printed circuit board through the chip on film; A temperature sensor embedded in the black matrix and arranged in a spaced manner with the heating element; the temperature sensor is connected with the printed circuit board through the chip on film; The printed circuit board is folded to the surface of the backlight module away from the display panel through the chip on film and connected with the heat dissipation element.

9. The display device of claim 8, wherein, The display panel further comprises sub-pixels arranged in rows and columns, and the black matrix is arranged at the side of the sub-pixels; The heating element is arranged in the row direction of the sub-pixels; in the column direction of the sub-pixels, the temperature sensor is arranged between two adjacent heating elements.

Images