Manufacturing method of module for taking water from air

Abstract

The invention discloses a manufacturing method of a module for extracting water from air, and relates to the technical field of extracting water from air, and the manufacturing method comprises the following steps: S1, preparing a semiconductor water condensation substrate: S11, preparing a mold which comprises an upper mold and a lower mold, putting conductive metal foils into the upper mold and the lower mold respectively, forming a semiconductor particle layer between the conductive metal foil in the upper mold and the conductive metal foil in the lower mold; s12, the upper mold and the lower mold are closed to form a mold cavity, and the mold cavity is filled with an insulating heat-insulating material; s13, after demolding, forming circuit layers on the two conductive metal foils; s14, obtaining a semiconductor water condensation substrate; and S2, a semiconductor water condensation substrate, a heat dissipation back plate, a heat insulation back plate and a solar photovoltaic substrate are connected in sequence, an air water taking module is formed, and the cold end of the semiconductor water condensation substrate faces the side away from the heat dissipation back plate. According to the invention, the integration of the air-to-water module is realized, and the large-area production of the semiconductor water condensation substrate can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of air water intake, and in particular to a method for manufacturing an air water intake module. Background Art

[0002] Solar energy, a green and environmentally friendly energy source, is ubiquitous and inexhaustible in nature. Solar resources are particularly abundant in arid and water-scarce Gobi and desert regions. Peltier-effect semiconductor refrigeration units, which utilize solar photovoltaic panels to power semiconductor refrigeration components, are a common practice in existing condensation-based air-to-water extraction technologies due to their environmental friendliness, lack of moving parts, reliable performance, and long service life.

[0003] However, the air water intake device currently installed separately between the solar photovoltaic panel and the semiconductor refrigeration component cannot achieve the integration of the solar photovoltaic panel and the semiconductor refrigeration sheet and the modularization of the air water intake device.

[0004] Moreover, in the production and manufacturing of semiconductor refrigeration sheets, since the ceramic substrate is a brittle material and is easily broken during production, semiconductor refrigeration sheets cannot be produced on a large scale, which limits the application prospects of semiconductor refrigeration technology in condensation-based air water extraction devices. Summary of the Invention

[0005] The purpose of the present invention is to provide a method for manufacturing an air water intake module, which realizes the integration of the air water intake module and can realize large-scale production of semiconductor condensation substrates.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] The present invention provides a method for manufacturing an air water intake module, comprising the following steps:

[0008] S1, preparing a semiconductor water condensation substrate, including:

[0009] S11, preparing a mold, the mold including an upper mold and a lower mold, placing conductive metal foil in the upper mold and the lower mold respectively, and forming a semiconductor particle layer between the conductive metal foil in the upper mold and the conductive metal foil in the lower mold;

[0010] S12, the upper mold and the lower mold are closed to form a mold cavity, and the mold cavity is filled with insulating material;

[0011] S13, after demoulding, forming a circuit layer on the two conductive metal foils;

[0012] S14, obtaining a semiconductor water condensation substrate;

[0013] S2, connecting the semiconductor water condensation substrate, the heat dissipation back plate, the heat insulation back plate and the solar photovoltaic substrate in sequence to form an air water intake module, with the cold end of the semiconductor water condensation substrate facing the side away from the heat dissipation back plate.

[0014] Preferably, in said S11, when forming a semiconductor particle layer between the conductive metal foil of the upper mold and the conductive metal foil in the lower mold, it includes: performing tinning of semiconductor particle solder joints on the conductive metal foils in the upper mold and the lower mold respectively; then performing P-type semiconductor particle patching on each P-type semiconductor particle solder joint position, and performing N-type semiconductor particle patching on each N-type semiconductor particle solder joint position, to form a semiconductor particle layer in which P-type semiconductor particles and N-type semiconductor particles are alternately arranged.

[0015] Preferably, in said S12, before filling the mold cavity with insulating and heat-insulating material, the upper mold and the lower mold are aligned and clamped, and the mold is placed in a welding device for pressurized and heated welding.

[0016] Preferably, in S12, the insulating and heat-insulating material enters the space formed by the P-type semiconductor particles, the N-type semiconductor particles and the two conductive metal foils to form an insulating and heat-insulating layer.

[0017] Preferably, in S13, the circuit layer formed on one conductive metal foil is the first circuit layer, and the circuit layer formed on the other conductive metal foil is the second circuit layer, the first circuit layer includes a plurality of first electrodes, the second circuit layer includes a plurality of second electrodes, the first electrodes and the second electrodes are both connected in series with the semiconductor particle layer, the side of the conductive metal foil where the first circuit layer is located is the cold end, and the side of the conductive metal foil where the second circuit layer is located is the hot end.

[0018] Preferably, an insulating and waterproof layer is provided on the surface of the first electrode away from the heat dissipation back plate; an air water intake layer or an air water intake structure is provided on the surface of the insulating and waterproof layer, the air water intake layer is a first hydrophilic layer or a first hydrophobic layer, the air water intake structure includes a plurality of columns of nanostructures and a plurality of bottom microgrooves, the bottom microgrooves are provided between adjacent columns of the nanostructures, and each column of the nanostructures includes a plurality of nanostructures;

[0019] Drainage grooves are formed between adjacent first electrodes, and a second hydrophilic layer or a second hydrophobic layer is provided in the drainage grooves.

[0020] Preferably, a connection groove is provided on a surface of the first electrode close to the heat dissipation back plate and / or a surface of the second electrode away from the heat dissipation back plate.

[0021] Preferably, the upper mold is provided with a first positioning surface, the lower mold is provided with a second positioning surface, the first positioning surface and the second positioning surface match, and the lower mold is provided with a glue injection port.

[0022] Preferably, the S2 includes:

[0023] S21, preparing a semiconductor water condensation substrate, a heat dissipation back plate, a heat insulation back plate and a solar photovoltaic substrate;

[0024] S22: electrically connecting the semiconductor water condensation substrate and the solar photovoltaic substrate, coating a thermal conductive material on the side of the heat dissipation backplane facing the semiconductor water condensation substrate, and coating an adhesive on both sides of the thermal insulation backplane;

[0025] S23: inserting a heat dissipation back plate coated with a thermal conductive material and a heat insulation back plate coated with an adhesive between the semiconductor water condensation substrate and the solar photovoltaic substrate, and curing and shaping them.

[0026] Preferably, the areas of the heat dissipation backplane, the solar photovoltaic substrate and the thermal insulation backplane are the same, and the area of the semiconductor water condensation substrate is smaller than that of the heat dissipation backplane, the solar photovoltaic substrate or the thermal insulation backplane.

[0027] Compared with the prior art, the present invention has achieved the following technical effects:

[0028] The present invention can manufacture a semiconductor water condensation substrate, a heat dissipation back plate, a heat insulation back plate and a solar photovoltaic substrate into an integrated air water intake module, which is beneficial to the modularization of the air water intake device; at the same time, compared with the traditional semiconductor refrigeration plate using a ceramic substrate, in production, due to the lack of a ceramic substrate structure, large-area production can be achieved, and small pieces of large-area semiconductor water condensation substrates can be cut, thereby improving production flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 This is a flow chart of the method for making an air water extraction module of the present invention;

[0031] Figure 2 This is an axonometric view of the semiconductor water condensation substrate of the present invention;

[0032] Figure 3 It is a schematic diagram of the mold of the present invention;

[0033] Figure 4The semiconductor water condensation substrate of the present invention is shown in FIG. Figure 1 ;

[0034] Figure 5 The semiconductor water condensation substrate of the present invention is shown in FIG. Figure 2 ;

[0035] Figure 6 Schematic diagram of the air water intake structure of the present invention;

[0036] Figure 7 for Figure 6 A local enlarged view of point A;

[0037] Figure 8 Schematic diagram of an air water intake module manufactured using the air water intake module manufacturing method of the present invention Figure 1 ;

[0038] Figure 9 Schematic diagram of an air water intake module manufactured using the air water intake module manufacturing method of the present invention Figure 2 ;

[0039] Figure 10 Schematic diagram of an air water intake module manufactured using the air water intake module manufacturing method of the present invention Figure 3 ;

[0040] Figure 11 A schematic diagram of an air water intake device manufactured using an air water intake module manufactured using the air water intake module manufacturing method of the present invention;

[0041] In the figure: 100-air water intake module, 200-air water intake device, 1-semiconductor condensation substrate, 2-heat dissipation backboard, 3-solar photovoltaic substrate, 4-first circuit layer, 5-second circuit layer, 6-semiconductor particle layer, 7-insulating thermal insulation layer, 8-connecting groove, 9-upper mold, 10-lower mold, 11-first positioning surface, 12-second positioning surface, 13-glue injection port, 14-frame, 15-insulating backboard, 16-first electrode, 17-second electrode, 18-drainage groove, 19-first hydrophilic layer, 20-second hydrophobic layer, 21-oblique groove, 22-vertical groove, 23-nanostructure, 24-bottom micro groove. DETAILED DESCRIPTION

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0043] The purpose of the present invention is to provide a method for manufacturing an air water intake module, which realizes the integration of the air water intake module and can realize large-area production of semiconductor water condensation substrates.

[0044] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0045] like Figures 1 to 7 As shown, this embodiment provides a method for manufacturing an air water intake module, comprising the following steps:

[0046] S1, preparing a semiconductor water condensation substrate 1, comprising:

[0047] S11, preparing a mold, which includes an upper mold 9 and a lower mold 10, placing conductive metal foil in the upper mold 9 and the lower mold 10, respectively, preferably conductive copper foil, and using an automatic solder paste dispensing machine or a screen printing process to tin the semiconductor particle solder joints on the conductive metal foil in the upper mold 9 and the lower mold 10; then using a high-speed placement machine to place P-type semiconductor particles at each P-type semiconductor particle solder joint position, and to place N-type semiconductor particles at each N-type semiconductor particle solder joint position, to form a semiconductor particle layer 6 in which P-type semiconductor particles and N-type semiconductor particles are alternately arranged;

[0048] S12, the upper mold 9 is provided with a first positioning surface 11, and the lower mold 10 is provided with a second positioning surface 12, the first positioning surface 11 and the second positioning surface 12 are both inclined surfaces, and the first positioning surface 11 and the second positioning surface 12 match. The upper mold 9 and the lower mold 10 are aligned and clamped, and the first positioning surface 11 and the second positioning surface 12 are affixed. The mold is placed in a welding device for pressurized and heated welding. The welding temperature, pressure and time are not particularly limited. Those skilled in the art can reasonably set the welding temperature, pressure and time according to the type of solder paste and the area of the semiconductor component in the mold;

[0049] The lower mold 10 is provided with a glue injection port 13. An insulating material is filled into the mold cavity formed by the upper mold 9 and the lower mold 10 through the glue injection port 13 using a glue injection machine. The specific material of the insulating material is not particularly limited. The insulating material is preferably a modified aerogel or a modified polyurethane, such as silica aerogel reinforced with glass fiber and elastic emulsion. The above material has extremely low thermal conductivity and excellent insulation properties, and has the characteristics of heat resistance, waterproofness, moisture resistance, and good adhesion. After curing, it can maintain a certain structural strength. The insulating material enters the space formed by the P-type semiconductor particles, the N-type semiconductor particles, and the two conductive metal foils to form an insulating layer 7. The component filled with the insulating material is subjected to a shaping and curing treatment together with the mold; and the cured component is demolded.

[0050] In this embodiment, the insulating and heat-insulating layer 7 obtained after curing can prevent external water vapor from invading the internal semiconductor particle layer 6 and the welding interface, causing corrosion of the semiconductor particles and the welding interface. At the same time, the insulating and heat-insulating layer 7 has a certain structural strength and good adhesion, which can support the overall structure.

[0051] S13, after demolding, chemically etching to form circuit layers on the two conductive metal foils. The circuit layer formed on one conductive metal foil is a first circuit layer 4, and the circuit layer formed on the other conductive metal foil is a second circuit layer 5. The side of the conductive metal foil where the first circuit layer 4 is located is a cold end, and the side of the conductive metal foil where the second circuit layer 5 is located is a hot end.

[0052] In this embodiment, the semiconductor particle layer 6 is composed of a plurality of alternatingly arranged P / N type semiconductor particle pairs. It will be understood by those skilled in the art that the P / N type semiconductor particle pairs are connected in series with the first circuit layer 4 and the second circuit layer 5 by soldering to achieve electrical connection of the Peltier circuit. There are no particular limitations on the arrangement of the P / N type semiconductor particle pairs and the method for achieving the series connection, and those skilled in the art may design them according to specific circumstances.

[0053] In this embodiment, after removing excess metal on the conductive metal foil by chemical etching, a plurality of first electrodes 16 connected in series with the semiconductor particle layer 6 are formed on the first circuit layer 4, and a plurality of second electrodes 17 connected in series with the semiconductor particle layer 6 are formed on the second circuit layer 5. Drainage grooves 18 are formed between adjacent first electrodes 16. By adjusting the shape of the first electrodes 16, the surface area of the first electrodes 16, the arrangement of the first electrodes 16, the arrangement spacing of the first electrodes 16, and the relative positions of the P-type semiconductor particles, the N-type semiconductor particles of the semiconductor particle layer and the first electrodes 16, the temperature gradient distribution between the first electrodes 16 and the drainage grooves 18, between adjacent first electrodes 16, and on the surface of the first electrodes 16 is achieved, and the air water intake function requirement of the directional distribution of the drainage grooves 18 is achieved; by adjusting the shape of the second electrodes 17 and the surface area of the second electrodes 17, the heat dissipation optimization of the second circuit layer 5 is achieved; the shape of the first electrodes 16 can be rectangular, square, circular or other shapes, and the shape of the second electrodes 17 can be uniformly distributed rectangles or squares; as shown in FIG. Figure 4As shown, the first electrodes 16 of each layer adopt an arrow-feather-shaped structure with a surface area gradient decreasing from the upper layer to the lower layer, and the P / N-type semiconductor particle pairs are connected in series with the middle and tail parts of the arrow-feather-shaped electrodes. By adjusting the shape of the first electrode 16, the surface area of the first electrode 16, the arrangement of the first electrode 16, and the connection position of the P / N-type semiconductor particle pairs and the first electrode 16, a continuous temperature gradient of alternating cold and hot is formed between the first electrode 16 and the drainage groove 18, and a vertical temperature distribution with an increasing cooling temperature gradient from top to bottom is formed between adjacent first electrodes 16. The surface of each first electrode 16 can also form a vertical temperature distribution with an increasing cooling temperature gradient from top to bottom. At the same time, an oblique groove 21 is formed between the lower end of the arrow-feather-shaped first electrode 16 and the upper end of the first electrode 16 below, and vertical grooves 22 are formed on both sides of the arrow-feather-shaped first electrode 16. The oblique grooves 21 and the vertical grooves 22 form a directionally distributed drainage groove 18 to facilitate water conduction; as shown in FIG. Figure 2 As shown, the second electrode 17 is in the shape of a uniformly distributed rectangle. By maximizing and uniformly distributing the rectangular electrode area, the heat conduction area is increased and the heat is evenly dispersed. It will be understood by those skilled in the art that the temperature gradient between the first electrode 16 and the drainage groove 18, and between adjacent first electrodes 16, can optimize air convection on the surface of the first circuit layer 4. The local temperature gradient on the surface of the first electrode 16 causes the tension change on the surface of the tiny water droplets to promote the directional movement of the tiny water droplets. The directional distribution of the drainage grooves 18 between adjacent first electrodes 16 is conducive to the directional discharge of condensed water. The arrangement and arrangement of the first electrodes 16 in the first circuit layer are not particularly limited, and those skilled in the art can design according to specific circumstances.

[0054] In this embodiment, when the first electrode 16 of the first circuit layer 4 is functionalized for air water intake, an insulating waterproof layer is formed on the first electrode 16, an air water intake layer or an air water intake structure is formed on the surface of the insulating waterproof layer, and drainage optimization treatment is performed on the drainage groove 18; wherein, the insulating waterproof layer can be obtained by coating an insulating waterproof material and curing it to prevent the first electrode 16 from contacting condensed water and causing circuit leakage, electrochemical corrosion, and condensed water from entering the internal insulating layer 7 through the drainage groove 18 and causing structural failure; the air water intake layer can be a first hydrophilic layer 19 or a first hydrophobic coating, the first hydrophilic layer 19 is obtained by coating a hydrophilic material on the surface of the insulating waterproof layer and curing it, and the first hydrophobic layer is obtained by coating a hydrophobic material on the surface of the insulating waterproof layer and curing it; the drainage optimization of the drainage groove 18 can be optimized by coating a hydrophilic material in the drainage groove 18 to form a second hydrophilic layer, coating a hydrophobic material to form a second hydrophobic layer 20, or filling it with a water-absorbing fiber material. There is no special restriction on the materials and methods for performing air water intake functionalization processing on the surface of the first circuit layer 4. Those skilled in the art can design it according to the air water intake requirements of different environments, such as Figure 5As shown, a first hydrophilic layer 19 is coated on the outer surface of the first electrode 16 in the shape of an arrow that forms an insulating and waterproof layer, and a second hydrophobic layer 20 is coated in the drainage groove 18. Thus, an air-water-intake functionalized surface is formed on the first circuit layer 4, in which the first electrode area is hydrophilic and the drainage groove 18 is hydrophobic. When air-water-intake is used, the hydrophilic surface of the first electrode 16 quickly condenses condensed water under gradient temperature cooling. The condensed condensed water is quickly discharged through the oblique grooves 21 at the bottom of the first electrode 16 and then flows into the vertical grooves 22 on both sides of the first electrode 16. In this embodiment, the first electrode 16 is hydrophilic and the drainage groove 18 is hydrophobic. The drainage grooves 18 between the electrodes 16 can also be filled with absorbent fiber materials after being subjected to insulation and waterproofing treatment. Condensed water condensed on the surface of the first electrode 16 is quickly absorbed and transferred by the edge absorbent fibers, preventing the condensed water from forming a continuous water film on its surface, which increases thermal resistance and affects the subsequent condensation efficiency. The air water intake structure includes several rows of nanostructures and several bottom microgrooves 24. Bottom microgrooves 24 are provided between adjacent rows of nanostructures. Each row of nanostructures includes several nanostructures 23. The size of the nanostructures 23 is nanometer-scale, and the size of the bottom microgrooves 24 is nanometer-scale or micrometer-scale.

[0055] In this embodiment, the conductive metal foil forming the first circuit layer 4 can also be made of copper foil that has been pre-processed for surface air water extraction functionality. The processing method is not particularly limited. When the air water extraction layer is a coating surface, for example, atomic layer deposition, magnetron sputtering and other processes can be used to form an aluminum oxide insulating layer and a titanium nitride air water extraction layer in the first electrode 16 area (etching reserved area) on the copper foil surface. When the air water extraction structure is a modified micro-nano structure, for example, a laser etching process can be used to construct a nanostructure array and an air water extraction structure of bottom microgrooves 24 on the aluminum oxide insulating layer. The nanostructure array includes several columns of nanostructures, each column of which has a nanostructure. The nanostructure includes a plurality of nanostructures 23, which are nanocones or nanocolumns. There are bottom microgrooves 24 between adjacent columns of nanostructures. The copper foil that has been pre-processed for surface air water extraction functionalization is chemically etched to remove excess copper foil, thereby forming a first electrode 16 having an insulating waterproof layer and an air water extraction layer (or an air water extraction structure); in this embodiment, the conductive copper foil first electrode 16 area forming the first circuit layer 4 close to the surface of the heat dissipation backplane and the conductive copper foil second electrode 17 area of the second circuit layer 5 away from the surface of the heat dissipation backplane can also be locally patterned to form a connecting groove 8, thereby improving the performance of the semiconductor water condensation substrate, such as Figure 2As shown, for example, a laser etching process can be used to etch micron-scale connection grooves 8 on the inner surface of the first electrode 16 area and the second electrode 17 area of the conductive copper foil. The connection grooves 8 increase the interface bonding area and bonding strength between the first electrode 16 and the insulating heat-insulating layer 7, and between the second electrode 17 and the insulating heat-insulating layer 7, thereby avoiding interface peeling between the copper electrode and the insulating heat-insulating layer 7 due to thermal expansion and contraction. At the same time, the connection grooves 8 reduce the lateral heat conduction in the first electrode 16 area, thereby improving the cooling performance of the semiconductor condensation substrate.

[0056] S15, obtaining the semiconductor water condensation substrate 1, performing internal resistance data testing to inspect the quality; cutting the semiconductor water condensation substrate 1 that passes the inspection to produce semiconductor water condensation substrates 1 with different voltage, current and area requirements;

[0057] S2, connect the semiconductor condensation substrate 1, the heat dissipation back plate 2, the heat insulation back plate 15 and the solar photovoltaic substrate 3 in sequence to form an air water extraction module 100, including:

[0058] S21, prepare the semiconductor water condensation substrate 1, the heat dissipation back plate 2, the thermal insulation back plate 15 and the solar photovoltaic substrate 3;

[0059] The heat dissipation back plate 2 is preferably an anodized aluminum plate, a copper plate with an insulating surface or an aluminum soaking plate. The material of the heat dissipation back plate 2 is not particularly limited. Aluminum and copper both have good thermal conductivity. After the anodized aluminum plate or the copper plate with an insulating surface or the aluminum soaking plate is selected as the heat dissipation back plate 2 and connected to the semiconductor water condensation substrate 1, the thermal insulation back plate 15 and the solar photovoltaic substrate 3, the heat generated by the second circuit layer 5 of the semiconductor water condensation substrate 1 (that is, the hot surface of the semiconductor water condensation substrate 1) can be quickly discharged, avoiding the problem of heat accumulation on the hot surface of the semiconductor water condensation substrate 1, thereby affecting the cooling efficiency of the cold surface of the semiconductor water condensation substrate 1. It can be understood by those skilled in the art that the aluminum oxide layer on the surface of the anodized aluminum plate is insulating, so it can avoid short circuiting of the semiconductor water condensation substrate 1;

[0060] The thermal insulation backplane 15 is preferably made of a silica aerogel composite fiber material. The silica aerogel material has good thermal insulation and weather resistance. The silica aerogel composite fiber material is selected as the thermal insulation backplane 15 and is arranged between the heat dissipation backplane 2 and the solar photovoltaic substrate 3. It can effectively block the heat of the solar photovoltaic substrate 3 from being conducted to the heat dissipation backplane 2 and the second circuit layer 5 of the semiconductor water condensation substrate 1 (i.e., the hot surface of the semiconductor water condensation substrate 1), thereby affecting the water condensation efficiency of the first circuit layer 4 of the semiconductor water condensation substrate 1 (i.e., the cold surface of the semiconductor water condensation substrate 1);

[0061] The solar photovoltaic substrate 3 adopts a cadmium telluride or perovskite solar photovoltaic panel. The solar photovoltaic substrate 3 is not particularly limited and can be a rigid substrate or a flexible substrate. Cadmium telluride and perovskite solar photovoltaic panels have a wide spectral absorption range and good weak light performance. The use of cadmium telluride or perovskite solar photovoltaic panels can improve the water extraction efficiency of the air water extraction module 100 in a weak light environment. For example, in the early morning or at dusk, the air humidity is high but the light intensity is weak. The use of cadmium telluride or perovskite solar photovoltaic panels further improves the adaptability of the air water extraction module 100 to the environment.

[0062] The heat dissipation back plate 2 has the same area as the solar photovoltaic substrate 3 and the thermal insulation back plate 15. The area of the semiconductor water condensation substrate 1 is smaller than the area of the heat dissipation back plate 2, the thermal insulation back plate 15 or the solar photovoltaic substrate 3. The area of the semiconductor water condensation substrate 1 is not particularly limited. Those skilled in the art can design it according to actual conditions. For example, a smaller semiconductor water condensation substrate 1 is used in a low humidity environment. By reducing the distance between the P / N type semiconductor particles and the size of the first electrode 16, the semiconductor water condensation substrate 1 can produce a lower cooling temperature to meet the air water extraction requirements in a low humidity environment.

[0063] S22: Using an automatic spot welding machine to weld wires to electrically connect the semiconductor water condensation substrate 1 and the solar photovoltaic substrate 3, the wires are preferably insulated flat wires, and using an automatic coating device to coat a thermal conductive material on the side of the heat dissipation back plate 2 facing the semiconductor water condensation substrate 1, the thermal conductive material is preferably thermal conductive silicone, and adhesive is coated on both sides of the thermal insulation back plate 15;

[0064] S23: Insert the heat dissipation back plate 2 coated with thermal conductive material and the thermal insulation back plate 15 coated with adhesive between the semiconductor water condensation substrate 1 and the solar photovoltaic substrate 3, and realize the bonding of the semiconductor water condensation substrate 1, the heat dissipation back plate 2, the thermal insulation back plate 15 and the solar photovoltaic substrate 3 through the thermal conductive material and the adhesive. The first circuit layer 4 faces the side away from the heat dissipation back plate 2, and is pressurized and cured to obtain the air water intake module 100. The air water intake module 100 is tested for lighting and cooling data to inspect the quality of the air water intake module 100.

[0065] The semiconductor water condensation substrate of this embodiment can realize air water extraction functionality in terms of air water extraction effect, has high water extraction efficiency, and is highly adaptable to the environment.

[0066] like Figures 8 to 10 As shown, in this embodiment, the air water intake module 100 can be rectangular, square, or polygonal, and the shape of the air water intake module 100 is not particularly limited; the air water intake module 100 as a whole can be flat or arc-shaped with a certain angle to meet the integrated installation requirements of the frame 14 of different air water intake devices 200, thereby improving the flexibility and adaptability of the water intake module.

[0067] like Figure 11 As shown, in actual applications, the air water intake module 100 of this embodiment can be installed and integrated with the frame 14 of the air water intake device 200 using multiple air water intake modules 100 to achieve modularization of the air water intake device 200. According to the requirements of air water intake in different application scenarios, the modular air water intake device 200 can be flexibly set to a variety of specifications and shapes, thereby improving the flexible adaptability of the device. Each air water intake module 100 can work independently to extract water. If a single air water intake module 100 is damaged, it will not affect the overall water intake effect of the device. The air water intake device 200 constructed by the air water intake modules 100 of this embodiment has high reliability, and the device can be maintenance-free in actual applications.

[0068] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. A method for manufacturing an air water intake module, characterized in that: The following steps are involved: S1, preparing a semiconductor water condensation substrate, including: S11, preparing a mold, the mold including an upper mold and a lower mold, placing conductive metal foil in the upper mold and the lower mold respectively, and forming a semiconductor particle layer between the conductive metal foil in the upper mold and the conductive metal foil in the lower mold; S12, the upper mold and the lower mold are combined to form a mold cavity, and the mold cavity is filled with insulating material; S13, after demoulding, forming a circuit layer on the two conductive metal foils; S14, obtaining a semiconductor water condensation substrate; S2, connecting the semiconductor water condensation substrate, the heat dissipation back plate, the heat insulation back plate and the solar photovoltaic substrate in sequence to form an air water intake module, with the cold end of the semiconductor water condensation substrate facing the side away from the heat dissipation back plate.

2. The method for manufacturing an air water intake module according to claim 1, characterized in that: In said S11, when forming a semiconductor particle layer between the conductive metal foil of the upper mold and the conductive metal foil in the lower mold, it includes: tinning the semiconductor particle solder joints on the conductive metal foils in the upper mold and the lower mold respectively; then patching P-type semiconductor particles at each P-type semiconductor particle solder joint position, and patching N-type semiconductor particles at each N-type semiconductor particle solder joint position, to form a semiconductor particle layer in which P-type semiconductor particles and N-type semiconductor particles are alternately arranged.

3. The method for manufacturing an air water intake module according to claim 1, characterized in that: In the above S12, before filling the mold cavity with the insulating material, the upper mold and the lower mold are aligned and clamped, and the mold is placed in a welding device for pressurized and heated welding.

4. The method for manufacturing an air water intake module according to claim 2, characterized in that: In the above S12, the insulating and heat-insulating material enters the space formed by the P-type semiconductor particles, the N-type semiconductor particles and the two conductive metal foils to form an insulating and heat-insulating layer.

5. The method for manufacturing an air water intake module according to claim 1, characterized in that: In S13, the circuit layer formed on one conductive metal foil is the first circuit layer, and the circuit layer formed on the other conductive metal foil is the second circuit layer. The first circuit layer includes a plurality of first electrodes, and the second circuit layer includes a plurality of second electrodes. Both the first electrodes and the second electrodes are connected in series with the semiconductor particle layer. The side of the conductive metal foil where the first circuit layer is located is the cold end, and the side of the conductive metal foil where the second circuit layer is located is the hot end.

6. The method for manufacturing an air water intake module according to claim 5, characterized in that: An insulating waterproof layer is provided on the surface of the first electrode away from the heat dissipation back plate; an air water intake layer or an air water intake structure is provided on the surface of the insulating waterproof layer, the air water intake layer is a first hydrophilic layer or a first hydrophobic layer, the air water intake structure includes a plurality of columns of nanostructures and a plurality of bottom microgrooves, the bottom microgrooves are provided between adjacent columns of the nanostructures, and each column of the nanostructures includes a plurality of nanostructures; Drainage grooves are formed between adjacent first electrodes, and a second hydrophilic layer or a second hydrophobic layer is provided in the drainage grooves.

7. The method for manufacturing an air water intake module according to claim 5, characterized in that: A connection groove is provided on a surface of the first electrode close to the heat dissipation back plate and / or a surface of the second electrode away from the heat dissipation back plate.

8. The method for manufacturing an air water intake module according to claim 1, characterized in that: The upper mold is provided with a first positioning surface, the lower mold is provided with a second positioning surface, the first positioning surface and the second positioning surface match, and the lower mold is provided with a glue injection port.

9. The method for manufacturing an air water intake module according to claim 1, characterized in that: The S2 includes: S21, preparing a semiconductor water condensation substrate, a heat dissipation back plate, a heat insulation back plate and a solar photovoltaic substrate; S22: electrically connecting the semiconductor water condensation substrate and the solar photovoltaic substrate, coating a thermal conductive material on the side of the heat dissipation backplane facing the semiconductor water condensation substrate, and coating an adhesive on both sides of the thermal insulation backplane; S23: inserting a heat dissipation back plate coated with a thermal conductive material and a heat insulation back plate coated with an adhesive between the semiconductor water condensation substrate and the solar photovoltaic substrate, and curing and shaping them.

10. The method for manufacturing an air water intake module according to claim 1, characterized in that: The areas of the heat dissipation back plate, the solar photovoltaic substrate and the thermal insulation back plate are the same, and the area of the semiconductor water condensation substrate is smaller than that of the heat dissipation back plate, the solar photovoltaic substrate or the thermal insulation back plate.

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