Cleaning device and cleaning method for semiconductor wafer

Abstract

The present invention discloses a cleaning device for semiconductor wafers and a cleaning method thereof, which belong to the technical field of semiconductor cleaning. The cleaning device for semiconductor wafers comprises: a cleaning tank, a cleaning component and a carrier, wherein the cleaning tank is used to accommodate wafers; the cleaning component is installed on the inner wall of the cleaning tank, and the wafers in the cleaning tank are rinsed by the cleaning component; the carrier is installed in the middle of the cleaning tank, and the carrier can rotate back and forth, the wafer can be placed on the carrier and rotate with the carrier, and when the wafer rotates with the carrier, the spraying direction of the cleaning agent in the cleaning component will gradually shift from toward the edge of the wafer to toward the surface of the wafer, and at the same time, when the spraying direction of the cleaning agent gradually shifts from toward the edge of the wafer to toward the surface of the wafer, the spraying pressure of the cleaning agent will synchronously decrease; the present application can, on the basis of ensuring that the wafer is not damaged, deflect the wafer so that the dirt on its surface is rinsed by more cleaning agent to effectively improve the cleaning ability.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cleaning, and more particularly to a cleaning device and a cleaning method for semiconductor wafers. Background Art

[0002] Semiconductor wafers are the core basic materials of the semiconductor industry. They are thin slices made of high-purity silicon through a series of complex processes. After production is completed and before use, their surfaces need to be cleaned. In addition, since semiconductor wafers are thin slices, they are easily damaged. Therefore, they are generally cleaned with dedicated cleaning equipment to reduce the damage rate and ensure cleaning efficiency.

[0003] At present, conventional cleaning devices are roughly composed of a carrier and a spray pipe. When in use, the wafers to be cleaned are placed on the carrier, and then the cleaning agent is sprayed on the wafer surface through the spray pipe to complete the cleaning. In addition, in order to improve the cleaning efficiency, a cleaning rack is generally placed on the carrier. The cleaning rack is provided with several symmetrical grooves with strictly uniform sizes for supporting both sides of the wafer. In this way, batch cleaning can be achieved by simply placing the wafers to be cleaned one by one in the grooves, which improves the cleaning efficiency.

[0004] However, the above-mentioned device still has certain defects, namely:

[0005] In order to prevent the cleaning agent sprayed from the spray pipe from causing axial impact on the wafer and causing damage, generally speaking, the spray direction of the spray pipe is towards the gap between the two wafers, that is, it sprays along the radial direction of the wafer (towards the edge of the wafer) to avoid direct impact on the wafer surface. In this way, the impact force on the dirt on the wafer surface will also be reduced, making the rinsing effect worse, and then the entire cleaning time will be greatly extended, which ultimately leads to low cleaning efficiency. Summary of the Invention

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a cleaning device for semiconductor wafers to solve the problems existing in the above-mentioned background technology.

[0007] The present invention provides the following technical solution: a cleaning device for semiconductor wafers, characterized by comprising:

[0008] a cleaning tank for accommodating wafers;

[0009] A cleaning assembly is installed on the inner wall of the cleaning tank and rinses the wafers in the cleaning tank through the cleaning assembly;

[0010] The carrier is installed in the middle of the cleaning tank and can rotate back and forth. The wafer can be placed on the carrier and rotate with the carrier. When the wafer rotates with the carrier, the spraying direction of the cleaning agent in the cleaning component will gradually shift from toward the edge of the wafer to toward the surface of the wafer. At the same time, when the spraying direction of the cleaning agent gradually shifts from toward the edge of the wafer to toward the surface of the wafer, the spraying pressure of the cleaning agent will decrease synchronously.

[0011] Furthermore, a partition is fixedly installed inside the cleaning tank, which divides the inside of the cleaning tank into a flushing chamber and an equipment chamber. The flushing chamber is located above the partition and is connected to the upper opening of the cleaning tank. The carrier is located in the flushing chamber and is rotatably mounted on the partition. A guide groove is provided on the edge of the partition, and a drain pipe is connected to the bottom of the guide groove, and the drain pipe extends away from the end of the guide groove to the outside of the cleaning tank.

[0012] Furthermore, the surface of the carrier is provided with a placement rack and a limit groove. The placement rack can be placed in the limit groove. After the placement rack is placed in the limit groove, the carrier can drive the placement rack to rotate synchronously. Several grooves are opened in the middle of the placement rack. The wafer can be placed in the groove and move synchronously with the placement rack.

[0013] Furthermore, the cleaning component includes a nozzle and a pressure pump. The nozzle is located in the rinsing chamber and is fixedly mounted on the inner wall of the cleaning tank. At the same time, the spraying direction of the nozzle is toward between the two wafers on the placement rack. The pressure pump is fixedly mounted on the outer wall of the cleaning tank. The liquid inlet end of the pressure pump is connected to the external cleaning agent container, and the liquid outlet end of the pressure pump is connected to the nozzle.

[0014] Furthermore, the carrier is equipped with a swinging motor and a connecting shaft that only performs reciprocating swing. The swinging motor is fixedly installed in the equipment cavity, and the connecting shaft is arranged in the equipment cavity, and one end of the connecting shaft is connected to the carrier, and the other end is connected to the output end of the swinging motor. At the same time, the swinging motor can drive the carrier to rotate reciprocatingly through the connecting shaft. An adjusting tube is installed in the middle of the equipment cavity, and the adjusting tube is connected between the nozzle and the liquid outlet end of the pressure pump. A valve is installed in the middle of the adjusting tube, and the valve can adjust the liquid flow in the adjusting tube. A connecting rod is rotatably installed on the adjusting handwheel of the valve, and a connecting seat is fixedly installed on the surface of the connecting shaft. The end of the connecting rod away from the valve is rotatably connected to the connecting seat, and at the same time, the rotation center of the connecting rod on the valve adjusting handwheel and the rotation center of the valve handwheel are eccentrically set.

[0015] Furthermore, the carrier is also equipped with a driving roller and a transmission assembly. The driving roller is rotatably installed on the carrier, and when the placement rack is placed in the limit groove, the edge of the wafer in the middle of the placement rack is placed on the driving roller. At the same time, when the driving roller rotates, it can drive the wafer mounted on its surface to rotate. The transmission assembly is connected between the swing motor and the driving roller, and the swing motor can drive the driving roller to rotate through the transmission assembly.

[0016] Furthermore, the transmission assembly includes a transmission shaft, a driving bevel gear, a driven bevel gear and a protective box. The protective box is fixedly installed in the middle of the carrier. The driving bevel gear and the driven bevel gear are both rotatably installed in the protective box. At the same time, the driving bevel gear is meshed with the driven bevel gear. One end of the transmission shaft is connected to the swing motor, and the other end is connected to the driving bevel gear shaft. The swing motor can drive the driving bevel gear to rotate through the transmission shaft. The driving roller is connected to the driven bevel gear shaft and can rotate synchronously with it.

[0017] Furthermore, the carrier is also equipped with a driving gear, a transmission gear and a ring gear. The driving gear is fixedly mounted on the connecting shaft and can rotate synchronously with the connecting shaft. A bracket is fixedly mounted inside the equipment cavity, and the transmission gear is rotatably mounted on the bracket, and the transmission gear is externally meshed with the driving gear. The connecting shaft is a hollow structure, and the ring gear is fixedly mounted inside the connecting shaft, and the ring gear is meshed with the transmission gear.

[0018] The present application also discloses a method for using a semiconductor wafer cleaning device, using the above-mentioned semiconductor wafer cleaning device, the method comprising the following steps:

[0019] S1: Place the wafers to be cleaned into the grooves of the placement rack one by one;

[0020] S2: Place the placement rack containing the wafer into the limiting groove of the carrier;

[0021] S3: Start the swing motor and pressure pump.

[0022] During use, the present application can drive the carrier to rotate, thereby driving the wafer to rotate so that it deviates from the flushing direction of the cleaning component, so that the dirt on the surface of the wafer is subjected to a greater impact force to improve the cleaning ability. When the carrier drives the wafer to rotate, it can also synchronously adjust the spray pressure of the cleaning agent in the cleaning component, thereby effectively improving the cleaning ability while ensuring that the wafer is not damaged. Moreover, during the operation of the carrier, it will also synchronously drive the drive roller to rotate to drive the wafer to rotate, so that the dirt on the surface of the wafer can contact the cleaning agent at more angles, further improving the cleaning ability and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the internal structure of the present invention from a first perspective;

[0025] Figure 3 This is a schematic diagram of the internal structure of the present invention from a second viewing angle;

[0026] Figure 4 For the present invention Figure 3 A in the middle is an enlarged structural diagram;

[0027] Figure 5 A schematic diagram of the internal structure of the present invention from a third perspective;

[0028] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point B in the middle.

[0029] The accompanying drawings are marked as follows: 1. cleaning tank; 2. carrier; 3. placement rack; 4. partition; 5. flushing chamber; 6. equipment chamber; 7. guide groove; 8. limit groove; 9. nozzle; 10. pressure pump; 11. swing motor; 12. connecting shaft; 13. regulating pipe; 14. valve; 15. connecting rod; 16. driving roller; 17. transmission shaft; 18. driving bevel gear; 19. driven bevel gear; 20. driving gear; 21. transmission gear; 22. ring gear; 23. bracket; 24. drain pipe; 25. protective box. DETAILED DESCRIPTION

[0030] The technical solutions of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. In addition, the forms of the various structures described in the following embodiments are merely examples and are not limited to the various structures described in the following embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0031] Reference Figure 2 The present invention provides a cleaning device for semiconductor wafers, comprising: a cleaning tank 1, a cleaning component and a carrier 2, the cleaning tank 1 being used to accommodate wafers; the cleaning component being installed on the inner wall of the cleaning tank 1, and the wafers in the cleaning tank 1 being rinsed by the cleaning component; the carrier 2 being installed in the middle of the cleaning tank 1, and the carrier 2 being able to rotate back and forth, the wafers being placed on the carrier 2 and rotating with the carrier 2, and when the wafers rotate with the carrier 2, the spraying direction of the cleaning agent in the cleaning component will gradually shift from toward the edge of the wafer to toward the surface of the wafer, and at the same time, when the spraying direction of the cleaning agent gradually shifts from toward the edge of the wafer to toward the surface of the wafer, the spraying pressure of the cleaning agent will synchronously decrease.

[0032] A partition 4 is fixedly installed inside the cleaning tank 1, and the partition 4 divides the inside of the cleaning tank 1 into two chambers, a rinsing chamber 5 and an equipment chamber 6. The rinsing chamber 5 is located above the partition 4 and is connected to the upper opening of the cleaning tank 1 to facilitate the placement of wafers. The carrier 2 is located in the rinsing chamber 5 and is rotatably mounted on the partition 4. A guide groove 7 is provided at the edge of the partition 4. The bottom of the guide groove 7 is connected to a drain pipe 24, and the drain pipe 24 extends away from the end of the guide groove 7 to the outside of the cleaning tank 1.

[0033] The surface of the carrier 2 is provided with a placement rack 3 and a limiting groove 8. The placement rack 3 can be placed in the limiting groove 8, and after the placement rack 3 is placed in the limiting groove 8, the carrier 2 can drive the placement rack 3 to rotate synchronously. In this way, it is only necessary to place the placement rack 3 containing the wafer on the carrier 2 and place it in the limiting groove 8, so that it can be well limited on the carrier 2.

[0034] There are several grooves in the middle of the placement rack 3. Wafers can be placed in the grooves and move synchronously with the placement rack 3. In this way, batch cleaning can be achieved by simply placing the wafers to be cleaned one by one into the grooves in the placement rack 3.

[0035] like Figure 3 As shown, the cleaning component includes a nozzle 9 and a pressure pump 10. The nozzle 9 is in the rinsing chamber 5 and is fixedly mounted on the inner wall of the cleaning tank 1. At the same time, the spraying direction of the nozzle 9 is toward between the two wafers on the placement rack 3. The pressure pump 10 is fixedly mounted on the outer wall of the cleaning tank 1. The liquid inlet end of the pressure pump 10 is connected to the external cleaning agent container, and the liquid outlet end of the pressure pump 10 is connected to the nozzle 9.

[0036] like Figure 3 and Figure 4 As shown, the carrier 2 is equipped with a swing motor 11 and a connecting shaft 12 that only do reciprocating swing. The swing motor 11 is fixedly installed in the equipment cavity 6, and the connecting shaft 12 is arranged in the equipment cavity 6. One end of the connecting shaft 12 is connected to the carrier 2, and the other end is connected to the output end of the swing motor 11. At the same time, the swing motor 11 can drive the carrier 2 to rotate reciprocatingly through the connecting shaft 12. An adjusting tube 13 is installed in the middle of the equipment cavity 6. The adjusting tube 13 is connected between the nozzle 9 and the liquid outlet end of the pressure pump 10. A valve 14 is installed in the middle of the adjusting tube 13, and the valve 14 can adjust the liquid flow in the adjusting tube 13. A connecting rod 15 is rotatably installed on the adjusting handwheel of the valve 14. A connecting seat is fixedly installed on the surface of the connecting shaft 12. The end of the connecting rod 15 away from the valve 14 is rotatably connected to the connecting seat. At the same time, the rotation center of the connecting rod 15 on the adjusting handwheel of the valve 14 is eccentric to the rotation center of the valve 14 handwheel.

[0037] In this way, it is only necessary to place the cleaned wafers one by one into the grooves in the placement rack 3, and then place the placement rack 3 with the wafers on the carrier 2, and make it in the limit groove 8, and then start the swing motor 11 and the pressure pump 10. The operation of the pressure pump 10 will pump the external cleaning agent into the regulating pipe 13, and flow into the nozzle 9 through the regulating pipe 13, and finally be sprayed out from the nozzle 9 to rinse the wafers in the middle of the placement rack 3 on the carrier 2. The rinsed cleaning agent will fall on the partition 4, and then flow into the guide groove 7, and finally flow out from the drain pipe 24. The user can set a collection device at the outlet of the drain pipe 24 to collect, treat or reuse the sewage.

[0038] When the swing motor 11 is running, it will drive the carrier 2 to rotate through the connecting shaft 12, thereby driving the wafer on the placement rack 3 to rotate. Moreover, since the output shaft of the swing motor 11 is reciprocating, the carrier 2 will also drive the placement rack 3 to swing back and forth (the swing direction is as follows Figure 2 As described in C in the figure, during the rinsing process, the wafer will be deflected from the rinsing direction of the nozzle 9, so that the dirt on the surface of the wafer can be directly rinsed. In addition, since the wafer is rotated to achieve tilt (such as Figure 2 As shown in FIG, the wafer is swung in the direction of C in the figure, so that it is tilted with respect to the spray direction of the rinse agent sprayed from the nozzle 9, wherein the movement direction of the rinse agent sprayed from the nozzle 9 is as shown in FIG. Figure 2 As shown at D in the middle, this rotation process can gradually increase the angle between the wafer and the flushing direction of the nozzle 9, so that the impact force on the wafer surface is slowly increased, thereby avoiding damage to the wafer caused by sudden impact.

[0039] Moreover, during the rotation of the connecting shaft 12, the handwheel of the valve 14 will be driven to rotate through the connecting rod 15. This will drive the handwheel of the valve 14 to rotate when the wafer is tilted to reduce the opening and closing degree of the valve core inside the valve 14, thereby reducing the pressure of the nozzle 9, and then reducing the impact of the cleaning agent on the wafer surface, effectively protecting the wafer, and achieving better cleaning ability for the dirt on the wafer surface when the wafer is intact. Moreover, this adjustment process is automatically generated when the carrier 2 drives the wafer to rotate. Therefore, a control program can be set for the swing motor 11 to make it pause during the swinging process. In this way, the continuous flushing time of the dirt on the wafer surface by the flushing agent in a certain direction can be increased, and in this process, the spray pressure of the flushing agent can be guaranteed to change synchronously, which is convenient for control.

[0040] In the above solution, the wafer itself remains fixed in the placement rack 3 during the cleaning process. As a result, the wafer portion deep in the placement rack 3 can only be flushed and cleaned by water flowing on the surface of the wafer, resulting in low cleaning efficiency. Therefore, the present application provides a preferred solution to solve this problem, which is as follows:

[0041] like Figure 5 and Figure 6 As shown, the carrier 2 is also equipped with a driving roller 16 and a transmission assembly. The driving roller 16 is rotatably installed on the carrier 2, and when the placement rack 3 is placed in the limiting groove 8, the edge of the wafer in the middle of the placement rack 3 is mounted on the driving roller 16. At the same time, when the driving roller 16 rotates, it can drive the wafer mounted on its surface to rotate. The transmission assembly is connected between the swing motor 11 and the driving roller 16, and the swing motor 11 can drive the driving roller 16 to rotate through the transmission assembly.

[0042] Continue as Figure 5 and Figure 6 As shown, the transmission assembly includes a transmission shaft 17, a driving bevel gear 18, a driven bevel gear 19 and a protection box 25. The protection box 25 is fixedly installed in the middle of the carrier 2. The driving bevel gear 18 and the driven bevel gear 19 are both rotatably installed in the protection box 25. At the same time, the driving bevel gear 18 is engaged with the driven bevel gear 19. One end of the transmission shaft 17 is connected to the swing motor 11, and the other end is connected to the rotating shaft of the driving bevel gear 18. The swing motor 11 can drive the driving bevel gear 18 to rotate through the transmission shaft 17. The driving roller 16 is connected to the rotating shaft of the driven bevel gear 19 and can rotate synchronously with it.

[0043] like Figure 5 and Figure 6 As shown, the carrier 2 is also equipped with a driving gear 20, a transmission gear 21 and a ring gear 22. The driving gear 20 is fixedly mounted on the connecting shaft 12 and can rotate synchronously with the connecting shaft 12. A bracket 23 is fixedly mounted inside the equipment cavity 6. The transmission gear 21 is rotatably mounted on the bracket 23, and the transmission gear 21 is externally meshed with the driving gear 20. The connecting shaft 12 is a hollow structure, and the ring gear 22 is fixedly mounted inside the connecting shaft 12, and the ring gear 22 is meshed with the transmission gear 21.

[0044] In this way, when the swing motor 11 is running, it will drive the transmission shaft 17 to rotate, and the transmission shaft 17 will drive the connecting shaft 12 to rotate through the driving gear 20, the transmission gear 21 and the ring gear 22, so as to drive the carrier 2 to rotate to ensure that the previous scheme can be realized. At the same time, the transmission shaft 17 will synchronously drive the driving bevel gear 18 and the driven bevel gear 19 to rotate, and the driven bevel gear 19 will drive the driving roller 16 to rotate. In this way, the driving roller 16 will drive the wafer in contact with its surface to rotate (because the wafer is in contact with the driving roller 16 under the action of its own gravity, there is friction between the two, and this friction can make the wafer rotate with the driving roller 16, and during the process of rinsing the wafer with the rinse agent, the rinse agent will also exert a certain pressure on the wafer, which will further increase the friction between the edge of the wafer and the drive roller 16), so that the dirt on the wafer can be washed at multiple angles by the cleaning agent sprayed by the nozzle 9, thereby effectively improving the cleaning ability.

[0045] However, in the above solution, the friction between the wafer and the driving roller 16 may be insufficient, so that it cannot rotate well. Therefore, the above solution is further optimized as follows:

[0046] Several rubber blocks are fixedly installed on the surface of the driving roller 16, and the rubber blocks are sticky. In this way, the wafer will contact the rubber blocks on the surface of the driving roller 16, which will effectively increase the friction between it and the driving roller 16, so that the driving roller 16 can stably drive the wafer to rotate.

[0047] In the above solution, there may be a certain friction between the wafer and the groove in the placement rack 3, and this friction may prevent the wafer from rotating. Therefore, the above solution is further optimized as follows:

[0048] The carrier 2 is equipped with a vibration motor, which can drive the placement rack 3 on the carrier 2 to vibrate when it is running, and then drive the wafer in the middle of the placement rack 3 to vibrate. This vibration can temporarily disengage the wafer from the groove in the placement rack, thereby reducing the friction with the placement rack 3, so that the drive roller 16 can better drive the wafer to rotate;

[0049] In addition, the vibration of the wafer can accelerate the removal of dirt on its surface, effectively improving the cleaning efficiency.

[0050] The present application also discloses a method for using a semiconductor wafer cleaning device, using the above-mentioned semiconductor wafer cleaning device, the method comprising the following steps:

[0051] S1: Place the wafers to be cleaned into the grooves of the placement rack 3 one by one;

[0052] S2: Place the placement rack 3 containing the wafer into the limiting groove 8 of the carrier 2;

[0053] S3: Start the swing motor 11 and the pressure pump 10.

[0054] This method adopts the semiconductor wafer cleaning device of the present application and can fully combine the advantages of the device.

[0055] Finally, it should be noted that the drawings of the embodiments disclosed herein only relate to structures related to the embodiments disclosed herein. Other structures may refer to conventional designs. The same embodiment and different embodiments of the present invention may be combined with each other without conflict.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A cleaning device for semiconductor wafers, characterized in that: include: A cleaning tank (1) for accommodating wafers; A cleaning component is mounted on the inner wall of the cleaning tank (1), and the wafers in the cleaning tank (1) are rinsed by the cleaning component; The carrier (2) is installed in the middle of the cleaning tank (1), and the carrier (2) can rotate back and forth. The surface of the carrier (2) is provided with a placement rack (3) and a limiting groove (8). The placement rack (3) can be placed in the limiting groove (8), and after the placement rack (3) is placed in the limiting groove (8), the carrier (2) can drive the placement rack (3) to rotate synchronously. A plurality of grooves are opened in the middle of the placement rack (3), and wafers can be placed in the grooves and move synchronously with the placement rack (3). When the wafer rotates with the carrier (2), the spraying direction of the cleaning agent in the cleaning component is gradually transferred from the edge of the wafer to the surface of the wafer. At the same time, when the spraying direction of the cleaning agent is gradually transferred from the edge of the wafer to the surface of the wafer, the spraying pressure of the cleaning agent is synchronously reduced.

2. The semiconductor wafer cleaning device according to claim 1, wherein: A partition (4) is fixedly installed inside the cleaning tank (1), and the partition (4) divides the inside of the cleaning tank (1) into a flushing chamber (5) and an equipment chamber (6), and the flushing chamber (5) is located above the partition (4) and is connected to the upper opening of the cleaning tank (1), and the carrier (2) is located in the flushing chamber (5) and is rotatably mounted on the partition (4), and a guide groove (7) is provided on the edge of the partition (4), and the bottom of the guide groove (7) is connected to a drain pipe (24), and the drain pipe (24) extends away from the end of the guide groove (7) to the outside of the cleaning tank (1).

3. The semiconductor wafer cleaning device according to claim 2, wherein: The cleaning component includes a nozzle (9) and a pressure pump (10), wherein the nozzle (9) is located in the flushing chamber (5) and is fixedly mounted on the inner wall of the cleaning tank (1), and the spraying direction of the nozzle (9) is directed toward between two wafers on the placement rack (3). The pressure pump (10) is fixedly mounted on the outer wall of the cleaning tank (1), and the liquid inlet end of the pressure pump (10) is connected to an external cleaning agent container, and the liquid outlet end of the pressure pump (10) is connected to the nozzle (9).

4. The semiconductor wafer cleaning device according to claim 3, wherein: The carrier (2) is equipped with a swing motor (11) and a connecting shaft (12) that only performs reciprocating swinging. The swing motor (11) is fixedly installed in the equipment cavity (6). The connecting shaft (12) is arranged in the equipment cavity (6), and one end of the connecting shaft (12) is connected to the carrier (2), and the other end is connected to the output end of the swing motor (11). At the same time, the swing motor (11) can drive the carrier (2) to reciprocate through the connecting shaft (12). An adjusting tube (13) is installed in the middle of the equipment cavity (6). The adjusting tube (13) is connected to the nozzle. A valve (14) is installed in the middle of the regulating tube (13) between the tube (9) and the liquid outlet end of the pressure pump (10), and the valve (14) can adjust the liquid flow in the regulating tube (13). A connecting rod (15) is rotatably installed on the regulating hand wheel of the valve (14), and a connecting seat is fixedly installed on the surface of the connecting shaft (12). The end of the connecting rod (15) away from the valve (14) is rotatably connected to the connecting seat, and the rotation center of the connecting rod (15) on the regulating hand wheel of the valve (14) is eccentrically arranged with the rotation center of the valve (14) hand wheel.

5. The semiconductor wafer cleaning device according to claim 4, wherein: The carrier (2) is further provided with a driving roller (16) and a transmission assembly. The driving roller (16) is rotatably mounted on the carrier (2). When the placement rack (3) is placed in the limiting groove (8), the edge of the wafer in the middle of the placement rack (3) is mounted on the driving roller (16). When the driving roller (16) rotates, the wafer mounted on its surface can be driven to rotate. The transmission assembly is connected between the swing motor (11) and the driving roller (16), and the swing motor (11) can drive the driving roller (16) to rotate through the transmission assembly.

6. The semiconductor wafer cleaning device according to claim 5, wherein: The transmission assembly includes a transmission shaft (17), a driving bevel gear (18), a driven bevel gear (19) and a protection box (25). The protection box (25) is fixedly installed in the middle of the carrier (2). The driving bevel gear (18) and the driven bevel gear (19) are both rotatably installed in the protection box (25). At the same time, the driving bevel gear (18) and the driven bevel gear (19) are engaged. One end of the transmission shaft (17) is connected to the swing motor (11), and the other end is connected to the rotating shaft of the driving bevel gear (18). The swing motor (11) can drive the driving bevel gear (18) to rotate through the transmission shaft (17). The driving roller (16) is connected to the rotating shaft of the driven bevel gear (19) and can rotate synchronously with it.

7. The semiconductor wafer cleaning device according to claim 6, wherein: The carrier (2) is further provided with a driving gear (20), a transmission gear (21) and a ring gear (22). The driving gear (20) is fixedly mounted on the connecting shaft (12) and can rotate synchronously with the connecting shaft (12). A bracket (23) is fixedly mounted inside the equipment cavity (6). The transmission gear (21) is rotatably mounted on the bracket (23), and the transmission gear (21) is externally meshed with the driving gear (20). The connecting shaft (12) is a hollow structure. The ring gear (22) is fixedly mounted inside the connecting shaft (12), and the ring gear (22) is meshed with the transmission gear (21).

8. A method for using a semiconductor wafer cleaning device, using the semiconductor wafer cleaning device according to any one of claims 3 to 7, the method comprising the following steps: S1: Place the wafers to be cleaned into the grooves of the placement rack (3) one by one; S2: placing the placement rack (3) containing the wafer into the limiting groove (8) of the carrier (2); S3: Start the swing motor (11) and the pressure pump (10).

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