Copper cylinder conductive cooling water tank for VCP plating line

Abstract

The invention discloses a copper cylinder conductive cooling water tank for a VCP plating line, the copper cylinder conductive cooling water tank for the VCP plating line comprises a conductive structure, a guide structure and a conveying structure, the conveying structure is movably connected between the conductive structure and the guide structure; the conductive structure comprises a conductive groove, a busbar and a plurality of conductive contacts, the conductive groove is arranged on the top sides of the guide structure and the conveying structure, and the busbar and the plurality of conductive contacts are arranged in the conductive groove; the guide structure extends corresponding to the conductive groove, and the conveying structure is movably connected to the guide structure; one end, facing the conductive groove, of the conveying structure extends and movably abuts against the conductive contacts, and the other end of the conveying structure is used for clamping the substrate. The top edge of the side wall of the conductive groove is provided with an overflow port. According to the copper cylinder conductive cooling water tank for the VCP plating line, the normal-temperature or low-temperature liquid conductive medium with good conductivity is filled in the conductive tank, so that a water bath soaking type conductive structure is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating lines, in particular to a copper cylinder conductive cooling water tank for a VCP electroplating line. Background Art

[0002] A VCP (Vertical Continuous Plating) line is a highly efficient and precise electroplating system primarily used to deposit uniform metal coatings on substrates (such as printed circuit boards (PCBs), semiconductor packaging substrates, or metal workpieces) while continuously conveying them vertically. Its key advantages lie in high production efficiency, coating uniformity, and adaptability to complex structures (such as microvias and blind vias), making it widely used in electronics manufacturing, semiconductor packaging, and other fields. Specifically, a VCP plating line utilizes a vertical continuous conveying system to suspend substrates vertically on a conveyor or fixture, which then passes through multiple plating tanks to complete the electroplating process. This system utilizes dynamic electrolyte management, high-precision current control, and a low-impedance circuit using conductive rollers or conductive contacts to achieve efficient and uniform plating. By leveraging these core technologies, such as vertical continuous conveying, dynamic electrolyte management, and segmented current control, the VCP plating line addresses the bottlenecks of coating uniformity and efficiency in high-density electronics manufacturing, becoming a mainstream process for modern precision electroplating. As electronic devices develop towards miniaturization and three-dimensional integration, higher performance and lower carbon emissions of VCP technology are currently important development directions for vertical continuous electroplating.

[0003] For existing VCP electroplating lines, the conductive structure is mainly composed of a power input module consisting of conductive contacts, a busbar, a dynamic compensation device, a cable, and a connector. It is one of the important structures that combines the substrate and the electroplating solution to form a circuit to complete the electroplating process. In this type of conductive structure, the conduction between the conductive contact and the substrate is generally achieved by the active cooperation of a copper conductive unit and a copper conductive contact. However, during the high current operation of the equipment, the two are prone to heat up and cause overheating, thereby affecting the conduction between the conductive contact and the substrate and reducing the conductive efficiency. At the same time, copper is easily oxidized at high temperatures to form an oxide layer, which in turn increases the resistance of the conductive unit or conductive contact, thereby increasing production energy consumption and greatly reducing the service life of the conductive structure, resulting in increased production costs. In addition, during the relative movement and friction between the two, conductive carbon brush dust is easily generated and scattered into the production environment, causing contamination of the solution. Summary of the Invention

[0004] Based on this, it is necessary to provide a copper cylinder conductive cooling water tank for VCP electroplating line to address the technical problems that the conductive structure of the existing VCP electroplating line is prone to heat and dust.

[0005] A conductive cooling water trough for a copper cylinder of a VCP electroplating line comprises a conductive structure, a guide structure and a conveying structure, wherein the conductive structure and the guide structure are both fixedly connected to a frame, and the conveying structure is movably connected between the conductive structure and the guide structure.

[0006] The conductive structure includes a conductive slot, a bus and a number of conductive contacts. The conductive slot is arranged on the top side of the guide structure and the conveying structure. The bus and the number of conductive contacts are arranged in the conductive slot, wherein the number of conductive contacts are arranged along the conveying direction of the substrate. One end of the bus is electrically connected to the output end of the external power supply, and the other end of the bus is electrically connected to the input ends of the number of conductive contacts to realize the power input of the conductive structure; the guide structure is extended corresponding to the conductive slot, and the conveying structure is movably connected to the guide structure; the conveying structure extends toward one end of the conductive slot and movably abuts against the number of conductive contacts, and the other end of the conveying structure is used to clamp the substrate.

[0007] An overflow port is provided at the top edge of the side wall of the conductive groove, and the overflow port is provided on the top side of several conductive contacts. Based on this, the conductive groove is filled with a normal temperature or low temperature liquid conductive medium with good conductivity to realize a water bath immersion conductive structure.

[0008] In one embodiment, the guide structure is configured as a guide plate, which is disposed adjacent to the bottom end of the conductive slot, and the conveying structure is movably engaged with the side of the guide plate facing the conductive slot.

[0009] In one embodiment, the above-mentioned conveying structure includes a driving plate, a conductive unit, a connecting plate and a clamp, the driving plate is arranged on the side of the guide plate facing the conductive groove; one side surface of the connecting plate is connected to the driving plate, and the other side surface of the connecting plate is movably matched with the guide plate; one end of the conductive unit is connected to one end of the connecting plate, and the other end of the conductive unit extends into the inside of the conductive groove and is electrically connected to a number of conductive contacts; the clamp is arranged at the bottom edge of the driving plate to clamp the substrate to be electroplated.

[0010] In one embodiment, the conveying structure includes a plurality of connecting plates, which are sequentially arranged on the top of the driving plate along the extending direction of the guide plate, and the plurality of connecting plates are movably matched with the guide plates.

[0011] In one embodiment, the above-mentioned conveying structure includes a plurality of conductive units, which are respectively connected to a plurality of connecting plates one by one, and the plurality of conductive units respectively extend into the interior of the conductive slot, so that each conductive unit can be electrically connected to a plurality of conductive contacts during movement.

[0012] In one embodiment, the conveying structure includes a plurality of clamps, and the plurality of clamps are arranged along the bottom edge of the driving plate.

[0013] In one embodiment, the driving plate may be configured as a conveyor belt.

[0014] In one embodiment, each of the above-mentioned connecting plates is provided with a first guide wheel and a second guide wheel, and the first guide wheel and the second guide wheel are respectively rotatably provided at the top and bottom ends of the connecting plate, and the first guide wheel and the second guide wheel are respectively rotatably matched with the top and bottom side edges of the guide plate.

[0015] In one embodiment, two second guide wheels are provided for each connecting plate, and the two second guide wheels are connected to the connecting plate through a connecting block provided with a matching groove; accordingly, the bottom side edge of the guide plate is fitted into the matching groove, and the two second guide wheels are respectively rotated to fit on both side surfaces of the guide plate.

[0016] In one embodiment, the conductive structure further includes a fixing base disposed at the bottom of the conductive slot and extending along the extension direction of the conductive slot; the busbar and a plurality of conductive contacts are disposed on the top side surface of the fixing base.

[0017] In one embodiment, the conductive structure further includes a plurality of elastic members, each of which corresponds to a plurality of conductive contacts, and each elastic member is disposed between the corresponding conductive contact and the fixing seat, thereby realizing an elastic connection between the conductive contact and the fixing seat.

[0018] In one embodiment, each of the above-mentioned connecting plates is further provided with an adjusting guide wheel, which is mounted on a side surface of the connecting plate facing the guide plate, and the adjusting guide wheel is movably in contact with the surface of the guide plate.

[0019] The above-mentioned copper cylinder conductive cooling water tank for VCP electroplating line realizes a water bath immersion conductive structure by filling the conductive tank with a room temperature or low temperature liquid conductive medium with good conductivity. In actual operation, the overflow port can control the liquid level of the liquid conductive medium in the conductive tank, while ensuring good conduction between several conductive contacts and the conveying structure, avoiding the overflow of the liquid conductive medium in the conductive tank and affecting the stability of the system operation. From the above settings, it can be seen that the copper cylinder conductive cooling water tank of the VCP electroplating line of the present invention sets the conductive structure to conduct electricity by immersion in a water bath. Therefore, under high current conditions, several conductive contacts can be well connected between the power input end of the conveying structure, avoiding overheating and preventing safety accidents such as fire caused by high temperature and damage to equipment; at the same time, water bath immersion can effectively control the working temperature of the copper conductive contacts, avoiding oxidation at high temperature to form a high-resistance oxide layer, thereby reducing production energy consumption while extending the service life of the conductive structure; in addition, in the water bath immersion environment, the friction loss between several conductive contacts and the power input end of the conveying structure is reduced, and the generation of conductive carbon brush dust is effectively avoided, thereby reducing pollution to the production environment and potions. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of a copper cylinder conductive cooling water tank for a VCP electroplating line in one embodiment; Figure 2 for Figure 1 An enlarged structural diagram of part M in the illustrated embodiment; Figure 3 Schematic diagram of the structure of a copper cylinder conductive cooling water tank for a VCP electroplating line in one embodiment. DETAILED DESCRIPTION

[0021] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0024] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0025] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0027] See also Figures 1 to 3The present invention discloses a copper cylinder conductive cooling water trough 1 for a VCP electroplating line, which includes a conductive structure 10, a guide structure, and a conveying structure 20. The conductive structure 10 and the guide structure are fixedly connected to a frame (not shown), and the conveying structure 20 is movably connected between the conductive structure 10 and the guide structure, so that the conveying structure 20 can carry out directional and fixed conveying of substrates to be electroplated based on the guide structure. During the conveying process, the conductive structure 10 inputs electrical energy to the substrate through the conveying mechanism and combines with the plating solution to form a loop to complete the electroplating work. Based on the above arrangement, specifically, the conductive structure 10 includes a conductive slot 11, a bus 12 and a plurality of conductive contacts 13. The conductive slot 11 is arranged on the top side of the guide structure and the conveying structure 20, and the bus 12 and the plurality of conductive contacts 13 are arranged in the conductive slot 11, wherein the plurality of conductive contacts 13 are arranged along the conveying direction of the substrate, that is, along the movement direction of the conveying structure 20. One end of the bus 12 is electrically connected to the output end of the external power supply, and the other end of the bus 12 is electrically connected to the input ends of the plurality of conductive contacts 13 respectively to realize the power input of the conductive structure 10; correspondingly, the guide structure is extended corresponding to the conductive slot 11, and the conveying structure 20 is movably connected to the guide structure, so that the conveying structure 20 can slide stably along the guide structure; and the conveying structure 20 extends toward one end of the conductive slot 11 and movably abuts against the plurality of conductive contacts 13, and the other end of the conveying structure 20 is used to clamp the substrate, thereby realizing conduction between the substrate and the conductive structure 10 while conveying the substrate. Furthermore, an overflow port a is provided on the top edge of the side wall of the conductive groove 11, and the overflow port a is provided on the top side of several conductive contacts 13. Based on this, the conductive groove 11 is filled with a liquid conductive medium at room temperature or low temperature with good conductivity, so as to realize a water bath immersion type conductive structure 10. In actual operation, the overflow port a can control the liquid level of the liquid conductive medium in the conductive groove 11, while ensuring good conduction between several conductive contacts 13 and the conveying structure 20, avoiding the overflow of the liquid conductive medium inside the conductive groove 11 and affecting the stability of the system operation. From the above settings, it can be seen that the copper cylinder conductive cooling water tank of the VCP electroplating line of the present invention sets the conductive structure 10 to be conductive by water bath immersion. Therefore, when power is on, several conductive contacts 13 can be well connected with the power input end of the conveying structure 20, avoiding local short circuit and heating caused by poor contact; at the same time, water bath immersion can effectively control the working temperature of the copper conductive contact 13, avoiding its oxidation at high temperature to form a high-resistance oxide layer, thereby extending the service life of the conductive structure 10; in addition, in the water bath immersion environment, the friction loss between the several conductive contacts 13 and the power input end of the conveying structure 20 is reduced, and the generation of toner particles is effectively avoided, thereby reducing pollution to the production environment.

[0028] Furthermore, the guide structure is configured as a guide plate 30, which is arranged on the adjacent side of the bottom end of the conductive groove 11, and the guide plate 30 extends along the preset conveying direction of the substrate and is connected to the frame (not shown). The conveying structure 20 is movably fitted with the side of the guide plate 30 facing the conductive groove 11, so that the conveying structure 20 can be directed and moved at a constant speed along the guide plate 30.

[0029] Furthermore, the conveying structure 20 includes a drive plate 21, a conductive unit 22, a connecting plate 23, and a clamp 24. The drive plate 21 is arranged on the side of the guide plate 30 facing the conductive slot 11. One side surface of the connecting plate 23 is connected to the drive plate 21, and the other side surface of the connecting plate 23 is movably engaged with the guide plate 30. One end of the conductive unit 22 is connected to one end of the connecting plate 23, and the other end of the conductive unit 22 extends into the conductive slot 11 and is electrically connected to a plurality of conductive contacts 13. The clamp 24 is arranged at the bottom edge of the drive plate 21 to clamp the substrate to be electroplated. Based on the above arrangement, the drive plate 21 is movably connected to the guide plate 30 via the connecting plate 23, so that the drive plate 21 can drive the conductive unit 22 and the clamp 24 to move in a directional manner along the guide plate 30.

[0030] In one embodiment, further, the conveying structure 20 includes a plurality of connecting plates 23, and the plurality of connecting plates 23 are arranged in sequence along the extension direction of the guide plate 30 and are arranged on the top of the driving plate 21. The plurality of connecting plates 23 are respectively movably cooperated with the guide plate 30. Thus, based on the coordinated cooperation between the plurality of connecting plates 23 and the guide plate 30, the connection stability between the driving plate 21 and the guide plate 30 can be greatly improved, thereby enhancing the guiding function of the guide plate 30.

[0031] In one embodiment, further, the conveying structure 20 includes a plurality of conductive units 22, and the plurality of conductive units 22 are respectively connected to a plurality of connecting plates 23, and the plurality of conductive units 22 respectively extend into the interior of the conductive slot 11, thereby enabling each conductive unit 22 to be electrically connected to a plurality of conductive contacts 13 during movement.

[0032] In one embodiment, the conveying structure 20 further includes a plurality of clamps 24, which are arranged along the bottom edge of the driving plate 21, so that the driving plate 21 can clamp and connect the substrate through the plurality of clamps 24, thereby strengthening the connection stability between the driving plate 21 and the substrate.

[0033] In one embodiment, specifically, the driving plate 21 may be configured as a conveyor belt, so as to achieve relative movement between the driving plate 21 and the guide plate 30 , so as to facilitate batch conveying of substrates.

[0034] Furthermore, each connecting plate 23 is provided with a first guide wheel 231 and a second guide wheel 232. The first guide wheel 231 and the second guide wheel 232 are respectively rotatably provided at the top and bottom ends of the connecting plate 23, and the first guide wheel 231 and the second guide wheel 232 are respectively rotatably matched with the top and bottom side edges of the guide plate 30, thereby realizing a movable connection between the connecting plate 23 and the guide plate 30.

[0035] In one embodiment, specifically, based on each connecting plate 23, two second guide wheels 232 are provided, and the two second guide wheels 232 are connected to the connecting plate 23 through a connecting block 25 provided with a matching groove b; accordingly, the bottom side edge of the guide plate 30 is matched into the matching groove b, and the two second guide wheels 232 are respectively rotated to match the two side surfaces of the guide plate 30, that is, the two second guide wheels 232 clamp the guide plate 30 to confine the bottom side edge of the guide plate 30 into the matching groove b. The matching groove b can further improve the matching stability between the connecting plate 23 and the guide plate 30, thereby enhancing the guiding ability of the guide plate 30 to a number of connecting plates 23.

[0036] Furthermore, the conductive structure 10 also includes a fixing seat 14, which is arranged at the bottom of the conductive slot 11 and extends along the extension direction of the conductive slot 11; based on this, the bus 12 and a plurality of conductive contacts 13 are arranged on the top side surface of the fixing seat 14, thereby enhancing the installation stability of the bus 12 and the plurality of conductive contacts 13.

[0037] Furthermore, the conductive structure 10 also includes a plurality of elastic members 15, each of which corresponds to a plurality of conductive contacts 13 one by one, and each elastic member 15 is arranged between the corresponding conductive contact 13 and the fixed seat 14, so as to realize an elastic connection between the conductive contact 13 and the fixed seat 14, thereby maintaining the conductive contact 13 and the conductive unit 22 in contact and conduction at a constant pressure, so as to adapt to the vibration or position displacement generated by the plurality of conductive units 22 during the movement, and realize dynamic pressure compensation.

[0038] Furthermore, each connecting plate 23 is also provided with an adjustment guide wheel 233, which is installed on the side surface of the connecting plate 23 facing the guide plate 30, and the adjustment guide wheel 233 is movably abutted against the surface of the guide plate 30 to further improve the matching stability between the connecting plate 23 and the guide plate 30, and avoid the conductive structure 10 and the connecting plate 23 from being offset due to the elastic force of the elastic member 15.

[0039] In summary, the copper cylinder conductive cooling water tank for the VCP electroplating line disclosed in the present invention realizes a water bath immersion conductive structure by filling the conductive tank with a liquid conductive medium at room temperature or low temperature with good conductivity. In actual operation, the overflow port can control the liquid level of the liquid conductive medium in the conductive tank, while ensuring good conduction between several conductive contacts and the conveying structure, avoiding the overflow of the liquid conductive medium in the conductive tank and affecting the stability of the system operation. From the above settings, it can be seen that the copper cylinder conductive cooling water tank of the VCP electroplating line of the present invention sets the conductive structure to conduct electricity by immersion in a water bath. Therefore, under high current conditions, several conductive contacts can be well connected between the power input end of the conveying structure, avoiding overheating and preventing safety accidents such as fire caused by high temperature and damage to equipment; at the same time, water bath immersion can effectively control the working temperature of the copper conductive contacts, avoiding oxidation at high temperature to form a high-resistance oxide layer, thereby reducing production energy consumption while extending the service life of the conductive structure; in addition, in the water bath immersion environment, the friction loss between several conductive contacts and the power input end of the conveying structure is reduced, and the generation of conductive carbon brush dust is effectively avoided, thereby reducing pollution to the production environment and potions.

[0040] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A copper cylinder conductive cooling water tank for VCP electroplating line, characterized in that: include: A conductive structure, a guide structure and a conveying structure, wherein the conductive structure and the guide structure are fixedly connected to the frame, and the conveying structure is movably connected between the conductive structure and the guide structure; The conductive structure includes a conductive slot, a busbar, and a plurality of conductive contacts. The conductive slot is disposed on the top side of the guide structure and the conveying structure. The busbar and the plurality of conductive contacts are disposed within the conductive slot. The plurality of conductive contacts are arranged along the conveying direction of the substrate. One end of the busbar is electrically connected to the output end of an external power source, and the other end of the busbar is electrically connected to the input ends of the plurality of conductive contacts to realize power input to the conductive structure. The guide structure extends corresponding to the conductive slot, and the conveying structure is movably connected to the guide structure. The conveying structure extends toward one end of the conductive slot and movably abuts against the plurality of conductive contacts. The other end of the conveying structure is used to clamp the substrate. An overflow port is provided at the top edge of the side wall of the conductive groove, and the overflow port is provided on the top side of several conductive contacts. Based on this, the conductive groove is filled with a normal temperature or low temperature liquid conductive medium with good conductivity to realize a water bath immersion conductive structure.

2. The copper cylinder conductive cooling water tank for VCP electroplating line according to claim 1, characterized in that: The guide structure is configured as a guide plate, which is disposed on the adjacent side of the bottom end of the conductive slot, and the conveying structure is movably matched with the side of the guide plate facing the conductive slot.

3. The copper cylinder conductive cooling water tank for VCP electroplating line according to claim 2, characterized in that: The conveying structure includes a driving plate, a conductive unit, a connecting plate and a clamp. The driving plate is arranged on the side of the guide plate facing the conductive groove; one side surface of the connecting plate is connected to the driving plate, and the other side surface of the connecting plate is movably matched with the guide plate; one end of the conductive unit is connected to one end of the connecting plate, and the other end of the conductive unit extends into the inside of the conductive groove and is electrically connected to a number of conductive contacts; the clamp is arranged at the bottom edge of the driving plate to clamp the substrate to be electroplated.

4. The copper cylinder conductive cooling water tank for VCP electroplating line according to claim 3, characterized in that: The conveying structure comprises a plurality of connecting plates, which are sequentially arranged on the top of the driving plate along the extending direction of the guide plate, and the plurality of connecting plates are movably matched with the guide plates respectively.

5. The copper cylinder conductive cooling water tank for VCP electroplating line according to claim 4, characterized in that: The conveying structure includes a plurality of conductive units, which are respectively connected to a plurality of connecting plates in a one-to-one correspondence, and the plurality of conductive units respectively extend into the inside of the conductive slot, so that each conductive unit can be electrically connected to a plurality of conductive contacts during movement.

6. The copper cylinder conductive cooling water tank for VCP electroplating line according to claim 3, characterized in that: The conveying structure comprises a plurality of clamps, and the plurality of clamps are arranged along the bottom side edge of the driving plate.

7. The copper cylinder conductive cooling water tank for VCP electroplating line according to claim 5, characterized in that: Each connecting plate is provided with a first guide wheel and a second guide wheel, which are respectively rotatably provided at the top and bottom ends of the connecting plate, and are respectively rotatably matched with the top and bottom side edges of the guide plate.

8. The copper cylinder conductive cooling water tank for VCP electroplating line according to claim 7, characterized in that: The conductive structure also includes a fixing seat, which is arranged at the bottom of the conductive slot and extends along the extension direction of the conductive slot; a bus bar and a plurality of conductive contacts are arranged on the top side surface of the fixing seat.

9. The copper cylinder conductive cooling water tank for VCP electroplating line according to claim 8, characterized in that: The conductive structure further includes a plurality of elastic members, each of which corresponds to a plurality of conductive contacts. Each elastic member is disposed between the corresponding conductive contact and the fixing seat, thereby achieving elastic connection between the conductive contact and the fixing seat.

10. The copper cylinder conductive cooling water tank for VCP electroplating line according to claim 9, characterized in that: Each connecting plate is further provided with an adjusting guide wheel, which is mounted on a side surface of the connecting plate facing the guide plate, and the adjusting guide wheel is movably in contact with the surface of the guide plate.

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