Heat dissipation device for data processing device

Abstract

The invention relates to a heat dissipation device for a data processing device, and the device comprises a first heat dissipation assembly which comprises a cooling part used for being installed in a first direction of a processor, and the cooling part is configured to absorb the heat of the processor; the second heat dissipation assembly is arranged in the first direction of the cooling piece, at least one end of the second heat dissipation assembly is used for being installed in the first direction of the memory module, and the second heat dissipation assembly is configured to transmit heat of the memory module into the second heat dissipation assembly to be diffused and transmit the heat into the cooling piece; the cooling piece comprises a liquid inlet and a liquid outlet which are arranged on the opposite sides, the liquid inlet direction of the liquid inlet is the same as the liquid outlet direction of the liquid outlet, and the liquid inlet direction is perpendicular to the heat transfer direction of the cooling piece and the second heat dissipation assembly. One end of the second heat dissipation assembly is in heat conduction connection with the memory module and arranged in the first direction of the cooling piece, heat of the memory module and the processor is transferred to the cooling piece for heat dissipation, heat conduction efficiency loss is avoided, the heat dissipation effect is improved, and the performance and stability of the data processing device are improved.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a heat dissipation device for a data processing device. Background Art

[0002] With the rapid development of high-density integration and high-performance computing technologies in the server sector, the power consumption of server components has increased significantly. In particular, the heat flux and power consumption of CPUs (processors) continue to rise, leading to a gradual decline in the heat dissipation capacity of traditional air cooling systems. DIMMs (dual in-line memory modules) that work with the CPU also face cooling challenges due to the increased power consumption. Against this backdrop, liquid cooling technology has become a key approach to addressing the heat dissipation challenges of high-power devices. Liquid cooling leverages the efficient thermal conductivity of liquid working fluids to quickly transfer and evenly distribute heat.

[0003] In the prior art, two main solutions for dissipating heat between DIMMs and the CPU are employed: One approach involves transferring heat through the gaps between the DIMMs to cold plates at both ends. However, this results in a long heat transfer path from the DIMM to the ends, resulting in high thermal resistance and limited heat dissipation efficiency. Alternatively, a liquid cooling channel is installed directly between the DIMMs. While this shortens the heat transfer path, the confined space and thin cold plate walls lead to high processing costs and assembly difficulties.

[0004] The above solutions have the problem that long-distance heat conduction is easily affected by vibration or thermal expansion, or thin-walled flow channels are easily fatigued and damaged under high pressure, resulting in poor heat dissipation efficiency, insufficient reliability, large space occupation and high cost. Summary of the Invention

[0005] Based on this, it is necessary to provide a heat dissipation device for a data processing device to address the problems of poor heat dissipation efficiency and insufficient reliability of existing servers.

[0006] A heat dissipation device for a data processing device, comprising:

[0007] A first heat dissipation assembly includes a cooling member for installation in a first direction of the processor, the cooling member being configured to absorb heat from the processor;

[0008] a second heat dissipation assembly, disposed in the first direction of the cooling element, wherein at least one end of the second heat dissipation assembly is configured to be mounted in the first direction of the memory module, and the second heat dissipation assembly is configured to transfer heat from the memory module to the second heat dissipation assembly for diffusion and transfer to the cooling element;

[0009] The cooling element includes a liquid inlet and a liquid outlet arranged on opposite sides. The liquid inlet direction and the liquid outlet direction of the liquid inlet are the same and are perpendicular to the heat transfer direction of the cooling element and the second heat dissipation component.

[0010] In one embodiment, there is a distance between two ends of the second heat dissipation component and the cooling member, the two ends of the second heat dissipation component are respectively arranged in the first direction of the memory module, and the cooling member is arranged within the distance.

[0011] In one embodiment, the second heat dissipation assembly includes a heat expansion member and a heat conductive member. The heat expansion member is arranged to extend laterally in the first direction of the cooling member and is thermally connected to the cooling member. The two heat conductive members are respectively arranged at both ends of the heat expansion member in the longitudinal direction, and one end of the heat conductive member is used to be inserted into the memory module.

[0012] In one embodiment, a chamber is provided in the cooling element, one end of the chamber is connected to the liquid inlet, and the other end of the chamber is connected to the liquid outlet.

[0013] In one embodiment, the cooling element is a cold plate structure, which includes an upper cold plate, a middle cold plate and a lower cold plate stacked in sequence. A flow channel is provided in the cavity of the upper cold plate and the lower cold plate, and the flow direction of the coolant in the flow channel is perpendicular to the direction of heat transfer of the heat expansion element.

[0014] In one embodiment, a plurality of fin structures are respectively provided in the chambers of the upper cold plate and the lower cold plate, and the plurality of fin structures are arranged in parallel and spaced apart to form the flow channel, and the flow direction of the flow channel is arranged parallel to the liquid inlet direction of the liquid inlet.

[0015] In one embodiment, the intercooler plate includes an inlet flow balancing groove and an outlet flow merging groove, the inlet flow balancing groove is connected to the liquid inlet, and the outlet flow merging groove is connected to the liquid outlet; the inlet flow balancing groove and the outlet flow merging groove are respectively arranged at both ends of the intercooler plate, and the extension direction of the inlet flow balancing groove and the outlet flow merging groove is perpendicular to the liquid inlet direction.

[0016] In one embodiment, the intercooler plate further includes at least one deflection groove, the deflection groove being arranged between the inlet flow balancing groove and the outlet converging groove, and the extension direction of the deflection groove being arranged parallel to the extension direction of the inlet flow balancing groove and the outlet converging groove;

[0017] The upper cold plate and the lower cold plate are respectively provided with baffle ribs at positions corresponding to the baffle grooves. The baffle ribs are protrudingly arranged between adjacent fin structures. The extending direction of the baffle ribs is perpendicular to the extending direction of the fin structure.

[0018] In one embodiment, a plurality of blocks are provided in the intercooling plate, the deflection grooves are formed between the plurality of blocks, and the height of the blocks is consistent with the thickness of the intercooling plate.

[0019] In one embodiment, the intercooler plate further includes an inlet confluence groove and an outlet overflow groove, the inlet confluence groove is arranged between the inlet equalizing groove and the block and is connected to the inlet confluence groove; the outlet overflow groove is arranged between the block and the outlet confluence groove and is connected to the outlet confluence groove; the extension direction of the inlet confluence groove and the outlet overflow groove is arranged parallel to the extension direction of the deflection groove.

[0020] In the above-mentioned heat dissipation device, one end of the second heat dissipation component is thermally connected to the memory module and is arranged in the first direction of the cooling member of the first heat dissipation component, so as to transfer the heat of the memory module and the processor to the cooling member for heat dissipation, thereby avoiding the efficiency loss of traditional air cooling or long-distance heat conduction, quickly reducing the temperature of the processor and memory module, improving the heat dissipation effect, and improving the performance and stability of the data processing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the structure of the heat dissipation device.

[0022] Figure 2 Schematic diagram of the explosion of the heat dissipation device.

[0023] Figure 3 It is a structural schematic diagram of the first heat dissipation component and the second heat dissipation component.

[0024] Figure 4 It is a structural diagram of the cooling element.

[0025] Figure 5 It is a cross-sectional schematic diagram in the longitudinal direction of the cooling element.

[0026] Figure 6 It is a schematic cross-sectional view of the cooling element in the width direction.

[0027] Figure 7 Schematic diagram of the structure of the upper cold plate.

[0028] Figure 8 Schematic diagram of the structure of the lower cold plate.

[0029] Figure 9 Schematic diagram of the structure of the intercooler plate.

[0030] In the figure: 10, first heat dissipation assembly; 11, cooling element; 110, upper cold plate; 111, middle cold plate; 112, lower cold plate; 113, inlet flow balancing groove; 114, outlet confluence groove; 115, deflection groove; 116, deflection rib; 117, stopper; 118, inlet confluence groove; 119, outlet overflow groove; 12, liquid inlet; 13, liquid outlet; 14, chamber; 15, flow channel; 16, fin structure;

[0031] 20. Second heat dissipation assembly; 21. Heat expansion member; 211. Heat pipe; 22. Heat conducting member; 221. Heat conducting plate;

[0032] 30. Processor; 40. Memory module; 50. Motherboard; 60. Chip module; 70. Power module. DETAILED DESCRIPTION

[0033] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0034] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0035] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0036] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0037] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0039] In related technologies, heat is transferred along the length of the memory modules to the heat dissipation structures at the front and rear ends by placing heat-conducting structures in the gaps between the memory modules. Liquid cooling channels within the heat dissipation structures then remove the heat. However, the heat from the memory module area must be transferred to the heat dissipation structures at both ends, resulting in a long heat transfer path, increased thermal resistance, and reduced heat dissipation efficiency, making it difficult to meet the requirements of high heat flux density scenarios.

[0040] Another approach is to design liquid cooling channels within the narrow spaces between memory modules, directly removing heat through liquid circulation. While this shortens the heat transfer path, the close spacing between memory modules, the thin walls of the heat dissipation structure, and the complex flow channel structure make processing more difficult and significantly increase manufacturing costs. Furthermore, the dense flow channel layout requires stringent assembly precision, further increasing process risks.

[0041] See Figure 1 、 Figure 2 , Figure 1 A schematic structural diagram of a heat dissipation device in an embodiment of the present application is shown. Figure 2 An exploded schematic diagram of a heat dissipation device in an embodiment of the present application is shown.

[0042] An embodiment of the present application provides a heat dissipation device for a data processing device, including a first heat dissipation component 10 and a second heat dissipation component 20, which achieves efficient heat dissipation effect for a processor 30 and a memory module 40 through reasonable structural settings and heat transfer path planning.

[0043] In this embodiment, the first heat dissipation assembly 10 includes a cooling member 11 for installation in a first direction relative to the processor 30. The cooling member 11 is configured to absorb heat from the processor 30. The second heat dissipation assembly 20 is disposed in the first direction relative to the cooling member 11. At least one end of the second heat dissipation assembly 20 is configured to be installed in the first direction relative to the memory module 40. The second heat dissipation assembly 20 is configured to transfer heat from the memory module 40 to the second heat dissipation assembly 20 for diffusion and transfer to the cooling member 11. The cooling member 11 includes a liquid inlet 12 and a liquid outlet 13 disposed on opposite sides. The liquid inlet direction of the liquid inlet 12 is the same as the liquid outlet direction of the liquid outlet 13 and is perpendicular to the heat transfer direction between the cooling member 11 and the second heat dissipation assembly 20.

[0044] The processor 30 is mounted on one side of the motherboard 50 of the heat dissipation device, and the memory module 40 is mounted on both sides of the processor 30. The first heat dissipation assembly 10 includes a cooling member 11, which is mounted in a first direction of the processor 30, that is, above the processor 30. The bottom of the cooling member 11 is in close contact with the surface of the processor 30, absorbing the heat generated by the processor 30. As the core computing component of the data processing device, the processor 30 generates a large amount of heat during operation. The cooling member 11 is in direct contact with the processor 30 and can quickly absorb this heat, preventing the processor 30 from overheating and affecting its performance or even being damaged.

[0045] A chamber 14 is provided in the cooling element 11. The cooling element 11 is also provided with a liquid port connected to one end of the chamber 14, and a liquid outlet 13 connected to the other end of the chamber 14. The liquid inlet 12 and the liquid outlet 13 are arranged on opposite sides, and the chamber 14 is configured to guide the flow of the coolant. The liquid inlet 12 is used to introduce external coolant, and the chamber 14 is used to guide the orderly flow of the coolant. The coolant will fully exchange heat with the outer wall of the cooling element 11 and absorb the heat generated by the processor 30. As the coolant continues to flow, its temperature gradually increases, and eventually it is discharged from the chamber 14 from the liquid outlet 13. The way in which the liquid inlet 12 and the liquid outlet 13 are arranged on opposite sides helps the coolant form a longer flow path inside the cooling element 11, thereby increasing the heat exchange time and improving the heat dissipation effect.

[0046] As coolant flows from inlet 12 into chamber 14 within cooling element 11, it exchanges heat with the inner walls of cooling element 11 and the areas in contact with processor 30. Due to its high specific heat capacity, coolant can absorb large amounts of heat with minimal temperature increase. After absorbing heat, the coolant continues to flow along chamber 14, eventually exiting through outlet 13, entering the subsequent cooling system for cooling, and then circulates back to inlet 12, achieving continuous heat dissipation.

[0047] The second heat sink assembly 20 is positioned in the first direction of the cooling element 11, with at least one end mounted in the first direction of the memory module 40. Specifically, the second heat sink assembly 20 is positioned above the cooling element 11, with at least one end mounted above and in contact with the memory module 40 to absorb heat from the memory module 40. The memory module 40 also generates a certain amount of heat during data processing. The primary function of the second heat sink assembly 20 is to transfer the heat generated by the memory module 40 to its internal portion for diffusion, and further transfer the heat to the cooling element 11, thereby utilizing the cooling capacity of the cooling element 11 to achieve synergistic heat dissipation.

[0048] The second heat dissipation assembly 20 may include structures such as heat pipes 211 and a temperature vapor chamber to evenly diffuse heat and smoothly transfer it to the cooling element 11. Furthermore, the contact area and shape of the second heat dissipation assembly 20 and the memory module 40 match those of the memory module 40 to ensure good thermal contact and improve heat transfer efficiency.

[0049] When the memory module 40 generates heat, the portion of the second heat sink 20 in contact with the memory module 40 absorbs the heat. After the heat diffuses within the second heat sink 20, it is transferred to the cooling element 11. This heat transfer method not only effectively reduces the temperature of the memory module 40 but also leverages the powerful heat dissipation capabilities of the cooling element 11 to further improve overall heat dissipation efficiency.

[0050] In practice, coolant is pumped from an external cooling system into inlet 12 of cooling element 11. It flows through internal flow channel 15, absorbs heat from processor 30, and then flows out through outlet 13, completing heat dissipation. Simultaneously, heat from memory module 40 is transferred to cooling element 11 via second heat sink assembly 20 and further removed by the coolant, achieving coordinated heat dissipation between processor 30 and memory module 40.

[0051] As described above, the heat dissipation device of the present application can effectively solve the heat dissipation problem of the processor 30 and memory module 40 in the data processing device. The coordinated operation of the first heat dissipation component 10 and the second heat dissipation component 20 allows the heat of the processor 30 and memory module 40 to be efficiently transferred to the coolant, avoiding the efficiency losses of traditional air cooling or long-distance heat conduction, quickly reducing the temperature of the processor 30 and memory module 40, improving the heat dissipation effect, and enhancing the performance and stability of the data processing device. At the same time, the optimized liquid cooling and heat conduction structure reduces space occupation, ensures the reliability and durability of the heat dissipation device, and reduces maintenance costs.

[0052] In one embodiment, the cooling element 11 is a cold plate structure, arranged in an elongated strip. It is made of a highly thermally conductive material, such as a copper alloy or aluminum alloy, and exhibits excellent thermal conductivity. The cooling element 11 employs a modular design, and its flow channel 15 may utilize a multi-layer microchannel structure to increase heat dissipation area and coolant flow efficiency.

[0053] In one embodiment, the contact areas between the processor 30 and the cooling element 11, between the memory module 40 and the second heat sink 20, and between the cooling element 11 and the second heat sink 20 are filled with a highly thermally conductive material such as thermal grease to reduce thermal resistance and improve heat transfer efficiency. The cooling element 11 and the second heat sink 20 are secured by bonding, snap-fit connection, bolt connection, or other methods to improve the stability of the connection and ensure effective heat dissipation. Alternatively, the second heat sink 20 and the cooling element 11 are formed using an integrated molding process to reduce thermal resistance.

[0054] Combine Figure 3 As shown, Figure 3 The figure is a schematic diagram of the structure of the first heat dissipation assembly 10 and the second heat dissipation assembly 20 provided in one embodiment of the present application. In some embodiments, the second heat dissipation assembly 20 is pressed against the first direction of the cooling element 11, with a gap between the two ends of the second heat dissipation assembly 20 and the cooling element 11. The two ends of the second heat dissipation assembly 20 are respectively disposed in the first direction of the memory module 40.

[0055] Specifically, the cooling element 11 is disposed above the processor 30. The first direction described here is upward. The bottom of the cooling element 11 is provided with a flat surface that fits the surface of the processor 30. The cooling element 11 is installed above the processor 30 using this flat surface to absorb the heat of the processor 30.

[0056] The second heat sink assembly 20 is made of a highly thermally conductive material and is generally in the shape of a strip or plate. The second heat sink assembly 20 is pressed against the cooling element 11, and there is a gap between the ends of the second heat sink assembly 20 and the cooling element 11. That is, there is space below the second heat sink assembly 20 for the cooling element 11 to avoid interference with the cooling element 11 and affect its heat dissipation effect.

[0057] Both ends of the second heat dissipation component 20 extend downward respectively, and the extended portion is arranged above the memory module 40 and contacts the memory module 40, and is used to absorb the heat generated by the memory module 40 and transfer it to the cooling member 11 through the contact portion of the second heat dissipation component 20 and the cooling member 11, thereby achieving a synergistic heat dissipation effect.

[0058] In one embodiment, the second heat dissipation component 20 includes a heat expansion member 21 and a heat conductive member 22. The heat expansion member 21 is arranged along a horizontal extension in the first direction of the cooling member 11 and is thermally connected to the cooling member 11; the two heat conductive members 22 are respectively arranged at the two ends of the heat expansion member 21 along the longitudinal direction, and one end of the heat conductive member 22 is used to be inserted into the memory module 40.

[0059] Specifically, the second heat sink assembly 20 consists of a horizontally arranged heat expansion member 21 and a longitudinally arranged heat conduction member 22, forming an I-shaped overall structure. The heat expansion member 21 is positioned horizontally directly above the cooling element 11. The bottom surface of the heat expansion member 21 is tightly thermally connected to the top surface of the cooling element 11 via a highly thermally conductive interface material. The heat expansion member 21 diffuses and transfers heat from the memory module 40, which is absorbed by the heat conduction member 22, to the cooling element 11 for dissipation.

[0060] The two heat conducting members 22 are respectively arranged at both ends of the heat expansion member 21 along the longitudinal direction, that is, the two heat conducting members 22 are respectively arranged vertically at both ends of the heat expansion member 21 to form a symmetrical heat dissipation wing structure, which transfers the heat generated by the memory module 40 to the heat expansion member 21 for diffusion.

[0061] The thermal conductor 22 is a copper heat sink, with a wedge-shaped structure at the end to facilitate insertion into the gap between the memory modules 40. Each thermal conductor 22 can simultaneously contact the sides of two adjacent memory modules 40, achieving dual-sided heat dissipation. The insertion portion of the thermal conductor 22 is nickel-plated to ensure thermal conductivity and prevent oxidation. The thermal conductor 22 is fixed to the heat expansion member 21 through integral molding, welding, or bolting.

[0062] In one embodiment, the heat conducting member 22 includes a plurality of heat conducting plates 221 spaced apart longitudinally, and the ends of the plurality of heat conducting plates 221 away from the heat expansion member 21 are respectively used to be inserted between the plurality of memory modules 40 , and the outer side walls of the heat conducting plates 221 are in contact with the outer side walls of the memory modules 40 .

[0063] Specifically, the heat conducting member 22 includes a plurality of heat conducting plates 221 spaced longitudinally and arranged in parallel. The number of heat conducting plates 221 matches the number of slots in the memory modules 40. The end of the heat conducting plate 221, which is away from the heat expansion member 21 and is located at the insertion end of the heat conducting plate 221, is configured in a wedge-shaped structure to facilitate insertion between the memory modules 40. The outer wall of the insertion end of the heat conducting plate 221 contacts the outer wall of the memory modules 40, absorbing heat generated by the memory modules 40 through the principle of heat conduction.

[0064] The heat conducting plate 221 is made of a highly thermally conductive material, such as a copper alloy plate, and its surface is anodized. The longitudinal height of the heat conducting plate 221 at least covers the heating area of the memory module 40 to ensure the heat conduction effect of the heat conducting plate 221 and improve the heat dissipation efficiency.

[0065] In one embodiment, a plurality of heat pipes 211 are provided in the heat expansion member 21 and are arranged at intervals in a transverse direction. The heat pipes 211 are connected to the heat conducting plate 221 and are covered on the cooling member 11. The heat pipes 211 are configured to transfer the heat absorbed from the heat conducting plate 221 to the cooling member 11.

[0066] Specifically, the heat expansion element 21 is equipped with multiple heat pipes 211 arranged in parallel and spaced laterally. These heat pipes 211 are perpendicular to the heat conducting plate 221 and welded to one end of the heat conducting plate 221. The heat pipes 211 are longer than the cooling element 11, allowing them to cover the cooling element 11. The working medium within the heat expansion element utilizes the phase change principle of the working medium to transfer heat absorbed by the heat conducting plate 221 and diffuse it to the cooling element 11 for dissipation.

[0067] In one embodiment, thermally conductive materials are provided at the contact portion between the cooling element 11 and the processor 30, at the contact portion between the cooling element 11 and the second heat dissipation assembly 20 (i.e., between the bottom of the heat expansion element 21 and the top of the cooling element 11), and at the contact portion between the second heat dissipation assembly 20 and the memory module 40 (i.e., between the heat conducting plate 221 and the memory module 40). These thermally conductive materials have excellent thermal conductivity and filling properties, effectively filling the tiny gaps between the contact surfaces and improving heat transfer efficiency.

[0068] Combine Figure 4 、 Figure 5 、 Figure 6 As shown, Figure 4 Schematic diagram of the structure of the cooling element 11 provided in one embodiment of the present application. Figure 5 Schematic diagram of a cross-section in the longitudinal direction of a cooling element 11 provided in one embodiment of the present application. Figure 6 Schematic cross-sectional view of the cooling element 11 in the width direction provided in one embodiment of the present application.

[0069] In some embodiments, the cooling member 11 is a cold plate structure, and the cooling member 11 includes an upper cold plate 110, a middle cold plate 111 and a lower cold plate 112 stacked in sequence. A flow channel 15 is provided in the cavity 14 of the upper cold plate 110 and the lower cold plate 112, and the flow direction of the coolant in the flow channel 15 is perpendicular to the direction of heat transfer of the heat expansion member 21.

[0070] Specifically, the cooling element 11 is a cold plate structure formed by stacking an upper cold plate 110, an intermediate cold plate 111, and a lower cold plate 112 in sequence, and is arranged in a long strip shape. The top of the cooling element 11 is tightly connected to the heat expansion element 21 to ensure that heat can be efficiently transferred from the heat expansion element 21 to the cooling element 11. The bottom of the lower cold plate 112 is installed above the processor 30 to absorb the heat of the processor 30 and dissipate heat from the processor 30. The top of the upper cold plate 110 is connected to the heat expansion element 21 of the second heat dissipation assembly 20. The cooling element 11 can simultaneously form a good heat conduction path with the heat expansion element 21 and the processor 30, thereby improving heat dissipation efficiency.

[0071] The chambers 14 of the upper and lower cold plates 110, 112 are used to hold coolant. Channels 15 are provided within the chambers 14 of the upper and lower cold plates 110, 112 to guide the flow of the coolant. The coolant in the channels 15 flows perpendicularly to the direction of heat transfer from the first heat dissipation assembly 10 or the second heat dissipation assembly 20.

[0072] Specifically, when heat generated by the processor 30 below is transferred upward to the cooling element 11 through the first heat sink assembly 10, or when heat diffused by the heat expansion element 21 above is transferred downward to the cooling element 11, the heat is primarily transferred in a direction perpendicular to the plane of the cooling element 11. The coolant, however, flows in the flow channel 15 perpendicular to this heat transfer direction, that is, parallel to the plane of the cooling element 11. This design allows the coolant to more fully exchange heat with the cooling element 11, improving heat dissipation efficiency.

[0073] The upper cold plate 110 , the middle cold plate 111 and the lower cold plate 112 are connected in a detachable manner, such as a snap connection, a screw connection, etc., to facilitate maintenance and replacement of components.

[0074] In one embodiment, a plurality of fin structures 16 are provided in the chamber 14 of the upper cold plate 110 and the lower cold plate 112 . The plurality of fin structures 16 are arranged in parallel and spaced apart to form a flow channel 15 . The flow direction of the flow channel 15 is arranged parallel to the liquid inlet direction of the liquid inlet 12 .

[0075] Specifically, multiple fin structures 16 are provided within the chamber 14 of the upper cold plate 110 and the lower cold plate 112. These fin structures 16 are made of a highly thermally conductive material, such as a copper alloy or an aluminum alloy, and are tightly connected to the walls of the chamber 14. The fin structures 16 are used to increase the contact area between the coolant and the walls of the chamber 14, thereby improving heat exchange efficiency.

[0076] A plurality of fin structures 16 are arranged in parallel and spaced apart to form a flow channel 15, and the flow direction of the flow channel 15 is arranged parallel to the liquid inlet direction of the liquid inlet 12. Specifically, a plurality of fin structures 16 are provided in the chamber 14 of the upper cold plate 110 or the lower cold plate 112. The plurality of fin structures 16 are arranged in parallel and spaced apart, that is, they are arranged to extend laterally along the upper cold plate 110 or the lower cold plate 112 to form the flow channel 15. The flow channel 15 is used to guide the flow direction of the coolant. The flow direction of the coolant in the flow channel 15 is arranged parallel to the liquid inlet direction of the liquid inlet 12, that is, the same as the liquid inlet direction of the liquid inlet 12. After the coolant enters the chamber 14 from the liquid inlet 12, it flows along the gaps between the fin structures 16, forming an orderly flow field, so that the coolant can more fully exchange heat with the fin structures 16 and the wall surface of the chamber 14, thereby removing the heat generated by the processor 30.

[0077] In this embodiment, the shape, height, width, etc. of the fin structure 16 can be adjusted according to the flow characteristics of the coolant and the heat exchange requirements to optimize the flow field distribution in the flow channel 15; the spacing of the fin structure 16 is determined according to the flow rate and heat dissipation requirements of the coolant to ensure that the coolant can fully fill the flow channel 15 and fully exchange heat with the fin structure 16.

[0078] Combine Figure 9 As shown, Figure 9 The figure is a schematic diagram of the structure of an intercooler plate 111 provided in one embodiment of the present application. In some embodiments, the intercooler plate 111 includes an inlet flow balancing groove 113 and an outlet flow converging groove 114. The inlet flow balancing groove 113 is connected to the liquid inlet 12, and the outlet flow converging groove 114 is connected to the liquid outlet 13. The inlet flow balancing groove 113 and the outlet flow converging groove 114 are respectively arranged at both ends of the intercooler plate 111, and the inlet flow balancing groove 113 and the outlet flow converging groove 114 extend perpendicular to the liquid inlet direction.

[0079] Specifically, the intercooler plate 111 is internally provided with an inlet flow balancing groove 113 and an outlet flow converging groove 114. The inlet flow balancing groove 113 communicates with the liquid inlet 12, while the outlet flow converging groove 114 communicates with the liquid outlet 13. These grooves are located at opposite ends of the intercooler plate 111, extending perpendicularly to the liquid inlet direction. This facilitates uniform distribution and convergence of the coolant as it enters and exits the intercooler plate 111, improving fluid uniformity and stability.

[0080] In one embodiment, the intercooler plate 111 further includes at least one deflection groove 115 , which is arranged between the inlet equalizing groove 113 and the outlet converging groove 114 , and the extension direction of the deflection groove 115 is arranged parallel to the extension direction of the inlet equalizing groove 113 and the outlet converging groove 114 .

[0081] Specifically, the baffles 115 within the chamber 14 of the intercooler plate 111 are positioned between the inlet equalizing grooves 113 and the outlet converging grooves 114. These baffles extend parallel to these two directions, i.e., perpendicular to the liquid inlet direction. Baffles 115 guide the coolant through a complex flow path within the intercooler plate 111, disrupting the laminar flow boundary and increasing the contact time and area between the coolant and the intercooler plate 111 wall, thereby improving heat exchange efficiency.

[0082] A plurality of stoppers 117 are provided in the intercooling plate 111 . Baffle grooves 115 are formed between the stoppers 117 . The height of the stoppers 117 is consistent with the thickness of the intercooling plate 111 .

[0083] Specifically, multiple blocks 117 are provided within the chamber 14 of the intercooler plate 111, forming baffles 115 between these blocks 117. In this embodiment, the chamber 14 of the intercooler plate 111 has four blocks 117, spaced apart to form three baffles 115. The height of the blocks 117 matches the thickness of the intercooler plate 111, ensuring that coolant does not overflow from above the blocks 117 when flowing within the baffles 115, thereby ensuring fluid stability and uniformity.

[0084] Combine Figure 7 、 Figure 8 As shown, Figure 7 Schematic diagram of the structure of the upper cold plate 110 provided in one embodiment of the present application. Figure 9 Schematic diagram of the structure of the lower cold plate 112 provided in one embodiment of the present application.

[0085] In one embodiment, the upper cold plate 110 and the lower cold plate 112 are respectively provided with deflection ribs 116 at positions corresponding to the deflection grooves 115 . The deflection ribs 116 are protrudingly arranged between adjacent fin structures 16 , and the extension direction of the deflection ribs 116 is perpendicular to the extension direction of the fin structure 16 .

[0086] Specifically, baffle ribs 116 are provided on the upper and lower cold plates 110, 112 at locations corresponding to the baffle grooves 115 of the intercooling plate 111. These ribs 116 protrude between adjacent fin structures 16 and extend perpendicularly to the direction of extension of the fin structures 16. These ribs 116 cooperate with the baffle grooves 115 of the intercooling plate 111. When coolant flows through the upper or lower cold plates 110, 112, they guide the coolant into a specific flow path, further increasing the contact area and duration between the coolant and the fin structures 16 and the walls of the chamber 14, thereby improving heat exchange efficiency.

[0087] In one embodiment, the intercooler plate 111 further includes an inlet confluence groove 118 and an outlet overflow groove 119. The inlet confluence groove 118 is arranged between the inlet equalizing groove 113 and the block 117 and is connected to the inlet confluence groove 118; the outlet overflow groove 119 is arranged between the block 117 and the outlet confluence groove 114 and is connected to the outlet confluence groove 114; the extension direction of the inlet confluence groove 118 and the outlet overflow groove 119 is arranged parallel to the extension direction of the deflection groove 115.

[0088] Specifically, the inlet confluence trough 118 is disposed between the inlet equalizing trough 113 and the block 117, and is in communication with the inlet equalizing trough 113. It is used to receive coolant flowing in from the inlet equalizing trough 113 and guide it to the deflecting trough 115. The outlet overflow trough 119 is disposed between the block 117 and the outlet confluence trough 114, and is in communication with the outlet confluence trough 114. It is used to collect coolant flowing out of the deflecting trough 115 and guide it to the outlet confluence trough 114. The inlet confluence trough 118 and the outlet overflow trough 119 extend parallel to the direction of the deflecting trough 115, that is, perpendicular to the liquid inlet direction. This helps to achieve uniform distribution and convergence of coolant as it flows through the intercooler plate 111, thereby improving the uniformity and stability of the fluid.

[0089] In this embodiment, the upper cold plate 110 and the lower cold plate 112 are symmetrically arranged with the intermediate cold plate 111 as the horizontal plane, and the flow path of the coolant entering the intermediate cold plate 111 and the lower cold plate 112 is described in detail. The flow path of the coolant in the upper cold plate 110 is consistent with that of the intermediate cold plate 111, and only the upper and lower flow directions of the coolant are opposite.

[0090] In the specific implementation process, first, when the data processing device starts working, the external cooling system introduces the coolant into the inlet equalizing groove 113 of the intercooler 111 through the liquid inlet 12, so that the coolant is initially evenly distributed when entering the intercooler 111, avoiding the coolant from concentrating in a certain area and affecting the heat dissipation effect.

[0091] Next, the coolant, evenly distributed through the inlet flow balancing groove 113, enters the inlet confluence groove 118. The inlet confluence groove 118 further collects the coolant and directs it to the fin structure 16 of the lower cold plate 112, flowing along the path of the flow channel 15. As the coolant flows for a distance in the fin area, the flow gradually transitions to laminar flow. At this point, the coolant encounters the deflection ribs 116. As the fluid flows over the deflection ribs 116, a wake region is formed, disrupting the fluid's boundary layer and increasing the heat exchange efficiency of the cold plate.

[0092] The deflecting ribs 116 then disrupt the laminar flow, directing the fluid into the deflecting grooves 115 of the intermediate cold plate 111. The mixed fluid then reenters the flow channels 15 of the fin structure 16 on the other side of the lower cold plate 112. As the flow channels 15 undergo a further transformation from combined to divided, the fluid impacts the fins of the lower cold plate 112, creating a strong turbulent flow effect. This turbulent effect further increases the contact area and duration between the coolant and the wall of the lower cold plate 112, improving heat exchange efficiency.

[0093] The above process is repeated in the lower cold plate 112. The coolant flows repeatedly between the multiple deflection grooves 115 and the fin structure 16, continuously exchanging heat and mixing. Because each section of the fin structure 16 is relatively short in length along the flow channel 15, only a thin boundary layer exists, resulting in high heat exchange efficiency. Ultimately, the coolant flows through the outlet overflow groove 119 to the outlet confluence groove 114, and then flows out of the cooling element 11 through the outlet confluence groove 114 and the liquid outlet 13, completing the entire heat dissipation process.

[0094] As mentioned above, the heat dissipation device of the present application adopts a unique flow channel 15 design and flow field control technology, so that the coolant forms a complex flow path and a strong turbulent effect inside the cooling element 11. This design not only increases the contact area and time between the coolant and the wall of the cooling element 11, but also increases the heat exchange efficiency. At the same time, through the repeated deflection of the flow channel 15 design, the interior of the lower cold plate 112 is forced to impact, further increasing the heat exchange capacity. Therefore, the heat dissipation device of the present application can significantly improve the heat dissipation efficiency of the data processing device and ensure the stable operation of the equipment in a high temperature environment.

[0095] In a data processing device, the processor 30 consumes a large amount of power, while the memory module 40 has a smaller function. Therefore, the processor 30 generates more heat. The lower cold plate 112 of the cooling element 11 is connected to the processor 30 and is used to absorb the heat of the processor 30. Therefore, the heat in the lower cold plate 112 is greater. The upper cold plate 110 is connected to the heat expansion element 21 of the second heat dissipation assembly 20 and is used to absorb the heat of the memory module 40. Compared with the lower cold plate 112, the heat is less. Therefore, a temperature difference is formed between the upper cold plate 110 and the lower cold plate 112. After the coolant in the upper cold plate 110 absorbs a certain temperature, it flows back to the lower cold plate 112 and mixes with the coolant at a higher temperature in the lower cold plate 112, playing a certain cooling role, helping to further improve the heat dissipation efficiency and the utilization rate of the coolant.

[0096] In this embodiment, the data processing device further includes a mainboard 50 , on which the processor 30 and the memory module 40 are mounted. The mainboard 50 also includes a chip module 60 and a power module 70 .

[0097] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0098] The above embodiments merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A heat dissipation device for a data processing device, characterized in that: include: A first heat dissipation assembly (10) includes a cooling member (11) for being mounted in a first direction of the processor (30), wherein the cooling member (11) is configured to absorb heat from the processor (30); A second heat dissipation component (20) is arranged in a first direction of the cooling member (11), at least one end of the second heat dissipation component (20) is used to be installed in the first direction of the memory module (40), and the second heat dissipation component (20) is configured to transfer heat of the memory module (40) to the second heat dissipation component (20) for diffusion and then transfer to the cooling member (11); The cooling element (11) comprises a liquid inlet (12) and a liquid outlet (13) arranged on opposite sides, wherein the liquid inlet direction of the liquid inlet (12) and the liquid outlet direction of the liquid outlet (13) are the same and are perpendicular to the heat transfer direction of the cooling element (11) and the second heat dissipation component (20).

2. The heat dissipation device for a data processing device according to claim 1, characterized in that: There is a distance between the two ends of the second heat dissipation component (20) and the cooling member (11), the two ends of the second heat dissipation component (20) are respectively arranged in a first direction of the memory module (40), and the cooling member (11) is arranged within the distance.

3. The heat dissipation device for a data processing device according to claim 2, characterized in that: The second heat dissipation component (20) includes a heat expansion component (21) and a heat conducting component (22), wherein the heat expansion component (21) is arranged in a first direction of the cooling component (11) along a transverse extension and is thermally connected to the cooling component (11); the two heat conducting components (22) are respectively arranged at two ends of the heat expansion component (21) along a longitudinal direction, and one end of the heat conducting component (22) is used for being plugged into the memory module (40).

4. The heat dissipation device for a data processing device according to any one of claims 1 to 3, characterized in that: A chamber (14) is provided in the cooling element (11), one end of the chamber (14) is communicated with the liquid inlet (12), and the other end is communicated with the liquid outlet (13).

5. The heat dissipation device for a data processing device according to claim 4, characterized in that: The cooling element (11) is a cold plate structure, comprising an upper cold plate (110), an intermediate cold plate (111) and a lower cold plate (112) stacked in sequence, a flow channel (15) being provided in the chambers (14) of the upper cold plate (110) and the lower cold plate (112), and a flow direction of the coolant in the flow channel (15) being perpendicular to the direction in which the second heat dissipation component (20) transfers heat.

6. The heat dissipation device for a data processing device according to claim 5, characterized in that: A plurality of fin structures (16) are respectively provided in the chambers (14) of the upper cold plate (110) and the lower cold plate (112), and the plurality of fin structures (16) are arranged in parallel and spaced apart to form the flow channel (15), and the flow direction of the flow channel (15) is arranged in parallel with the liquid inlet direction of the liquid inlet (12).

7. The heat dissipation device for a data processing device according to claim 6, characterized in that: The intermediate cooling plate (111) comprises an inlet flow balancing groove (113) and an outlet flow converging groove (114); the inlet flow balancing groove (113) is communicated with the liquid inlet (12), and the outlet flow converging groove (114) is communicated with the liquid outlet (13); the inlet flow balancing groove (113) and the outlet flow converging groove (114) are respectively arranged at two ends of the intermediate cooling plate (111); and the extension direction of the inlet flow balancing groove (113) and the outlet flow converging groove (114) is perpendicular to the liquid inlet direction.

8. The heat dissipation device for a data processing device according to claim 7, characterized in that: The intercooling plate (111) further comprises at least one deflection groove (115), wherein the deflection groove (115) is arranged between the inlet equalizing groove (113) and the outlet converging groove (114), and an extension direction of the deflection groove (115) is arranged parallel to an extension direction of the inlet equalizing groove (113) and the outlet converging groove (114); The upper cold plate (110) and the lower cold plate (112) are respectively provided with deflection ribs (116) at positions corresponding to the deflection grooves (115); the deflection ribs (116) are protrudingly arranged between adjacent fin structures (16); and the extension direction of the deflection ribs (116) is perpendicular to the extension direction of the fin structures (16).

9. The heat dissipation device for a data processing device according to claim 8, characterized in that: A plurality of blocks (117) are provided in the intercooling plate (111), the deflection groove (115) is formed between the plurality of blocks (117), and the height of the blocks (117) is consistent with the thickness of the intercooling plate (111).

10. The heat dissipation device for a data processing device according to claim 9, characterized in that: The intermediate cooling plate (111) further comprises an inlet confluence groove (118) and an outlet overflow groove (119); the inlet confluence groove (118) is arranged between the inlet equalizing groove (113) and the stopper (117), and is communicated with the inlet confluence groove (118); the outlet overflow groove (119) is arranged between the stopper (117) and the outlet confluence groove (114), and is communicated with the outlet confluence groove (114); and the extension direction of the inlet confluence groove (118) and the outlet overflow groove (119) is arranged parallel to the extension direction of the deflection groove (115).

Images