Wafer taking and placing device, transportation equipment and aging test system and method

Abstract

The invention provides a wafer taking and placing device, transportation equipment and an aging test system and method, and particularly relates to the technical field of wafer test.The wafer taking and placing device comprises a wafer feeding device and a wafer discharging device, the wafer feeding device comprises a first grabbing mechanism, and the wafer discharging device comprises a second grabbing mechanism; the first grabbing mechanism and the second grabbing mechanism are both used for grabbing a heat sink bearing a wafer; and after the wafer unloading device grabs the first heat sink bearing the tested wafer and takes the first heat sink out of the target aging test device, the wafer loading device feeds a second heat sink which is grabbed in advance and bears the wafer to be tested into the target aging test device. According to the wafer unloading device, the wafer unloading action is executed after the wafer test is completed, and then the wafer loading action is executed by the wafer loading device, so that the time consumed for taking the wafer from unloading to loading is saved.

Description

Technical Field

[0001] The present application relates to the field of wafer testing technology, and in particular to a wafer loading and unloading device, transportation equipment, aging testing system and method. Background Art

[0002] In the semiconductor manufacturing process, wafer testing is a critical step in ensuring chip quality and performance. This process typically involves using a transporter to move wafers from one processing station to another. Specifically, after burn-in testing, the transporter removes the tested wafers from the tester and places a second heat sink, carrying the wafer under test, back into the tester.

[0003] In order to achieve the above goals, the transporter is equipped with a special wafer loading and unloading device, which is responsible for loading and unloading wafers. Specifically, the wafer loading and unloading device needs to move to the designated position first to put down the wafer that has completed aging, and then take the second heat sink carrying the wafer to be tested on the same loading position, move it to the tester, and place the second heat sink carrying the wafer to be tested on the tester for the next test. Although this mode of operation can meet basic production needs, there is a significant waiting time between the end of one test and the preparation of the next second heat sink carrying the wafer to be tested to start testing, which in turn affects the efficiency and production capacity of the entire production line. Summary of the Invention

[0004] In order to solve at least one of the shortcomings of the above-mentioned prior art, the present application provides a wafer loading and unloading device, comprising:

[0005] A wafer loading device and a wafer unloading device, wherein the wafer loading device includes a first grasping mechanism, and the wafer unloading device includes a second grasping mechanism, wherein the first grasping mechanism and the second grasping mechanism are both used to grasp a heat sink carrying a wafer;

[0006] After the wafer unloading device grabs the first heat sink carrying the tested wafer and takes it out of the target aging test device, the wafer loading device sends the pre-grabbed second heat sink carrying the wafer to be tested into the target aging test device.

[0007] Optionally, the wafer loading device includes a first bracket, the first grasping mechanism includes a first lifting mechanism and an adsorption mechanism arranged on the first lifting mechanism, and the first lifting mechanism is used to drive the corresponding adsorption mechanism to move along the first bracket to complete the wafer loading action; the wafer unloading device includes a second bracket, the second grasping mechanism includes a second lifting mechanism and an adsorption mechanism arranged on the second lifting mechanism, and the second lifting mechanism is used to drive the corresponding adsorption mechanism to move along the second bracket to complete the wafer unloading action.

[0008] Optionally, the wafer loading device is connected to the wafer unloading device and arranged side by side.

[0009] Optionally, the adsorption mechanism includes:

[0010] The third bracket is ring-shaped;

[0011] a plurality of adsorption members arranged at intervals along the circumference of the third bracket and connected to the third bracket, wherein the plurality of adsorption members are configured to simultaneously provide adsorption force to the bottom of the wafer so that the wafer is attached to the heat sink;

[0012] A plurality of clamping members are arranged at intervals along the circumference of the third bracket and connected to the third bracket. The plurality of clamping members are configured to clamp the heat sink carrying the wafer in a controlled manner and at the same time.

[0013] Optionally, the third bracket includes a concentric first annular bracket and a second annular bracket, and the second annular bracket is slidingly connected to the first annular bracket so that the second annular bracket slides along the circumference of the first annular bracket; the multiple adsorption parts and the multiple clamping parts are connected to the second annular bracket.

[0014] Optionally, the adsorption mechanism further includes: a plurality of sliding components, each sliding component corresponding to one of the clips, for slidingly connecting the clip with the third bracket, so that the clip slides radially along the third bracket in a controlled manner, thereby switching between a first position in which the clip is engaged with the heat sink and a second position in which the clip is separated from the heat sink.

[0015] Optionally, the clamping member includes a vertical portion and a horizontal portion, the vertical portion and the horizontal portion are connected to form an L-shape, and the horizontal portion is configured to abut against the bottom of the heat sink when the clamping member is in the first position to support the heat sink;

[0016] A second air channel is provided inside the clamping component to adsorb the heat sink when the clamping component abuts against the bottom of the heat sink.

[0017] On the other hand, the present application provides a wafer transport device, comprising:

[0018] Any optional wafer loading and unloading device as above;

[0019] A transport mechanism, wherein the transport mechanism is used to drive the wafer loading and unloading device of the wafer loading and unloading device to move from the wafer loading and unloading equipment to the target aging test device of the wafer aging test equipment, so that the wafer unloading device takes out the first heat sink carrying the tested wafer from the target aging test device, and the wafer loading device of the wafer loading and unloading device places the second heat sink carrying the wafer to be tested in the target aging test device.

[0020] Optionally, the transport mechanism is also used to drive the wafer loading and unloading device to move from the target aging test device to the wafer loading and unloading equipment, so that the wafer unloading device places the first heat sink carrying the tested wafer on the wafer loading and unloading equipment, and the wafer loading device takes the second heat sink carrying the wafer to be tested out of the wafer loading and unloading equipment.

[0021] Optionally, the transportation mechanism includes:

[0022] A third lifting mechanism, the wafer loading and unloading device is slidably connected to the third lifting mechanism, and the third lifting mechanism is used to drive the wafer loading and unloading device to move in a vertical direction;

[0023] The translation mechanism is slidingly connected to the third lifting mechanism, and the translation mechanism is used to drive the third lifting mechanism to move in the horizontal direction.

[0024] Optionally, the arrangement direction of the wafer loading device and the wafer unloading device is consistent with the horizontal movement direction of the third lifting mechanism; the translation mechanism is used to drive the third lifting mechanism to move in the horizontal direction after the wafer unloading device takes out the first heat sink carrying the tested wafer from the target aging test device, so that the wafer loading device is aligned with the target aging test device.

[0025] Optionally, the wafer loading and unloading device is connected to the third lifting mechanism through a correction mechanism, and the correction mechanism includes a first connecting component and a second connecting component. The first connecting component is used to correct the tilt degree of the wafer loading and unloading device in a first direction, and the second connecting component is used to correct the tilt degree of the wafer loading and unloading device in a second direction. The first direction and the second direction are horizontal directions perpendicular to each other.

[0026] Optionally, the first connecting component includes a first connecting member connected to the wafer loading and unloading device, and a second connecting member slidably connected to the third lifting mechanism; the first connecting member and the second connecting member are connected by a first pin, and the axis of the first pin is parallel to the second direction; the first connecting member is used to drive the wafer loading and unloading device to rotate around the axis of the first pin, and the second connecting member is used to drive the wafer loading and unloading device to move under the drive of the third lifting mechanism.

[0027] Optionally, the second connecting component includes a third connecting member fixedly connected to the wafer loading and unloading device, and a fourth connecting member fixedly connected to the first connecting member, the third connecting member and the fourth connecting member are connected by a second pin, and the axis of the second pin is parallel to the first direction; the third connecting member is used to drive the wafer loading and unloading device to rotate around the axis of the second pin.

[0028] On the other hand, the present application provides a wafer-level aging test system, comprising:

[0029] Wafer aging test equipment, including at least one aging test device;

[0030] Wafer loading and unloading equipment, used to provide the second heat sink carrying the wafer to be tested, and to recover the first heat sink carrying the wafer after testing;

[0031] An optional wafer transport device such as any of the above items is arranged between the wafer aging test equipment and the wafer loading and unloading equipment, and is used to take out the first heat sink carrying the tested wafer from the target aging test device of the wafer aging test equipment, and send the second heat sink carrying the wafer to be tested into the target aging test device; and place the first heat sink carrying the tested wafer on the wafer loading and unloading equipment, and grab the second heat sink carrying the wafer to be tested from the wafer loading and unloading equipment.

[0032] On the other hand, the present application provides a wafer aging test method based on any of the above optional wafer-level aging test systems, comprising:

[0033] During the wafer testing process of the target aging test device, the transport mechanism drives the wafer loading and unloading device in the loading state to move from the wafer loading and unloading equipment to the target aging test device; in the loading state, the wafer loading device grabs the second heat sink carrying the wafer to be tested, and the wafer unloading device is in an unloaded state;

[0034] When the wafer aging test equipment completes the wafer test, the wafer unloading device removes the first heat sink carrying the tested wafer from the target aging test device of the wafer aging test equipment;

[0035] The wafer loading device sends the second heat sink carrying the wafer to be tested into the target aging test device, so that the wafer loading and unloading device is in a unloading state; in the unloading state, the wafer loading device is in an unloaded state, and the wafer unloading device grabs the first heat sink carrying the tested wafer.

[0036] By adopting the above technical solution, this application has the following beneficial effects:

[0037] The present application provides a wafer loading and unloading device, including a wafer loading device and a wafer unloading device, wherein the wafer loading device includes a first grasping mechanism, and the wafer unloading device includes a second grasping mechanism, wherein the first grasping mechanism and the second grasping mechanism are both used to grasp a heat sink carrying a wafer; when the wafer unloading device grasps the first heat sink carrying the wafer after the test and takes it out of the target aging test device, the wafer loading device sends the pre-grabbed second heat sink carrying the wafer to be tested into the target aging test device. The wafer unloading device of the present application performs the wafer unloading action after the wafer test is completed, and the wafer loading device then performs the wafer loading action, so that the unloading and loading actions can be closely connected, which greatly saves the time from unloading to loading and taking the wafer, effectively improves the efficiency of the entire production process, and reduces production costs.

[0038] Other features and advantages of this application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, in which the same reference numerals generally represent the same components. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0040] Figure 1 This is a schematic structural diagram of a wafer loading and unloading device provided in an embodiment of the present application;

[0041] Figure 2 This is a top view of a wafer loading and unloading device provided in an embodiment of the present application;

[0042] Figure 3 This is a schematic state diagram of a wafer loading and unloading device provided in an embodiment of the present application;

[0043] Figure 4 This is a schematic state diagram of another wafer loading and unloading device provided in an embodiment of the present application;

[0044] Figure 5 It is a structural schematic diagram of the adsorption mechanism provided in an embodiment of the present application;

[0045] Figure 6 Schematic diagram of the structure of the clamping member and the sliding assembly provided in an embodiment of the present application;

[0046] Figure 7 is a schematic structural diagram of a heat sink provided in an embodiment of the present application;

[0047] Figure 8 is a perspective view of a heat sink provided in an embodiment of the present application;

[0048] Figure 9 is a partial perspective view of a heat sink provided in an embodiment of the present application;

[0049] Figure 10 is a schematic structural diagram of an adsorption component provided in an embodiment of the present application;

[0050] Figure 11 is a partial perspective view of a clip provided in an embodiment of the present application;

[0051] Figure 12 This is a partial enlarged view of the adsorption mechanism provided in an embodiment of the present application;

[0052] Figure 13 is a schematic structural diagram of a third bracket provided in an embodiment of the present application;

[0053] Figure 14 It is a structural schematic diagram of the wafer transport equipment provided in an embodiment of the present application;

[0054] Figure 15 It is a structural diagram of the wafer loading and unloading device and the transport mechanism provided in an embodiment of the present application;

[0055] Figure 16 This is a schematic structural diagram of a wafer loading and unloading device and a correction mechanism provided in an embodiment of the present application;

[0056] Figure 17 is a structural diagram of the correction mechanism provided in an embodiment of the present application;

[0057] Figure 18 This is a structural diagram of another wafer loading and unloading device and correction mechanism provided in an embodiment of the present application;

[0058] Figure 19 Schematic diagram of the structure of a wafer-level aging test system provided in an embodiment of the present application;

[0059] Figure 20 This is a top view of a wafer transport device and a wafer aging test device provided in an embodiment of the present application.

[0060] The following is a supplementary description of the accompanying drawings:

[0061] 100-wafer loading and unloading device, 110-wafer loading device, 111-first bracket, 112-first lifting mechanism, 120-wafer unloading device, 121-second bracket, 122-second lifting mechanism, 200-adsorption mechanism, 210-third bracket, 211-first annular bracket, 212 second annular bracket, 220-adsorption member, 221-first air channel, 230-clamping member, 231-vertical part, 232-horizontal part, 233-second air channel, 234-adsorption port, 240-sliding assembly, 241-upper sliding member, 242-lower sliding member, 250-driving member, 260-limiting assembly, 261-first sensor, 262-first limit Part, 263-second sensor, 264-second limit part, 300-heat sink, 310-first area, 320-second area, 330-notch, 340-third air channel, 341-first air hole, 342-second air hole, 400-transportation mechanism, 410-third lifting mechanism, 420-translation mechanism, 500-correction mechanism, 510-first connecting component, 511-first connecting piece, 512-second connecting piece, 513-first pin, 520-second connecting component, 521-third connecting piece, 522-fourth connecting piece, 523-second pin, 600-wafer aging test equipment, 610-rack, 700-wafer loading and unloading equipment. DETAILED DESCRIPTION

[0062] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of this application.

[0063] References to "one embodiment" or "embodiment" herein refer to specific features, structures, or characteristics that may be included in at least one implementation of the present application. Throughout the description of this application, it should be understood that the terms "upper," "lower," "top," and "bottom," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplification. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation, and are therefore not to be construed as limiting the present application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Thus, a feature designated "first" or "second" may explicitly or implicitly include one or more of such features. Furthermore, the terms "first," "second," etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential sequence. It should be understood that such terms are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0064] refer to Figures 1-2 The present application provides a wafer loading and unloading device 100, comprising a wafer loading device 110 and a wafer unloading device 120. The wafer loading device 110 includes a first grasping mechanism, and the wafer unloading device 120 includes a second grasping mechanism. Both the first grasping mechanism and the second grasping mechanism are used to grasp a heat sink carrying a wafer. After the wafer unloading device 120 grasps the first heat sink carrying a tested wafer and removes it from a target aging test device, the wafer loading device 110 delivers the pre-grabbed second heat sink carrying a wafer to be tested into the target aging test device.

[0065] Optionally, the wafer loading device 110 is connected to the wafer unloading device 120 and arranged side by side.

[0066] Optionally, the wafer loading device 110 includes a first bracket 111, the first grasping mechanism includes a first lifting mechanism 112 and an adsorption mechanism 200 arranged on the first lifting mechanism 112, and the first lifting mechanism 112 is used to drive the corresponding adsorption mechanism 200 to move along the first bracket 111 to complete the wafer loading action; the wafer unloading device 120 includes a second bracket 121, the second grasping mechanism includes a second lifting mechanism 122 and an adsorption mechanism 200 arranged on the second lifting mechanism 122, and the second lifting mechanism 122 is used to drive the corresponding adsorption mechanism 200 to move along the second bracket 121 to complete the wafer unloading action.

[0067] Specifically, the first bracket 111 serves as the main frame of the wafer loading device 110, supporting and fixing other components. It is usually a rigid structure to ensure stable support during the wafer loading process. The first lifting mechanism 112 is connected to the first bracket 111 and is responsible for driving the adsorption mechanism 200 to rise and fall along the first bracket 111. It can use screw transmission, cylinder drive and other methods to achieve precise height adjustment to adapt to the wafer loading requirements at different positions and complete the wafer loading action. The second bracket 121 is arranged side by side with the first bracket 111 to form the main frame of the wafer unloading device 120. It also has good rigidity and stability, providing support for the adsorption mechanism 200 during the unloading process. The second lifting mechanism 122 is connected between the second bracket 121 and the adsorption mechanism 200. Similar to the first lifting mechanism 112, it drives the adsorption mechanism 200 to rise and fall along the second bracket 121 through a specific transmission mechanism to perform the wafer unloading action and remove the first heat sink carrying the tested wafer from the target aging test device. In this embodiment, the first lifting mechanism 112 is disposed on both sides of the adsorption mechanism 200 corresponding to the wafer loading device 110, and the second lifting mechanism 122 is disposed on both sides of the adsorption mechanism 200 corresponding to the wafer unloading device 120. In other embodiments, the location and number of the first lifting mechanism 112 and the second lifting mechanism 122 can also be set according to actual needs.

[0068] Specifically, the wafer loading and unloading device 100 is used to move back and forth between the test position of the wafer burn-in test equipment 600 and the wafer loading and unloading device 700 for placing the heat sink 300 carrying the wafers. When the wafer loading and unloading device 100 is located at the test position of the wafer burn-in test equipment 600, the suction mechanism 200 of the wafer unloading device 120 removes the first heat sink carrying the tested wafer from the target burn-in test device of the wafer burn-in test equipment 600. The suction mechanism 200 of the wafer loading device 110 then places the second heat sink carrying the wafer to be tested into the target burn-in test device of the wafer burn-in test equipment 600. When the wafer loading and unloading device 100 is located at the wafer loading and unloading equipment 700, the wafer unloading device 120 places the first heat sink carrying the tested wafer on the wafer loading and unloading equipment 700, and the wafer loading device 110 takes the second heat sink carrying the wafer to be tested out of the wafer loading and unloading equipment 700, and then goes to the test position to prepare for the next round of testing.

[0069] Specifically, when the wafer loading and unloading device 100 is located at the test position of the wafer aging test equipment 600, the first lifting mechanism 112 and the second lifting mechanism 122 are alternately lifted and lowered. Figure 3As shown, the second lifting mechanism 122 first drives the corresponding adsorption mechanism 200 to descend, so that the adsorption mechanism 200 of the wafer unloading device 120 performs the wafer unloading action. After the wafer unloading is completed, the second lifting mechanism 122 drives the adsorption mechanism 200 to reset, as shown in FIG. Figure 4 As shown, the first lifting mechanism 112 drives the corresponding adsorption mechanism 200 to descend, so that the adsorption mechanism 200 of the wafer loading device 110 performs the wafer loading action. After the wafer loading is completed, the first lifting mechanism 112 drives the adsorption mechanism 200 to reset. When the wafer loading and unloading device 100 is located in the wafer loading and unloading equipment 700, the first lifting mechanism 112 and the second lifting mechanism 122 can be lifted and lowered alternately or synchronously. That is, there is no requirement for the order in which the wafer unloading device 120 places the first heat sink carrying the tested wafer on the wafer loading and unloading equipment 700 and the wafer loading device 110 removes the second heat sink carrying the wafer to be tested from the wafer loading and unloading equipment 700. Generally, the wafer unloading device 120 can first place the first heat sink carrying the tested wafer on the wafer loading and unloading equipment 700, and then the wafer loading device 110 can remove the second heat sink carrying the wafer to be tested from the wafer loading and unloading equipment 700.

[0070] Specifically, in the embodiment of the present application, the wafer loading and unloading device 100 realizes the close connection between the unloading and loading actions through the wafer loading device 110 and the wafer unloading device 120 arranged side by side, which greatly saves the time required for taking wafers from unloading to loading, effectively improves the efficiency of the entire production process, and reduces production costs.

[0071] refer to Figure 5 In one possible embodiment, the adsorption mechanism 200 includes a third bracket 210, a plurality of adsorption members 220, and a plurality of clamping members 230. The third bracket 210 is annular; the plurality of adsorption members 220 are spaced apart along the circumference of the third bracket 210 and connected to the third bracket 210. The plurality of adsorption members 220 are configured to simultaneously provide adsorption force to the bottom of the wafer so that the wafer is attached to the heat sink 300; the plurality of clamping members 230 are spaced apart along the circumference of the third bracket 210 and connected to the third bracket 210. The plurality of clamping members 230 are configured to simultaneously and controlledly clamp the heat sink 300 carrying the wafer and provide adsorption force to the heat sink 300 to prevent the heat sink 300 carrying the wafer from falling off while following the movement of the adsorption mechanism 200. Here, the plurality of adsorption members 220 and the plurality of clamping members 230 are staggered so that the plurality of clamping members 230 and the plurality of adsorption members 220 are evenly arranged on the third bracket 210.

[0072] Please continue to refer to Figure 5The adsorption mechanism 200 further includes a plurality of sliding assemblies 240, each corresponding to a clip 230, configured to slidably connect the clip 230 to the third bracket 210, so that the clip 230 can slide in a controlled manner along the radial direction of the third bracket 210, thereby switching between a first position in which the clip is engaged with the heat sink 300 and a second position in which the clip is separated from the heat sink 300. Specifically, the plurality of sliding assemblies 240 simultaneously drive the corresponding clips 230 to move toward the center of the third bracket 210, thereby simultaneously supporting the heat sink 300. At this time, the clip 230 is in the first position. When the plurality of sliding assemblies 240 simultaneously drive the corresponding clips 230 to return to their original positions, that is, to move away from the center of the third bracket 210, the support for the heat sink 300 can be withdrawn. At this time, the clip 230 is in the second position.

[0073] refer to Figure 6 The sliding assembly 240 includes an upper sliding member 241 connected to the clamping member 230 and a lower sliding member 242 connected to the third bracket 210. The upper sliding member 241 and the lower sliding member 242 are slidably connected. The upper sliding member 241 slides along the lower sliding member 242, driving the clamping member 230 toward the center of the third bracket 210 until it moves to the first position. The upper sliding member 241 slides along the lower sliding member 242, driving the clamping portion toward a position away from the center of the third bracket 210 until it moves to the second position.

[0074] Please continue to refer to Figure 6 The clamping member 230 includes a vertical portion 231 and a horizontal portion 232, the vertical portion 231 and the horizontal portion 232 are connected to form an L shape, and the horizontal portion 232 is configured to abut against the bottom of the heat sink 300 when the clamping member 230 is in the first position to support the heat sink 300. Specifically, Figure 7 As shown, a plurality of notches 330 are provided on the peripheral side of the heat sink 300, and each notch 330 corresponds to a clip 230. The clip 230 moves from the notch 330 to the transverse portion 232 located below the heat sink 300, thereby supporting the heat sink 300. When the transverse portion 232 of the clip 230 moves to the notch 330, the support for the heat sink 300 will be withdrawn.

[0075] refer to Figures 7-9 The top of the heat sink 300 is provided with a first area 310 for placing wafers and a second area 320 other than the first area 310. A plurality of third air channels 340 are provided inside the heat sink 300. The third air channels 340 include first air holes 341 located in the first area 310 and second air holes 342 located in the second area 320. Each third air channel 340 corresponds to one adsorption member 220. Figure 10 As shown, and see Figure 5The adsorbent 220 has a first air channel 221 extending downward from the third bracket 210. The first air channel 221 is configured to communicate with the second air hole 342 of the corresponding third air channel 340 when the adsorbent 220 abuts the heat sink 300, thereby adsorbing the wafer sequentially through the second air hole 342, the third air channel 340, and the first air hole 341. In this embodiment, there are eight third air channels 340, each corresponding to a single adsorbent 220. In other embodiments, the number of third air channels 340 can be increased based on actual needs.

[0076] refer to Figure 11 The clamping member 230 has a second air channel 233 inside to attract the heat sink 300 when it contacts the bottom of the heat sink 300. Specifically, the top of the horizontal portion 232 is provided with an adsorption port 234 that communicates with the second air channel 233. This adsorption port 234 adsorbs the heat sink 300. This embodiment not only adsorbs the wafer, but also the bottom of the heat sink 300, preventing the heat sink 300 from moving or sliding.

[0077] refer to Figure 12 The adsorption mechanism 200 further includes a plurality of driving members 250, each corresponding to a respective clipping member 230. The driving members 250 are mounted on the third bracket 210 and cooperate with the sliding assemblies 240 corresponding to the respective clipping members 230 to simultaneously and controlledly drive the clipping members 230 to switch between the first and second positions. In other words, the driving members 250 are used to drive the corresponding sliding assemblies 240 to move the corresponding clipping members 230. Specifically, the driving members 250 are mounted on the third bracket 210, and the upper sliding member 241 is mounted on the third bracket 210. The driving members 250 are connected to the upper sliding member 241 and cooperate with the plurality of sliding assemblies 240. The upper sliding member 241 is configured to slide along the lower sliding member 242 under the drive of the driving members 250, thereby simultaneously driving the corresponding clipping members 230 to move. Here, the driving members 250 are pneumatic cylinders. In other embodiments, the driving members 250 may also utilize other drive structures. In this embodiment, the number of driving members 250 is the same as the number of clipping members 230. In other embodiments, the number of driving members 250 can be set according to specific design requirements. For example, multiple clamping members 230 correspond to one driving member 250, for example, every two clamping members 230 correspond to one driving member 250. Here, a protrusion structure is further provided on one side of the upper sliding member 241, and the driving member 250 is connected to the protrusion structure, so that the driving member 250 drives the upper sliding member 241 to rotate.

[0078] refer to Figure 5 、 12The adsorption mechanism 200 further includes a plurality of limiting assemblies 260, each of which corresponds to a clamping member 230 and is used to limit the movement of the clamping member 230 between the first position and the second position. Specifically, the limiting assembly 260 includes a first sensor 261, a first limiting portion 262, a second sensor 263, and a second limiting portion 264. The first sensor 261 and the second sensor 263 are mounted on the third bracket 210, and the first limiting portion 262 and the second limiting portion 264 are fixed to the upper sliding member 241 of the sliding assembly 240. The first sensor 261 cooperates with the first limiting portion 262 to detect whether the corresponding clamping member 230 is in the first position, and the second sensor 263 cooperates with the second limiting portion 264 to detect whether the corresponding clamping member 230 is in the second position. When the first sensor 261 senses the first limiting portion 262 , it indicates that the clamping member 230 has reached the first position. When the second sensor 263 senses the second limiting portion 264 , it indicates that the clamping member 230 has reached the second position.

[0079] In a specific embodiment, the adsorption mechanism 200 also includes a controller (not shown in the figure), which is respectively connected to the multiple adsorption members 220, the driving member 250, the first sensor 261 and the second sensor 263 to control the sliding assembly 240 to drive the clamping member 230 to move, so that the clamping member 230 is clamped to the heat sink 300. The simultaneous feedback of multiple adsorption members 220 contacting the heat sink 300 indicates that the heat sink 300 is in a horizontal state and is not tilted. There is no need to adjust the position of the heat sink 300. The multiple clamping members 230 can be directly controlled to clamp to the heat sink 300, avoiding the situation where the heat sink 300 tilts and causes the clamping to be unstable and causes the heat sink 300 to slide, thereby improving the stability of the heat sink 300 clamping. The controller is configured to control the driving member 250 to drive the upper sliding member 241 to move radially along the third bracket 210 after receiving the feedback signal of contact with the heat sink 300 from multiple adsorption members 220 at the same time. The controller is further configured to, upon receiving a signal from the first sensor 261, control the clamping member 230 to attract the heat sink 300, and then control the corresponding lifting mechanism to move the adsorption mechanism 200 vertically upward. The controller is further configured to, upon receiving a signal from the second sensor 263, control the corresponding lifting mechanism to move the adsorption mechanism 200 vertically downward. For the adsorption mechanism 200 of the wafer loading device 110, the lifting mechanism is the first lifting mechanism 112; for the adsorption mechanism 200 of the wafer unloading device 120, the lifting mechanism is the second lifting mechanism 122.

[0080] Specifically, in the embodiment of the present application, multiple adsorption members 220 are used to adsorb the bottom of the wafer, so that the wafer is attached to the heat sink 300, which can prevent the wafer from moving and falling off. In addition, multiple clamping members 230 are used to simultaneously clamp the heat sink 300 carrying the wafer. The clamping members 230 can also provide adsorption and support forces for the heat sink 300, thereby preventing the heat sink 300 from falling off during transportation and improving the stability of the movement of the heat sink 300. Not only the wafer is adsorbed, but also the heat sink 300. Through double adsorption, the stability of the wafer and heat sink 300 during transportation can be ensured, preventing the wafer and heat sink 300 from falling off from the adsorption mechanism 200.

[0081] refer to Figure 13 In one possible embodiment, the third bracket 210 includes a concentric first annular bracket 211 and a second annular bracket 212. The second annular bracket 212 is slidably connected to the first annular bracket 211, allowing the second annular bracket 212 to slide along the circumference of the first annular bracket 211. A plurality of adsorption members 220 and a plurality of clamping members 230 are connected to the second annular bracket 212. Specifically, the first annular bracket 211 serves as the base bracket and is annular in shape, providing a stable support frame for the entire adsorption mechanism 200. The second annular bracket 212 is also annular in shape and is arranged concentrically with the first annular bracket 211. The two are connected by a sliding connection. This sliding connection can be achieved by providing a guide structure such as a slide rail or a slide groove on the first annular bracket 211, and a matching slider or other sliding component on the second annular bracket 212, allowing the second annular bracket 212 to slide along the circumference of the first annular bracket 211. Multiple adsorption parts 220 and multiple clips 230 are all installed on the second annular bracket 212. As the second annular bracket 212 slides, the positions of these adsorption parts 220 and clips 230 can also be adjusted circumferentially accordingly, so that each clip 230 corresponds one-to-one to the position of each notch 330 on the heat sink 300, and each adsorption part 220 corresponds one-to-one to the position of each third air duct 340 on the heat sink 300.

[0082] Specifically, in the embodiment of the present application, the third bracket 210 is set as two inner and outer concentric annular brackets, and the second annular bracket 212 is able to slide circumferentially on the first annular bracket 211 to achieve flexible adjustment of the adsorption mechanism 200 during operation. In actual wafer loading and unloading operations, it may be necessary to optimize the position of the adsorption component 220 and the clamping component 230 based on factors such as the size, shape and specific installation position of the wafer. This sliding connection method allows the adsorption component 220 and the clamping component 230 to be better matched with the wafer and the heat sink 300 by adjusting the position of the second annular bracket 212 without changing the relative position of the entire adsorption mechanism 200 and other components, thereby improving the accuracy and reliability of adsorption and clamping.

[0083] On the other hand, reference Figure 14 , the present application also provides a wafer transport device, comprising:

[0084] The wafer loading and unloading device 100 is provided in any of the above embodiments. Specifically, the wafer loading device 110 of the wafer loading and unloading device 100 is responsible for taking out the second heat sink carrying the wafer to be tested from the wafer loading and unloading equipment 700, and placing it into the target aging test device of the wafer aging test equipment 600. The wafer loading device 110 is equipped with an adsorption mechanism 200 to adsorb and fix the second heat sink carrying the wafer to be tested. The wafer unloading device 120 of the wafer loading and unloading device 100 is arranged side by side with the wafer loading device 110, and is used to take out the first heat sink carrying the tested wafer from the target aging test device, and place it on the wafer loading and unloading equipment 700. It is also equipped with an adsorption mechanism 200 to adsorb and fix the first heat sink carrying the tested wafer.

[0085] The transport mechanism 400 is used to drive the wafer loading and unloading device 100 to move from the wafer loading and unloading equipment 700 to the target aging test device of the wafer aging test equipment 600, so that the wafer unloading device 120 takes out the first heat sink carrying the tested wafer from the target aging test device, and the wafer loading device 110 sends the pre-grabbed second heat sink carrying the wafer to be tested into the target aging test device; the transport mechanism 400 is also used to drive the wafer loading and unloading device 100 to move from the target aging test device to the wafer loading and unloading equipment 700, so that the wafer unloading device 120 places the first heat sink carrying the tested wafer on the wafer loading and unloading equipment 700, and the wafer loading device 110 takes out the second heat sink carrying the wafer to be tested from the wafer loading and unloading equipment 700.

[0086] Specifically, the transport mechanism 400 is mounted on the wafer transport equipment's frame. The frame typically utilizes a metal frame structure with sufficient strength and rigidity to support the weight of the wafer handling device 100 and the transport mechanism 400, while ensuring the stability of the entire device during movement. The transport mechanism 400 includes transmission components such as guide rails, screws, and gears, enabling precise horizontal and vertical movement of the wafer handling device 100.

[0087] Specifically, in the embodiment of the present application, the wafer loading device 110 and the wafer unloading device 120 are arranged side by side on a wafer loading and unloading device 100, so that after completing a wafer unloading action, the wafer loading action can be performed immediately without waiting or performing complex mechanical adjustments; this layout makes full use of the space and time resources of the equipment, realizes the close connection between the unloading and loading actions, reduces the operating gap, and improves the continuity and efficiency of the entire production process. The transportation mechanism 400 can not only move the wafer loading and unloading device 100 from the wafer loading and unloading equipment 700 to the target aging test device, but also move it from the target aging test device back to the wafer loading and unloading equipment 700 after completing the unloading and loading actions. Through the control and transmission mechanism, the transportation mechanism can achieve stable and accurate movement in two directions, ensure the smooth transfer of wafers between different positions, and meet the continuous wafer testing needs in the production process.

[0088] refer to Figure 15 In one possible implementation, the transport mechanism 400 includes:

[0089] The third lifting mechanism 410, the wafer loading and unloading device 100 is slidably connected to the third lifting mechanism 410, and the third lifting mechanism 410 is used to drive the wafer loading and unloading device 100 to move in the vertical direction. Specifically, the third lifting mechanism 410 usually includes a lifting bracket, a lifting transmission device and a guide device. Among them, the lifting bracket serves as the main frame of the entire third lifting mechanism 410, and is usually made of metal material, with sufficient strength and rigidity to support the weight of the wafer loading and unloading device and ensure stability during the lifting process. The lifting transmission device usually adopts a transmission method such as a screw nut pair, a gear rack or a hydraulic cylinder. In order to ensure the smoothness and straightness of the lifting process, the third lifting mechanism is also equipped with a guide device, such as a linear guide rail, a slide rail, etc. The guide device is installed on both sides or all around the lifting bracket to accurately guide the movement of the lifting bracket, reduce shaking and offset during the lifting process, and improve the accuracy and reliability of the movement.

[0090] The translation mechanism 420 and the third lifting mechanism 410 are slidably connected to the translation mechanism 420, and the translation mechanism 420 is used to drive the third lifting mechanism 410 to move in the horizontal direction. Specifically, the translation mechanism 420 usually includes a translation frame, a translation guide rail and a translation drive device. Among them, the translation frame serves as the basic frame of the translation mechanism. The translation frame is generally long and rectangular, and adopts a steel structure or an aluminum alloy structure. It has high strength and rigidity, can stably support the weight of the third lifting mechanism 410 and the wafer loading and unloading device 100, and ensure the overall stability during the translation process. The top or bottom of the translation frame is usually provided with a track beam for installing the guide rail, which is used to install the translation guide rail. The translation guide rail provides precise guidance for the horizontal movement of the third lifting mechanism. The translation guide rail generally adopts a linear guide rail, a roller guide rail, etc., which has the characteristics of low friction, high precision, and strong load capacity. It can ensure that the third lifting mechanism runs smoothly and accurately during the horizontal movement, reducing position deviation and vibration. The translation drive device is responsible for providing power to the translation mechanism 420 and is typically composed of a motor, a reducer, and transmission components. The motor reduces speed and increases torque through the reducer. The motor then transmits power to the screw, rack, or other transmission elements on the translation frame through transmission components such as couplings, gears, and belts, thereby driving the third lifting mechanism 410 to move horizontally along the translation guide rail. In practice, the selection and configuration of the drive device requires precise calculation based on parameters such as load weight, travel speed, and stroke length to meet the transportation requirements of the production process.

[0091] During the actual wafer handling process, the third lifting mechanism 410 and the translation mechanism 420 of the transport mechanism 400 work together to complete a series of actions according to a preset procedure and sequence. For example, the translation mechanism 420 moves the third lifting mechanism 410 and the wafer loading and unloading device 100 to the top or designated position of the wafer loading and unloading device 700, and then the third lifting mechanism 410 drives the wafer loading and unloading device 100 down to the height of the wafer loading and unloading device 700, and the wafer loading device 110 takes out the second heat sink carrying the wafer to be tested from the wafer loading and unloading device 700; the translation mechanism 420 moves the third lifting mechanism 410 and the wafer loading and unloading device 100 to the top of the target aging test device of the wafer aging test device 600, and the third lifting mechanism 410 drives the wafer loading and unloading device 10 ... third lifting mechanism 410 drives the wafer loading and unloading device 100 to the height of the wafer loading and unloading device 700, and the third lifting mechanism 410 drives the wafer loading and unloading device 100 to the height of the wafer loading and unloading device 700, and the third lifting mechanism 410 drives the wafer loading and unloading device 100 to the height of the wafer loading and unloading device 700, and the third lifting mechanism 410 drives the wafer loading and unloading device 100 to 0 descends, the wafer unloading device 120 removes the first heat sink carrying the tested wafer from the target aging test device, and the wafer loading device 110 places the second heat sink carrying the wafer to be tested in the target aging test device; the translation mechanism 420 moves the third lifting mechanism 410 and the wafer loading and unloading device 100 back to the top of the wafer loading and unloading equipment 700, and the third lifting mechanism 410 drives the wafer loading and unloading device 100 to descend to the height of the wafer loading and unloading equipment 700, and the wafer unloading device 120 places the first heat sink carrying the tested wafer on the wafer loading and unloading equipment 700, completing a complete handling cycle. Through this collaborative working mode, the wafer transportation equipment can efficiently and accurately complete the transfer of wafers between different locations, meeting the production process requirements of the wafer-level aging test system.

[0092] Specifically, in the embodiment of the present application, the transport mechanism 400 utilizes a structure that combines a third lifting mechanism 410 and a translation mechanism 420 to achieve motion control of the wafer access device 100 in both the vertical and horizontal directions. This layered motion control method decomposes complex three-dimensional motion into two independent one-dimensional motions, making motion control simpler, more precise, and more reliable. By separately controlling the motion of the third lifting mechanism 410 and the translation mechanism 420, the position and height of the wafer access device 100 can be flexibly adjusted to accommodate wafer handling requirements at different locations.

[0093] Please continue to refer to Figure 15 In one possible embodiment, the arrangement direction of the wafer loading device 110 and the wafer unloading device 120 is consistent with the horizontal movement direction of the third lifting mechanism 410; the translation mechanism 420 is used to drive the third lifting mechanism 410 to move in the horizontal direction after the wafer unloading device 120 removes the first heat sink carrying the tested wafer from the target aging test device, so that the wafer loading device 110 is aligned with the target aging test device.

[0094] Specifically, in the embodiment of the present application, after the wafer unloading device 120 completes the action of removing the tested wafer from the target aging test device, the translation mechanism 420 is immediately started, driving the third lifting mechanism 410 and the wafer loading and unloading device 100 thereon to move in the horizontal direction. Since the arrangement direction of the wafer loading device 110 and the wafer unloading device 120 is consistent with the horizontal movement direction of the third lifting mechanism 410, during the movement, the wafer loading device 110 can accurately align with the target aging test device and prepare for the next loading action of the second heat sink carrying the wafer to be tested. This arrangement and movement method ensures that after completing one unloading, the loading device can quickly and accurately reach the designated position without the need for additional adjustment time, thereby improving the continuity and efficiency of the entire handling process.

[0095] refer to Figures 16-18 In one possible embodiment, the wafer loading and unloading device 100 is connected to the third lifting mechanism 410 via a correction mechanism 500. The correction mechanism 500 includes a first connecting component 510 and a second connecting component 520. The first connecting component 510 is used to correct the tilt of the wafer loading and unloading device 100 in a first direction, and the second connecting component 520 is used to correct the tilt of the wafer loading and unloading device 100 in a second direction. The first and second directions are mutually perpendicular horizontal directions. In this embodiment, the first direction is the arrangement direction of the wafer loading device 110 and the wafer unloading device 120. In other embodiments, the first direction can be set according to specific needs.

[0096] Specifically, the first connecting assembly 510 includes a first connecting member 511 connected to the wafer loading and unloading device 100, and a second connecting member 512 slidably connected to the third lifting mechanism 410. The first connecting member 511 and the second connecting member 512 are connected by a first pin 513, and the axis of the first pin 513 is parallel to the second direction. The first connecting member 511 is used to drive the wafer loading and unloading device 100 to rotate about the axis of the first pin 513, and the second connecting member 512 is used to drive the wafer loading and unloading device 100 to move under the drive of the third lifting mechanism 410. Specifically, the first connecting member 511 is directly connected to the wafer loading and unloading device 100, usually fixed to a specific position of the wafer loading and unloading device 100 by bolts, flanges or other suitable connection methods, serving as an interface for transmitting motion and force. The second connecting member 512 is slidably connected to the third lifting mechanism 410. This sliding connection can be achieved through structures such as guide rails and slideways, so that the second connecting member can drive the wafer loading and unloading device 100 to move along a predetermined path under the drive of the third lifting mechanism 410. The first pin 513 connects the first connecting member 511 and the second connecting member 512, and its axis is parallel to the second direction. The first pin not only serves as a connection but also acts as a rotation axis, allowing the first connecting member 511 to drive the wafer loading and unloading device 100 to rotate about its axis, thereby correcting the degree of tilt of the wafer loading and unloading device in the first direction.

[0097] Specifically, the second connecting assembly 520 includes a third connecting member 521 fixedly connected to the wafer loading and unloading device 100, and a fourth connecting member 522 fixedly connected to the first connecting member 511. The third connecting member 521 and the fourth connecting member 522 are connected by a second pin 523, and the axis of the second pin 523 is parallel to the first direction; the third connecting member 521 is used to drive the wafer loading and unloading device 100 to rotate around the axis of the second pin 523. Specifically, the fourth connecting member 522 is fixedly connected to the first connecting member 511 to form a stable connection frame to transmit motion and force. The second pin 523 connects the third connecting member 521 and the fourth connecting member 522, and its axis is parallel to the first direction. The third connecting member 521 rotates around the axis of the second pin 523 to correct the tilt of the wafer loading and unloading device 100 in the second direction.

[0098] In a specific implementation, the correction mechanism 500 includes a second connecting component 520 corresponding to the wafer loading device 110, and a second connecting component 520 corresponding to the wafer unloading device 120. Accordingly, the fourth connecting member 522 corresponding to the wafer loading device 110 and the fourth connecting member 522 corresponding to the wafer unloading device 120 are respectively fixedly connected to the first connecting member 511 on both sides. The first connecting member 511 is fixedly connected to the first bracket 111 and the second bracket 121 at the same time. The third connecting member 521 corresponding to the wafer loading device 110 is fixedly connected to the first bracket 111, and the third connecting member 521 corresponding to the wafer unloading device 120 is fixedly connected to the second bracket 121.

[0099] In a specific implementation, the first bracket 111 and the second bracket 121 include a back plate close to the third lifting mechanism 410, the first connecting component 510 and the second connecting component 520 are distributed on both sides of the back plate, an opening is provided on the back plate, and the fourth connecting member 522 passes through the back plate through the opening and is fixedly connected to the first connecting member 511.

[0100] Specifically, in the embodiments of the present application, during wafer handling, the wafer handling apparatus 100 may tilt due to factors such as equipment manufacturing errors, uneven installation, changes in mechanical load, or mechanical deformation caused by long-term use, affecting the precise placement and removal of wafers. The correction mechanism 500, through the coordinated action of the first connecting assembly 510 and the second connecting assembly 520, independently adjusts the tilt of the wafer handling apparatus 100 in two mutually perpendicular horizontal directions. When the wafer handling apparatus 100 needs to be corrected for tilt in the first direction, the first connecting member 511 in the first connecting assembly 510 is controlled to rotate about the axis of the first pin 513, driving the wafer handling apparatus 100 to make fine adjustments in the first direction. When tilting in the second direction, adjustment is achieved by rotating the third connecting member 521 in the second connecting assembly 520 about the axis of the second pin 523. This adjustment method allows the wafer handling apparatus 100 to be precisely adjusted without changing its overall position, ensuring precise docking of the suction mechanism 200 with the wafer and the target aging test device.

[0101] On the other hand, the present application also provides a wafer-level aging test system, comprising:

[0102] Wafer aging test equipment 600, including at least one aging test device;

[0103] Wafer loading and unloading equipment 700, used to provide a second heat sink carrying a wafer to be tested, and to recover a first heat sink carrying a wafer after testing;

[0104] The wafer transport equipment provided in any of the above embodiments is arranged between the wafer aging test equipment 600 and the wafer loading and unloading equipment 700, and is used to remove the first heat sink carrying the tested wafer from the target aging test device in at least one aging test device, and send the second heat sink carrying the wafer to be tested into the target aging test device; and place the first heat sink carrying the tested wafer on the wafer loading and unloading equipment 700, and grab the second heat sink carrying the wafer to be tested from the wafer loading and unloading equipment 700.

[0105] Specifically, in the embodiment of the present application, the wafer transport equipment provides the possibility of parallel operation. Specifically, referring to Figure 19 After the test is completed, the wafer unloading device 120 removes the first heat sink carrying the tested wafer from the target aging test device of the wafer burn-in test equipment 600. The wafer loading device 110 then places the second heat sink carrying the wafer to be tested into the target aging test device, allowing the wafer burn-in test equipment 600 to start a new round of wafer testing. During this process, the wafer unloading device 120 places the first heat sink carrying the tested wafer into the wafer loading and unloading device 700. The wafer loading device 110 takes the second heat sink carrying the wafer to be tested from the wafer loading and unloading device 700 and then waits at the target aging test device. This significantly reduces the waiting time between unloading and loading, optimizes the connection between multiple rounds of wafer burn-in testing, and thus improves overall production efficiency.

[0106] refer to Figure 20 In one possible embodiment, the wafer aging test equipment 600 includes a wafer aging test device, which includes an alignment mechanism and a rack 610 , wherein the alignment mechanism is disposed on the rack 610 ;

[0107] The rack 610 extends into the wafer transport equipment, and the alignment mechanism is configured to be controlled to move out along a slide groove provided on the rack 610 to an extended position of the rack 610 in the wafer transport equipment, so that the wafer transport equipment places the wafer on the alignment mechanism or takes it out from the alignment mechanism; and after the wafer transport equipment places the wafer on the alignment mechanism, it moves back along the slide groove provided on the rack 610.

[0108] Specifically, in an embodiment of the present application, the rack 610 extends into the wafer transport equipment, and the positioning mechanism can be moved out or back in a controlled manner along the slide slot, so that the positioning mechanism can be moved out to the extended position in the wafer transport equipment when needed to complete the loading or unloading operation of the wafer, and then moved back to its original position, reducing the complexity of mechanical adjustment while improving the flexibility and efficiency of operation.

[0109] On the other hand, the present application also provides a wafer aging test method based on the wafer-level aging test system provided in any of the above embodiments, the method comprising:

[0110] During wafer testing in the wafer burn-in test equipment 600, the transport mechanism 400 drives the wafer loading and unloading device 100 in the loading state to move from the wafer loading and unloading device 700 to the target burn-in test equipment; in the loading state, the wafer loading device 110 grabs the second heat sink carrying the wafer to be tested, and the wafer unloading device 120 is in an unloaded state;

[0111] When the wafer aging test device 600 completes the wafer test, the wafer unloading device 120 removes the first heat sink carrying the tested wafer from the target aging test device;

[0112] The wafer loading device 110 sends the second heat sink carrying the wafer to be tested into the target aging test device, so that the wafer loading and unloading device 100 is in the unloading state; in the unloading state, the wafer loading device 110 is in an unloaded state, and the wafer unloading device 120 grabs the first heat sink carrying the tested wafer.

[0113] Specifically, in the embodiment of the present application, during the wafer testing process of the wafer aging test equipment 600, the transport mechanism 400 drives the wafer loading and unloading device 100 in the loading state to move from the wafer loading and unloading device 700 to the target aging test device of the wafer aging test equipment 600. In the loading state, the wafer loading device 110 carries the second heat sink of the wafer to be tested, and the wafer unloading device 120 is in an unloaded state. This parallel operation improves time efficiency. The wafer loading device 110 is ready to carry the second heat sink of the wafer to be tested when the test is in progress. There is no need to wait until the test is completed before loading preparations, which reduces the waiting time in the entire test process. When the wafer burn-in tester 600 completes wafer testing, the wafer unloading device 120 removes the first heat sink carrying the tested wafer from the target burn-in tester of the wafer burn-in tester 600. Immediately thereafter, the wafer loading device 110 places the second heat sink carrying the wafer to be tested into the target burn-in tester, placing the wafer unloading device 100 in the unloading state. In this state, the wafer loading device 110 is unloaded, and the wafer unloading device 120 carries the first heat sink carrying the tested wafer. This seamless operational process not only improves equipment utilization and reduces the waiting time between two rounds of wafer testing, but also significantly enhances production efficiency.

[0114] In one possible implementation, the wafer aging test method further includes:

[0115] During the wafer testing process of the wafer aging test device 600, the transport mechanism 400 drives the wafer loading and unloading device 100 in the unloading state to move from the target aging test device to the wafer loading and unloading device 700;

[0116] The wafer unloading device 120 places the first heat sink carrying the tested wafer on the wafer unloading equipment 700;

[0117] The wafer loading and unloading device 700 recovers the first heat sink carrying the tested wafer and provides a second heat sink carrying the wafer to be tested;

[0118] The wafer loading device 110 takes out the second heat sink carrying the wafer to be tested from the wafer loading and unloading equipment 700 , so that the wafer loading and unloading device 100 is in a loading state.

[0119] Specifically, in the embodiment of the present application, during the wafer testing process of the wafer aging test equipment 600, the transport mechanism 400 drives the wafer loading and unloading device 100 in the unloading state to move from the target aging test device to the wafer loading and unloading device 700. At this time, the wafer unloading device 120 places the first heat sink carrying the tested wafer on the wafer loading and unloading device 700. The wafer loading and unloading device 700 recovers the first heat sink carrying the tested wafer and provides a second heat sink carrying the wafer to be tested. Then, the wafer loading device 110 removes the second heat sink carrying the wafer to be tested from the wafer loading and unloading device 700, so that the wafer loading and unloading device 100 is in the loading state and is ready for the next round of testing. Efficient material flow is achieved. Through the precise movement of the transport mechanism 400, it is ensured that the wafer can be accurately transferred from the target aging test device to the wafer loading and unloading device 700, thereby improving production efficiency, reducing the transfer time of wafers between different devices, reducing the waiting time between two rounds of wafer testing, and significantly improving production efficiency.

[0120] In summary, the wafer loading and unloading device 100 of the present application includes a wafer loading device 110 and a wafer unloading device 120. The wafer loading device 110 includes a first grasping mechanism, and the wafer unloading device 120 includes a second grasping mechanism. Both the first grasping mechanism and the second grasping mechanism are used to grasp the heat sink carrying the wafer. After the wafer unloading device 120 grasps the first heat sink carrying the tested wafer and takes it out of the target aging test device, the wafer loading device 110 sends the pre-grabbed second heat sink carrying the wafer to be tested into the target aging test device. The wafer unloading device 120 of the present application performs the wafer unloading action after the wafer test is completed, and the wafer loading device 110 then performs the wafer loading action, so that the unloading and loading actions can be closely connected, which greatly saves the time from unloading to loading and taking out the wafer, effectively improves the efficiency of the entire production process, and reduces production costs.

[0121] In this application, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal connection between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0122] It should be noted that the order of the embodiments of the present application described above is for descriptive purposes only and does not represent the superiority or inferiority of the embodiments. The above description describes specific embodiments, and other embodiments are also within the scope of the appended claims. In some cases, the actions or steps described in the claims can be performed in the order of different embodiments and can achieve the expected results. In addition, the processes depicted in the accompanying drawings do not necessarily require a specific order or a connection order to achieve the desired results. In some embodiments, multi-tasking parallel processing is also possible or may be advantageous.

[0123] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other. The key points of each embodiment are the differences from other embodiments.

[0124] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A wafer loading and unloading device, characterized in that: It includes a wafer loading device and a wafer unloading device, the wafer loading device includes a first grasping mechanism, the wafer unloading device includes a second grasping mechanism, and the first grasping mechanism and the second grasping mechanism are both used to grasp the heat sink carrying the wafer; After the wafer unloading device grabs the first heat sink carrying the tested wafer and takes it out of the target aging test device, the wafer loading device sends the pre-grabbed second heat sink carrying the wafer to be tested into the target aging test device.

2. The wafer loading and unloading device according to claim 1, characterized in that: The wafer loading device includes a first bracket, the first grasping mechanism includes a first lifting mechanism and an adsorption mechanism arranged on the first lifting mechanism, and the first lifting mechanism is used to drive the corresponding adsorption mechanism to move along the first bracket to complete the wafer loading action; the wafer unloading device includes a second bracket, the second grasping mechanism includes a second lifting mechanism and an adsorption mechanism arranged on the second lifting mechanism, and the second lifting mechanism is used to drive the corresponding adsorption mechanism to move along the second bracket to complete the wafer unloading action.

3. The wafer loading and unloading device according to claim 1, characterized in that: The wafer loading device is connected to the wafer unloading device and is arranged side by side.

4. The wafer loading and unloading device according to claim 1, characterized in that: The adsorption mechanism (200) comprises: The third bracket is ring-shaped; a plurality of adsorption members arranged at intervals along the circumference of the third bracket and connected to the third bracket, wherein the plurality of adsorption members are configured to simultaneously provide adsorption force to the bottom of the wafer so that the wafer is attached to the heat sink; A plurality of clamping members are arranged at intervals along the circumference of the third bracket and connected to the third bracket. The plurality of clamping members are configured to clamp the heat sink carrying the wafer in a controlled manner at the same time.

5. The wafer loading and unloading device according to claim 4, characterized in that: The third bracket includes a concentric first annular bracket and a second annular bracket, and the second annular bracket is slidably connected to the first annular bracket so that the second annular bracket slides along the circumference of the first annular bracket; The plurality of adsorption members and the plurality of clamping members are connected to the second annular bracket.

6. The wafer loading and unloading device according to claim 4, characterized in that: The adsorption mechanism also includes: a plurality of sliding components, each of the sliding components corresponds to one of the clips, and is used to slidingly connect the clip with the third bracket so that the clip slides radially along the third bracket in a controlled manner, thereby switching between a first position engaged with the heat sink and a second position separated from the heat sink.

7. The wafer loading and unloading device according to claim 6, characterized in that: The clamping member includes a vertical portion and a horizontal portion, wherein the vertical portion and the horizontal portion are connected to form an L-shape, and the horizontal portion is configured to abut against the bottom of the heat sink when the clamping member is in the first position to support the heat sink; A second air channel is provided inside the clamping component to adsorb the heat sink when the clamping component abuts against the bottom of the heat sink.

8. A wafer transport device, characterized in that: include: The wafer loading and unloading device according to any one of claims 1 to 7; The transport mechanism is used to drive the wafer picking and placing device to move from the wafer loading and unloading equipment to the target aging test device, so that the wafer unloading device of the wafer picking and placing device will take out the first heat sink carrying the tested wafer from the target aging test device, and the wafer loading device of the wafer picking and placing device will send the pre-grabbed second heat sink carrying the wafer to be tested into the target aging test device.

9. The wafer transport equipment according to claim 8, characterized in that: The transport mechanism is also used to drive the wafer loading and unloading device to move from the target aging test device to the wafer loading and unloading equipment, so that the wafer unloading device places the first heat sink carrying the tested wafer on the wafer loading and unloading equipment, and the wafer loading device takes the second heat sink carrying the wafer to be tested out of the wafer loading and unloading equipment.

10. The wafer transport equipment according to claim 8 or 9, characterized in that: The transportation mechanism includes: A third lifting mechanism, wherein the wafer loading and unloading device is slidably connected to the third lifting mechanism, and the third lifting mechanism is used to drive the wafer loading and unloading device to move in a vertical direction; The translation mechanism is slidingly connected to the third lifting mechanism, and the translation mechanism is used to drive the third lifting mechanism to move in the horizontal direction.

11. The wafer transport equipment according to claim 10, characterized in that: The arrangement direction of the wafer loading device and the wafer unloading device is consistent with the horizontal movement direction of the third lifting mechanism; the translation mechanism is used to drive the third lifting mechanism to move in the horizontal direction after the wafer unloading device takes out the first heat sink carrying the tested wafer from the target aging test device, so that the wafer loading device is aligned with the target aging test device.

12. The wafer transport equipment according to claim 10, wherein: The wafer loading and unloading device is connected to the third lifting mechanism through a correction mechanism, and the correction mechanism includes a first connecting component and a second connecting component. The first connecting component is used to correct the tilt degree of the wafer loading and unloading device in a first direction, and the second connecting component is used to correct the tilt degree of the wafer loading and unloading device in a second direction. The first direction and the second direction are horizontal directions perpendicular to each other.

13. The wafer transport equipment according to claim 12, wherein: The first connecting component includes a first connecting member connected to the wafer loading and unloading device, and a second connecting member slidably connected to the third lifting mechanism; the first connecting member and the second connecting member are connected by a first pin, and the axis of the first pin is parallel to the second direction; the first connecting member is used to drive the wafer loading and unloading device to rotate around the axis of the first pin, and the second connecting member is used to drive the wafer loading and unloading device to move under the drive of the third lifting mechanism.

14. The wafer transport equipment according to claim 13, wherein: The second connecting component includes a third connecting member fixedly connected to the wafer loading and unloading device, and a fourth connecting member fixedly connected to the first connecting member. The third connecting member and the fourth connecting member are connected by a second pin, and the axis of the second pin is parallel to the first direction; the third connecting member is used to drive the wafer loading and unloading device to rotate around the axis of the second pin.

15. A wafer-level aging test system, characterized in that: include: Wafer aging test equipment, including at least one aging test device; Wafer loading and unloading equipment, used to provide the second heat sink carrying the wafer to be tested, and to recover the first heat sink carrying the wafer after testing; The wafer transport equipment according to any one of claims 8 to 14 is arranged between the wafer aging test equipment and the wafer loading and unloading equipment, and is used to remove the first heat sink carrying the tested wafer from the target aging test device in the at least one aging test device, and send the second heat sink carrying the wafer to be tested into the target aging test device; and place the first heat sink carrying the tested wafer on the wafer loading and unloading equipment, and grab the second heat sink carrying the wafer to be tested from the wafer loading and unloading equipment.

16. A wafer aging test method based on the wafer-level aging test system according to claim 15, characterized in that: The method comprises: During the wafer testing process of the target aging test device, the transport mechanism drives the wafer loading and unloading device in the loading state to move from the wafer loading and unloading equipment to the target aging test device; in the loading state, the wafer loading device grabs the second heat sink carrying the wafer to be tested, and the wafer unloading device is in an unloaded state; When the target aging test device completes the wafer test, the wafer unloading device removes the first heat sink carrying the tested wafer from the target aging test device; The wafer loading device sends the second heat sink carrying the wafer to be tested into the target aging test device, so that the wafer loading and unloading device is in a unloading state; in the unloading state, the wafer loading device is in an unloaded state, and the wafer unloading device grabs the first heat sink carrying the tested wafer.

Images