Chip mounting mechanism

Abstract

The invention discloses a chip mounting mechanism, and relates to the technical field of chip mounting, and the chip mounting mechanism is characterized in that the bottom end of a mounting main body is fixedly connected with a baffle plate, the baffle plate is provided with a plurality of air outlet holes along the length direction, the side end of the baffle plate is fixedly connected with an air blowing assembly, and the air blowing assembly is communicated with the air outlet holes; the two limiting assemblies are located on the two sides of the interior of the mounting body respectively, the bottom ends of the limiting assemblies are fixedly connected with the mounting body, and the mounting assemblies are arranged at the tops of the limiting assemblies; the air blowing assembly operates, the air blowing assembly introduces filtered air into the baffle, the air flow penetrates through the air outlet holes, the air flow cleans the top of the mainboard, when the air flow flows along the top of the mainboard, the air flow removes dust on the top of the mainboard, and therefore the poor contact effect is avoided when a chip is attached to the top of the mainboard.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounting, and in particular to a chip mounting mechanism. Background Art

[0002] A chip, also known as an integrated circuit, is a miniaturized circuit that integrates a large number of electronic components and connecting circuits on a piece of semiconductor material. These electronic components and circuits are manufactured through semiconductor technology and are highly integrated and miniaturized.

[0003] In the prior art, chips are often mounted on the motherboard using a mounting mechanism. The mounting mechanism is provided with an adsorption device, which adsorbs the chip and then places the chip on the motherboard. At the same time, the mounting mechanism provides a vacuum environment for the chip mounting. The chip is heated using the mounting mechanism's hot air system before mounting, thereby achieving the chip mounting effect.

[0004] However, when the mainboard is placed on the mounting mechanism, dust is contained on the mainboard. When the chip is mounted on the mainboard, the dust may cause poor contact of the chip, thereby affecting the mounting effect of the chip. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip mounting mechanism to solve the technical problem in the prior art that when a motherboard is placed on the mounting mechanism, dust is contained on the motherboard. When the chip is mounted on the motherboard, the dust will cause poor contact of the chip, thereby affecting the mounting effect of the chip.

[0006] The technical problem to be solved by the present invention can be achieved through the following technical solutions:

[0007] Chip placement mechanism, including:

[0008] A mounting body, wherein a baffle is fixedly connected to the bottom end of the mounting body, the baffle is provided with a plurality of air outlet holes along the length direction, and a blast assembly is fixedly connected to the side end of the baffle, and the blast assembly is communicated with the air outlet holes;

[0009] The limiting components are provided in two groups and are respectively located on both sides of the interior of the mounting body, and the bottom ends of the limiting components are fixedly connected to the mounting body;

[0010] A mounting component is arranged on top of the limiting component.

[0011] As a further solution of the present invention: the limit assembly includes: a limit plate, a limit rod and a limiter, the bottom end of the limiter is fixedly connected to the mounting body, the two ends of the limit rod are respectively fixedly connected to the limit plate and the limiter, the limiter is slidably connected to the mounting body, and the side end of the limiter is slidably connected to the baffle.

[0012] As a further solution of the present invention: the top end of the limiting plate is abutted and connected with a supporting plate, and the side end of the supporting plate is rotatably connected to the baffle.

[0013] As a further solution of the present invention: the side end of the supporting plate is fixedly connected to a flip plate, the side end of the flip plate is fixedly connected to a flipper, the cross-section of the flip plate is semicircular, the bottom end of the flipper is fixedly connected to a blower assembly, and the blower assembly is located at the side end of the baffle.

[0014] As a further solution of the present invention: the blowing assembly includes: a blower and a connecting pipe, the connecting pipe is provided in several groups and is evenly distributed along the length direction of the blower, and both ends of the connecting pipe are fixedly connected to the baffle and the blower respectively.

[0015] As a further solution of the present invention: hinge seats are fixedly connected to both sides of the baffle, and the bottom ends of the hinge seats are fixedly connected to the supporting plate.

[0016] As a further solution of the present invention: the mounting component includes: a moving component, an adsorption tube and an absorber, the adsorption tubes are provided in several groups and are equidistantly distributed along the length direction of the absorber, the top end of the adsorption tube is fixedly connected to the absorber, the top end of the absorber is fixedly connected to the moving component, and the moving component moves back and forth in the length direction parallel to the mounting body.

[0017] As a further solution of the present invention: the moving assembly includes: a telescopic rod, a telescope and a slide, the upper and lower ends of the telescopic rod are respectively fixedly connected to the adsorber and the telescope, the top of the telescope is fixedly connected to the slide, and sliding holes are respectively opened at both ends of the slide, and a guide rod is slidably connected along the inner wall of the sliding hole, and the two ends of the guide rod are respectively fixedly connected to the inner wall of the mounting body.

[0018] As a further solution of the present invention: a carrying platform is provided at the bottom of the adsorption tube, a carrying groove is provided at the top of the carrying platform, the side end of the carrying platform is fixedly connected to the inside of the mounting body, the mounting body is provided with a loading port at one end close to the carrying platform, the side end of the mounting body is fixedly connected to a feeder, and the feeder is communicated with the loading port.

[0019] As a further solution of the present invention: a hot air heater is provided at the side end of the supporting platform, and the hot air heater is located at the bottom of the adsorption tube. Two sets of support rods are provided between the hot air heater and the mounting body, and the two ends of the support rods are fixedly connected to the hot air heater and the mounting body respectively.

[0020] Beneficial effects of the present invention:

[0021] 1. Before the chip is mounted, the mainboard is placed in the mounting body first, and the mainboard is first held against the baffle. When the mainboard is placed, the limit assembly operates, and the limit assembly holds and limits both sides of the mainboard. At this time, the blower assembly operates, and the blower assembly passes the filtered air into the baffle. The airflow passes through the air outlet and cleans the top of the mainboard. When the airflow flows along the top of the mainboard, the airflow removes the dust on the top of the mainboard, thereby avoiding poor contact when the chip is mounted on the top of the mainboard.

[0022] 2. When the dust on the top of the motherboard is removed, the blower component stops running, the mounting body is sealed, and then the air in the mounting body is removed through the vacuum system. Then the mounting component adsorbs the chip and then installs it on the motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the accompanying drawings.

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a front view of the overall structure of the present invention;

[0026] Figure 3 It is a cross-sectional view of the overall structure of the present invention;

[0027] Figure 4 It is a schematic diagram of the mounting assembly structure of the present invention.

[0028] In the figure: 1. Mounting body; 2. Blower; 3. Turner; 4. Turning plate; 5. Support plate; 6. Limit plate; 7. Limit rod; 8. Limiter; 9. Carrying platform; 10. Carrying slot; 11. Adsorption tube; 12. Adsorption device; 13. Telescopic rod; 14. Telescopic device; 15. Sliding seat; 16. Guide rod; 17. Loading port; 18. Baffle; 19. Air outlet; 20. Connecting pipe; 21. Feeder; 22. Sliding hole; 23. Articulated seat; 24. Hot air generator; 25. Support rod. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0030] like Figures 1-4 As shown, the chip mounting mechanism includes: a mounting body 1, a limiting component and a mounting component.

[0031] The bottom end of the mounting body 1 is fixedly connected to a baffle 18, and the baffle 18 is provided with a plurality of air outlet holes 19 along the length direction. The side end of the baffle 18 is fixedly connected to a blower assembly, and the blower assembly and the air outlet holes 19 are communicated with each other. The limiting assembly is provided with two groups and is respectively located on both sides of the interior of the mounting body 1. The bottom end of the limiting assembly is fixedly connected to the mounting body 1, and the mounting assembly is arranged on the top of the limiting assembly. Before the chip is mounted, the motherboard is first placed in the mounting body 1, and the motherboard is first abutted against the baffle 18. When the motherboard is placed, the limiting assembly is operated, and the limiting assembly abuts and limits the two sides of the motherboard. At this time, the blower assembly is operated, and the blower assembly passes the filtered air into the baffle 18. The airflow passes through the air outlet holes 19, and the airflow cleans the top of the motherboard. When the airflow flows along the top of the motherboard, the airflow removes the dust on the top of the motherboard, thereby avoiding the effect of poor contact when the chip is mounted on the top of the motherboard;

[0032] When the dust on the top of the motherboard is removed, the blower assembly stops running, the mounting body 1 is sealed, and then the air in the mounting body 1 is removed through the vacuum system, and then the mounting assembly adsorbs the chip and installs it on the motherboard.

[0033] In some specific embodiments, the limit assembly includes: a limit plate 6, a limit rod 7 and a limiter 8. The bottom end of the limiter 8 is fixedly connected to the mounting body 1, and the two ends of the limit rod 7 are respectively fixedly connected to the limit plate 6 and the limiter 8. The limiter 8 is slidably connected to the mounting body 1, and the side end of the limiter 8 is slidably connected to the baffle 18. When the mainboard is placed in the mounting body 1, the two sets of limit assemblies operate simultaneously, the limiter 8 operates, the limiter 8 drives the limit rod 7 to open, and the limit rod 7 drives the limit plate 6 to slide along the mounting body 1. When the limit plate 6 resists the side end of the mainboard, the limiter 8 stops operating, thereby realizing the effect of the two sets of limit plates 6 resisting and limiting the two sides of the mainboard. The limit assembly can resist and limit mainboards of different lengths, further improving the applicability of the limit assembly.

[0034] In some specific embodiments, the top end of the limiting plate 6 is connected to the supporting plate 5, and the side end of the supporting plate 5 is rotatably connected to the baffle 18. When dust is removed from the top of the main board, in order to avoid dust splashing into the interior of the mounting body 1 when the airflow removes dust, when the limiting component supports and limits the main board, the supporting plate 5 is flipped, and the supporting plate 5 supports the top end of the limiting plate 6. The supporting plate 5 and the limiting plate 6 block the flying dust, and the dust will be discharged along the supporting plate 5 and the limiting plate 6, and then discharged from the feed port of the mounting body 1, wherein the air outlet 19 opened on the baffle 18 is located at the bottom of the limiting plate 6.

[0035] In some specific embodiments, the side end of the supporting plate 5 is fixedly connected to the flip plate 4, and the side end of the flip plate 4 is fixedly connected to the flipper 3. The cross section of the flip plate 4 is semicircular, and the bottom end of the flipper 3 is fixedly connected to a blast assembly. The blast assembly is located at the side end of the baffle 18. When the supporting plate 5 needs to be flipped and abutted against the top of the limit plate 6, the flipper 3 runs, the flipper 3 drives the flip plate 4 to move, and the flip plate 4 drives the supporting plate 5 to flip. When the supporting plate 5 abuts against the top of the limit plate 6, the flipper 3 stops running. When the dust on the inside is removed, the flipper 3 drives the flip plate 4 to reset, and the flip plate 4 drives the supporting plate 5 to flip in the direction away from the limiting plate 6. When the supporting plate 5 and the bottom of the mounting body 1 are perpendicular, the flipper 3 stops running. The flipper 3 can control the flipping and supporting of the supporting plate 5 through the flip plate 4. The length of the supporting plate 5 is equal to the length of the baffle 18. When the supporting plate 5 and the limiting plate 6 are in contact, the side end of the supporting plate 5 and the baffle 18 are in contact, thereby preventing dust from flowing out from the gap between the supporting plate 5 and the baffle 18.

[0036] In some specific embodiments, the blowing assembly includes: a blower 2 and a connecting pipe 20, the connecting pipe 20 is provided with several groups and is evenly distributed along the length direction of the blower 2, and the two ends of the connecting pipe 20 are fixedly connected to the baffle 18 and the blower 2 respectively. When the blowing assembly is running, the blower 2 runs, and the blower 2 blows out the filtered air. The airflow flows along the connecting pipe 20, and then the airflow flows to the baffle 18, and then the airflow is ejected from the air outlet 19. The connecting pipe 20 achieves the effect of guiding the airflow.

[0037] In some specific embodiments, the baffle 18 is fixedly connected to a hinge seat 23 on both sides, and the bottom end of the hinge seat 23 is fixedly connected to the supporting plate 5. When the supporting plate 5 is flipped, the supporting plate 5 drives the hinge seat 23 to rotate, and the hinge seat 23 achieves the effect of hingedly connecting the supporting plate 5 to the baffle 18.

[0038] In some specific embodiments, the mounting component includes: a moving component, an adsorption tube 11 and an adsorber 12. The adsorption tube 11 is provided with several groups and is equidistantly distributed along the length direction of the adsorber 12. The top of the adsorption tube 11 is fixedly connected to the adsorber 12. The top of the adsorber 12 is fixedly connected to the moving component. The moving component moves back and forth in the length direction parallel to the mounting body 1. When the mounting component is running, the moving component moves the adsorber 12 downward. When the adsorption tube 11 contacts the chip, the moving component stops moving the adsorber 12. The adsorber 12 runs, and the adsorber 12 adsorbs the chip on the bottom end of the adsorption tube 11 through the adsorption tube 11. Then the moving component moves, and the moving component moves the chip to the top of the main board through the adsorber 12 and the adsorption tube 11. Then the moving component moves the adsorber 12 downward. The adsorber 12 mounts the chip on the main board through the adsorption tube 11. When the chip is mounted, the moving component drives the adsorber 12 and the adsorption tube 11 to reset.

[0039] In some specific embodiments, the moving component includes: a telescopic rod 13, a telescope 14 and a slide 15, the upper and lower ends of the telescopic rod 13 are fixedly connected to the adsorber 12 and the telescope 14 respectively, the top of the telescope 14 is fixedly connected to the slide 15, and sliding holes 22 are respectively opened at both ends of the slide 15, and a guide rod 16 is slidably connected along the inner wall of the sliding hole 22, and the two ends of the guide rod 16 are respectively fixedly connected to the inner wall of the mounting body 1. When the moving component is running, the slide 15 can slide along the guide rod 16, and the sliding hole 22 opened in the slide 15 slides along the guide rod 16. The slide 15 drives the telescope 14 to move, and the telescope 14 can drive the telescopic rod 13 to move upward or downward, so that the telescopic rod 13 moves up or downward with the adsorber 12.

[0040] In some specific embodiments, a carrier platform 9 is provided at the bottom of the adsorption tube 11, a carrier groove 10 is provided at the top of the carrier platform 9, the side end of the carrier platform 9 is fixedly connected to the inside of the mounting body 1, and the mounting body 1 is provided with a loading port 17 at one end close to the carrier platform 9, and a feeder 21 is fixedly connected to the side end of the mounting body 1, and the feeder 21 is communicated with the loading port 17. The chip is placed on the carrier platform 9, and the chips are arranged in sequence on the carrier groove 10. When the chip is adsorbed by the mounting component, the feeder 21 runs and the feeder 21 loads the new chip. The feeder 21 can put the chip in a vacuum state, and then pass the chip through the loading port 17. The chip slides along the inner wall of the loading groove 10, thereby realizing the effect of automatically loading the chip on the carrier platform 9. The loading groove 10 opened on the carrier platform 9 can limit the chip, and the carrier platform 9 realizes the function of carrying the chip.

[0041] In some specific embodiments, a hot air heater 24 is provided at the side end of the carrier platform 9, and the hot air heater 24 is located at the bottom of the adsorption tube 11. Two groups of support rods 25 are provided between the hot air heater 24 and the mounting body 1. The two ends of the support rods 25 are fixedly connected to the hot air heater 24 and the mounting body 1 respectively. When the mounting component adsorbs the chip and detaches from the carrier platform 9, the mounting component moves to the top of the hot air heater 24, and the hot air heater 24 blows hot air to the bottom of the chip, thereby achieving the effect of heating the bottom of the chip.

[0042] The above describes several embodiments of the present invention in detail, but the embodiments of the present invention are not limited to these and should not be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. Chip mounting mechanism, characterized in that: include: A mounting body (1), wherein a baffle (18) is fixedly connected to the bottom end of the mounting body (1), a plurality of air outlet holes (19) are provided on the baffle (18) along the length direction, and a blast assembly is fixedly connected to the side end of the baffle (18), wherein the blast assembly and the air outlet holes (19) are in communication with each other; A limiting component, wherein the limiting component is provided in two groups and is respectively located on both sides of the interior of the mounting body (1), and the bottom end of the limiting component is fixedly connected to the mounting body (1); A mounting component is arranged on top of the limiting component.

2. The chip mounting mechanism according to claim 1, wherein: The limiting assembly comprises: a limiting plate (6), a limiting rod (7) and a limiting device (8); the bottom end of the limiting device (8) is fixedly connected to the mounting body (1); the two ends of the limiting rod (7) are respectively fixedly connected to the limiting plate (6) and the limiting device (8); the limiting device (8) is slidably connected to the mounting body (1); and the side end of the limiting device (8) is slidably connected to the baffle (18).

3. The chip mounting mechanism according to claim 2, wherein: The top end of the limiting plate (6) is connected to the supporting plate (5), and the side end of the supporting plate (5) is connected to the baffle (18) in a rotational manner.

4. The chip mounting mechanism according to claim 3, wherein: The side end of the supporting plate (5) is fixedly connected to a flip plate (4), and the side end of the flip plate (4) is fixedly connected to a flipper (3). The flip plate (4) has a semicircular cross section. The bottom end of the flipper (3) is fixedly connected to a blast assembly, and the blast assembly is located at the side end of the baffle (18).

5. The chip mounting mechanism according to claim 4, characterized in that: The blast assembly comprises a blower (2) and a connecting pipe (20). The connecting pipe (20) is provided in a plurality of groups and is evenly distributed along the length direction of the blower (2). Both ends of the connecting pipe (20) are fixedly connected to the baffle (18) and the blower (2), respectively.

6. The chip mounting mechanism according to claim 3, wherein: Both sides of the baffle (18) are fixedly connected with hinged seats (23), and the bottom end of the hinged seat (23) is fixedly connected to the supporting plate (5).

7. The chip mounting mechanism according to claim 1, wherein: The mounting assembly comprises: a moving assembly, an adsorption tube (11) and an adsorbent (12); the adsorption tube (11) is provided in a plurality of groups and is equidistantly distributed along the length direction of the adsorbent (12); the top end of the adsorption tube (11) is fixedly connected to the adsorbent (12); the top end of the adsorbent (12) is fixedly connected to the moving assembly; and the moving assembly reciprocates in a length direction parallel to the mounting body (1).

8. The chip mounting mechanism according to claim 7, wherein: The moving assembly comprises: a telescopic rod (13), a telescopic device (14) and a slide (15); the upper and lower ends of the telescopic rod (13) are respectively fixedly connected to the absorber (12) and the telescopic device (14); the top end of the telescopic device (14) is fixedly connected to the slide (15); both ends of the slide (15) are respectively provided with sliding holes (22); a guide rod (16) is slidably connected along the inner wall of the sliding hole (22); and both ends of the guide rod (16) are respectively fixedly connected to the inner wall of the mounting body (1).

9. The chip mounting mechanism according to claim 7, wherein: A bearing platform (9) is provided at the bottom of the adsorption tube (11), a bearing groove (10) is provided at the top of the bearing platform (9), a side end of the bearing platform (9) is fixedly connected to the interior of the mounting body (1), a loading port (17) is provided at one end of the mounting body (1) close to the bearing platform (9), a feeder (21) is fixedly connected to the side end of the mounting body (1), and the feeder (21) and the loading port (17) are communicated with each other.

10. The chip mounting mechanism according to claim 9, wherein: A hot air heater (24) is provided at the side end of the carrier platform (9), and the hot air heater (24) is located at the bottom of the adsorption tube (11). Two groups of support rods (25) are provided between the hot air heater (24) and the mounting body (1), and the two ends of the support rods (25) are fixedly connected to the hot air heater (24) and the mounting body (1) respectively.

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