Heat dissipation coating softening method and device

Abstract

The invention provides a heat dissipation coating softening method and device, and relates to the technical field of electronics. The heat dissipation coating softening method comprises the steps that based on set initial power, a heat dissipation object is started, a heat dissipation device is started to conduct heat dissipation on the heat dissipation object, and heat dissipation coating is clamped between the heat dissipation object and a heat conduction device; the temperature of the heat dissipation object is continuously detected, if it is detected that the temperature of the heat dissipation object does not exceed the preset temperature, first preset power is increased on the basis of the current power to operate for first preset time, and if it is detected that the temperature of the heat dissipation object exceeds the preset temperature, the current power is kept to operate for second preset time, an alarm is given when the time when the temperature of the heat dissipation object exceeds the preset temperature is longer than second preset time; and if the current power of the heat dissipation object reaches the rated power, the softening process of the heat dissipation coating is ended. Through the method, the softening flexibility of the heat dissipation coating in the server can be improved.

Description

Technical Field

[0001] This specification relates to the field of electronic technology, and in particular to a method and device for softening heat dissipation coating. Background Art

[0002] With the development of network technology, the power consumption of servers that carry data computing and storage has gradually increased, and the heat generated by the servers has also increased, which has increased the demand for heat dissipation of the servers.

[0003] There are two main cooling methods used in servers: air cooling and liquid cooling. In air cooling, the radiator fits closely to the heat sink, while in liquid cooling, the cold plate fits closely to the heat sink. Heat is dissipated through heat exchange between heat dissipating components like fans and circulation pumps and heat-conducting components. The effectiveness of either method is closely related to the fit between the heat-conducting components and the heat sink. This fit is influenced not only by the heat-conducting component's structure but also by the thermal coating, such as thermal grease, applied between the two components.

[0004] Before the server can operate normally, the heat dissipation coating applied between the heat-conducting device and the heat dissipation object needs to be heated to soften it so that it can be evenly and reliably attached to the heat-conducting device and the heat dissipation object. This process requires the assembled server to be placed in an incubator. A series of complex operations are required, such as placing the server in the incubator and taking it out of the incubator after completion. As servers gradually become larger, this is difficult to achieve efficiently. Therefore, how to flexibly achieve efficient softening of the heat dissipation coating applied to electronic equipment such as servers is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0005] In order to overcome the problems existing in the related art, this specification provides a method and device for softening heat dissipation coating.

[0006] According to a first aspect of an embodiment of this specification, a method for softening a heat dissipation coating is provided, which is applied to a server and includes:

[0007] Based on the set initial power, the heat dissipation object is started, and the heat dissipation device is started to dissipate heat from the heat dissipation object, wherein the heat dissipation object is attached to the heat conductive device, a heat dissipation coating is sandwiched between the heat dissipation object and the heat conductive device, and the heat conductive device exchanges heat with the heat dissipation device;

[0008] continuously detecting the temperature of the heat dissipation object, and if it is detected that the temperature of the heat dissipation object does not exceed a preset temperature, increasing a first preset power on the basis of a current power and operating for a first preset time; if it is detected that the temperature of the heat dissipation object exceeds a preset temperature, maintaining the current power and operating for a second preset time, and issuing an alarm when the temperature of the heat dissipation object exceeds the preset temperature for longer than the second preset time, wherein the first preset power is greater than the second preset power, and the first preset time is less than the second preset time;

[0009] If the current power of the heat dissipation object reaches the rated power, the softening process of the heat dissipation paint is terminated.

[0010] Optionally, after increasing the first preset power based on the current power and running for the first preset time, the method further includes:

[0011] If the difference between the preset temperature and the temperature of the heat dissipation object is less than a first preset value, controlling the heat dissipation device to improve the heat dissipation capacity;

[0012] If the difference between the preset temperature and the temperature of the heat dissipation object is greater than a second preset value, controlling the heat dissipation device to reduce the heat dissipation capacity;

[0013] If the difference between the preset temperature and the temperature of the heat dissipation object is between a first preset value and a second preset value, maintaining the heat dissipation capacity of the heat dissipation device;

[0014] The first preset value is smaller than the second preset value.

[0015] Optionally, after an alarm is issued when the temperature of the heat dissipation object exceeds a preset temperature for a period longer than a second preset time, or when the temperature of the heat dissipation object is not detected during continuous temperature detection of the heat dissipation object, the method further includes:

[0016] Controlling the heat dissipation device to increase the heat dissipation capacity to a maximum value;

[0017] During operation at the maximum value of the heat dissipation capacity of the heat dissipation device, the server is controlled to save operation data, and the server is shut down after the operation reaches a third preset time.

[0018] Optionally, the heat dissipation device is a fan;

[0019] The controlling of the heat dissipation device to improve the heat dissipation capability is specifically as follows:

[0020] Controlling the fan to increase the speed;

[0021] The controlling the heat dissipation device to reduce the heat dissipation capacity is specifically:

[0022] The fan is controlled to reduce its rotation speed.

[0023] Optionally, the heat dissipation device is a flow valve and / or a water pump;

[0024] The controlling of the heat dissipation device to improve the heat dissipation capability is specifically as follows:

[0025] Sending a first control message to a cooling liquid distribution unit (CDU) so that the CDU controls the flow valve and / or the water pump to increase the cooling liquid flow rate;

[0026] The controlling the heat dissipation device to reduce the heat dissipation capacity is specifically:

[0027] A second control message is sent to a cooling liquid distribution unit (CDU) so that the CDU controls the flow valve and / or the water pump to reduce the cooling liquid flow rate.

[0028] According to a second aspect of an embodiment of this specification, a heat dissipation paint softening device is provided, which is applied to a server and includes:

[0029] a starting unit, configured to start the heat dissipation object based on a set initial power, and start the heat dissipation device to dissipate heat from the heat dissipation object, wherein the heat dissipation object is attached to the heat conductive device, a heat dissipation coating is sandwiched between the heat dissipation object and the heat conductive device, and the heat conductive device exchanges heat with the heat dissipation device;

[0030] an adjustment unit, configured to continuously detect the temperature of the heat dissipation object, and if it is detected that the temperature of the heat dissipation object does not exceed a preset temperature, increase a first preset power based on a current power and operate for a first preset time; if it is detected that the temperature of the heat dissipation object exceeds a preset temperature, maintain the current power and operate for a second preset time, and issue an alarm when the temperature of the heat dissipation object exceeds the preset temperature for longer than the second preset time, wherein the first preset power is greater than the second preset power, and the first preset time is less than the second preset time;

[0031] The control unit is configured to terminate the softening process of the heat dissipation coating if the current power of the heat dissipation object reaches the rated power.

[0032] Optionally, the adjustment unit is further configured to increase a first preset power based on the current power and operate for a first preset time, and if the difference between the preset temperature and the temperature of the heat dissipation object is less than a first preset value, control the heat dissipation device to improve the heat dissipation capacity;

[0033] After increasing a first preset power based on the current power and running for a first preset time, if the difference between the preset temperature and the temperature of the heat dissipation object is greater than a second preset value, controlling the heat dissipation device to reduce the heat dissipation capacity;

[0034] After increasing a first preset power based on the current power and running for a first preset time, if the difference between the preset temperature and the temperature of the heat dissipation object is between the first preset value and the second preset value, maintaining the heat dissipation capacity of the heat dissipation device;

[0035] The first preset value is smaller than the second preset value.

[0036] Optionally, the device further includes: a closing unit;

[0037] The adjustment unit is further configured to control the heat dissipation device to increase the heat dissipation capacity to a maximum value after an alarm is issued when the temperature of the heat dissipation object exceeds a preset temperature for a period longer than a second preset time, or when the temperature of the heat dissipation object is not detected during continuous temperature detection of the heat dissipation object;

[0038] The shut-down unit is configured to control the server to save operating data while the server is operating at the maximum heat dissipation capacity of the heat dissipation device, and shut down the server after the server has been running for a third preset time.

[0039] Optionally, the heat dissipation device is a fan; the adjustment unit executes a process of controlling the heat dissipation device to improve the heat dissipation capacity, specifically for controlling the fan to increase the speed; the adjustment unit executes a process of controlling the heat dissipation device to reduce the heat dissipation capacity, specifically for controlling the fan to reduce the speed; or,

[0040] The heat dissipation device is a flow valve and / or a water pump;

[0041] The adjustment unit executes a process of controlling the heat dissipation device to improve the heat dissipation capacity, specifically for sending a first control message to the CDU, so that the CDU controls the flow valve and / or the water pump to increase the liquid cooling flow rate;

[0042] The adjustment unit executes a process of controlling the heat dissipation device to reduce the heat dissipation capacity, specifically for sending a second control message to the cold liquid distribution unit CDU, so that the CDU controls the flow valve and / or water pump to reduce the liquid cooling flow rate.

[0043] According to a third aspect of an embodiment of this specification, a server is provided, comprising a processing chip and a machine-readable storage medium, wherein the machine-readable storage medium stores machine-executable instructions that can be executed by the processing chip, and the processing chip is prompted by the machine-executable instructions to implement any of the method steps described above.

[0044] According to a fourth aspect of the embodiments of this specification, a machine-readable storage medium is provided, which stores machine-executable instructions. When called and executed by a processing chip, the machine-executable instructions prompt the processing chip to: implement any of the method steps described above.

[0045] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0046] In the embodiments of the present specification, the heat dissipation object is started from the initial power and the power of the heat dissipation object is gradually increased to gradually increase the temperature of the heat dissipation object, and the heat dissipation coating between the heat dissipation object and the heat-conducting device is gradually softened. The relationship between the temperature of the heat dissipation object and its specification temperature is monitored to confirm whether the softening of the heat dissipation coating has reached a level that fully fits the heat dissipation object and the heat-conducting device. That is, the softening of the heat dissipation coating is achieved through the operation process of the server itself, avoiding the need to place the server in an incubator for softening the heat dissipation coating, and improving the flexibility of softening the heat dissipation coating in the server.

[0047] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0049] Figure 1 This is a flow chart of a method for softening a heat dissipation coating involved in this application;

[0050] Figure 2 This is a schematic diagram of a server to which the heat dissipation coating softening method involved in this application is applicable;

[0051] Figure 3 is a schematic diagram of another server to which the heat dissipation coating softening method involved in this application is applicable;

[0052] Figure 4 This is a schematic structural diagram of a heat dissipation paint softening device involved in this application;

[0053] Figure 5 This is a structural diagram of a server involved in this application. DETAILED DESCRIPTION

[0054] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of this specification, as detailed in the appended claims.

[0055] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. As used in this specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0056] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, such information should not be limited to these terms. These terms are merely used to distinguish information of the same type from one another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information without departing from the scope of this specification. Depending on the context, the term "if" as used herein may be interpreted as "when," "when," or "in response to determining."

[0057] This application provides a method for softening heat dissipation coating, such as Figure 1 As shown, it is applied to the server and includes:

[0058] S100: Based on a set initial power, start a heat dissipation object and start a heat dissipation device to dissipate heat for the heat dissipation object.

[0059] A GPU (Graphics Processing Unit) and a processor are provided in the server as heat dissipation objects, and a heat-conducting device for conducting heat is provided on the heat dissipation object, such as a radiator in an air-cooling mode, or a cold plate in a liquid-cooling mode, or a radiator and a cold plate in the case of a combination of air-cooling and liquid-cooling modes, without limitation to the comparison.

[0060] The heat dissipation object is fitted with the heat conducting component, heat dissipation paint is sandwiched between the heat dissipation object and the heat conducting component, and the heat conducting component performs heat exchange through the heat dissipation component.

[0061] In the server, the heat received by the heat-conducting device can be dissipated through a heat dissipation device. For example, when the heat-conducting device is a radiator, the fan serving as the heat dissipation device can blow cold air into the server and perform heat exchange with the radiator to reduce the temperature of the heat dissipation object. For another example, when the heat-conducting device is a cold plate, the water pump and / or flow valve serving as the heat dissipation device can be controlled to flow the cold liquid in the pipeline into the cold plate to reduce the temperature of the heat dissipation object. Of course, the mixed air cooling and liquid cooling methods can include both devices.

[0062] In the server, there can be a BMC (Baseboard Management Controller) that executes a script stored in the server to collect the temperature of the heat dissipation object, control the power of the heat dissipation object, and control the heat dissipation capacity of the heat dissipation device, thereby softening the heat dissipation coating contained in the server. Of course, the server can also execute the script or the image file containing the tools, drivers, and scripts through the processor running the operating system, and implement it in the management page such as KVM (Keyboard Video Mouse), and set it according to actual needs. The script can also be stored in a removable memory such as flash memory in the form of a readable storage medium, and the removable memory can be plugged into the server so that the BMC, processor, and other processing chips can read and execute it. In other words, the processing chip can be a BMC or a chip with corresponding functions such as a processor, and it should be noted that the processing chip can also be a heat dissipation object or not, and can be set according to needs. The following description takes the BMC as the processing chip as an example.

[0063] The BMC or an execution script read by the BMC can set an initial power for the cooling target. For example, the initial power can be set to 10%-20% of the rated power of the cooling target. After the cooling target is started, it begins operating at the initial power, and the corresponding cooling device is also activated to dissipate heat for the cooling target.

[0064] S101: Continuously detect the temperature of the heat dissipation object.

[0065] After a heat sink is powered on, the BMC continuously monitors its temperature and adjusts its power based on the detected temperature. This power can be considered the current power. When the heat sink is powered on, the current power can be the initial power. As the power of the heat sink is adjusted, the current power accumulates from the initial power. In other words, the current power of the heat sink will gradually increase over time, and this process will also gradually increase the temperature of the heat sink.

[0066] S102: If it is detected that the temperature of the heat dissipation object does not exceed the preset temperature, increase a first preset power based on the current power and operate for a first preset time.

[0067] S103: If it is detected that the temperature of the heat dissipation object exceeds a preset temperature, maintain the current power operation for a second preset time.

[0068] A preset temperature, a first preset power, a second preset power, a first preset time, and a second preset time may also be set in the BMC or in the execution script read by the BMC.

[0069] The preset temperature may be a rated temperature of the heat dissipation object, and the rated temperature may represent a maximum temperature that the heat dissipation object can withstand during normal operation.

[0070] The first preset power and the second preset power can be set according to the initial power and the rated power, wherein the first preset power is the power increased when the heat dissipation object can run at the current power for the first preset time and the detected temperature can be maintained below the rated temperature, and the second preset power is the power increased after the heat dissipation object exceeds the rated temperature of the heat dissipation object at the current power and runs at the current power for the second preset time.

[0071] For example, the first preset power can be set to 50 watts, and the second preset power can be set to 20 watts. This ensures that the first preset power is greater than the second preset power. This setting means that if the heat dissipation target can effectively soften the heat dissipation coating at the current power, increasing the power at the current power will raise the temperature of the heat dissipation target, thereby further softening the heat dissipation coating. If the heat dissipation coating cannot be effectively softened at the current power, the current temperature will be maintained to continue softening the heat dissipation coating. Furthermore, the second preset time is set to be greater than the first preset time to ensure sufficient softening of the heat dissipation coating.

[0072] That is, the first preset power is set to be greater than the second preset power, and the first preset time is set to be less than the second preset time.

[0073] For example, when the rated power of the heat dissipation object is 800 watts, the initial power can be set to 100 watts, the first preset power to 50 watts, the second preset power to 20 watts, the first preset time to 5 minutes, the second preset time to 30 minutes, and the rated temperature to 80 degrees. Of course, the specific parameters can be set according to the parameters of the heat dissipation object and the actual situation, and there is no restriction on this.

[0074] S104: When the temperature of the heat dissipation object exceeds the preset temperature for a period longer than a second preset time, an alarm is issued.

[0075] When the heat dissipation object maintains operation at the current power, a timer may be started in the BMC to count time.

[0076] If it is detected that the temperature of the heat dissipation object is restored to below the preset temperature, the process returns to the loop of step S101 to step S103 to continue detecting the temperature of the heat dissipation object and adjusting the current power according to the temperature of the heat dissipation object.

[0077] If it is detected that the temperature of the heat dissipation object is above the preset temperature for more than the second preset time, it may indicate that the current heat dissipation paint has softened or there is a problem with the working condition of the server. The BMC needs to issue an alarm to prompt the staff to check the working condition of the server or the condition of the heat dissipation paint.

[0078] In order to prevent the temperature of the heat dissipation object from exceeding the preset temperature for too long, thereby causing damage to components in the server, optionally, after an alarm is issued when the temperature of the heat dissipation object exceeds the preset temperature for more than a second preset time in step S104, or when the temperature of the heat dissipation object is not detected during the continuous detection of the temperature of the heat dissipation object in step S101, the method further includes:

[0079] S106: Control the heat dissipation device to increase the heat dissipation capacity to a maximum value.

[0080] In a server, the BMC may be unable to detect the temperature of the heat sink. This may be due to an anomaly in the temperature detection between the BMC and the heat sink. In this case, if the heat sink temperature continues to rise, the BMC cannot make a judgment based on the heat sink temperature. This may cause the thermal coating to soften excessively and damage the heat sink.

[0081] At this time, the primary task is to avoid damage to the heat dissipation object. Therefore, the BMC can first control the heat dissipation device to improve the heat dissipation capacity to accelerate the heat dissipation capacity in the server. For example, if the heat dissipation device is a fan, the speed can be increased. If the heat dissipation device is a water pump or flow valve, the flow rate of the coolant in the pipeline can be increased by increasing the water pump power and the opening of the flow valve. Preferably, the BMC can directly increase the heat dissipation capacity of the heat dissipation device to the maximum value, thereby reducing the heat dissipation capacity of the server more quickly and avoiding high temperature damage to the device.

[0082] S107 . During operation at the maximum heat dissipation capacity of the heat dissipation device, control the server to save operation data, and shut down the server after the operation reaches a third preset time.

[0083] After the heat dissipation capacity of the heat dissipation device reaches its maximum, it continues to operate for a period of time to more reliably reduce the temperature of the heat dissipation object. During this period, the BMC can control the server to save operating data, thereby preventing data loss. After the third preset operation time, the server is shut down to allow personnel to conduct abnormality investigation.

[0084] The third preset time can be set according to actual needs, such as being set based on the approximate duration of saving the operating data, without any restriction.

[0085] Through the above process, the problem of damage to components in the server caused by abnormalities occurring during the softening process of the heat dissipation paint can be reduced, and the reliability of the softening process of the heat dissipation paint in the server can be further improved.

[0086] S105: If the current power of the heat dissipation object reaches the rated power, the softening process of the heat dissipation paint is ended.

[0087] The BMC continuously controls the power increase of the heat dissipation object to soften the heat dissipation paint. If the current power of the heat dissipation object reaches the rated power without any abnormality, it indicates that the heat dissipation paint has been sufficiently softened, and the above process can be ended to allow the server to operate normally.

[0088] In the embodiments of the present specification, the heat dissipation object is started from the initial power and the power of the heat dissipation object is gradually increased to gradually increase the temperature of the heat dissipation object, and the heat dissipation coating between the heat dissipation object and the heat-conducting device is gradually softened. The relationship between the temperature of the heat dissipation object and its specification temperature is monitored to confirm whether the softening of the heat dissipation coating has reached a level that fully fits the heat dissipation object and the heat-conducting device. That is, the softening of the heat dissipation coating is achieved through the operation process of the server itself, avoiding the need to place the server in an incubator for softening the heat dissipation coating, and improving the flexibility of softening the heat dissipation coating in the server.

[0089] During the softening process of the heat dissipation coating, if the heat dissipation object fails to reach a certain temperature, insufficient softening may occur, or excessive softening may occur when the rated temperature is approaching. To avoid the above situation, optionally, after step S102, increasing the first preset power based on the current power and running for the first preset time, further includes:

[0090] S108: If the difference between the preset temperature and the temperature of the heat dissipation object is less than a first preset value, control the heat dissipation device to improve the heat dissipation capacity.

[0091] Two temperatures can be pre-set in the BMC or in a script read by the BMC: a first preset value and a second preset value. The first preset value is lower than the second preset value. This setting allows the heat dissipation capacity of the server's heat sink to be adjusted based on the difference between the heat dissipation target and the rated temperature. For example, if the rated temperature is 85 degrees Celsius, the first preset value can be set to 5 degrees Celsius and the second preset value to 10 degrees Celsius. In other words, the temperature of the heat dissipation target is controlled within 5-10 degrees Celsius of the rated temperature.

[0092] When the temperature of the heat dissipation object is 81 degrees, the difference between the rated temperature and the temperature of the heat dissipation object is 4 degrees, which is less than the first preset value. This indicates that the temperature of the heat dissipation object is close to the rated temperature. The BMC can control the heat dissipation device to improve a certain heat dissipation capacity, such as presetting a certain speed, water pump power or flow valve opening, so as to reduce the temperature of the heat dissipation object and avoid the heat dissipation object occasionally exceeding the rated temperature or excessive softening of the heat dissipation coating due to long-term high temperature.

[0093] S109: If the difference between the preset temperature and the temperature of the heat dissipation object is greater than a second preset value, control the heat dissipation device to reduce heat dissipation capacity.

[0094] When the temperature of the heat dissipation object is 60 degrees, the difference between the rated temperature and the temperature of the heat dissipation object is 25 degrees, which is greater than the second preset value. This indicates that the temperature of the heat dissipation object is far from the expected softening temperature of the heat dissipation coating, making it difficult to fully soften the heat dissipation coating. The BMC can control the heat dissipation device to reduce a certain heat dissipation capacity, such as presetting a certain speed, water pump power or flow valve opening, so as to reduce the temperature of the heat dissipation object and avoid insufficient softening of the heat dissipation coating.

[0095] S110 : If the difference between the preset temperature and the temperature of the heat dissipation object is between a first preset value and a second preset value, maintaining the heat dissipation capacity of the heat dissipation device.

[0096] When the temperature of the heat dissipation target reaches 78 degrees Celsius, the difference between the rated temperature and the temperature of the heat dissipation target is 7 degrees Celsius, which is between the first preset value and the second preset value. At this time, the BMC does not need to adjust the heat dissipation device, but continues to soften the heat dissipation coating at the current power and waits to increase the current power before retesting.

[0097] In the above process, optional, such as Figure 2 As shown, the heat dissipation device is a fan, and the BMC can control the speed of the fan through the peripheral circuit;

[0098] The controlling of the heat dissipation device to improve the heat dissipation capability is specifically as follows:

[0099] Controlling the fan to increase the speed;

[0100] The controlling the heat dissipation device to reduce the heat dissipation capacity is specifically:

[0101] The fan is controlled to reduce its rotation speed.

[0102] That is, the BMC can control the heat dissipation capacity of the heat dissipation device by increasing or decreasing the fan speed.

[0103] In the above process, optional, such as Figure 3As shown, the heat dissipation device is a flow valve and / or a water pump. A CDU (Cooling Distribution Unit) may be configured in the server or server cluster, and the BMC may be electrically connected to the CDU.

[0104] The controlling of the heat dissipation device to improve the heat dissipation capability is specifically as follows:

[0105] Sending a first control message to the CDU, so that the CDU controls the flow valve and / or the water pump to increase the liquid cooling flow rate;

[0106] The controlling the heat dissipation device to reduce the heat dissipation capacity is specifically:

[0107] A second control message is sent to the CDU, so that the CDU controls the flow valve and / or the water pump to reduce the liquid cooling flow rate.

[0108] The server can also be equipped with a CDU, which can control the flow of coolant within the pipes of the liquid-cooled server, for example, by controlling a water pump or flow valve. Control messages can be agreed upon between the CDU and the BMC. For example, a first control message can instruct the CDU to reduce the opening of a flow valve or increase the power of the water pump to increase the liquid cooling flow rate, while a second control message can instruct the CDU to increase the opening of a flow valve or reduce the power of the water pump to reduce the coolant flow rate.

[0109] Correspondingly, the present application also provides a heat dissipation coating softening device, such as Figure 4 As shown, it is applied to the server and includes:

[0110] a starting unit, configured to start the heat dissipation object based on a set initial power, and start the heat dissipation device to dissipate heat from the heat dissipation object, wherein the heat dissipation object is attached to the heat conductive device, a heat dissipation coating is sandwiched between the heat dissipation object and the heat conductive device, and the heat conductive device exchanges heat with the heat dissipation device;

[0111] an adjustment unit, configured to continuously detect the temperature of the heat dissipation object, and if it is detected that the temperature of the heat dissipation object does not exceed a preset temperature, increase a first preset power based on a current power and operate for a first preset time; if it is detected that the temperature of the heat dissipation object exceeds a preset temperature, maintain the current power and operate for a second preset time, and issue an alarm when the temperature of the heat dissipation object exceeds the preset temperature for longer than the second preset time, wherein the first preset power is greater than the second preset power, and the first preset time is less than the second preset time;

[0112] The control unit is configured to terminate the softening process of the heat dissipation coating if the current power of the heat dissipation object reaches the rated power.

[0113] Optionally, the adjustment unit is further configured to increase a first preset power based on the current power and operate for a first preset time, and if the difference between the preset temperature and the temperature of the heat dissipation object is less than a first preset value, control the heat dissipation device to improve the heat dissipation capacity;

[0114] After increasing a first preset power based on the current power and running for a first preset time, if the difference between the preset temperature and the temperature of the heat dissipation object is greater than a second preset value, controlling the heat dissipation device to reduce the heat dissipation capacity;

[0115] After increasing a first preset power based on the current power and running for a first preset time, if the difference between the preset temperature and the temperature of the heat dissipation object is between the first preset value and the second preset value, maintaining the heat dissipation capacity of the heat dissipation device;

[0116] The first preset value is smaller than the second preset value.

[0117] Optionally, the device further includes: a closing unit;

[0118] The adjustment unit is further configured to control the heat dissipation device to increase the heat dissipation capacity to a maximum value after an alarm is issued when the temperature of the heat dissipation object exceeds a preset temperature for a period longer than a second preset time, or when the temperature of the heat dissipation object is not detected during continuous temperature detection of the heat dissipation object;

[0119] The shut-down unit is configured to control the server to save operating data while the server is operating at the maximum heat dissipation capacity of the heat dissipation device, and shut down the server after the server has been running for a third preset time.

[0120] Optionally, the heat dissipation device is a fan; the adjustment unit executes a process of controlling the heat dissipation device to improve the heat dissipation capacity, specifically for controlling the fan to increase the speed; the adjustment unit executes a process of controlling the heat dissipation device to reduce the heat dissipation capacity, specifically for controlling the fan to reduce the speed; or,

[0121] The heat dissipation device is a flow valve and / or a water pump;

[0122] The adjustment unit executes a process of controlling the heat dissipation device to improve the heat dissipation capacity, specifically for sending a first control message to the cold CDU, so that the CDU controls the flow valve and / or the water pump to increase the liquid cooling flow rate;

[0123] The adjustment unit executes a process of controlling the heat dissipation device to reduce the heat dissipation capacity, specifically for sending a second control message to the cold liquid distribution unit CDU, so that the CDU controls the flow valve and / or water pump to reduce the liquid cooling flow rate.

[0124] Correspondingly, this application also provides a server, such as Figure 5 As shown, it includes a processing chip and a machine-readable storage medium, wherein the machine-readable storage medium stores machine-executable instructions that can be executed by the processing chip, and the processing chip is prompted by the machine-executable instructions to implement any of the method steps described above.

[0125] The server may also include a CDU, a fan, a water pump and / or a flow valve, a cold plate, etc., which can be configured according to actual needs without limitation.

[0126] Correspondingly, the present application also provides a machine-readable storage medium storing machine-executable instructions. When called and executed by a processing chip, the machine-executable instructions prompt the processing chip to implement any of the method steps described above.

[0127] It should be noted that the processing chip can be implemented as a BMC, a processor, or a chip with similar functions, without limitation. Furthermore, the processing chip can be a heat sink or not. For example, if the processing chip is a BMC, it can be a heat sink, but if it is a processor, it can be a heat sink.

[0128] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0129] In the embodiments of the present specification, the heat dissipation object is started from the initial power and the power of the heat dissipation object is gradually increased to gradually increase the temperature of the heat dissipation object, and the heat dissipation coating between the heat dissipation object and the heat-conducting device is gradually softened. The relationship between the temperature of the heat dissipation object and its specification temperature is monitored to confirm whether the softening of the heat dissipation coating has reached a level that fully fits the heat dissipation object and the heat-conducting device. That is, the softening of the heat dissipation coating is achieved through the operation process of the server itself, avoiding the need to place the server in an incubator for softening the heat dissipation coating, and improving the flexibility of softening the heat dissipation coating in the server.

[0130] The implementation process of the functions and effects of each module in the above-mentioned device is specifically described in the implementation process of the corresponding steps in the above-mentioned method, and will not be repeated here.

[0131] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts can be referred to the partial description of the method embodiments. The device embodiments described above are merely illustrative, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this specification. A person of ordinary skill in the art can understand and implement it without paying any creative work.

[0132] The foregoing description of this specification describes specific embodiments. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order shown or the sequential order to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0133] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the present invention and practice of the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this specification and include common knowledge or customary techniques in the art not claimed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present invention being indicated by the following claims.

[0134] It should be understood that the present description is not limited to the exact structure that has been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0135] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A method for softening heat dissipation coating, characterized in that: Applicable to servers, including: Based on the set initial power, the heat dissipation object is started, and the heat dissipation device is started to dissipate heat from the heat dissipation object, wherein the heat dissipation object is attached to the heat conductive device, a heat dissipation coating is sandwiched between the heat dissipation object and the heat conductive device, and the heat conductive device exchanges heat with the heat dissipation device; continuously detecting the temperature of the heat dissipation object, and if it is detected that the temperature of the heat dissipation object does not exceed a preset temperature, increasing a first preset power on the basis of a current power and operating for a first preset time; if it is detected that the temperature of the heat dissipation object exceeds a preset temperature, maintaining the current power and operating for a second preset time, and issuing an alarm when the temperature of the heat dissipation object exceeds the preset temperature for longer than the second preset time, wherein the first preset power is greater than the second preset power, and the first preset time is less than the second preset time; If the current power of the heat dissipation object reaches the rated power, the softening process of the heat dissipation paint is terminated.

2. The method according to claim 1, characterized in that After the first preset power is increased based on the current power and the operation is performed for the first preset time, the method further includes: If the difference between the preset temperature and the temperature of the heat dissipation object is less than a first preset value, controlling the heat dissipation device to improve the heat dissipation capacity; If the difference between the preset temperature and the temperature of the heat dissipation object is greater than a second preset value, controlling the heat dissipation device to reduce the heat dissipation capacity; If the difference between the preset temperature and the temperature of the heat dissipation object is between a first preset value and a second preset value, maintaining the heat dissipation capacity of the heat dissipation device; The first preset value is smaller than the second preset value.

3. The method according to claim 1, characterized in that After an alarm is issued when the temperature of the heat dissipation object exceeds a preset temperature for a period longer than a second preset time, or when the temperature of the heat dissipation object is not detected during continuous detection of the temperature of the heat dissipation object, the method further includes: Controlling the heat dissipation device to increase the heat dissipation capacity to a maximum value; During operation at the maximum value of the heat dissipation capacity of the heat dissipation device, the server is controlled to save operation data, and the server is shut down after the operation reaches a third preset time.

4. The method according to claim 2 or 3, characterized in that The heat dissipation device is a fan; The controlling of the heat dissipation device to improve the heat dissipation capability is specifically as follows: Controlling the fan to increase the speed; The controlling the heat dissipation device to reduce the heat dissipation capacity is specifically: The fan is controlled to reduce its rotation speed.

5. The method according to claim 2 or 3, characterized in that The heat dissipation device is a flow valve and / or a water pump; The controlling of the heat dissipation device to improve the heat dissipation capability is specifically as follows: Sending a first control message to a cooling liquid distribution unit (CDU) so that the CDU controls the flow valve and / or the water pump to increase the cooling liquid flow rate; The controlling the heat dissipation device to reduce the heat dissipation capacity is specifically: A second control message is sent to a cooling liquid distribution unit (CDU) so that the CDU controls the flow valve and / or the water pump to reduce the cooling liquid flow rate.

6. A heat dissipation paint softening device, characterized in that: Applicable to servers, including: a starting unit, configured to start the heat dissipation object based on a set initial power, and start the heat dissipation device to dissipate heat from the heat dissipation object, wherein the heat dissipation object is attached to the heat conductive device, a heat dissipation coating is sandwiched between the heat dissipation object and the heat conductive device, and the heat conductive device exchanges heat with the heat dissipation device; an adjustment unit, configured to continuously detect the temperature of the heat dissipation object, and if it is detected that the temperature of the heat dissipation object does not exceed a preset temperature, increase a first preset power based on a current power and operate for a first preset time; if it is detected that the temperature of the heat dissipation object exceeds a preset temperature, maintain the current power and operate for a second preset time, and issue an alarm when the temperature of the heat dissipation object exceeds the preset temperature for longer than the second preset time, wherein the first preset power is greater than the second preset power, and the first preset time is less than the second preset time; The control unit is configured to terminate the softening process of the heat dissipation coating if the current power of the heat dissipation object reaches the rated power.

7. The device according to claim 6, characterized in that The adjustment unit is further configured to increase a first preset power based on the current power and operate for a first preset time, and if the difference between the preset temperature and the temperature of the heat dissipation object is less than a first preset value, control the heat dissipation device to improve the heat dissipation capacity; After increasing a first preset power based on the current power and running for a first preset time, if the difference between the preset temperature and the temperature of the heat dissipation object is greater than a second preset value, controlling the heat dissipation device to reduce the heat dissipation capacity; After increasing a first preset power based on the current power and running for a first preset time, if the difference between the preset temperature and the temperature of the heat dissipation object is between the first preset value and the second preset value, maintaining the heat dissipation capacity of the heat dissipation device; The first preset value is smaller than the second preset value.

8. The device according to claim 6, characterized in that Also includes: Close the unit; The adjustment unit is further configured to control the heat dissipation device to increase the heat dissipation capacity to a maximum value after an alarm is issued when the temperature of the heat dissipation object exceeds a preset temperature for a period longer than a second preset time, or when the temperature of the heat dissipation object is not detected during continuous temperature detection of the heat dissipation object; The shut-down unit is configured to control the server to save operating data while the server is operating at the maximum heat dissipation capacity of the heat dissipation device, and shut down the server after the server has been running for a third preset time.

9. The device according to claim 8, characterized in that The heat dissipation device is a fan; the adjustment unit executes a process of controlling the heat dissipation device to improve the heat dissipation capacity, specifically for controlling the fan to increase the speed; the adjustment unit executes a process of controlling the heat dissipation device to reduce the heat dissipation capacity, specifically for controlling the fan to reduce the speed; or, The heat dissipation device is a flow valve and / or a water pump; The adjustment unit executes a process of controlling the heat dissipation device to improve the heat dissipation capacity, specifically for sending a first control message to the cold liquid distribution unit CDU, so that the CDU controls the flow valve and / or the water pump to increase the liquid cooling flow rate; The adjustment unit executes a process of controlling the heat dissipation device to reduce the heat dissipation capacity, specifically for sending a second control message to the cold liquid distribution unit CDU, so that the CDU controls the flow valve and / or water pump to reduce the liquid cooling flow rate.

10. A server, characterized in that: The method comprises a processing chip and a machine-readable storage medium, wherein the machine-readable storage medium stores machine-executable instructions that can be executed by the processing chip, and the processing chip is prompted by the machine-executable instructions to implement the method steps described in any one of claims 1 to 5.

11. A machine-readable storage medium, characterized in that Machine executable instructions are stored, and when called and executed by a processing chip, the machine executable instructions prompt the processing chip to: implement the method steps described in any one of claims 1-5.

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