Evaporation device, display panel production equipment and display panel

Abstract

The invention provides an evaporation device, display panel production equipment and a display panel. The evaporation device comprises an evaporation cavity, a carrying track, an electrostatic adsorption part and a limiting part, and the carrying track penetrates through the evaporation cavity; the electrostatic adsorption part is movably connected to the carrying track, the electrostatic adsorption part moves on the carrying track in a first posture, the electrostatic adsorption part is used for adsorbing the to-be-evaporated backboard to the adsorption surface, and when the electrostatic adsorption part is in the first posture, the adsorption surface extends in the vertical direction; the limiting part is movably mounted on the electrostatic adsorption part so as to be capable of reciprocating between a limiting position and an avoiding position relative to the adsorption surface, the limiting part is far away from the adsorption surface when being located at the avoiding position, and the limiting part can be in contact with the outer surface of the to-be-evaporated backboard on the adsorption surface when being located at the limiting position. Therefore, by arranging the limiting piece, the problem that the back plate to be evaporated is separated from the electrostatic adsorption piece due to self weight when the electrostatic adsorption force is unreliable can be solved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of evaporation equipment, and in particular to an evaporation device, display panel production equipment, and a display panel. Background Art

[0002] An evaporation device utilizes physical vapor deposition (PVD) technology. It heats the material to be evaporated through an internal evaporation source, causing it to evaporate and deposit onto the substrate surface, forming a thin film. The evaporation source primarily consists of a crucible, a heating structure, and an insulation chamber. The crucible holds the material to be evaporated, while the heating structure heats the crucible, causing it to evaporate. The crucible is equipped with an evaporation nozzle, which vaporizes the material at high temperature and then propels it toward the substrate surface.

[0003] In the prior art, the evaporation device includes a conveying mechanism and a carrying unit that are interconnected. The carrying unit includes a carrying surface. The carrying unit can adsorb the back panel to be evaporated in a roughly vertical direction on the carrying surface by electrostatic adsorption. The conveying mechanism sends the back panel to be evaporated into or out of the evaporation chamber through the adsorption unit.

[0004] Since the back panel to be evaporated is electrostatically adsorbed to the supporting surface in a roughly vertical direction, during the transportation or evaporation process of the back panel to be evaporated, it is easy for the electrostatic adsorption force to be unable to counteract the weight of the back panel to be evaporated, causing the back panel to be evaporated to detach from the supporting surface, thereby increasing the risk of the back panel to be evaporated being broken and the equipment being shut down. Summary of the Invention

[0005] In order to solve the above problems, embodiments of the present application provide an evaporation device, a display panel production device, and a display panel to at least partially solve the above problems.

[0006] In a first aspect, the present application provides an evaporation device, comprising:

[0007] evaporation chamber;

[0008] A carrying track passing through the evaporation chamber;

[0009] An electrostatic adsorbent is movably connected to the transport track, and moves on the transport track in a first posture to reach a loading position, a vapor deposition position, or an unloading position, wherein the loading position and the unloading position are located outside the vapor deposition chamber, and the vapor deposition position is located inside the vapor deposition chamber. The electrostatic adsorbent includes an adsorption surface, and is used to adsorb the backplane to be vapor-deposited on the adsorption surface. When the electrostatic adsorbent is in the first posture, the adsorption surface extends in a vertical direction.

[0010] A limiting member is movably mounted on the electrostatic adsorption member so as to be able to move back and forth between a limiting position and an avoidance position relative to the adsorption surface. When in the avoidance position, the limiting member is away from the adsorption surface to allow the back plate to be evaporated to be adsorbed on the adsorption surface. When in the limiting position, the limiting member can contact the outer surface of the back plate to be evaporated on the adsorption surface.

[0011] In an optional embodiment, the electrostatic adsorption component in the first posture includes relative upper and lower ends along the vertical direction, and the limiting component is arranged at the lower end of the electrostatic adsorption component; preferably, the electrostatic adsorption component in the first posture includes relative upper and lower ends along the vertical direction, and the limiting component is arranged at the upper and lower ends of the electrostatic adsorption component.

[0012] In an optional embodiment, there are multiple limit members, and at least two of the limit members are located at the corners of the back panel to be evaporated which is adsorbed by the electrostatic adsorption member; preferably, there are multiple limit members, which are distributed at intervals around the electrostatic adsorption member.

[0013] In an optional embodiment, the evaporation device also includes a driving component, the driving component includes a first telescopic member and a second telescopic member, the first telescopic member includes a first telescopic end and a first fixed end relative to each other, the first telescopic end can be extended and retracted relative to the first fixed end, the second telescopic member includes a second telescopic end and a second fixed end relative to each other, the second telescopic end can be extended and retracted relative to the second fixed end; the first telescopic end is connected to the limiting member, the first fixed end is connected to the second telescopic end, and the second fixed end is connected to the electrostatic adsorption member; wherein, the telescopic direction of the first telescopic end is parallel to the adsorption surface, and the telescopic direction of the second telescopic end is perpendicular to the adsorption surface.

[0014] In an optional embodiment, the limiting member includes a contact limiting surface for contacting the outer surface of the back plate to be evaporated on the adsorption surface, and at least the material of the contact limiting surface includes antistatic material.

[0015] In an optional embodiment, the material of the contact limiting surface includes a flexible material.

[0016] In an optional embodiment, the limiting member includes a contact limiting surface for contacting the outer surface of the back plate to be evaporated on the adsorption surface, and the shape of the contact limiting surface is circular or elliptical.

[0017] In an optional embodiment, the evaporation device includes a magnetic levitation drive mechanism, which is installed on the transport track and / or the electrostatic adsorption component to drive the limiting component to move along the transport track.

[0018] In an optional embodiment, the evaporation device also includes an evaporation source, which is located in the evaporation chamber. When the electrostatic adsorption component is located at the evaporation position in the first posture, the evaporation source and the electrostatic adsorption component are spaced apart along a first direction, the first direction is perpendicular to the vertical direction, and the evaporation nozzle of the evaporation source is facing the surface to be evaporated of the back panel to be evaporated.

[0019] In an optional embodiment, the evaporation source includes multiple groups of evaporation nozzles and multiple crucibles, the crucibles are used to hold and heat the evaporation materials, the multiple groups of evaporation nozzles are spaced apart in the vertical direction, and the multiple crucibles are spaced apart in the vertical direction, and each crucible and each group of evaporation nozzles are connected one by one.

[0020] In an optional embodiment, the evaporation source further includes a plurality of gas collecting chambers, each of the gas collecting chambers is connected to each of the crucibles in a one-to-one correspondence, and each of the gas collecting chambers is provided with a group of the evaporation nozzles.

[0021] In an optional embodiment, the evaporation nozzle extends obliquely upward.

[0022] In an optional embodiment, the evaporation device further includes a controller, a loading mechanism and an unloading mechanism. When the electrostatic adsorption component is located at the loading position, it corresponds to the loading mechanism. The loading mechanism is used to place the back panel to be evaporated on the adsorption surface of the electrostatic adsorption component under the control of the controller. When the electrostatic adsorption component is located at the unloading position, it corresponds to the unloading mechanism. The unloading mechanism is used to remove the back panel to be evaporated from the electrostatic adsorption component under the control of the controller.

[0023] In an optional embodiment, the evaporation device further includes a bracket, which is connected between the carrying track and the electrostatic adsorption component, and the electrostatic adsorption component is rotatably connected to the bracket to switch between the first posture and the second posture relative to the carrying track. The extension direction of the rotation axis of the electrostatic adsorption component is perpendicular to the vertical direction and parallel to the adsorption surface. In the second posture, the adsorption surface is roughly perpendicular to the vertical direction; under the control of the controller, the loading mechanism places the back panel to be evaporated on the adsorption surface of the electrostatic adsorption component located at the loading position and in the second posture. After the receiving component carrying the back panel to be evaporated switches from the second posture to the first posture, it moves from the loading position toward the evaporation position.

[0024] In an optional embodiment, the transport track is a closed loop track, and the loading mechanism, the evaporation chamber and the unloading mechanism are distributed at different positions of the closed loop track.

[0025] In a second aspect, the present application provides a display panel production device, which includes the above-mentioned evaporation device.

[0026] In a third aspect, the present application provides a display panel, which is produced by the above-mentioned display panel production equipment. The display panel includes a substrate, a structural functional layer and an organic encapsulation layer stacked in sequence, and the organic encapsulation layer includes at least two organic films stacked in sequence in a direction away from the substrate.

[0027] Based on the above-mentioned evaporation device provided by the present application, the electrostatic adsorption component can carry the back plate to be evaporated while maintaining the first posture, and move from the loading position to the evaporation position and the unloading position in sequence, that is, the back plate to be evaporated can be driven by the electrostatic adsorption component from the loading position to the evaporation position and the unloading position while being in a vertical extension posture. The electrostatic adsorption component can generate an electrostatic adsorption force to adsorb the back plate to be evaporated on the adsorption surface, and at the same time, the limiting component can limit the back plate to be evaporated from the adsorption surface. In this way, in the process of the electrostatic adsorption component carrying the back plate to be evaporated to the evaporation position and the unloading position, the electrostatic adsorption force and the limiting component act together on the back plate to be evaporated to ensure that the back plate to be evaporated is firmly limited on the adsorption surface. Moreover, adsorbing the back plate to be evaporated on the adsorption surface by the electrostatic adsorption force is conducive to ensuring the flatness of the back plate to be evaporated. Therefore, when using the evaporation device of the present application, in the process of the electrostatic adsorption component carrying the back panel to be evaporated, the flatness of the back panel to be evaporated can be guaranteed, and the possibility of the back panel to be evaporated falling off the electrostatic adsorption component can be avoided, thereby overcoming the problem of the back panel to be evaporated falling off the electrostatic adsorption component due to its own weight when the electrostatic adsorption force is unreliable, and reducing the risk of the back panel to be evaporated being broken and the evaporation device being shut down. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The following drawings are only intended to illustrate and explain the present application and do not limit the scope of the present application.

[0029] Figure 1 is a schematic diagram of an evaporation device provided by an exemplary embodiment of the present application;

[0030] Figure 2 This is a schematic diagram of a vapor deposition device provided by an exemplary embodiment of the present application, in which a limiting member is in a limiting position to limit the position of a back plate to be vapor deposited;

[0031] Figure 3 This is a schematic diagram from another perspective of an evaporation device provided by an exemplary embodiment of the present application, in which a limiting member is in a limiting position to limit the position of a back plate to be evaporated;

[0032] Figure 4 This is a schematic diagram from another perspective of an evaporation device provided by an exemplary embodiment of the present application, in which a limiting member is in a limiting position to limit the position of a back plate to be evaporated;

[0033] Figure 5 This is a schematic diagram from another perspective of an evaporation device provided by an exemplary embodiment of the present application, in which a limiting member is in a limiting position to limit the position of a back plate to be evaporated;

[0034] Figure 6 This is a schematic diagram from another perspective of an evaporation device provided by an exemplary embodiment of the present application, in which a limiting member is in a limiting position to limit the position of a back plate to be evaporated;

[0035] Figure 7 This is a schematic diagram of a evaporation device provided by an exemplary embodiment of the present application, in which a limiting member is located in an avoidance position;

[0036] Figure 8 This is a schematic diagram of a evaporation device provided by an exemplary embodiment of the present application, in which a limiting member is located in an avoidance position;

[0037] Figure 9 This is a schematic diagram from another perspective of a vapor deposition device provided by an exemplary embodiment of the present application, in which a limiting member is located in an avoidance position;

[0038] Figure 10 This is a schematic diagram of another evaporation device provided by an exemplary embodiment of the present application, in which a limiting member is in a limiting position to limit the position of a back plate to be evaporated;

[0039] Figure 11 This is a schematic diagram of another evaporation device provided by an exemplary embodiment of the present application, in which a limiting member is located in an avoidance position;

[0040] Figure 12 This is a schematic diagram of an evaporation device provided by an exemplary embodiment of the present application, in which a limiting member is located at an evaporation position and corresponds to an evaporation source;

[0041] Figure 13 is a schematic diagram of another evaporation device provided by an exemplary embodiment of the present application;

[0042] Figure 14 is a schematic diagram of an electrostatic adsorption component in a second posture in an evaporation device provided by an exemplary embodiment of the present application;

[0043] Figure 15 is a partial structural diagram of a display panel provided by an exemplary embodiment of the present application;

[0044] Figure 16 It is a partial structural diagram of a display panel provided by an exemplary embodiment of the present application.

[0045] Description of reference numerals:

[0046] 11-evaporation chamber, 12-carrying track, 13-loading mechanism, 14-unloading mechanism;

[0047] 21-electrostatic adsorption element, 210-adsorption surface, 22-limiting element, 23-bracket;

[0048] 30-driving assembly, 31-first telescopic member, 32-second telescopic member, 33-first driving member, 34-second driving member;

[0049] 40-evaporation source, 41-evaporation nozzle, 42-crucible, 43-gas collecting chamber;

[0050] 50-structural functional layer, 51-pixel defining layer, 52-isolation structure, 521-first structural layer, 522-second structural layer, 53-light-emitting structure, 531-first electrode, 532-light-emitting component, 533-second electrode, 54-protective structure, 60-organic encapsulation layer, 70-inorganic encapsulation layer; W-backplane to be evaporated, Q-substrate, X-first direction. DETAILED DESCRIPTION

[0051] In order to have a clearer understanding of the technical features, purposes and effects of the embodiments of the present application, the specific implementation methods of the embodiments of the present application are now described with reference to the accompanying drawings.

[0052] In this document, “illustrative” means “serving as an example, instance or illustration”, and any diagram or implementation described in this document as “illustrative” should not be interpreted as a more preferred or more advantageous technical solution.

[0053] To simplify the drawings, only the parts related to the present application are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, to simplify the drawings and facilitate understanding, in some figures, only one or more components with the same structure or function are schematically shown, or only one or more are labeled.

[0054] First, reference Figures 1 to 3 ,as well as Figure 7The present application first provides an evaporation device, which includes an evaporation chamber 11, a carrier track 12, an electrostatic adsorption member 21 and a limit member 22. The carrier track 12 passes through the evaporation chamber 11; the electrostatic adsorption member 21 is movably connected to the carrier track 12, and the electrostatic adsorption member 21 moves on the carrier track 12 in a first posture to reach a loading position, an evaporation position or an unloading position. The loading position and the unloading position are located outside the evaporation chamber 11, and the evaporation position is located in the evaporation chamber 11. The electrostatic adsorption member 21 includes an adsorption surface 210, and the electrostatic adsorption member 21 is used to The vapor-deposited backplane W is adsorbed on the adsorption surface 210. When the electrostatic adsorption component 21 is in the first posture, the adsorption surface 210 extends in the vertical direction. The limiting component 22 is movably installed on the electrostatic adsorption component 21 so that it can move back and forth between a limiting position and an avoidance position relative to the adsorption surface 210. When the limiting component 22 is in the avoidance position, it is away from the adsorption surface 210 to allow the backplane W to be vapor-deposited to be adsorbed on the adsorption surface 210. When the limiting component 22 is in the limiting position, it can contact the outer surface of the backplane W to be vapor-deposited on the adsorption surface 210 to limit the backplane W to be vapor-deposited from leaving the adsorption surface 210.

[0055] Those skilled in the art should understand that the evaporation chamber 11 may include an evaporation inlet and an evaporation outlet, and the transport track 12 may enter the evaporation chamber 11 through the evaporation inlet and extend from the evaporation chamber 11 through the evaporation outlet, thereby passing through the evaporation chamber 11.

[0056] Based on the above technical solution, it can be known that the back panel W to be evaporated can be placed on the electrostatic adsorption component 21 located at the loading position, and the back panel W to be evaporated can also be taken away from the electrostatic adsorption component 21 located at the unloading position. The electrostatic adsorption component 21 can drive the back panel W to be evaporated from the loading position through the evaporation inlet of the evaporation chamber 11 to the evaporation position in the evaporation chamber 11. After the evaporation of the back panel W to be evaporated is completed in the evaporation chamber 11, the electrostatic adsorption component 21 can drive the back panel W to be evaporated from the evaporation position through the evaporation outlet of the evaporation chamber 11 to the unloading position, completing the unloading of the back panel W to be evaporated. Among them, for example Figure 7 and Figure 9 As shown, the limiting member 22 is away from the adsorption surface 210 when in the avoidance position, and will not interfere with the process of placing the vapor deposition back plate W on the adsorption surface 210. Figure 3 As shown, when the back plate W to be evaporated is placed on the adsorption surface 210, the limiting member 22 can move to the limiting position, thereby playing a hard limiting role on the back plate W to be evaporated, preventing the back plate W to be evaporated from leaving the limiting surface.

[0057] As can be seen from the above, the electrostatic adsorption member 21 can carry the back panel W to be evaporated while maintaining the first posture, and move it from the loading position to the evaporation position and the unloading position in sequence. That is, the back panel W to be evaporated can be driven by the electrostatic adsorption member 21 from the loading position to the evaporation position and the unloading position while being in a vertically extended posture. The electrostatic adsorption member 21 can generate an electrostatic adsorption force to adsorb the back panel W to be evaporated on the adsorption surface 210, and at the same time, the limiter 22 can limit the back panel W to be evaporated from the adsorption surface 210. In this way, in the process of the electrostatic adsorption member 21 carrying the back panel W to be evaporated to the evaporation position and the unloading position, the electrostatic adsorption force and the limiter 22 act together on the back panel W to be evaporated to ensure that the back panel W to be evaporated is firmly limited on the adsorption surface 210. Moreover, adsorbing the back panel W to be evaporated on the adsorption surface 210 by the electrostatic adsorption force is conducive to ensuring the flatness of the back panel W to be evaporated. Therefore, when using the evaporation device of the present application, in the process of the electrostatic adsorption component 21 carrying the back panel W to be evaporated, the flatness of the back panel W to be evaporated can be guaranteed, and the possibility of the back panel W to be evaporated falling off the electrostatic adsorption component 21 can be avoided, thereby overcoming the problem of the back panel W to be evaporated falling off the electrostatic adsorption component 21 due to its own weight when the electrostatic adsorption force is unreliable, and reducing the risk of the back panel W to be evaporated breaking and the evaporation device shutting down.

[0058] In practical applications, the outer surface of the backsheet W to be evaporated refers to the surface to be evaporated of the backsheet W. The surface of the backsheet W to be evaporated that does not require evaporation can be adsorbed on the adsorption surface 210, that is, in contact with the adsorption surface 210; the other surface to be evaporated is relatively exposed.

[0059] Among them, the vertical direction in this application is the direction of gravity. When the electrostatic adsorption component 21 is in the first posture and carries the back panel W to be evaporated, the adsorption surface 210 extends in the vertical direction, and the back panel W to be evaporated adsorbed on the adsorption surface 210 also extends in the vertical direction. Therefore, the back panel W to be evaporated can easily resist the electrostatic adsorption force due to its own gravity and detach from the adsorption surface 210, thereby falling off from the electrostatic adsorption component 21.

[0060] Regarding the "electrostatic adsorption element 21 for adsorbing the backsheet W to be evaporated onto the adsorption surface 210", it can be understood as follows: under the action of the electrostatic adsorption force generated by the electrostatic adsorption element 21, the surface of the backsheet W to be evaporated is adsorbed and adhered to the adsorption surface 210, and the electrostatic adsorption force and the gravity of the backsheet W to be evaporated counteract each other, so that the backsheet W to be evaporated remains in a state of adsorption 210. The specific structure of the electrostatic adsorption element 21 can be set according to actual needs and is easily conceivable by those skilled in the art based on existing electrostatic adsorption technology, and is not limited in this application. In one example, the electrostatic adsorption element 21 may include multiple electrostatic chucks, and the adsorption surface 210 includes the adsorption disc surface of the electrostatic chuck. The electrostatic chuck has a structure in which a circuit such as a metal electrode is embedded in a dielectric or insulator (e.g., ceramic material) matrix. The electrostatic chuck can be a Coulomb force type electrostatic chuck, a Johnson-Rahbeck force type electrostatic chuck, or a gradient force type electrostatic chuck. A Coulomb-type electrostatic chuck sandwiches a relatively high-resistance dielectric between an electrode and an adsorption surface, and adsorption is achieved through the Coulomb force between the electrode and the adsorbed object. A Johnson-Rabec-type electrostatic chuck sandwiches a relatively low-resistance dielectric between an electrode and an adsorption surface, and adsorption is achieved through the Johnson-Rabec-type force generated between the dielectric's adsorption surface and the adsorbed object. A gradient-type electrostatic chuck utilizes a nonuniform electric field to adsorb the adsorbed object. When the adsorbed object is a conductor or semiconductor (silicon wafer), a Coulomb-type electrostatic chuck or a Johnson-Rabec-type electrostatic chuck is preferably used. When the adsorbed object is an insulator such as glass, a gradient-type electrostatic chuck is preferably used.

[0061] In the evaporation chamber 11, the evaporation material can be deposited on the backplane W to be evaporated to form various thin film functional layers, which can be used to manufacture electronic devices or optical components such as display panels, thin film solar cells, and organic photoelectric conversion elements (organic thin film camera elements). The evaporation material can be an organic material or a metal material.

[0062] Regarding “in the first posture, the adsorption surface 210 extends in the vertical direction”, it can be understood as follows: the extension direction of the adsorption surface 210 is parallel to the vertical direction, or the angle between the extension direction of the adsorption surface 210 and the vertical direction is less than or equal to 10°. For example, in Figure 2 The extension direction of the adsorption surface 210 is parallel to the vertical direction. Figure 10In the embodiment, the angle between the extension direction of the adsorption surface 210 and the vertical direction is 5°. The electrostatic adsorption component 21 is moved on the carrier track 12 in a first posture to reach the loading position, the evaporation position or the unloading position, which has the following beneficial effects: when the electrostatic adsorption component 21 moves on the carrier track 12 in a first posture, the back panel W to be evaporated extends roughly in the vertical direction, which can reduce the probability of floating impurity particles or pollutants adhering to the surface of the back panel W to be evaporated, and can also reduce the occupied area, especially for a large area of the back panel W to be evaporated. For example, the back panel W to be evaporated is used to make a display panel, and the large area of the back panel W to be evaporated can be used to make the 7.5th generation (corresponding to about 4.29m 2 (surface area of 1.95m × 2.2m), 8.5th generation (corresponding to approximately 5.7m 2 (surface area of 2.2 m × 2.5 m)) or even the 10th generation (corresponding to about 8.7 m 2 Even higher generations (such as Gen 11 and Gen 12) and corresponding surface areas can be similarly realized.

[0063] In one possible embodiment, the adsorption surface 210 may include a supporting area and an edge area, wherein the edge area surrounds the supporting area, and the backsheet W to be evaporated is adsorbed on the supporting area; when the limiting member 22 is in the avoidance position, it is away from the supporting area, and the orthographic projection of the limiting member 22 on the adsorption surface 210 is separated from the supporting area, thereby avoiding interference with the placement of the backsheet W to be evaporated or removing the backsheet W to be evaporated from the supporting area; when the limiting member 22 is in the restricted position, at least part of the orthographic projection of the limiting member 22 on the adsorption surface 210 overlaps with the supporting area, so that the limiting member 22 can play a role in limiting the backsheet W to be evaporated in the supporting area. It should be understood that the receiving member can also be provided with an alignment detector for determining whether the backsheet W to be evaporated is aligned with the supporting area. After alignment, the limiting member 22 is moved from the avoidance position to the restricted position.

[0064] In one possible embodiment, reference Figure 2 and Figure 3 , the electrostatic adsorption member 21 in the first posture includes an upper end and a lower end distributed in the vertical direction. In one example, the limiter 22 is provided at the lower end of the electrostatic adsorption member 21. In this way, the limiter can support the evaporation back plate W in the vertical direction, thereby reducing the risk of the limiter 22 being separated from the adsorption surface 210 due to gravity. In another example, referring to Figure 3The upper and lower ends of the electrostatic adsorption member 21 are both provided with limit members 22. Thus, when the electrostatic adsorption force is unreliable, the limit member 22 at the lower end can not only support the back sheet W to be deposited in the vertical direction, but also prevent the back sheet W to be deposited from escaping from the electrostatic adsorption member 21 in a direction perpendicular to the adsorption surface 210. The limit member 22 at the upper end and the limit member 22 at the lower end jointly limit the back sheet W to be deposited, more reliably preventing the back sheet W to be deposited from tipping over and escaping from the electrostatic adsorption member 21.

[0065] In another example, refer to Figure 4 The electrostatic adsorption component 21 in the first posture also includes two vertical sides extending between the upper end and the lower end. Limiting members 22 can be set at the upper end, the lower end and one of the vertical sides of the electrostatic adsorption component 21. The other vertical side does not have a limiting member 22, which can facilitate the loading and unloading of the back panel W to be evaporated from the vertical side.

[0066] In another example, refer to Figure 5 or Figure 6 There are multiple limiting members 22, and at least two limiting members 22 are located at the corners of the back plate to be evaporated W adsorbed by the electrostatic adsorption member 21. Furthermore, limiting members 22 can be distributed between adjacent corners.

[0067] Further, in one embodiment, referring to Figures 3 to 6 , the number of the limiting members 22 is multiple, and they are spaced around the electrostatic adsorption member 21. For example, the multiple limiting members 22 can be evenly spaced around the electrostatic adsorption member 21. In this way, when the back plate W to be evaporated is located on the adsorption surface 210, the four sides of the back plate W to be evaporated can be limited by the limiting members 22. The multiple limiting members 22 can apply a uniform limiting force to the back plate W to be evaporated, so that the back plate W to be evaporated is reliably limited on the adsorption surface 210. In one example, referring to Figure 6 The adsorption surface 210 is rectangular, and each of the four sides of the rectangle has at least one stopper 22. Furthermore, a plurality of stoppers 22 are respectively distributed on the four sides of the rectangle, and the plurality of stoppers 22 are evenly spaced.

[0068] In one possible embodiment, reference Figure 2 and Figure 7The evaporation device also includes a driving component 30, which includes a first telescopic member 31 and a second telescopic member 32. The first telescopic member 31 includes a first telescopic end and a first fixed end relative to each other, and the first telescopic end can be extended and retracted relative to the first fixed end. The second telescopic member 32 includes a second telescopic end and a second fixed end relative to each other, and the second telescopic end can be extended and retracted relative to the second fixed end. The first telescopic end is connected to the limiter 22, the first fixed end is connected to the second telescopic end, and the second fixed end is connected to the electrostatic adsorption member 21. The telescopic direction of the first telescopic end is parallel to the adsorption surface 210, and the telescopic direction of the second telescopic end is perpendicular to the adsorption surface 210. Through the above technical solution, the first telescopic member 31 can be extended and retracted in a direction parallel to the adsorption surface 210, thereby driving the limiter 22 to move back and forth in a direction parallel to the adsorption surface 210. The second telescopic member 32 can be extended and retracted in a direction perpendicular to the adsorption surface 210, thereby driving the limiter 22 to move back and forth in a direction perpendicular to the adsorption surface 210. This design can make the limiter 22 move away from or close to the adsorption surface 210. Moreover, the telescopic length of the first telescopic part 31 can accurately position the position of the limiting part 22 relative to the adsorption surface 210 in a direction parallel to the adsorption surface 210, and the telescopic length of the second telescopic part 32 can accurately position the position of the limiting part 22 relative to the adsorption surface 210 in a direction perpendicular to the adsorption surface 210, ensuring that the limiting part 22 can contact the back panel W to be evaporated and avoid oppression on the back panel W to be evaporated.

[0069] In one example, the number of drive assemblies 30 and the number of limit members 22 are the same and correspond one to one, that is, each limit member 22 can be independently controlled by a drive assembly 30. In addition, the first telescopic member 31 can be a pneumatic telescopic mechanism, a liquid level telescopic mechanism, or an electric telescopic mechanism, and the second telescopic member 32 can be a pneumatic telescopic mechanism, a liquid level telescopic mechanism, or an electric telescopic mechanism, which is not limited in this application.

[0070] In one example, reference Figure 6 , a driving assembly 30 can be provided at the corner of the electrostatic adsorption member 21, and the first telescopic end of the driving assembly 30 can be connected to two limiting members 22 at the same time, and the two limiting members 22 extend respectively toward the two side edges corresponding to the corners to limit the adjacent two side edges of the back plate W to be evaporated. That is, there is an angle between the two limiting members 22, and the two limiting members 22 and the first telescopic member 31 are roughly Y-shaped. This design can make more efficient use of space, especially at the corners of the electrostatic adsorption member 21, where it is usually difficult to set a driving assembly for each side separately. By allowing the first telescopic member 31 to connect the two limiting members 22 at the same time, not only the structure is simplified, but also the limiting stability of the back plate W to be evaporated is improved. Moreover, the two limiting members 22 and the first telescopic member 31 connected in a Y shape can also protect the corners of the back plate W to be evaporated and reduce the probability of corner damage.

[0071] In one example, the second telescopic member 32 can be connected to the side of the electrostatic adsorption member, so that multiple driving components can surround the electrostatic adsorption member.

[0072] In another possible embodiment, reference Figure 8 The driving assembly 30 includes a first driving member 33 and a second driving member 34. The second driving member 34 includes a fixed end and a free end. The second driving member 34 can be extended and retracted between the fixed end and the free end. One end of the first driving member 33 is rotatably connected to the side of the electrostatic adsorption member 21, and the other end is connected to the fixed end of the second driving member 34. The free end of the second driving member 34 is connected to the limit member 22. Through this design, when it is necessary to move the limit member 22 from the limiting position toward the avoidance position, the second driving member 34 can be extended first to make the limit member 22 leave the surface of the back panel W to be evaporated, and then the first driving member 33 can be rotated to drive the second driving member 34 and the limit member 22 to rotate toward the side away from the electrostatic adsorption member 21 until it reaches the avoidance position; when it is necessary to move the limit member 22 from the avoidance position toward the limiting position, the first driving member 33 can be rotated to drive the second driving member 34 and the limit member 22 to move toward the adsorption surface 210 of the electrostatic adsorption member 21, and then the second driving member 34 can be controlled to shorten so that the limit member 22 can reach the limiting position.

[0073] Since there may be circuits in the back panel W to be evaporated, such as a driving display circuit in a display panel, in order to prevent the static electricity on the limiter 22 from damaging the circuits in the back panel W to be evaporated during the movement of the limiter 22 toward the restricted position, in one possible embodiment, the limiter 22 includes a contact limiter surface for contacting the outer surface of the back panel W to be evaporated on the adsorption surface 210, and at least the material of the contact limiter surface includes an antistatic material. For example, at least the material of the contact limiter includes polyetheretherketone (PEEK), which is a high-performance special engineering plastic with excellent properties such as high temperature resistance, chemical corrosion resistance, and high strength.

[0074] Furthermore, the surfaces of the first telescopic member 31 and the second telescopic member 32 may also be coated with an antistatic coating.

[0075] Furthermore, the material of the contact limiting surface includes a flexible material. Thus, when the contact limiting surface contacts the outer surface of the back plate W to be evaporated, flexible contact can be achieved between the base limiting surface and the back plate W to be evaporated, avoiding excessive coldness.

[0076] Furthermore, one end of the limiting member 22 connected to the driving assembly 30 includes a rigid material, so as to achieve precise control of the limiting member 22 by the driving assembly 30 .

[0077] In a possible embodiment, the limiting member 22 includes a contact limiting surface for contacting the outer surface of the back plate W to be evaporated on the adsorption surface 210, and the shape of the contact limiting surface is circular or elliptical. Figure 11 , the limiting member 22 is disc-shaped and has a circular contact limiting surface. In this way, the outer contour of the contact limiting surface has no sharp corners, thereby avoiding the situation where stress concentration is generated on the back panel W to be evaporated when the contact limiting surface applies a limiting force to the back panel W to be evaporated. In a possible implementation, the evaporation device includes a magnetic levitation drive mechanism, which is installed on the transport track 12 and / or the electrostatic adsorption member 21 to drive the limiting member 22 to move along the transport track 12. Among them, the design of the magnetic levitation drive mechanism makes the movement of the limiting member 22 on the transport track 12 more stable, precise and low-noise. Magnetic levitation technology reduces the friction and resistance generated by physical contact by utilizing the principle of magnetic suspension, which is beneficial to avoid the generation of impurity particles, reduce the impurity particles attached to the back panel W to be evaporated, and improve the evaporation quality of the back panel W to be evaporated.

[0078] In one example, the magnetic levitation drive mechanism may include an energized coil and a permanent magnet. The energized coil may be used as a stator and installed on the carrying track 12. The permanent magnet may be used as a movable part and installed on the electrostatic adsorption part 21. The permanent magnet may move in a magnetic levitation state relative to the energized coil. That is, the electrostatic adsorption part 21 may move in a magnetic levitation state relative to the carrying track 12.

[0079] Regarding the specific structure of the magnetic levitation drive mechanism, those skilled in the art can configure it in combination with the actual needs of magnetic levitation technology, and this application does not limit it.

[0080] In one possible implementation, refer to Figure 12 The evaporation device also includes an evaporation source 40. The evaporation source 40 is located in the evaporation chamber 11. When the electrostatic adsorbent 21 is in the evaporation position in the first posture, the evaporation source 40 and the electrostatic adsorbent 21 are spaced apart along a first direction X. The first direction X is perpendicular to the vertical direction. The evaporation nozzle 41 of the evaporation source 40 faces the surface to be evaporated of the backing plate W to be evaporated. It should be understood that the vertical direction in this application can be the direction of gravity, and the first direction X can be the horizontal direction. When the electrostatic adsorbent 21 is in the evaporation position in the first posture, the surface to be evaporated of the backing plate W to be evaporated extends approximately along the vertical direction. Through this design, a stable distance can be maintained between the evaporation nozzle 41 and the backing plate W to be evaporated, and the evaporation material released by the evaporation source 40 can be uniformly and effectively deposited on the surface to be evaporated of the backing plate W to be evaporated. The specific type and structure of the evaporation source 40 can be selected according to actual evaporation requirements. For example, it can be an electron beam evaporation source 40, a resistance heating evaporation source 40, etc.

[0081] In a possible embodiment, during evaporation, the evaporation material is easily deposited on the limiter 22 and the first telescopic member 31. In order to prevent the evaporation material from being deposited on the limiter 22 and the first telescopic member 31, a replaceable protective film can be attached to the side of the limiter 22 facing away from the adsorption surface 210 and the side of the first telescopic member 31 facing away from the adsorption surface 210. Whenever a certain thickness of evaporation material is deposited on the original protective film, a new protective film can be replaced.

[0082] Specifically, refer to Figure 12 The evaporation source 40 may include multiple groups of evaporation nozzles 41 and multiple crucibles 42. The crucibles 42 are used to hold and heat the evaporation materials. The multiple groups of evaporation nozzles 41 are spaced apart in the vertical direction, and the multiple crucibles 42 are spaced apart in the vertical direction. Each crucible 42 is connected to each group of evaporation nozzles 41 in a one-to-one correspondence. Through such a design, the gaseous evaporation material after being heated and evaporated by the crucible 42 can move toward the back plate W to be evaporated through the evaporation nozzles 41, and finally be deposited on the back plate W to be evaporated. And because each group of evaporation nozzles 41 is spaced apart in the vertical direction, the gaseous evaporation material can be deposited on the surface to be evaporated of the back plate W to be evaporated that extends in the vertical direction, reducing the possibility that the gaseous evaporation material will be difficult to reach the upper end of the surface to be evaporated due to gravity.

[0083] The number of evaporation nozzles 41 included in each group of evaporation nozzles 41 and the arrangement and distribution of the evaporation nozzles 41 can be designed by those skilled in the art based on actual needs, and this application does not limit this. For example, each group of evaporation nozzles 41 includes three evaporation nozzles 41, and the three evaporation nozzles 41 are spaced apart in the horizontal direction.

[0084] Further, in a possible implementation, referring to Figure 12 The evaporation source 40 also includes a plurality of gas collecting chambers 43, each gas collecting chamber 43 is connected to each crucible 42 in a one-to-one correspondence, and each gas collecting chamber 43 is provided with a group of evaporation nozzles 41. Through such a design, the gaseous evaporation material evaporated from each crucible 42 first enters the corresponding gas collecting chamber 43, is mixed in the gas collecting chamber 43, and then moves toward the back plate W to be evaporated through the evaporation nozzle 41 on the evaporation nozzle 41 on the gas collecting chamber 43. The evaporation material ejected from each evaporation nozzle 41 can be made more uniform, thereby improving the evaporation effect. In addition, the design of the gas collecting chamber 43 can also play a buffering role, reducing the turbulence of the evaporation material during the ejection process, so that the evaporation material can be more smoothly deposited on the back plate W to be evaporated.

[0085] In one possible embodiment, the evaporation source 40 may further include an insulation box, which houses the crucible 42 and the gas collecting chamber 43. The insulation box helps maintain a stable temperature around the crucible 42 and the gas collecting chamber 43, ensuring precise temperature control during the heating and evaporation of the evaporation material, thereby improving the consistency and uniformity of the evaporation. The insulation box can be made of a material with high thermal conductivity and high temperature resistance, such as graphite or ceramic, to effectively transfer and retain heat.

[0086] Of course, when a plurality of crucibles 42 are provided in the heat preservation box, a multi-layer rack is also required to be provided in the heat preservation box, and the plurality of crucibles 42 can be fixed on the multi-layer rack in layers, so that the plurality of crucibles 42 are spaced apart and distributed in the vertical direction.

[0087] Due to the effect of gravity, after the gaseous evaporation material leaves the evaporation nozzle 41, it will gradually move downward while moving toward the back plate W to be evaporated. Therefore, in a possible embodiment, the evaporation nozzle 41 extends obliquely upward. That is, the extension direction of the evaporation nozzle 41 can have an angle with the horizontal direction. Through such a design, the gaseous evaporation material has a tendency to move obliquely upward when leaving the evaporation nozzle 41, so as to resist the effect of gravity and reduce the possibility that the gaseous evaporation material will have difficulty reaching the upper end of the surface to be evaporated due to gravity. In one example, the extension direction of the evaporation nozzle 41 can be at an angle of 10° to 30° to the horizontal direction.

[0088] In one possible implementation, refer to Figure 1 or Figure 13 The evaporation device further includes a controller, a loading mechanism 13, and a unloading mechanism 14. When the electrostatic adsorbent 21 is in the loading position, it corresponds to the loading mechanism 13. The loading mechanism 13 is used to place the backing plate W to be evaporated on the adsorption surface 210 of the electrostatic adsorbent 21 under the control of the controller. When the electrostatic adsorbent 21 is in the unloading position, it corresponds to the unloading mechanism 14. The unloading mechanism 14 is used to remove the backing plate W to be evaporated from the electrostatic adsorbent 21 under the control of the controller. Through this design, the automatic loading and unloading of the backing plate W to be evaporated on the electrostatic adsorbent 21 is achieved. Furthermore, the evaporation device may also include an in-position sensor, which determines whether the electrostatic adsorbent 21 is in the loading position, the unloading position, or the evaporation position. The controller can be electrically connected to the in-position sensor to determine the position of the electrostatic adsorbent 21 based on the feedback from the in-position sensor, so as to timely control the loading mechanism 13, the unloading mechanism 14, or the evaporation source 40 to perform corresponding operations.

[0089] Figure 1 and Figure 13 The arrow in the figure indicates that the electrostatic adsorption member 21 moves on the carrying track 12 and passes through the loading mechanism 13, the evaporation chamber 11 and the unloading mechanism 14 in sequence.

[0090] It should be clarified that those skilled in the art should understand that in actual production, the back panel W to be evaporated on the electrostatic adsorption component 21 is transported to the position corresponding to the unloading mechanism 13 after evaporation. At this time, the unloading mechanism 14, under the control of the controller, actually removes the back panel W to be evaporated from the electrostatic adsorption component 21 that has completed an evaporation process. For the convenience of description, this application does not strictly distinguish in terms of language form.

[0091] The controller may include a processor and memory, wherein the memory stores a computer program, and the processor executes the computer program to implement the aforementioned functions. The specific structures of the loading mechanism 13 and the unloading mechanism 14 can be designed according to actual needs. For example, they may include a robotic arm, a suction device, etc. to achieve automatic loading and unloading of the backplane W to be evaporated. This design can further improve the automation level of the evaporation device, reduce manual operations, and improve production efficiency.

[0092] In order to achieve more safe and reliable loading of the back plate W to be evaporated onto the electrostatic adsorption member 21, and more safe and reliable unloading of the back plate W to be evaporated from the electrostatic adsorption member 21, in a possible embodiment, reference is made to Figure 12 and Figure 14The evaporation device also includes a bracket 23, which is connected between the carrying track 12 and the electrostatic adsorption component 21. The electrostatic adsorption component 21 is rotatably connected to the bracket 23 to switch between a first posture and a second posture relative to the carrying track 12. The extension direction of the rotation axis of the electrostatic adsorption component 21 is perpendicular to the vertical direction and parallel to the adsorption surface 210. In the second posture, the adsorption surface 210 is roughly perpendicular to the vertical direction; under the control of the controller, the loading mechanism 13 places the back panel W to be evaporated on the adsorption surface 210 of the electrostatic adsorption component 21 which is in the loading position and in the second posture. After the receiving component carrying the back panel W to be evaporated is switched from the second posture to the first posture, it moves from the loading position toward the evaporation position. With this design, when the electrostatic adsorption member 21 is in the second posture, the adsorption surface 210 is approximately perpendicular to the vertical direction, that is, the adsorption surface 210 is approximately parallel to the horizontal direction. At this time, the loading mechanism 13 can conveniently and safely place the back panel W to be evaporated on the adsorption surface 210 that extends approximately horizontally. After the position of the back panel W to be evaporated on the adsorption surface 210 is aligned, the electrostatic adsorption force can be used to fix the back panel W to be evaporated on the adsorption surface 210. At the same time, the limiter 22 can be used to play a hard limit role on the back panel W to be evaporated. Then, the electrostatic adsorption member 21 is rotated to the first posture, and the back panel W to be evaporated extends in the vertical direction. In the process of transporting the back panel W to be evaporated on the electrostatic adsorption member 21, the electrostatic adsorption member 21 remains in the first posture, which can reduce the adhesion of particles to the back panel W to be evaporated and save the space area occupied by the back panel W to be evaporated. Similarly, when it is necessary to use the unloading mechanism 14 to remove the back panel W to be evaporated from the electrostatic adsorption component 21, the electrostatic adsorption component 21 can be rotated to the second posture, so that the back panel W to be evaporated extends horizontally, making it easier for the unloading mechanism 14 to clamp or absorb the back panel W to be evaporated.

[0093] In one possible embodiment, reference Figure 13 , the transport track 12 can be a closed loop track, and the loading mechanism 13, the evaporation chamber 11 and the unloading mechanism 14 are distributed at different positions of the closed loop track. In this way, the electrostatic adsorption component 21 can circulate between the loading mechanism 13, the evaporation chamber 11 and the unloading mechanism 14, simplifying the movement of the electrostatic adsorption component 21 from the unloading mechanism 14 to the loading mechanism 13. For example, after the electrostatic adsorption component 21 carries the back panel W to be evaporated at the loading mechanism 13, it carries the back panel W to be evaporated through the evaporation chamber 11 to the unloading mechanism 14. After unloading the back panel W to be evaporated through the unloading mechanism 14, the unloaded electrostatic adsorption component 21 can move directly from the unloading mechanism 14 to the loading mechanism 13, without having to return to the loading mechanism 13 through the evaporation chamber 11, or be moved to the loading mechanism 13 by other moving parts, which can improve the use efficiency of the electrostatic adsorption component 21.

[0094] In one example, when multiple film layers need to be evaporated on the backplane W to be evaporated, the evaporation device may include multiple evaporation chambers 11, and different evaporation chambers 11 are placed with different mask plates for evaporating different film layers.

[0095] In one example, only one carrier is provided in each evaporation chamber 11 for carrying the corresponding mask plate. The carrier can move along a preset path in the evaporation chamber 11 to move the mask plate from the standby position to the mask position, or from the mask position to the standby position. The specific structure of the carrier can be designed according to actual needs. For example, it can include a driving mechanism and a carrying part, the driving mechanism is used to drive the carrying part to move, and the carrying part is used to carry the mask plate. In one possible implementation, the carrying part may include an adsorption device for adsorbing the mask plate to achieve stable transportation of the mask plate. Through such a design, the degree of automation of the evaporation device can be further improved, manual operation can be reduced, and production efficiency can be improved.

[0096] Based on the above-mentioned evaporation device provided in this application, this application also provides a method for manufacturing a display panel, which includes:

[0097] S1, providing a backplane W to be evaporated;

[0098] S2, placing the backsheet W to be evaporated on the adsorption surface 210 of the electrostatic adsorption member 21 located at the loading position, and controlling the electrostatic adsorption member 21 to generate static electricity to adsorb the backsheet W to be evaporated;

[0099] S3, controlling the limit member 22 to move to the limit position;

[0100] S4, controlling the electrostatic adsorption component 21 to move from the loading position toward the evaporation position.

[0101] Through the above method, in the process of manufacturing the display panel, especially in the process of moving the back panel W to be evaporated toward the evaporation position, on the one hand, the back panel W to be evaporated is electrostatically adsorbed on the adsorption surface 210, which is beneficial to ensure the flatness of the back panel. On the other hand, the back panel W to be evaporated is rigidly limited at the restricted position by the limiting part 22, which greatly reduces the possibility of the back panel falling off from the electrostatic adsorption part 21, reduces the risk of back panel breakage and evaporation device downtime, and is beneficial to reducing the production cost of the display panel.

[0102] If the electrostatic adsorbent 21 can rotate relative to the carrier track 12 so as to be switchable between the first posture and the second posture, the electrostatic adsorbent 21 can be first maintained in the second posture so that the adsorption surface 210 extends approximately horizontally, and then the backing plate W to be vapor-deposited is placed on the adsorption surface 210. After the limiter 22 moves to the restricted position, the electrostatic adsorbent 21 is rotated to the first posture, and then the electrostatic adsorbent 21 in the first posture is controlled to move from the loading position to the vapor deposition position. After the vapor deposition is completed, the electrostatic adsorbent 21 in the first posture is continued to be controlled to move from the vapor deposition position to the unloading position. After reaching the unloading position, the electrostatic adsorbent 21 is rotated to the second posture, and the unloading mechanism 14 is used to remove the vapor-deposited backing plate from the electrostatic adsorbent 21 in the second posture.

[0103] In a second aspect, the present application also provides a display panel production device, which includes the above-mentioned evaporation device.

[0104] Thirdly, the present application also provides a display panel manufactured using the aforementioned display panel production apparatus. The display panel comprises a substrate Q, a structural and functional layer 50, and an organic encapsulation layer 60 stacked in sequence. The organic encapsulation layer 60 comprises at least two organic thin films stacked in sequence in a direction away from the substrate Q. Thus, the organic thin films obtained by at least two evaporation depositions can form the organic encapsulation layer 60, which can be used to protect the structural and functional layers.

[0105] In one possible embodiment, reference Figure 15 The structural functional layer 50 may include an isolation structure 52, multiple light-emitting structures 53, and multiple protective structures 54. The isolation structure 52 is disposed on one side of the substrate Q, enclosing multiple isolation openings. The light-emitting structures 53 are disposed correspondingly to the isolation openings, with a portion of the light-emitting structure 53 located within the isolation openings. The protective structure 54 is disposed on the side of the corresponding light-emitting structure 53 facing away from the substrate Q, and the protective structure 54 overlaps the sidewall of the isolation structure 52. The material of the protective structure 54 includes an inorganic material. In this way, the protective structure 54 can isolate water and oxygen, protect the light-emitting structure 53, and reduce the impact of ultraviolet light on the light-emitting structure 53 when the organic encapsulation layer 60 is cured by ultraviolet light.

[0106] Furthermore, the display panel also includes a pixel defining layer 51, which is arranged between the substrate Q and the isolation structure 52. The pixel defining layer 51 includes a plurality of pixel openings, the pixel openings correspond to the isolation openings, the pixel openings are connected to the corresponding isolation openings, the orthographic projection of the pixel opening on the substrate Q is located within the orthographic projection range of the corresponding isolation opening on the substrate Q, and part of the light-emitting structure 53 is located in the pixel opening.

[0107] In one possible embodiment, the light-emitting structure 53 includes a first electrode 531, a light-emitting component 532, and a second electrode 533, stacked in sequence along a direction away from the substrate Q. The first electrode 531 is disposed between the substrate Q and the pixel-defining layer 51, with a portion of the first electrode 531 exposed in the corresponding pixel opening. The light-emitting component 532 is stacked on the surface of the first electrode 531 exposed in the pixel opening. Thus, under the conductive action of the first electrode 531 and the second electrode 533, the light-emitting component 532 can emit light, and the light emission range of the light-emitting component 532 is within the range defined by the isolation opening.

[0108] In one example, the isolation structure 52 includes a first structure layer 521 and a second structure layer 522 stacked in sequence in a direction toward the substrate Q, the first structure layer 521 protrudes from the side wall of the second structure layer 522 in a direction parallel to the substrate Q, and the second electrode 533 is electrically connected to the second structure layer 522. For example, the second electrode 533 and the second structure layer 522 are in conductive contact to achieve electrical connection. In this way, the first structure layer 521 can extend out of the side wall of the second structure layer 522 to form an eaves-like structure. Then, when the second electrode 533 is evaporated, the second electrode 533 will not be continuous near the eaves-like structure, but will be discontinuous. In this way, the isolation structure 52 can reliably separate the adjacent light-emitting structures 53 and the second electrode 533, so as to achieve independent preparation of light-emitting structures 53 of different colors without the need for a fine metal mask.

[0109] The isolation structures 52 in the display panels of the present application are all made of metal and can be prepared by physical vapor deposition using the aforementioned display device. A patterned etching process is then used to form a pattern with an undercut structure to isolate the evaporated organic light-emitting material, thereby obtaining an independent light-emitting structure 53. Compared to preparation processes requiring a fine metal mask, display panels using isolation structures 52 increase in weight during the preparation of the isolation structures 52 and are easily affected by gravity and fall from the electrostatic adsorption member, resulting in product loss. However, the evaporation device of the present invention can avoid slipping and damage, thereby improving production efficiency.

[0110] One of the first electrode 531 and the second electrode 533 may be an anode, and the other may be a cathode.

[0111] The light-emitting component 532 may include an organic light-emitting material, which can be obtained by evaporating the organic material using the evaporation device provided in this application. The light-emitting component 532 may include one or more of: a HIL (Hole Injection Layer), a HTL (Hole Transfer Layer), an EML (Emitting Layer), and an ETL (Electron Transfer Layer). The organic light-emitting materials in the light-emitting component 532 are generally divided into: polymers, small molecule organic compounds, and complex light-emitting materials; polymers are usually conductive conjugated polymers or semiconductor conjugated polymers, which can be formed into films by spin coating, are simple to manufacture, and have low cost, but their purity is difficult to improve, and they are inferior to small molecule organic compounds in terms of durability, brightness, and color. Organic small molecule light-emitting materials are mainly organic dyes, which have advantages such as strong chemical modification, a wide range of selection, easy purification, high quantum efficiency, and the ability to produce emission peaks in various colors such as red, green, blue, and yellow. However, most of them have problems such as concentration quenching in the solid state. Complex luminescent materials are between organic and inorganic substances. They have both the high fluorescence quantum efficiency of organic substances and the high stability of inorganic substances. They are considered to be a type of luminescent material with great application prospects.

[0112] In one possible embodiment, the multiple light-emitting structures 53 include a first light-emitting structure 53, a second light-emitting structure 53, and a third light-emitting structure 53; the multiple partition openings include a first partition opening, a second partition opening, and a third partition opening; the first light-emitting structure 53 is arranged corresponding to the first partition opening, the second light-emitting structure 53 is arranged corresponding to the second partition opening, and the third light-emitting structure 53 is arranged corresponding to the third partition opening; the first light-emitting structure 53 and the second light-emitting structure 53 emit different colors, the first light-emitting structure and the third light-emitting structure emit different colors, and the second light-emitting structure and the third light-emitting structure emit different colors. In this way, light-emitting structures 53 capable of emitting different colors can be arranged in different pixel openings. In this way, by providing multiple light-emitting structures 53, the display panel can present a variety of display colors and effects.

[0113] In one example, reference Figure 16 The display panel also includes an inorganic encapsulation layer 70, which is disposed on the side of the organic encapsulation layer 60 facing away from the substrate Q. The inorganic encapsulation layer 70 can be formed by chemical vapor deposition. The inorganic encapsulation layer 70 can isolate water and oxygen. The inorganic encapsulation layer 70 and the organic encapsulation layer 60 can jointly protect the structural and functional layer 50.

[0114] In one example, after forming the second electrode 533, an inorganic protective layer can be formed on the side of the light-emitting structure 53 and the isolation structure 52 facing away from the substrate Q by chemical vapor deposition; then, the excess inorganic protective layer is removed by patterned etching to obtain a protective structure 54 corresponding to the light-emitting structure 53. The etching method can be dry etching or wet etching.

[0115] It can be understood that the substrate Q plays the role of supporting the entire panel in the display panel. The substrate Q is generally divided into two types: hard substrate Q and soft substrate Q. The hard substrate Q is usually made of rigid materials such as glass or plastic, and has good stability and durability, and is suitable for large-size displays and professional displays; while the soft substrate Q is usually made of soft plastic or metal foil and other materials, and is suitable for flexible displays and wearable devices.

[0116] The present application also provides a display device, which includes the display panel described above, or includes a display panel manufactured by the manufacturing method described above. Based on the beneficial effects of the display panel described above, the display device has the advantage of high production yield.

[0117] The display device can be used in smart wearable devices (such as smart bracelets and smart watches), and can also be used in smart phones, tablet computers, monitors and other devices. Other essential components of the display device are well understood by those skilled in the art and are not described here in detail, nor should they be construed as limiting the present invention.

[0118] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0119] It should be understood that although the specific embodiments of the present application are described in detail in conjunction with the accompanying drawings, it should not be understood as limiting the scope of protection of the present application. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still fall within the scope of protection of the present application. Although this specification is described in accordance with various embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that those skilled in the art can understand.

[0120] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A vapor deposition device, characterized in that: include: an evaporation chamber (11); A carrying track (12) passing through the evaporation chamber (11); An electrostatic adsorption member (21) is movably connected to the transport track (12), and the electrostatic adsorption member (21) moves on the transport track (12) in a first posture to reach a loading position, a vapor deposition position, or a unloading position, wherein the loading position and the unloading position are located outside the vapor deposition chamber (11), and the vapor deposition position is located in the vapor deposition chamber (11). The electrostatic adsorption member (21) includes an adsorption surface (210), and the electrostatic adsorption member (21) is used to adsorb a back plate (W) to be vapor-deposited on the adsorption surface (210). When the electrostatic adsorption member (21) is in the first posture, the adsorption surface (210) extends in a vertical direction. A limiting member (22) is movably mounted on the electrostatic adsorption member (21) so as to be capable of reciprocating between a limiting position and an avoidance position relative to the adsorption surface (210); the limiting member (22) is away from the adsorption surface (210) in the avoidance position to allow the back plate (W) to be evaporated to be adsorbed on the adsorption surface (210); and is capable of contacting the outer surface of the back plate (W) to be evaporated on the adsorption surface (210) in the limiting position.

2. The evaporation device according to claim 1, wherein The electrostatic adsorption member (21) in the first posture includes an upper end and a lower end opposite to each other in the vertical direction, and the limiting member (22) is arranged at the lower end of the electrostatic adsorption member (21); Preferably, the electrostatic adsorption member (21) in the first posture includes an upper end and a lower end relative to each other in the vertical direction, and the limiting member (22) is provided at both the upper end and the lower end of the electrostatic adsorption member (21).

3. The evaporation device according to claim 2, characterized in that There are multiple limiting members (22), and at least two limiting members (22) are located at the corners of the back plate (W) to be evaporated, which are adsorbed by the electrostatic adsorption member (21); Preferably, there are a plurality of the limiting members (22), which are distributed at intervals around the electrostatic adsorption member (21).

4. The evaporation device according to claim 1, wherein The evaporation device further comprises a driving assembly (30), wherein the driving assembly (30) comprises a first telescopic member (31) and a second telescopic member (32), wherein the first telescopic member (31) comprises a first telescopic end and a first fixed end opposite to each other, wherein the first telescopic end can be extended and retracted relative to the first fixed end, and the second telescopic member (32) comprises a second telescopic end and a second fixed end opposite to each other, wherein the second telescopic end can be extended and retracted relative to the second fixed end; The first telescopic end is connected to the limiting member (22), the first fixed end is connected to the second telescopic end, and the second fixed end is connected to the electrostatic adsorption member (21); The telescopic direction of the first telescopic end is parallel to the adsorption surface (210), and the telescopic direction of the second telescopic end is perpendicular to the adsorption surface (210).

5. The vapor deposition device according to claim 1, wherein The limiting member (22) comprises a contact limiting surface for contacting the outer surface of the back plate (W) to be evaporated on the adsorption surface (210), and at least the material of the contact limiting surface comprises an antistatic material.

6. The vapor deposition device according to claim 5, characterized in that The material of the contact limiting surface includes a flexible material.

7. The evaporation device according to claim 1, characterized in that The limiting member (22) comprises a contact limiting surface for contacting the outer surface of the back plate (W) to be evaporated on the adsorption surface (210), and the shape of the contact limiting surface is circular or elliptical.

8. The evaporation device according to claim 1, wherein The evaporation device comprises a magnetic suspension drive mechanism, which is installed on the transport track (12) and / or the electrostatic adsorption member (21) to drive the limiting member (22) to move along the transport track (12).

9. The evaporation device according to claim 1, wherein The evaporation device further comprises an evaporation source (40), wherein the evaporation source (40) is located in the evaporation chamber (11); when the electrostatic adsorption component (21) is located at the evaporation position in the first posture, the evaporation source (40) and the electrostatic adsorption component (21) are spaced apart along a first direction, the first direction is perpendicular to the vertical direction, and the evaporation nozzle (41) of the evaporation source (40) faces the surface to be evaporated of the back plate (W) to be evaporated.

10. The vapor deposition device according to claim 9, characterized in that The evaporation source (40) includes multiple groups of evaporation nozzles (41) and multiple crucibles (42), the crucibles (42) are used to contain and heat the evaporation material, the multiple groups of evaporation nozzles (41) are spaced apart in the vertical direction, the multiple crucibles (42) are spaced apart in the vertical direction, and each of the crucibles (42) and each group of the evaporation nozzles (41) are connected in a one-to-one correspondence.

11. The evaporation device according to claim 10, wherein: The evaporation source (40) further comprises a plurality of gas collecting chambers (43), each of the gas collecting chambers (43) is connected to each of the crucibles (42) in a one-to-one correspondence, and each of the gas collecting chambers (43) is provided with a group of the evaporation nozzles (41).

12. The vapor deposition device according to claim 9, wherein The evaporation nozzle (41) extends obliquely upward.

13. The vapor deposition device according to claim 1, wherein The evaporation device further comprises a controller, a loading mechanism (13) and a unloading mechanism (14); the electrostatic adsorption member (21) corresponds to the loading mechanism (13) when located at the loading position; the loading mechanism (13) is used to place the back plate (W) to be evaporated on the adsorption surface (210) of the electrostatic adsorption member (21) under the control of the controller; When the electrostatic adsorption component (21) is located at the unloading position, it corresponds to the unloading mechanism (14), and the unloading mechanism (14) is used to remove the back plate (W) to be evaporated from the electrostatic adsorption component (21) under the control of the controller.

14. The vapor deposition device according to claim 13, wherein The evaporation device further comprises a bracket (23), the bracket (23) being connected between the carrier track (12) and the electrostatic adsorption member (21), the electrostatic adsorption member (21) being rotatably connected to the bracket (23) so as to switch between the first posture and the second posture relative to the carrier track (12), the extension direction of the rotation axis of the electrostatic adsorption member (21) being perpendicular to the vertical direction and parallel to the adsorption surface (210), and in the second posture, the adsorption surface (210) being substantially perpendicular to the vertical direction; Under the control of the controller, the loading mechanism (13) places the back plate (W) to be evaporated on the adsorption surface (210) of the electrostatic adsorption component (21) located at the loading position and in the second posture, and the receiving component carrying the back plate (W) to be evaporated is switched from the second posture to the first posture and then moves from the loading position toward the evaporation position.

15. The vapor deposition device according to claim 13, wherein The carrying track (12) is a closed loop track, and the loading mechanism (13), the vapor deposition chamber (11) and the unloading mechanism (14) are distributed at different positions of the closed loop track.

16. A display panel production device, characterized in that: The production equipment includes the evaporation device according to any one of claims 1 to 15.

17. A display panel, characterized in that: The display panel is manufactured by the display panel production equipment described in claim 16 above, and the display panel includes a substrate (Q), a structural functional layer (50) and an organic encapsulation layer (60) stacked in sequence, and the organic encapsulation layer (60) includes at least two organic thin films stacked in sequence in a direction away from the substrate (40).

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