Electrode assembly and deposition apparatus

Abstract

The invention discloses an electrode assembly and a deposition apparatus. The electrode assembly comprises a heating plate, a carrier plate and a connecting piece. The carrier plate is arranged on the heating plate. The connecting pieces are located between the carrier plate and the heating plate, one ends of the connecting pieces are fixedly connected to the heating plate, the other ends of the connecting pieces abut against the carrier plate, and the carrier plate and the heating plate are electrically connected through the connecting pieces. In this way, the reliability of electric conduction between the carrier plate and the heating plate can be improved.

Description

Technical Field

[0001] The present application relates to the field of film coating technology, and in particular to electrode assemblies and deposition equipment. Background Art

[0002] Deposition equipment coats substrates on carrier plates by ionizing process gases. With the continuous advancement of deposition processes, the requirements for deposition equipment production capacity are increasing, and deposition equipment is also growing in size. In related technologies, large electrode assemblies in deposition equipment can deform over time, leading to poor contact and poor coating quality. Summary of the Invention

[0003] The embodiments of the present application provide an electrode assembly and a deposition device, which can improve the reliability of electrical conduction between a carrier plate and a heating plate.

[0004] In a first aspect, embodiments of the present application provide an electrode assembly. The electrode assembly includes a heating plate, a carrier plate, and connecting plates. The carrier plate is disposed on the heating plate. Multiple connecting plates are positioned between the carrier plate and the heating plate. One end of the connecting plate is fixedly connected to the heating plate, and the other end of the connecting plate abuts the carrier plate, thereby electrically connecting the carrier plate and the heating plate.

[0005] Optionally, the sum of the elastic forces of the plurality of connecting pieces is less than or equal to the gravity of the carrier plate.

[0006] Optionally, the carrier includes a bearing portion and a supporting portion, the supporting portion is arranged on the periphery of the bearing portion and is located on a side of the bearing portion close to the heating plate, the connecting piece abuts the bearing portion, and the supporting portion is used to abut the heating plate.

[0007] Optionally, the thickness of the connecting piece is between 0.1 mm and 0.8 mm.

[0008] Optionally, one end of the connecting piece abutting against the carrier plate is higher than the upper surface of the heating plate.

[0009] Optionally, the connection piece and / or the heating plate are grounded.

[0010] Optionally, a reinforcement piece is further provided on a side of the heating plate facing away from the carrier plate, the heating plate is fixed to the reinforcement piece, and the rigidity of the reinforcement piece is greater than the rigidity of the heating plate.

[0011] Optionally, the reinforcement includes a first reinforcement portion and a second reinforcement portion arranged in an annular shape, the second reinforcement portion is arranged on the periphery of the first reinforcement portion, and the reinforcement also includes a connecting portion arranged between the first reinforcement portion and the second reinforcement portion, and multiple connecting portions are arranged at circumferential intervals on the first reinforcement portion.

[0012] Optionally, a plurality of heat-insulating members are provided on a side of the reinforcement member facing away from the heating plate, for cooperating with the lifting mechanism.

[0013] In a second aspect, embodiments of the present application provide a deposition apparatus. The deposition apparatus includes an apparatus body and the aforementioned electrode assembly. The apparatus body has a process chamber, and the electrode assembly is movably disposed within the process chamber.

[0014] The beneficial effects of the present application are as follows: unlike the prior art, the carrier plate can abut against the connecting piece provided above the heating plate, and the carrier plate can apply pressure to the connecting piece, thereby causing the connecting piece to elastically deform and maintain electrical conduction with the carrier plate. This ensures that the charge on the carrier plate can be promptly and continuously transferred to the heating plate and then grounded through the heating plate. By providing the connecting piece, the carrier plate can maintain electrical conduction with the heating plate even in the event of possible deformation and a gap between the carrier plate and the heating plate, thereby improving the reliability of the electrical conduction between the carrier plate and the heating plate and ensuring that the charge on the carrier plate can be promptly grounded. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of an embodiment of a deposition system of the present application;

[0016] Figure 2 Schematic diagram of the cooperation between the electrode assembly and the device body in the deposition system embodiment of the present application;

[0017] Figure 3 This is a schematic structural diagram of an embodiment of the electrode assembly of the present application without a carrier plate;

[0018] Figure 4 It is a schematic structural diagram of the reinforcement member in the embodiment of the electrode assembly of the present application. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] Plasma-enhanced chemical vapor deposition (PECVD) equipment (referred to as deposition equipment) is a thin film deposition technology widely used in semiconductors, optoelectronics, display devices, and other fields. It uses plasma to enhance gas-phase chemical reactions, causing precursor gases to react chemically on the substrate surface and deposit to form a solid thin film.

[0021] The production capacity of the deposition equipment currently used in the photovoltaic industry is in increasing demand, and the corresponding equipment chamber size is also getting larger and larger, and the size of the lower electrode that matches it is also getting larger and larger. The larger-sized lower electrode is in a high-temperature state for a long time, and often deforms after a period of use. This phenomenon will cause a gap between the carrier plate and the lower electrode, resulting in uneven heating of the carrier plate. In addition, due to the gap between the carrier plate and the lower electrode, the charge of the carrier plate above the gap cannot be conducted to the ground through the lower electrode in time, which will affect the coating quality of the entire carrier plate. When a high-power power supply is fed in, the gap between the carrier plate and the lower electrode is likely to cause discharge when the carrier plate is deformed, and the heat generated by the discharge will damage the lower electrode and the carrier plate. Therefore, how to maintain continuous conduction between the lower electrode and the carrier plate is a technical problem that needs to be solved. In order to improve the above-mentioned technical problems, the present application can provide the following embodiments.

[0022] Combine Figure 1 The embodiment of the present application provides a deposition device 1. The deposition device 1 includes a device body 10 and an electrode assembly 30. The device body 10 has a process chamber 101, and the electrode assembly 30 is movably disposed in the process chamber 101.

[0023] Specifically, the device body 10 has a process chamber 101, and the process chamber 101 is provided with an electrode assembly 30 and a feeding assembly 20 parallel to each other. The electrode assembly 30 is arranged below the feeding assembly 20. The deposition device 1 also includes a radio frequency source and components such as an air inlet pipe and an air outlet pipe connected to the process chamber 101. The process chamber 101 can provide the vacuum environment required for the coating process. The feeding assembly 20 is located at the upper part of the process chamber 101, usually composed of a cathode plate and a spray plate and connected to an external power supply. The electrode assembly 30 is located at the lower part of the process chamber 101 and is used to carry the substrate to be coated. The electrode assembly 30 can make the substrate to be coated reach the temperature required for the process. The electrode assembly 30 needs to be grounded. The feeding assembly 20 and the electrode assembly 30 constitute a positive and negative discharge interval. The feeding assembly 20 and the electrode assembly 30 excite the process gas to generate plasma through power discharge, and coat the surface of the substrate.

[0024] In some embodiments, the deposition device 1 further includes a lifting mechanism (not shown), which can carry the electrode assembly 30 and drive the electrode assembly 30 to rise and fall, thereby meeting the process requirements of the coating and facilitating the transfer of the substrate.

[0025] Combine Figure 2 and Figure 3 The present embodiment provides an electrode assembly 30. The electrode assembly 30 includes a heating plate 31, a carrier plate 32, and a connecting piece 33. The carrier plate 32 is disposed on the heating plate 31. The carrier plate 32 is used to support a substrate. The heating plate 31 generates heat to heat the carrier plate 32 and the substrate supported by the carrier plate 32, thereby reaching the required process temperature.

[0026] Among them, a plurality of connecting pieces 33 are located between the carrier 32 and the heating plate 31, one end of the connecting piece 33 is fixedly connected to the heating plate 31, and the other end of the connecting piece 33 abuts against the carrier 32, and the connecting piece 33 electrically connects the carrier 32 and the heating plate 31. The carrier 32 is movable relative to the connecting piece 33 and the heating plate 31, and the carrier 32 can be transferred into or out of the process chamber 101. The carrier 32 can be placed above the heating plate 31. When the carrier 32 is placed above the heating plate 31, the carrier 32 can abut against the connecting piece 33 set above the heating plate 31, and the carrier 32 can apply pressure to the connecting piece 33, so that the connecting piece 33 can produce elastic deformation and maintain electrical conduction with the carrier 32. This ensures that the charge on the carrier 32 can be timely and continuously conducted to the heating plate 31, and then grounded through the heating plate 31. By providing the connecting piece 33, the carrier plate 32 can maintain electrical conduction with the heating plate 31 even when the carrier plate 32 may be deformed and a gap is generated between the carrier plate 32 and the heating plate 31, thereby improving the reliability of the electrical conduction between the carrier plate 32 and the heating plate 31 and ensuring that the charge on the carrier plate 32 can be grounded in time.

[0027] On the other hand, by providing the connecting piece 33, the carrier plate 32 and the heating plate 31 can maintain a continuous conductive state, and when a high-power power supply is fed in, the abnormal phenomenon of discharge generated in the gap between the carrier plate 32 and the heating plate 31 is reduced.

[0028] Furthermore, by providing a plurality of connecting pieces 33 , the connecting pieces 33 can correspond to different areas of the carrier 32 , thereby further increasing the reliability of electrical conduction between the carrier 32 and the heating plate 31 .

[0029] Optionally, the connecting piece 33 is made of metal and may be in an S-shaped, C-shaped, U-shaped, Y-shaped, or Z-shaped shape, which is not specifically limited herein. The connecting piece 33 may be made of, for example, aluminum, nickel, a nickel alloy, a titanium alloy, or stainless steel.

[0030] In some embodiments, the sum of the elastic forces of the multiple connecting pieces 33 is less than or equal to the weight of the carrier 32. With this arrangement, when the carrier 32 is placed, the elastic forces of the multiple connecting pieces 33 are insufficient to fully support the carrier 32. As a result, the carrier 32 will come into contact with the heating plate 31 under the influence of gravity, allowing the charge on the carrier 32 to be directly transferred to the heating plate 31 in addition to passing through the connecting pieces 33.

[0031] On the other hand, when there are a large number of connecting pieces 33, the elastic modulus and deformation of each connecting piece 33 will vary. If the weight of the carrier plate 32 is less than the sum of the elastic forces of the connecting pieces 33, the carrier plate 32 will easily tilt when placed on the connecting pieces 33, causing the carrier plate 32 to no longer be parallel to the feed assembly 20, thereby affecting the ionization of the process gas and the uniformity of the coating. By setting the sum of the elastic forces of the multiple connecting pieces 33 to be less than or equal to the weight of the carrier plate 32, when the carrier plate 32 is placed on the multiple connecting pieces 33, the connecting pieces 33 are deformed by the pressure of the carrier plate 32, which can enable the carrier plate 32 to contact the heating plate 31, thereby ensuring that the carrier plate 32 can be placed horizontally as much as possible, thereby reducing the impact on the uniformity of the coating.

[0032] In some embodiments, the carrier 32 includes a bearing portion 321 and a supporting portion 322. The supporting portion 322 is arranged on the outer periphery of the bearing portion 321 and is located on the side of the bearing portion 321 close to the heating plate 31. The connecting piece 33 abuts against the bearing portion 321, and the supporting portion 322 is used to abut against the heating plate 31.

[0033] After the carrier 32 is placed, the larger portion of the carrier 321 abuts against the connecting piece 33. The carrier 321 exerts pressure on the connecting piece 33, ensuring that the connecting piece 33 continuously abuts against the carrier 321, thereby improving the reliability of electrical conduction between the carrier 32 and the heating plate 31. After the carrier 32 is placed, the connecting piece 33 is compressed. As the carrier 32 moves downward, the supporting portion 322 abuts against the heating plate 31, providing support for the carrier 321.

[0034] Furthermore, when the sum of the elastic forces of the plurality of connecting pieces 33 is less than or equal to the weight of the carrier 32 , the support portion 322 can abut against the heating plate 31 , thereby keeping the carrier portion 321 parallel to the feeding assembly 20 .

[0035] In some embodiments, the thickness of the connecting piece 33 is between 0.1 mm and 0.8 mm, for example, 0.3 mm, 0.5 mm, or 0.7 mm.

[0036] If the width of the connecting pieces 33 is uniform, but the thickness of the connecting pieces 33 is too large, deformation of the connecting pieces 33 will be more difficult, and uneven material properties and positions between the connecting pieces 33 will have a significant impact on the placement of the carrier 32. Furthermore, if the sum of the elastic forces of multiple connecting pieces 33 is less than or equal to the weight of the carrier 32, excessive thickness of the connecting pieces 33 will result in a reduction in the number of connecting pieces 33. This reduction in the number of connecting pieces 33 will result in fewer connecting pieces 33 remaining in contact with the carrier 32 in the event of possible deformation, reducing the reliability of electrical conduction between the carrier 32 and the heating plate 31.

[0037] If the connecting pieces 33 have a uniform width, but their thickness is too small, their strength will be too low, and they will be more susceptible to fatigue during use. They will also be more likely to undergo irreversible deformation, resulting in an inability to reliably contact the carrier board 32 and, in turn, reducing the reliability of electrical conduction between the carrier board 32 and the heating plate 31. If the sum of the elastic forces of multiple connecting pieces 33 is less than or equal to the weight of the carrier board 32, a too small thickness will result in an increased number of connecting pieces 33, making equipment production more difficult.

[0038] In some embodiments, the end of the connecting piece 33 that abuts the carrier plate 32 is higher than the upper surface of the heating plate 31. In other words, the connecting piece 33 protrudes from the heating plate 31. This allows the carrier plate 32 to more easily abut the connecting piece 33, and the connecting piece 33 deforms accordingly when subjected to pressure. In some embodiments, the connecting piece 33 is completely higher than the upper surface of the heating plate 31, allowing the connecting piece 33 to have sufficient deformation travel, further facilitating the placement of the carrier plate 32.

[0039] In some embodiments, the connecting piece 33 and / or the heating plate 31 are grounded. Specifically, the connecting piece 33 can be directly grounded. The connecting piece 33 can be indirectly grounded by being connected to the heating plate 31. The connecting piece 33 and the heating plate 31 can also be both grounded.

[0040] In order to keep the electrode assembly 30 grounded during the lifting and lowering process, the electrode assembly 30 also includes a grounding plate 36. The grounding plate 36 can be directly grounded or connected to the side wall of the process chamber 101 and then grounded through the equipment body 10. The grounding plate 36 can be connected to the heating plate 31 or to the connecting plate 33. In this way, the charge conduction path of the electrode assembly 30 includes the following: (1) the charge on the carrier plate 32 is conducted to the connecting plate 33, the connecting plate 33 is conducted to the heating plate 31, the heating plate 31 is conducted to the grounding plate 36, and the grounding plate 36 is grounded. Alternatively, (2) the charge on the carrier plate 32 is conducted to the connecting plate 33, the connecting plate 33 is conducted to the heating plate 31, the heating plate 31 is conducted to the grounding plate 36, the elastic grounding plate 36 is connected to the side wall of the process chamber 101, and the side wall of the process chamber 101 is grounded. The grounding plate 36 can produce telescopic deformation, so that the grounding plate 36 can maintain connection with the heating plate 31 during the lifting and lowering process of the electrode assembly 30.

[0041] Combine Figures 2 to 4In some embodiments, a reinforcement member 34 is provided on the side of the heating plate 31 facing away from the carrier plate 32. The heating plate 31 is fixed to the reinforcement member 34, and the stiffness of the reinforcement member 34 is greater than the stiffness of the heating plate 31. The provision of the reinforcement member 34 can reduce deformation of the heating plate 31 during repeated heating, thereby improving the reliability of the electrical connection between the carrier plate 32 and the heating plate 31 when placed, and reducing the situation where the carrier plate 32 is not parallel to the feeding assembly 20.

[0042] In some embodiments, the reinforcement 34 includes a first reinforcement portion 341 and a second reinforcement portion 342 arranged in an annular shape, the second reinforcement portion 342 is arranged on the periphery of the first reinforcement portion 341, and the reinforcement 34 also includes a connecting portion 343 arranged between the first reinforcement portion 341 and the second reinforcement portion 342, and a plurality of connecting portions 343 are arranged at circumferential intervals on the first reinforcement portion 341. The plurality of connecting portions 343 can connect the first reinforcement portion 341 and the second reinforcement portion 342 in a radial shape. The second reinforcement portion 342 can be arranged corresponding to the portion of the heating plate 31 close to the edge, and the first reinforcement portion 341 can be arranged corresponding to the portion of the heating plate 31 close to the center. The connecting portion 343 can connect the two, so that the reinforcement 34 becomes a component that can increase the rigidity of the heating plate 31. By providing the reinforcement 34, the deformation of the heating plate 31 can be effectively reduced.

[0043] In some embodiments, a plurality of heat-insulating members 35 are provided on a side of the reinforcement member 34 facing away from the heating plate 31 for cooperating with a lifting mechanism (not shown).

[0044] Specifically, the electrode assembly 30 needs to be connected to a lifting mechanism, which lifts and lowers the electrode assembly 30. To provide insulation and heat isolation, a thermal insulation member 35 is installed between the lower electrode assembly 30 and the lifting mechanism, where the reinforcement member 34 contacts the lifting mechanism. This insulation member 35 can be made of insulating ceramic.

[0045] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electrode assembly, characterized in that: include: Heating plate; a carrier plate, the carrier plate being arranged on the heating plate; Connecting pieces, a plurality of connecting pieces are located between the carrier plate and the heating plate, one end of the connecting piece is fixedly connected to the heating plate, and the other end of the connecting piece abuts against the carrier plate, and the connecting piece electrically connects the carrier plate and the heating plate.

2. The electrode assembly according to claim 1, wherein: The sum of the elastic forces of the plurality of connecting pieces is less than or equal to the gravity of the carrier plate.

3. The electrode assembly according to claim 1, wherein: The carrier plate includes a bearing portion and a supporting portion. The supporting portion is arranged on the outer periphery of the bearing portion and is located on a side of the bearing portion close to the heating plate. The connecting piece abuts against the bearing portion, and the supporting portion is used to abut against the heating plate.

4. The electrode assembly according to claim 1, wherein: The thickness of the connecting piece is between 0.1 mm and 0.8 mm.

5. The electrode assembly according to claim 1, wherein: One end of the connecting piece abutting against the carrier plate is higher than the upper surface of the heating plate.

6. The electrode assembly according to claim 1, wherein: The connecting piece and / or the heating plate are grounded.

7. The electrode assembly according to claim 1, wherein: A reinforcing member is further provided on a side of the heating plate facing away from the carrier plate. The heating plate is fixed to the reinforcing member. The rigidity of the reinforcing member is greater than that of the heating plate.

8. The electrode assembly according to claim 7, wherein: The reinforcement member includes a first reinforcement portion and a second reinforcement portion arranged in an annular shape, the second reinforcement portion is arranged on the periphery of the first reinforcement portion, and the reinforcement member also includes a connecting portion arranged between the first reinforcement portion and the second reinforcement portion, and a plurality of the connecting portions are arranged at circumferential intervals on the first reinforcement portion.

9. The electrode assembly according to claim 7, wherein: A plurality of heat-insulating parts are provided on a side of the reinforcement member facing away from the heating plate, for cooperating with the lifting mechanism.

10. A deposition device, characterized in that: include: The equipment body has a process cavity; The electrode assembly according to any one of claims 1 to 9, wherein the electrode assembly is movably disposed in the process chamber.

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