Semiconductor workpiece conveying box

Abstract

The invention provides a semiconductor workpiece conveying box which comprises a lower box with a top opening; the upper cover is provided with at least one lateral annular groove; the at least one airtight rubber strip is provided with a base part and at least one skirt edge, the base part is contained in the lateral annular groove, and the skirt edge is connected with the base part and extends outwards; when the upper cover is combined with the top opening of the lower box, the skirt edge of the airtight rubber strip is elastically bent and tightly attached to the inner side wall of the lower box to form an airtight shape. The semiconductor workpiece conveying box has good sealing performance, and the cleanliness and the low-humidity state in the box can be maintained. In addition, the device has better structural strength, can provide good protectiveness for the semiconductor workpiece contained in the device, and can be repeatedly used for many times. In addition, the semiconductor workpiece conveying box does not generate volatile organic substances.

Description

Technical Field

[0001] The present invention relates to a workpiece conveying box, in particular to a semiconductor workpiece conveying box which can accommodate semiconductor workpieces for conveying and transportation. Background Art

[0002] Currently, semiconductor workpieces, such as front-opening unified pods (FOUPs), mask carriers, substrate carriers, plate carriers, and other semiconductor transport carriers or related parts, are packaged in dust-free bags or cartons during transportation. Summary of the Invention

[0003] However, the above-mentioned method of using dust-free bags or cartons for packaging has the following problems:

[0004] First, neither dust bags nor cartons offer adequate sealing properties, preventing semiconductor components from maintaining cleanliness for extended periods and making them susceptible to contamination. Furthermore, neither can be reused, leading to difficulties in reducing packaging costs and environmental concerns. Furthermore, neither provides adequate protection for the semiconductor components contained within, making them susceptible to damage during transport.

[0005] Secondly, due to the characteristics of the material of the dust-free bag, it is easy to produce volatile organic compounds (VOCs), and the bag cannot maintain a low humidity state for a long time.

[0006] In view of the above-mentioned defects of the prior art, the inventor felt that it was not perfect, so he devoted his mind to carefully research and overcome it, and has successfully developed a semiconductor workpiece transfer box with good sealing performance, which can maintain the cleanliness and low humidity inside the box.

[0007] In addition, the semiconductor workpiece transfer box has good structural strength, can provide good protection for the semiconductor workpieces contained therein, and can be reused multiple times.

[0008] Furthermore, the semiconductor workpiece transfer box does not generate volatile organic substances.

[0009] To achieve the above-mentioned and other purposes, the present invention provides a semiconductor workpiece transfer box, which includes: a lower box having a top opening; an upper cover having at least one lateral annular groove; and at least one airtight rubber strip having a base and at least one skirt, the base being accommodated in the lateral annular groove, and the skirt being connected to the base and extending outward; wherein, when the upper cover is combined with the top opening of the lower box, the skirt of the airtight rubber strip is elastically folded and tightly adheres to the inner wall of the lower box to form an airtight state.

[0010] In the above-mentioned semiconductor workpiece transfer box, the upper cover may have a ring edge and a lower protrusion, the ring edge may cover the top edge of the lower box, the lower protrusion may extend downward from the ring edge, and the lateral annular groove may be provided around the lower protrusion.

[0011] In the above-mentioned semiconductor workpiece transfer box, the upper cover may have an OHT chuck, and the OHT chuck may protrude from the top surface of the lower protrusion.

[0012] In the above-mentioned semiconductor workpiece transfer box, the lower protrusion and the OHT chuck may be integrally formed and connected, the upper cover may have a flat portion, and the OHT chuck may be located at the center of the flat portion.

[0013] In the above-mentioned semiconductor workpiece transfer box, the lower box can have several first overlapping parts, and the upper cover can have several second overlapping parts. The several first overlapping parts and the several second overlapping parts can be stacked together, so that multiple semiconductor workpiece transfer boxes with the same structure can be stacked and stand on each other.

[0014] In the above-mentioned semiconductor workpiece conveying box, the number of skirts of the airtight tape can be two, and the two skirts are spaced apart from each other. When the upper cover is combined with the top opening of the lower box, the outer surface of the base and the inner wall of the lower box have a second distance. When the two skirts of the airtight tape are not bent, there is a third distance between the free ends of the two skirts, and the third distance can be greater than or equal to the second distance.

[0015] In the above-mentioned semiconductor workpiece transfer box, the skirt may have an inclined surface, and the inclined surface may be upwardly inclined relative to the horizontal plane of the base.

[0016] In the above-mentioned semiconductor workpiece transfer box, the lower box has a chamber inside, and the upper cover can be provided with a gas valve assembly, a part of which can be passed through the chamber and used to exhaust or airtighten the gas in the chamber.

[0017] In the above-mentioned semiconductor workpiece transfer box, the gas valve assembly may include a gas valve nozzle and a gas valve plug, and the opening or closing of the gas valve plug is used to control the exhaust or airtightness of the gas valve nozzle.

[0018] In the above-mentioned semiconductor workpiece transfer box, the gas valve nozzle may have a channel connected to the chamber, the annular wall of the channel may be provided with multiple grooves, the gas valve plug is used to cooperate with the channel to open or airtight, and the total length of the channel may be less than the total length of the gas valve plug.

[0019] In the above-mentioned semiconductor workpiece transfer box, the side walls of the lower box can be inclined and expanded from bottom to top, so that multiple lower boxes with the same structure can be stacked.

[0020] In the above-mentioned semiconductor workpiece transfer box, the interior of the lower box may have at least one spare parts placement area.

[0021] In the above-mentioned semiconductor workpiece transfer box, the lower box may have at least one isolating member inside, and the material of the isolating member is LCP, COP or metal.

[0022] The semiconductor workpiece transfer box may further include a plurality of snap-fit structures, which may be arranged around the junction of the upper cover and the lower box to lock and open and close the upper cover and the lower box.

[0023] In the above-mentioned semiconductor workpiece transfer box, the material of the lower box and the upper cover can be LCP, COP or metal.

[0024] Thus, the semiconductor workpiece transfer box of the present invention can gradually bend the skirt of the airtight tape upward during the process of attaching the upper cover to the top opening from top to bottom. Furthermore, after the upper cover is attached and positioned, the skirt can maintain a close contact with the inner sidewall of the lower box, allowing the upper cover to airtightly seal the top opening, thereby maintaining the cleanliness and humidity within the box for a long period of time. Furthermore, the semiconductor workpiece transfer box can also conveniently extract air from outside the box via the air valve assembly, thereby reducing the oxygen content and humidity within the box and providing a better storage environment for the semiconductor workpieces within the box. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required to be used in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 It is a three-dimensional schematic diagram of an embodiment of the present invention.

[0027] Figure 2 It is a schematic exploded perspective view of an embodiment of the present invention from another perspective.

[0028] Figure 3 It is a schematic sectional view of a three-dimensional combination of an embodiment of the present invention.

[0029] Figure 4 It is a partial cross-sectional schematic diagram of an embodiment of the present invention when the upper cover has not yet been combined with the lower box.

[0030] Figure 5 It is a partial cross-sectional schematic diagram of an upper cover combined with a lower box according to an embodiment of the present invention.

[0031] Figure 6 It is a schematic side sectional view of an airtight rubber strip according to an embodiment of the present invention.

[0032] Figure 7 It is a partial three-dimensional cross-sectional schematic diagram of an upper cover according to an embodiment of the present invention.

[0033] Figure 8 It is a partial combined cross-sectional schematic diagram of an embodiment of the present invention, and the air valve plug is in a closed state.

[0034] Figure 9 It is a partial combined cross-sectional schematic diagram of an embodiment of the present invention, with the air valve plug in an open state.

[0035] Figure 10 It is a partial cross-sectional schematic diagram of an upper cover according to an embodiment of the present invention.

[0036] Figure 11 It is a schematic side sectional structure diagram of the lower box according to one embodiment of the present invention.

[0037] Figure 12 It is a schematic diagram of a three-dimensional structure of an embodiment of the present invention in a stacked state.

[0038] Figure 13 It is a schematic diagram of a three-dimensional structure of a lower box with an isolation piece according to an embodiment of the present invention.

[0039] Reference numerals

[0040] 1. Unpack

[0041] 1a Inner wall

[0042] 11 Top opening

[0043] 12 Sidewall

[0044] 13. Parts storage area

[0045] 14 bottom plate

[0046] 15 First overlapping part

[0047] 16 Isolators

[0048] 2 Upper cover

[0049] 21 lateral ring groove

[0050] 22 Ring Rim

[0051] 23 lower bulge

[0052] 24 Valve nozzle

[0053] 241 vent

[0054] 242 Ring Wall

[0055] 25 Valve plug

[0056] 251 Rod

[0057] 252 elastic plug

[0058] 2521 Card Block

[0059] 253 Stopper

[0060] 26 OHT chuck

[0061] 27 flat part

[0062] 28 Second overlapping part

[0063] 3 Airtight tape

[0064] 31 base

[0065] 311 outer surface

[0066] 32 Skirt

[0067] 321 Free End

[0068] 322 inclined surface

[0069] 4 Buckle structure

[0070] D1 first spacing

[0071] D2 second spacing

[0072] D3 third spacing

[0073] L1, L2 total length

[0074] S Room

[0075] θ angle DETAILED DESCRIPTION

[0076] The semiconductor workpiece transfer box according to an embodiment of the present invention will be further described below with reference to the accompanying drawings.

[0077] The aforementioned and other technical aspects, features, and effects of the present invention are clearly presented in the following detailed description of preferred embodiments with reference to the accompanying drawings. It is worth noting that directional terms such as up, down, left, right, front, and back, used in the following embodiments, refer only to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes only and do not limit the present invention. Furthermore, in the following embodiments, identical or similar components will be referenced using the same or similar reference numerals.

[0078] Please refer to Figures 1 to 3, is a preferred embodiment of the semiconductor workpiece transfer box of the present invention, which includes a lower box 1, an upper cover 2 and at least one airtight tape 3, the airtight tape 3 is combined with the upper cover 2, and the upper cover 2 is openably combined with the lower box 1.

[0079] For details, please refer to Figures 2 to 4 The lower box 1 has a chamber S inside, and the lower box 1 has a top opening 11 connected to the chamber S, so that a semiconductor workpiece can be placed into or taken out of the chamber S through the top of the lower box 1. The upper cover 2 has at least one lateral annular groove 21, and the airtight seal 3 has a base 31 and at least one skirt 32. The base 31 is accommodated in the lateral annular groove 21, and the skirt 32 is connected to the base 31 and extends outward. The upper cover 2 is used to close the top opening 11 of the lower box 1. After the upper cover 2 is coupled to the lower box 1, the lateral annular groove 21 of the upper cover 2 will be located inside the lower box 1.

[0080] Please refer to Figure 4 and Figure 5 According to the aforementioned structure, during the process of joining the upper cover 2 to the top opening 11 from top to bottom, the skirt 32 of the airtight seal 3 will contact the inner sidewall 1a of the lower box 1. As the upper cover 2 is pressed downward, the skirt 32 is gradually elastically bent upward due to its partial adhesion to the inner sidewall 1a of the lower box 1. After the upper cover 2 is joined and positioned, the elastic return ability of the skirt 32 allows the skirt 32 to remain in close contact with the inner sidewall 1a of the lower box 1, allowing the upper cover 2 to airtightly seal the top opening 11 of the lower box 1 and maintain the cleanliness and humidity of the chamber S for a long time. In addition, the elastic deformation of the skirt 32, which is in close contact with the inner sidewall 1a of the lower box 1, can also increase the contact area between the airtight seal 3 and the inner sidewall 1a of the lower box 1, effectively preventing the upper cover 2 from loosening from the lower box 1 and improving the stability of the connection between the two.

[0081] For more details, please refer to Figure 2 and Figure 5 In one embodiment of the present invention, the upper cover 2 may have an annular rim 22 and a lower protrusion 23. The annular rim 22 is adapted to cover the top edge of the lower box 1, and the lower protrusion 23 may extend downward from the inner edge of the annular rim 22. When the upper cover 2 closes the top opening 11 of the lower box 1, the lower protrusion 23 slightly protrudes toward the chamber S, and the lateral annular groove 21 may be provided around the lower protrusion 23. This facilitates the manufacture and molding of the upper cover 2 of this embodiment, and improves the ease of assembly and securement of the upper cover 2, the lower box 1, and the airtight seal 3.

[0082] Please refer to Figure 4and Figure 5 In one embodiment of the present invention, the base 31 of the airtight seal 3 has an outer surface 311. When the skirt 32 of the airtight seal 3 is unbent, a first distance D1 is defined between the outer surface 311 of the base 31 and the free end 321 of the skirt 32. When the upper cover 2 is coupled to the top opening 11 of the lower box 1, a second distance D2 is defined between the outer surface 311 of the base 31 and the inner sidewall 1a of the lower box 1. The first distance D1 may be greater than the second distance D2. In this manner, the airtight seal 3 of this embodiment ensures that its skirt 32 can elastically deform and tightly abut against the inner sidewall 1a of the lower box 1.

[0083] See also Figure 5 and Figure 6 In one embodiment of the present invention, the skirt 32 has an inclined surface 322 that rises upward relative to the horizontal plane of the base 31. That is, the angle θ between the inclined surface 322 and the horizontal plane of the base 31 is greater than 0. Thus, the airtight seal 3 of this embodiment can have a moderately upward-sloping skirt 32, ensuring that during the process of joining the upper cover 2 to the lower box 1, the skirt 32 can elastically deform in the desired direction and be maintained in close contact with the inner wall 1a of the lower box 1 by the inclined surface 322 of the skirt 32.

[0084] In addition, please refer to Figure 4 and Figure 5 In one embodiment of the present invention, the airtight seal strip 3 can have two skirts 32, and the two skirts 32 can be spaced apart. This allows one airtight seal strip 3 to have two locations that elastically deform and abut against the inner wall 1a of the lower case 1, thereby improving the airtightness of the semiconductor workpiece transfer box.

[0085] In one embodiment of the present invention, when the two skirts 32 of the airtight rubber strip 3 are not bent, a third distance D3 is defined between the free ends 321 of the two skirts 32. This third distance D3 can be greater than or equal to the second distance D2. In this way, the airtight rubber strip 3 of this embodiment can prevent interference between the two skirts 32 when bent and deformed, which could lead to poor airtightness.

[0086] It is worth mentioning that in this embodiment, the upper cover 2 can have one lateral annular groove 21, which accommodates the base 31 of one airtight adhesive strip 3. In other embodiments, the upper cover 2 can have multiple lateral annular grooves 21, each of which can accommodate the base 31 of one airtight adhesive strip 3, and two adjacent lateral annular grooves 21 can be spaced apart vertically. In this way, the upper cover 2 can be assembled with a larger number of airtight adhesive strips 3 to further improve the airtightness of the semiconductor workpiece transfer box. For example, the number of lateral annular grooves 21 can be selected to be two, so that the semiconductor workpiece transfer box has good airtightness and the upper cover 2 and the lower box 1 can be appropriately firmly combined without being difficult to separate. In addition, the upper cover 2 can be formed with different numbers of lateral annular grooves 21 according to actual needs to accommodate the corresponding number of airtight adhesive strips 3, so it is not limited to the aforementioned embodiment of providing one or two lateral annular grooves 21.

[0087] On the other hand, please refer to Figure 3 、 Figures 7 to 9 In addition to the above embodiments, in one embodiment of the present invention, the upper cover 2 may be provided with an air valve assembly, and the air valve assembly may include an air valve nozzle 24 and an air valve plug 25. A portion of the air valve assembly may be inserted into the chamber S and used to exhaust or airtighten the gas in the chamber S. For example, the air valve nozzle 24 may be connected to the lower protrusion 23 of the upper cover 2 and extend toward the chamber S. The air valve nozzle 24 has at least one vent 241. The air valve plug 25 may be movably provided on the air valve nozzle 24 to selectively block the vent 241 of the air valve nozzle 24; that is, when the air valve plug 25 is in a closed state (such as Figure 8 As shown), the chamber S is not connected to the outside of the upper cover 2, and the valve plug 25 is in the open state (as shown Figure 9 (as shown), the chamber S can communicate with the exterior of the upper cover 2 via the vent 241. Thus, the upper cover 2 of this embodiment can regulate the humidity and airtightness within the chamber S by controlling the opening or closing of the air valve plug 25 while maintaining its connection with the lower case 1. The present invention is not limited to the specific configuration of the air valve nozzle 24 and the air valve plug 25; the principle is that they can achieve the aforementioned effects.

[0088] More specifically, in one embodiment of the present invention, the air valve nozzle 24 can be generally tubular, forming an internal passageway communicating with the chamber S. The air valve nozzle 24 has an annular wall 242, and the vent 241 extends through the inner and outer surfaces of the annular wall 242. For example, but not limited to, the vent 241 can be in the form of a perforation, or in the form of a groove extending upward from the bottom end of the annular wall 242 a predetermined distance. In this embodiment, the vents 241 (grooves) can be multiple, preferably equiangularly distributed on the annular wall 242. The annular wall 242 of the air valve nozzle 24 can be integrally formed and connected to the lower protrusion 23 of the upper cover 2, or can be separately assembled and coupled to the perforation of the lower protrusion 23, without limitation in the present invention.

[0089] The valve plug 25 may include a rod 251, an elastic plug head 252, and a stopper 253. The ends of the rod 251 are connected to the elastic plug head 252 and the stopper 253, respectively. The lower end of the rod 251 extends through the annular wall 242 of the valve nozzle 24. The stopper 253 has a width that is at least partially greater than the inner diameter of the annular wall 242, allowing the stopper 253 to remain positioned outside the lower end of the annular wall 242. The elastic plug head 252 may also include at least one latching block 2521, which protrudes from the circumferential surface of the elastic plug head 252 and is located relatively close to the rod 251.

[0090] Therefore, please refer to Figure 7 and Figure 8 , the elastic plug head 252 of the air valve plug 25 can block the inside of the annular wall 242, so that the circumferential surface of the elastic plug head 252 can be in contact with the inner circumferential surface of the annular wall 242 to form a closed state of the air valve plug 25, so that the chamber S cannot be connected to the outside of the upper cover 2 through the vent 241. Among them, the elastic plug head 252 can be made of an elastic material (such as rubber) to enhance air tightness; and the block 2521 of the elastic plug head 252 can be extended into the corresponding vent 241, so that the block 2521 can assist in positioning the air valve plug 25, so that the elastic plug head 252 of the air valve plug 25 will not easily separate from the air valve mouth 24. In addition, the shape of the elastic plug head 252 can be a cone that is wide at the top and narrow at the bottom, and the upper half of the annular wall 242 can also form a corresponding shape to enhance the effect of close fit between the two. Among them, as Figure 8 As shown, the total length L1 of the channel of the air valve nozzle 24 is less than the total length L2 of the air valve plug 25 , so as to ensure that the opening or closing of the air valve plug 25 can accurately control the exhaust or airtightness of the air valve nozzle 24 .

[0091] Please refer to Figure 3 and Figure 9In operation, an air extraction device (e.g., a vacuum machine) can be used to extract air from the air valve nozzle 24 from the outside of the upper cover 2. At this time, the air valve plug 25, which was originally in a closed state, will be attracted by the air extraction device and move upward, so that the circumferential surface of the elastic plug head 252 no longer contacts the inner circumferential surface of the annular wall 242, thereby forming an open state of the air valve plug 25. In the embodiment where the elastic plug head 252 has the blocking block 2521, the blocking block 2521 will be elastically deformed by the force during the upward suction of the elastic plug head 252, thereby disengaging from the corresponding air vent 241. After the air valve plug 25 moves upward until the stopper 253 abuts the lower end of the annular wall 242, the stopper 253 can be used to prevent the entire air valve plug 25 from disengaging from the air valve nozzle 24. In this way, the air in the chamber S can be extracted by the exhaust device through the vent 241 , so that a low-oxygen, low-humidity and low-pressure environment is formed in the chamber S.

[0092] Please refer to Figure 3 and Figure 8 After the air extraction device stops operating, the air valve plug 25 can naturally fall down, or preferably be pressed back to the closed state by downward pressure, so as to maintain the low oxygen, low humidity and low pressure environment in the chamber S. At the same time, the low pressure environment in the chamber S can also help improve the tightness of the upper cover 2 in sealing the top opening 11 of the lower box 1. Therefore, the air valve plug 25 can provide excellent airtightness together with the airtight tape 3, thereby maintaining the low oxygen, low humidity and low pressure environment in the chamber S for a longer period of time, and ensuring that it is difficult for external air to flow into the chamber S, thereby maintaining the cleanliness of the items placed in the chamber S.

[0093] Furthermore, the upper cover 2 may be equipped with a humidity sensor extending into the chamber S for real-time detection of the humidity within the chamber S, serving as a reference for determining whether the vacuum device should cease operation. The humidity within the chamber S can also be read in real time during use. Furthermore, before opening the upper cover 2, it is recommended to first open the air valve plug 25 to allow for natural air release, thereby reducing the vacuum level within the chamber S and making it easier to open the upper cover 2 from above the lower box 1.

[0094] It is worth mentioning that in one embodiment of the present invention, the lower box 1 and the upper cover 2 can both be made of low-hygroscopic materials, such as LCP (Liquid Crystal Polymer), COP (Cyclo Olefin Polymer), or metal. In this way, the lower box 1 and the upper cover 2 of this embodiment can effectively reduce the generation of volatile organic compounds and slow down the rise in humidity in the chamber S, thereby preventing the internal semiconductor workpieces from being contaminated by volatile organic compounds, and the semiconductor workpiece transfer box can extend the time it maintains a low-humidity environment. In addition, the lower box 1 and the upper cover 2 can be repeatedly cleaned and reused, and can also be dried to avoid residual water stains. At the same time, they also have good structural strength to enhance the protection of the internal semiconductor workpieces.

[0095] Please refer to Figure 2 、 Figure 3 and Figure 10 In addition to the above embodiments, in one embodiment of the present invention, the upper cover 2 has an OHT (Overhead Hoist Transfer) chuck 26, and the OHT chuck 26 can protrude from the top surface of the lower protrusion 23. In this way, when the upper cover 2 is combined with the lower box 1, the OHT system can be used to clamp the OHT chuck 26 of the upper cover 2 to automatically transport and transfer the semiconductor workpiece transfer box of this embodiment. The OHT chuck 26 can be assembled and combined with the lower protrusion 23, or as shown in FIG. Figure 10 As shown, the upwardly protruding OHT chuck 26 is integrally formed on the lower protrusion 23 to save assembly time. The OHT chuck 26 can be preferably located in the center of the upper cover 2 to allow the OHT system to more stably clamp the semiconductor workpiece transfer box.

[0096] Furthermore, in the embodiment where the lower protrusion 23 and the OHT chuck 26 are integrally formed and connected, the upper surface of the upper cover 2 may have a flat portion 27, and the OHT chuck 26 may be located at the center of the flat portion 27. Thus, the flat portion 27 facilitates the mold ejection stroke during manufacturing, making the upper cover 2 with the OHT chuck 26 easier and faster to manufacture.

[0097] Please refer to Figure 2 and Figure 11 In addition to the above embodiment, in one embodiment of the present invention, the side wall 12 of the lower box 1 can be inclined and expanded from bottom to top. In this way, it is convenient to stack and store several lower boxes 1 with the same structure to save storage space.

[0098] In addition, in one embodiment of the present invention, the side wall 12 of the lower box 1 may further be formed with a concave-convex structure, thereby strengthening the structure of the side wall 12 and achieving an impact resistance effect.

[0099] Please refer to Figure 1 and Figure 3 In addition to the above embodiment, in one embodiment of the present invention, the lower box 1 may have at least one small object placement area 13. For example, but not limitation, the small object placement area 13 may be a local groove formed by the bottom plate 14 of the lower box 1, or a small box placed in the receiving chamber S. In this way, the lower box 1 of this embodiment can be used to store small objects, such as moisture-proof bags to reduce humidity in the receiving chamber S, screws, spare airtight tape 3, etc.

[0100] Please refer to Figure 1 、 Figure 2 and Figure 12 In addition to the above embodiment, in one embodiment of the present invention, the lower box 1 may have a plurality of first overlapping portions 15, and the upper cover 2 may have a plurality of second overlapping portions 28. Thus, when the upper cover 2 is fixed to the top of the lower box 1, the plurality of first overlapping portions 15 and the plurality of second overlapping portions 28 can be stacked together, so that multiple semiconductor workpiece transfer boxes of the same structure can be stacked and stand on top of each other.

[0101] For example, but not limitation, the plurality of first overlapping portions 15 can be provided on the bottom plate 14 of the lower case 1, such as a plurality of raised points on the outer bottom surface of the bottom plate 14, which also serve as the legs of the lower case 1. The plurality of second overlapping portions 28 can be provided on the upper surface of the upper cover 2, such as a plurality of recessed recesses recessed into the top surface of the lower protrusions 23. In this manner, when two sets of semiconductor workpiece transfer boxes are stacked one above the other, the plurality of first overlapping portions 15 of the upper lower case 1 can penetrate the plurality of second overlapping portions 28 of the lower upper cover 2. Furthermore, the lower edge of the upper lower case 1 can be surrounded by the concave lower protrusions 23, thereby ensuring that the semiconductor workpiece transfer boxes of this embodiment can be stacked securely. In other embodiments, the corresponding first overlapping portions 15 and second overlapping portions 28 can also have the opposite concave-convex configuration, or other equivalent structures that can achieve the desired effect of limiting horizontal displacement, without limitation by the present invention.

[0102] Please refer to Figure 13In addition to the above embodiments, in one embodiment of the present invention, the lower box 1 may include at least one isolating member 16. The isolating member 16 may be, for example, an isolating plate and / or an isolating box. The isolating member 16 may also be made of a low-hygroscopic material, such as LCP, COP, or metal. Thus, the lower box 1 of this embodiment can utilize the isolating member 16 to separate semiconductor workpieces, such as carriers and / or parts, to prevent contact contamination between the semiconductor workpieces.

[0103] Please refer to Figure 2 、 Figure 3 and Figure 5 In addition to the above embodiments, in one embodiment of the present invention, a plurality of snap-fit structures 4 can be arranged around the junction of the upper cover 2 and the lower box 1, for example, around the periphery of the ring edge 22 of the upper cover 2 and the periphery of the top edge of the lower box 1. In this way, after the upper cover 2 of this embodiment is combined with the lower box 1, the snap-fit structure 4 can be further locked to maintain the upper cover 2 firmly combined with the lower box 1 and not easily separated. This is particularly beneficial for effectively preventing the upper cover 2 from loosening when automatically grabbing the semiconductor workpiece transfer box. Before opening the upper cover 2, the snap-fit structure 4 should be switched to an unlocked state. The number of the snap-fit structures 4 is not limited, and one or more can be provided according to actual needs. The specific form of the snap-fit structure 4 is not limited to that disclosed in the figure, and any equivalent structure that can achieve locking and unlocking is applicable.

[0104] It should be noted that the semiconductor workpiece transfer box of the present invention is not only suitable for accommodating wafer transfer boxes, but can also be used for any semiconductor transfer carriers or related parts such as mask carriers, substrate carriers, carrier carriers, etc., and any semiconductor workpieces requiring high cleanliness, so it is extremely practical.

[0105] The above descriptions are merely embodiments of the present invention and are not intended to limit the scope of the present invention.

Claims

1. A semiconductor workpiece transfer box, characterized in that: The semiconductor workpiece transfer box comprises: a lower box having a top opening; The upper cover has at least one lateral annular groove; and At least one airtight rubber strip having a base and at least one skirt, wherein the base is accommodated in the lateral annular groove, and the skirt is connected to the base and extends outward; When the upper cover is combined with the top opening of the lower box, the skirt of the airtight rubber strip is elastically bent and closely adheres to the inner wall of the lower box to form an airtight state.

2. The semiconductor workpiece transfer box according to claim 1, wherein: The upper cover has a ring edge and a lower convex portion, the ring edge covers the top edge of the lower box, the lower convex portion extends downward from the ring edge, and the lateral annular groove is arranged on the circumference of the lower convex portion.

3. The semiconductor workpiece transfer box according to claim 2, characterized in that: The upper cover has an OHT clamp, and the OHT clamp protrudes from the top surface of the lower protrusion.

4. The semiconductor workpiece transfer box according to claim 3, characterized in that: The lower convex portion is integrally formed and connected with the OHT chuck. The upper cover has a flat portion, and the OHT chuck is located at the center of the flat portion.

5. The semiconductor workpiece transfer box according to claim 1, wherein: The lower box has a plurality of first overlapping parts, and the upper cover has a plurality of second overlapping parts. The plurality of first overlapping parts and the plurality of second overlapping parts can be matched and stacked with each other, so that a plurality of semiconductor workpiece transfer boxes with the same structure can be stacked and stood on each other.

6. The semiconductor workpiece transfer box according to claim 1, wherein: The number of the skirts of the airtight strip is two, and the two skirts are spaced apart from each other. When the upper cover is combined with the top opening of the lower box, the outer surface of the base and the inner wall of the lower box have a second distance. When the two skirts of the airtight strip are not bent, there is a third distance between the free ends of the two skirts, and the third distance is greater than or equal to the second distance.

7. The semiconductor workpiece transfer box according to claim 1, wherein: The skirt has an inclined surface, and the inclined surface is upwardly inclined relative to the horizontal plane of the base.

8. The semiconductor workpiece transfer box according to claim 1, wherein: The lower box has a containing chamber inside, and the upper cover is provided with an air valve assembly. A part of the air valve assembly is passed through the containing chamber and is used to exhaust or airtighten the gas in the containing chamber.

9. The semiconductor workpiece transfer box according to claim 8, characterized in that: The air valve assembly includes an air valve nozzle and an air valve plug. The opening or closing of the air valve plug is used to control the exhaust or airtightness of the air valve nozzle.

10. The semiconductor workpiece transfer box according to claim 9, wherein: The air valve nozzle has a channel connected to the chamber, and the annular wall of the channel is provided with a plurality of grooves. The air valve plug is used to cooperate with the channel to open or airtighten. The total length of the channel is less than the total length of the air valve plug.

11. The semiconductor workpiece transfer box according to claim 1, wherein: The side walls of the lower box are inclined and expanded from bottom to top, so that multiple lower boxes with the same structure can be stacked.

12. The semiconductor workpiece transfer box according to claim 1, wherein: The lower box has at least one area for placing small items.

13. The semiconductor workpiece transfer box according to claim 1, wherein: The lower box has at least one isolating member inside, and the isolating member is made of LCP, COP or metal.

14. The semiconductor workpiece transfer box according to claim 1, wherein: It also includes a plurality of buckle structures, which are arranged in a ring at the junction of the upper cover and the lower box, and are used to lock and open and close the upper cover and the lower box.

15. The semiconductor workpiece transfer box according to any one of claims 1 to 14, characterized in that: The lower box and the upper cover are made of LCP, COP or metal.

Images