Heat dissipation device for data processing device

Abstract

The invention relates to a heat dissipation device for a data processing device, and the device comprises a first heat dissipation assembly which is used for being installed above a processor, and the first heat dissipation assembly is configured to absorb the heat of the processor; the second heat dissipation assembly is arranged above the first heat dissipation assembly, at least one end of the second heat dissipation assembly is used for being installed above the memory module, and the second heat dissipation assembly is configured to transmit heat of the memory module into the second heat dissipation assembly to be diffused and transmit the heat into the first heat dissipation assembly; the first heat dissipation assembly comprises a liquid inlet and a liquid outlet, and cooling liquid flows into the first heat dissipation assembly from the liquid inlet and flows out from the liquid outlet after absorbing heat. The first heat dissipation assembly is used for being installed above the processor, the second heat dissipation assembly is arranged above the first heat dissipation assembly, the two ends of the second heat dissipation assembly are arranged on the memory module, heat of the memory module and the processor is transferred into the first heat dissipation assembly, cooperative heat dissipation is achieved, heat conduction efficiency loss is avoided, and the heat dissipation effect is improved. And the performance and the stability of the data processing device are improved.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a heat dissipation device for a data processing device. Background Art

[0002] With the rapid development of high-density integration and high-performance computing technologies in the server sector, the power consumption of server components has increased significantly. In particular, the heat flux and power consumption of the CPU continue to rise, leading to a gradual decline in the heat dissipation capacity of traditional air cooling systems. DIMMs (dual in-line memory modules) that work with the CPU also face cooling challenges due to the increased power consumption. Against this backdrop, liquid cooling technology has become a key approach to addressing the heat dissipation challenges of high-power components. Liquid cooling leverages the efficient thermal conductivity of liquid working fluids to quickly transfer and evenly distribute heat.

[0003] In the prior art, two main solutions for dissipating heat between DIMMs and the CPU are employed: One approach involves transferring heat through the gaps between the DIMMs to cold plates at both ends. However, this results in a long heat transfer path from the DIMM to the ends, resulting in high thermal resistance and limited heat dissipation efficiency. Alternatively, a liquid cooling channel is installed directly between the DIMMs. While this shortens the heat transfer path, the confined space and thin cold plate walls lead to high processing costs and assembly difficulties.

[0004] The above solutions have the problem that long-distance heat conduction is easily affected by vibration or thermal expansion, or thin-walled flow channels are easily fatigued and damaged under high pressure, resulting in poor heat dissipation efficiency, insufficient reliability, large space occupation and high cost. Summary of the Invention

[0005] Based on this, it is necessary to provide a heat dissipation device for a data processing device to address the problems of poor heat dissipation efficiency and insufficient reliability of existing servers.

[0006] A heat dissipation device for a data processing device, comprising:

[0007] a first heat dissipation assembly, configured to be mounted above the processor, wherein the first heat dissipation assembly is configured to absorb heat from the processor;

[0008] a second heat dissipation assembly, disposed above the first heat dissipation assembly, wherein at least one end of the second heat dissipation assembly is configured to be mounted above the memory module, and the second heat dissipation assembly is configured to transfer heat from the memory module to the second heat dissipation assembly for diffusion and then to the first heat dissipation assembly;

[0009] The first heat dissipation component includes a liquid inlet and a liquid outlet. Cooling liquid flows into the first heat dissipation component from the liquid inlet and flows out from the liquid outlet after absorbing heat.

[0010] In one embodiment, there is a distance between two ends of the second heat dissipation component and the first heat dissipation component, the two ends of the second heat dissipation component are respectively arranged above the memory module, and the first heat dissipation component is arranged within the distance.

[0011] In one embodiment, the second heat dissipation component includes a heat expansion component and a heat conductive component. The heat expansion component is horizontally arranged above the first heat dissipation component and is thermally connected to the first heat dissipation component; the two heat conductive components are respectively longitudinally arranged at both ends of the heat expansion component, and one end of the heat conductive component is used to be inserted into the memory module.

[0012] In one embodiment, the first heat dissipation component includes a cooling element, one end of which is connected to the heat expansion element, and the other end is used to be installed above the processor; the cooling element includes a liquid inlet and a liquid outlet, and the liquid inlet is arranged on opposite sides of the liquid outlet.

[0013] In one embodiment, a chamber is provided in the cooling element, one end of the chamber is connected to the liquid inlet, and the other end is connected to the liquid outlet, and the chamber is configured to guide the flow of the cooling liquid.

[0014] In one embodiment, the cooling element is a cold plate structure, a flow channel is provided in a cavity of the cold plate structure, and a flow direction of the coolant in the flow channel is perpendicular to a direction in which the first heat dissipation component or the second heat dissipation component transfers heat.

[0015] In one embodiment, a plurality of fin structures are provided in the chamber, and the plurality of fin structures are arranged parallel to the liquid inlet direction of the liquid inlet and spaced apart to form the flow channel.

[0016] In one embodiment, the heat conducting member includes a plurality of heat conducting plates spaced longitudinally apart, and the ends of the plurality of heat conducting plates away from the heat expansion member are respectively used to be inserted between a plurality of memory modules, and the outer side walls of the heat conducting plates are in contact with the outer side walls of the memory modules.

[0017] In one embodiment, a plurality of heat pipes arranged laterally at intervals are provided in the heat expansion member, the heat pipes are connected to the heat conducting plate, the heat pipes cover the first heat dissipation component, and the heat pipes are configured to transfer heat absorbed from the heat conducting plate to the first heat dissipation component.

[0018] In one embodiment, the contact portion between the first heat dissipation component and the processor, the contact portion between the first heat dissipation component and the second heat dissipation component, and the contact portion between the second heat dissipation component and the memory module are all provided with thermal conductive materials.

[0019] The heat dissipation device features a first heat dissipation assembly mounted above the processor, and a second heat dissipation assembly positioned above the first heat dissipation assembly, with both ends positioned on the memory modules. This assembly transfers heat from the memory modules and processor to the first heat dissipation assembly, achieving synergistic heat dissipation and avoiding loss of thermal conductivity. This reduces the temperatures of the processor and memory modules, improves heat dissipation, and enhances the performance and stability of the data processing device. Furthermore, the optimized liquid cooling and heat conduction structure reduces space usage, ensures the reliability and durability of the heat dissipation device, and reduces maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of the structure of the heat dissipation device.

[0021] Figure 2 Schematic diagram of the explosion of the heat dissipation device.

[0022] Figure 3 It is a structural schematic diagram of the first heat dissipation component and the second heat dissipation component.

[0023] Figure 4 It is a structural diagram of the cooling element.

[0024] Figure 5 Schematic diagram of the flow channel and fin structure.

[0025] In the figure: 10, first heat dissipation assembly; 11, cooling element; 12, liquid inlet; 13, liquid outlet; 14, chamber; 15, flow channel; 16, fin structure;

[0026] 20. Second heat dissipation assembly; 21. Heat expansion member; 211. Heat pipe; 22. Heat conducting member; 221. Heat conducting plate;

[0027] 30. Processor; 40. Memory module; 50. Motherboard; 60. Chip module; 70. Power module. DETAILED DESCRIPTION

[0028] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0029] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0030] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0031] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0032] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0033] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0034] In related technologies, heat is transferred along the length of the memory modules to the heat dissipation structures at the front and rear ends by placing heat-conducting structures in the gaps between the memory modules. Liquid cooling channels within the heat dissipation structures then remove the heat. However, the heat from the memory module area must be transferred to the heat dissipation structures at both ends, resulting in a long heat transfer path, increased thermal resistance, and reduced heat dissipation efficiency, making it difficult to meet the requirements of high heat flux density scenarios.

[0035] Another approach is to design liquid cooling channels within the narrow spaces between memory modules, directly removing heat through liquid circulation. While this shortens the heat transfer path, the close spacing between memory modules, the thin walls of the heat dissipation structure, and the complex flow channel structure make processing more difficult and significantly increase manufacturing costs. Furthermore, the dense flow channel layout requires stringent assembly precision, further increasing process risks.

[0036] See Figure 1 、 Figure 2 , Figure 1 A schematic structural diagram of a heat dissipation device in an embodiment of the present application is shown. Figure 2 An exploded schematic diagram of a heat dissipation device in an embodiment of the present application is shown.

[0037] An embodiment of the present application provides a heat dissipation device for a data processing device, including a first heat dissipation component 10 and a second heat dissipation component 20, which achieves efficient heat dissipation effect for a processor 30 and a memory module 40 through reasonable structural settings and heat transfer path planning.

[0038] In this embodiment, the first heat dissipation assembly 10 is mounted above the processor 30 and is configured to transfer heat from the processor 30 into the first heat dissipation assembly 10. The second heat dissipation assembly 20 is disposed above the first heat dissipation assembly 10. At least one end of the second heat dissipation assembly 20 is mounted above the memory module 40. The second heat dissipation assembly 20 is configured to transfer heat from the memory module 40 to the second heat dissipation assembly 20 for diffusion and transfer to the first heat dissipation assembly 10. The first heat dissipation assembly 10 includes a liquid inlet 12 and a liquid outlet 13. Coolant flows into the first heat dissipation assembly 10 from the liquid inlet 12, absorbs heat, and then flows out from the liquid outlet 13.

[0039] The first heat sink assembly 10 is mounted above the processor 30, with its bottom in close contact with the surface of the processor 30, transferring heat generated by the processor 30 to the interior of the first heat sink assembly. As the core computing component of the data processing device, the processor 30 generates a large amount of heat during operation. Directly contacting the processor 30, the first heat sink assembly 10 can quickly absorb this heat, preventing overheating that could affect performance or even damage the processor 30.

[0040] The first heat dissipation component 10 is a heat dissipation structure including a cooling element 11 and a heat dissipation substrate, which dissipates heat through active liquid cooling and heat conduction. The cooling element 11 is an active liquid cooling part, including a liquid inlet 12, a liquid outlet 13 and a flow channel 15. The liquid inlet 12 is used to introduce coolant, which flows in the flow channel 15, and the liquid outlet 13 is used to discharge the coolant after absorbing heat. The heat dissipation substrate is arranged on the top or bottom surface of the cooling element, and a thermal interface material such as thermal grease or phase change material is provided on its surface or inside. The heat dissipation substrate and the cooling element are fixed by bonding, bolting, etc. The heat dissipation substrate contacts the processor 30 and the second heat dissipation component 20, and transfers heat to the cooling element 11. The coolant flows in the flow channel 15, continuously absorbing the heat transferred from the heat dissipation substrate, and takes the heat out of the first heat dissipation component 10 as it flows.

[0041] As the coolant flows into the first heat sink 10 from the liquid inlet 12, it exchanges heat with the inner wall of the first heat sink 10 and the portion in contact with the processor 30. Due to its high specific heat capacity, the coolant can absorb a large amount of heat with minimal temperature increase. After absorbing heat, the coolant continues to flow, eventually exiting through the liquid outlet 13, entering the subsequent cooling system for cooling, and then circulates back to the liquid inlet 12, achieving continuous heat dissipation.

[0042] The second heat sink assembly 20 is positioned above the first heat sink assembly 10, with at least one end mounted above and in contact with the memory module 40 to absorb heat from the memory module 40. The memory module 40 also generates a certain amount of heat during data processing. The primary function of the second heat sink assembly 20 is to transfer the heat generated by the memory module 40 to its internal storage for diffusion, and further transfer the heat to the first heat sink assembly 10, leveraging the heat dissipation capabilities of the first heat sink assembly 10 for synergistic heat dissipation.

[0043] The second heat dissipation assembly 20 may include structures such as heat pipes 211 and a temperature vapor chamber to evenly diffuse heat within the assembly and smoothly transfer it to the first heat dissipation assembly 10. Furthermore, the contact area and shape of the second heat dissipation assembly 20 and the memory module 40 match those of the memory module 40, ensuring good thermal contact and improving heat transfer efficiency.

[0044] When the memory module 40 generates heat, the portion of the second heat sink 20 in contact with the memory module 40 absorbs the heat. After the heat diffuses within the second heat sink 20, it is transferred to the first heat sink 10. This heat transfer method not only effectively reduces the temperature of the memory module 40 but also leverages the powerful heat dissipation capabilities of the first heat sink 10 to further improve overall heat dissipation efficiency.

[0045] In practice, coolant is pumped from an external cooling system into the liquid inlet 12 of the first heat sink assembly 10. It flows through the internal flow channel 15, absorbing heat from the processor 30 before exiting through the liquid outlet 13, completing the heat dissipation. Simultaneously, heat from the memory module 40 is transferred to the first heat sink assembly 10 through the second heat sink assembly 20, where it is further carried away by the coolant, achieving coordinated heat dissipation between the processor 30 and the memory module 40.

[0046] As described above, the heat dissipation device of the present application can effectively solve the heat dissipation problem of the processor 30 and memory module 40 in a data processing device. The coordinated operation of the first heat dissipation component 10 and the second heat dissipation component 20 allows the heat from the CPU and memory module 40 to be efficiently transferred to the coolant, avoiding the efficiency losses of traditional air cooling or long-distance heat conduction. This reduces the temperature of the processor 30 and memory module 40, improves the heat dissipation effect, and enhances the performance and stability of the data processing device. At the same time, the optimized liquid cooling and heat conduction structure reduces space occupation, ensures the reliability and durability of the heat dissipation device, and reduces maintenance costs.

[0047] In one embodiment, the first heat dissipation assembly 10 can be made of a highly thermally conductive material such as copper or aluminum alloy to improve heat exchange efficiency. The first heat dissipation assembly 10 employs a modular design, and its flow channel 15 utilizes a multi-layer microchannel structure to increase the heat dissipation area and coolant flow efficiency. The liquid inlet 12 and liquid outlet 13 of the first heat dissipation assembly 10 are positioned on opposite sides to increase the coolant flow distance and enhance heat dissipation.

[0048] In one embodiment, the contact areas between the processor 30 and the first heat sink 10, between the memory module 40 and the second heat sink 20, and between the first heat sink 10 and the second heat sink 20 are filled with a highly thermally conductive material such as thermal grease to reduce thermal resistance and improve heat transfer efficiency. The first heat sink 10 and the second heat sink 20 are secured by bonding, snap-fitting, or bolting to improve connection stability and ensure effective heat dissipation. Alternatively, the second heat sink 20 and the first heat sink 10 are formed using an integrated molding process to reduce connection thermal resistance.

[0049] Combine Figure 3 As shown, Figure 3The figure is a schematic diagram of the structure of the first heat dissipation assembly 10 and the second heat dissipation assembly 20 provided in one embodiment of the present application. In some embodiments, the second heat dissipation assembly 20 is pressed above the first heat dissipation assembly 10, with a gap between the ends of the second heat dissipation assembly 20 and the first heat dissipation assembly 10. The ends of the second heat dissipation assembly 20 are respectively located above the memory module 40.

[0050] Specifically, a plane that fits the surface of the processor 30 is provided at the bottom of the first heat dissipation component 10 , and the first heat dissipation component 10 is installed above the processor 30 using the plane to absorb the heat of the processor 30 .

[0051] The second heat sink 20 is made of a highly thermally conductive material and is generally in the shape of a strip or plate. The second heat sink 20 is pressed against the first heat sink 10, with a gap between the ends of the second heat sink 20 and the first heat sink 10. This means that space is reserved below the second heat sink 20 for mounting the first heat sink 10, preventing interference with the first heat sink 10 and affecting its heat dissipation.

[0052] Both ends of the second heat dissipation component 20 extend downward respectively, and the extended portion is arranged above the memory module 40 and contacts the memory module 40, so as to absorb the heat generated by the memory module 40 and transfer it to the first heat dissipation component 10 through the contact portion between the second heat dissipation component 20 and the first heat dissipation component 10, thereby achieving a synergistic heat dissipation effect.

[0053] In one embodiment, the second heat dissipation component 20 includes a heat expansion component 21 and a heat conductive component 22. The heat expansion component 21 is horizontally arranged above the first heat dissipation component 10 and is thermally connected to the first heat dissipation component 10; the two heat conductive components 22 are respectively longitudinally arranged at both ends of the heat expansion component 21, and one end of the heat conductive component 22 is used to be inserted into the memory module 40.

[0054] Specifically, the second heat sink assembly 20 is composed of a horizontally arranged heat expansion member 21 and a longitudinally arranged heat conducting member 22, forming an I-shaped overall structure. The heat expansion member 21 is made of copper or aluminum alloy, or is formed by extrusion of an aluminum alloy. The heat expansion member 21 is arranged horizontally directly above the first heat sink assembly 10. Its bottom surface is tightly thermally connected to the upper surface of the first heat sink assembly 10 via a highly thermally conductive interface material. This allows the heat absorbed by the heat conducting member 22 from the memory module 40 to be diffused and transferred to the first heat sink assembly 10 for heat dissipation.

[0055] In this embodiment, the high thermal conductivity interface material is thermal grease or a phase change thermal pad with a thermal conductivity greater than 5 W / m·K.

[0056] The heat conductors 22 are copper heat pipes or aluminum alloy extrusions. They are longitudinally positioned at either end of the thermal expansion member 21, forming a symmetrical heat dissipation fin structure that transfers heat generated by the memory module 40 to the thermal expansion member 21 for dissipation.

[0057] The thermal conductor 22 is a copper heat sink with a wedge-shaped structure at its end to facilitate insertion into the gap between the memory modules 40. Each thermal conductor 22 can simultaneously contact the sides of two adjacent memory modules 40, achieving dual-sided heat dissipation. The insertion portion of the thermal conductor 22 is nickel-plated to ensure thermal conductivity and prevent oxidation. The thermal conductor 22 is fixed to the heat expansion member 21 through integral molding, welding, or bolting.

[0058] In one embodiment, the heat conducting member 22 includes a plurality of heat conducting plates 221 spaced apart longitudinally, and the ends of the plurality of heat conducting plates 221 away from the heat expansion member 21 are respectively used to be inserted between the plurality of memory modules 40 , and the outer side walls of the heat conducting plates 221 are in contact with the outer side walls of the memory modules 40 .

[0059] Specifically, the heat conducting member 22 includes a plurality of heat conducting plates 221 spaced longitudinally and arranged in parallel. The number of heat conducting plates 221 matches the number of slots in the memory modules 40. The end of the heat conducting plate 221, which is away from the heat expansion member 21 and is located at the insertion end of the heat conducting plate 221, is configured in a wedge-shaped structure to facilitate insertion between the memory modules 40. The outer wall of the insertion end of the heat conducting plate 221 contacts the outer wall of the memory modules 40, absorbing heat generated by the memory modules 40 through the principle of heat conduction.

[0060] The heat conducting plate 221 is made of a highly thermally conductive material, such as a copper alloy plate, and its surface is anodized. The longitudinal height of the heat conducting plate 221 at least covers the heating area of the memory module 40 to ensure the heat conduction effect of the heat conducting plate 221 and improve the heat dissipation efficiency.

[0061] In one embodiment, a plurality of heat pipes 211 are provided in the heat expansion member 21 and are arranged at intervals in a transverse direction. The heat pipes 211 are connected to the heat conducting plate 221 and are covered on the first heat dissipation component 10. The heat pipes 211 are configured to transfer the heat absorbed from the heat conducting plate 221 to the first heat dissipation component 10.

[0062] Specifically, the heat expansion member 21 includes multiple heat pipes 211 arranged in parallel and spaced laterally from each other. These heat pipes 211 are positioned perpendicular to the heat conducting plate 221 and are welded to one end of the heat conducting plate 221. The heat pipes 211 are longer than the first heat dissipation assembly 10, allowing them to extend over the first heat dissipation assembly 10. The heat pipes 211 utilize the working medium within them and, through the phase change principle of the working medium, absorb and transfer heat from the heat conducting plate 221 to the first heat dissipation assembly 10 for dissipation.

[0063] In one embodiment, thermally conductive materials are provided at the contact areas between the first heat dissipation assembly 10 and the processor 30, the contact areas between the first heat dissipation assembly 10 and the second heat dissipation assembly 20 (i.e., between the bottom of the heat expansion member 21 and the top of the first heat dissipation assembly 10), and the contact areas between the second heat dissipation assembly 20 and the memory module 40 (i.e., between the heat conducting plate 221 and the memory module 40). These thermally conductive materials have excellent thermal conductivity and filling properties, effectively filling the tiny gaps between the contact surfaces and improving heat transfer efficiency.

[0064] Combine Figure 4 As shown, Figure 4 Schematic diagram of the structure of the cooling member 11 provided in one embodiment of the present application. In some embodiments, the first heat dissipation assembly 10 includes a cooling member 11, one end of the cooling member 11 is connected to the heat expansion member 21, and the other end is used to be installed above the processor 30.

[0065] Specifically, the cooling element 11 is an elongated strip, with its top tightly connected to the thermal expansion element 21, ensuring efficient heat transfer from the thermal expansion element 21 to the cooling element 11. The bottom of the cooling element 11 is mounted above the processor 30, absorbing and dissipating heat from the processor 30. This creates a good heat conduction path between the cooling element 11, the thermal expansion element 21, and the processor 30, improving heat dissipation efficiency.

[0066] In one embodiment, the cooling element 11 includes a liquid inlet 12 and a liquid outlet 13, with the liquid inlet 12 and the liquid outlet 13 being located on opposite sides. A chamber 14 is provided within the cooling element 11, with one end of the chamber 14 communicating with the liquid inlet 12 and the other end communicating with the liquid outlet 13. The chamber 14 is configured to guide the flow of the coolant.

[0067] Specifically, a chamber 14 is provided in the cooling element 11. The cooling element 11 is also provided with a liquid inlet connected to one end of the chamber 14, and a liquid outlet 13 connected to the other end of the chamber 14, and the liquid inlet 12 and the liquid outlet 13 are arranged on opposite sides. The liquid inlet 12 is used to introduce external coolant, and the chamber 14 is used to guide the orderly flow of the coolant. The coolant will fully exchange heat with the outer wall of the cooling element 11 and absorb the heat generated by the processor 30. As the coolant continues to flow, its temperature gradually increases, and eventually it is discharged from the chamber 14 through the liquid outlet 13. The way in which the liquid inlet 12 and the liquid outlet 13 are arranged on opposite sides helps the coolant form a longer flow path inside the cooling element 11, thereby increasing the heat exchange time and improving the heat dissipation effect.

[0068] Combine Figure 5 As shown, Figure 5Schematic diagram of the flow channel 15 and fin structure 16 provided in one embodiment of the present application. In some embodiments, the cooling element 11 is a cold plate structure, and the flow channel 15 is provided within the cavity 14 of the cold plate structure. The flow direction of the coolant in the flow channel 15 is perpendicular to the direction of heat transfer from the first heat dissipation component 10 or the second heat dissipation component 20.

[0069] Specifically, cooling element 11 utilizes a cold plate structure, made from highly thermally conductive materials such as copper alloy or aluminum alloy, offering excellent thermal conductivity. A chamber 14 is located within the cold plate structure to accommodate coolant. A flow channel 15 is provided within chamber 14 to guide the coolant's flow path, achieving efficient heat exchange.

[0070] The flow direction of the coolant in the flow channel 15 is perpendicular to the direction in which the first heat dissipation component 10 or the second heat dissipation component 20 transfers heat. Specifically, when the heat generated by the processor 30 below is transferred upward to the cold plate structure through the first heat dissipation component 10, or when the heat diffused by the second heat dissipation component 20 above is transferred downward to the cold plate structure, the heat is mainly transferred in a direction perpendicular to the plane of the cold plate structure. The flow direction of the coolant in the flow channel 15 is perpendicular to the heat transfer direction, that is, parallel to the plane of the cold plate structure. This design allows the coolant to more fully exchange heat with the cold plate structure, thereby improving heat dissipation efficiency.

[0071] In one embodiment, a plurality of fin structures 16 are provided in the chamber 14 . The plurality of fin structures 16 are arranged parallel to the liquid inlet direction of the liquid inlet 12 and spaced apart to form a flow channel 15 .

[0072] Specifically, a plurality of fin structures 16 are provided in the chamber 14. These fin structures 16 are made of a highly thermally conductive material and are tightly connected to the wall of the chamber 14. The fin structures 16 are used to increase the contact area between the coolant and the wall of the chamber 14, thereby improving the heat exchange efficiency.

[0073] Multiple fin structures 16 are spaced parallel to the direction of liquid inlet 12, forming flow channels 15. Specifically, after the coolant enters chamber 14 through liquid inlet 12, it flows along the gaps between the fin structures 16, forming an orderly flow field. This design allows the coolant to more effectively exchange heat with the fin structures 16 and the walls of chamber 14, removing heat generated by processor 30.

[0074] The height of the fin structure 16 can be adjusted according to the flow characteristics of the coolant and the heat exchange requirements to optimize the flow field distribution in the flow channel 15; the spacing of the fin structure 16 is determined according to the flow rate of the coolant and the heat dissipation requirements to ensure that the coolant can fully fill the flow channel 15 and fully exchange heat with the fin structure 16.

[0075] In this embodiment, the data processing device includes a mainboard 50 , on which a processor 30 , a memory module 40 , a chip module 60 and a power module 70 are mounted.

[0076] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above embodiments merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A heat dissipation device for a data processing device, characterized in that: include: a first heat dissipation assembly (10) for being mounted above the processor (30), wherein the first heat dissipation assembly (10) is configured to absorb heat from the processor (30); a second heat dissipation component (20) disposed above the first heat dissipation component (10), at least one end of the second heat dissipation component (20) being used to be mounted above the memory module (40), and the second heat dissipation component (20) being configured to transfer heat from the memory module (40) to the second heat dissipation component (20) for diffusion and then to the first heat dissipation component (10); The first heat dissipation component (10) comprises a liquid inlet (12) and a liquid outlet (13); the coolant flows into the first heat dissipation component (10) from the liquid inlet (12), and flows out from the liquid outlet (13) after absorbing heat.

2. The heat dissipation device for a data processing device according to claim 1, characterized in that: There is a distance between the two ends of the second heat dissipation component (20) and the first heat dissipation component (10), the two ends of the second heat dissipation component (20) are respectively arranged above the memory module (40), and the first heat dissipation component (10) is arranged within the distance.

3. The heat dissipation device for a data processing device according to any one of claims 1 to 2, characterized in that: The second heat dissipation component (20) includes a heat expansion component (21) and a heat conduction component (22). The heat expansion component (21) is arranged horizontally above the first heat dissipation component (10) and is thermally connected to the first heat dissipation component (10). The two heat conduction components (22) are respectively arranged longitudinally at the two ends of the heat expansion component (21). One end of the heat conduction component (22) is used for being plugged into the memory module (40).

4. The heat dissipation device for a data processing device according to claim 3, characterized in that: The first heat dissipation component (10) includes a cooling element (11), one end of which is connected to the heat expansion element (21), and the other end of which is used to be installed above the processor (30); the cooling element (11) includes a liquid inlet (12) and a liquid outlet (13), and the liquid inlet (12) is arranged on opposite sides of the liquid outlet (13).

5. The heat dissipation device for a data processing device according to claim 4, characterized in that: A chamber (14) is provided in the cooling element (11), one end of the chamber (14) is connected to the liquid inlet (12), and the other end is connected to the liquid outlet (13), and the chamber (14) is configured to guide the flow of the cooling liquid.

6. The heat dissipation device for a data processing device according to claim 5, characterized in that: The cooling element (11) is a cold plate structure, a flow channel (15) is provided in a chamber (14) of the cold plate structure, and a flow direction of the coolant in the flow channel (15) is perpendicular to a direction in which the first heat dissipation component (10) or the second heat dissipation component (20) transfers heat.

7. The heat dissipation device for a data processing device according to claim 6, characterized in that: A plurality of fin structures (16) are provided in the chamber (14), and the plurality of fin structures (16) are arranged in parallel with the liquid inlet direction of the liquid inlet (12) and spaced apart to form the flow channel (15).

8. The heat dissipation device for a data processing device according to claim 3, characterized in that: The heat conducting member (22) comprises a plurality of heat conducting plates (221) spaced apart longitudinally, wherein ends of the plurality of heat conducting plates (221) away from the heat expansion member (21) are respectively used to be inserted between a plurality of memory modules (40), and outer side walls of the heat conducting plates (221) are in contact with outer side walls of the memory modules (40).

9. The heat dissipation device for a data processing device according to claim 8, characterized in that: A plurality of heat pipes (211) arranged at intervals in a transverse direction are provided in the heat expansion member (21), the heat pipes (211) are connected to the heat conducting plate (221), the heat pipes (211) are covered on the first heat dissipation component (10), and the heat pipes (211) are configured to transfer heat absorbed from the heat conducting plate (221) to the first heat dissipation component (10).

10. The heat dissipation device for a data processing device according to claim 1, characterized in that: The contact portion between the first heat dissipation component (10) and the processor (30), the contact portion between the first heat dissipation component (10) and the second heat dissipation component (20), and the contact portion between the second heat dissipation component (20) and the memory module (40) are all provided with heat conductive material.

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