A composite structure, preparation process and peel strength test method based on LCP copper foil

Through gradient fluorination interface design, functionalized porous fillers and dynamic hot pressing-curing joint control preparation process, the problem of interface bonding between LCP and copper foil is solved, and the peel strength and dielectric properties of the LCP-copper foil composite structure are improved, making it suitable for high-reliability substrate materials for 5G/6G communication equipment.

CN120439583BActive Publication Date: 2025-10-03DONGGUAN LONGYI ELECTRONICS TECH
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Patent Information

Application Number
CN202510922903.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-07-04
Publication Date
2025-10-03
Estimated Expiration
2045-07-04

AI Technical Summary

Technical Problem

There are problems of thermal stress mismatch, increased dielectric loss and insufficient process control at the interface between LCP and copper foil, which lead to interface delamination and high-frequency signal transmission loss, and cannot meet the high reliability requirements of 5G/6G communication equipment.

Method used

A preparation process that adopts gradient fluorination interface design, functionalized porous fillers and dynamic hot pressing-curing joint control is adopted. A concentration gradient is formed by spin coating. Combined with UV pre-curing and differential scanning calorimetry monitoring, the hot pressing parameters are dynamically adjusted to form a high-strength, low-loss LCP-copper foil composite structure.

Benefits of technology

The peel strength of the LCP-copper foil composite structure is improved, the dielectric constant is reduced, and the dielectric loss is reduced, providing a highly reliable substrate material for 5G/6G communication equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the technical field of LCP copper foil structures, and more specifically to an LCP copper foil composite structure, a preparation process, and a peel strength testing method. The LCP-copper foil composite structure has a dispersion uniformity of porous nanofillers in its interface bonding layer of ≤200nm, and a fluorine-containing group concentration gradient distribution range covering more than 80% of the interface thickness. The present invention aims to provide an LCP copper foil composite structure, a preparation process, and a peel strength testing method that can optimize the peel strength and dielectric constant of the LCP copper foil composite structure, overcome the conflicting limitations of LCP-copper foil interface bonding strength and high-frequency loss, and provide a high-reliability substrate material for 5G / 6G communication equipment.
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Description

Technical Field

[0001] The present invention relates to the technical field of LCP copper foil structures, and in particular to an LCP copper foil-based composite structure, a preparation process and a peeling strength testing method. Background Art

[0002] Liquid crystal polymer (LCP) films have become a core material for 5G millimeter wave antennas and high-frequency communication substrates due to their ultra-low dielectric constant and dielectric loss. However, the following problems exist in the interface between LCP and copper foil:

[0003] Thermal stress mismatch: The difference in linear expansion coefficient between LCP and copper foil leads to interface delamination after hot pressing;

[0004] Increased dielectric loss: Traditional bonding layers contain polar groups, which increase high-frequency signal transmission losses;

[0005] Insufficient process control: Static hot pressing parameters cannot match the curing kinetics of the polyimide precursor, resulting in bubbles or under-curing. Summary of the Invention

[0006] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a composite structure, preparation process and peel strength testing method based on LCP copper foil, which can optimize the peel strength and dielectric constant of the LCP copper foil composite structure, break through the contradictory limitations of LCP-copper foil interface bonding strength and high-frequency loss, and provide high-reliability substrate materials for 5G / 6G communication equipment.

[0007] The present invention is achieved through the following technical solutions:

[0008] In a first aspect, the present invention discloses a preparation process based on an LCP copper foil composite structure, which comprises the following steps:

[0009] A100. The fluorinated monomer is mixed with a polyamic acid solution, and a surface-functionalized porous nanofiller is added to form a modified polyamic acid bonding layer precursor after dispersion treatment;

[0010] A200. The precursor obtained in step A100 is applied between the LCP film and the copper foil by a spin coating device, and the concentration gradient of the fluorinated monomer is controlled by centrifugal force at the interface, wherein the concentration of the fluorinated group on the LCP side gradually increases toward the copper foil side;

[0011] A300. The coated interface layer is UV pre-cured to form a semi-interpenetrating network structure;

[0012] A400. The semi-interpenetrating network structure of step A300 is placed in a laminator, combined with a differential scanning calorimeter to monitor the curing exothermic peak in real time, and the hot pressing temperature and pressure parameters are dynamically adjusted by the PID algorithm to complete the gradient curing of the interface bonding layer;

[0013] A500. After cooling, an LCP-copper foil composite structure is obtained.

[0014] In combination with the first aspect, further, in step A100, the porous nanofiller is porous The nanoparticles have surfaces pretreated with a silane coupling agent and grafted with a fluorinated monomer, and pores are loaded with fluorinated groups. The amount of the porous nanofiller added is 1% to 3% of the mass of the polyamic acid solution.

[0015] In combination with the first aspect, further, in step A100, the fluorine-containing monomer is tetrafluoroethylene acrylate or perfluoroalkyl acrylate, and the added mass ratio thereof is 5% to 15% of the mass of the polyamic acid solution.

[0016] In combination with the first aspect, further, in step A200, the centrifugal force of the rotary coating is 2000~5000rpm, and the coating thickness is 5~20μm; the concentration gradient distribution is achieved by adjusting the centrifugal force and the coating time, wherein the concentration gradient of the fluorine-containing group on the LCP side decreases at a rate of 0.5%~1.5% / μm, and the copper foil side increases at a rate of 1%~2% / μm.

[0017] In combination with the first aspect, further, in step A300, the conditions for UV pre-curing are: wavelength of 365nm, irradiation intensity of 50~100mW / cm², and time of 30~60s.

[0018] In combination with the first aspect, further, in step A400, the specific parameters of the dynamic hot pressing-curing joint control are: initial preheating temperature 100~120℃, heating to 250~270℃ after detecting the DSC exothermic peak, and pressure increasing stepwise to 8~12MPa; the curing degree is ≥95%.

[0019] In a second aspect, the present invention discloses an LCP-copper foil composite structure obtained by the preparation process, wherein the dispersion uniformity of the porous nanofiller in the interface bonding layer is ≤200nm, and the concentration gradient distribution range of the fluorine-containing group covers more than 80% of the interface thickness.

[0020] In combination with the second aspect, further, in step S500, the performance indicators of the obtained LCP-copper foil composite structure include:

[0021] Peel strength ≥1.2N / mm;

[0022] At 10GHz frequency, the dielectric constant is ≤2.8 and the dielectric loss is ≤0.002;

[0023] After 500 hours of aging in an 85℃ / 85%RH environment, the interface bonding strength retention rate is ≥90%.

[0024] In a third aspect, the present invention discloses a method for testing the peel strength of an LCP copper foil composite structure, comprising the following steps:

[0025] B100. Based on the interface thickness of LCP-copper foil composite structure With the target peel strength threshold , set the peeling speed of the electronic testing machine through nonlinear function and sampling frequency :

[0026]

[0027]

[0028] in, and are the speed adjustment coefficients, is the sampling frequency adjustment coefficient;

[0029] B200. Obtaining the original peel force-displacement curve using an electronic testing machine , and use S filter to smooth the data:

[0030]

[0031] in, is the displacement point after filtering The peeling force, is the half-width of the filter window, is the window length, are the least squares fitting polynomial coefficients;

[0032] B300. Define dynamic anomaly thresholds , to satisfy The data segment is repaired using cubic spline interpolation:

[0033]

[0034] in, is the abnormality judgment threshold, is the average value of the peeling force of the verse segment, is the standard deviation of peel force fluctuation, is the interpolated peeling force after repair, is the cubic spline interpolation coefficient;

[0035] B400. Extract displacement interval Calculate the effective peel strength based on the stable segment data within :

[0036]

[0037] interval boundaries Determined by the reciprocal rate of change:

[0038]

[0039] in, is the average peel strength in the stable section, is the test sample width, is the interval boundary, is the curvature change threshold;

[0040] B500. Build peel strength Fluorine content of fluorinated monomers , added amount The response surface model is:

[0041]

[0042] The optimal process parameters are solved by gradient descent method :

[0043]

[0044] in, ~ are the coefficients determined by fitting the experimental data using the least squares method, is the mass ratio of fluorine element in fluorine-containing monomers, is the mass proportion of fluorinated monomer in the bonding layer, is the fluorine content corresponding to the extreme point of the response surface, is the addition amount corresponding to the extreme point of the response surface;

[0045] B600. Optimal parameter combination Repeat the experiment ≥30 times and calculate the 95% confidence interval:

[0046]

[0047] in, To verify the experimental sample size, for The average peel strength of the experiments was is the critical value of the t distribution at the 95% confidence level, for The standard deviation of the intensity across experiments.

[0048] In conjunction with the third aspect, further, in step B500, the coefficients of the response surface model are optimized using a genetic algorithm, specifically including:

[0049] Will ~ Encoded as a binary string, defining the value range

[0050] Setting the fitness function

[0051]

[0052] in, is the number of experimental data points, and are the predicted value and the measured value respectively;

[0053] Perform genetic operations so that: crossover probability , mutation probability ;

[0054] Set the termination condition: the fitness improvement rate for 10 consecutive generations is <1% or the total number of iterations is ≥100.

[0055] Beneficial effects of the present invention:

[0056] The present invention is based on an LCP copper foil composite structure, a preparation process and a peel strength testing method. Through the triple technological innovations of gradient fluorination interface design, functionalized porous filler and dynamic hot pressing-curing joint control, it breaks through the contradictory limitations of LCP-copper foil interface bonding strength and high-frequency loss. In addition, through the corresponding peel strength testing method, the use strength of the LCP copper foil composite structure is effectively verified, laying the foundation for providing high-reliability substrate materials for 5G / 6G communication equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] The present invention is further described with reference to the accompanying drawings. However, the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative effort.

[0058] Figure 1 This is a flow chart of the preparation process of the LCP copper foil composite structure in one embodiment of the present invention. DETAILED DESCRIPTION

[0059] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0060] Liquid crystal polymer (LCP) films have become a core material for 5G millimeter wave antennas and high-frequency communication substrates due to their ultra-low dielectric constant and dielectric loss. However, the following problems exist in the interface between LCP and copper foil:

[0061] Thermal stress mismatch: The difference in linear expansion coefficient between LCP and copper foil leads to interface delamination after hot pressing;

[0062] Increased dielectric loss: Traditional bonding layers contain polar groups, which increase high-frequency signal transmission losses;

[0063] Insufficient process control: Static hot pressing parameters cannot match the curing kinetics of the polyimide precursor, resulting in bubbles or under-curing.

[0064] Example 1

[0065] In order to solve the above problems, this embodiment discloses a preparation process based on an LCP copper foil composite structure, which includes the following steps:

[0066] A100. The fluorinated monomer is mixed with a polyamic acid solution, and a surface-functionalized porous nanofiller is added to form a modified polyamic acid bonding layer precursor after dispersion treatment;

[0067] A200. The precursor obtained in step A100 is applied between the LCP film and the copper foil by a spin coating device, and the concentration gradient of the fluorinated monomer is controlled by centrifugal force at the interface, wherein the concentration of the fluorinated group on the LCP side gradually increases toward the copper foil side;

[0068] A300. The coated interface layer is UV pre-cured to form a semi-interpenetrating network structure;

[0069] A400. The semi-interpenetrating network structure of step A300 is placed in a laminator, combined with a differential scanning calorimeter to monitor the curing exothermic peak in real time, and the hot pressing temperature and pressure parameters are dynamically adjusted by the PID algorithm to complete the gradient curing of the interface bonding layer;

[0070] A500. After cooling, an LCP-copper foil composite structure is obtained.

[0071] In this embodiment, the centrifugal force of spin coating drives the migration of the fluorinated monomer, resulting in a low fluorine concentration on the LCP side and a high fluorine concentration on the copper foil side. The low fluorine concentration is compatible with the non-polar surface of the LCP, while the high fluorine concentration forms a CF···Cu coordination bond with Cu.

[0072] Example 2

[0073] In this embodiment, due to the conventional unmodified porous The surface is hydrophilic and has poor compatibility with hydrophobic polyamic acid, which leads to agglomeration and causes interfacial stress concentration. In addition, the fluorine groups are unevenly distributed, and directly added fluorine-containing monomers are prone to migrate to the surface and cannot form effective bonds at the interface. The smooth surface of ordinary nanofillers makes it difficult to form mechanical interlocking with the LCP-copper foil structure.

[0074] Therefore, further, in step A100, the porous nanofiller is porous The nanoparticles have surfaces pretreated with a silane coupling agent and grafted with a fluorinated monomer, and the pores are loaded with fluorinated groups; the amount of the porous nanofiller added is 1% to 3% of the mass of the polyamic acid solution, preferably 2%.

[0075] Through the above steps, we can achieve:

[0076] Surface silanization enhances dispersibility, amino groups convert the hydrophilic surface into hydrophobic, improve compatibility with polyamic acid, increase the Zeta potential from -35mV to -15mV, and electrostatic repulsion reduces the risk of agglomeration;

[0077] Fluorine groups are grafted into the pores, with a fluorine group loading rate of >80%. Fluorine groups are slowly released from the pores to maintain gradient distribution stability.

[0078] The porous structure strengthens anchoring and forms a mechanical interlocking mechanism. The SEM of the copper foil peeling surface shows that the filler embedding depth is greater than 200nm.

[0079] Example 3

[0080] In this embodiment, since traditional fluorinated monomers cannot copolymerize with polyamic acid, the interfacial chemical bonding is weak; excessive addition of fluorinated monomers induces phase separation and increases dielectric loss; when the monomer type and addition amount are not limited, the strength and dielectric properties are inversely related.

[0081] Therefore, further, in step A100, the fluorine-containing monomer is tetrafluoroethylene acrylate or perfluoroalkyl acrylate, and the added mass ratio thereof is 5% to 15% of the mass of the polyamic acid solution, preferably 10%.

[0082] In this embodiment, through copolymerization, the double bond of acrylate undergoes Michael addition with the amino group of polyamic acid to form a covalent bond: PAA-NH2+CH2=CH-COOR → PAA-NH-CH2-CH2-COOR;

[0083] In addition, the polarizability of the CF bond is much lower than that of the C-OH bond, which reduces the dielectric loss.

[0084] The following is the experimental test data for optimizing the type and addition amount of fluorinated monomers:

[0085] Table 1. Fluorinated monomer type and addition amount experimental grouping:

[0086]

[0087] Unified parameters of preparation process: functionalization : 2wt%; spin coating: 3000rpm, thickness 15μm; hot pressing: 260℃ / 10MPa / 15min.

[0088] Table 2. Fluorinated monomer type and addition performance test results:

[0089]

[0090] Key mechanism verification:

[0091] Copolymerization rate verification, characteristic peak comparison:

[0092] Perfluoroalkyl acrylate added group: 1720 (C=O stretching) and 1650 (Amide I band) peak fusion, confirming copolymerization;

[0093] PTFE group: 1200 (-CF2-) independent peak with no peak shift, indicating no reaction;

[0094] Fluorine distribution uniformity, optimal group (perfluoroalkyl acrylate 10%):

[0095] Fluoride ion strength gradient: 8% on the LCP side → 55% at the interface center → 85% on the copper foil side.

[0096] Gradient slope: 1.8% / μm on the copper foil side;

[0097] PTFE group: fluoride ions are distributed in clusters.

[0098] Example 4

[0099] In this embodiment, due to the random diffusion of fluorine-containing monomers in the traditional coating process, a directional gradient of decreasing on the LCP side / increasing on the copper foil side cannot be formed; and thermal stress is concentrated: microcracks are caused at the point where the interface fluorine concentration suddenly changes, and the non-uniform fluorine distribution leads to local polarization rate differences, and the dielectric loss increases by >0.003.

[0100] Therefore, further, in step A200, the centrifugal force of the rotary coating is 2000~5000rpm, and the coating thickness is 5~20μm; the concentration gradient distribution is achieved by adjusting the centrifugal force and the coating time, wherein the decreasing rate of the fluorine-containing group concentration gradient on the LCP side is 0.5%~1.5% / μm, and the increasing rate on the copper foil side is 1%~2% / μm.

[0101] In this embodiment, centrifugal force drives the gradient to form, which is mainly caused by the balance between the Coriolis force and the viscous resistance of the fluorinated monomer in the centrifugal field.

[0102] The following is the experimental test data for optimizing the gradient parameters:

[0103] Table 3. Ranges of gradient parameters:

[0104]

[0105] Fixed fluorinated monomer (perfluoroalkyl acrylate 10wt%), functionalized 2wt%, change coating parameters:

[0106] Table 4. Experimental groups

[0107]

[0108] Table 5. Performance test results

[0109]

[0110] Example 5

[0111] In this embodiment, the free diffusion of the fluorinated monomer in the uncured precursor destroys the gradient distribution formed by centrifugation; direct hot pressing causes filler sedimentation and micropores; and the thermal curing of polyamic acid competes with the free radical polymerization of the fluorinated monomer, resulting in uneven crosslinking density.

[0112] Therefore, further, in step A300, the conditions for UV pre-curing are: wavelength of 365nm, irradiation intensity of 50~100mW / cm², and time of 30~60s.

[0113] UV pre-curing constructs a semi-interpenetrating network, "anchoring" the fluorinated monomer at the gradient position; UV pre-curing forms a rigid skeleton to resist thermal pressure flow deformation; UV pre-curing prioritizes the polymerization of the fluorinated monomer to achieve step-by-step reaction control.

[0114] The following is the experimental test data for UV pre-curing parameter optimization:

[0115] Fixing material: Perfluoroalkyl acrylate 10wt% + functionalized 2wt% + centrifugal coating at 3000rpm Variable: UV irradiation parameters (repeated 3 times per group)

[0116] Table 6. Experimental design

[0117]

[0118] Table 7. Gradient retention test

[0119]

[0120] Table 8. Final performance comparison

[0121]

[0122] Experimental data shows that the wavelength is 365nm: matching the initiator absorption peak;

[0123] Intensity 50-100mW / cm²: balance polymerization rate and heat accumulation;

[0124] Time 30-60s: achieve the best gel point conversion rate;

[0125] The gradient locking rate is >95%, the interface void rate is <0.5%, and the peel strength is increased by 40%.

[0126] Among them, 80mW / cm²×45s is the optimal parameter combination, providing more gradient stability technology for high-frequency substrates.

[0127] Example 6

[0128] In this embodiment, since the exothermic peak of polyamic acid curing lags behind the actual reaction, the traditional fixed parameters lead to under-curing or over-curing and gradient destruction, and the step-type pressure increase triggers filler displacement and causes local overheating.

[0129] Therefore, further, in step A400, the specific parameters of the dynamic hot pressing-curing joint control are: initial preheating temperature 100~120℃, heating to 250~270℃ after detecting the DSC exothermic peak, and stepwise increase of pressure to 8~12MPa; the curing degree is ≥95%.

[0130] The following is the test data of the dynamic hot pressing-curing joint control experiment:

[0131] Table 9. Experimental groups

[0132]

[0133] Table 10. Performance test results

[0134]

[0135] Example 7

[0136] This embodiment discloses an LCP-copper foil composite structure. The LCP-copper foil composite structure is produced by the preparation process of Examples 1-6, wherein the dispersion uniformity of the porous nanofiller in the interface bonding layer is ≤200 nm, and the concentration gradient distribution range of the fluorine-containing group covers more than 80% of the interface thickness.

[0137] The experimental data results of the LCP-copper foil composite structure prepared by the preparation process of Examples 1-6 are as follows:

[0138] Table 11. Experimental data results

[0139]

[0140] Example 8

[0141] This embodiment discloses a method for testing the peel strength of an LCP copper foil composite structure, which comprises the following steps:

[0142] B100. Based on the interface thickness of LCP-copper foil composite structure With the target peel strength threshold , set the peeling speed of the electronic testing machine through nonlinear function and sampling frequency :

[0143]

[0144]

[0145] in, and are the speed adjustment coefficients, is the sampling frequency adjustment coefficient;

[0146] B200. Obtaining the original peel force-displacement curve using an electronic testing machine , and use S filter to smooth the data:

[0147]

[0148] in, is the displacement point after filtering The peeling force, is the half-width of the filter window, is the window length, are the least squares fitting polynomial coefficients;

[0149] B300. Define dynamic anomaly thresholds , to satisfy The data segment is repaired using cubic spline interpolation:

[0150]

[0151] in, is the abnormality judgment threshold, is the average value of the peeling force of the verse segment, is the standard deviation of peel force fluctuation, is the interpolated peeling force after repair, is the cubic spline interpolation coefficient;

[0152] B400. Extract displacement interval Calculate the effective peel strength based on the stable segment data within :

[0153]

[0154] interval boundaries Determined by the reciprocal rate of change:

[0155]

[0156] in, is the average peel strength in the stable section, is the test sample width, is the interval boundary, is the curvature change threshold;

[0157] B500. Build peel strength Fluorine content of fluorinated monomers , added amount The response surface model is:

[0158]

[0159] The optimal process parameters are solved by gradient descent method :

[0160]

[0161] in, ~ are the coefficients determined by fitting the experimental data using the least squares method, is the mass ratio of fluorine element in fluorine-containing monomers, is the mass proportion of fluorinated monomer in the bonding layer, is the fluorine content corresponding to the extreme point of the response surface, is the addition amount corresponding to the extreme point of the response surface;

[0162] B600. Optimal parameter combination Repeat the experiment ≥30 times and calculate the 95% confidence interval:

[0163]

[0164] in, To verify the experimental sample size, for The average peel strength of the experiments was is the critical value of the t distribution at the 95% confidence level, for The standard deviation of the intensity across experiments.

[0165] Furthermore, in step B500, the coefficients of the response surface model are optimized using a genetic algorithm, specifically including:

[0166] Will ~ Encoded as a binary string, defining the value range

[0167] Setting the fitness function

[0168]

[0169] in, is the number of experimental data points, and are the predicted value and the measured value respectively;

[0170] Perform genetic operations so that: crossover probability , mutation probability ;

[0171] Set the termination condition: the fitness improvement rate for 10 consecutive generations is <1% or the total number of iterations is ≥100.

[0172] Improve test accuracy and parameter optimization efficiency through Savitzky-Golay filtering, spline interpolation, genetic algorithm, etc.

[0173] The response surface model quantifies the nonlinear relationship between two variables and reduces the number of experiments by more than 50% compared with the traditional single-factor method;

[0174] Dynamic matching of peeling speed, sampling frequency and interface thickness to avoid test errors of too thin / too thick samples;

[0175] Confidence interval verification ensures the industrial applicability of the process window;

[0176] Different from conventional testing methods, this method introduces adaptive algorithms and optimization models to improve the accuracy of the peel strength test method.

[0177] In summary, the present invention is based on an LCP copper foil composite structure, a preparation process and a peel strength testing method. Through the triple technological innovations of gradient fluorination interface design, functionalized porous filler and dynamic hot pressing-curing joint control, it breaks through the contradictory limitations of LCP-copper foil interface bonding strength and high-frequency loss; in addition, through the corresponding peel strength testing method, the use strength of the LCP copper foil composite structure is effectively verified, laying the foundation for providing high-reliability substrate materials for 5G / 6G communication equipment.

[0178] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A preparation process based on LCP copper foil composite structure, characterized in that: The following steps are involved: A100. The fluorinated monomer is mixed with a polyamic acid solution, and a surface-functionalized porous nanofiller is added to form a modified polyamic acid bonding layer precursor after dispersion treatment; A200. The precursor obtained in step A100 is applied between the LCP film and the copper foil by a spin coating device, and the concentration gradient of the fluorinated monomer is controlled by centrifugal force at the interface, wherein the concentration of the fluorinated group on the LCP side gradually increases toward the copper foil side; A300. The coated interface layer is UV pre-cured to form a semi-interpenetrating network structure; A400. The semi-interpenetrating network structure of step A300 is placed in a laminator, combined with a differential scanning calorimeter to monitor the curing exothermic peak in real time, and the hot pressing temperature and pressure parameters are dynamically adjusted by the PID algorithm to complete the gradient curing of the interface bonding layer; A500. After cooling, an LCP-copper foil composite structure is obtained.

2. The preparation process of the LCP copper foil composite structure according to claim 1, characterized in that: In step A100, the porous nanofiller is porous The nanoparticles have surfaces pretreated with a silane coupling agent and grafted with a fluorinated monomer, and pores are loaded with fluorinated groups. The amount of the porous nanofiller added is 1% to 3% of the mass of the polyamic acid solution.

3. The preparation process of the LCP copper foil composite structure according to claim 1, characterized in that: In step A100, the fluorine-containing monomer is tetrafluoroethylene acrylate or perfluoroalkyl acrylate, and the added mass ratio thereof is 5% to 15% of the mass of the polyamic acid solution.

4. The preparation process of the LCP copper foil composite structure according to claim 1, characterized in that: In step A200, the centrifugal force of the rotary coating is 2000~5000rpm, and the coating thickness is 5~20μm; the concentration gradient distribution is achieved by adjusting the centrifugal force and the coating time, wherein the decreasing rate of the fluorine-containing group concentration gradient on the LCP side is 0.5%~1.5% / μm, and the increasing rate on the copper foil side is 1%~2% / μm.

5. The preparation process of the LCP copper foil composite structure according to claim 1, characterized in that: In step A300, the UV pre-curing conditions are: wavelength 365nm, irradiation intensity 50~100mW / , the time is 30~60s.

6. The preparation process of the LCP copper foil composite structure according to claim 1, characterized in that: In step A400, the specific parameters of the dynamic hot pressing-curing joint control are: initial preheating temperature 100~120℃, heating to 250~270℃ after detecting the DSC exothermic peak, and stepwise increase of pressure to 8~12MPa; the curing degree is ≥95%.

7. An LCP-copper foil composite structure prepared by the preparation process according to any one of claims 1 to 6, characterized in that: The dispersion uniformity of the porous nanofiller in the interface bonding layer is ≤200nm, and the concentration gradient distribution range of the fluorine-containing groups covers more than 80% of the interface thickness.

8. The LCP-copper foil composite structure according to claim 7, characterized in that: In step S500, the performance indicators of the obtained LCP-copper foil composite structure include: Peel strength ≥1.2N / mm; At 10GHz frequency, the dielectric constant is ≤2.8 and the dielectric loss is ≤0.002; After 500 hours of aging in an 85℃ / 85%RH environment, the interface bonding strength retention rate is ≥90%.

9. A method for testing the peel strength of the LCP copper foil composite structure according to claim 7 or 8, characterized in that: The following steps are involved: B100. Based on the interface thickness of LCP-copper foil composite structure With the target peel strength threshold , set the peeling speed of the electronic testing machine through nonlinear function and sampling frequency ; B200. Obtaining the original peel force-displacement curve using an electronic testing machine , and use S filter to smooth the data; B300. Define dynamic anomaly thresholds , to satisfy The data segments are repaired using cubic spline interpolation; B400. Extract displacement interval Calculate the effective peel strength based on the stable segment data within ; B500. Build peel strength Fluorine content of fluorinated monomers , added amount The response surface model was used to solve the optimal process parameters by gradient descent method. , peel strength The calculation formula of and the calculation formula of the gradient descent method include ~ , ~ are the coefficients determined by fitting the experimental data using the least squares method; B600. Optimal parameter combination The experiment was repeated ≥30 times and the 95% confidence interval was calculated.

10. The method for testing the peel strength of an LCP copper foil composite structure according to claim 9, wherein: In step B500, the coefficients of the response surface model are optimized using a genetic algorithm, specifically including: Will ~ Encoded as a binary string, defining the value range Setting the fitness function ; Perform genetic operations so that: crossover probability , mutation probability ; Set the termination condition: the fitness improvement rate for 10 consecutive generations is <1% or the total number of iterations is ≥100.

Citation Information

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