Low-frequency two-stage inductive voltage divider and manufacturing method and device thereof

Abstract

The invention provides a low-frequency two-stage inductive voltage divider and a manufacturing method and device.The low-frequency two-stage inductive voltage divider comprises a first-stage inductive voltage divider body and a second-stage inductive voltage divider body, the first-stage inductive voltage divider body is composed of a first winding and a first iron core, and the first winding is wound around the first iron core; the second-stage inductive voltage divider is composed of a second winding and a second iron core, and the second winding is wound on the first iron core and the second iron core at the same time. According to the voltage divider, a two-stage excitation method is adopted, excitation current can be reduced, meanwhile, in order to reduce the influence of magnetic errors, a shielding type structure is designed, coaxial cables are wound in a ten-wire parallel mode, the influence of leakage current is reduced, and the error of the 1kV low-frequency induction voltage divider is better than 1 * 10 <-7 > on the premise that no electronic compensation circuit exists.

Description

Technical Field

[0001] The present invention relates to the technical field of software installation, and more particularly, to a method and device for manufacturing a low-frequency double-stage induction voltage divider. Background Art

[0002] Low-frequency power transmission technology is a new type of efficient AC power transmission technology based on fully controlled power electronic devices. By using a high-voltage and large-capacity converter, the 50Hz power frequency is reduced to around 20Hz low frequency, reducing the line impedance. By exploring the potential of the frequency dimension, the system power transmission capacity and flexible regulation capacity are improved. As a key metering / measurement device for low-frequency power transmission projects, the applicable range of existing transformer development technologies in the low-frequency field is restricted. The rated voltage of the induction voltage divider generally does not exceed 1kV. The reasons why its voltage level and accuracy level are difficult to improve are as follows: 1) Insulation is difficult, especially the insulation treatment of numerous lead-out wires is very complex; 2) As the voltage increases, the influence of leakage current increases; 3) It cannot be wound like a low-voltage induction voltage divider by twisting 10 wires together, so it is difficult to ensure that the resistance, leakage inductance, and divided voltage of each winding segment are the same. Summary of the Invention

[0003] In order to solve the technical problem that the voltage level and accuracy of low-frequency transformers in the prior art are difficult to improve, the present invention provides a low-frequency double-stage induction voltage divider, its manufacturing method, and device.

[0004] According to one aspect of the present invention, the present invention provides a low-frequency double-stage induction voltage divider, which includes a first-stage induction voltage divider and a second-stage induction voltage divider, wherein:

[0005] The first-stage induction voltage divider consists of a first winding and a first iron core, and the first winding is wound around the first iron core;

[0006] The second-stage induction voltage divider consists of a second winding and a second iron core, and the second winding is wound around both the first iron core and the second iron core simultaneously.

[0007] Optionally, the second winding is wound by multiple wires of a coaxial cable in parallel, and the multiple wires wound in parallel are connected in series at the head and tail.

[0008] Optionally, the second winding is wound by 10 wires of a coaxial cable in parallel.

[0009] According to another aspect of the present invention, the present invention provides a method for manufacturing a low-frequency double-stage induction voltage divider, the method comprising:

[0010] Obtain a first winding and a first iron core, and wind the first winding around the first iron core to form a first-stage induction voltage divider;

[0011] Obtain a second winding and a second iron core, and wind the second winding around the first iron core and the second iron core simultaneously to form a second-stage induction voltage divider;

[0012] Form a low-frequency two-stage induction voltage divider according to the first-stage induction voltage divider and the second-stage induction voltage divider.

[0013] Optionally, before obtaining the second winding and the second iron core, the method further includes winding the second winding with multiple coaxial cables in parallel, and the multiple wires wound in parallel are connected in series at the head and tail.

[0014] Optionally, winding the second winding with multiple coaxial cables in parallel means winding the second winding with 10 coaxial cables in parallel.

[0015] According to another aspect of the present invention, the present invention provides a manufacturing device for a low-frequency two-stage induction voltage divider, and the device includes:

[0016] A first manufacturing module, configured to obtain a first winding and a first iron core, and wind the first winding around the first iron core to form a first-stage induction voltage divider;

[0017] A second manufacturing module, configured to obtain a second winding and a second iron core, and wind the second winding around the first iron core and the second iron core simultaneously to form a second-stage induction voltage divider;

[0018] A third manufacturing module, configured to form a low-frequency two-stage induction voltage divider according to the first-stage induction voltage divider and the second-stage induction voltage divider.

[0019] Optionally, the second manufacturing module is further configured to wind the second winding with multiple coaxial cables in parallel, and the multiple wires wound in parallel are connected in series at the head and tail.

[0020] Optionally, winding the second winding with multiple coaxial cables in parallel by the second manufacturing module means winding the second winding with 10 coaxial cables in parallel.

[0021] According to yet another aspect of the present invention, the present invention provides a computer-readable storage medium, and the storage medium stores a computer program, and the computer program is used to execute the method described in any of the above aspects of the present invention.

[0022] According to yet another aspect of the present invention, an electronic device is provided, and the electronic device includes: a processor; a memory for storing executable instructions of the processor; the processor is configured to read the executable instructions from the memory and execute the instructions to implement the method described in any of the above aspects of the present invention.

[0023] The low-frequency two-stage inductive voltage divider and its manufacturing method and device described in the present invention include a first-stage inductive voltage divider and a second-stage inductive voltage divider. The first-stage inductive voltage divider is composed of a first winding and a first core, the first winding being wound on the first core; the second-stage inductive voltage divider is composed of a second winding and a second core, the second winding being wound on both the first core and the second core. The voltage divider adopts a two-stage excitation principle and is designed with a cross-shielded structure to reduce the influence of magnetic errors. It also uses 10 coaxial cables in parallel to reduce the influence of leakage current. Without a compensation circuit, the error of the 1kV low-frequency inductive voltage divider is better than 1×10 -7 , which improves the accuracy of the 1kV low-frequency inductive voltage divider and ensures the accuracy of the value source of the low-frequency voltage proportional value traceability system. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] A more complete understanding of exemplary embodiments of the present invention may be obtained by referring to the following drawings:

[0025] Figure 1 2 is a schematic structural diagram of a low-frequency two-stage inductive voltage divider according to a preferred embodiment of the present invention;

[0026] Figure 2 2 is a schematic diagram showing the principle of a low-frequency two-stage inductive voltage divider according to a preferred embodiment of the present invention;

[0027] Figure 3 A schematic diagram of a method for manufacturing a low-frequency two-stage inductive voltage divider according to a preferred embodiment of the present invention;

[0028] Figure 4 A schematic structural diagram of a device for manufacturing a low-frequency two-stage inductive voltage divider according to a preferred embodiment of the present invention;

[0029] Figure 5 Schematic diagram of the structure of an electronic device according to a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0030] Exemplary embodiments of the present invention will now be described with reference to the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. These embodiments are provided to provide a thorough and complete disclosure of the present invention and to fully convey the scope of the present invention to those skilled in the art. The terminology used in the exemplary embodiments shown in the accompanying drawings is not intended to limit the present invention. In the accompanying drawings, identical elements are denoted by the same reference numerals.

[0031] Unless otherwise specified, the terms used herein (including technical terms) have the ordinary meaning understood by those skilled in the art. In addition, it can be understood that the terms defined in the commonly used dictionary should be understood as having a consistent meaning with the context of their related fields, rather than being understood as idealized or overly formal meanings.

[0032] Exemplary voltage divider

[0033] Figure 1 It is a structural schematic diagram of a low-frequency double-stage induction voltage divider according to a preferred embodiment of the present invention. As Figure 1 shown, the low-frequency double-stage induction voltage divider described in this preferred embodiment includes a first-stage induction voltage divider 101 and a second-stage induction voltage divider 102. The no-load voltage drop of the first-stage induction voltage divider 101 is applied to the primary side of the second-stage induction voltage divider 102, so that the no-load voltage drop of the second-stage induction voltage divider 102 is reduced, thereby reducing the second-stage excitation current and improving the accuracy level of the induction voltage divider. Among them:

[0034] The first-stage induction voltage divider 101 is composed of a first winding W1 and a first iron core C1, and the first winding W1 is wound around the first iron core C1;

[0035] The second-stage induction voltage divider 102 is composed of a second winding W2 and a second iron core C2, and the second winding W2 is wound around both the first iron core C1 and the second iron core C2 simultaneously.

[0036] Preferably, the second winding W2 is wound by multiple wires of coaxial cable in parallel, and the multiple wires wound in parallel are connected in series at the head and tail.

[0037] Preferably, the second winding W2 is wound by 10 wires of coaxial cable in parallel.

[0038] In this preferred embodiment, the first winding W1 and the second winding W2 excite the first iron core C1 and the second iron core C2 respectively. Therefore, it is called double-stage excitation. Among them, the second winding W2 is wound by multiple wires in parallel based on the autotransformer principle and is connected in series at the head and tail. Therefore, it is called an induction voltage divider. When the input voltage is U1, the output voltage is U2. Further, the second winding W2 is wound by 10 wires of coaxial cable in parallel on the iron core C2, reducing the influence of leakage current. On the premise of no compensation circuit, the error of the 1kV low-frequency induction voltage divider is better than 1×10 -7 , ensuring the accuracy of low-frequency voltage measurement within 15Hz - 30Hz.

[0039] Figure 2 It is a principle schematic diagram of a low-frequency double-stage induction voltage divider according to a preferred embodiment of the present invention. As Figure 2 shown, when the first stage is a no-load induction voltage divider:

[0040]

[0041] In the formula, is the primary induced electromotive force of the first-stage induction voltage divider, that is, the induced electromotive force of winding W1 on iron core C1. is the exciting current of the first-stage induction voltage divider, and Z1 is the internal impedance of W1.

[0042] Then the magnetic error of the first-stage transformer is:

[0043]

[0044] In the formula, Z m1 is the exciting impedance of the first-stage induction voltage divider, and Z m1 >>Z1.

[0045] Since W2 is wound around iron cores C1 and C2 at the same time, the induced electromotive forces generated by W2 on iron cores C1 and C2 are respectively and Therefore, when the induction voltage divider is no-load:

[0046]

[0047] In the formula, is the exciting current of the second-stage transformer, is the primary induced electromotive force of the second-stage induction voltage divider, and Z2 is the internal impedance of W2.

[0048] By combining formula (**1**) and formula (**3**), we can get

[0049]

[0050] From formula (**4**), for the second-stage induction voltage divider composed of W2 and C2, its primary voltage is equivalent to the primary voltage drop of the first-stage induction voltage divider. Therefore, the magnetic error of the second-stage induction voltage divider:

[0051]

[0052] In the formula, Z m2 is the exciting impedance of the second-stage induction voltage divider, and Z m2 >>Z2.

[0053] Therefore, by combining formula (**2**) and formula (**5**), the error expression of the double-stage exciting induction voltage divider under no-load conditions can be obtained:

[0054]

[0055] As can be seen from Equation (6), the double-stage excitation induction voltage divider is equivalent to adding the no-load voltage drop of the first-stage induction voltage divider to the primary side of the second-stage induction voltage divider, which reduces the no-load voltage drop of the second-stage induction voltage divider. The error of the double-stage excitation induction voltage divider is determined by the no-load voltage drop of the second stage and is the negative value of the product of the magnetic errors of the first and second stages. Therefore, in this embodiment, the double-stage excitation method is adopted to reduce the excitation current. At the same time, to reduce the influence of magnetic errors, a shielded structure is designed, and coaxial cables are wound in parallel with multiple wires to reduce the influence of leakage current. Without any electronic compensation circuit, the error of the 1kV low-frequency induction voltage divider is better than 1×10 -7 , effectively improving the accuracy level of the induction voltage divider.

[0056] Exemplary method

[0057] Figure 3 FIG. is a flowchart of a method for manufacturing a low-frequency double-stage induction voltage divider according to a preferred embodiment of the present invention. As Figure 3 shown, the method for manufacturing the low-frequency double-stage induction voltage divider according to this preferred embodiment starts from step 301.

[0058] In step 301, a first winding and a first iron core are obtained, and the first winding is wound around the first iron core to form a first-stage induction voltage divider.

[0059] In step 302, a second winding and a second iron core are obtained, and the second winding is simultaneously wound around the first iron core and the second iron core to form a second-stage induction voltage divider.

[0060] In step 3, a low-frequency double-stage induction voltage divider is formed according to the first-stage induction voltage divider and the second-stage induction voltage divider.

[0061] Preferably, before obtaining the second winding and the second iron core, the method further includes winding the second winding with multiple coaxial cables in parallel, and the multiple wires wound in parallel are connected in series at the head and tail.

[0062] Preferably, the winding of the second winding with multiple coaxial cables in parallel means winding the second winding with 10 coaxial cables in parallel.

[0063] The manufacturing method of the low-frequency double-stage induction voltage divider described in this preferred embodiment includes obtaining a first winding and a first iron core, winding the first winding around the first iron core to form a first-stage induction voltage divider; obtaining a second winding and a second iron core, and winding the second winding around both the first iron core and the second iron core simultaneously to form a second-stage induction voltage divider; forming a low-frequency double-stage induction voltage divider based on the first-stage induction voltage divider and the second-stage induction voltage divider. The double-stage excitation method is adopted to reduce the excitation current. At the same time, to reduce the influence of magnetic errors, a shielding structure is designed, and coaxial cables are wound in multiple strands in parallel, reducing the influence of leakage current. Without any electronic compensation circuit, the error of the 1 kV low-frequency induction voltage divider is better than 1×10 -7 , effectively improving the accuracy level of the low-frequency induction voltage divider.

[0064] Exemplary device

[0065] Figure 4 FIG. is a schematic structural diagram of the manufacturing device of the low-frequency double-stage induction voltage divider according to the preferred embodiment of the present invention. As Figure 4 shown, the manufacturing device 400 of the low-frequency double-stage induction voltage divider described in this preferred embodiment includes:

[0066] A first manufacturing module 401, configured to obtain a first winding and a first iron core, and wind the first winding around the first iron core to form a first-stage induction voltage divider;

[0067] A second manufacturing module 402, configured to obtain a second winding and a second iron core, and wind the second winding around both the first iron core and the second iron core simultaneously to form a second-stage induction voltage divider;

[0068] A third manufacturing module 403, configured to form a low-frequency double-stage induction voltage divider based on the first-stage induction voltage divider and the second-stage induction voltage divider.

[0069] Preferably, the second manufacturing module 402 is further configured to wind the second winding with coaxial cables in multiple strands in parallel, and the multiple strands wound in parallel are connected in series at the head and tail.

[0070] Preferably, winding the second winding with coaxial cables in multiple strands in parallel by the second manufacturing module 402 means winding the second winding with 10 coaxial cables in parallel.

[0071] The steps of manufacturing the low-frequency double-stage induction voltage divider by the manufacturing device of the low-frequency double-stage induction voltage divider described in this preferred embodiment are the same as those of the manufacturing method of the low-frequency double-stage induction voltage divider, and the achieved technical effects are also the same, so they will not be elaborated here.

[0072] Exemplary electronic device

[0073] Figure 5 Schematic diagram of the structure of an electronic device according to a preferred embodiment of the present invention. The electronic device may be either or both of the first device and the second device, or a stand-alone device independent of them, and the stand-alone device may communicate with the first device and the second device to receive the input signals collected from them. Figure 5 Block diagram of an electronic device according to an embodiment of the present disclosure is illustrated. As Figure 5 shown, the electronic device includes one or more processors 501 and a memory 502.

[0074] The processor 501 may be a central processing unit (CPU) or other forms of processing units having data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

[0075] The memory 502 may include one or more computer program products, and the computer program products may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory, etc. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage media, and the processor 501 may run the program instructions to implement the energy consumption anomaly diagnosis method based on the enterprise energy consumption space of the various embodiments disclosed above and / or other desired functions. In one example, the electronic device may further include: an input device 503 and an output device 504, and these components are interconnected through a bus system and / or other forms of connection mechanisms (not shown).

[0076] In addition, the input device 503 may further include, for example, a keyboard, a mouse, etc.

[0077] The output device 504 may output various information to the outside. The output device 504 may include, for example, a display, a speaker, a printer, and a communication network and its connected remote output devices, etc.

[0078] Of course, for simplicity, Figure 5 only some of the components related to the present disclosure in the electronic device are shown in, and components such as buses, input / output interfaces, etc. are omitted. In addition, according to specific application scenarios, the electronic device may further include any other appropriate components.

[0079] Exemplary computer program product and computer-readable storage medium

[0080] In addition to the above methods and devices, embodiments of the present disclosure may also be computer program products, which include computer program instructions that, when executed by a processor, cause the processor to execute the steps in the method for manufacturing a low-frequency dual-stage induction voltage divider according to various embodiments of the present disclosure described in the "Exemplary Method" section above in this specification.

[0081] The computer program product may be written in any combination of one or more programming languages for programming code to perform the operations of the embodiments of the present disclosure. The programming languages include object-oriented programming languages such as Java, C++, etc., and also include conventional procedural programming languages such as the "C" language or similar programming languages. The programming code may be executed entirely on the user's computing device, partially on the user's device, executed as an independent software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0082] Furthermore, embodiments of the present disclosure may also be computer-readable storage media, on which computer program instructions are stored that, when executed by a processor, cause the processor to execute the steps in the method for manufacturing a low-frequency dual-stage induction voltage divider according to various embodiments of the present disclosure described in the "Exemplary Method" section above in this specification.

[0083] The computer-readable storage media may employ any combination of one or more readable media. The readable media may be a readable signal medium or a readable storage medium. The readable storage medium may, for example, include but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or components, or any combination of the above. More specific examples of the readable storage medium (non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0084] The basic principles of the present disclosure have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, benefits, effects, etc. mentioned in the present disclosure are only examples and not limitations, and it cannot be considered that these advantages, benefits, effects, etc. are essential for each embodiment of the present disclosure. In addition, the above specific details are only for illustrative and facilitating understanding purposes, rather than limitations. The above details do not limit the present disclosure to necessarily adopt the above specific details for implementation.

[0085] In the present specification, each embodiment is described in a progressive manner. The key point of each embodiment is the difference from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other. For system embodiments, since they basically correspond to method embodiments, the description is relatively simple. For related parts, reference can be made to the partial description of the method embodiments.

[0086] The block diagrams of devices, apparatuses, equipment, and systems involved in the present disclosure are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "comprising", "including", "having", etc. are open-ended terms, meaning "including but not limited to", and can be used interchangeably with each other. The word "or" and "and" used herein refer to the word "and / or", and can be used interchangeably with each other, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to", and can be used interchangeably with each other.

[0087] The devices and methods of the present disclosure can be implemented in many ways. For example, the devices and methods of the present disclosure can be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above order of the steps for the method is only for illustration. The steps of the method of the present disclosure are not limited to the specific order described above, unless otherwise specifically stated. In addition, in some embodiments, the present disclosure can also be implemented as a program recorded in a recording medium, and these programs include machine-readable instructions for implementing the method according to the present disclosure. Therefore, the present disclosure also covers a recording medium storing a program for executing the method according to the present disclosure.

[0088] It should also be noted that in the devices, equipment, and methods of the present disclosure, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present disclosure. The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these aspects are very obvious to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the aspects shown herein, but to the broadest scope consistent with the principles and novel features disclosed herein.

[0089] The above description has been given for purposes of illustration and description. In addition, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions, and sub-combinations thereof.

Claims

1. A low-frequency two-stage inductive voltage divider, characterized in that: The voltage divider includes a first-stage inductive voltage divider and a second-stage inductive voltage divider, wherein: The first-stage inductive voltage divider is composed of a first winding and a first core, wherein the first winding is wound on the first core; The second-stage inductive voltage divider is composed of a second winding and a second iron core, and the second winding is wound on both the first iron core and the second iron core.

2. The low-frequency two-stage inductive voltage divider according to claim 1, characterized in that: The second winding is formed by winding multiple coaxial cables in parallel, and the multiple parallel-wound cables are connected in series end to end.

3. The low-frequency two-stage inductive voltage divider according to claim 2, characterized in that: The second winding is wound in parallel using 10 coaxial cables.

4. A method for manufacturing a low-frequency two-stage inductive voltage divider, characterized in that: The method comprises: Obtaining a first winding and a first core, and winding the first winding on the first core to form a first-stage inductive voltage divider; Obtaining a second winding and a second iron core, and winding the second winding on the first iron core and the second iron core at the same time to form a second-stage inductive voltage divider; A low-frequency double-stage inductive voltage divider is formed by the first-stage inductive voltage divider and the second-stage inductive voltage divider.

5. The method according to claim 4, characterized in that Before obtaining the second winding and the second core, the method further includes winding the second winding in parallel using multiple wires of a coaxial cable, and connecting the multiple wires in parallel in series end to end.

6. The method according to claim 5, characterized in that Said adopting the coaxial cable to wind the second winding in parallel means adopting the coaxial cable to wind the second winding in parallel with 10 wires.

7. A device for manufacturing a low-frequency two-stage inductive voltage divider, characterized in that: The device comprises: a first manufacturing module, configured to obtain a first winding and a first core, and wind the first winding on the first core to form a first-stage inductive voltage divider; A second manufacturing module is used to obtain a second winding and a second core, and wind the second winding on the first core and the second core at the same time to form a second-stage inductive voltage divider; The third manufacturing module is configured to construct a low-frequency two-stage inductive voltage divider according to the first-stage inductive voltage divider and the second-stage inductive voltage divider.

8. A computer-readable storage medium, characterized in that The storage medium stores a computer program, and the computer program is used to execute the method according to any one of claims 4 to 6.

9. An electronic device, characterized in that: The electronic device comprises: processor; a memory for storing instructions executable by the processor; The processor is configured to read the executable instructions from the memory and execute the instructions to implement the method according to any one of claims 4 to 6.

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