Semiconductor heating plate polishing device and method

Abstract

The present invention relates to the technical field of polishing devices, and discloses a semiconductor heating disk polishing device and method, including a shell, a conveying mechanism and a polishing mechanism, wherein a feed port and a discharge port are respectively opened on both sides of the shell, and the conveying mechanism and the polishing mechanism are both installed inside the shell, and the conveying mechanism comprises a conveyor belt, a mounting plate, a rotating shaft, a support plate and an arc-shaped clamping plate; the semiconductor heating disk polishing device, by arranging a conveyor belt, a mounting plate, a rotating shaft, a support plate, a arc-shaped clamping plate and a rotating component, places the semiconductor heating disk on the support plate when polishing the semiconductor heating disk, and the semiconductor heating disk rotates with the support plate, so that the surface of the semiconductor heating disk can be polished more evenly when the sand belt polishes it, avoiding excessive polishing or inadequate polishing of a part of the heating disk, and since different positions on the surface of the sand belt can contact with the semiconductor heating disk for polishing, the sand belt will not be locally worn during the polishing process.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing devices, and in particular to a semiconductor heating disc polishing device and method. Background Art

[0002] A semiconductor heating plate is a heating device used to provide the necessary heat to wafers during semiconductor manufacturing, bringing them to the temperature required for specific processes. A uniform and stable temperature is crucial during wafer processing, and semiconductor heating plates offer features such as stable heating rates and precise temperature control. During the processing of semiconductor heating plates, polishing can improve their surface finish, preventing damage to the wafer caused by burrs on the surface of the semiconductor heating plate. This smooth surface also reduces thermal resistance during heat conduction. Heating plates used for semiconductor wafer heating typically have a disc-shaped structure, and the surface in contact with the wafer should be finely polished to remove oxide layers and burrs.

[0003] Chinese patent CN118699965B discloses a magnesium alloy sanding machine with an automatic compensation function, which can grind the upper surface of a workpiece.

[0004] However, since the sanding belt used in the device grinds the workpiece in one direction, during the grinding process, the friction between the sanding belt and the surface of the part is concentrated in a fixed area, which will cause the wear of the sanding belt in this area to increase, and reduce the service life of the sanding belt. At the same time, since the contact area between the sanding belt and the surface of the part is always fixed, when the surface of the sanding belt is worn, the parts with greater wear and the parts with less wear have different grinding effects on the workpiece surface, resulting in uneven grinding of the workpiece. Summary of the Invention

[0005] In response to the shortcomings of the existing technology, the present invention provides a semiconductor heating disk polishing device and method, which has the advantages of uniformly polishing the surface of the semiconductor heating disk and avoiding local excessive wear of the sanding belt, solving the problems mentioned in the above background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] A semiconductor heating disk polishing device comprises a shell, a conveying mechanism and a polishing mechanism, wherein a feed port and a discharge port are respectively opened on both sides of the shell, and the conveying mechanism and the polishing mechanism are both installed inside the shell, the conveying mechanism comprises a conveyor belt, a mounting plate, a rotating shaft, a support plate and an arc-shaped clamping plate, the two ends of the conveyor belt respectively pass through the feed port and the discharge port and extend to the outside of the shell, the two ends of the mounting plate are fixedly connected to the conveyor belt, the rotating shaft is rotatably mounted on the mounting plate, the support plate is fixedly mounted on the upper end of the rotating shaft, and the arc-shaped clamping plate is slidably arranged on both sides of the support plate;

[0008] The conveying mechanism also includes a clamping plate control assembly, a rotating assembly and a guiding assembly, the clamping plate control assembly includes a docking plate, a return spring and a clamping rail, the docking plate is fixedly arranged on the arc clamping plate, and the docking plates cooperate to form a circular ring, the circular ring is coaxial with the rotating shaft, the return spring is used to push the relative arc clamping plates apart, the clamping rail is used to squeeze the docking plate to compress the return spring, so that the arc clamping plate clamps the workpiece, the rotating assembly is used to control the rotation of the supporting plate and the clamped arc clamping plate when being conveyed by the conveyor belt, and the guiding assembly is used to enable the return spring to contract when the docking plate abuts against one end of the clamping rail;

[0009] The grinding mechanism includes a sanding belt, which is arranged above the conveyor belt, and the lower surface of the sanding belt is arranged parallel to the lower surface of the conveyor belt;

[0010] A lifting frame is installed inside the shell, and the lifting frame is used to control the distance between the grinding mechanism and the conveying mechanism.

[0011] Preferably, guide rollers and a drive shaft are provided inside the conveyor belt, and the guide rollers relative to each other are connected through a conveyor belt transmission. The drive shaft is fixedly installed between the guide rollers on the same side, and both ends of the drive shaft are rotatably connected to the inner walls on both sides of the lifting frame. A drive motor is fixedly installed at one end of the lifting frame, and the driving end of the drive motor is fixedly connected to one of the drive shafts.

[0012] Preferably, the rotating assembly includes a gear and a tooth plate, the gear is fixedly mounted on one end of the rotating shaft, the tooth plate is fixedly mounted inside the lifting frame, and the tooth surface of the tooth plate is adapted to mesh with the gear, the length direction of the tooth plate is the same as the length direction of the clamping track, and both ends of the tooth plate are located between the two ends of the clamping track, and the tooth plate is arranged above the plane formed by the axes of the two drive shafts.

[0013] Preferably, a connecting block is symmetrically fixed to the lower surface of the support plate, and a slide is fixedly installed on the lower surface of the arc-shaped clamping plate. The slide is sleeved on the outer side of the connecting block, and waist-shaped holes are opened on both sides of the slide. Sliders are fixedly installed at both ends of the connecting block, and the slides are slidably connected to the relative waist-shaped holes. A guide rod is fixedly connected between the two connecting blocks, and the guide rod is slidably connected to the slide. The return spring is sleeved on the guide rod, and the two ends of the return spring are fixedly connected to the connecting block and the slide respectively.

[0014] Preferably, the docking plate is fixedly mounted on the lower surface of the slide, and there is a gap between the lower surface of the docking plate and the upper surface of the mounting plate. The end of the clamping rail is fixedly connected with an arc-shaped guide block, and the distance between the two arc-shaped guide blocks away from one end of the clamping rail is greater than the distance between the two arc-shaped guide blocks close to one end of the clamping rail.

[0015] Preferably, the guide assembly includes a disc, a sector block and a guide rod, the disc is fixedly mounted on the end of the rotating shaft, the sector block is symmetrically fixed on both sides of the disc, the guide rod is fixedly mounted inside the shell, and the guide rod is adapted to fit against the side of the disc, one end of the guide rod is arranged on one side of the arc-shaped guide block, and the other end of the guide rod coincides with the projection of one end of the tooth plate on the horizontal plane.

[0016] Preferably, a lifting cylinder is provided inside the feed port and the discharge port, the lifting cylinder is fixedly connected to the inner wall of the shell, and the driving end of the lifting cylinder is fixedly connected to the bottom of the lifting frame.

[0017] Preferably, the grinding mechanism also includes a guide wheel, a tensioning wheel and a grinding motor, the guide wheels are arranged at both ends inside the sanding belt, and a transmission shaft is fixedly installed on the guide wheels, the grinding motor is fixedly installed inside the shell, and the driving end of the grinding motor is fixedly connected to one of the guide wheels, the tensioning wheel is tightly attached to the upper surface inside the sanding belt, and a tensioning shaft is rotatably installed on the tensioning wheel, both ends of the tensioning shaft are slidably installed with guide frames, the guide frame is fixedly installed inside the shell, and a tensioning spring is provided inside the guide frame, and the two ends of the tensioning spring are respectively fixedly connected to the tensioning shaft and the guide frame.

[0018] Preferably, support wheels are further provided between the guide wheels, and the support wheels are rotatably connected to the inner wall of the shell, and the support wheels are in contact with the inner bottom wall of the sanding belt.

[0019] The present invention also discloses a method for polishing a semiconductor heating plate, which comprises the following specific steps:

[0020] Start the conveyor belt and the sanding belt, and place the semiconductor heating plate with the surface to be sanded facing upward on the support plate located on one side of the feed port;

[0021] When the arc-shaped clamping plate moves from the feed port to the inside of the shell, the clamping plate control component automatically clamps the semiconductor heating plate placed on the support plate, and the rotation of the semiconductor heating plate is controlled by the rotating component;

[0022] When the semiconductor heating disk contacts the lower surface of the abrasive belt, the abrasive belt grinds the upper surface of the semiconductor heating disk;

[0023] When the arc-shaped clamping plate moves from the discharge port to the outside of the shell, the semiconductor heating plate is automatically released through the clamping plate control component;

[0024] Collect the semiconductor heating disc on the support plate that leaves the interior of the shell from the discharge port.

[0025] Beneficial effects

[0026] Compared with the prior art, the present invention provides a semiconductor heating plate polishing device and method, which has the following beneficial effects:

[0027] 1. The semiconductor heating disk polishing device is provided with a conveyor belt, a mounting plate, a rotating shaft, a support plate, an arc-shaped clamping plate and a rotating assembly. When polishing the semiconductor heating disk, the semiconductor heating disk is placed on the support plate, and the semiconductor heating disk rotates with the support plate, so that the surface of the semiconductor heating disk can be polished more evenly by the sand belt, thereby avoiding excessive polishing or insufficient polishing of a part of the heating disk. Moreover, since different positions on the surface of the sand belt can contact and polish the semiconductor heating disk, the sand belt will not be locally worn during the polishing process.

[0028] 2. The semiconductor heating disc grinding device is provided with a clamping plate control assembly. When the arc clamping plate is away from the sanding belt, the return spring controls the two arc clamping plates to move away from each other, so that the semiconductor heating disc can be conveniently placed between the arc clamping plates. When the arc clamping plate is close to the sanding belt, the compression track squeezes the docking plate, so that the two arc clamping plates are close to each other, thereby automatically clamping the semiconductor heating disc. No manual control of the clamping is required, making the operation simpler and more convenient. By providing a gear and a toothed plate, when the semiconductor heating disc moves with the conveyor belt within the sanding range, the gear rolls on one side of the toothed plate, driving the support plate and the arc clamping plate to rotate, so that the semiconductor heating disc continues to move during the grinding process.

[0029] 3. The semiconductor heating disc polishing device is provided with a guide assembly to control the angle of the docking plate when it approaches the clamping track. Since one side of the guide rod fits against the side of the disc, when the disc approaches the guide rod, the guide rod can push the fan-shaped block fixed on the side of the disc to rotate, so that the side of the disc slides in contact with the guide rod, so that when the docking plate approaches the clamping track, it can be pushed by the clamping track to form a ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is one of the three-dimensional structural schematic diagrams of the semiconductor heating disk polishing device of the present invention;

[0031] Figure 2 This is the second schematic diagram of the three-dimensional structure of the semiconductor heating plate polishing device of the present invention;

[0032] Figure 3 This is the third schematic diagram of the three-dimensional structure of the semiconductor heating plate polishing device of the present invention;

[0033] Figure 4 This is the fourth schematic diagram of the three-dimensional structure of the semiconductor heating plate polishing device of the present invention;

[0034] Figure 5 This is the fifth schematic diagram of the three-dimensional structure of the semiconductor heating plate polishing device of the present invention;

[0035] Figure 6This is the sixth schematic diagram of the three-dimensional structure of the semiconductor heating plate polishing device of the present invention;

[0036] Figure 7 This is the seventh schematic diagram of the three-dimensional structure of the semiconductor heating plate polishing device of the present invention;

[0037] Figure 8 This is the eighth schematic diagram of the three-dimensional structure of the semiconductor heating plate polishing device of the present invention;

[0038] Figure 9 For the present invention Figure 8 A magnified schematic diagram of the structure at point A.

[0039] In the picture:

[0040] 1. Shell; 11. Feed port; 12. Discharge port;

[0041] 2. Conveying mechanism; 21. Conveyor belt; 211. Guide roller; 212. Drive shaft; 213. Drive motor; 22. Mounting plate; 23. Rotating shaft; 24. Support plate; 241. Connecting block; 242. Slider; 243. Guide rod; 25. Arc-shaped clamping plate; 251. Slide plate; 252. Waist-shaped hole; 26. Clamping plate control assembly; 261. Docking plate; 262. Return spring; 263. Clamping rail; 264. Arc-shaped guide block; 27. Rotating assembly; 271. Gear; 272. Tooth plate; 28. Guide assembly; 281. Disc; 282. Sector block; 283. Guide rod;

[0042] 3. Grinding mechanism; 31. Abrasive belt; 32. Guide wheel; 33. Tensioning wheel; 34. Grinding motor; 35. Drive shaft; 36. Tensioning shaft; 37. Guide frame; 38. Tensioning spring; 39. Support wheel;

[0043] 4. Lifting frame; 41. Lifting cylinder. DETAILED DESCRIPTION

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0045] Example 1:

[0046] See also Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 8The present invention provides a semiconductor heating disk polishing device, comprising a shell 1, a conveying mechanism 2 and a polishing mechanism 3, wherein a feed port 11 and a discharge port 12 are respectively opened on both sides of the shell 1, and the conveying mechanism 2 and the polishing mechanism 3 are both installed inside the shell 1, and the conveying mechanism 2 comprises a conveyor belt 21, a mounting plate 22, a rotating shaft 23, a support plate 24 and an arc-shaped clamping plate 25, wherein the two ends of the conveyor belt 21 respectively pass through the feed port 11 and the discharge port 12 and extend to the outside of the shell 1, and the two ends of the mounting plate 22 are fixedly connected to the conveyor belt 21, the rotating shaft 23 is rotatably mounted on the mounting plate 22, the support plate 24 is fixedly mounted on the upper end of the rotating shaft 23, and the arc-shaped clamping plate 25 is slidably arranged on both sides of the support plate 24;

[0047] The conveying mechanism 2 also includes a clamping plate control assembly 26, a rotating assembly 27 and a guide assembly 28. The clamping plate control assembly 26 includes a docking plate 261, a return spring 262 and a clamping rail 263. The docking plate 261 is fixedly arranged on the arc clamping plate 25, and the docking plates 261 cooperate to form a ring, which is coaxial with the rotating shaft 23. The return spring 262 is used to push the relative arc clamping plates 25 apart, and the clamping rail 263 is used to squeeze the docking plate 261 to compress the return spring 262, so that the arc clamping plate 25 clamps the workpiece. The rotating assembly 27 is used to control the rotation of the support plate 24 and the clamped arc clamping plate 25 when being conveyed by the conveyor belt 21. The guide assembly 28 is used to enable the return spring 262 to contract when the docking plate 261 is in contact with one end of the clamping rail 263.

[0048] The grinding mechanism 3 includes a sanding belt 31, which is arranged above the conveyor belt 21, and the lower surface of the sanding belt 31 is arranged parallel to the lower surface of the conveyor belt 21;

[0049] A lifting frame 4 is installed inside the housing 1 , and the lifting frame 4 is used to control the distance between the grinding mechanism 3 and the conveying mechanism 2 .

[0050] The cam 23 is fixed to the support plate 22 and the cam 23 is slidably mounted on the side of the support plate 24. The support plate 24 and the cam 23 can both rotate with the cam 23. When the cam 23 clamps the semiconductor heating disk, the semiconductor heating disk can rotate accordingly. Therefore, during the grinding process, the semiconductor heating disk rotates while moving in a straight line by providing the rotating assembly 27, so that the sanding belt 31 can evenly grind the upper surface of the semiconductor heating disk, thereby preventing a part of the heating disk from being over-grinded or under-grinded. In addition, in this embodiment, when the width of the sanding belt 31 is smaller than the diameter of the semiconductor heating disk, and at least one of the semiconductor heating disks is When both ends of the diameter extend to the outside of the sanding belt 31, the semiconductor heating disk can contact every position of the lower surface of the sanding belt 31 during rotation, so that the wear of the sanding belt 31 is more uniform. When the width of the sanding belt 31 is greater than the diameter of the semiconductor heating disk, and both ends of each diameter of the semiconductor heating disk are on the inner side of the sanding belt 31, since the movement trajectory of the heating disk is a straight line determined by the position of the paper strip, the wear of the position on the sanding belt 31 that contacts the semiconductor heating disk is more uniform; by setting the clamping plate control assembly 26, when the arc clamping plate 25 is away from the sanding belt 31, the return spring 262 controls the two arc clamping plates 25 to move away from each other, so that the semiconductor heating disk can be conveniently placed between the arc clamping plates 25, and when the arc clamping plate 25 is close to the sanding belt 31, the clamping rail 263 squeezes the docking plate 261, so that the two arc clamping plates 25 are close to each other, thereby automatically clamping the semiconductor heating disk, without the need for manual control of clamping, making operation simpler and more convenient.

[0051] When using the device, the conveyor belt 21 and the sanding belt 31 are started, and the semiconductor heating disc to be sanded is placed on the support plate 24 located on one side of the feed port 11 with the surface to be sanded facing upwards;

[0052] When the arc-shaped clamping plate 25 moves from the feed port 11 to the inside of the housing 1, the clamping plate control component 26 automatically clamps the semiconductor heating disk placed on the support plate 24, and the rotation of the semiconductor heating disk is controlled by the rotating component 27;

[0053] When the semiconductor heating disk contacts the lower surface of the abrasive belt 31 , the abrasive belt 31 grinds the upper surface of the semiconductor heating disk;

[0054] When the arc-shaped clamping plate 25 moves from the discharge port 12 to the outside of the housing 1, the semiconductor heating plate is automatically released by the clamping plate control component 26;

[0055] The semiconductor heating disks on the support plate 24 leaving the interior of the housing 1 through the discharge port 12 are collected.

[0056] Example 2:

[0057] like Figure 1 - Figure 7 As shown, the difference between this embodiment and the above embodiment is that a guide roller 211 and a drive shaft 212 are provided inside the conveyor belt 21, and the guide rollers 211 opposite to each other are connected by the conveyor belt 21, and the drive shaft 212 is fixedly installed between the guide rollers 211 on the same side, and the two ends of the drive shaft 212 are rotatably connected to the inner walls on both sides of the lifting frame 4, and a drive motor 213 is fixedly installed at one end of the lifting frame 4, and the driving end of the drive motor 213 is fixedly connected to one of the drive shafts 212.

[0058] As can be seen from the above, by setting the guide roller 211, the drive shaft 212 and the drive motor 213, when the drive motor 213 is working, it can control the conveyor belt 21 to rotate the conveying mounting plate 22, so that the rotating shaft 23 and the support plate 24 installed on the mounting plate 22 drive the semiconductor heating plate to move.

[0059] The rotating assembly 27 includes a gear 271 and a tooth plate 272. The gear 271 is fixedly mounted on one end of the rotating shaft 23. The tooth plate 272 is fixedly mounted inside the lifting frame 4. The tooth surface of the tooth plate 272 is adapted to mesh with the gear 271. The length direction of the tooth plate 272 is the same as the length direction of the clamping rail 263. Both ends of the tooth plate 272 are located between the two ends of the clamping rail 263. The tooth plate 272 is arranged above the plane formed by the axes of the two drive shafts 212.

[0060] As can be seen from the above, since the rotating shaft 23 is rotatably mounted on the mounting plate 22, and the mounting plate 22 moves with the conveyor belt 21, when the gear 271 contacts the tooth plate 272, the gear 271 drives the rotating shaft 23 fixed thereto to rotate, thereby causing the semiconductor heating plate to rotate during grinding.

[0061] A connecting block 241 is symmetrically fixed to the lower surface of the support plate 24, and a slide plate 251 is fixedly installed on the lower surface of the arc-shaped clamping plate 25. The slide plate 251 is sleeved on the outer side of the connecting block 241, and waist-shaped holes 252 are opened on both sides of the slide plate 251. Sliders 242 are fixedly installed at both ends of the connecting block 241, and the slides 242 are slidably connected to the relative waist-shaped holes 252. A guide rod 243 is fixedly connected between the two connecting blocks 241, and the guide rod 243 is slidably connected to the slide plate 251. The return spring 262 is sleeved on the guide rod 243, and the two ends of the return spring 262 are fixedly connected to the connecting block 241 and the slide plate 251 respectively.

[0062] As can be seen from the above, since the guide rod 243 fixedly mounted on the connecting block 241 is slidably connected to the slide plate 251, the arc-shaped splint 25 is slidably connected to the support plate 24. Since the waist-shaped hole 252 opened on the slide plate 251 is slidably connected to the slider 242 fixedly mounted on the connecting block 241, the sliding distance of the slide plate 251 can be limited. Combined with the setting of the reset spring 262, when the reset spring 262 is extended, the slider 242 can be against one end of the waist-shaped hole 252. When the clamping rail 263 squeezes the docking plate 261 so that the two docking plates 261 form a circular ring, the slider 242 is against the other end of the waist-shaped hole 252.

[0063] The docking plate 261 is fixedly mounted on the lower surface of the slide plate 251, and there is a gap between the lower surface of the docking plate 261 and the upper surface of the mounting plate 22. The end of the clamping rail 263 is fixedly connected with an arc-shaped guide block 264, and the distance between the two arc-shaped guide blocks 264 away from one end of the clamping rail 263 is greater than the distance between the two arc-shaped guide blocks 264 close to one end of the clamping rail 263.

[0064] As can be seen from the above, by providing the arc-shaped guide block 264 , the two separated docking plates 261 can move along the curvature of the arc-shaped guide block 264 to the clamping track 263 , so that the two docking plates 261 are squeezed to form a ring.

[0065] The guide assembly 28 includes a disc 281, a sector block 282 and a guide rod 283. The disc 281 is fixedly mounted on the end of the rotating shaft 23, the sector block 282 is symmetrically fixed on both sides of the disc 281, and the guide rod 283 is fixedly mounted inside the shell 1, and the guide rod 283 is adapted to be in contact with the side of the disc 281. One end of the guide rod 283 is arranged on one side of the arc-shaped guide block 264, and the other end of the guide rod 283 coincides with the projection of one end of the tooth plate 272 on the horizontal plane.

[0066] As can be seen from the above, since one side of the guide rod 283 is adapted to fit against the side of the disc 281, when the disc 281 approaches the guide rod 283, the guide rod 283 can push the fan-shaped block 282 fixed on the side of the disc 281 to rotate, so that the side of the disc 281 slides in contact with the guide rod 283, so that when the docking plate 261 approaches the clamping rail 263, it can be pushed by the clamping rail 263 so that the two docking plates 261 cooperate to form a ring.

[0067] Example 3:

[0068] like Figure 3 、 Figure 8 and Figure 9As shown, the difference between this embodiment and the above embodiment is that a lifting cylinder 41 is provided inside the feed port 11 and the discharge port 12, and the lifting cylinder 41 is fixedly connected to the inner wall of the shell 1, and the driving end of the lifting cylinder 41 is fixedly connected to the bottom of the lifting frame 4.

[0069] As can be seen from the above, since the lifting cylinder 41 can change the height of the lifting frame 4, the distance between the grinding mechanism 3 and the conveying mechanism 2 can be changed.

[0070] The grinding mechanism 3 also includes a guide wheel 32, a tensioning wheel 33 and a grinding motor 34. The guide wheels 32 are arranged at both ends inside the sanding belt 31, and a transmission shaft 35 is fixedly installed on the guide wheel 32. The grinding motor 34 is fixedly installed inside the shell 1, and the driving end of the grinding motor 34 is fixedly connected to one of the guide wheels 32. The tensioning wheel 33 is tightly attached to the upper surface inside the sanding belt 31, and a tensioning shaft 36 is rotatably installed on the tensioning wheel 33. Guide frames 37 are slidably installed at both ends of the tensioning shaft 36. The guide frame 37 is fixedly installed inside the shell 1. A tensioning spring 38 is provided inside the guide frame 37, and the two ends of the tensioning spring 38 are respectively fixedly connected to the tensioning shaft 36 and the guide frame 37.

[0071] As can be seen from the above, by providing the guide wheel 32 and the tensioning wheel 33, when the sanding belt 31 heats up and stretches due to sanding, the transmission effect between the guide wheel 32 and the sanding belt 31 can be ensured. By providing the sanding motor 34, it is used to drive the guide wheel 32 to rotate, thereby causing the sanding belt 31 to rotate.

[0072] Support wheels 39 are further provided between the guide wheels 32 . The support wheels 39 are rotatably connected to the inner wall of the housing 1 , and the support wheels 39 are in contact with the inner bottom wall of the sanding belt 31 .

[0073] As can be seen from the above, when grinding the workpiece, the pressure exerted on the workpiece by the bottom of the sanding belt 31 away from the guide wheel 32 will be reduced due to the elastic force of the sanding belt 31 itself. By providing the support wheel 39, when the sanding belt 31 grinds the semiconductor heating disk, the pressure of the sanding belt 31 on the semiconductor heating disk is more balanced.

[0074] Example 4:

[0075] See also Figure 1 - Figure 9 The present invention also discloses a method for polishing a semiconductor heating plate, which comprises the following specific steps:

[0076] Start the conveyor belt 21 and the sanding belt 31, and place the semiconductor heating plate with the surface to be sanded facing upward on the support plate 24 located on one side of the feed port 11;

[0077] When the arc-shaped clamping plate 25 moves from the feed port 11 to the inside of the housing 1, the clamping plate control component 26 automatically clamps the semiconductor heating disk placed on the support plate 24, and the rotation of the semiconductor heating disk is controlled by the rotating component 27;

[0078] When the semiconductor heating disk contacts the lower surface of the abrasive belt 31 , the abrasive belt 31 grinds the upper surface of the semiconductor heating disk;

[0079] When the arc-shaped clamping plate 25 moves from the discharge port 12 to the outside of the housing 1, the semiconductor heating plate is automatically released by the clamping plate control component 26;

[0080] The semiconductor heating disks on the support plate 24 leaving the interior of the housing 1 through the discharge port 12 are collected.

[0081] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor heating plate polishing device, comprising a housing, a conveying mechanism, and a polishing mechanism, wherein a feed port and a discharge port are respectively provided on two sides of the housing, and the conveying mechanism and the polishing mechanism are both installed inside the housing, characterized in that: The conveying mechanism includes a conveyor belt, a mounting plate, a rotating shaft, a support plate and an arc-shaped clamping plate. The two ends of the conveyor belt respectively pass through the feed port and the discharge port and extend to the outside of the shell. The two ends of the mounting plate are fixedly connected to the conveyor belt. The rotating shaft is rotatably mounted on the mounting plate. The support plate is fixedly mounted on the upper end of the rotating shaft. The arc-shaped clamping plate is slidably arranged on both sides of the support plate. The conveying mechanism also includes a clamping plate control assembly, a rotating assembly and a guiding assembly, the clamping plate control assembly includes a docking plate, a return spring and a clamping rail, the docking plate is fixedly arranged on the arc clamping plate, and the docking plates cooperate to form a circular ring, the circular ring is coaxial with the rotating shaft, the return spring is used to push the relative arc clamping plates apart, the clamping rail is used to squeeze the docking plate to compress the return spring, so that the arc clamping plate clamps the workpiece, the rotating assembly is used to control the rotation of the supporting plate and the clamped arc clamping plate when being conveyed by the conveyor belt, and the guiding assembly is used to enable the return spring to contract when the docking plate abuts against one end of the clamping rail; The grinding mechanism includes a sanding belt, which is arranged above the conveyor belt, and the lower surface of the sanding belt is arranged parallel to the lower surface of the conveyor belt; A lifting frame is installed inside the shell, and the lifting frame is used to control the distance between the grinding mechanism and the conveying mechanism; The guide assembly includes a disc, a sector block and a guide rod. The disc is fixedly mounted on the end of the rotating shaft, the sector blocks are symmetrically fixed on both sides of the disc, and the guide rod is fixedly mounted inside the shell, and the guide rod fits against the side of the disc.

2. A semiconductor heating plate polishing device according to claim 1, characterized in that: Guide rollers and a drive shaft are provided inside the conveyor belt, and the guide rollers relative to each other are connected through a conveyor belt transmission. The drive shaft is fixedly installed between the guide rollers on the same side, and both ends of the drive shaft are rotatably connected to the inner walls of both sides of the lifting frame. A drive motor is fixedly installed at one end of the lifting frame, and the driving end of the drive motor is fixedly connected to one of the drive shafts.

3. A semiconductor heating plate polishing device according to claim 2, characterized in that: The rotating assembly includes a gear and a tooth plate. The gear is fixedly mounted on one end of the rotating shaft. The tooth plate is fixedly mounted inside the lifting frame, and the tooth surface of the tooth plate is adapted to mesh with the gear. The length direction of the tooth plate is the same as the length direction of the clamping track, and both ends of the tooth plate are located between the two ends of the clamping track. The tooth plate is arranged above the plane formed by the axes of the two drive shafts.

4. The semiconductor heating plate polishing device according to claim 1, characterized in that: The lower surface of the support plate is symmetrically fixed with connecting blocks, and the lower surface of the arc-shaped clamping plate is fixedly installed with a slide plate, which is sleeved on the outer side of the connecting block, and waist-shaped holes are opened on both sides of the slide plate, and sliders are fixedly installed at both ends of the connecting block, and the sliders are slidably connected to the relative waist-shaped holes. A guide rod is fixedly connected between the two connecting blocks, and the guide rod is slidably connected to the slide plate, and the return spring is sleeved on the guide rod, and the two ends of the return spring are fixedly connected to the connecting block and the slide plate respectively.

5. A semiconductor heating plate polishing device according to claim 4, characterized in that: The docking plate is fixedly mounted on the lower surface of the slide, and there is a gap between the lower surface of the docking plate and the upper surface of the mounting plate. The end of the clamping rail is fixedly connected to an arc-shaped guide block, and the distance between the two arc-shaped guide blocks away from one end of the clamping rail is greater than the distance between the two arc-shaped guide blocks close to one end of the clamping rail.

6. The semiconductor heating plate polishing device according to claim 5, characterized in that: One end of the guide rod is arranged on one side of the arc-shaped guide block, and the other end of the guide rod coincides with the projection of one end of the tooth plate on the horizontal plane.

7. The semiconductor heating plate polishing device according to claim 1, characterized in that: A lifting cylinder is provided inside the feed port and the discharge port. The lifting cylinder is fixedly connected to the inner wall of the shell, and the driving end of the lifting cylinder is fixedly connected to the bottom of the lifting frame.

8. The semiconductor heating plate polishing device according to claim 1, characterized in that: The grinding mechanism also includes a guide wheel, a tensioning wheel and a grinding motor. The guide wheels are arranged at both ends of the sanding belt, and a transmission shaft is fixedly installed on the guide wheels. The grinding motor is fixedly installed inside the shell, and the driving end of the grinding motor is fixedly connected to one of the guide wheels. The tensioning wheel is tightly attached to the upper surface of the inside of the sanding belt, and a tensioning shaft is rotatably installed on the tensioning wheel. Guide frames are slidably installed on both ends of the tensioning shaft, and the guide frame is fixedly installed inside the shell. A tensioning spring is provided inside the guide frame, and the two ends of the tensioning spring are respectively fixedly connected to the tensioning shaft and the guide frame.

9. The semiconductor heating plate polishing device according to claim 8, characterized in that: Support wheels are also provided between the guide wheels. The support wheels are rotatably connected to the inner wall of the shell, and the support wheels are in contact with the inner bottom wall of the sanding belt.

10. A method for polishing a semiconductor heating disk, using a semiconductor heating disk polishing device according to any one of claims 1 to 9, characterized in that: The specific steps are: Start the conveyor belt and the sanding belt, and place the semiconductor heating plate with the surface to be sanded facing upward on the support plate located on one side of the feed port; When the arc-shaped clamping plate moves from the feed port to the inside of the shell, the clamping plate control component automatically clamps the semiconductor heating plate placed on the support plate, and the rotation of the semiconductor heating plate is controlled by the rotating component; When the semiconductor heating disk contacts the lower surface of the abrasive belt, the abrasive belt grinds the upper surface of the semiconductor heating disk; When the arc-shaped clamping plate moves from the discharge port to the outside of the shell, the semiconductor heating plate is automatically released through the clamping plate control component; Collect the semiconductor heating disc on the support plate that leaves the interior of the shell from the discharge port.

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