IGBT module and excitation power cabinet

Abstract

The invention relates to an IGBT (Insulated Gate Bipolar Translator) module and an excitation power cabinet, which are characterized in that the excitation power cabinet comprises in-cabinet components arranged in a cabinet body assembly and an IGBT module, the IGBT module comprises a module supporting piece and an internal module component, and the IGBT component is arranged in the cabinet body assembly. The module components comprise a radiator, an IGBT module, an absorption capacitor, a driving board I, a driving board II, a driving board III and a photoelectric conversion board, the radiator is used for radiating heat of the IGBT module, the IGBT module is connected with the absorption capacitor, the photoelectric conversion board is electrically connected with the driving board III, the driving board I, the driving board II and the driving board III are electrically connected through wire harnesses, and the driving board I, the driving board II and the driving board III are electrically connected through wire harnesses. The components in the cabinet comprise a capacitor module connected with the IGBT module and an alternating current and direct current integrated reactor, and the alternating current and direct current components of the capacitor module are connected with the alternating current and direct current integrated reactor. The device is reasonable in arrangement, high in heat dissipation capability, high in structural performance and convenient to push and mount, and IGBT breakdown is avoided.

Description

Technical Field

[0001] The present invention specifically relates to an IGBT module and an excitation power cabinet. Background Art

[0002] When a generator or power grid fails or experiences operating fluctuations, the excitation system outputs a boosted excitation voltage, increasing the power system's static stability limit and accelerating fault recovery time. However, in conventional excitation systems, this boost can only be achieved by increasing the AC-side excitation transformer secondary voltage. As a key support for the system, the generator excitation system is constrained by its power topology and device performance, making it difficult to meet the grid's operational requirements for higher excitation output, faster reactive power control, and more coordinated power oscillation suppression. This requires fundamental research into power electronics topologies and control technologies to improve the performance of the generator excitation system, a core component involved in grid stability control.

[0003] At the same time, the size of conventional excitation cabinets is relatively large, which affects the space occupancy, and the internal modules and other equipment are not properly protected, which makes it easy to cause pulling damage during transportation and installation. For high-parameter and high-power excitation systems, according to the AC5500V / 1min high voltage withstand requirement, there are also great safety hazards during their use. There is a risk of IGBT breakdown when there is overvoltage. Therefore, it is more important to optimize the internal structure of the excitation cabinet, reduce space occupancy, strengthen the module structure, increase the module heat dissipation capacity, and increase the protection level of the excitation power cabinet. Summary of the Invention

[0004] The purpose of the present invention is to provide an IGBT module and an excitation power cabinet to improve cabinet space utilization, strengthen the module structure and heat dissipation capacity, optimize the layout inside the cabinet, reduce the risk of IGBT breakdown during overvoltage, and at the same time improve the protection safety level of the excitation power cabinet.

[0005] In order to achieve the above object, the first technical solution of the present invention is: an IGBT module, the innovation of which is: comprising a module support and module components, wherein the module components are arranged inside the module support,

[0006] The module components include a heat sink, an IGBT module, a main stack busbar, a sub-stack busbar, an absorption capacitor, a driver board I, a driver board II, a driver board III, a photoelectric conversion board, and an inlet and outlet copper busbar.

[0007] The radiator is arranged in the module support, and two rows of IGBT modules are provided on the radiator, the driver board I is fixed on the upper row of IGBT modules, and the driver board II is fixed on the lower row of IGBT modules. An insulating connection is formed between the driver board III and the radiator, and the driver board III is located above the driver board II. The main laminated busbar is insulated from the module support, and the lower pin of the main laminated busbar is connected to the upper pin of the upper row of IGBT modules. The absorption capacitor is fixed on the lower pin of the main laminated busbar, the sub-laminated busbar is fixed on the lower pin of the upper row of IGBT modules and the upper pin of the lower row of IGBT modules, the input and output copper busbar is fixed on the lower pin of the lower row of IGBT modules, the photoelectric conversion board is arranged on the module support and electrically connected to the driver board III, and the driver board I, the driver board II and the driver board III are electrically connected through a wiring harness.

[0008] In the above-mentioned first technical solution, the module support includes a main sealing plate, a top plate, an outer sealing plate, a photoelectric conversion mounting plate, a photoelectric conversion protective plate, a radiator support plate, a busbar support and a copper busbar support. The module components are arranged in the interior composed of the main sealing plate, the top plate and the outer sealing plate. The radiator is fixed on the main sealing plate, the top plate is fixed on the radiator and the top of the main sealing plate, the radiator support plate is arranged on the bottom of the radiator and the main sealing plate, and the outer sealing plate is fixed on the main sealing plate, the top and the outside of the radiator support plate at the same time. The photoelectric conversion plate is fixed on the main sealing plate through the photoelectric conversion mounting plate, and the photoelectric conversion protective plate is fixedly connected to the photoelectric conversion mounting plate and is located on the outer periphery of the photoelectric conversion plate. The busbar support is arranged on the radiator and the main sealing plate, the copper busbar support is fixedly connected to the radiator support plate, and the copper busbar support simultaneously supports the incoming and outgoing copper buses.

[0009] In the first technical solution mentioned above, the outer sealing plate is provided with an outer sealing plate heat dissipation hole, the radiator support plate is provided with a radiator support plate outlet, and the module support has a module air duct formed by the main sealing plate and the top plate, which is used for cooling air to enter and dissipate heat and cool the IGBT module.

[0010] In the above-mentioned first technical solution, the top of the main sealing plate and the top of the top plate are provided with an inclined surface of 1° to 3°.

[0011] In the first technical solution, the module insulation components include insulation sealing plate I, insulation sealing plate II, insulators, insulation support plates, busbar insulation supports and insulation blocks.

[0012] The insulating sealing plate II is arranged on the radiator support plate of the module support, and the insulating sealing plate I is connected to the insulating sealing plate II, while the insulator is fixed on the copper busbar support of the module support.

[0013] The driving plate III is insulated and connected to the radiator through the insulating support plate and the support studs.

[0014] The busbar insulating support and the busbar support of the module support are detachably connected.

[0015] The main laminate busbar is insulated and connected to the top plate of the module support through an insulating block.

[0016] In the first technical solution, one side of the insulating sealing plate I is provided with an insulating sealing plate I outlet, and the other side is provided with an insulating sealing plate I flange that forms a positioning abutment with the radiator support plate of the module support.

[0017] The insulating support plate is provided with a wire-passing hole at a position facing the wiring terminal of the driving plate II.

[0018] In order to achieve the above object, the second technical solution of the present invention is: an excitation power cabinet, the innovation of which is: comprising the above-mentioned IGBT module, as well as a cabinet assembly and components inside the cabinet,

[0019] The cabinet assembly has a first chamber M and a second chamber N, and the first chamber M has an air cavity.

[0020] The components in the cabinet include capacitor modules, resistors, AC / DC integrated reactors, AC / DC components, secondary components and filter capacitors.

[0021] The IGBT module, capacitor module and secondary components are all located in the first chamber M. The charging and discharging resistors, AC / DC integrated reactor, AC / DC components and filter capacitors in the resistor are all located in the second chamber N. The filter resistor in the resistor is placed on the top of the cabinet assembly.

[0022] The IGBT modules have 5 groups, of which 3 groups of IGBT modules constitute the three phases A, B, and C, and the remaining 2 groups of IGBT modules constitute the power supply + phase and power supply - phase. The capacitor module consists of 1 AC / DC module and 1 DC / DC module, and the AC / DC module is electrically connected to the DC / DC module.

[0023] The output end of the AC circuit breaker in the AC / DC component is connected to the input end of the AC side in the AC / DC integrated reactor, and the output end of the AC side in the AC / DC integrated reactor is connected to the input ends of phase A, phase B, and phase C in the IGBT module through the input and output copper bars. The input end of the capacitor module is connected to the output ends of phase A, phase B, and phase C in the IGBT module through the main laminated busbar. At the same time, the output end of the capacitor module is connected to the input ends of the power supply + phase and power supply - phase in the IGBT module through the main laminated busbar. The output ends of the power supply + phase and power supply - phase in the IGBT module are connected to the input end of the DC side in the AC / DC integrated reactor through the input and output copper bars. The output end of the DC side in the AC / DC integrated reactor is connected to the input end of the DC circuit breaker in the AC / DC component. One end of the filter resistor in the resistor is electrically connected to the filter capacitor, and the other end is electrically connected to the fuse in the cabinet assembly. The charging and discharging resistor in the resistor is electrically connected to the secondary component.

[0024] In the second technical solution, the cabinet assembly includes a cabinet having a front door and a rear door, and side sealing plates are provided on both sides of the cabinet, a top sealing plate is provided on the top, and a bottom sealing plate is provided on the bottom.

[0025] The top sealing plate is provided with a fan, the periphery of which is provided with a fan cover, and the air outlet of the fan dissipates heat to the IGBT module through the air cavity.

[0026] The interior of the cabinet is divided into a first chamber M and a second chamber N by a partition. An AC / DC component mounting plate is provided in the cabinet and located in the second chamber N. The AC / DC components are fixed on the AC / DC component mounting plate.

[0027] The front side of the cabinet body is provided with a notch on the left front column and a notch on the right front column of the cabinet body corresponding to the position of the IGBT module.

[0028] The front door is provided with a front door heat dissipation hole, and the rear door is provided with a rear door heat dissipation hole.

[0029] The top plate is provided with a heat dissipation hole at the position corresponding to the capacitor module.

[0030] A capacitor module lifting opening is provided on the side of the capacitor module.

[0031] In the second technical solution, the cabinet assembly is further provided with an internal insulation member.

[0032] The insulation parts in the cabinet include an insulation protection plate, an insulation support, an upper insulation plate, a lower insulation plate, an insulation pull plate, an insulation cap, an insulation beam, an insulation support plate for the capacitor module and an insulation partition.

[0033] An insulating protective plate is provided inside the cabinet assembly and in front of the IGBT module and the capacitor module to prevent electric shock, and the insulating protective plate is detachably connected to the cabinet assembly through an insulating support.

[0034] The IGBT module is separated from the air cavity by an upper insulating plate installed on the top, and a lower insulating plate is installed on the bottom, and an anti-tilting insulating pull plate is provided on the outside. The bottom of the capacitor module is installed in the first chamber M through the capacitor module insulating support plate, and an anti-tilting insulating beam is provided on the outside. The end of the resistor is provided with an insulating cap, and the AC and DC components are fixed to the AC and DC component mounting plate in the cabinet assembly through an insulating partition.

[0035] In the second technical solution, the insulating protection plate has an insulating protection portion that protects the IGBT module and the capacitor module, and an insulating protection plate mounting portion connected to the L-shaped insulating support member is provided around the insulating protection portion, and wire-passing notches are provided on both sides of the insulating protection portion.

[0036] The upper insulating plate is provided with an upper insulating plate vent, and the lower insulating plate is provided with a lower insulating plate vent.

[0037] The air cavity is provided with an air cavity outlet, and a rubber strip is provided at the lower part of the air cavity outlet.

[0038] The air cavity air outlet corresponds to the upper insulation plate vent, the lower insulation plate vent, and the module air duct on the IGBT module.

[0039] The positive effects of the present invention are: after adopting the structure of the IGBT module and the excitation power cabinet of the present invention, the reasonable layout inside the IGBT module reduces the spatial size of the module, ensures the heat dissipation capacity of the module, and at the same time strengthens the fixation of the laminated busbar, the input and output copper busbars, etc., strengthens the overall structural performance of the module, and further optimizes the structure inside the excitation power cabinet so that the entire module inside is in an overall point-position suspended state. In the event of overvoltage, the risk of IGBT breakdown can be reduced, and the safety protection level of the cabinet can be enhanced. At the same time, by improving the integration of devices such as modules, inductors, and AC and DC components and optimizing the heat dissipation structure, the structure of the excitation power cabinet is optimized, the space occupancy is reduced, and the space utilization rate is improved, the modular layout is completed, and subsequent maintenance is also convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a side view of the IGBT module of the present invention;

[0041] Figure 2 This is a schematic diagram of the internal structure of the IGBT module of the present invention;

[0042] Figure 3It is a schematic structural diagram of the insulating plate I of the present invention;

[0043] Figure 4 It is a structural schematic diagram of the radiator support plate of the present invention;

[0044] Figure 5 It is a schematic diagram of the overall structure of the excitation power cabinet of the present invention;

[0045] Figure 6 This is an overall schematic diagram of the excitation power cabinet of the present invention from another angle;

[0046] Figure 7 This is a schematic diagram of the internal structure of the excitation power cabinet of the present invention;

[0047] Figure 8 This is a schematic diagram of the internal structure of the excitation power cabinet of the present invention from another angle;

[0048] Figure 9 It is a structural schematic diagram of the insulating protective plate of the present invention;

[0049] Figure 10 It is a schematic structural diagram of the upper insulating plate of the present invention;

[0050] Figure 11 It is a structural schematic diagram of the lower insulating plate of the present invention;

[0051] Figure 12 It is a structural schematic diagram of the wind cavity of the present invention. DETAILED DESCRIPTION

[0052] The present invention will be further described below with reference to the accompanying drawings and given embodiments, but the present invention is not limited thereto.

[0053] Example 1

[0054] like Figure 1 、 2 , 3, and 4, an IGBT module includes a module support 100 and a module component 200, wherein the module component 200 is arranged inside the module support 100.

[0055] The module components 200 include a heat sink 201, an IGBT module 202, a main stack busbar 203, a sub-stack busbar 204, an absorption capacitor 205, a driver board I 206, a driver board II 207, a driver board III 208, a photoelectric conversion board 209 and an inlet and outlet copper busbar 210.

[0056] In order to arrange the space reasonably and ensure that the size of the IGBT module is compressed as much as possible to achieve the purpose of compactness, the heat sink 201 is arranged in the module support 100, and the heat sink 201 is provided with an upper and lower row of IGBT modules 202, the driving board I 206 is fixed on the upper row of IGBT modules 202, the driving board II 207 is fixed on the lower row of IGBT modules 202, the driving board III 208 is insulated from the heat sink 201 and is located above the driving board II 207, the main laminated busbar 203 is insulated from the module support 100, and the main laminated busbar is The lower pin of the busbar 203 is connected to the upper pin of the upper IGBT module 202, the absorption capacitor 205 is fixed on the lower pin of the main laminate busbar 203, the sub-laminate busbar 204 is fixed on the lower pin of the upper IGBT module 202 and the upper pin of the lower IGBT module 202, the input and output copper busbar 210 is fixed on the lower pin of the lower IGBT module 202, the photoelectric conversion board 209 is arranged on the module support 100 and is electrically connected to the drive board III 208, and the drive board I 206, the drive board II 207 and the drive board III 208 are electrically connected through a wiring harness.

[0057] Further, such as Figure 1 As shown, in order to provide good support and heat dissipation for the module components, the module support 100 includes a main sealing plate 101, a top plate 102, an outer sealing plate 103, a photoelectric conversion mounting plate 104, a photoelectric conversion protection plate 105, a radiator support plate 106, a busbar support 107 and a copper bar support 108. The module components 200 are arranged inside the main sealing plate 101, the top plate 102 and the outer sealing plate 103. The radiator 201 is fixed on the main sealing plate 101, the top plate 102 is fixed on the radiator 201 and the top of the main sealing plate 101, and the radiator support plate 106 is arranged on the heat dissipation plate 108. The outer sealing plate 103 is fixed to the outside of the main sealing plate 101, the top 102 and the radiator support plate 106 at the same time. The photoelectric conversion plate 209 is fixed to the main sealing plate 101 through the photoelectric conversion mounting plate 104, and the photoelectric conversion protection plate 105 is fixedly connected to the photoelectric conversion mounting plate 104 and is located on the periphery of the photoelectric conversion plate 209. The busbar support 107 is provided on the radiator 201 and the main sealing plate 101, and the copper busbar support 108 is fixedly connected to the radiator support plate 106, and the copper busbar support 108 supports the incoming and outgoing copper busbars 210 at the same time.

[0058] Further, such as Figure 1 As shown, in order to fully ensure the heat dissipation effect of the IGBT module, the outer sealing plate 103 is provided with outer sealing plate heat dissipation holes 103a. In order to ensure the heat dissipation strength of the outer sealing plate 103, the heat dissipation holes 103 are arranged in a cross shape with a cross steel plate retained in the middle.

[0059] Further, such as Figure 6 As shown, in order to ensure that the inlet and outlet copper bars 210 can reasonably extend out of the IGBT module, a radiator support plate outlet 106 a is provided on the radiator support plate 106 .

[0060] Furthermore, in order to prevent the occurrence of eddy current, the radiator support plate 106 is made of 304 stainless steel.

[0061] The module support 100 has a module air duct 109, enclosed by a main cover plate 101 and a top plate 102, for cooling air to enter and dissipate heat from the IGBT module 202. Specifically, air generated by the fan in the excitation power cabinet passes through the module air duct 109 and flows through the heat sink 201, removing heat from the IGBT module and accelerating the cooling of the IGBT module.

[0062] Furthermore, in order to facilitate the installation and removal of the IGBT module, a 1° to 3° inclined surface is provided on the top of the main sealing plate 101 and the top plate 102. At the same time, a handle 211 is provided in front of the IGBT module.

[0063] Further, such as Figure 2 As shown, since the distance between the incoming and outgoing copper busbars and the module support is too small, in order to ensure the electrical clearance and creepage distance, a module insulation member is provided inside the module support member. Specifically, the module insulation member 300 includes an insulating sealing plate I 301, an insulating sealing plate II 302, an insulator 303, an insulating support plate 304, a busbar insulating support member 305 and an insulating block 306.

[0064] The insulating sealing plate II 302 is set on the radiator support plate 106 of the module support 100, and the insulating sealing plate I 301 is connected to the insulating sealing plate II 302. At the same time, the insulator 303 is fixed on the copper busbar support 108 of the module support 100.

[0065] The driving board III 208 is insulated from the heat sink 201 through the insulating support plate 304 and the support studs.

[0066] The busbar insulating support 305 is detachably connected to the busbar support 107 of the module support 100.

[0067] The main laminate busbar 203 is insulated and connected to the top plate 102 of the module support 100 through the insulating block 306 .

[0068] Further, such as Figure 3As shown, in order to further ensure the electrical clearance and creepage distance and facilitate wiring, the insulating sealing plate I 301 is provided with an insulating sealing plate I outlet 301a on one side and an insulating sealing plate I flange 301b on the other side for forming a positioning abutment with the radiator support plate 106 of the module support 100.

[0069] In order to facilitate the wiring of the driving board II 207 , the insulating support plate 304 is provided with a wire hole 304 a at a position facing the wiring terminal of the driving board II 207 .

[0070] A photoelectric conversion protection plate 105 is provided outside the photoelectric conversion plate 209 to prevent the photoelectric conversion plate 209 from being damaged by impact.

[0071] In order to strengthen the overall structural performance of the IGBT module and ensure that the module and its connections are not damaged during transportation and vibration, fixing holes are provided on the main laminated busbar 203 of the external interface. Through the fixing holes, the main laminated busbar 203 can be fixed to the module top plate 102 through the insulating block 306, and on the other hand, the main laminated busbar 203 can be fixed to the side of the main sealing plate 101 through the busbar insulating support 305. In order to strengthen the strength of the side fixing of the main sealing plate 101, busbar supports 107 are provided at the corresponding positions of the busbar insulating support 305. Fixing holes are provided on the input and output copper busbars 210 of the external interface. The input and output copper busbars 210 can be fixed to the radiator support plate 106 through the insulator 303 and the copper busbar support 108, thereby achieving the purpose of strengthening the overall structure of the module.

[0072] Example 2

[0073] like Figure 5 、 6 , 7, 8, 9, 10, 11, 12, an excitation power cabinet includes the above-mentioned IGBT module, as well as a cabinet assembly 400 and components 500 in the cabinet,

[0074] The cabinet assembly 400 has a first chamber M and a second chamber N, and the first chamber M has an air cavity 406.

[0075] The components 500 in the cabinet include a capacitor module 501, a resistor 502, an AC / DC integrated reactor 503, AC / DC components 504, a secondary component 505 and a filter capacitor 506.

[0076] The IGBT module, capacitor module 501 and secondary components 505 are all located in the first chamber M. The charging and discharging resistors, AC / DC integrated reactor 503, AC / DC components 504 and filter capacitor 506 in the resistor 502 are all located in the second chamber N. The filter resistor in the resistor 502 is placed on the top of the cabinet assembly 400.

[0077] The IGBT modules have 5 groups, of which 3 groups of IGBT modules constitute the three phases A, B, and C, and the remaining 2 groups of IGBT modules constitute the power supply + phase and the power supply - phase. The capacitor module 501 consists of 1 AC / DC module and 1 DC / DC module, and the AC / DC module is electrically connected to the DC / DC module.

[0078] The output end of the AC circuit breaker in the AC / DC component 504 is connected to the input end of the AC side of the AC / DC integrated reactor 503, and the output end of the AC side of the AC / DC integrated reactor 503 is connected to the input end of the A phase, B phase, and C phase of the IGBT module through the inlet and outlet copper bus 210. The input end of the capacitor module 501 is connected to the output end of the A phase, B phase, and C phase of the IGBT module through the main laminated busbar 203. At the same time, the output end of the capacitor module 501 is connected to the power supply + phase and power supply + phase of the IGBT module through the main laminated busbar 203. -phase input end is connected, the output ends of the power +phase and power -phase in the IGBT module are connected to the input end of the DC side of the AC / DC integrated inductor 503 through the input and output copper bus 210, the output end of the DC side of the AC / DC integrated inductor 503 is connected to the input end of the DC circuit breaker in the AC / DC component 504, one end of the filter resistor in the resistor 502 is electrically connected to the filter capacitor 506, and the other end is electrically connected to the fuse in the cabinet assembly 400, and the charging and discharging resistor in the resistor 502 is electrically connected to the secondary component 505.

[0079] Further, such as Figure 5 、 6 As shown, in order to further improve the rationality of the structure, the cabinet assembly 400 includes a cabinet 401, and the cabinet 401 has a front door 402 and a rear door 403. The cabinet 401 is provided with side sealing plates 404 on both sides, a top sealing plate 407 on the top, and a bottom sealing plate 409 on the bottom.

[0080] The top sealing plate 407 is provided with a fan, and the periphery of the fan is provided with a fan cover 405. The air outlet of the fan dissipates heat to the IGBT module through the air cavity 406.

[0081] The interior of the cabinet 401 is divided into a first chamber M and a second chamber N by a partition 408. An AC / DC component mounting plate 410 is provided in the cabinet 401 and located in the second chamber N. The AC / DC components 504 are fixed on the AC / DC component mounting plate 410.

[0082] In order to reduce the size of the cabinet and facilitate the installation of the module, the front side of the cabinet 401 is provided with a cabinet left front column notch 401a and a cabinet right front column notch 401b corresponding to the position of the IGBT module to prevent the module from interfering with the frame of the cabinet 401 during installation. Since the power module in the power cabinet is close to the cabinet top, which has some influence on its wiring, a cabinet upper beam notch 401c is provided at the front of the cabinet 401 corresponding to the position of the power module to facilitate the wiring of the power module.

[0083] In order to ensure the circulation of air volume and improve the heat dissipation performance, the front door 402 is provided with a front door heat dissipation hole 402a, and the rear door 403 is provided with a rear door heat dissipation hole 403a.

[0084] The top sealing plate 407 is provided with a top plate heat dissipation hole 407a at a position corresponding to the capacitor module 501.

[0085] In order to facilitate the installation of the capacitor module 501 , a capacitor module lifting opening 501 a is provided on the side of the capacitor module 501 .

[0086] Further, such as Figure 7 As shown, in order to ensure the safety performance of the entire cabinet, the cabinet assembly 400 is further provided with an internal cabinet insulation member 600.

[0087] The insulation components 600 in the cabinet include an insulation protection plate 601, an insulation support 602, an upper insulation plate 603, a lower insulation plate 604, an insulation pull plate 605, an insulation cap 606, an insulation beam 607, a capacitor module insulation support plate 608 and an insulation partition 609.

[0088] In order to ensure the stability of the IGBT module installation, an insulating protective plate 601 is provided inside the cabinet assembly 400 and in front of the IGBT module and the capacitor module 501 to prevent electric shock. The insulating protective plate 601 is used to connect the IGBT modules and connect the IGBT module to the air cavity to prevent the IGBT module from tilting or moving. The insulating protective plate 601 is detachably connected to the cabinet assembly 400 through an insulating support 602.

[0089] The IGBT module is separated from the air cavity 406 by an upper insulating plate 603 installed on the top, and a lower insulating plate 604 is installed on the bottom, and an anti-tilting insulating pull plate 605 is provided on the outside. In order to ensure the stability of the installation of the capacitor module 501, the bottom of the capacitor module 501 is installed in the first chamber M through the capacitor module insulating support plate 608, and an anti-tilting insulating beam 607 is provided on the outside to prevent the capacitor module 501 from tipping over. In order to ensure that the electrical clearance and creepage distance meet the requirements, an insulating cap 606 is added to the end of the resistor 502, and the AC and DC components 504 are fixed to the AC and DC component mounting plate 410 in the cabinet assembly 400 through an insulating partition 609.

[0090] Specifically, since the IGBT module and the capacitor module 501 are in a high potential state, in order to ensure the safety performance of the entire cabinet, the module as a whole is in a floating potential state. An upper insulating plate 603 is installed on the top of the IGBT module. The upper insulating plate 603 can separate the entire top of the IGBT module from the air cavity 406. A lower insulating plate 604 is installed at the bottom of the IGBT module. The lower insulating plate 604 can separate the entire bottom of the IGBT module from the cabinet. At the bottom of the capacitor module 501, a capacitor module insulating support plate 608 is provided to ensure that the capacitor module 501 is separated from the cabinet, thereby ensuring that the entire module is in a floating potential state. In the event of overvoltage, the risk of IGBT breakdown can be reduced.

[0091] Furthermore, since the IGBT module and the capacitor module 501 are in a floating potential state as a whole, in order to ensure the installation of the operator and avoid the risk of electric shock, the insulating protection plate 601 has an insulating protection portion 601c that protects the IGBT module and the capacitor module 501, and the insulating protection portion 601c is surrounded by an insulating protection plate mounting portion 601a connected to the L-shaped insulating support 602, and the insulating protection portion 601c is provided with a wire notch 601b on both sides. In this way, the relevant wiring in the cabinet can be normally connected through the wire notch 601b.

[0092] The upper insulating plate 603 is provided with an upper insulating plate vent 603a. Specifically, the upper insulating plate 603 is provided with an upper insulating plate vent 603a that corresponds to the air cavity air outlet 406a, which can ensure the heat dissipation effect of the IGBT module. The upper insulating plate 603 is installed on the module top plate 102. The upper insulating plate 603 is provided with an upper insulating plate mounting hole 603b, and the upper insulating plate mounting hole 603b is a countersunk hole to ensure that the mounting bolt does not protrude from the upper insulating plate 603 and affect the push-on installation of the IGBT module.

[0093] Further, if Figure 11As shown, the lower insulating plate 604 is provided with a lower insulating plate vent 604a, which corresponds to the module air duct 109. At the same time, the inlet and outlet copper bars 210 also pass through the lower insulating plate vent 604a.

[0094] The lower insulating plate 604 is provided with a lower insulating plate mounting hole 604b, and the lower insulating plate mounting hole 604b is a countersunk hole, the purpose of which is to ensure that the mounting bolts do not protrude from the upper insulating plate 603 and affect the push-in installation of the IGBT module. At the same time, the lower insulating plate 604 is provided with a module front limit plate mounting hole 604c, a module rear limit plate mounting hole 604d and a module slide rail mounting hole 604e, and the module front limit plate mounting hole 604c, the module rear limit plate mounting hole 604d and the module slide rail mounting hole 604e are blind holes, the purpose of which is to prevent the fastening screws from passing through the lower insulating plate 604, causing the module and the cabinet to be conductive and equipotential.

[0095] Further, such as Figure 12 As shown, the air cavity 406 is provided with an air cavity vent 406a, which corresponds directly to each IGBT module air duct 109. A rubber strip 406b is provided below the air cavity vent 406a to ensure airtightness after the module is installed and to ensure that the air generated by the fan passes through the IGBT module. The cabinet front door 402 is provided with a front door heat dissipation hole 402a, and the cabinet rear door 403 is provided with a rear door heat dissipation hole 403a to ensure air circulation and improve overall heat dissipation performance. The cabinet top sealing plate 407 is provided with a top plate heat dissipation hole 407a corresponding to the position of the capacitor module 501, so that the heat generated in the capacitor module 501 can be discharged through the top plate heat dissipation hole 407a.

[0096] The air cavity air outlet 406a corresponds to the upper insulation plate vent 603a, the lower insulation plate vent 604a, and the module air duct 109 on the IGBT module.

[0097] In order to facilitate the disassembly and assembly of the IGBT module, an inclined surface with an angle of 1° to 3° corresponding to the top of the main sealing plate 101 and the top of the top plate 102 is provided at the bottom of the air cavity 406 .

[0098] Furthermore, in order to ensure the convenience of the inlet and outlet of the entire cabinet, a movable bottom sealing plate 409 is provided at the bottom of the cabinet corresponding to the outlet copper busbar.

[0099] The beneficial effects of the present invention are:

[0100] 1) Through the reasonable layout of the IGBT module, the space size of the module is reduced, the heat dissipation capacity of the module is guaranteed, and at the same time, the laminated busbars, inlet and outlet copper bars, etc. are strengthened and fixed, thereby enhancing the overall structural performance of the module.

[0101] 2) Because the top of the main sealing plate and the top of the top plate are provided with a 1° to 3° inclined surface, and the bottom of the air cavity is provided with a 1° to 3° inclined surface corresponding to the top of the main sealing plate and the top plate, it makes it smoother and more convenient to push and install the IGBT module;

[0102] 3) Because the IGBT module and capacitor module are separated from other components by insulating plates at the top and bottom, the entire module is in a state of overall potential suspension, which can reduce the risk of IGBT breakdown in the event of overvoltage. At the same time, the front of the module is protected by an insulating protective plate, which can reduce the risk of electric shock and increase the safety protection level of the cabinet;

[0103] 4) By improving the integration of modules, reactors, AC and DC components and optimizing the heat dissipation structure, the excitation cabinet structure is optimized, the space occupancy is reduced, and the space utilization rate is improved.

[0104] With the above-described preferred embodiments of the present invention as a guide, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. An IGBT module, characterized in that: The invention comprises a module support (100) and a module component (200), wherein the module component (200) is arranged inside the module support (100). The module components (200) include a heat sink (201), an IGBT module (202), a main laminate busbar (203), a sub-laminated busbar (204), an absorption capacitor (205), a driving board I (206), a driving board II (207), a driving board III (208), a photoelectric conversion board (209), and an inlet and outlet copper busbar (210). The heat sink (201) is arranged in the module support (100), and two upper and lower rows of IGBT modules (202) are arranged on the heat sink (201), the driving board I (206) is fixed on the upper row of IGBT modules (202), the driving board II (207) is fixed on the lower row of IGBT modules (202), the driving board III (208) is insulated from the heat sink (201), and is located above the driving board II (207), the main laminated busbar (203) is insulated from the module support (100), and the lower pins of the main laminated busbar (203) are connected to the upper row of IGBT modules (2 02), the absorption capacitor (205) is fixed on the lower pin of the main laminate busbar (203), the sub-laminate busbar (204) is fixed on the lower pin of the upper IGBT module (202) and the upper pin of the lower IGBT module (202), the inlet and outlet copper busbar (210) is fixed on the lower pin of the lower IGBT module (202), the photoelectric conversion board (209) is provided on the module support (100) and is electrically connected to the drive board III (208), and the drive board I (206), the drive board II (207) and the drive board III (208) are electrically connected through a wiring harness.

2. The IGBT module according to claim 1, wherein: The module support (100) comprises a main sealing plate (101), a top plate (102), an outer sealing plate (103), a photoelectric conversion mounting plate (104), a photoelectric conversion protection plate (105), a radiator support plate (106), a busbar support (107) and a copper busbar support (108); the module components (200) are arranged inside the main sealing plate (101), the top plate (102) and the outer sealing plate (103); the radiator (201) is fixed on the main sealing plate (101); the top plate (102) is fixed on the radiator (201) and the top of the main sealing plate (101); the radiator support plate (106) is arranged between the radiator (201) and the main sealing plate The outer sealing plate (103) is fixed to the main sealing plate (101), the top (102) and the outside of the radiator support plate (106) at the same time. The photoelectric conversion plate (209) is fixed to the main sealing plate (101) through the photoelectric conversion mounting plate (104). The photoelectric conversion protection plate (105) is fixedly connected to the photoelectric conversion mounting plate (104) and is located on the periphery of the photoelectric conversion plate (209). The busbar support (107) is provided on the radiator (201) and the main sealing plate (101). The copper busbar support (108) is fixedly connected to the radiator support plate (106), and the copper busbar support (108) simultaneously supports the inlet and outlet copper busbars (210).

3. The IGBT module according to claim 2, wherein: The outer sealing plate (103) is provided with an outer sealing plate heat dissipation hole (103a), the radiator support plate (106) is provided with a radiator support plate outlet (106a), and the module support member (100) has a module air duct (109) formed by enclosing a main sealing plate (101) and a top plate (102), for cooling air to enter and dissipate heat and cool the IGBT module (202).

4. The IGBT module according to claim 2, wherein: The top of the main sealing plate (101) and the top of the top plate (102) are provided with inclined surfaces of 1° to 3°.

5. The IGBT module according to claim 1, wherein: The module insulation member (300) includes an insulation sealing plate I (301), an insulation sealing plate II (302), an insulator (303), an insulation support plate (304), a busbar insulation support member (305) and an insulation block (306). The insulating sealing plate II (302) is arranged on the radiator support plate (106) of the module support (100), and the insulating sealing plate I (301) is connected to the insulating sealing plate II (302), while the insulator (303) is fixed on the copper busbar support (108) of the module support (100). The driving plate III (208) is insulated and connected to the radiator (201) via the insulating support plate (304) and the support studs. The busbar insulating support (305) is detachably connected to the busbar support (107) of the module support (100). The main laminate busbar (203) is insulated and connected to the top plate (102) of the module support (100) through an insulating block (306).

6. The IGBT module according to claim 5, wherein: One side of the insulating sealing plate I (301) is provided with an insulating sealing plate I outlet (301a), and the other side is provided with an insulating sealing plate I flange (301b) for forming a positioning abutment with the radiator support plate (106) of the module support member (100). The insulating support plate (304) is provided with a wire hole (304a) at a position facing the connection terminal of the driving plate II (207).

7. An excitation power cabinet, characterized in that: It comprises an IGBT module according to any one of claims 1 to 6, as well as a cabinet assembly (400) and components (500) in the cabinet, The cabinet assembly (400) has a first chamber M and a second chamber N, and the first chamber M has an air cavity (406). The components (500) in the cabinet include a capacitor module (501), a resistor (502), an AC / DC integrated reactor (503), AC / DC components (504), a secondary component (505), and a filter capacitor (506). The IGBT module, capacitor module (501) and secondary components (505) are all located in the first chamber M; the charging and discharging resistors, AC / DC integrated reactor (503), AC / DC components (504) and filter capacitor (506) in the resistor (502) are all located in the second chamber N; the filter resistor in the resistor (502) is placed on the top of the cabinet assembly (400). The IGBT modules have 5 groups, of which 3 groups of IGBT modules constitute the three phases A, B, and C, and the remaining 2 groups of IGBT modules constitute the power supply + phase and the power supply - phase. The capacitor module (501) consists of 1 AC / DC module and 1 DC / DC module, and the AC / DC module is electrically connected to the DC / DC module. The output end of the AC circuit breaker in the AC / DC component (504) is connected to the input end of the AC side in the AC / DC integrated reactor (503), and the output end of the AC side in the AC / DC integrated reactor (503) is connected to the input ends of phase A, phase B, and phase C in the IGBT module via the inlet and outlet copper bars (210). The input end of the capacitor module (501) is connected to the output ends of phase A, phase B, and phase C in the IGBT module via the main laminated busbar (203). At the same time, the output end of the capacitor module (501) is connected to the power supply + phase and power supply - phase in the IGBT module via the main laminated busbar (203). The output ends of the power supply + phase and the power supply - phase in the IGBT module are connected to the input end of the DC side in the AC / DC integrated reactor (503) through the inlet and outlet copper bars (210); the output end of the DC side in the AC / DC integrated reactor (503) is connected to the input end of the DC circuit breaker in the AC / DC component (504); one end of the filter resistor in the resistor (502) is electrically connected to the filter capacitor (506), and the other end is electrically connected to the fuse in the cabinet assembly (400); and the charge and discharge resistor in the resistor (502) is electrically connected to the secondary component (505).

8. The excitation power cabinet according to claim 7, characterized in that: The cabinet assembly (400) comprises a cabinet (401), wherein the cabinet (401) has a front door (402) and a rear door (403), and the cabinet (401) is provided with side sealing plates (404) on both sides, a top sealing plate (407) on the top, and a bottom sealing plate (409) on the bottom. A fan is provided on the top sealing plate (407), a fan cover (405) is provided on the periphery of the fan, and the air outlet of the fan dissipates heat from the IGBT module through the air cavity (406). The interior of the cabinet (401) is divided into a first chamber M and a second chamber N by a partition (408). An AC / DC component mounting plate (410) is provided in the cabinet (401) and located in the second chamber N. The AC / DC component (504) is fixed on the AC / DC component mounting plate (410). The front side of the cabinet (401) and corresponding to the position of the IGBT module are provided with a cabinet left front column notch (401a) and a cabinet right front column notch (401b). The front door (402) is provided with a front door heat dissipation hole (402a), and the rear door (403) is provided with a rear door heat dissipation hole (403a). A top plate heat dissipation hole (407a) is provided on the top sealing plate (407) at a position corresponding to the capacitor module (501). A capacitor module lifting opening (501a) is provided on the side of the capacitor module (501).

9. The excitation power cabinet according to claim 7, characterized in that: The cabinet assembly (400) is further provided with an internal cabinet insulation member (600). The insulation member (600) in the cabinet includes an insulation protection plate (601), an insulation support member (602), an upper insulation plate (603), a lower insulation plate (604), an insulation pull plate (605), an insulation cap (606), an insulation beam (607), a capacitor module insulation support plate (608) and an insulation partition (609). An insulating protection plate (601) for preventing electric shock is provided inside the cabinet assembly (400) and in front of the IGBT module and the capacitor module (501), and the insulating protection plate (601) is detachably connected to the cabinet assembly (400) via an insulating support member (602). The IGBT module is separated from the air cavity (406) by an upper insulating plate (603) installed on the top, and a lower insulating plate (604) is installed on the bottom, and an anti-tilting insulating pull plate (605) is provided on the outside of the lower insulating plate. The bottom of the capacitor module (501) is installed in the first chamber M through a capacitor module insulating support plate (608), and an anti-tilting insulating beam (607) is provided on the outside of the lower insulating plate. An insulating cap (606) is added to the end of the resistor (502). The AC and DC components (504) are fixed to the AC and DC component mounting plate (410) in the cabinet assembly (400) through an insulating partition (609).

10. The excitation power cabinet according to claim 9, characterized in that: The insulating protection plate (601) has an insulating protection portion (601c) for protecting the IGBT module and the capacitor module (501), and insulating protection plate mounting portions (601a) connected to the L-shaped insulating support member (602) are provided around the insulating protection portion (601c), and wire-passing notches (601b) are provided on both sides of the insulating protection portion (601c). The upper insulating plate (603) is provided with an upper insulating plate vent (603a), and the lower insulating plate (604) is provided with a lower insulating plate vent (604a). The air cavity (406) is provided with an air cavity air outlet (406a), and a rubber strip (406b) is provided at the lower portion of the air cavity air outlet (406a). The air cavity air outlet (406a) corresponds to the upper insulation plate vent (603a), the lower insulation plate vent (604a), and the module air duct (109) on the IGBT module.

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