Heating film production process

Abstract

The invention provides a heating film production technology. The heating film production technology comprises the following steps that a metal thin film and a bottom film are attached to form a basic film material; transferring the basic film material into laser cutting equipment, cutting the basic film material into a metal film, cutting off the metal film while the bottom film is not broken to form a complete conductive circuit, and attaching a first film layer with high-temperature resistance, heat conduction and insulation properties to the surface of the metal film cut in the previous step to form a conductive circuit; and attaching a second film layer with high temperature resistance, heat conduction and insulation properties to the bottom of the metal film, and attaching a double faced adhesive tape to the lower part of the second film layer to form a finished product of the heating film. According to the heating film production process provided by the invention, a metal film is processed by adopting a laser cutting process, the process is not limited by the size, a large-area flaky metal circuit heating film can be produced, cutting fluid or chemical pollution is avoided, waste gas can be treated through a filtering system, the environment-friendly production environment requirement is met, the production efficiency is high, and the production cost is low. And the consistency of product performance is good.

Description

Technical Field

[0001] The present invention relates to the technical field of heating products, in particular to a production process of a heating film. Background Art

[0002] Metal heating film is a thin-film electric heating device with metal material as the core heating element. The current processing method is to etch metal circuits on the film layer through chemical etching. After the metal circuits are connected to the power supply, heat is generated. However, due to the limitation of the size of the etching machine, the size of the sheet metal circuit heating film produced by this method is limited to a certain extent, and the production process will cause pollution, and its production efficiency is low. Summary of the Invention

[0003] The purpose of the present invention is to provide a heating film production process to solve the technical problems in the background technology.

[0004] To achieve the aforementioned objectives, the present invention provides the following technical solutions:

[0005] A heating film production process comprises the following steps:

[0006] Step S1, attaching the metal film and the base film to form a base film material;

[0007] Step S2, transferring the base film material described in step S1 to a laser cutting device, and cutting the base film material with the metal film facing upward, so that the metal film is cut off but the base film is not broken;

[0008] Step S3, removing excess metal film waste from the product after laser cutting in step S2 to form a complete conductive circuit;

[0009] Step S4, attaching a first film layer having high temperature resistance, thermal conductivity and insulation properties to the surface of the metal film cut in step S3, wherein the first film layer has a single-sided adhesive layer adhered to the metal film;

[0010] In step S5, the base film of the metal film in step S4 is removed, and a second film layer having the same high temperature resistance, thermal conductivity and insulation properties is attached to the bottom of the metal film. The second film layer has a single-sided adhesive layer adhered to the metal film, that is, the metal film is attached between the first film layer and the second film layer to form a finished structure of the heating film.

[0011] Double-sided tape is attached below the second film layer in step S5.

[0012] The metal film is made of any one of nickel-chromium alloy, stainless steel foil or copper foil.

[0013] The base film is made of PET material with a single-sided adhesive layer.

[0014] The first film layer and the second film layer have the same material structure and are both made of polyimide, silica gel or mica board.

[0015] Compared with the existing technology, the present invention provides a heating film production process, which uses a laser cutting process to process the metal film. It is not limited by size and can produce large-area sheet metal circuit heating films. In addition, there is no cutting fluid or chemical pollution in this application, and the exhaust gas can be treated by a filtration system to meet the requirements of an environmentally friendly production environment. The processing technology provided by this application uses laser cutting to achieve a cutting accuracy of ±0.05mm, and can accurately cut complex circuit patterns of metal films, meeting the multifunctional design requirements of the heating film, with high production efficiency and good consistency in product performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 : Schematic diagram of the finished product structure of the heating film in Example 1 of the present invention;

[0017] Figure 2 : Schematic diagram of the finished product composition structure of the heating film in Example 2 of the present invention. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0019] Specific embodiment 1: In an embodiment of the present invention, a heating film production process includes the following steps:

[0020] Step S1, attaching the metal film 2 to the base film to form a base film material, where the base film is made of PET material with a single-sided adhesive layer;

[0021] In step S2, the base film material in step S1 is transferred to a laser cutting device. The laser cuts the base film material according to a pre-set cutting trajectory, with the metal film 2 of the base film facing upwards, so that the metal film 2 is cut and the base film is not cut. Laser cutting can directly process circuits of any shape through CNC programming, eliminating mold production costs and time, and is particularly suitable for processing small-batch customization or heating films with complex circuit structures.

[0022] In step S3, the excess metal film 2 waste on the product after laser cutting in step S2 is removed to form a complete conductive circuit. Since the laser cutting width is only 0.1-0.3mm and the cutting surface is smooth and burr-free, no secondary processing is required. This feature can prevent short circuits or poor contact in the conductive circuit.

[0023] Step S4, attaching a first film layer 1 having high temperature resistance, thermal conductivity and insulation properties to the surface of the metal film 2 cut in step S3, wherein the first film layer 1 has a single-sided adhesive layer adhered to the metal film 2;

[0024] Step S5: Remove the bottom film of the metal film 2 in step S4, and attach a second film layer 3 with the same high temperature resistance, thermal conductivity and insulation properties to the bottom of the metal film 2. The second film layer 3 has a single-sided adhesive layer and is adhered to the metal film 2. That is, the metal film 2 is attached between the first film layer 1 and the second film layer 3 to form a finished heating film. The structural composition of the finished product is shown in FIG. Figure 1 ;

[0025] The metal film 2 in this application is made of any one of nickel-chromium alloy, stainless steel foil or copper foil. In this embodiment, the metal film 2 is made of nickel-chromium alloy. Nickel-chromium alloy has excellent corrosion resistance, heat resistance and mechanical properties. In high temperature environment, nickel-chromium alloy can maintain its strength and hardness, and is not easy to deform or melt, effectively ensuring the normal use of the heating film made of this material when it is powered on and heated.

[0026] The first film layer 1 and the second film layer 3 in the present application have the same material structure. The first film layer 1 and the second film layer 3 both cover the circuit structure processed on the metal film 2. The first film layer 1 and the second film layer 3 are both made of any one of polyimide (PI), silica gel or mica board. In this embodiment, the first film layer 1 and the second film layer 3 are both made of polyimide (PI) material. Polyimide (PI) has excellent properties such as high temperature resistance, radiation resistance and low thermal expansion coefficient. In terms of electrical insulation, the film made of polyimide (PI) has high dielectric strength, which can effectively block current leakage and avoid the risk of short circuit. At the same time, the film layer made of PI can also be used as an insulating layer to suppress the resistance drift of the metal conductive layer (such as nickel-chromium alloy), thereby ensuring the long-term stability of the heating power.

[0027] Specific embodiment 2: Based on embodiment 1, a double-sided tape 4 is attached to the bottom of the second film layer 3 in step S5 to form a finished product of the heating film. Figure 2 As shown in the structural diagram, the double-sided tape 4 can adopt the currently commonly used 3M tape. The double-sided tape 4 can be used to attach the heating film structure of the present application to the required scene for quick installation and use.

[0028] Compared with the existing technology, the present invention provides a heating film production process, which uses a laser cutting process to process the metal film. It is not limited by size and can produce large-area sheet metal circuit heating films. In addition, there is no cutting fluid or chemical pollution in this application, and the exhaust gas can be treated by a filtration system to meet the requirements of an environmentally friendly production environment. The processing technology provided by this application uses laser cutting to achieve a cutting accuracy of ±0.05mm, and can accurately cut complex circuit patterns of metal films, meeting the multifunctional design requirements of the heating film, with high production efficiency and good consistency in product performance.

[0029] It will be apparent to those skilled in the art that the present invention is not limited to the details of the foregoing exemplary embodiments and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and it is intended that all variations within the meaning and range of equivalents of the claims be embraced therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0030] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A heating film production process, characterized in that: The following steps are involved: Step S1, attaching the metal film and the base film to form a base film material; Step S2, transferring the base film material described in step S1 to a laser cutting device, and cutting the base film material with the metal film facing upward, so that the metal film is cut off but the base film is not broken; Step S3, removing excess metal film waste from the product after laser cutting in step S2 to form a complete conductive circuit; Step S4, attaching a first film layer having high temperature resistance, thermal conductivity and insulation properties to the surface of the metal film cut in step S3, wherein the first film layer has a single-sided adhesive layer adhered to the metal film; In step S5, the base film of the metal film in step S4 is removed, and a second film layer having the same high temperature resistance, thermal conductivity and insulation properties is attached to the bottom of the metal film. The second film layer has a single-sided adhesive layer adhered to the metal film, that is, the metal film is attached between the first film layer and the second film layer to form a finished structure of the heating film.

2. A heating film production process according to claim 1, characterized in that: A double-sided tape is attached below the second film layer in step S5.

3. A heating film production process according to any one of claims 1 or 2, characterized in that: The metal film is made of any one of nickel-chromium alloy, stainless steel foil or copper foil.

4. A heating film production process according to claim 3, characterized in that: The base film is made of PET material with a single-sided adhesive layer.

5. A heating film production process according to claim 4, characterized in that: The first film layer and the second film layer have the same material structure and are both made of polyimide, silica gel or mica board.

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