Resin composition and display device including adhesive member formed from the resin composition

Abstract

The invention relates to a resin composition and a display device including an adhesive member formed from the resin composition. A display device includes a display panel, a window disposed on the display panel, and an adhesive member disposed between the display panel and the window, in which the adhesive member includes a polymer derived from a resin composition, the resin composition includes a (meth) acrylate oligomer (A) including a siloxane skeleton, a photoinitiator (B), a (meth) acrylate monomer (C) including a first monomer having a surface tension of about 20 mN / m to about 30 mN / m and represented by the following Formula 1, and a urethane (meth) acrylate oligomer (D), and the shear viscosity of the resin composition at 25 DEG C is about 8 mPa * s to 50 mPa * s. Formula 1 # imgabs0 #

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0017783, filed on February 6, 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure herein relates to a resin composition and a display device including an adhesive member formed of the resin composition. Background Art

[0004] In order to provide image information to users, display devices are used in various multimedia devices such as televisions, mobile phones, tablet computers and / or game consoles. Recently, various types (categories) of flexible display devices that are foldable, bendable and / or rollable have been developed.

[0005] The display device is composed of a plurality of components (e.g., a plurality of members) and includes a bonding member (e.g., an adhesive layer) for bonding the components or members (e.g., each of them) together. The bonding member employed (e.g., used) in display devices of various suitable shapes can be formed by applying (e.g., depositing) a resin composition (for bonding) by an inkjet method. Summary of the Invention

[0006] An aspect according to one or more embodiments of the present disclosure relates to a resin composition having (possessing) appropriate or excellent discharge stability and adhesive strength.

[0007] An aspect according to one or more embodiments of the present disclosure relates to a display device having (possessing) appropriate or excellent reliability during various appropriate operations by including an adhesive member formed of a resin composition having appropriate or excellent adhesive strength.

[0008] Additional aspects of the embodiments will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0009] According to one or more embodiments of the present disclosure, a display device includes a display panel, a window arranged on the display panel, and an adhesive member arranged between the display panel and the window, wherein the adhesive member includes a polymer derived from a resin composition, the resin composition including: a (meth)acrylate oligomer (A) including a siloxane skeleton; a photoinitiator (B); a (meth)acrylate monomer (C) including a first monomer having a surface tension of about 20 mN / m to about 30 mN / m and represented by Formula 1; and a urethane (meth)acrylate oligomer (D), and the resin composition has a shear viscosity of about 8 mPa·s to about 50 mPa·s at about 25°C.

[0010] Formula 1

[0011]

[0012] In Formula 1, R1 is a hydrogen atom or a substituted or unsubstituted methyl group, and R2 is a substituted or unsubstituted alkyl group having 1 to 20 carbons.

[0013] In an embodiment, the (meth)acrylate oligomer (A) may be synthesized using the first polymerizable monomer represented by Formula 2-1 or Formula 2-2.

[0014] Formula 2-1

[0015]

[0016] Formula 2-2

[0017]

[0018] In Formula 2-1 and Formula 2-2, R3 and R5 may each independently be a hydrogen atom or a substituted or unsubstituted methyl group, R4 and R6 may each independently be a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, R7 may be a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, and n may be an integer from 0 to 20. In the specification, an integer selected from 0 to 20 refers to an integer selected from 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, and 20. The description of the above numerical ranges also applies to any other numerical ranges appearing in the present invention, for example, integers selected from 0 and 1, integers selected from 0 to 2, integers selected from 0 to 3, integers selected from 0 to 4, integers selected from 0 to 5, integers selected from 0 to 6, integers selected from 0 to 7, integers selected from 0 to 8, integers selected from 0 to 9, integers selected from 0 to 10, integers selected from 0 to 11, integers selected from 0 to 12, integers selected from 0 to 13, integers selected from 0 to 14, integers selected from 0 to 15, integers selected from 0 to 16, integers selected from 0 to 17, integers selected from 0 to 18, and integers selected from 0 to 19, etc.

[0019] In an embodiment, in Formula 2-1, R3 may be an unsubstituted methyl group and R4 may be an unsubstituted n-propylene group, and in Formula 2-2, R5 may be an unsubstituted methyl group, R6 may be an unsubstituted n-propylene group, and R7 may be an unsubstituted n-butyl group.

[0020] In an embodiment, the (meth)acrylate oligomer (A) may be synthesized from a first polymerizable monomer and a second polymerizable monomer different from the first polymerizable monomer, and the second polymerizable monomer may include at least one selected from methyl methacrylate, isobornyl methacrylate, and 2-hydroxyethyl methacrylate.

[0021] In an embodiment, the first monomer may include 2-ethylhexyl acrylate and / or isodecyl acrylate.

[0022] In an embodiment, the (meth)acrylate monomer (C) may further include a second monomer different from the first monomer, and the second monomer may include at least one selected from 4-hydroxybutyl acrylate, tetrahydrofurfuryl acrylate, and diethylene glycol 2-ethylhexyl ether acrylate.

[0023] In an embodiment, the resin composition may be a solvent-free composition.

[0024] In embodiments, the (meth)acrylate oligomer (A) may have a weight average molecular weight of about 4,000 g / mol to about 20,000 g / mol.

[0025] In embodiments, the (meth)acrylate monomer (C) may have a weight average molecular weight of about 400 g / mol to about 1,500 g / mol.

[0026] In embodiments, the urethane (meth)acrylate oligomer (D) may have a weight average molecular weight of about 8,000 g / mol to about 50,000 g / mol.

[0027] In an embodiment, based on a total of 100 weight percent (100 wt %) of the resin composition, the amount of the (meth)acrylate oligomer (A) may be about 1 wt % to about 15 wt %, the amount of the photoinitiator (B) may be about 1 wt % to about 10 wt %, the amount of the (meth)acrylate monomer (C) may be about 50 wt % to about 90 wt %, and the amount of the urethane (meth)acrylate oligomer (D) may be about 1 wt % to about 25 wt %.

[0028] In embodiments, the photoinitiator (B) may include a radical polymerizable initiator.

[0029] In an embodiment, the bonding member may have a storage modulus of about 0.2 MPa or less at -20°C.

[0030] In an embodiment, the adhesive member may have a 180° peel strength of about 800 gf / 25 mm or more with respect to a glass substrate or a polyethylene terephthalate (PET) film at 25°C.

[0031] In an embodiment, the adhesive member may be formed by directly depositing the resin composition onto the surface of the window or the surface of the display panel, and then UV curing the resin composition.

[0032] In an embodiment, the display device may further include an input sensing portion, wherein the adhesive member may be disposed between the display panel and the input sensing portion or between the input sensing portion and the window.

[0033] In an embodiment, the display panel may include a display element layer and an encapsulation layer disposed on the display element layer, the input sensing part may be directly disposed on the encapsulation layer, and the adhesive member may be disposed on the input sensing part.

[0034] In an embodiment, the display device may further include an optical control layer disposed between the bonding member and the window, and an optical adhesive layer disposed between the optical control layer and the window, wherein the optical adhesive layer may include a polymer derived from the resin composition.

[0035] In an embodiment, the display device may include at least one folding axis, and at least a portion of the display device may be foldable with respect to the folding axis.

[0036] According to one or more embodiments of the present disclosure, the resin composition includes: a (meth)acrylate oligomer (A) including a siloxane skeleton, a photoinitiator (B), a (meth)acrylate monomer (C) including a first monomer having a surface tension of about 20 mN / m to about 30 mN / m and represented by Formula 1, and a urethane (meth)acrylate oligomer (D), wherein the resin composition has a shear viscosity of about 8 mPa·s to about 50 mPa·s at 25° C. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated into and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. In the drawings:

[0038] Figure 1 Combined perspective views for explaining an expanded state of a display device according to an embodiment of the present disclosure;

[0039] Figure 2A Combined perspective views for explaining an inwardly folded state of a display device according to an embodiment of the present disclosure;

[0040] Figure 2B A combined perspective view for explaining a state where a display device according to an embodiment of the present disclosure is folded outward;

[0041] Figure 3 is an exploded perspective view of a display device according to an embodiment of the present disclosure;

[0042] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0043] Figures 5A to 5C Each is a cross-sectional view schematically illustrating (eg, one) step (eg, task or action) of a method of manufacturing a bonding member according to an embodiment of the present disclosure;

[0044] Figure 6A and Figure 6B Each is a cross-sectional view schematically illustrating (eg, one) step (eg, task or action) of a method of manufacturing a bonding member according to an embodiment of the present disclosure;

[0045] Figure 7 A cross-sectional view illustrating a display device according to an embodiment of the present disclosure; and

[0046] Figure 8 A cross-sectional view illustrating a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0047] In the present disclosure, various suitable modifications may be made and various suitable forms may be applied, and specific embodiments will be illustrated in the drawings and described in more detail in the text. However, this is not intended to limit the scope of the present disclosure to any specific disclosure form. It should be understood that the scope of the present disclosure includes all suitable changes, equivalents, and substitutions included in the spirit and scope of the present disclosure.

[0048] As used herein, it will be understood that when an element (region, layer or section) is referred to as being "on," "connected to" or "coupled to" another element (region, layer or section), it can be directly on, directly connected to or directly coupled to the other element (region, layer or section), or intervening components may be present.

[0049] In contrast, in this application, when an element is referred to as being "directly disposed on" another layer, film, region, or panel, there are no intervening layers, films, regions, or panels. For example, "directly disposed on" or "directly on" may mean that two layers or two components are directly disposed (e.g., in direct contact with each other) without using additional intervening components (such as bonding components).

[0050] The same reference numerals or symbols refer to the same elements throughout the text. In addition, in the accompanying drawings, the thickness, proportion and dimension of the elements may be exaggerated for effective description of the technical content.

[0051] The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0052] It will be understood that although terms such as first and second can be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from other elements. For example, a first element can be referred to as a second element, and similarly, a second element can be referred to as a first element, without departing from the scope of this disclosure. Singular forms are intended to also include plural forms, unless the context clearly indicates otherwise.

[0053] In addition, terms such as "under," "below," "above," and "upper" are used herein to describe the relationship between components as illustrated in the drawings. These terms are relative concepts and are described according to the orientations depicted in the drawings. In the description, the term "disposed on..." and the like may refer not only to a case where a component is disposed on an upper portion of another component, but also to a case where a component is disposed on a lower portion of another component.

[0054] It will be further understood that when the terms “include” or “have” are used in this specification, it indicates the presence of the stated features, integers, steps, operations, components, parts or combinations thereof, but does not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts or combinations thereof.

[0055] As used herein, the term "substituted or unsubstituted" may refer to a functional group that is substituted or unsubstituted with one or more substituents selected from the group consisting of a deuterium atom, a halogen atom, a cyano group, a nitro group, an amine group, a silyl group, an oxy group, a sulfenyl group, a sulfinyl group, a sulfonyl group, a carbonyl group, a boron group, a phosphine oxide group, a phosphine sulfide group, an alkyl group, an alkenyl group, an alkynyl group, a hydrocarbon ring group, an aryl group, and a heterocyclic group. Furthermore, each of the exemplified substituents may be substituted or unsubstituted. For example, a biphenyl group may be interpreted as an aryl group or a phenyl group substituted with a phenyl group.

[0056] In the description, the alkyl group may be a linear, branched, or cyclic type or species. The carbon number of the alkyl group may be 1 to 60, 1 to 30, 1 to 20, 1 to 10, or 1 to 6. Examples of the alkyl group may include methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, isobutyl, 2-ethylbutyl, 3,3-dimethylbutyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, cyclopentyl, 1-methylpentyl, 3-methylpentyl, 2-ethylpentyl, 4-methyl-2-pentyl, n-hexyl, 1-methylhexyl, 2-ethylhexyl, 2-butylhexyl, cyclohexyl, 4-methylcyclohexyl, 4-tert-butylcyclohexyl, n-heptyl, 1-methylheptyl, 2,2-dimethylheptyl, 2-ethylheptyl, 2-butylheptyl, n-octyl, tert-octyl, 2-ethyloctyl, 2-butyloctyl, 2-hexyloctyl, 3,7-dimethyloctyl, cyclooctyl, n-nonyl, n-decyl, adamantyl, 2-ethyldecyl, 2-butyldecyl The present invention also includes 2-ethyldodecyl, 2-butyldodecyl, 2-hexyldodecyl, 2-octyldodecyl, n-tridecyl, n-tetradecyl, n-pentadecyl, n-hexadecyl, 2-ethylhexadecyl, 2-butylhexadecyl, 2-hexylhexadecyl, 2-octylhexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl, n-eicosyl, 2-ethyleicosyl, 2-butyleicosyl, 2-hexyleicosyl, 2-octyleicosyl, n-heneicosyl, n-docosyl, n-tricosyl, n-tetracosyl, n-pentacosyl, n-hexacosyl, n-heptacosyl, n-octacosyl, n-nonacosyl and / or n-triacontyl. However, embodiments of the present disclosure are not limited thereto. In the present disclosure, “having a carbon number of ,” “the carbon number of ,” and “the carbon number of ” have the same meaning as “having carbons ” and “the carbon number of ” have the same meaning as “having carbons ” and “the carbon number of ” have.

[0057] In the description, cycloalkyl may refer to a cyclic alkyl group. The number of carbon atoms in the cycloalkyl group may be 3 to 50, 3 to 30, 3 to 20, or 3 to 10. Examples of cycloalkyl groups may include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, 4-methylcyclohexyl, 4-tert-butylcyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, norbornyl, 1-adamantyl, 2-adamantyl, isobornyl, and / or bicycloheptyl. However, embodiments of the present disclosure are not limited thereto.

[0058] In the description, the same explanation of the above-mentioned alkyl group can be applied to the alkylene group except that the alkylene group is a divalent group.

[0059] In the description, an alkenyl group refers to a hydrocarbon group including one or more carbon-carbon double bonds in the middle and / or at the end of an alkyl group having 2 or more carbon atoms. The alkenyl group may be straight chain or branched. The carbon number of the alkenyl group is not specifically limited, but may be 2 to 30, 2 to 20, or 2 to 10. Examples of alkenyl groups may include vinyl, 1-butenyl, 1-pentenyl, 1,3-butadienyl, styryl, and / or styrylvinyl, etc. However, embodiments of the present disclosure are not limited thereto.

[0060] In the description, an aryl group refers to any functional group or substituent derived from an aromatic hydrocarbon ring. The aryl group may be a monocyclic aryl group or a polycyclic aryl group. The number of ring carbon atoms in the aryl group may be 6 to 30, 6 to 20, or 6 to 15. Examples of aryl groups include phenyl, naphthyl, fluorenyl, anthracenyl, phenanthrenyl, biphenyl, terphenyl, quaterphenyl, pentyl, hexyl, triphenylene, pyrenyl, benzofluoranthenyl, and / or 1,2-triphenylenyl. However, embodiments of the present disclosure are not limited thereto.

[0061] In the description, the fluorenyl group may be substituted, and two substituents may be combined with each other to form a spiro structure. Examples of substituted fluorenyl groups are as follows. However, the embodiments of the present disclosure are not limited thereto.

[0062]

[0063] In the description, a heterocyclic group refers to any functional group or substituent derived from a ring including one or more of B, O, N, P, Si, and S as a ring-forming heteroatom. Heterocyclic groups include aliphatic heterocyclic groups and aromatic heterocyclic groups. Aromatic heterocyclic groups may be heteroaryl groups. Aliphatic heterocyclic groups and aromatic heterocyclic groups may be monocyclic or polycyclic.

[0064] In the description, the heteroaryl group may include one or more of B, O, N, P, Si and S as ring-forming heteroatoms. If the heteroaryl group includes two or more heteroatoms, the two or more heteroatoms may be the same or different. The heteroaryl group may be a monocyclic heterocyclic group or a polycyclic heterocyclic group. The number of carbon atoms in the ring forming the heteroaryl group may be 2 to 30, 2 to 20 or 2 to 10. Examples of heteroaryl groups may include thienyl, furyl, pyrrolyl, imidazolyl, pyridyl, bipyridyl, pyrimidyl, triazinyl, triazolyl, acridinyl, pyridazinyl, pyrazinyl, quinolyl, quinazolinyl, quinoxalinyl, phenoxazinyl, phthalazinyl, pyridopyridyl, pyridopyrazinyl, pyrazinopyrazinyl, isoquinolyl, indolyl, carbazolyl, N-arylcarbazolyl, N-heteroarylcarbazolyl, N-alkylcarbazolyl, benzoxazolyl, benzimidazolyl, benzothiazolyl, benzocarbazolyl, benzothienyl, dibenzothienyl, thienothiphenyl, benzofuranyl, phenanthrolinyl, thiazolyl, isoxazolyl, oxazolyl, oxadiazolyl, thiadiazolyl, phenothiazinyl, dibenzothiaryl and / or dibenzofuranyl, and the like. However, the embodiments of the present disclosure are not limited thereto.

[0065] In the description, the same explanation as for the above-mentioned aryl group can be applied to the arylene group except that the arylene group is a divalent group. The same explanation as for the above-mentioned heteroaryl group can be applied to the heteroarylene group except that the heteroarylene group is a divalent group.

[0066] In the description, silyl groups include alkylsilyl groups and arylsilyl groups. The alkyl group in the alkylsilyl group may be linear, branched, or cyclic. The number of carbon atoms in the alkylsilyl group is not specifically limited, but may be, for example, 1 to 20 or 1 to 10. The number of carbon atoms in the arylsilyl group is not specifically limited, but may be, for example, 6 to 30, 6 to 20, or 6 to 15. Examples of silyl groups may include trimethylsilyl, triethylsilyl, tert-butyldimethylsilyl, vinyldimethylsilyl, propyldimethylsilyl, triphenylsilyl, diphenylsilyl, and / or phenylsilyl, etc. However, embodiments of the present disclosure are not limited thereto.

[0067] In the description, the thio group may include an alkylthio group and an arylthio group. The thio group may refer to an alkyl group or an aryl group defined above in combination with a sulfur atom. The alkyl group in the alkylthio group may be linear, branched, or cyclic. The number of carbon atoms in the alkylthio group is not specifically limited, but may be, for example, 1 to 20 or 1 to 10. The number of carbon atoms in the arylthio group is not specifically limited, but may be, for example, 6 to 30, 6 to 20, or 6 to 15. Examples of thio groups may include methylthio, ethylthio, propylthio, pentylthio, hexylthio, octylthio, dodecylthio, cyclopentylthio, cyclohexylthio, phenylthio, and / or naphthylthio, etc. However, embodiments of the present disclosure are not limited thereto.

[0068] In the description, an oxy group may refer to an alkyl or aryl group defined above in combination with an oxygen atom. Oxy groups may include alkoxy groups and aryloxy groups. Alkoxy groups may be linear, branched, or cyclic types or species. The number of carbon atoms in the alkoxy group is not specifically limited, but may be, for example, 1 to 20 or 1 to 10. The number of carbon atoms in the aryloxy group is not specifically limited, but may be, for example, 6 to 30, 6 to 20, or 6 to 15. Examples of oxy groups may include methoxy, ethoxy, n-propoxy, isopropoxy, butoxy, pentyloxy, hexyloxy, octyloxy, nonyloxy, decyloxy, and / or benzyloxy, etc. However, embodiments of the present disclosure are not limited thereto.

[0069] In the description, a boryl group may refer to an alkyl or aryl group defined above that is bound to a boron atom. Boryl groups include alkylboryl groups and arylboryl groups. The alkyl group in the alkylboryl group may be linear, branched, or cyclic. The number of carbon atoms in the alkylboryl group is not specifically limited, but may be, for example, 1 to 20 or 1 to 10. The number of carbon atoms in the arylboryl group is not specifically limited, but may be, for example, 6 to 30, 6 to 20, or 6 to 15. Examples of boryl groups may include dimethylboryl, diethylboryl, tert-butylmethylboryl, diphenylboryl, and / or phenylboryl, etc. However, embodiments of the present disclosure are not limited thereto.

[0070] In the specification, the phosphine oxide group may refer to an alkyl group or an aryl group defined above in combination with -P(=O)-. The number of carbon atoms in the phosphine oxide group is not particularly limited, but may be 1 to 30, 1 to 20, or 1 to 10. The phosphine oxide group may include an alkyl phosphine oxide group and an aryl phosphine oxide group. For example, the phosphine oxide group may have the following structure, but is not limited thereto.

[0071]

[0072] In the specification, the phosphinyl sulfide group may refer to an alkyl group or an aryl group defined above in combination with -P(=S)-. The number of carbon atoms in the phosphinyl sulfide group is not particularly limited, but may be 1 to 30, 1 to 20, or 1 to 10. The phosphinyl sulfide group may include an alkylphosphinyl sulfide group and an arylphosphinyl sulfide group. For example, the phosphinyl sulfide group may have the following structure, but is not limited thereto.

[0073]

[0074] In the specification, the alkyl group in the alkoxy group, the alkylthio group, the alkylboryl group, the alkylsilyl group, the alkylphosphine oxide group, or the alkylphosphine sulfide group may be the same as exemplified in the above-described alkyl group.

[0075] In the specification, the aryl group in the aryloxy group, the arylthio group, the arylboryl group, the arylsilyl group, the arylphosphine oxide group, or the arylphosphine sulfide group may be the same as exemplified in the aryl group described above.

[0076] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an ideal or overly formal sense unless expressly defined as such herein.

[0077] Hereinafter, a resin composition according to an embodiment of the present disclosure and a display device including a bonding member formed of the same will be explained in more detail with reference to the accompanying drawings.

[0078] Figure 1 Combined perspective views illustrating a deployed state of a display device DD according to an embodiment of the present disclosure. Figure 2A A combined perspective view illustrating an inwardly folded state of the display device DD according to an embodiment of the present disclosure. Figure 2B A combined perspective view illustrating a state where the display device DD according to an embodiment of the present disclosure is folded outward.

[0079] Figure 1 The display device DD according to the embodiment of the present disclosure explained in is activated in response to an electrical signal. For example, the display device DD may be a mobile phone, a tablet computer, a monitor, a television, a car navigation system, a game console, or a wearable device, but the embodiment of the present disclosure is not limited thereto. Figure 1 , the display device DD is explained as a mobile phone as an example. The display device DD according to an embodiment may be a flexible display device that can be folded, bent, and / or rolled.

[0080] exist Figure 1 In the drawings and other drawings, the first direction DR1, the second direction DR2, and the third direction DR3 are illustrated, and the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 described herein may be relative concepts and thus may be changed to other directions. As used herein, the first direction DR1 and the second direction DR2 are perpendicular to each other, and the third direction DR3 is a normal direction relative to a plane defined by the first direction DR1 and the second direction DR2.

[0081] As used herein, a thickness direction of the display device DD may be parallel to a third direction DR3, which is a normal direction relative to a plane defined by the first direction DR1 and the second direction DR2. A front surface (or upper surface) and a rear surface (or lower surface) of a member constituting the display device DD may be defined relative to the third direction DR3.

[0082] As used herein, the term "on a plane" or "in a plan view" may refer to viewing in a plane parallel to the plane defined by the first direction DR1 and the second direction DR2. As used herein, the term "overlapping with..." may refer to overlapping with..." on a plane (of the display device DD) or in a plan view (of the display device DD), unless otherwise defined.

[0083] refer to Figure 1 , the display device DD can display an image IM through the display surface FS. The display surface FS may include a display area DA and a non-display area NDA. The display area DA may be an area activated in response to an electrical signal. The display device DD may display an image IM through the display area DA. In addition, in the display area DA, various types or kinds of external inputs may be detected. The non-display area NDA may be adjacent to the display area DA. The non-display area NDA may be around the display area DA (for example, surrounding the display area DA). Therefore, the shape of the display area DA may be substantially defined by the non-display area NDA. However, this is explained as an example, and the non-display area NDA may be arranged to be adjacent to only one side of the display area DA, or the non-display area NDA may not be provided. The display surface FS may include a plane defined by the first direction DR1 and the second direction DR2.

[0084] The rear surface RS of the display device DD may face the display surface FS. In one or more embodiments, since the rear surface RS is an outer surface of the display device DD, no video or image may be displayed thereon. In one or more embodiments, the rear surface RS may serve as a second display surface on which a video or image may be displayed.

[0085] The display device DD can be divided into a folding area FA1 and non-folding areas NFA1 and NFA2. In addition, the display device DD can include a plurality of non-folding areas NFA1 and NFA2. The first non-folding area NFA1 and the second non-folding area NFA2 can be separated and / or isolated (e.g., spaced apart or separated), with the folding area FA1 located therebetween.

[0086] exist Figures 1 to 2B , a display device DD including one folding area FA1 is described. However, this is illustrated as an example, and in one or more embodiments, multiple folding areas may be defined in the display device DD. Furthermore, the display device DD can be folded about multiple folding axes, such that portions of the display surface FS are opposed to each other (e.g., facing or facing away from each other). The number of folding axes included in the display device DD and the number of non-folding areas corresponding to the folding axes are not limited to any one embodiment.

[0087] refer to Figure 2A and Figure 2B , the display device DD can be folded relative to the first folding axis FX1. Figure 2A and Figure 2B The first folding axis FX1 illustrated in FIG2 is a virtual axis extending in the first direction DR1 and may be parallel to the long side direction of the display device DD. However, this is illustrated as an example, and the extending direction of the first folding axis FX1 is not limited to the first direction DR1.

[0088] The first folding axis FX1 may extend along the first direction DR1 on the display surface FS or may extend along the first direction DR1 on the rear surface (or bottom surface) RS. Figure 2A , the first non-folding area NFA1 and the second non-folding area NFA2 face each other, that is, the display device DD can be folded inward so that the display surface FS is not exposed to the outside. Figure 2B , the display device DD can be folded relative to the first folding axis FX1 and can be converted into an outward folded state, wherein an area on the rear surface RS overlapping with the first non-folding area NFA1 and another area on the rear surface RS overlapping with the second non-folding area NFA2 face each other.

[0089] Figure 3 is an exploded perspective view of a display device DD according to an embodiment of the present disclosure.

[0090] refer to Figure 3 The display device DD includes a display module DM, a window WP on the display module DM, and an adhesive member AP disposed between the display module DM and the window WP. Furthermore, the display device DD may further include a support member SM disposed below the display module DM, a protective layer PF disposed on the window WP, and a housing HAU that accommodates the display module DM and / or the support member SM.

[0091] The housing HAU may be made of a relatively rigid material. For example, the housing HAU may include multiple frames and / or panels made of glass, plastic, and / or metal. The housing HAU may provide a defined or predetermined storage space. The display module DM may be housed in the storage space, thereby being protected from external impacts.

[0092] The support member SM may include a metal material and / or a non-metal material (e.g., a polymer material or carbon fiber reinforced plastic (CFRP)). For example, the support member SM may include stainless steel, aluminum, or an aluminum alloy. In one or more embodiments, the support member SM may include carbon fiber reinforced plastic (CFRP) or the like. However, the embodiments of the present disclosure are not limited thereto, and the support member SM may include other non-metal materials (e.g., plastic, glass fiber reinforced plastic, and / or glass).

[0093] In one or more embodiments, the display device DD may further include a buffer layer and / or a barrier layer disposed below the support member SM. The buffer layer may include an elastomer such as sponge, foam plastic, and / or urethane resin. The barrier layer may be an electromagnetic wave blocking layer and / or a heat dissipation layer.

[0094] The display module DM can be activated in response to an electrical signal. Figure 1 ) is activated and displays the image IM( Figure 1 In the display module DM, an active area AA-DM and a peripheral area NAA-DM may be defined. The active area AA-DM may be activated in response to an electrical signal. The peripheral area NAA-DM may be positioned adjacent to at least one side of the active area AA-DM. Circuits and / or wires for driving the active area AA-DM may be arranged in the peripheral area NAA-DM.

[0095] The adhesive member (eg, adhesive layer) AP may be disposed on the display module DM. The display module DM may be coupled to the window WP via the adhesive member AP. The adhesive member AP may be optically transparent. The adhesive member AP according to an embodiment may include a resin composition RC (see Figure 5A and Figure 6A ) polymer. The adhesive member AP may be formed from the resin composition RC according to an embodiment. The adhesive member AP formed from the resin composition RC according to an embodiment may exhibit appropriate or excellent adhesion reliability. In an embodiment, the display device DD including the adhesive member AP formed from the resin composition RC may exhibit appropriate or excellent reliability during operations such as folding, bending, and / or rolling.

[0096] The window WP may include a glass substrate. The window WP may protect the display module DM, etc. The image IM generated in the display module DM ( Figure 1 ) can be provided to the user through the window WP. For example, the window WP may include ultra-thin glass (UTG).

[0097] The window WP may include a transmissive area TA and a frame area BZA. The transmissive area TA may overlap at least a portion of the active area AA-DM of the display module DM. The transmissive area TA may be optically transparent. The image IM( Figure 1 ) can be provided to the user through the transmission area TA.

[0098] The frame area BZA may be a region having relatively lower transmittance than the transmission area TA. The frame area BZA may define the shape of the transmission area TA. The frame area BZA may be adjacent to the transmission area TA and may be around (eg, surround) the transmission area TA.

[0099] The border area BZA may have a set or predetermined color. The border area BZA may cover the peripheral areas NAA-DM of the display module DM and thus may block external view of the peripheral areas NAA-DM. However, embodiments of the present disclosure are not limited thereto, and the border area BZA may be arranged adjacent to only one side of the transmissive area TA, or at least a portion of the border area BZA may not be provided.

[0100] The protective layer PF may be a functional layer that protects one surface (e.g., the top surface) of the window WP. The protective layer PF may include an anti-fingerprint coating agent, a hard coating agent, and / or an antistatic agent. In one or more embodiments, an auxiliary adhesive layer may be disposed between the window WP and the protective layer PF. In one or more embodiments, the protective layer PF may not be provided.

[0101] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present disclosure. Figure 4 Can be along Figure 3 A cross-sectional view taken along line II' in FIG.

[0102] exist Figure 4 For ease of description, no Figure 3 1 and 2. The housing HAU is shown in the configuration in FIG. 1, and only the support member SM, the display module DM, the adhesive member AP, the window WP and the protection layer PF are illustrated.

[0103] refer to Figure 4 , the support member SM may include a first support portion MP1 overlapping the first non-folding area NFA1 and a second support portion MP2 overlapping the second non-folding area NFA2. The first support portion MP1 and the second support portion MP2 may be separated and / or separated (e.g., spaced apart or separated) in the folding area FA1. In one or more embodiments, the first support portion MP1 and the second support portion MP2 may not overlap the folding area FA1. In one or more embodiments, at least a portion of the first support portion MP1 and at least a portion of the second support portion MP2 may overlap the folding area FA1.

[0104] The display module DM may include a display panel DP and an input sensing portion TP disposed on the display panel DP. The display panel DP may include a base substrate BS, a circuit layer DP-CL disposed on the base substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and an encapsulation layer TFE disposed to cover the display element layer DP-EL.

[0105] Figure 4 The configuration of the display panel DP explained in FIG. 1 is shown as an example, and the configuration of the display panel DP is not limited thereto. For example, the display panel DP may include a liquid crystal display element, and in this case, the encapsulation layer TFE may not be provided.

[0106] The base substrate BS may provide a base surface on which the circuit layer DP-CL is to be disposed. The base substrate BS may be a flexible substrate capable of bending, folding, and / or curling. The base substrate BS may be a glass substrate, a metal substrate, and / or a polymer substrate. However, embodiments of the present disclosure are not limited thereto, and the base substrate BS may include an inorganic layer, an organic layer, or a composite material layer (e.g., an organic-inorganic composite material layer).

[0107] The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern and / or a signal line, etc. For example, the circuit layer DP-CL may include a switching transistor and a driving transistor for driving a light emitting element in the display element layer DP-EL.

[0108] The display element layer DP-EL may include a light-emitting element for emitting light, such as an organic light-emitting element, an inorganic light-emitting element, an organic-inorganic light-emitting element, a micro-LED, a nano-LED, a quantum dot light-emitting element, an electrophoretic element, and / or an electrowetting element.

[0109] The encapsulation layer TFE may be disposed on the display element layer DP-EL. The encapsulation layer TFE may protect the display element layer DP-EL from moisture, oxygen, and / or foreign matter (such as dust particles). The encapsulation layer TFE may include at least one inorganic layer. In one or more embodiments, the encapsulation layer TFE may include at least one organic layer and at least one inorganic layer. For example, the encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence.

[0110] The input sensing portion TP may be disposed on the display panel DP. For example, the input sensing portion TP may be disposed directly on the encapsulation layer TFE. The input sensing portion TP may detect external input, convert it into a set or predetermined input signal, and provide the input signal to the display panel DP. For example, in the display device DD according to an embodiment, the input sensing portion TP may be a touch sensing portion that detects touch. The input sensing portion TP may detect direct touch by a user, indirect touch by a user, direct touch by an object, and / or indirect touch by an object.

[0111] The input sensing portion TP can detect at least any one of the position and strength (pressure) of a touch applied from the outside. In an embodiment, the input sensing portion TP may have various suitable structures and / or may be composed of various suitable materials, but the present disclosure is not limited thereto. The input sensing portion TP may include a plurality of sensing electrodes for detecting external input. The sensing electrodes may detect input from the outside by a capacitive method. In the display panel DP, an input signal may be received from the input sensing portion TP, and an image corresponding to the input signal may be generated.

[0112] The window WP may include a base layer BL and a printed layer BM. In one or more embodiments, the base layer BL may be a glass substrate or a polymer substrate. In one or more embodiments, the base layer BL may be a plastic substrate. For example, the base layer BL may include polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof.

[0113] The printed layer BM may be disposed on one surface of the base layer BL. The printed layer BM may be provided in at least a portion of the bottom surface of the base layer BL adjacent to the display module DM. The printed layer BM may be disposed at the edge of the base layer BL. The printed layer BM may be an ink-printed layer. Alternatively, the printed layer BM may be a layer containing a pigment and / or dye. Within the window WP, the frame area BZA may be the portion in which the printed layer BM is provided.

[0114] The adhesive member AP may be disposed between the display module DM and the window WP. The adhesive member AP may have a thickness T0 of about 50 μm to about 200 μm. For example, the adhesive member AP may have a thickness T0 of about 50 μm to about 100 μm. However, these thicknesses are disclosed as examples, and the thickness T0 of the adhesive member AP is not limited thereto.

[0115] The bonding member AP according to the embodiment includes a resin composition RC according to the embodiment (see Figure 5A and Figure 6A ) polymer, which will be described in more detail later. The resin composition RC according to the embodiment includes at least one (meth)acrylate oligomer, at least one photoinitiator, at least one (meth)acrylate monomer, and at least one urethane (meth)acrylate oligomer. The resin composition RC according to the embodiment will be described in more detail later.

[0116] As described in more detail later, because the adhesive member AP according to the embodiment has a high 180° peel strength in a hot and humid (e.g., hot and humid) environment, the adhesive member AP according to the embodiment can exhibit appropriate or excellent adhesion reliability and folding reliability. The hot and humid (e.g., hot and humid) environment may refer to an environment with high temperature and high humidity. Even in a hot and humid (e.g., hot and humid) environment, since the adhesive member AP is not peeled off from the adherend (e.g., the display module DM or the window WP), operations such as folding or unfolding can be easily performed. That is, even in a hot and humid (e.g., hot and humid) environment, the display device DD including the adhesive member AP according to the embodiment can also exhibit appropriate or excellent reliability during operations such as folding and unfolding because the adhesive member does not fall off from the adherend in such an environment.

[0117] Figures 5A to 5C Each is a cross-sectional view schematically illustrating a step of a method of manufacturing an adhesive member AP according to an embodiment of the present disclosure.

[0118] According to an embodiment, a method of manufacturing an adhesive member AP may include: providing a resin composition RC onto a substrate CF (e.g., to form an initial adhesive member P-AP); forming the adhesive member AP by providing light (e.g., UV light or UV-L) to the initial adhesive member P-AP; and detaching the adhesive member AP from the substrate CF.

[0119] Figure 5A 1 is a cross-sectional view showing an example of applying the resin composition RC to the substrate CF. Figure 5A , resin composition RC can be applied to substrate CF. Resin composition RC can be applied to substrate CF by nozzle NZ. For example, the substrate CF on which resin composition RC is provided may include polyethylene terephthalate (PET). Substrate CF is a temporary substrate for forming bonding member AP by resin composition RC. Therefore, any suitable substrate that can be easily detached from bonding member AP after resin composition RC is cured can be used without restriction. Detaching treatment is carried out on a surface of substrate CF provided with resin composition RC.

[0120] Resin composition RC can be provided by inkjet printing or dispensing. According to JIS Z8803 standard measurement, the resin composition RC according to the embodiment can have a shear viscosity of about 8mPa s to about 50mPa s. The shear viscosity is measured at about 25 ° C and about 10 rpm. If (for example, when) the shear viscosity of the resin composition RC falls within the above range (time), the resin composition RC can show appropriate or excellent discharge stability. That is, if (for example, when) the shear viscosity of the resin composition RC falls within the above range (time), the resin composition RC can be easily discharged from a device such as a nozzle NZ, and can be applied with a uniform amount and uniform thickness so as not to deviate from the component (for example, the morphology of the component) on which the resin composition RC will be provided. For example, if (for example, when) the shear viscosity of the resin composition RC falls within the above range (time), the resin composition RC can be easily discharged from a device such as a nozzle NZ, and can be applied with a uniform amount and uniform thickness throughout the surface of the component on which the resin composition RC will be provided.

[0121] The resin composition RC according to the embodiment may not include a solvent (e.g., excluding any solvent). The resin composition RC according to the embodiment may not include a volatile organic solvent (e.g., excluding any volatile organic solvent). The resin composition RC can be provided as a solvent-free composition. Because the resin composition RC is a solvent-free composition, it is possible to make it easier to discharge the resin composition RC from the nozzle NZ. If (e.g., when) the resin composition RC includes a volatile organic solvent, the process for manufacturing the adhesive member including the resin composition RC may include a heat treatment for drying the volatile organic solvent, etc., which may make it more difficult to discharge the resin composition RC from the nozzle NZ.

[0122] The resin composition RC according to the embodiment is a photocurable resin composition. The resin composition RC according to the embodiment may be a UV photocurable resin that can be cured by UV. The resin composition RC according to the embodiment is in a liquid state before curing (before being cured) and can be crosslinked or cured when irradiated with light such as UV light.

[0123] The resin composition RC according to an embodiment may include a (meth)acrylate oligomer (A) (eg, at least one (meth)acrylate oligomer (A)), a photoinitiator (B), a (meth)acrylate monomer (C), and a urethane (meth)acrylate oligomer (D).

[0124] The (meth)acrylate oligomer (A) according to the embodiment has a siloxane skeleton. The (meth)acrylate oligomer (A) can be synthesized from a first polymerizable monomer. The (meth)acrylate oligomer (A) can be derived from a first polymerizable monomer represented by the following Formula 2-1 or Formula 2-2.

[0125] Formula 2-1

[0126]

[0127] Formula 2-2

[0128]

[0129] In Formula 2-1 and Formula 2-2, R3 and R5 may each independently be a hydrogen atom or a substituted or unsubstituted methyl group. For example, R3 and R5 may each be an unsubstituted methyl group.

[0130] In Formula 2-1 and Formula 2-2, R4 and R6 may each independently be a substituted or unsubstituted alkylene group having a carbon number of 1 to 20. R4 and R6 may each independently be a substituted or unsubstituted linear alkylene group having a carbon number of 1 to 20 or a substituted or unsubstituted branched alkylene group having a carbon number of 1 to 20. For example, R4 and R6 may each be an unsubstituted n-propylene group.

[0131] In Formula 2-2, R7 may be a substituted or unsubstituted alkyl group having a carbon number of 2 to 20. R7 may be a substituted or unsubstituted linear alkyl group having a carbon number of 1 to 20 or a substituted or unsubstituted branched alkyl group having a carbon number of 1 to 20. For example, R7 may be an unsubstituted n-butyl group.

[0132] In Formula 2-2, n may be an integer from 0 to 20. For example, n may be 1.

[0133] In an embodiment, the (meth)acrylate oligomer (A) may be a polymer synthesized from a first polymerizable monomer and a second polymerizable monomer different from the first polymerizable monomer. The second polymerizable monomer may include at least one of methyl methacrylate, isobornyl methacrylate, and 2-hydroxyethyl methacrylate. For example, the second polymerizable monomer may include all of methyl methacrylate, isobornyl methacrylate, and 2-hydroxyethyl methacrylate. For example, the (meth)acrylate oligomer (A) may be an oligomer synthesized by reacting a first polymerizable monomer represented by Formula 2-1 or Formula 2-2 with a second polymerizable monomer selected from at least one of methyl methacrylate, isobornyl methacrylate, and 2-hydroxyethyl methacrylate.

[0134] The (meth)acrylate oligomer (A) may have a weight average molecular weight of about 4,000 g / mol to about 20,000 g / mol. For example, in an embodiment, the (meth)acrylate oligomer (A) may have a weight average molecular weight of about 8,000 g / mol to about 9,500 g / mol. Because the resin composition RC includes the (meth)acrylate oligomer (A) having a weight average molecular weight within the above range, the resin composition RC can be easily discharged from the nozzle NZ and can be applied in a uniform amount and uniform thickness (for example, on the substrate CF).

[0135] The weight percentage of the (meth)acrylate oligomer (A) relative to the total weight of the resin composition RC (e.g., 100 wt%) may be about 1 wt% to about 20 wt%. In one or more embodiments, the weight percentage of the (meth)acrylate oligomer (A) relative to the total weight of the resin composition RC (e.g., 100 wt%) may be about 1 wt% to about 15 wt%. For example, the weight percentage of the (meth)acrylate oligomer (A) relative to the total weight of the resin composition RC may be about 1 wt% to about 7 wt%. Because the amount of the (meth)acrylate oligomer (A) included in the resin composition RC falls within the above range, the resin composition RC may have a suitable shear viscosity, which makes it easier for the resin composition RC to be discharged from the nozzle NZ, and thus the resin composition RC can be provided by an inkjet printing method or a dispensing method. In addition, since the amount of the (meth)acrylate polymer (A) included in the resin composition RC falls within the above range, the adhesive member AP formed from the resin composition RC can have appropriate or excellent adhesive strength and can be easily folded or unfolded (for example, without falling off from the adherend due to folding and unfolding).

[0136] The resin composition RC includes at least one photoinitiator (B). The photoinitiator (B) may include a free radical polymerizable initiator. When the resin composition RC includes multiple photoinitiators (B), different photoinitiators can be activated by light with different peak wavelengths (e.g., UV light).

[0137] For example, the photoinitiator (B) may include at least one of 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methylpropan-1-one.

[0138] In addition, the photoinitiator (B) may include 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morphin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl (2,4,6-trimethylbenzoyl)-diphenylphosphine oxide, at least one of bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrrolyl)phenyl]titanium(IV) and bis(2,4-cyclopentadienyl)phenylphosphinate, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, [1-(4-phenylsulfonylbenzoyl)heptyleneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrrolyl)phenyl]titanium(IV).

[0139] The photoinitiator (B) may have a weight percentage of about 1 wt % to about 10 wt % relative to the total weight of the resin composition RC (e.g., 100 weight percent (100 wt %) in total). For example, the weight percentage of the photoinitiator (B) may be about 1 wt % to about 5 wt % relative to the total weight of the resin composition RC. However, the weight percentage is provided as an example, and the amount (e.g., weight percentage) of the photoinitiator (B) is not limited thereto.

[0140] The resin composition RC includes at least one (meth)acrylate monomer (C). In an embodiment, the (meth)acrylate monomer (C) may include a (meth)acryloyl group. As used herein, the term "(meth)acryloyl group" refers to an acryloyl group or a methacryloyl group, and the term "(meth)acryl" refers to an acryl group or a methacryl group. For example, the (meth)acrylate monomer may be an acrylate monomer including one acryloyl group or a methacryloyl monomer including one methacryloyl group.

[0141] The (meth)acrylate monomer (C) includes a first monomer. The first monomer included in the (meth)acrylate monomer (C) is represented by the following Formula 1.

[0142] Formula 1

[0143]

[0144] In Formula 1, R1 may be a hydrogen atom or a substituted or unsubstituted methyl group. For example, R1 may be an unsubstituted methyl group.

[0145] In Formula 1, R2 may be a substituted or unsubstituted alkyl group having a carbon number of 1 to 20. For example, R2 may be a 4-hydroxybutyl group, a 2-ethylhexyl group, a methyltetrahydrofuryl group ( That is, any one of a methyl group substituted with a tetrahydrofuranyl group) and a 2-ethylhexyldiglycol group.

[0146] The first monomer included in the (meth)acrylate monomer (C) may include 2-ethylhexyl acrylate and / or isodecyl acrylate.

[0147] The first monomer included in the (meth) acrylate monomer (C) may have a surface tension of about 20mN / m to about 30mN / m. Because the surface tension of the first monomer is about 20mN / m to about 30mN / m, the resin composition RC can be easily discharged from the nozzle NZ and can be applied in a uniform amount and uniform thickness. If (for example, when) the first monomer has a surface tension less than about 20mN / m (time), the application uniformity of the resin composition RC on the polyethylene terephthalate film can be reduced. If (for example, when) the first monomer has a surface tension greater than about 30mN / m (time), the discharge of the resin composition RC from the nozzle NZ may be difficult. The resin composition RC according to the embodiment may include two or more (meth) acrylate monomers (C). The (meth) acrylate monomer (C) may include the above-mentioned first monomer and may further include a second monomer different from the first monomer. The second monomer may include at least one of 4-hydroxybutyl acrylate, tetrahydrofurfuryl acrylate, and 2-ethylhexyl ether diethylene glycol acrylate. For example, the resin composition RC according to the embodiment may include 2-ethylhexyl acrylate as the first monomer, and may include all of 4-hydroxybutyl acrylate, tetrahydrofurfuryl acrylate, and 2-ethylhexyl ether acrylate diglycol as the second monomer. In an embodiment, the resin composition RC according to the embodiment may include isodecyl acrylate as the first monomer, and may include all of 4-hydroxybutyl acrylate, tetrahydrofurfuryl acrylate, and 2-ethylhexyl ether acrylate diglycol as the second monomer. However, embodiments of the present disclosure are not limited thereto.

[0148] The weight percentage of the (meth)acrylate monomer (C) relative to the total weight of the resin composition RC (e.g., 100 wt%) may be about 50 wt% to about 90 wt%. For example, the weight percentage of the (meth)acrylate monomer (C) relative to the total weight of the resin composition RC may be about 80 wt% to about 90 wt%. If (e.g., when) the weight percentage of the (meth)acrylate monomer (C) relative to the total weight of the resin composition RC is less than about 50 wt%, crosslinking (e.g., excessive crosslinking) may occur in the resin composition RC, and thus the tackiness (e.g., adhesion) of the surface may be reduced. As a result, the 180° peel strength of the adhesive member formed from the resin composition RC on the glass substrate may be reduced. If (e.g., when) the weight percentage of the (meth)acrylate monomer (C) relative to the total weight of the resin composition RC is greater than about 90 wt%, insufficient crosslinking may occur in the resin composition RC, and thus the cohesive force may be insufficient or even absent. As a result, the adhesive member formed from the resin composition RC may have reduced 180° peel strength on the glass substrate. That is, when the weight percentage of the (meth)acrylate monomer (C) relative to the total weight of the resin composition RC is less than about 50 wt%, the resin composition RC may be excessively crosslinked and may result in reduced adhesion. Furthermore, when the weight percentage of the (meth)acrylate monomer (C) relative to the total weight of the resin composition RC is greater than about 90 wt%, the resin composition RC may have insufficient crosslinking and may result in insufficient cohesion. In both cases, the adhesive member formed from the resin composition RC may have reduced 180° peel strength on a glass substrate.

[0149] When the resin composition RC includes two or more (meth)acrylate monomers (C), the sum of the weight percentages of the two or more (meth)acrylate monomers (C) (e.g., the total amount of all (meth)acrylate monomers (C)) relative to the total weight of the resin composition RC (e.g., 100 wt%) can be from about 50 wt% to about 90 wt%. Because the total amount of the (meth)acrylate monomers (C) included in the resin composition RC falls within the above range, the resin composition RC can have a suitable shear viscosity, which makes it easier for the resin composition RC to be discharged from the nozzle NZ, and thus the resin composition RC can be properly deposited by an inkjet printing method or a dispensing method. In addition, if (e.g., when) the amount of the (meth)acrylate monomers (C) included in the resin composition RC (e.g., the total amount in the case of two or more (meth)acrylate monomers (C)) falls within the above range, the adhesive member AP formed from the resin composition RC can have suitable or excellent adhesive strength and can be easily folded and unfolded.

[0150] The resin composition RC includes at least one urethane (meth) acrylate oligomer (D). For example, the resin composition RC may include one urethane acrylate oligomer, or the resin composition RC may include two or more urethane (meth) acrylate oligomers having different weight average molecular weights.

[0151] In embodiments, the urethane (meth)acrylate oligomer (D) may have a weight average molecular weight of about 8,000 g / mol to about 50,000 g / mol. Since the urethane (meth)acrylate oligomer (D) having a weight average molecular weight of about 5,000 g / mol to about 40,000 g / mol is included in the resin composition RC in an oligomer state having a relatively high degree of polymerization, the resin composition RC may maintain a high degree of polymerization after curing, and thus may form an adhesive member AP having appropriate or excellent adhesion reliability.

[0152] The weight percentage of the urethane (meth) acrylate oligomer (D) relative to the total weight of the resin composition RC (e.g., 100 wt%) may be about 1 wt% to about 40 wt%. In one or more embodiments, the weight percentage of the urethane (meth) acrylate oligomer (D) relative to the total weight of the resin composition RC (e.g., 100 wt%) may be about 1 wt% to about 25 wt%. For example, the weight percentage of the urethane (meth) acrylate oligomer (D) relative to the total weight of the resin composition RC may be about 1 wt% to about 15 wt%. For example, the weight percentage of the urethane (meth) acrylate oligomer (D) relative to the total weight of the resin composition RC (e.g., 100 wt%) may be about 4 wt%. However, these weight percentages are disclosed as examples, and the amount (e.g., weight percentage) of the urethane (meth) acrylate oligomer (D) is not limited thereto.

[0153] Figure 5B 1 is a cross-sectional view showing an example of forming an adhesive member AP by applying light to the resin composition RC. Figure 5B , UV-L (eg, UV light) may be irradiated to the initial bonding member P-AP formed by applying the resin composition RC in a uniform thickness on the substrate CF. Figure 5B While the UV-L is directly irradiated onto the initial bonding member P-AP, the present disclosure is not limited thereto. A carrier film may be disposed on the initial bonding member P-AP and may cover the initial bonding member P-AP during the curing process. The carrier film may be transparent to the UV-L.

[0154] refer to Figure 5A and Figure 5B, UV-L may be provided to the initial bonding member P-AP in the presence of oxygen (eg, in an oxygen-containing atmosphere). Figure 5C ) can be formed by curing the resin composition RC according to the embodiment in the presence of oxygen. UV-L may be provided once, or UV-L may be provided two or more times to form the bonding member AP from the resin composition RC. For example, when UV-L is provided twice to form the bonding member AP from the resin composition RC, the applied resin composition RC is pre-cured by providing (e.g., a first dose of) UV-L (e.g., providing (e.g., a first dose of) UV-L to the resin composition RC to form a pre-cured resin composition RC), and final curing can be achieved by providing (e.g., a second dose of) UV-L to the pre-cured resin composition RC. The resin composition RC may be finally cured to form the bonding member AP (see Figure 5C ).

[0155] Figure 5C It may be a cross-sectional view illustrating detachment of the adhesive member AP from the substrate CF. Figure 5C The substrate CF is passed through the initial bonding member P-AP (see Figure 5B ) provides UV-L (see Figure 5B ) and the adhesive member AP formed is detached.

[0156] refer to Figure 5A and Figure 5C In the presence of oxygen, the adhesive member AP formed by curing the resin composition RC according to the embodiment may have a 180° peel strength of about 800 gf / 25mm to about 2,000 gf / 25mm with respect to a glass substrate at about 25°C. For example, the adhesive member AP according to the embodiment may have a 180° peel strength of about 1,000 gf / 25mm to about 1,500 gf / 25mm with respect to a glass substrate at about 25°C. If (for example, when) the curable resin composition RC of the prior art is cured in the air in the presence of oxygen, the polymerization reaction of the resin composition RC is suppressed due to the presence of oxygen. Therefore, the adhesive member formed by curing the resin composition RC of the prior art in the presence of oxygen has low adhesion. Even when the resin composition RC according to an embodiment is cured in the presence of oxygen, the resin composition RC according to an embodiment includes the (meth)acrylate oligomer (A), the photoinitiator (B), the (meth)acrylate monomer (C), and the urethane (meth)acrylate oligomer (D) as described above, and thus can form an adhesive member AP having suitable or excellent adhesion reliability. That is, in an embodiment, even when the adhesive member AP is photocured in the presence of oxygen, the adhesive member AP according to the present disclosure can exhibit suitable or excellent 180° peel strength in a hot and humid environment (e.g., hot and humid).

[0157] The adhesive member AP formed by curing the resin composition RC according to the embodiment may have a storage modulus (G') of about 0.01 MPa to about 0.2 MPa at -20 ° C. In an embodiment, the resin composition RC has a low storage modulus (G') even after light curing, and therefore can exhibit appropriate or excellent adhesion reliability. Therefore, in the adhesive member AP formed by the resin composition RC, a lifting phenomenon does not occur at the interface, and therefore folding and unfolding can be easily performed. That is, the adhesive member AP formed by the resin composition RC remains firmly bonded to the adherend, and therefore can be easily and reliably folded and unfolded.

[0158] The detached adhesive member AP may be provided on the window WP (see Figure 4 ) on a surface or on a display module DM (see Figure 4 For example, one surface of the adhesive member AP is laminated on the surface of the window WP or on the surface of the display module DM, and the surface of the display module DM or the surface of the window WP that is not laminated with the one surface of the adhesive member AP may be adhered to the other surface of the adhesive member AP.

[0159] Figure 6A and Figure 6B Each is a cross-sectional view schematically showing a step of a method of manufacturing an adhesive member AP according to an embodiment of the present disclosure.

[0160] Figure 6A and Figure 6B For explanation and reference Figures 5A to 5C The method of manufacturing the bonding member AP is described in a cross-sectional view of a different manufacturing method. Figure 6A and Figure 6B In the description, no further explanation or reference will be made. Figures 1 to 5C The contents described are duplicated, and the differences will be mainly described.

[0161] refer to Figure 6A The resin composition RC can be directly provided on the display module DM (see Figure 6B ) on the surface or on the window WP (see Figure 6B ) on the surface. Figure 6A The resin composition RC is shown to be provided directly on the surface of the display module DM. The resin composition RC may have a shear viscosity of about 8 mPa·s to about 50 mPa·s at about 25° C. and about 10 rpm as measured in accordance with JIS Z8803, while covering the curved surface of the step SP-b in the display module DM (e.g., directly on the surface of the display module DM).

[0162] refer to Figure 6B , a window WP may be provided on the initial bonding member P-AP formed by applying the resin composition RC in a uniform thickness. Then, UV-L may be provided to the initial bonding member P-AP through the window WP. The initial bonding member P-AP is cured to form a bonding member AP (see Figure 4 ).

[0163] In an embodiment, UV-L is directly irradiated on the initial bonding member P-AP to form the bonding member AP (see Figure 4 Then, the bonding member AP ( Figure 4 ) provides window WP.

[0164] Figure 7 is a cross-sectional view illustrating a display device DD-a according to an embodiment of the present disclosure.

[0165] exist Figure 7 In the description of the display device DD-a explained in Figures 1 to 6B The contents described are duplicated, and the differences will be mainly described.

[0166] With reference Figure 3 and Figure 4 The display device DD described is compared to Figure 7 The display device DD-a illustrated in FIG may further include an optical control layer PP and an optical adhesive layer AP-a. The optical control layer PP according to an embodiment may be disposed between the adhesive member AP and the window WP. The optical adhesive layer AP-a according to an embodiment may be disposed between the optical control layer PP and the window WP.

[0167] The optical control layer PP is disposed on the display panel DP of the display module DM and thus may control light reflected on the display panel DP due to external light. The optical control layer PP may include, for example, a polarizer and / or a color filter layer.

[0168] The optical adhesive layer AP-a may be formed from the above-mentioned resin composition RC according to an embodiment. The optical adhesive layer AP-a may include a polymer derived from the resin composition RC according to an embodiment. The optical adhesive layer AP-a including the polymer derived from the resin composition RC may have a 180° peel strength of about 800 gf / 25mm to about 2,000 gf / 25 for a glass substrate or a polyethylene terephthalate (PET) film at about 25°C. The optical adhesive layer AP-a including the polymer derived from the resin composition RC may have a storage modulus (G') of about 0.01 MPa to about 0.2 MPa at about -20°C. Therefore, the optical adhesive layer AP-a including the polymer derived from the resin composition RC according to the embodiment has high adhesion properties and flexibility, and even when folding or bending operations are performed, no warping phenomenon occurs at the interface of the optical adhesive layer AP-a (for example, the adhesive layer AP-a does not fall off from the adherend), and therefore, appropriate or excellent adhesion reliability and folding properties can be obtained (for example, exhibited).

[0169] The display device DD-a according to the embodiment may include an optical adhesive layer AP-a and an adhesive member AP each including a polymer derived from the resin composition RC according to the embodiment. The display device DD-a including the optical adhesive layer AP-a and the adhesive member AP may exhibit adequate or excellent reliability during operations such as folding.

[0170] Figure 8 A cross section of a display device DD-b is illustrated for explaining an embodiment of the present disclosure.

[0171] exist Figure 8 In the description of the display device DD-b according to the embodiment explained in Figures 1 to 7 The contents described are duplicated, and the differences will be mainly described.

[0172] With reference Figure 3 and Figure 4 The display device DD described is compared to Figure 8 The display device DD-b illustrated in FIG may further include an optical control layer PP, an optical adhesive layer AP-a, and an interlayer adhesive layer PIB. The optical control layer PP according to an embodiment may be disposed between the adhesive member AP and the window WP. The optical adhesive layer AP-a according to an embodiment may be disposed between the optical control layer PP and the window WP.

[0173] In the display device DD-b according to the embodiment, the adhesive member AP may be arranged between the display panel DP and the input sensing part TP. That is, the input sensing part TP may not be arranged directly on the display panel DP, and the display panel DP and the input sensing part TP may be bonded together by the adhesive member AP. For example, the adhesive member AP may be arranged on the encapsulation layer TFE (see FIG. 1 ) of the display panel DP. Figure 4 ) and the input sensing part TP.

[0174] An interlayer adhesive layer (PIB) may be provided below the optical control layer PP. The interlayer adhesive layer (PIB) may be disposed between the input sensing portion TP and the optical control layer PP and may be formed from an adhesive material having suitable or excellent moisture resistance (e.g., moisture resistance). For example, the interlayer adhesive layer (PIB) may include polyisobutylene. The interlayer adhesive layer (PIB) may be disposed on the input sensing portion TP and may prevent or reduce corrosion of the sensing electrodes.

[0175] The display device DD-b according to the embodiment may include the optical adhesive layer AP-a and the adhesive member AP each including a polymer derived from the resin composition RC, and may exhibit appropriate or excellent reliability during operations such as folding.

[0176] Hereinafter, with reference to Examples and Comparative Examples, an adhesive member and a display device formed of a resin composition according to an embodiment of the present disclosure will be described in more detail. In addition, the Examples described below are only for understanding the present disclosure, and the scope of the present disclosure is not limited thereto.

[0177] Example

[0178] 1. Synthesis of (meth)acrylate oligomer (A)

[0179] (Meth)acrylate oligomers (A) A-1, A-2, A-3, and A-4 provided for the resin compositions according to Examples and Comparative Examples were synthesized by the following method. (Meth)acrylate oligomers (A) A-1, A-2, and A-3 are each (meth)acrylate oligomers (A) of Examples, and (meth)acrylate oligomer (A) A-4 is (meth)acrylate oligomer (A) of Comparative Example. Herein, "(meth)acrylate oligomer (A) A-1," "(meth)acrylate oligomer (A) A-2," "(meth)acrylate oligomer (A) A-3," and "(meth)acrylate oligomer (A) A-4" may be referred to as "A-1," "A-2," "A-3," and "A-4," respectively.

[0180] In the synthetic examples, the molecular weight (e.g., weight average molecular weight) and the molecular weight distribution value were measured by using a gel permeation chromatography (GPC) analyzer HLC-8420GPC manufactured by TOSHO Corporation. Using TSKgel SUPER HZM-N as a measuring column, the weight average molecular weight (Mw) and the molecular weight distribution value were obtained by converting the size exclusion chromatography (SEC) curve detected by a refractive index (RI) detector into a standard polystyrene (PS).

[0181] The NMR spectrum was obtained using a nuclear magnetic resonance (NMR) analysis device AVANCE III 300M manufactured by Bruker, and the copolymer composition ratio was calculated using the integrated ratio of the measured signals of each monomer component based on the obtained NMR spectrum. In addition, deuterated chloroform (manufactured by KANTO CHEMICAL CO. INC.) was used as a universal solvent in the measurement.

[0182] (1) Synthesis of (meth)acrylate oligomer (A) A-1

[0183] 40 ml of toluene was added to a round flask equipped with a cooling tube, a dropping funnel, a nitrogen introduction tube and a magnetic stirrer, and the solvent was deoxygenated by stirring at room temperature for 30 minutes while nitrogen bubbling was performed.

[0184] The obtained solvent was heated in an oil bath until the internal temperature reached approximately 90° C. Next, a homogeneous solution prepared in advance was added to a dropping funnel: 4 g of a siloxane monomer (FM-0711 manufactured by JNC Corporation) as a first polymerizable monomer, 15.2 g of methyl methacrylate (MMA, Tokyo Kasei Kogyo Co., Ltd.), 8.9 g of isobornyl methacrylate (IBXMA, Tokyo Chemical Industry), and 0.5 g of 2-hydroxyethyl methacrylate (2-HEMA, Tokyo Chemical Industry) as a second polymerizable monomer, 1.2 g of V-601 (Fujifilm Wako Pure Chemical) as a thermal polymerization initiator, and 10 ml of toluene. The stopcock of the dropping funnel was opened, and the homogeneous solution in the dropping funnel was slowly dripped into the round flask over 1 hour, and the mixture was then stirred for 1 hour to perform a polymerization reaction.

[0185] Next, 600 ml of a 58 vol% aqueous ethanol solution (Fujifilm Wako Pure Chemical) was added to a 1000 ml beaker and stirred with a magnetic stirrer. The polymerization solution in the round flask was added dropwise to the mixture to obtain a precipitate. The precipitate was filtered with suction, and the resulting solid was rinsed and filtered with a 58 vol% ethanol solution (Fujifilm Wako Pure Chemical) to remove toluene and unreacted monomers, resulting in a residue. The residue was dried under reduced pressure to obtain a white powder of the (meth)acrylate oligomer (A)A-1, a copolymer.

[0186] The (meth)acrylate oligomer (A)A-1 had a weight average molecular weight of 10,800 g / mol and a molecular weight distribution of 1.42. The copolymer composition weight ratio of the (meth)acrylate oligomer (A)A-1 was MMA:IBXMA:2-EHMA:FM-0711 = 76.7:18.5:2.6:2.2.

[0187] (2) Synthesis of (meth)acrylate oligomer (A) A-2

[0188] In order to introduce a (meth)acrylate group at the terminal of (meth)acrylate oligomer (A)A-1, the following process was performed: 5 g of (meth)acrylate oligomer (A)A-1, 20 ml of toluene, 2.0 mg of dibutyltin dilaurate (FUJIFILM Wako Pure Chemical), and 0.40 g of isocyanateethyl methacrylate (IEM) were added to a round flask equipped with a cooling tube and a magnetic stirrer, and the mixture was reacted by heating in an oil bath until the internal temperature reached approximately 60°C.

[0189] Next, 600 ml of a 58 vol% aqueous ethanol solution (Fujifilm Wako Pure Chemical) was added to a 1000 ml beaker and stirred with a magnetic stirrer. The reacted solution in the round flask was added dropwise to the mixture to obtain a precipitate. The precipitate was filtered by suction, and the resulting solid was rinsed and filtered with a 58 vol% ethanol solution (Fujifilm Wako Pure Chemical) to remove the reaction solvent and unreacted monomers, resulting in a residue. The residue was dried under reduced pressure to obtain a white (meth)acrylate oligomer (A)A-2 powder, which was a copolymer.

[0190] The (meth)acrylate oligomer (A)A-2 had a weight average molecular weight of 11,000 g / mol and a molecular weight distribution value of 1.42. 1 H NMR) was used to examine the introduction of (meth)acrylate groups.1 The peaks of the obtained (meth)acrylate (A) A-2 by H NMR examination are as follows. Tetramethylsilane (TMS) was used as 1 Reference substances for H NMR measurements, 1 H NMR was measured at a resonance frequency of 300 MHz, and chemical shift values were expressed by δ (ppm).

[0191] A-2 1 H NMR values (TMS, 300 MHz) δ: 5.6 and 6.2

[0192] (3) Synthesis of (meth)acrylate oligomer (A) A-3

[0193] 40 ml of toluene was added to a round flask equipped with a cooling tube, a dropping funnel, a nitrogen introduction tube and a magnetic stirrer, and the solvent was deoxygenated by stirring at room temperature for 30 minutes while nitrogen bubbling was performed.

[0194] The obtained solvent was heated in an oil bath until the internal temperature reached approximately 90° C. Next, a homogeneous solution prepared in advance was added to a dropping funnel: 4.2 g of a siloxane monomer (TM-0701T manufactured by JNC Corporation) as a first polymerizable monomer, 15.0 g of methyl methacrylate (MMA, Tokyo Kasei Kogyo Co. Ltd.), 8.9 g of isobornyl methacrylate (IBXMA, Tokyo Chemical Industry) and 0.5 g of 2-hydroxyethyl methacrylate (2-HEMA, Tokyo Chemical Industry) as a second polymerizable monomer, 1.4 g of V-601 (Fujifilm Wako Pure Chemical) and 10 ml of n-butyl acetate as a thermal polymerization initiator. The stopcock of the dropping funnel was opened, and the homogeneous solution in the dropping funnel was slowly dripped into the round flask over 1 hour, and the mixture was then stirred for 1 hour to perform a polymerization reaction.

[0195] Next, 600 ml of a 58 vol% aqueous ethanol solution (Fujifilm Wako Pure Chemical) was added to a 1000 ml beaker and stirred with a magnetic stirrer. The polymerization solution in the round flask was added dropwise little by little to obtain a precipitate. The precipitate was filtered by suction, and the resulting solid was rinsed and filtered with a 58 vol% ethanol solution (Fujifilm Wako Pure Chemical) to remove n-butyl acetate and unreacted monomers, thereby obtaining a residue. The residue was dried under reduced pressure to obtain a white (meth)acrylate oligomer (A) A-3 powder as a copolymer.

[0196] (Meth)acrylate oligomer (A) A-3 has a weight average molecular weight of 10,800 g / mol and a molecular weight distribution of 1.42. The copolymer composition weight ratio of (meth)acrylate oligomer (A) A-3 is MMA: IBXMA: 2-EHMA: TM-0701T = 75.6: 18.3: 2.1: 4.0.

[0197] (4) Synthesis of (meth)acrylate oligomer (A) A-4

[0198] 40 ml of toluene was added to a round flask equipped with a cooling tube, a dropping funnel, a nitrogen introduction tube and a magnetic stirrer, and the solvent was deoxygenated by stirring at room temperature for 30 minutes while nitrogen bubbling was performed.

[0199] The obtained solvent was heated in an oil bath until the internal temperature reached approximately 90° C. Next, a homogeneous solution prepared in advance was added to a dropping funnel: 14.1 g of methyl methacrylate (MMA, Tokyo Kasei Kogyo Co. Ltd.), 11.1 g of isobornyl methacrylate (IBXMA, Tokyo Chemical Industry), 1.1 g of V-601 (Fujifilm Wako Pure Chemical) as a thermal polymerization initiator, and 10 ml of n-butyl acetate. The stopcock of the dropping funnel was opened, and the homogeneous solution in the dropping funnel was slowly dripped into the round flask over 1 hour, and the mixture was then stirred for 1 hour to perform a polymerization reaction.

[0200] Next, 600 ml of a 58 vol% aqueous ethanol solution (Fujifilm Wako Pure Chemical) was added to a 1000 ml beaker and stirred with a magnetic stirrer. The polymerization solution in the round flask was added dropwise little by little to obtain a precipitate. The precipitate was filtered by suction, and the resulting solid was rinsed and filtered with a 58 vol% ethanol solution (Fujifilm Wako Pure Chemical) to remove toluene and unreacted monomers, obtaining a residue. The residue was dried under reduced pressure to obtain a white (meth)acrylate oligomer (A) A-4 powder as a copolymer.

[0201] The (meth)acrylate oligomer (A) A-4 had a weight average molecular weight of 6,400 g / mol and a molecular weight distribution of 1.49. The copolymer composition weight ratio of the (meth)acrylate oligomer (A) A-4 was MMA:IBXMA=76.9:23.1.

[0202] 2. Production of resin composition

[0203] The resin compositions according to the examples were produced by mixing each material listed in Table 1. Each material was placed in a light-shielding plastic container in an amount by mass (g) according to Table 1 and Table 2, and the mixture was stirred at room temperature to produce resin compositions according to Examples 1 to 5 and Comparative Examples 1 to 5.

[0204] Table 1

[0205]

[0206] Table 2

[0207]

[0208] Materials in Tables 1 and 2

[0209] Omnirad 819: Phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (made by IGM Resins)

[0210] 4-HBA: 4-Hydroxybutyl acrylate (manufactured by Osaka Organic Chemical Industry Ltd.)

[0211] EHDG-AT: 2-ethylhexyl ether acrylate diethylene glycol (manufactured by Kyoeisha Chemical Co., Ltd.)

[0212] 2-EHA: 2-ethylhexyl acrylate (manufactured by Toagosei)

[0213] THF-A: Tetrahydrofurfuryl acrylate (manufactured by Kyoeisha Chemical Co. Ltd.)

[0214] IDAA: Isodecyl acrylate (manufactured by Osaka Organic Chemical Industry Ltd.)

[0215] UF-C051: Urethane acrylate (weight average molecular weight: 35,000 g / mol, manufactured by Kyoeisha Chemical Co. Ltd.)

[0216] UF-C052: Urethane acrylate (weight average molecular weight: 10,000 g / mol, manufactured by Kyoeisha Chemical Co. Ltd.)

[0217] UN6304: Urethane acrylate (weight average molecular weight: 10,000 g / mol, manufactured by Negami Chemical Industrial Co. Ltd.)

[0218] SAG008: Silicone surfactant (weight average molecular weight: 10,000 g / mol, manufactured by Nissan Chemical Corporation)

[0219] S-656: Fluorine-based surfactant (weight average molecular weight: 10,000 g / mol, manufactured by AGC SEIMI CHEMICAL)

[0220] 3. Manufacturing of bonded components (test samples)

[0221] Each of the above resin compositions was applied on soda lime glass (Central Glass Co. Ltd.) by an inkjet printer (manufactured by MicroJet Technology Co. Ltd.) to have a thickness of about 50 μm.

[0222] In the presence of oxygen, UV light was irradiated onto the soda-lime glass to which the resin composition was applied using UV LED lamps having a peak wavelength of about 405 nm and a peak wavelength of about 365 nm, respectively, so that the accumulated light dose (e.g., amount) was about 220 mJ / cm 2 and about 380mJ / cm 2 .

[0223] A polyethylene terephthalate (PET) film (TOYOBO CO. LTD., product name A4360, thickness 50 μm) pre-cut into approximately 20 mm × 150 mm was bonded to the UV-irradiated soda-lime glass under a bonding pressure of 0.15 MPa. UV light was then irradiated using a UV lamp having a peak wavelength of approximately 396 nm so that the accumulated light dose (e.g., amount) was approximately 4,000 mJ / cm 2 to obtain samples.

[0224] 4. Evaluation of the properties of the resin composition and the bonded component

[0225] The surface tension of the (meth)acrylate monomer (C) in each of the resin compositions according to Examples and Comparative Examples, the shear viscosity of each resin composition, and the 180° peel strength of an adhesive member including the resin composition were evaluated, and the results are listed in Table 2 below.

[0226] (Evaluation of Surface Tension of (Meth)Acrylate Monomer (C) in Resin Composition)

[0227] The surface tension of the (meth)acrylate monomer (C) in each of the resin compositions was measured by a pendant drop method using a contact angle meter (Kyowa Interface Science Co., Ltd. DMo-601).

[0228] (Evaluation of shear viscosity of resin composition)

[0229] The shear viscosity of each resin composition was measured in accordance with JIS Z8803 at 25° C. The shear viscosity of each resin composition was measured using a viscometer TVE-25L (manufactured by TOKISANGYO) at a speed of 10 rpm.

[0230] (Evaluation of Spreading Wettability of Resin Composition)

[0231] The spreading wettability of each resin composition was measured in the following manner. A 2 μL droplet was placed on a PET film (TOYOBOCO. LTD., product name A4360, thickness 50 μm). The droplet was then observed after 60 seconds, and a droplet that maintained a circular shape was marked with an O, while a droplet that did not maintain a circular shape was marked with an X.

[0232] (180° peel strength evaluation of bonded components)

[0233] In order to evaluate the 180° peel strength of the adhesive member, the sample was tested at a peel angle of 180° and a speed of 300 mm / min at 25°C, and the 180° peel strength was measured by using a universal testing machine (Instron Corporation, product type 5965). The average peel strength value of about 50 mm peeling was calculated, and the average peel strength value was multiplied by 1.25 to evaluate the 180° peel strength for a width of 25 mm.

[0234] Table 3

[0235]

[0236] With reference to Table 1 and Table 3, the resin compositions according to Examples 1 to 5 include A-1, A-2 or A-3 as the (meth)acrylate oligomer (A) according to the present disclosure. Each of the resin compositions according to Examples 1 to 5 includes a (meth)acrylate oligomer (A) comprising a siloxane skeleton. In addition, each of the resin compositions according to Examples 1 to 5 includes a (meth)acrylate monomer (C) of the present disclosure, specifically, a first monomer having a surface tension of about 20 mN / m to about 30 mN / m. The resin compositions according to Examples 1 to 5 have a shear viscosity of about 8 mPa·s to about 50 mPa·s at 25°C. In contrast, with reference to Table 2 and Table 3, the resin compositions according to Comparative Examples 1, 3 and 4 do not include a (meth)acrylate oligomer (A). The resin composition according to Comparative Example 2 includes A-4, which does not correspond to an embodiment of the present disclosure, as a (meth)acrylate oligomer (A). The A-4 contained in the resin composition according to Comparative Example 2 does not include a siloxane skeleton. In addition, the resin composition according to Comparative Example 5 includes A-1, which is a (meth)acrylate oligomer (A) including a siloxane skeleton according to the present disclosure, but does not include the (meth)acrylate monomer (C) according to the present disclosure. Specifically, the resin composition according to Comparative Example 5 does not include a first monomer having a surface tension of about 20 mN / m to about 30 mN / m, and only includes a (meth)acrylate monomer having a surface tension greater than about 30 mN / m. The resin composition according to Comparative Example 5 has a shear viscosity greater than about 50 mPa·s at 25°C.

[0237] With reference to Tables 1 to 3, it can be confirmed that in the case of Examples 1 to 5, when an ink formed of a resin composition including the above-mentioned material combination is provided, appropriate or excellent discharge characteristics and / or high application reliability and adhesion reliability on a glass substrate are obtained (or shown). Therefore, when an adhesive member applied to a flexible display device is formed of the resin composition according to the embodiment, its durability and folding characteristics can be improved.

[0238] As can be seen, the resin compositions according to Examples 1 to 5 each have a shear viscosity of about 8 mPa·s to about 50 mPa·s at 25° C., as measured according to JIS Z8803. Therefore, when the resin composition according to an embodiment of the present disclosure is provided by an inkjet printing method, the resin composition can be stably discharged and applied with a uniform thickness.

[0239] It can be seen that the adhesive member formed of each of the resin compositions according to Examples 1 to 5 has a 180° peel strength of about 800 gf / 25 mm to about 2,000 gf / 25 mm. Therefore, the adhesive member including the resin composition according to the embodiment of the present disclosure can have appropriate or excellent adhesion reliability.

[0240] It can be seen that each of the first monomers of the (meth)acrylate monomer (C) in the resin compositions according to Examples 1 to 5 has a surface tension of about 20 mN / m to about 30 mN / m. It can be seen that the spreading wettability of each of the resin compositions according to Examples 1 to 5 is marked as 0. Therefore, when the resin composition according to an embodiment of the present disclosure is provided on a glass substrate and / or a PET film, etc. by an inkjet printing method, the resin composition according to the embodiment can be applied with a uniform thickness without deteriorating the applied shape while maintaining appropriate or excellent adhesion reliability.

[0241] In contrast, the resin composition according to Comparative Example 1 does not include the (meth)acrylate oligomer (A), and in the case of the resin composition according to Comparative Example 2, the (meth)acrylate oligomer (A) does not include a siloxane skeleton. It can be seen that the spreading wettability of each of the resin compositions according to Comparative Examples 1 and 2 is marked as X. It can be confirmed that the resin compositions according to Comparative Examples 1 and 2 do not include the (meth)acrylate oligomer (A), or the (meth)acrylate oligomer (A) does not include a siloxane skeleton, and therefore, when the resin composition is provided on a glass substrate and / or a PET film, etc. by an inkjet printing method, the application uniformity (for example, uniformity of the deposited layer) is reduced.

[0242] The resin composition according to Comparative Examples 3 and 4 does not include (meth) acrylate oligomer (A), but includes a surfactant. Wherein, the surfactant is a silicon-based surfactant or a fluorine-based surfactant. It can be seen that the resin composition according to Comparative Examples 3 and 4 has a spreading wettability marked as O, and the bonding member formed by the resin composition according to Comparative Examples 3 and 4 has a 180° peel strength of less than about 800gf / 25mm at 25°C. The resin composition according to Comparative Examples 3 and 4 includes a surfactant, and therefore when provided on a glass substrate and / or a PET film, etc. by an inkjet printing method, the resin composition can be applied with a uniform thickness. However, it can be determined that the bonding member formed by the resin composition according to Comparative Examples 3 and 4 does not include a (meth) acrylate oligomer (A) with a siloxane skeleton, and therefore has low adhesion.

[0243] The resin composition according to Comparative Example 5 includes a (meth) acrylate oligomer (A) having a siloxane skeleton, but does not include a first monomer having a surface tension of about 20mN / m to about 30mN / m. In addition, the resin composition according to Comparative Example 5 has a shear viscosity greater than about 50mPa·s at 25°C. Therefore, it can be seen that the resin composition according to Comparative Example 5 has a spreading wettability marked as X, and the adhesive member formed by the resin composition according to Comparative Example 5 has a 180° peel strength of less than about 800gf / 25mm at 25°C. It is determined that the resin composition according to Comparative Example 5 does not include a (meth) acrylate monomer (C) comprising a first monomer, and therefore when the resin composition is provided on a glass substrate and / or a PET film, etc. by an inkjet printing method, the application uniformity (e.g., the uniformity of the deposited adhesive layer) is reduced. In addition, it was confirmed that the resin composition according to Comparative Example 5 had a shear viscosity greater than about 50 mPa·s at 25° C., making it difficult to discharge the resin composition and causing an adhesive member including the resin composition to have reduced adhesion reliability.

[0244] According to the resin composition of the embodiment of the present disclosure, at least one (meth) acrylate oligomer (A) including a siloxane skeleton, at least one photoinitiator (B), at least one (meth) acrylate monomer (C) having a surface tension of about 20mN / m to about 30mN / m, and at least one urethane (meth) acrylate oligomer (D). According to the JIS Z8803 standard, the resin composition according to the embodiment of the present disclosure may have a shear viscosity of about 8mPa·s to about 50mPa·s at 25°C. Therefore, the resin composition according to the embodiment may exhibit appropriate or excellent discharge stability, and the adhesive member formed by the resin composition according to the embodiment may exhibit appropriate or excellent application uniformity while maintaining appropriate or excellent viscosity. According to the display device of the embodiment of the present disclosure, an adhesive member may be arranged between the display panel and the window. The adhesive member may include a polymer derived from the resin composition according to the embodiment. Therefore, even when performing operations such as folding / unfolding, the display device including the adhesive member according to the embodiment may also exhibit appropriate or excellent adhesion reliability.

[0245] According to the foregoing, the resin composition according to the present disclosure may have appropriate or excellent discharge stability, application uniformity, and adhesive strength.

[0246] In addition, the display device according to the present disclosure includes a bonding member having appropriate or excellent bonding strength, and therefore can have appropriate or excellent reliability in various operating states. In other words, the resin composition described in the present disclosure includes a specific (meth)acrylate oligomer, a photoinitiator and a (meth)acrylate monomer, resulting in excellent discharge stability and bonding strength. It has a shear viscosity of about 8mPa·s to about 50mPa at 25°C, which ensures uniform application and strong adhesion. The display device including the bonding member derived from the resin composition maintains high reliability and adhesion even during operations such as folding and unfolding, making it suitable for various operating states.

[0247] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, expressions such as "at least one of a, b and c," "at least one selected from a, b and c," "at least one selected from the group consisting of a, b and c," "at least one from among a, b, and c," "at least one from among a, b, and c," and "at least one of a to c" and the like indicate only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0248] As used herein, the terms "use," "using," and "used" may be considered synonymous with the terms "utilize," "utilizing," and "utilized," respectively. When describing embodiments of the present inventive concept, the use of "may" refers to "one or more embodiments of the present inventive concept."

[0249] In the present disclosure, and unless otherwise limited, "not including one or any "component"", "excluding one or any "component"" and / or "without..."a "component"", etc. means that the "component" is not added, selected or used as a component in the formula / composition / structure, but due to other impurities and / or external factors, less than an appropriate amount of the "component" may still be included.

[0250] As used herein, the term "about" and similar terms are used as terms of approximation rather than as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that one skilled in the art will recognize. As used herein, "about" is inclusive of the stated value and means within an acceptable range of deviations for the particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0251] Furthermore, any numerical range set forth in this article is intended to include all subranges of the same numerical precision included in the range of the description. For example, the range of "1.0 to 10.0" is intended to include between the minimum value 1.0 of description and the maximum value 10.0 of description (and including the minimum value 1.0 of description and the maximum value 10.0 of description), that is, all subranges with a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit set forth in this article is intended to include all lower numerical limits included therein, and any minimum numerical limit set forth in this specification is intended to include all higher numerical limits included therein. Accordingly, the applicant reserves the right to amend this specification (including claims) to explicitly set forth any subrange included in the range explicitly set forth herein.

[0252] The display manufacturing device, display device and / or any other related device or component according to the embodiments of the present disclosure described herein can be implemented using any appropriate hardware, firmware (e.g., an application-specific integrated circuit), software, or a combination of software, firmware, and hardware. For example, the various components of the device can be formed on an integrated circuit (IC) chip or on separate IC chips. Further, the various components of the device can be implemented on a flexible printed circuit film, a tape carrier package (TCP), or a printed circuit board (PCB), or formed on a substrate. Further, the various components of the device can be processes or threads running on one or more processors in one or more computing devices, executing computer program instructions and interacting with other system components to perform the various functions described herein. The computer program instructions are stored in a memory that can be implemented in a computing device using a standard storage device (such as, for example, a random access memory (RAM)). The computer program instructions can also be stored in other non-transitory computer-readable media such as, for example, a CD-ROM or a flash drive. Those skilled in the art will also recognize that, without departing from the scope of the present disclosure, the functions of each computing device can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed on one or more other computing devices.

[0253] Thus far, although certain embodiments of the present disclosure have been described, it should be understood that the present invention should not be limited to these embodiments, but that a person skilled in the art may make various appropriate changes and modifications within the spirit and scope of the claimed disclosure and its equivalents.

[0254] Therefore, the technical scope of the present disclosure is not intended to be limited to what is stated in the detailed description of the specification, but is intended to be defined by the claims and their equivalents.

Claims

1. A display device, comprising: Display panel; a window on the display panel; as well as an adhesive member between the display panel and the window, wherein the bonding member comprises a polymer derived from a resin composition, The resin composition comprises: a (meth)acrylate oligomer (A) comprising a siloxane skeleton; Photoinitiator (B); (meth)acrylate monomers (C) including a first monomer having a surface tension of 20 to 30 mN / m and represented by Formula 1; and urethane (meth)acrylate oligomer (D), and The resin composition has a shear viscosity of 8 to 50 mPa·s at 25° C. In formula 1, R1 is a hydrogen atom or a substituted or unsubstituted methyl group, and R2 is a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms.

2. The display device according to claim 1, wherein the (meth)acrylate oligomer (A) is synthesized using a first polymerizable monomer represented by Formula 2-1 or Formula 2-2: in, In formula 2-1 and formula 2-2, R3 and R5 are each independently a hydrogen atom or a substituted or unsubstituted methyl group, R4 and R6 are each independently a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, R7 is a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, and n is an integer from 0 to 20.

3. The display device according to claim 2, wherein: In formula 2-1: R3 is unsubstituted methyl; and R4 is an unsubstituted n-propylene group.

4. The display device according to claim 2, wherein In formula 2-2: R5 is an unsubstituted methyl group; R6 is unsubstituted n-propylene; and R7 is unsubstituted n-butyl.

5. The display device according to claim 2, wherein: The (meth)acrylate oligomer (A) is synthesized from the first polymerizable monomer and a second polymerizable monomer different from the first polymerizable monomer; and The second polymerizable monomer includes at least one selected from the group consisting of methyl methacrylate, isobornyl methacrylate, and 2-hydroxyethyl methacrylate. 6 . The display device according to claim 1 , wherein the first monomer comprises 2-ethylhexyl acrylate and / or isodecyl acrylate.

7. The display device according to claim 6, wherein: The (meth)acrylate monomer (C) further includes a second monomer different from the first monomer; and The second monomer includes at least one selected from the group consisting of 4-hydroxybutyl acrylate, tetrahydrofurfuryl acrylate, and diethylene glycol 2-ethylhexyl ether acrylate. The display device according to claim 1 , wherein the resin composition is a solvent-free composition. 9 . The display device according to claim 1 , wherein the (meth)acrylate oligomer (A) has a weight average molecular weight of 4,000 to 20,000 g / mol. 10 . The display device according to claim 1 , wherein the (meth)acrylate monomer (C) has a weight average molecular weight of 400 to 1,500 g / mol. 11 . The display device according to claim 1 , wherein the urethane (meth)acrylate oligomer (D) has a weight average molecular weight of 8,000 g / mol to 50,000 g / mol.

12. The display device according to claim 1, wherein Based on 100 weight percent of the total of the resin composition: The amount of the (meth)acrylate oligomer (A) is 1 wt % to 15 wt %; The amount of the photoinitiator (B) is 1 wt% to 10 wt%; The amount of the (meth)acrylate monomer (C) is 50 wt % to 90 wt %; and The amount of the urethane (meth)acrylate oligomer (D) is 1 wt % to 25 wt %. 13 . The display device according to claim 1 , wherein the photoinitiator (B) comprises a radical polymerizable initiator. 14 . The display device according to claim 1 , wherein the bonding member has a storage modulus of 0.2 MPa or less at −20° C. 15 . The display device according to claim 1 , wherein the adhesive member has a 180° peel strength of 800 gf / 25 mm or more at 25° C. with respect to a glass substrate or a polyethylene terephthalate film. 16 . The display device according to claim 1 , wherein the adhesive member is formed by directly depositing the resin composition onto a surface of the window or a surface of the display panel, and then UV curing the resin composition. 17 . The display device of claim 1 , further comprising an input sensing portion, wherein the adhesive member is between the display panel and the input sensing portion or between the input sensing portion and the window.

18. The display device according to claim 17, The display panel includes a display element layer and an encapsulation layer on the display element layer. The input sensing portion is directly on the packaging layer, and The adhesive member is on the input sensing portion.

19. The display device according to claim 1, further comprising: an optical control layer between the bonding member and the window; as well as an optical adhesive layer between the optical control layer and the window, The optical adhesive layer includes a polymer derived from the resin composition.

20. The display device according to claim 1, wherein The display device includes at least one folding axis, and At least a portion of the display device is folded relative to the folding axis.

21. A resin composition comprising: a (meth)acrylate oligomer (A) comprising a siloxane skeleton; Photoinitiator (B); (meth)acrylate monomer (C) including a first monomer having a surface tension of 20 to 30 mN / m and represented by Formula 1; as well as Urethane (meth)acrylate oligomer (D), The resin composition has a shear viscosity of 8 to 50 mPa·s at 25° C. In formula 1, R1 is a hydrogen atom or a substituted or unsubstituted methyl group, and R2 is a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms.

Images