PCB (printed circuit board) corner film stripping mechanism and film stripping method thereof

Abstract

The invention discloses a PCB (Printed Circuit Board) corner film stripping mechanism and a film stripping method thereof, and the mechanism comprises an adsorption mechanism which is used for receiving, adsorbing and fixing a PCB covered with a protective film; the ultrasonic vibration mechanism is used for generating ultrasonic vibration; and the transplanting mechanism is used for driving the ultrasonic vibration mechanism to move, so that the vibration end of the ultrasonic vibration mechanism touches the protective film at the corner of the PCB fixed by the adsorption mechanism, and vibration separation of the PCB and the protective film at the corner of the PCB is realized. According to the invention, plate corner stripping is realized by using the high-frequency vibration characteristic of ultrasonic waves, so that the PCB cannot be damaged, and dust cannot be generated.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB production and transportation, and in particular to a PCB board corner film peeling mechanism and a film peeling method thereof. Background Art

[0002] PCBs, also known as printed circuit boards, not only support electronic components but also serve as a carrier for electrical connections. PCBs are extremely fragile during the production process. Damage from airborne dust, bare-handed contact, scratches from hard objects, and even friction between PCBs can all lead to damage, reducing product yield. To address this, each PCB is covered with a protective copper film during production. However, this creates a new challenge: the film must be removed before the next step in the process. Because the copper film is forcefully pressed onto the PCB surface, it adheres tightly to the surface and is difficult to separate.

[0003] To address the aforementioned issues, a Chinese utility model document with authorization publication number CN216189178U discloses an automatic film-tearing device, comprising a machine and the following devices mounted on the machine: a gripping device for gripping a product and moving it, the product comprising a plate and protective films attached to opposite sides of the plate; a film-lifting device for peeling the edges of the protective film on both sides of the product gripped by the gripping device off the plate; a fixing device for receiving and adsorbing the product gripped by the gripping device; and a film-tearing device for gripping the edges of the protective film on both sides of the product, which have been peeled off the plate, and tearing the protective film off the plate. The film-tearing device is positioned above the fixing device; the film-lifting device and the fixing device are positioned around the gripping device. This automatic film-tearing device enables automated tearing of the protective film from the surface of a PCB.

[0004] However, the above-mentioned automatic film tearing equipment realizes film removal on the board corners through a grinding mechanism and a blower mechanism in conjunction with a gripping device. The grinding mechanism needs to rub the protective film on the board corners through a high-speed rotating grinding wheel. In this process, not only dust is generated, but also a high damage rate to the PCB board is caused. Summary of the Invention

[0005] In order to overcome the problem that the film peeling method of the automatic film peeling equipment in the prior art not only generates dust but also causes a high damage rate to the PCB board, the present invention provides a PCB board corner film peeling mechanism and a film peeling method.

[0006] The technical solution of the present invention is as follows: In one aspect, the present invention provides a PCB board corner film peeling mechanism, comprising: An adsorption mechanism, used to receive and adsorb the PCB board covered with the protective film; An ultrasonic vibration mechanism for generating ultrasonic vibration; The transplanting mechanism is used to drive the ultrasonic vibration mechanism to move so that the vibration end of the ultrasonic vibration mechanism touches the protective film at the corner of the PCB board fixed by the adsorption mechanism, thereby realizing vibration separation of the PCB board and the protective film at the corner of the board.

[0007] As a preferred solution of the present invention, the ultrasonic vibration mechanism includes an ultrasonic generator and an ultrasonic vibration head connected to the ultrasonic generator, and the ultrasonic generator is fixed on the moving end of the transplanting mechanism.

[0008] As a preferred solution of the present invention, the transplanting mechanism includes an up and down moving module and a front and back moving module, the front and back moving module is fixed on the moving end of the up and down moving module, the ultrasonic generator is fixed on the moving end of the front and back moving module through a fixed bracket, and the ultrasonic vibration head faces the adsorption mechanism.

[0009] As a preferred solution of the present invention, the vibration frequency of the ultrasonic vibration mechanism is 15kHz-28kHz.

[0010] As a preferred solution of the present invention, the ultrasonic vibration head is cylindrical, and the angle between the ultrasonic vibration head and the PCB board fixed by the adsorption mechanism is 45°-60°.

[0011] As a preferred solution of the present invention, the diameter of the ultrasonic vibration head is 6mm-10mm.

[0012] As a preferred solution of the present invention, the PCB board corner film peeling mechanism further includes: The film tearing mechanism is installed on one side of the adsorption mechanism. The film rolling mechanism includes a rotating part and a film rolling power part. The film rolling power part drives the rotating part to rotate to roll up the protective film on the PCB board; The mucosal mechanism is installed on the moving end of the transplanting mechanism and is located above the ultrasonic vibration mechanism. The mucosal mechanism cooperates with the transplanting mechanism to transfer the protective film separated from the corner of the PCB board to the rotating part.

[0013] As a preferred solution of the present invention, the PCB board corner film peeling mechanism further includes: The loading and lifting mechanism is used to receive the loading box tray delivered by the transport trolley and lift the loading box tray to the loading work position. The loading box tray stores a stack of PCB boards covered with protective film. The unloading lifting mechanism is used to receive the unloading box tray delivered by the transport trolley and lift the loading box tray to the unloading working position. The loading box tray is used to recover the PCB board after the film is torn; The grabbing robot is used to transport the PCB boards on the loading box tray located at the loading work position to the adsorption mechanism one by one, and to transport the PCB boards after the film is torn off the adsorption mechanism to the loading box tray located at the unloading work position.

[0014] As a preferred solution of the present invention, the PCB board corner film peeling mechanism further includes: A loading positioning mechanism, used for fixing the loading box tray lifted to the loading working position; The unloading positioning mechanism is used to fix the loading box tray lifted to the unloading working position.

[0015] On the other hand, the present invention provides a method for peeling a film from a PCB board corner peeling mechanism as described in any of the above solutions, characterized by comprising: The PCB board covered with the protective film is received and fixed by the adsorption mechanism; Starting the ultrasonic vibration mechanism so that the vibration end of the ultrasonic vibration mechanism generates ultrasonic vibration; The ultrasonic vibration mechanism is driven to move by the transplanting mechanism, so that the vibrating end of the ultrasonic vibration mechanism repeatedly touches the protective film at the corner of the PCB board fixed by the adsorption mechanism multiple times along the direction from the inside of the board to the board corner within a certain period of time, thereby realizing vibration separation of the PCB board and the protective film at the board corner.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention achieves the functions of fixing the PCB board, generating ultrasonic vibration, and precisely moving the ultrasonic vibration mechanism to complete the film stripping through the coordinated work of the adsorption mechanism, the ultrasonic vibration mechanism, and the transplanting mechanism. The overall structure is compact and the functions are complete, which improves the degree of automation and work efficiency of the film stripping. During the mold stripping, the high-frequency vibration characteristics of the ultrasound are utilized to generate relative movement between the PCB board and the protective film at the board corner, thereby achieving vibration separation. Compared with traditional polishing methods, this film stripping method is more gentle, not only does it not damage the PCB board, but it also does not generate dust, meeting the requirements for some occasions with high cleanliness requirements for the production environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a schematic structural diagram of a PCB board corner stripping mechanism after demoulding in one embodiment of the present invention; Figure 2 This is a schematic structural diagram of a PCB board corner film peeling mechanism according to one embodiment of the present invention; Figure 3 This is a schematic structural diagram of a PCB board corner film-lifting mechanism in another embodiment of the present invention; Figure 4 Schematic diagram of the structure of the PCB board corner film-lifting mechanism in another embodiment of the present invention.

[0019] In the figure, 1. Adsorption mechanism; 2. Ultrasonic vibration mechanism; 201. Ultrasonic generator; 202. Ultrasonic vibration head; 203. Fixed bracket; 3. Transplanting mechanism; 301. Up and down moving module; 302. Forward and backward moving module; 4. Film tearing mechanism; 401. Rotating part; 402. Film rolling power part; 5. Film sticking mechanism; 6. Loading lifting mechanism; 7. Unloading lifting mechanism; 8. Loading positioning mechanism; 9. Unloading positioning mechanism; 10. Grasping robot; 100. PCB board; 200. Protective film; 300. Loading box tray; 400. Unloading box tray. DETAILED DESCRIPTION

[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. It should also be noted that the embodiments described below are intended only to illustrate the present invention and are not intended to limit the present invention.

[0021] It should be noted that the terms "install", "set", "connect", "fix" and the like should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrated; they can be mechanically connected or electrically connected; they can be directly connected or indirectly connected through an intermediate medium; they can be internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined. The indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the product of the application is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art, or the orientation or position relationship in which the product of the application is usually placed when in use. It is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on this application. The terms "first" and "second" are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly defined.

[0022] See also Figure 1 、 Figure 2 An embodiment of the present invention provides a PCB board corner film removal mechanism, including an adsorption mechanism 1, an ultrasonic vibration mechanism 2 and a transplanting mechanism 3. The ultrasonic vibration mechanism 2 is installed on the movable end of the transplanting mechanism 3. The adsorption mechanism 1 is used to receive and adsorb and fix the PCB board 100 covered with a protective film 200; the ultrasonic vibration mechanism 2 is used to generate high-frequency ultrasonic vibrations; and the transplanting mechanism 3 is used to drive the ultrasonic vibration mechanism 2 to move so that the vibrating end of the ultrasonic vibration mechanism 2 touches the protective film 200 at the corner of the PCB board 100 fixed by the adsorption mechanism 1, thereby achieving vibration separation of the PCB board 100 and the protective film 200 at the corner.

[0023] During film removal, the PCB 100 covered with the protective film 200 is first received and secured by the suction mechanism 1. The ultrasonic vibration mechanism 2 is then activated, causing its vibrating end to generate ultrasonic vibrations. Finally, the transfer mechanism 3 moves the ultrasonic vibration mechanism 2, causing its vibrating end to repeatedly and slowly contact the protective film 200 at the corner of the PCB 100 secured by the suction mechanism 1 multiple times (e.g., approximately three times) along the inside of the board toward the corner within a certain period of time (e.g., 15 seconds). This allows the PCB 100 to be fully separated from the protective film 200 at the corner by the suction mechanism 1, resulting in a well-lifted protective film 200. This facilitates subsequent film removal and improves the integrity of the film removal process. This process also generates no dust and does not damage the PCB 100, achieving a damage-free film removal process. Among them, the movement from the inside of the board to the corner of the board helps the protective film 200 to gradually lift up from the inside of the board, and with repeated slow touches, the vibration energy of the ultrasonic vibration mechanism 2 can be more fully transmitted to the interface between the PCB board 100 and the protective film 200 at the corner of the board, so that the protective film 200 can extend from the inside of the board to the corner of the board in a more natural and smooth manner, forming a lifted state that is convenient for subsequent film tearing operations, making the entire film peeling process smoother.

[0024] The PCB board corner stripping mechanism of the embodiment of the present invention achieves the functions of fixing the PCB board 100, generating ultrasonic vibrations, and precisely moving the ultrasonic vibration mechanism 2 to complete the stripping by the coordinated work of the adsorption mechanism 1, the ultrasonic vibration mechanism 2, and the transplanting mechanism 3. The overall structure is compact and the functions are complete, which improves the degree of automation and work efficiency of the stripping. During the stripping process, the high-frequency vibration characteristics of the ultrasonic wave are utilized to generate relative movement between the PCB board 100 and the protective film 200 at the board corner, thereby achieving vibration separation. This stripping method is gentler than the traditional polishing method, not only does it not damage the PCB board 100, but it also does not generate dust, meeting the requirements of some occasions with high cleanliness requirements for the production environment.

[0025] See also Figure 1 、 Figure 2 In one embodiment, the ultrasonic vibration mechanism 2 includes an ultrasonic generator 201 and an ultrasonic vibration head 202 connected to the ultrasonic generator 201. The ultrasonic generator 201 is fixed to the movable end of the transfer mechanism 3, allowing the ultrasonic vibration mechanism 2 to move with the movable end of the transfer mechanism 3, facilitating precise positioning of the protective film 200 at the corner of the PCB board 100. When the ultrasonic vibration mechanism 2 is activated, the ultrasonic generator 201 is controlled to convert electrical energy into kinetic energy, driving the ultrasonic vibration head 202 to produce high-frequency ultrasonic vibrations that are invisible to the naked eye.

[0026] Preferably, the vibration frequency of the ultrasonic vibration mechanism 2 is 15kHz-28kHz. High-frequency ultrasonic vibrations in this frequency range can generate sufficient energy to generate relative motion between the PCB board 100 and the protective film 200, thereby achieving separation between the two. Different PCB board 100 and protective film 200 materials may have different responses to the vibration frequency, and the frequency range of 15kHz-28kHz has a wide range of applicability, which can achieve good film peeling effects for various types of PCB boards 100 and protective films 200. Within this frequency range, the energy of the ultrasonic vibrations can meet the requirements for film peeling without being too high to cause damage to the PCB board 100. Excessively high frequencies may cause excessive energy concentration, adversely affecting the structure and performance of the PCB board 100; while excessively low frequencies may not provide sufficient energy for effective film peeling.

[0027] Preferably, the ultrasonic vibrator 202 is cylindrical, with a regular shape that facilitates control of its contact area and position with the protective film 200. The diameter of the ultrasonic vibrator 202 is 6 mm to 10 mm, ensuring that the vibrator is neither too large nor results in an excessively large contact area, which could cause unnecessary pressure and damage to the PCB 100. Furthermore, the angle between the ultrasonic vibrator 202 and the PCB 100 secured by the adsorption mechanism 1 is 45° to 60°, allowing the ultrasonic vibrator 202 to contact the protective film 200 only at the corners of the board through its bottom edge. This angled contact method more effectively transfers the energy of the ultrasonic vibration to the interface between the protective film 200 and the PCB 100, improving film removal efficiency. It also avoids the significant impact force that could otherwise be caused by vertical contact, reducing damage to the PCB 100. Furthermore, this angle range helps the protective film 200 gradually lift from the inside of the board, achieving a well-defined lifting state.

[0028] See also Figure 2In one embodiment, the transplanting mechanism 3 includes a vertically movable module 301 and a forward-backward movable module 302. The forward-backward movable module 302 is fixed to the movable end of the vertically movable module 301. The ultrasonic generator 201 is fixed to the movable end of the forward-backward movable module 302 via a fixed bracket 203, and the ultrasonic vibrating head 202 faces the adsorption mechanism 1. The transplanting mechanism 3, consisting of the vertically movable module 301 and the forward-backward movable module 302, enables the ultrasonic vibrating mechanism 2 to move in two mutually perpendicular dimensions. Through the coordinated operation of these two modules, the position of the ultrasonic vibrating head 202 is precisely adjusted, ensuring that it accurately contacts the protective film 200, thereby improving the accuracy and success rate of the film removal operation. During the film removal process, the movement of the vertically movable module 301 and the forward-backward movable module 302 can be flexibly controlled according to the specifications of different PCB boards 100, the position of the protective film 200, and the specific film removal requirements, ensuring good contact between the ultrasonic vibrating head 202 and the protective film 200.

[0029] See also Figure 3 In one embodiment, the PCB board corner film peeling mechanism also includes a film tearing mechanism 4 and a film sticking mechanism 5. The film tearing mechanism 4 is installed on one side of the adsorption mechanism 1. The film rolling mechanism includes a rotating part 401 and a film rolling power part 402. The film rolling power part 402 drives the rotating part 401 to rotate to roll up the protective film 200 on the PCB board 100; the film sticking mechanism 5 is installed on the moving end of the transplanting mechanism 3 and is located above the ultrasonic vibration mechanism 2. The film sticking mechanism 5 cooperates with the transplanting mechanism 3 to transfer the protective film 200 separated at the corner of the PCB board 100 to the rotating part 401.

[0030] The PCB board corner film-lifting mechanism of the above-mentioned embodiment, by adding a film-tearing mechanism 4 and a film-adhering mechanism 5, has complete functions from film-lifting to film-tearing. By mounting the film-adhering mechanism 5 on the movable end of the transfer mechanism 3 and above the ultrasonic vibration mechanism 2, the film-adhering mechanism 5 can cooperate with the transfer mechanism 3 to transfer the protective film 200 separated from the corner of the PCB board 100 to the rotating portion 401, thereby making the overall structure more compact and more efficient. After the protective film 200 is separated and lifted by the ultrasonic vibration mechanism 2, the film-adhering mechanism 5 can use its viscosity or other means to absorb or grasp the protective film 200, and then accurately place the protective film 200 on the rotating portion 401 through the movement of the transfer mechanism 3, thereby achieving precise transfer of the lifted protective film 200 from the PCB board 100 to the film-winding mechanism, ensuring the consistency and stability of the process from demolding to film-tearing. By mounting the film-tearing mechanism 4 on one side of the adsorption mechanism 1, once the protective film 200 has been transferred to the rotating portion 401, the film-tearing mechanism 4 can further roll the protective film 200 off the PCB 100, thereby automating the film-tearing and film-removing operations. Through the coordinated operation of the transfer mechanism 3, the film-adhering mechanism 5, and the film-tearing mechanism 4, the entire process, from film-tearing and film-retracting to film-retracting and film-rewinding, can be completed automatically, reducing manual errors and labor intensity, and improving production efficiency and product quality consistency.

[0031] See also Figure 4 Furthermore, in one embodiment, the PCB board corner film-lifting mechanism also includes a loading lifting mechanism 6, a unloading lifting mechanism 7, a loading positioning mechanism 8, a unloading positioning mechanism 9 and a grabbing robot 10. The loading positioning mechanism 8 is installed on the loading working position, the unloading positioning mechanism 9 is installed on the unloading working position, and the grabbing robot 10 is installed between the adsorption mechanism 1 and the loading positioning mechanism 8 and the unloading positioning mechanism 9. The loading and unloading mechanism 6 is used to receive a loading box tray 300 conveyed by a transport vehicle and lift the loading box tray 300 to the loading work position. A stack of PCB boards 100 covered with protective film 200 is stored on the loading box tray 300. The unloading mechanism 7 is used to receive a unloading box tray 400 conveyed by a transport vehicle and lift the loading box tray 300 to the unloading work position. The loading box tray 300 is used to recover the PCB boards 100 after the film is removed. The loading positioning mechanism 8 is used to fix the loading box tray 300 lifted to the loading work position. The unloading positioning mechanism 9 is used to fix the loading box tray 300 lifted to the unloading work position. The gripping robot 10 is used to transport the PCB boards 100 on the loading box tray 300 located at the loading work position one by one to the suction mechanism 1, and to transport the PCB boards 100 after the film is removed from the suction mechanism 1 to the loading box tray 300 located at the unloading work position.

[0032] The PCB board corner film removal mechanism of the above-described embodiment can automatically receive the loading box tray 300 delivered by the transport vehicle via the loading lifting mechanism 6, thereby realizing an automated loading process for raw materials (PCB boards 100 covered with protective film 200), reducing the workload and labor intensity of manual handling, and improving loading efficiency and accuracy. Furthermore, loading via the loading box tray 300 can process batches of PCB boards 100 at once, meeting the production line's demand for batch loading, improving production efficiency, and reducing the time interval for loading. The unloading lifting mechanism 7 can automatically receive the unloading box tray 400 delivered by the transport vehicle, realizing an automated unloading process for the unfilmed PCB boards 100, eliminating the need for manual handling of the unloading tray, improving unloading efficiency and automation. Unloading via the unloading box tray 400 allows the unfilmed PCB boards 100 to be stored and managed in an orderly manner, facilitating subsequent handling, testing, or further processing. The loading positioning mechanism 8 can securely lift the loading box tray 300 to the loading work position, preventing the tray from shifting or shaking during subsequent operations. This provides a stable operating base for the gripping robot 10, enabling the robot to accurately grasp the PCB board according to the predetermined position and trajectory, improving the accuracy and success rate of grasping, and thus ensuring the smooth progress of the entire film stripping process. The loading positioning mechanism 8 can securely lift the unloading box tray 400 to the unloading work position, ensuring that the unloading box tray 400 remains stable during the process of receiving the PCB board 100 after film stripping, preventing the unloading box tray 400 from moving and affecting the accuracy of the unloading operation. The gripping robot 10 realizes the automated handling of the PCB board 100 during the loading, film stripping, film stripping, and unloading processes, reducing manual intervention and improving production efficiency and product quality consistency.

[0033] It should be noted that since the adsorption mechanism 1, film tearing mechanism 4, film sticking mechanism 5, loading and lifting mechanism 6, unloading and lifting mechanism 7, gripping robot 10, loading and positioning mechanism 8, and unloading and positioning mechanism 9 are all well-known prior art in the art, the present invention will not elaborate on the specific structural structures and detailed operating principles of these mechanisms. The core innovation of the present invention lies in the organic combination and application of these mechanisms. Through the coordinated operation of these mechanisms, efficient film removal and tearing of the protective film 200 at the corners of the PCB board 100, as well as automated loading and unloading of the PCB board 100, are achieved, thereby overcoming the problems of existing automatic film tearing equipment, such as dust generation and high damage rate to the PCB board 100.

[0034] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the appended claims of the present invention.

[0035] The above is an exemplary description of the patent of the present invention in conjunction with the accompanying drawings. It is obvious that the implementation of the patent of the present invention is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the patent of the present invention, or the concept and technical solution of the patent of the present invention are directly applied to other occasions without improvement, they are all within the scope of protection of the present invention.

Claims

1. A PCB board corner film peeling mechanism, characterized in that: include: An adsorption mechanism, used to receive and adsorb the PCB board covered with the protective film; An ultrasonic vibration mechanism for generating ultrasonic vibration; The transplanting mechanism is used to drive the ultrasonic vibration mechanism to move so that the vibration end of the ultrasonic vibration mechanism touches the protective film at the corner of the PCB board fixed by the adsorption mechanism, thereby realizing vibration separation of the PCB board and the protective film at the corner of the board.

2. The PCB board corner film peeling mechanism according to claim 1, characterized in that: The ultrasonic vibration mechanism includes an ultrasonic generator and an ultrasonic vibration head connected to the ultrasonic generator. The ultrasonic generator is fixed on the moving end of the transplanting mechanism.

3. The PCB board corner film peeling mechanism according to claim 2, characterized in that: The transplanting mechanism includes an up-and-down moving module and a forward-and-backward moving module, the forward-and-backward moving module is fixed on the moving end of the up-and-down moving module, the ultrasonic generator is fixed on the moving end of the forward-and-backward moving module through a fixed bracket, and the ultrasonic vibration head faces the adsorption mechanism.

4. The PCB board corner film-lifting mechanism according to claim 2, characterized in that: The vibration frequency of the ultrasonic vibration mechanism is 15kHz-28kHz.

5. The PCB board corner film peeling mechanism according to claim 4, characterized in that: The ultrasonic vibration head is cylindrical, and the angle between the ultrasonic vibration head and the PCB board fixed by the adsorption mechanism is 45°-60°.

6. The PCB board corner film peeling mechanism according to claim 5, characterized in that: The diameter of the ultrasonic vibration head is 6mm-10mm.

7. The PCB board corner film peeling mechanism according to claim 1, characterized in that: Also includes: The film tearing mechanism is installed on one side of the adsorption mechanism. The film rolling mechanism includes a rotating part and a film rolling power part. The film rolling power part drives the rotating part to rotate to roll up the protective film on the PCB board; The mucosal mechanism is installed on the moving end of the transplanting mechanism and is located above the ultrasonic vibration mechanism. The mucosal mechanism cooperates with the transplanting mechanism to transfer the protective film separated from the corner of the PCB board to the rotating part.

8. The PCB board corner film peeling mechanism according to claim 2, characterized in that: Also includes: The loading and lifting mechanism is used to receive the loading box tray delivered by the transport trolley and lift the loading box tray to the loading work position. The loading box tray stores a stack of PCB boards covered with protective film. The unloading lifting mechanism is used to receive the unloading box tray delivered by the transport trolley and lift the loading box tray to the unloading working position. The loading box tray is used to recover the PCB board after the film is torn; The grabbing robot is used to transport the PCB boards on the loading box tray located at the loading work position to the adsorption mechanism one by one, and to transport the PCB boards after the film is torn off the adsorption mechanism to the loading box tray located at the unloading work position.

9. The PCB board corner film peeling mechanism according to claim 8, characterized in that: Also includes: A loading positioning mechanism, used for fixing the loading box tray lifted to the loading working position; The unloading positioning mechanism is used to fix the loading box tray lifted to the unloading working position.

10. A film stripping method for a PCB board corner film stripping mechanism according to any one of claims 1 to 9, characterized in that: include: The PCB board covered with the protective film is received and fixed by the adsorption mechanism; Starting the ultrasonic vibration mechanism so that the vibration end of the ultrasonic vibration mechanism generates ultrasonic vibration; The ultrasonic vibration mechanism is driven to move by the transplanting mechanism, so that the vibrating end of the ultrasonic vibration mechanism repeatedly touches the protective film at the corner of the PCB board fixed by the adsorption mechanism multiple times along the direction from the inside of the board to the board corner within a certain period of time, thereby realizing vibration separation of the PCB board and the protective film at the board corner.

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